CN216351386U - Light emitting device and optical module - Google Patents

Abstract

The application discloses light emitting device and optical module, light emitting device includes: the TO tube seat is provided with an anode pin which penetrates through the TO tube seat and protrudes out of the surface of the TO tube seat. The metal base is arranged TO protrude out of the surface of the TO tube seat, a metal boss close TO the anode pin is arranged on the side face of the metal base, a light emitter is arranged on the side wall of the metal boss, and a first shielding block is arranged on the other side of the metal base; the first shielding block is of a bent structure, and the extending direction of the bent structure forms open coating on the positive pin. The positive pin is electrically connected with the light emitting device. In this application, anodal pin and the gold thread pin cladding of drawing forth can be with most radiant energy constraint between anodal pin and first shielding piece in the inside of first shielding piece, alleviate the production of radiation, improve the high frequency performance of pin and gold thread, reduce the impedance sudden change.

Description

Light emitting device and optical module

Technical Field

The present application relates to the field of communications technologies, and in particular, to a light emitting device and an optical module.

Background

The optical module is mainly used for photoelectric and electro-optical conversion, an electric signal is converted into an optical signal by a transmitting end of the optical module and is transmitted out through an optical fiber, and a received optical signal is converted into an electric signal by a receiving end of the optical module. The core devices of the optical module are a laser LD and a photodiode PD, wherein the laser is used for converting an electric signal into an optical signal and coupling the optical signal into an optical fiber to realize signal transmission. The coupling efficiency is defined as the total light intensity of several percent emitted by the laser can be coupled into the optical fiber, and the coupling efficiency of the optical module package is very critical and directly influences the optical signal transmission performance and the production yield.

With the development of informatization, the integration level of an optical communication module is higher and higher, the power density of the module is also increased continuously, and when the power density of a chip is overlarge, the electromagnetic radiation of the module is stronger, so that other devices are easily influenced.

SUMMERY OF THE UTILITY MODEL

The application provides a light emitting device and a light module to reduce electromagnetic radiation of the light module.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses a light emitting device, includes:

the light emitting device includes:

a TO tube seat is arranged on the base plate,

the TO tube cap covers the TO tube seat;

the metal base is arranged by protruding out of the surface of the TO tube seat;

the metal boss is arranged on one side of the metal base, and the side wall of the metal boss is provided with a light emitter;

the positive pin penetrates through the TO tube seat and protrudes out of the surface of the TO tube seat;

the first shielding block is arranged on the other side of the metal base; the first shielding block is of a bent structure, and the extending direction of the bent structure forms open coating on the positive pin;

the positive pin is connected with the metal base through a gold thread.

The beneficial effect of this application:

the application discloses light emitting device and optical module, its light emitting device includes: the light emitting device includes: the TO tube seat is provided with an anode pin which penetrates through the TO tube seat and protrudes out of the surface of the TO tube seat. The metal base is arranged TO protrude out of the surface of the TO tube seat, a metal boss close TO the anode pin is arranged on the side face of the metal base, a light emitter is arranged on the side wall of the metal boss, and the first shielding block is arranged on the other side of the metal base and on the adjacent side of the metal boss; the first shielding block is of a bent structure and surrounds the positive pin. The positive pin is electrically connected with the positive electrode of the light emitting device. In this application, anodal pin and the gold thread pin cladding of drawing forth can be with most radiant energy constraint between anodal pin and first shielding piece in the inside of first shielding piece, alleviate the production of radiation, improve the high frequency performance of pin and gold thread, reduce the impedance sudden change. The first shielding block serves as a high-frequency signal ground, the cathode of the light emitter can be bonded to the metal base through the bonding wire, and the parasitic effect of the pin is reduced compared with the bonding wire bonded to the pin, so that the impedance discontinuity between the cathode of the light emitter and the high-frequency signal ground is reduced. Anodal pin and the gold thread pin of drawing forth wrap up in the inside of first shielding piece in this application, can tie most radiant energy between anodal pin and first shielding piece, alleviate the production of radiation, improve the high frequency performance of pin and gold thread, reduce the impedance sudden change.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is a schematic structural diagram of a light emitting device according to an embodiment of the present disclosure;

fig. 6 is a schematic diagram of an internal structure of a light emitting device according to an embodiment of the present disclosure;

FIG. 7 is another angle view of FIG. 6;

fig. 8 is a schematic diagram of an internal structure of a light emitting device according to an embodiment of the present application.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C," each including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical module 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, the optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver.

The shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two openings 204 and 205; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates located at two sides of the bottom plate and disposed perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two openings 204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end (left end in fig. 3) of the optical module 200, and the opening 205 is also located at an end (right end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to receive the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 300 and the optical transceiver can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when the devices such as the circuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 203 located on an outer wall of a housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking members 203 are located on the outer walls of the two lower side plates of the lower housing 202, and include snap-fit members that mate with a cage of an upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. The electronic components may include, for example, capacitors, resistors, transistors, Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip may include, for example, a Micro Controller Unit (MCU), a limiting amplifier (limiting amplifier), a Clock and Data Recovery (CDR) chip, a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 300 further includes a gold finger 301 formed on an end surface thereof, the gold finger 301 being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by the gold fingers 301. The gold finger 301 may be disposed on only one side surface (e.g., the upper surface shown in fig. 4) of the circuit board 300, or may be disposed on both upper and lower surfaces of the circuit board 300 to meet the requirement of a large number of pins. The golden finger 301 is configured to establish an electrical connection with the upper computer to achieve power supply, ground, I2C signaling, data signaling, and the like. Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

The optical transceiver comprises an optical transmitter subassembly and an optical receiver subassembly.

In this application, the lower case 202 includes a bottom plate 2021, and a first lower side plate 2022 and a second lower side plate 2023 located on both sides of the bottom plate 2021 and disposed perpendicular to the bottom plate 2021.

With continued reference to fig. 4, in the present embodiment, a first fiber adapter 600 and a second fiber adapter 700 are provided for transmission of light between the optical transceiver and the external optical device. As shown in fig. 4, the optical transceiver module provided in the embodiment of the present invention includes a first optical sub-transceiver module 400 and a second optical sub-transceiver module 500, wherein the first optical sub-transceiver module 400 and the second optical sub-transceiver module 500 are disposed in a parallel direction, and the first optical sub-transceiver module 400 is disposed at one side of the second optical sub-transceiver module 500.

Optionally, the first and second rosa 400 and 500 may also be disposed in an up-down direction.

Optionally, one end of the first optical transceiver sub-assembly 400 is connected to the first optical fiber adapter 600, and the other end is provided with the circuit board 300. The other end of the circuit board 300 is provided with a gold finger, which is located at the position of the electric port and connected with the upper computer to realize the electric connection with the upper computer.

In the present embodiment, the first fiber optic adapter 600 and the second fiber optic adapter 700 are disposed in parallel inside the package cavity. The present application takes the light emitting device in the first rosa 400 as an example.

Fig. 5 is a schematic structural diagram of a light emitting device according to an embodiment of the present disclosure, and fig. 6 is a schematic structural diagram of an internal structure of a light emitting device according to an embodiment of the present disclosure. Fig. 7 is another angle view of fig. 6. As shown in fig. 5, 6 and 7, in some embodiments, the optical transmitter device in the first rosa module 400 is a coaxial TO package, including: the TO tube seat 402 and the TO tube cap 401 covering the TO tube seat 402, photoelectric devices such as a laser and a photodiode are placed on the surface of the TO tube seat 402, a light window for light TO pass through is arranged on the TO tube cap 401, and the photoelectric devices such as the laser and the photodiode are packaged in a sealed cavity by the TO tube seat 402 and the TO tube cap 401.

The TO tube base 402 is provided with a plurality of pins 403, the pins 403 penetrate through the TO tube base 402 and protrude out of the surface of the TO tube base 402, and the pins 403 are wrapped by glass TO realize insulation between the pins 403 and the TO tube base 402. The optoelectronic device is sealed between the TO header 402 and the TO cap 401, which establishes electrical connection TO the outside by pins 403 passing through the TO header 402.

In order TO facilitate the installation of the photoelectric device, the optical module further comprises a metal base 404 protruding from the TO socket 402, and the photoelectric device such as an optical transmitter 405 is arranged on the metal base 404.

