CN211348740U

CN211348740U - Optical module

Info

Publication number: CN211348740U
Application number: CN201921615934.0U
Authority: CN
Inventors: 孙飞龙; 周小军; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-09-26
Filing date: 2019-09-26
Publication date: 2020-08-25
Anticipated expiration: 2029-09-26

Abstract

An embodiment of the present application shows an optical module, including: the laser diode comprises a tube seat, a laser chip, a grounding capacitor, a grounding pin, a second laser pin and a first laser pin. The negative electrode of the laser chip is connected with a grounded capacitor in the embodiment of the application. The frequency of the resonant point of the laser chip is known to be in direct proportion to the total capacitance of the power-on loop where the laser chip is located. The total capacitance is increased, and the frequency of the resonance point of the laser chip moves towards the high-frequency direction; because the frequency of the resonance point of the laser chip moves towards the high-frequency direction and the corresponding cut-off frequency moves towards the high-frequency direction in the attenuation process of the output power of the corresponding laser chip, the applicable frequency range of the optical module also moves towards the high-frequency direction, and the aim of improving the high-frequency performance of the product is fulfilled.

Description

Optical module

Technical Field

The embodiment of the application relates to the optical communication technology. And more particularly, to a light module.

Background

Due to the increasing demand for communication bandwidth in the field of optical fiber communication, global optical communication is in a rapid development period. In the field of high-speed data communication, in order to ensure that data can be transmitted at a high speed over a long distance, optical modules are generally used in the field to realize the transmission and reception of light with different wavelengths.

The existing optical module generally refers to an integrated module for photoelectric conversion, and the optical module is generally in a package structure. The optical module is prepared into a packaging structure so as to avoid the problem that the photoelectric device fails under the action of oxygen and water vapor in a non-airtight environment, wherein the photoelectric device comprises: photoelectric devices such as laser chips and backlight detectors. At present, the common packaging mode of the optoelectronic device is to package the optoelectronic device in a package cavity formed by a tube seat and a tube cap. The specific packaging process is as follows: firstly, attaching a photoelectric device to the surface of a substrate of a base, connecting the photoelectric device with a base pin of the base in a gold wire bonding mode, and realizing the electrical connection between the photoelectric device and the outside through the base pin; then, the photoelectric device is packaged in a packaging cavity formed by the tube seat and the tube cap, and finally an optical module with a packaging structure is formed.

In the process of practical application, because the frequency band curve of the laser chip may have resonance in a certain frequency range, the problem of insufficient bandwidth occurs when the laser chip operates in the corresponding frequency range.

SUMMERY OF THE UTILITY MODEL

In view of the above technical problems, an object of the present application is to provide an optical module.

A first aspect of an embodiment of the present application shows an optical module, including: a circuit board having an electrical circuit and electrical components connected by the electrical circuit; a header for carrying the device; a support plate carried by the tube seat;

a substrate supported by the support plate and having a first metal plate and a second metal plate formed of a metal material on a surface thereof;

the laser chip is borne by the substrate, and the anode of the top surface of the laser chip is connected with the surface of the first metal plate in a routing way; the negative electrode of the bottom surface is arranged on the surface of the second metal plate to realize electric connection;

the first laser pin penetrates through the upper surface and the lower surface of the tube seat, one end of the first laser pin is electrically connected with the first metal plate, and the other end of the first laser pin is electrically connected with the circuit board;

the second laser pin penetrates through the upper surface and the lower surface of the tube seat, one end of the second laser pin is electrically connected with the second metal plate, and the other end of the second laser pin is electrically connected with the circuit board;

the grounding pin does not penetrate through the upper surface and the lower surface of the tube seat, one end of the grounding pin is electrically connected with the tube seat, and the other end of the grounding pin is electrically connected with a grounding circuit of the circuit board;

and the grounding capacitor is borne by the tube seat, the negative electrode of the grounding capacitor is electrically connected with the second laser tube pin, and the positive electrode of the grounding capacitor is electrically connected with the tube seat.

