CN207852652U - A kind of patch-type IRM high shielding constructions - Google Patents
A kind of patch-type IRM high shielding constructions Download PDFInfo
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- CN207852652U CN207852652U CN201820271979.XU CN201820271979U CN207852652U CN 207852652 U CN207852652 U CN 207852652U CN 201820271979 U CN201820271979 U CN 201820271979U CN 207852652 U CN207852652 U CN 207852652U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model belongs to IR signal reception technical field, and in particular to a kind of patch-type IRM high shielding constructions, including pcb board are plugged with copper post through there is several via holes on pcb board in each via hole；The front of pcb board is equipped with PD chips, and reverse side is equipped with IC chip；One end of each copper post is connected to by bonding wire on PD chips, and the other end of each copper post is connected to by bonding wire in IC chip；Solidification has packaging plastic, PD chips and IC chip to be built in the packaging plastic of pcb board both sides on the two sides of pcb board.The utility model has the beneficial effects that：Save the material and process costs of inner shield or external shield；Manufacture craft is simplified, and reduces several process relative to plug-in unit class product and patch type stent-type product, reduces the high-cost electrotinning processing procedure polluted with waste water and gas；Reduce the assembling difficulty and labour cost of external shield relative to patch type PCB product.
Description
Technical field
The utility model belongs to IR signal reception technical field, and in particular to a kind of patch-type IRM high shielding constructions.
Background technology
IRM is infrared receiver module, and internal there are one photosensitive PD chips, a processing amplification IC chip of connecting can connect
Receive 940nm infrared light, and the signal that carrier wave is made of infrared light is handled, whole wave, decoding, amplification, and by optical signal turn
It is melted into electrical parameter model, because processing amplification IC chip can also be interfered by other light in extraneous natural light, so will encapsulation
Colloid use black epoxy glue, black colorant component can filter out visible light and a part of infrared light, and most 860nm are below
Infrared light, but because filtering feux rouges light percent of pass is 80% or so, so still there is the high wave spectrum or energy saving in sunlight
Lamp, the high wave spectrum in incandescent lamp can enter in IRM modules, interfere IC chip, influence the decoding of IRM, amplify, handle telecommunications
Number ability, there are clutter phenomenons or remote control reception distance to be greatly lowered.
The IRM mainly produced currently on the market is broadly divided into two major class：Plug-in unit class and patch type.Plug-in unit class IRM is used
Retort stand bending inner shield encapsulating structure, a kind of anti-light interference as shown in Chinese utility model publication number CN102290411A
Infrared receiver module.Patch type is divided into two class of stent-type and PCB, and patch type stent-type copper or retort stand are also bending inner shield
Cover structure；And the IRM of patch type PCB construction, it is that shielding case design is done using external iron-clad, above-mentioned three kinds of encapsulation all have production
Complex process, yield is low, problem of high cost.
First, the IRM with holder bending structure is because of equipment limit, and the density of product is generally 20PCS disjunctors, at most
40PCS or so disjunctors, production efficiency are extremely low.
Single production line UPH only 5~10K/h, and holder production technology is more, including die bond, bonding wire, curved shielding case, sealing,
Removing glue, Laser Jet knife of fetching water (or sandblasting), are electroplated, the muscle that hits, cut bottom muscle, test, full corner cut and packaging, need 13 to arrive work
Sequence, especially electrotinning belong to heavy polluted industry, and environmental requirement is higher and higher at present, and electroplate factory gradually decreases, rear current cost meeting
Increase, and procedure error can all influence whole yield.
The encapsulation of patch type stent-type is identical with above-mentioned production process for encapsulating, is only improved in density, but at most
Density is also just between 80~120pcs, and the efficiency promoted is also considerably less, but the cost of holder floats 2~3 times, always
Body cost is more taller than plug-in unit class IRM.
