CN201629338U - Metal-ceramic coaxial packaging outer casing for photoelectric receiving assembly - Google Patents
Metal-ceramic coaxial packaging outer casing for photoelectric receiving assembly Download PDFInfo
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- CN201629338U CN201629338U CN 201020126838 CN201020126838U CN201629338U CN 201629338 U CN201629338 U CN 201629338U CN 201020126838 CN201020126838 CN 201020126838 CN 201020126838 U CN201020126838 U CN 201020126838U CN 201629338 U CN201629338 U CN 201629338U
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- metal
- ceramic
- welded
- ceramic substrate
- coaxial packaging
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Abstract
The utility model provides a metal-ceramic coaxial packaging outer casing for a photoelectric receiving assembly, and used for packaging of photoelectric receiving elements with high transmission speed in the field of optical communication. The metal-ceramic coaxial packaging outer casing structurally comprises a metal support and a metal cap welded onto the metal support and provided with a glass optical window, wherein the metal support is of an annular structure; a ceramic base plate is welded on the metal support on the inner side of the metal cap; metallized areas are arranged on the front surface and the back surface of the ceramic base plate; the metallized areas on the front surface and the back surface of the ceramic base plate are in electric connection through metallized through holes on the ceramic base plate; and a metal lead is welded on the back face of the ceramic base plate. The metal-ceramic coaxial packaging outer casing solves the problem of low speed of signal transmission and achieves the purposes of high speed of signal transmission and less loss.
Description
Technical field
The utility model relates to the optoelectronic package field, is used for the encapsulation of the high transfer rate photoelectric receiving device of optical communication field, particularly a kind of photoelectricity receiving unit metal-ceramic coaxial packaging shell.
Background technology
High transfer rate photoelectricity receiving unit is the pith in the optical communication system, because the photoelectricity receiving unit receives the light signal in the optical fiber and converts thereof into the signal of telecommunication of high-speed transfer, therefore, the package casing of photoelectricity receiving unit must satisfy the high transfer rate requirement.
The photoelectricity receiving unit that uses at present is the low transmission rate package casing with the coaxial type package casing, and what use in this kind structure is the coaxial type package casing of metal-glass.Housing main body is the circular metal flat board, on metal plate, punch, pass metal lead wire in the hole, with glass metal lead wire and metal plate are welded together, the external metallization lead-in wire is inserted in the hole of outside line plate, and the photoelectricity receiving unit will be welded on the metal plate with the metal nut cap of glass optical window after placing on the metal plate.Light signal enters enclosure by the glass optical window, and the photoelectricity receiving unit is converted to the signal of telecommunication to light signal, and the signal of telecommunication is transferred to external circuit by lead-in wire.Because the shell of this structure uses glass to do the insulation medium, and the change in dielectric constant of glass is big, dielectric loss is big, therefore is not suitable for the photoelectricity receiving unit of high transfer rate.
The utility model content
The technical problems to be solved in the utility model is: by using ceramic substrate as dielectric, and print transmission circuit on ceramic substrate, the transmission circuit of printing designs according to the microwave transmission theory, thereby has solved the low problem of signal transmission rate.
For solving the problems of the technologies described above, technical solution adopted in the utility model is: a kind of photoelectricity receiving unit metal-ceramic coaxial packaging shell, the metal nut cap that comprises metallic support in the structure and be welded on the band glass optical window on the metallic support, wherein: metallic support is a cirque structure, on the metallic support of metal nut cap inboard, be welded with ceramic substrate, there is metallized area at the front and the back side of ceramic substrate, above-mentioned metallized area forms by the plated-through hole on the ceramic substrate and is electrically connected, and metal lead wire is welded in the back side of ceramic substrate.
Adopt the beneficial effect that technique scheme produced to be: the structure of package casing adopts pottery to do the insulation medium, and according to microwave transmission Design Theory metallization pattern and plated-through hole, make the transmission reflection of the signal of telecommunication low, loss is little, can satisfy the requirement of high transfer rate; And owing on ceramic substrate, designed complicated transmission circuit, make the volume of package casing reduce greatly, reduced the use amount of part, reduced processing cost.
Description of drawings
Fig. 1 is the structural representation of the utility model photoelectricity receiving unit with metal-ceramic coaxial packaging shell;
Among the figure: 1-metallic support, 11-ceramic substrate, 2-metal nut cap, the transparent optical window of 21-, 3-metal lead wire.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in further detail.
Referring to Fig. 1, the photoelectricity receiving unit that the utility model provides metal-ceramic coaxial packaging shell, comprise metallic support 1 in the structure and be welded on metal nut cap 2 on the metallic support 1 with transparent optical window 21, wherein: metallic support 1 is a cirque structure, on the metallic support 1 of metal nut cap 2 inboards, be welded with ceramic substrate 11, there is metallized area at the front and the back side of ceramic substrate 11, above-mentioned metallized area forms by the plated-through hole on the ceramic substrate 11 and is electrically connected, and metal lead wire 3 is welded in the back side of ceramic substrate 11.
Above-mentioned ceramic substrate 11 is single-layer ceramic structure or multilayer ceramic structure, and layer and interlayer have metal line when adopting multilayer ceramic structure, forms by plated-through hole to be electrically connected.