An embodiment of the present application shows an optical module, including: the laser chip comprises a circuit board, a tube seat, a laser chip, a grounding capacitor, a grounding pin, a second laser pin, a first laser pin and a substrate, wherein the substrate is borne by the tube seat, and a first metal plate and a second metal plate which are made of metal materials are arranged on the surface of the substrate. The circuit board is provided with a circuit and an electrical element connected with the circuit, the cathode of the laser chip is electrically connected with the second laser pin through a second metal plate, and the anode of the laser chip is electrically connected with the first laser pin through a first metal plate; through foretell connected mode laser instrument chip, second laser pin, first laser pin form a closed circular telegram, and simultaneously, second laser pin and first laser pin still are connected with the circuit board respectively, are connected with the electric circuit board through second laser pin and first laser pin and provide the electric energy for the laser instrument chip to make laser instrument chip can realize corresponding function. On the basis, the second laser pin is also electrically connected with the negative electrode of the grounding capacitor, the positive electrode of the grounding capacitor is electrically connected with the grounding pin through the tube seat, and the laser chip is connected with the grounding capacitor in parallel through the connection mode. The negative electrode of the laser chip is connected with a grounded capacitor in the embodiment of the application. Since the negative electrode of the laser chip is connected with a grounding capacitor, when the capacitance value of the grounding capacitor is larger than that of the laser chip, the total capacitance of the power-on loop in which the laser chip is located is increased. The total capacitance increases and the frequency of the resonance point of the laser chip shifts in the high frequency direction. Because the frequency of the resonance point of the laser chip moves towards the high-frequency direction, and the corresponding cut-off frequency moves towards the high-frequency direction in the attenuation process of the output power of the corresponding laser chip, the applicable frequency range of the optical module also moves towards the high-frequency direction, and the purpose of improving the high-frequency performance of the product is further achieved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present invention;

fig. 4 is an exploded view of an optical module according to an embodiment of the present invention;

fig. 5 is a perspective view of the embodiment of the present invention providing a connection relationship between the optical transceiver module and the circuit board;

fig. 6 is a top view of the embodiment of the present invention providing a connection relationship between the optical transceiver module and the circuit board;

fig. 7 is an exploded view of the light emitting module according to the embodiment of the present invention;

fig. 8 is a schematic view of a base structure according to an embodiment of the present invention;

fig. 9 is a schematic view of a base structure according to an embodiment of the present invention;

fig. 10 is a schematic view of a base structure according to an embodiment of the present invention;

fig. 11 is a schematic view of a base structure according to an embodiment of the present invention;

FIG. 12 shows a loga of laser chips^(P _{Output of} ^/P _{Input device} ⁾-a frequency response curve;

FIG. 13 shows a loga of laser chip and optical module^(P _{Output of} ^/P _{Input device} ⁾-a frequency response curve;

fig. 14 is a S11-frequency response curve of the optical module shown in the related art and the optical module shown in the embodiment of the present application.

Illustration of the drawings:

100-optical network unit, 101-optical fiber, 102-optical module interface, 103-network cable, 104-network cable interface, 105-second circuit board, 106-cage, 107-radiator, 200-optical module, 201-upper shell, 202-lower shell, 203-unlocking handle, 300-first circuit board, 400-optical transceiver, 401-optical receiving sub-module, 402-optical transmitting sub-module, 4021-optical fiber adapter assembly, 4022-adjusting sleeve, 4023-sealing welding tube body, 4024-tube cap, 4025-base, 1-tube base, 1 a-bearing surface, 1 b-bottom surface, 2-support plate, 2 a-first binding surface, 3-base plate, 3 a-first packaging surface, 3a 1-first metal plate, 3a 2-second metal plate, 4-laser chip, 5-backlight detector, 6-grounding capacitor, 7-heat sink, 7 a-second packaging surface, 8-emitting terminal pin, 8 a-electrode pin, 8a 1-first laser pin, 8a 2-first backlight pin, 8a 3-second backlight pin, 8a 4-second laser pin, 8 b-grounding pin, 8 c-insulating sleeve, 500-flexible circuit board, 501-first flexible circuit board, 502-second flexible circuit board.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

One of the core elements of fiber optic communications is the conversion of optical to electrical signals. The optical fiber communication uses the optical signal carrying information to transmit in the optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fiber. The information processing devices such as computers use electrical signals, which require the interconversion between electrical signals and optical signals during the signal transmission process.