Patch type PCB be encapsulated in technique on final package reduce die bond, bonding wire, sealing, cutting, test, dress iron-clad (have
It is artificial and automatic, but efficiency is all very low) and braid, totally 7 procedure, but fill external iron-clad and need extra cost, it is essential and wants
Soldering iron welds iron-clad and IRM products, prevents from falling off, while high temperature (the 380 DEG C or so) time of contact in welding needs to control and exist
Within 10s, the production difficulty that further increases.
Invention content
The purpose of the utility model is to overcome defects of the existing technology, provide one kind while obstructing light interference,
Save the material and process costs of inner shield or external shield；Manufacture craft is simplified, relative to plug-in unit class product and patch
Piece class stent-type product reduces several process, reduces the high-cost electrotinning processing procedure polluted with waste water and gas；Relatively
Reduce the patch-type IRM high shielding constructions of the assembling difficulty and labour cost of external shield in patch type PCB product.
Technical solution adopted by the utility model to solve its technical problems is：A kind of patch-type IRM high shielding constructions,
Including pcb board, through there are several via holes on pcb board, copper post is plugged in each via hole, the circuit on pcb board two sides is logical
Cross copper post conducting；The front of pcb board is equipped with PD chips, and reverse side is equipped with IC chip；One end of each copper post passes through bonding wire
It is connected on PD chips, the other end of each copper post is connected to by bonding wire in IC chip；Solidification has envelope on the two sides of pcb board
Glue is filled, PD chips and IC chip are built in correspondingly in the packaging plastic of pcb board both sides.
IC chip is positioned over the back side of PD chips by the utility model, reduce light interference while cancel inner shield and
External iron-clad, reduces raw material cost, and significantly improving production efficiency, the jigsaw density of pcb board up to 1500~
2000pcs disjunctors improve production efficiency under the premise of reducing packing colloid dosage, reduce cost.
The utility model is separated PD chips and IC chip by the tow sides die bond bonding wire of pcb board, pressing mold sealing,
Simultaneously because the tow sides of pcb board have the double-deck copper foil metal layer, while obstructing light interference, inner shield or external screen are saved
Cover the material and process costs of cover；It is simple in structure, it is easy to make.
Specifically, PD chips and IC chip are adhered to by crystal-bonding adhesive on pcb board, facilitate each first device of bonding wire connection
Part.
Preferably, packaging plastic is epoxy resin or silicones, curing molding effect is good.
Preferably, pcb board is the BT resin plates of equal layered copper plate on two sides.The special process of the utility model is
The special designing of pcb board is selected using by pcb board drilling rear plug copper post to which the line layer at the positive back side be connected simultaneously
The integral thickness of the BT resin plates of 0.4mm, integral thickness 0.5mm, final encapsulation finished product is far below industry in 2.0~3.0mm
4.5~6.5mm thickness levels keep product more lightening, increase application range.
In production, since the substrate of pcb board uses the BT resin plates of 0.4mm thickness, integral thickness is left up to 0.5mm after plating
It is right so that the hardness of pcb board is very high, therefore, the fixed both sides for pushing down pcb board can be used in the processing procedures such as die bond bonding wire,
Keep middle section hanging, it is convenient for production so as to carry out positive and negative both sides die bond bonding wire, improve efficiency.
In addition, the manufacture craft of the patch-type IRM high shielding constructions of the utility model comprising following steps：
A, prepare raw material：Several via holes are bored on pcb board, fill in copper post in each via hole, and copper post is by PCB
The circuit turn-on of plate upper and lower surface；
B, die bond：PD chips are bonded in the front of pcb board by crystal-bonding adhesive；
C, it toasts：PD chips are fixed on pcb board by toasting；
D, die bond again：IC chip is bonded in the reverse side of pcb board by crystal-bonding adhesive, and is toasted again, IC chip is fixed
On pcb board；
D, it welds：On the front of pcb board, one end of copper post is connected to by bonding wire on PD chips；In the anti-of pcb board
On face, the other end of copper post is connected to by bonding wire in IC chip；
E, pressing mold：Glue laminated mold forming will be filled in the both sides of pcb board by mold；
F, it toasts：By packaging plastic baking-curing；
G, it cuts：Design size will be cut into after baking-curing.