The metal base 404 and the TO base 402 may be an integral structure, and in order TO facilitate heat dissipation of the optoelectronic device, in this example, the materials of the metal base 404 and the TO base 402 include, but are not limited TO, tungsten copper, a raft alloy, SPCC (Cold rolled carbon Steel), copper, and the like. The metal base 404 and the TO header 402 can be of a separate structure, and the metal base 404 and the TO header 402 are connected through conductive silver paste.

The pin 403 includes: a positive pin 4031 and a negative pin 4032. One end of the positive pin 4031 penetrates through the metal base 404 and protrudes from the upper surface of the metal base 404. The negative pin 4032 is electrically connected TO the TO header 402.

The light emitter 405 is arranged on the side surface of the metal base, the light emitter 405 is provided with a positive electrode pin and a negative electrode pin, and the positive electrode pin is connected with the positive electrode pin 4031 through a gold wire; the negative pin is connected with the negative pin through a gold thread.

The metal base 404 is provided with a metal boss 4041 protruding toward the side of the metal base 404, and the protruding direction is toward the direction of the pin 403. The light emitter is arranged on the side wall of the metal boss 4041 and close to the anode pin 4031, and the anode pin is connected with the anode pin 4031 through a gold wire. In this example, the negative pin is connected to the metal base 404, and the negative pin is connected to the metal base 404 by a gold wire. The arrangement of the side protrusions can be used for lifting the light emitter 405, so that the distance from a gold wire to the light emitter 405 can be shortened, and the generation of parasitic capacitance can be reduced.

The metal base 404 is further provided with a first shielding block 4042, one end of the first shielding block 4042 is connected to the metal boss 4041, the first shielding block 4042 has an arc-shaped structure, and the positive pin 4031 is disposed inside an arc-shaped corner of the first shielding block 4042. First shielding piece 4042 is close but not connect with the positive pole pin, and the setting of first shielding piece 4042 has increased the surface area of metal base 404, the radiating efficiency of improvement, and simultaneously, the curved structure of first shielding piece 4042 realizes electromagnetic shield to its inside positive pole pin 4031, plays good signal transmission's effect. Under the high frequency, the pin has stronger inductance effect, can stimulated emission, causes strong electromagnetic interference, and the pin parcel can be with most radiant energy constraint between pin and first shielding piece 4042 in the inside of first shielding piece 4042 in this application, alleviates the production of radiation. Improve the high-frequency performance of the pin and the gold wire and reduce the sudden change of impedance.

In this application, the first shielding block 4042 serves as the high frequency signal ground, and the cathode of the optical transmitter 405 can be formed by wire bonding TO the metal base 404, so that the parasitic length of the pin is reduced relative TO the wire bonding TO the TO pin, and the impedance discontinuity between the cathode of the optical transmitter 405 and the high frequency signal ground is reduced. The shielding block is directly used as a reference ground of the laser, so that the alternating current return path is shortened, and compared with the condition that ceramic exists below the ground of a high-frequency signal, the condition that the ground impedance is high is relieved.

Alternatively, the optical transmitter 405 may be an LD laser or MEL laser.

In some embodiments of the present application, the first shielding block 4042 may be a corner-type arrangement, as shown in fig. 7, comprising: a first connecting arm 40421, a second connecting arm 40422 and a third connecting arm 40423 which are connected in sequence. The first end of the first connecting arm 40421 is connected to the sidewall of the metal base 404 and is located adjacent to the metal boss 4041. The second end of the first connecting arm 40421 is connected to the first end of the second connecting arm 40422, and a certain included angle is formed between the first connecting arm 40421 and the second connecting arm 40422. Second end and the first end of third linking arm 40423 of second linking arm 40422 are connected, have certain contained angle between second linking arm 40422 and the third linking arm 40423, and second linking arm 40422 sets up in the inside of the contained angle that third linking arm 40423 and first linking arm 40421 formed. The positive electrode pin 4031 is arranged on the inner side of the corner of the first shielding block 4042, and the first shielding block 4042 forms a non-contact half-wrapping on the positive electrode pin 4031, so that most of radiation energy can be bound between the pin and the first shielding block 4042, and the generation of radiation is relieved.

