CN201611661U - Metal-ceramic packaging shell for a photoelectric receiving module - Google Patents
Metal-ceramic packaging shell for a photoelectric receiving module Download PDFInfo
- Publication number
- CN201611661U CN201611661U CN 201020126825 CN201020126825U CN201611661U CN 201611661 U CN201611661 U CN 201611661U CN 201020126825 CN201020126825 CN 201020126825 CN 201020126825 U CN201020126825 U CN 201020126825U CN 201611661 U CN201611661 U CN 201611661U
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- ceramic
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- ceramic member
- metal frame
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Abstract
The utility model provides a metal-ceramic packaging shell for a photoelectric receiving module, used for packaging a high transmission-rate photoelectric receiver in a photo-communication technical field, comprising a metal frame, a ceramic piece welded with the lower surface of the metal frame, a photo-coupling interface welded in the opening at the side wall of the metal frame and a metallization electric through-hole on the ceramic piece, wherein ceramic walls are arranged at three sides of the ceramic piece and a dust-pan shaped opening is arranged at another side and steps are arranged on the inner sides of the three ceramic walls; metallization areas are all arranged on the steps and the back of the ceramic piece and the metallization areas are switched into conduction by the metallization electric through-hole; a metal lead is welded on the back of the ceramic piece and connected with the corresponding metallization electric through-hole; the metal frame is in inverse L shape and one surface is of plate shaped structure and another surface is of square frame shaped structure and welded on the ceramic piece. The structure design solves the problems that the volume of the current packaging shell is large and the signal transmission rate is low.
Description
Technical field
The utility model relates to the optoelectronic package field, is used for the encapsulation of the high transfer rate photoelectric receiving device of optical communication field, the metal-ceramic package casing that particularly a kind of photoelectricity receiving unit is used.
Background technology
High transfer rate photoelectricity receiving unit is the pith in the optical communication system, because the photoelectricity receiving unit receives the light signal in the optical fiber and converts thereof into the signal of telecommunication of high-speed transfer, therefore, the package casing of photoelectricity receiving unit must satisfy the high transfer rate requirement.
At present, package casing structure commonly used is square metal-ceramic insulator structure, the metal body of wall is welded on the metal base plate, the metal wall body side surface has the optical coupling interface, on the metal body of wall of optical coupling interface both sides opening is arranged, be used for the welding ceramics insulator, be welded with metal lead wire on the ceramic insulator.Optical fiber imports light signal into enclosure by the optical coupling interface, inner photoelectricity receiving unit is converted to the signal of telecommunication to light signal, the signal of telecommunication is by the metal lead wire of the metallization circuit transmission on the ceramic insulator to the outside, metal lead wire is welded on the surface of external circuit, and the signal of telecommunication is transferred to shell circuit in addition.The shell of this structure is than higher, and metal lead wire is positioned in the middle of the shell, need dig out groove in the circuit board during use, and shell is put in the groove, and the lead-in wire height is adapted with the wiring board height, and base plate is screwed, and installs complicated; The volume of shell is big, and it is bigger to take up space, and is unfavorable for the miniaturization of optical fiber receive module; In addition, according to the microwave designing theory, metal lead wire need place the opposite of optical coupling interface during the two-way difference output signal of telecommunication, and existing encapsulating structure is used for the metal lead wire of transmission of electric signals in the side of optical coupling interface, therefore is unfavorable for the signal transmission.
The utility model content
The technical problems to be solved in the utility model is: place the opposite of photoelectricity coupling interface and be symmetrically distributed fully with respect to the axis of optical coupling interface by the transmission circuit with transmission of electric signals, and whole metal lead wires are placed the bottom surface of ceramic member, thereby solve the problem that present package casing volume is big, signal transmission rate is low.
For solving the problems of the technologies described above, technical solution adopted in the utility model is: a kind of photoelectricity receiving unit metal-ceramic package casing, comprise in the structure: metal frame, be welded in ceramic member below the metal frame, be welded in the optical coupling interface in the metal frame sidewall opening, the metallization electric through-hole is arranged on the ceramic member, wherein: ceramic member three sides have ceramic wall, an other side is that the opening formation is dustpan-shaped, is equipped with step three ceramic wall inboards; There is metallized area on the step and the ceramic member back side, and above-mentioned metallized area is by the metallization electric through-hole conducting on the ceramic member; The back side at ceramic member is welded with metal lead wire, links to each other with corresponding metallization electric through-hole; It is L shaped that metal frame is, and one side is a platy structure, and another side is a square box shape structure, is welded on the ceramic member.
Adopt the beneficial effect that technique scheme produced to be: the utility model is according to the microwave transmission Design Theory, be arranged on the opposite of optical coupling interface by transmission circuit with transmission of electric signals, and form the path of two symmetries, satisfy signal of telecommunication difference output ground requirement well, thereby can satisfy the requirement of high transfer rate; In addition, the package casing compact conformation that the utility model provides, volume is little, thereby reduces production costs, and helps the miniaturization of photoelectricity receiving unit and integrated simultaneously; Metal lead wire is welded on the bottom of shell in the structure, and the method by Reflow Soldering mounts in the circuit board, can produce in batches, enhances productivity.
Description of drawings
Fig. 1 is the vertical view of the utility model photoelectricity receiving unit with metal-ceramic package casing structure;
Fig. 2 is the profile of structure shown in Figure 1 along the A-A line;
Fig. 3 is a structure upward view shown in Figure 1;
Fig. 4 is the structural representation of ceramic member in the utility model;
Among the figure: 1-metal frame, 2-ceramic member, 21,22, the step of 23-ceramic member, 3-optical coupling interface, 4,41,42, the 43-metal lead wire.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in further detail.