The manufacture craft of the patch-type IRM high shielding constructions of the utility model is simplified, relative to plug-in unit class product and patch
Piece class stent-type product reduces several process, especially high-cost electrotinning processing procedure, reduces waste water and gas pollution；Relatively
Reduce the assembling difficulty and labour cost of external shield in patch type PCB product.
A kind of advantageous effect of patch-type IRM high shielding constructions of the utility model is：
1. the utility model passes through the tow sides die bond bonding wire of pcb board, pressing mold sealing, by PD chips and IC chip point
Open, while because the tow sides of pcb board have the double-deck copper foil metal layer, obstruct light interference while, save inner shield or
The material and process costs of external shield；It is simple in structure, it is easy to make；
2. the manufacture crafts of the patch-type IRM high shielding constructions of the utility model is simplified, relative to plug-in unit class product and
Patch type stent-type product reduces several process, reduces the high-cost electrotinning processing procedure polluted with waste water and gas；Phase
Reduce the assembling difficulty and labour cost of external shield for patch type PCB product.
Description of the drawings
Utility model will be further described in detail below with reference to the attached drawings and specific embodiments.
Fig. 1 is a kind of internal structure chart of patch-type IRM high shielding constructions of the utility model.
Wherein:1.PCB plates；2. copper post；3.PD chips；4.IC chips；5. bonding wire；6. packaging plastic.
Specific implementation mode
The utility model is described in further detail presently in connection with attached drawing.These attached drawings are simplified schematic diagram,
Only illustrate the basic structure of the utility model in a schematic way, therefore it only shows composition related with the utility model.
A kind of specific embodiment of patch-type IRM high shielding constructions of the utility model as shown in Figure 1 comprising PCB
Plate 1 is plugged with copper post 2, the circuit on 1 two sides of pcb board passes through copper through there is several via holes on pcb board 1 in each via hole
Column 2 is connected；The front of pcb board 1 is equipped with PD chips 3, and reverse side is equipped with IC chip 4；One end of each copper post 2 passes through bonding wire
5 are connected on PD chips 3, and the other end of each copper post 2 is connected to by bonding wire 5 in IC chip 4；It is solid on the two sides of pcb board 1
Change has packaging plastic 6, PD chips 3 and IC chip 4 to be built in correspondingly in the packaging plastic 6 of 1 both sides of pcb board.
IC chip 4 is positioned over the back side of PD chips 3 by the present embodiment, reduce light interference while cancel inner shield and
External iron-clad, reduces raw material cost, and significantly improving production efficiency, the jigsaw density of pcb board 1 up to 1500~
2000pcs disjunctors improve production efficiency under the premise of reducing packing colloid dosage, reduce cost.
The present embodiment is separated PD chips 3 and IC chip 4 by the tow sides die bond bonding wire of pcb board 1, pressing mold sealing,
Simultaneously because the tow sides of pcb board 1 have the double-deck copper foil metal layer, while obstructing light interference, inner shield or outer is saved
The material and process costs of shielding case；It is simple in structure, it is easy to make.
Specifically, PD chips 3 and IC chip 4 are adhered to by crystal-bonding adhesive on pcb board 1, and bonding wire 5 is facilitated to connect each member
Device.
Preferably, packaging plastic 6 is epoxy resin or silicones, curing molding effect is good.
Preferably, pcb board 1 is the BT resin plates of equal layered copper plate on two sides.The special process of the present embodiment is
The special designing of pcb board 1, to which the line layer at the positive back side be connected, is selected simultaneously that is, using by the drilling rear plug of pcb board 1 copper post 2
The integral thickness of the BT resin plates of 0.4mm, integral thickness 0.5mm, final encapsulation finished product is far below industry in 2.0~3.0mm
4.5~6.5mm thickness levels keep product more lightening, increase application range.