The metal base 404 is further provided with a second shielding block 4043, one end of the second shielding block 4043 is connected with the metal boss 4041, and other pins are disposed inside the corner of the second shielding block 4043. The second shielding block 4043 is close to but not connected with other pins, the surface area of the metal base 404 is increased by the second shielding block 4043, the heat dissipation efficiency is improved, and meanwhile, the bending structure of the second shielding block 4043 realizes electromagnetic shielding of the pins inside the second shielding block 4043, so that a good signal transmission effect is achieved. Under the high frequency, the pin has stronger inductance effect, can stimulated emission, causes strong electromagnetic interference, and the pin wraps up in the inside of second shielding piece 4043 in this application, can tie most radiant energy between pin and second shielding piece 4043, alleviates the production of radiation.

The positive pin is arranged in the range of the connecting line of the tail ends of the first shielding block and the second shielding block and the metal base.

In this application, the second shielding block 4043 serves as the high frequency signal ground, and the cathode of the optical transmitter 405 can be wired TO the metal base 404, so that the parasitic effect of the pin is reduced relative TO the wire-TO pin, and the impedance discontinuity between the cathode of the optical transmitter 405 and the high frequency signal ground is reduced. The shielding block is directly used as a reference ground of the laser, so that the alternating current return path is shortened, and compared with the condition that ceramic exists below the ground of a high-frequency signal, the condition that the ground impedance is high is relieved.

Further, the negative pin of light emitter 405 and metal base pass through the gold thread to be connected, and optionally, the negative pin passes through the gold thread with metal boss 4041 to be connected, or the negative pin passes through the gold thread with metal boss 4041 to be connected. The negative electrode pin is connected with the metal boss 4041 through a gold wire, so that the gold wire between the negative electrode pin and the metal boss 4041 is as short as possible, and parasitic resistance is reduced.

Alternatively, the optical transmitter 405 may be an LD laser or MEL laser.

In some embodiments of the present application, the second shielding block 4043 may be in a corner-like arrangement, as shown in fig. 7, including: fourth linking arm 40431, fifth linking arm 40432, and sixth linking arm 40433 are connected in series. The first end of the fourth connecting arm 40431 is connected to the sidewall of the metal base 404 and is located adjacent to the metal projection 4041. The second end of fourth linking arm 40431 is connected to the first end of fifth linking arm 40432, and there is a certain angle between fourth linking arm 40431 and fifth linking arm 40432. A second end of fifth linking arm 40432 is connected to a first end of sixth linking arm 40433, a certain included angle is provided between fifth linking arm 40432 and sixth linking arm 40433, and fifth linking arm 40432 is disposed inside the included angle formed by sixth linking arm 40433 and fourth linking arm 40431. Other pins are arranged on the inner side of the corner of the second shielding block 4043, the second shielding block 4043 forms non-contact half-wrapping on the other pins, most of radiation energy can be bound between the pins and the second shielding block 4043, and radiation is relieved. The first shielding block 4042 forms a non-contact half-clad to the positive pin 4031, which can confine most of the radiation energy between the pin and the first shielding block 4042, and mitigate the generation of internal radiation.

Further, the positive electrode pin 4031 is disposed between the end connection lines of the first and second shielding blocks 4042, 4043 and the metal base, and forms a non-contact half-clad structure on the positive electrode pin 4031, so that most of the radiation energy can be bound between the pin and the first shielding block 4042, and the generation of internal radiation is alleviated.

Fig. 8 is a schematic diagram of an internal structure of a light emitting device according to an embodiment of the present application. In some embodiments of the present application, the first shielding block 4042 may also be an arc shielding block, the positive electrode pin 4031 is disposed inside a corner of the first shielding block 4042, and the first shielding block 4042 forms a non-contact half-coating on the positive electrode pin 4031, so that most of radiation energy can be bound between the pin and the first shielding block 4042, and radiation generation is mitigated. As shown in the figure, the first shielding block is in a half-surrounding state with respect to the pole tube pin, and the anode pin is arranged in a connecting line extending from the tail end of the first shielding block and the metal boss.

Further, the first shielding block 4042 and the positive electrode pin 4031 are of a concentric structure, so that the first shielding block 4042 can achieve the effect similar to a coaxial cable, can shield external interference signals, and plays a role in good signal transmission. And positive pole pin 4031 sets up in the inboard of the corner of first shielding piece 4042, and first shielding piece 4042 forms contactless half cladding to positive pole pin 4031, can tie most radiant energy between pin and first shielding piece 4042, alleviates the production of inside radiation.