In conjunction with Fig. 1～Fig. 3, the photoelectricity receiving unit metal-ceramic package casing that the utility model provides, comprise in the structure: metal frame 1, be welded in ceramic member 2 below the metal frame 1, be welded in the optical coupling interface 3 in metal frame 1 sidewall opening, the metallization electric through-hole is arranged on the ceramic member 2, it is characterized in that: ceramic member three sides have ceramic wall, an other side is that the opening formation is dustpan-shaped, is equipped with step 21,22,23 three ceramic wall inboards; There is metallized area on the step 21,22,23 and ceramic member 2 back sides, and above-mentioned metallized area is by the metallization electric through-hole conducting on the ceramic member 2; Be welded with metal lead wire 4 at the back side of ceramic member 2, link to each other with corresponding metallization electric through-hole; Metal frame 1 is L shaped, and one side is a platy structure, and another side is a square box shape structure, is welded on the ceramic member 2.
Structure and annexation to every kind of member elaborates below.
The metallic plate one side of metal frame 1 vertically is welded on ceramic member 2 openings one side, and the square metal frame is welded on the top of the ceramic wall of ceramic member 2, and both constitute cavity, are box like structure.
Be welded with metal lead wire 4 at the back side of ceramic member 2, metal lead wire 4 is divided into two kinds, and a kind of is tabular metal lead wire 41, links to each other with the earth connection of circuit; Another kind is linear metal lead wire 42.Metal lead wire 4 is symmetrically distributed in the both sides of optical coupling interface 3 axis, and metal lead wire 4 is used for linking to each other with outside line.Wherein the metal lead wire 43 on optical coupling interface 3 opposites is an output signal line, and this structural design meets the design principle of microwave transmission theory, and therefore this structural design can improve signal transmission rate to a great extent.
Claims (5)
1. photoelectricity receiving unit metal-ceramic package casing, comprise in the structure: metal frame (1), be welded in ceramic member (2) below the metal frame (1), be welded in the optical coupling interface (3) in metal frame (1) sidewall opening, ceramic member has the metallization electric through-hole on (2), it is characterized in that: ceramic member three sides have ceramic wall, an other side is that the opening formation is dustpan-shaped, is equipped with step (21,22,23) three ceramic wall inboards; Step (21,22,23) is gone up and there is metallized area at ceramic member (2) back side, and above-mentioned metallized area is by the metallization electric through-hole conducting on the ceramic member (2); Be welded with metal lead wire (4) at the back side of ceramic member (2), link to each other with corresponding metallization electric through-hole; Metal frame (1) is L shaped, and one side is a platy structure, and another side is a square box shape structure, is welded on the ceramic member (2).
2. photoelectricity receiving unit metal-ceramic package casing according to claim 1 is characterized in that the metallized area on the step (21) relative with ceramic member (2) opening one side is symmetrically distributed along the axis direction of optical coupling interface (3).
3. photoelectricity receiving unit metal-ceramic package casing according to claim 1 is characterized in that metallized area is the metallized area that tungsten or molybdenum are made.
4. photoelectricity receiving unit metal-ceramic package casing according to claim 1 is characterized in that above-mentioned ceramic member (2) is the single-layer ceramic structure.
5. photoelectricity receiving unit metal-ceramic package casing according to claim 1 is characterized in that above-mentioned ceramic member (2) is a multilayer ceramic structure, and layer has metal line with interlayer, forms by the metallization electric through-hole to be electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020126825 CN201611661U (en) | 2010-03-05 | 2010-03-05 | Metal-ceramic packaging shell for a photoelectric receiving module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020126825 CN201611661U (en) | 2010-03-05 | 2010-03-05 | Metal-ceramic packaging shell for a photoelectric receiving module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201611661U true CN201611661U (en) | 2010-10-20 |
Family
ID=42962296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020126825 Expired - Lifetime CN201611661U (en) | 2010-03-05 | 2010-03-05 | Metal-ceramic packaging shell for a photoelectric receiving module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201611661U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102967906A (en) * | 2012-11-29 | 2013-03-13 | 中国电子科技集团公司第十三研究所 | Packaging shell for semiconductor photoelectric module |
| CN102981222A (en) * | 2012-11-29 | 2013-03-20 | 中国电子科技集团公司第十三研究所 | Photoelectric receiving module casing with four-channel transmitting and coupling structure |
-
2010
- 2010-03-05 CN CN 201020126825 patent/CN201611661U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102967906A (en) * | 2012-11-29 | 2013-03-13 | 中国电子科技集团公司第十三研究所 | Packaging shell for semiconductor photoelectric module |
| CN102981222A (en) * | 2012-11-29 | 2013-03-20 | 中国电子科技集团公司第十三研究所 | Photoelectric receiving module casing with four-channel transmitting and coupling structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 050051 Hebei Shijiazhuang City Cooperative Road 113 179 Mailbox 41 sub-box Patentee after: Hebei Zhongchi Electronic Technology Co., Ltd. Address before: 050051 Hebei Shijiazhuang City Cooperative Road 113 179 Mailbox 41 sub-box Patentee before: HEBEI SINOPACK ELECTRONIC TECHNOLOGY CO., LTD. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101020 |