The optical module realizes the photoelectric conversion function in the technical field of optical fiber communication, and the interconversion of optical signals and electric signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on a circuit board, main electrical connections comprise power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the golden finger becomes a standard mode of the optical module industry, and on the basis, the circuit board is a necessary technical characteristic in most optical modules.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber is connected with the far-end server, one end of the network cable is connected with the local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber and the network cable; and the connection between the optical fiber and the network cable is completed by an optical network unit with an optical module.

An optical port of the optical module 200 is connected with the optical fiber 101 and establishes bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.

The optical network unit is provided with an optical module interface 102, which is used for accessing an optical module and establishing bidirectional electric signal connection with the optical module; the optical network unit is provided with a network cable interface 104 for accessing a network cable and establishing bidirectional electric signal connection with the network cable; the optical module is connected with the network cable through the optical network unit, specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit is used as an upper computer of the optical module to monitor the work of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network unit and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 has a second circuit board 105, and a cage 106 is disposed on a surface of the second circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected with the optical fiber 101.

The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.

Fig. 3 is a schematic diagram of an optical module according to an embodiment of the present invention, and fig. 4 is a schematic diagram of an optical module according to an embodiment of the present invention. As shown in fig. 3 and 4, an optical module 200 provided by the embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking handle 203, a first circuit board 300, and an optical transceiver 400;

the upper shell 201 and the lower shell 202 form a package cavity with two openings, specifically, two ends of the package cavity are opened (204, 205) in the same direction, or two openings in different directions are opened; one of the openings is an electrical port 204 for being inserted into an upper computer such as an optical network unit, the other opening is an optical port 205 for external optical fiber access to connect internal optical fibers, and the photoelectric devices such as the first circuit board 300 and the optical transceiver 400 are located in the packaging cavity.

The upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that adopts upper casing, lower casing to combine is convenient for install devices such as circuit board in the casing, generally can not make the casing of optical module structure as an organic whole, like this when devices such as assembly circuit board, locating component, heat dissipation and electromagnetic shield structure can't install, also do not do benefit to production automation yet.

The unlocking handle 203 is positioned on the outer wall of the packaging cavity/lower shell 202, and the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; when the optical module is inserted into the upper computer, the unlocking handle fixes the optical module in the cage of the upper computer, and the clamping relation between the optical module and the upper computer is released by pulling the unlocking handle, so that the optical module can be drawn out from the cage of the upper computer.

Referring to fig. 5, fig. 5 is a perspective view of a connection relationship between an optical transceiver module and a circuit board according to the present application. The optical transceiver 400 generally includes an rosa 401 and an rosa 402. In general, the rosa 401 is connected to the first circuit board 300 through a receiving terminal pin; the tosa 402 is connected to the first circuit board 300 through the tx pins. After receiving the optical signal by the corresponding optical fiber adapter, the optical receive sub-module 401 converts the optical signal into an electrical signal, and then the first circuit board 300 transmits the electrical signal to the second circuit board 105 (also referred to as an upper computer), and the second circuit board 105 performs a series of processes on the received electrical signal. After receiving the electrical signal, the tosa 402 converts the electrical signal into an optical signal, and then emits the optical signal through an optical fiber adapter corresponding to the tosa, thereby implementing the conversion of the optical signal. In the transmission process of signals, because a receiving terminal pin or a transmitting terminal pin leaks into the air, which may cause a serious impedance mismatch, the optical receive sub-module 401 and the optical transmit sub-module 402 according to the technical solution shown in the embodiment of the present application may be connected to the first circuit board 300 through the flexible circuit board 500.