In some embodiments of the present application, as shown in fig. 8, the second shielding block 4043 may be an arc shielding block, the other pins are disposed inside corners of the second shielding block 4043, and the second shielding block 4043 forms a non-contact half-wrapping for the other pins, so that most of the radiation energy can be confined between the pins and the second shielding block 4043, and the generation of radiation is mitigated.

Further, the second shielding block 4043 and other pins are concentric circle structures, so that the second shielding block 4043 can achieve the effect of shielding external interference signals, and good signal transmission is achieved. And other pins are arranged on the inner side of the corner of the second shielding block 4043, and the second shielding block 4043 forms non-contact half-wrapping for other pins, so that most of radiation energy can be bound between the pins and the second shielding block 4043, and the generation of internal radiation is relieved.

The application discloses optical module includes: the TO tube seat and the TO tube cap covering the TO tube seat are provided with a positive pin and a negative pin, and the pins penetrate through the TO tube seat and protrude out of the surface of the TO tube seat. And the metal base is arranged TO protrude out of the surface of the TO tube seat, and the light emitter 405 is arranged on the metal base. The metal base is provided with a metal boss 4041 and a shielding block, the metal boss 4041 protrudes towards the side face of the metal base, and the protruding direction is arranged towards the pin direction. The anode pin is connected with the anode of the light emitter 405 through a gold wire; the negative pin is connected with the metal base, and the negative pin of the light emitter 405 is connected with the metal base through a gold thread. The shielding block is in a semi-surrounding structure and wraps the pin, so that the high-frequency performance of the pin and the gold wire is improved, and the impedance mutation is reduced. The shielding block acts as a high frequency signal ground, and the cathode of the optical transmitter 405 can be wire-bonded TO the metal base 404, so that the parasitic of the pin is reduced relative TO wire-bonding TO the TO pin, and the impedance discontinuity between the cathode of the optical transmitter 405 and the high frequency signal ground is reduced. The shielding block is directly used as a reference ground of the laser, so that the alternating current return path is shortened, and compared with the condition that ceramic exists below the ground of a high-frequency signal, the condition that the ground impedance is high is relieved.

As described above, taking the upper surface of the circuit board as an example, the connection direction between the optical port 205 and the electrical port is the longitudinal direction of the optical module, the vertical direction is the width direction of the optical module, and the vertical direction is the height direction of the optical module.

Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.

It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims (9)

1. A light emitting device, comprising:

a TO tube seat is arranged on the base plate,

the TO tube cap covers the TO tube seat;

the positive pin penetrates through the TO tube seat and protrudes out of the surface of the TO tube seat;

the metal base is arranged TO protrude out of the surface of the TO tube seat, and a side of the metal base protrudes towards the direction close TO the positive electrode pin TO form a metal boss;

the side wall of the metal boss is provided with a light emitter;

the first shielding block is arranged on the other side of the metal base and is adjacent to the metal boss; the first shielding block is of a bent structure, and the extending direction of the bent structure forms open coating on the positive pin;

the positive pin is electrically connected with the light emitter.

2. The light emitting device of claim 1, further comprising: and the second shielding block is arranged on the opposite side of the first shielding block, and the positive pin is positioned in the extending connection range of the tail ends of the first shielding block and the second shielding block.

3. The light emitting device of claim 1, further comprising a negative pin connected to the metal base; the positive pin of the light emitter is connected with the positive pin through a gold wire; and the negative pin of the light emitter is connected with the metal base through a gold thread.

4. The light emitting device according to claim 1, wherein the positive electrode pin of the light emitter is connected to the positive electrode pin by a gold wire; and the negative pin of the light emitter is connected with the metal boss through a gold thread.

5. The light emitting device as claimed in claim 1, wherein the first shielding block is a circular arc-shaped structure, and the first shielding block is wrapped on the outer side of the positive pin and is not in contact with the positive pin.

6. The light emitting device according to claim 4, wherein a center of the first shielding block coincides with a center of the positive pin.

7. The light emitting device of claim 1, wherein the light emitter is a semiconductor laser.

8. A light module comprising a light emitting device according to any one of claims 1 to 7.

9. The light module of claim 8, further comprising:

an upper housing;

the lower shell is covered with the lower shell to form a wrapping cavity;

the circuit board is arranged inside the packaging cavity;

the light emitting device is arranged in the packaging cavity and connected with the circuit board.

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