In production, since the substrate of pcb board 1 uses the BT resin plates of 0.4mm thickness, integral thickness reaches 0.5mm after plating
Left and right so that the hardness of pcb board 1 is very high, therefore, can push down the two of pcb board 1 using fixation in the processing procedures such as die bond bonding wire
Side keeps middle section hanging, convenient for production so as to carry out positive and negative both sides die bond bonding wire, improves efficiency.
In addition, the manufacture craft of the patch-type IRM high shielding constructions of the present embodiment comprising following steps：
A, prepare raw material：Several via holes are bored on pcb board 1, copper post 2 are filled in each via hole, and copper post 2 will
The circuit turn-on of 1 upper and lower surface of pcb board；
B, die bond：PD chips 3 are bonded in the front of pcb board 1 by crystal-bonding adhesive；
C, it toasts：PD chips 3 are fixed on pcb board 1 by toasting；
D, die bond again：IC chip 4 is bonded in the reverse side of pcb board 1 by crystal-bonding adhesive, and is toasted again, IC chip 4 is consolidated
It is scheduled on pcb board 1；
D, it welds：On the front of pcb board 1, one end of copper post 2 is connected to by bonding wire 5 on PD chips 3；In pcb board
On 1 reverse side, the other end of copper post 2 is connected to by bonding wire 5 in IC chip 4；
E, pressing mold：Glue laminated mold forming will be filled in the both sides of pcb board 1 by mold；
F, it toasts：By 6 baking-curing of packaging plastic；
G, it cuts：Design size will be cut into after baking-curing.
The manufacture craft of the patch-type IRM high shielding constructions of the present embodiment is simplified, relative to plug-in unit class product and patch
Class stent-type product reduces several process, reduces the high-cost electrotinning processing procedure of waste water and gas pollution；Relative to patch
Class PCB product reduces the assembling difficulty and labour cost of external shield.
It should be appreciated that specific embodiment described above is only used for explaining the utility model, it is not used to limit this reality
With novel.By the utility model the obvious changes or variations extended out of spirit still in the utility model protection
Among range.
Claims (3)
1. a kind of patch-type IRM high shielding constructions, it is characterised in that：Including pcb board (1), the pcb board (1) if on through having
A via hole is done, copper post (2) is plugged in each via hole, the circuit on pcb board (1) two sides passes through copper post (2) and is connected；Institute
The front for stating pcb board (1) is equipped with PD chips (3), and reverse side is equipped with IC chip (4)；One end of each copper post (2) passes through weldering
Line (5) is connected on PD chips (3), and the other end of each copper post (2) is connected to by bonding wire (5) in IC chip (4)；It is described
Solidification has packaging plastic (6), the PD chips (3) and IC chip (4) to be built in PCB correspondingly on the two sides of pcb board (1)
In the packaging plastic (6) of plate (1) both sides.
2. a kind of patch-type IRM high shielding constructions according to claim 1, it is characterised in that：The PD chips (3) and IC
Chip (4) is adhered to by crystal-bonding adhesive on pcb board (1).
3. a kind of patch-type IRM high shielding constructions according to claim 1 or 2, it is characterised in that：The pcb board (1) is
The BT resin plates of equal layered copper plate on two sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820271979.XU CN207852652U (en) | 2018-02-26 | 2018-02-26 | A kind of patch-type IRM high shielding constructions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820271979.XU CN207852652U (en) | 2018-02-26 | 2018-02-26 | A kind of patch-type IRM high shielding constructions |
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| Publication Number | Publication Date |
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| CN207852652U true CN207852652U (en) | 2018-09-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108281395A (en) * | 2018-02-26 | 2018-07-13 | 苏州雷霆光电科技有限公司 | A kind of patch-type IRM high shielding constructions and its manufacture craft |
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2018
- 2018-02-26 CN CN201820271979.XU patent/CN207852652U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108281395A (en) * | 2018-02-26 | 2018-07-13 | 苏州雷霆光电科技有限公司 | A kind of patch-type IRM high shielding constructions and its manufacture craft |
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