FIG. 6 is a top view of a possible embodiment of the connection between the optical transceiver module and the circuit board. In the embodiment shown in fig. 6, the rosa 401 is connected to the first circuit board 300 through a first flexible circuit board 501, and the rosa 402 is connected to the first circuit board 300 through a second flexible circuit board 502. In the embodiment shown in fig. 6, the optical receive sub-module 401 and the optical transmit sub-module 402 are respectively connected to the first circuit board through the flexible circuit board, and this connection effectively avoids the occurrence of problems such as signal distortion and the like due to serious impedance mismatch caused by the long pins leaking into the air.

The tosa 402 is provided with optoelectronic devices such as a laser chip and a backlight detector. In order to avoid the problem that the photoelectric device fails under the action of oxygen and water vapor in a non-airtight environment. The tosa 402 is typically fabricated in a package structure. FIG. 7 is an exploded view of the transmitter optical subassembly of the package structure, and it can be seen that the transmitter optical subassembly 402 includes: the optical fiber adapter assembly 4021, the adjusting sleeve 4022, the sealing welding tube body 4023, the tube cap 4024 and the base 4025.

As shown in fig. 8, the base 4025 includes: the LED module comprises a tube seat 1, a support plate 2, a substrate 3, a photoelectric device and a plurality of emitting terminal pins 8. The tube seat 1 is perpendicular to the support plate 2. One surface of the supporting plate 2 is fixedly connected with one surface of the substrate 3, the other surface of the substrate 3 is used for packaging the photoelectric device, the photoelectric device packaged on the photoelectric device substrate in fig. 8 is a laser chip, and in the actual application process, the photoelectric device can also be a light receiving chip. The laser chip in fig. 8 is electrically connected to the emitter pin 8 by gold wire bonding, and the electrical connection of the laser chip to the outside is realized through the emitter pin 8.

The substrate 3 sealed by the cap 4024 and the base 4025 is sealed to form a sealed cavity for supporting the substrate 3 and the laser chip. The tube cap 4024 is connected to the optical fiber adapter assembly 4021 by a sealing and welding tube 4023. Optionally, an adjusting sleeve 4022 may be disposed between the sealing welding tube 4023 and the optical fiber adapter 4021, and the adjusting sleeve 4022 is used to adjust the position of the optical fiber adapter 4021.

In view of the above technical problem, reference may be made to fig. 9 and 10 for a structure of a base 4025 provided in an embodiment of the present application. The base 4025 includes: the device comprises a tube seat 1, a support plate 2, a substrate 3, a laser chip 4, a backlight detector 5, a grounding capacitor 6 and a plurality of transmitting terminal pins 8. The tube seat 1 is perpendicular to the support plate 2; the support plate 2 is provided with a first binding surface 2 a; the substrate 3 has a second bonding surface (not shown) and a first packaging surface 3a, which are oppositely arranged, and the second bonding surface is bonded to the first bonding surface 2 a; the negative electrode of the laser chip 4 is packaged on the first packaging surface 3 a; the backlight detector 5 and the grounding capacitor 6 are attached to the surface of the tube seat 1, and the light receiving surface of the backlight detector 5 faces the rear light emitting surface of the laser chip 4; the grounding capacitor 6 is electrically connected to the laser chip 4.

The tube seat 1 can be made of tungsten copper, silver alloy, gold or ceramic or other materials with good heat conducting property. The stem 1 is substantially cylindrical, and has a circular bearing surface 1a and a bottom surface 1b opposite to the bearing surface 1 a.

The supporting plate 2 can be made of tungsten copper, silver alloy, gold, ceramic or other materials with good heat-conducting property. Preferably, the support plate 2 is made of tungsten copper. The supporting plate 2 penetrates through the bearing surface 1a and the bottom surface 1b of the tube seat 1, and the supporting plate 2 and the tube seat 1 can be integrally formed or can be independently arranged. The supporting plate 2 is a substantially cylindrical body, specifically, a quadrangular prism or a semicircular cylinder, and in the process of practical application, any cylindrical structure that can function as the supporting substrate 3 can be used as the supporting plate 2. The supporting plate 2 is arranged on one side of the center of the tube seat 1, the supporting plate 2 is provided with a first binding surface 2a perpendicular to the bearing surface 1a, and the first binding surface 2a is parallel to the central axis of the tube seat 1.