Above-mentioned metallized area is tungsten or molybdenum zone.
The metallized area in ceramic substrate 11 fronts is used for installing the photoelectricity receiving unit, the metallized area at the back side is used for weld metal lead-in wire 3, metal lead wire 3 quantity are generally 4,6,8,10,12, and the metallized area of ceramic substrate 11 front and backs links together by the plated-through hole of ceramic substrate 11 inside.There is the endless metal figure at the edge at ceramic substrate 11 back sides, is used for welding together with circular ring metal support 1.Metal lead wire 3 passes the back side that is welded on ceramic substrate 11 in the hole of metallic support 1.Metal nut cap 2 is a carnival hat shape structure, at end face opening is arranged, and is welded with transparent optical window 21, and the material of transparent optical window 21 is optical glass, quartz, sapphire.Metal nut cap 2 welds together by the method and the metallic support 1 of electric resistance welding, forms seal chamber, and the photoelectricity receiving unit is protected portion in the enclosure.
Claims (4)
1. a photoelectricity receiving unit is with metal-ceramic coaxial packaging shell, comprise metallic support (1) in the structure and be welded on the metal nut cap with transparent optical window (21) (2) on the metallic support (1), it is characterized in that: metallic support (1) is a cirque structure, on the metallic support (1) of metal nut cap (2) inboard, be welded with ceramic substrate (11), there is metallized area at the front and the back side of ceramic substrate (11), above-mentioned metallized area forms by the plated-through hole on the ceramic substrate (11) and is electrically connected, and metal lead wire (3) is welded in the back side of ceramic substrate (11).
2. photoelectricity receiving unit according to claim 1 is characterized in that with metal-ceramic coaxial packaging shell above-mentioned ceramic substrate (11) is the single-layer ceramic structure.
3. photoelectricity receiving unit according to claim 1 is characterized in that with metal-ceramic coaxial packaging shell above-mentioned ceramic substrate (11) is a multilayer ceramic structure, and layer has metal line with interlayer, forms by plated-through hole to be electrically connected.
4. photoelectricity receiving unit according to claim 1 is characterized in that with metal-ceramic coaxial packaging shell above-mentioned metallized area is the metallized area that tungsten or molybdenum form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020126838 CN201629338U (en) | 2010-03-05 | 2010-03-05 | Metal-ceramic coaxial packaging outer casing for photoelectric receiving assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020126838 CN201629338U (en) | 2010-03-05 | 2010-03-05 | Metal-ceramic coaxial packaging outer casing for photoelectric receiving assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201629338U true CN201629338U (en) | 2010-11-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020126838 Expired - Lifetime CN201629338U (en) | 2010-03-05 | 2010-03-05 | Metal-ceramic coaxial packaging outer casing for photoelectric receiving assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201629338U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102981222A (en) * | 2012-11-29 | 2013-03-20 | 中国电子科技集团公司第十三研究所 | Photoelectric receiving module casing with four-channel transmitting and coupling structure |
| CN104124285A (en) * | 2014-07-17 | 2014-10-29 | 武汉电信器件有限公司 | High frequency photoelectric detector encapsulation base with multilayer ceramic pot-type encapsulation |
| CN105322317A (en) * | 2014-11-18 | 2016-02-10 | 中国计量科学研究院 | Vacuum system, multi-level vacuum system and feed through electrical connection method therefor |
| CN106252422A (en) * | 2016-08-23 | 2016-12-21 | 太仓市威士达电子有限公司 | A kind of metal shell for packaging of photoelectric device |
| CN111865430A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver |
-
2010
- 2010-03-05 CN CN 201020126838 patent/CN201629338U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102981222A (en) * | 2012-11-29 | 2013-03-20 | 中国电子科技集团公司第十三研究所 | Photoelectric receiving module casing with four-channel transmitting and coupling structure |
| CN104124285A (en) * | 2014-07-17 | 2014-10-29 | 武汉电信器件有限公司 | High frequency photoelectric detector encapsulation base with multilayer ceramic pot-type encapsulation |
| CN104124285B (en) * | 2014-07-17 | 2016-05-04 | 武汉电信器件有限公司 | Adopt the high frequency light electric explorer encapsulation base plate of multi-layer ceramics pot type encapsulation |
| CN105322317A (en) * | 2014-11-18 | 2016-02-10 | 中国计量科学研究院 | Vacuum system, multi-level vacuum system and feed through electrical connection method therefor |
| CN105322317B (en) * | 2014-11-18 | 2017-08-25 | 中国计量科学研究院 | A kind of vacuum system, multi-stage vacuum system and their feedthrough electrical connection methods |
| CN106252422A (en) * | 2016-08-23 | 2016-12-21 | 太仓市威士达电子有限公司 | A kind of metal shell for packaging of photoelectric device |
| CN111865430A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 050051 Hebei Shijiazhuang City Cooperative Road 113 179 Mailbox 41 sub-box Patentee after: Hebei Zhongchi Electronic Technology Co., Ltd. Address before: 050051 Hebei Shijiazhuang City Cooperative Road 113 179 Mailbox 41 sub-box Patentee before: HEBEI SINOPACK ELECTRONIC TECHNOLOGY CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101110 |
|
| CX01 | Expiry of patent term |