In the embodiment of the present application, the substrate 3 may be a ceramic substrate 3 having a good thermal conductivity. The material of the ceramic substrate 3 may be aluminum nitride, aluminum oxide, or the like. The substrate 3 is provided with a second binding face and a first packaging face 3a which are oppositely arranged, the second binding face is used for being mutually bound with the first binding face 2a of the supporting plate 2, and the first packaging face 3a is used for binding the laser chip 4. In this application embodiment, the substrate 3 and the supporting plate 2 are attached to each other, on one hand, the supporting plate 2 can support the substrate 3, and on the other hand, heat generated in the process of making the photoelectric device can be transferred to the supporting plate 2 through the substrate 3, so as to increase the heat dissipation surface, and keep the temperature of the substrate 3 substantially constant, so that the temperature of the photoelectric device packaged on the substrate 3 is substantially constant.

The laser chip 4 is mounted on the first mounting surface 3a of the substrate 3. The laser chip 4 may be fixed to the first package face 3a of the substrate 3 by solder or conductive paste. The laser chip 4 mainly includes a semiconductor laser diode for emitting laser light.

The backlight detector 5 is packaged on the bearing surface 1a of the tube seat 1, and a light receiving surface of the backlight detector 5 is opposite to a rear light emitting surface of the semiconductor laser diode. The backlight detector 5 can be a side-illumination InGaAs/InP detector, and can also be a front-light-entering InGaAs/InP detector. The backlight detector 5 is used for sensing the power of the laser light emitted by the semiconductor laser diode, so that the magnitude of the current applied to the semiconductor laser diode can be controlled according to the detection result of the backlight detector 5.

In a possible embodiment, the backlight detector 5 is connected to the carrying surface 1a of the stem 1 through a heat sink 7. In particular, with continued reference to fig. 9, the tosa 402 further includes a heat sink 7 for supporting the backlight detector 5; the heat sink 7 has a third attaching face (not shown) and a second package face 7 a; the second package face 7a is obliquely arranged relative to the third fitting face; the third attaching surface is attached to the bearing surface 1a, and the negative electrode of the backlight detector 5 is packaged on the second packaging surface 7 a. On the one hand, the heat sink 7 dissipates heat from the backlight detector 5 attached thereto, so that the temperature of the backlight detector 5 is kept constant. On the other hand, the second package face 7a of the heat sink 7 is disposed obliquely with respect to the third bonding face, so that the influence of reflected light on the semiconductor laser diode can be reduced.

In this embodiment, the cap 4024 is configured to cooperate with the base 4025 to seal the carrying surface 1a of the socket 1 and the optoelectronic devices mounted on the substrate 3. The shape of the cap 4024 corresponds to the shape of the socket 1. The cap 4024 is tightly coupled to the carrying surface 1a of the socket 1 to seal the carrying surface 1a and the optoelectronic device mounted on the substrate 3. An optical window is formed at one end of the cap 4024 far away from the bearing surface 1a, and the optical window is used for transmitting the signal light emitted by the laser chip 4. The cap 4024 may be a flat window cap 4024, or may be a cap 4024 provided with a ball lens or a non-ball lens, and different types of caps 4024 may be selected according to different coupling optical paths and use requirements.

One of the plurality of transmitting terminal pins 8 is a ground pin 8 b; the others are electrode pins 8 a. The grounding pin 8b is arranged on one surface (bottom surface 1b) opposite to the tube seat 1 and does not penetrate through the tube seat 1; the electrode pin 8a penetrates the stem 1. The tube seat 1 is made of metal, and the tube seat 1 is connected with the electrode pin 8a through the glass material insulating sleeve 8c, so that the tube seat 1 is electrically isolated from the electrode pin 8 a. Meanwhile, the socket 1 and the ground pin 8b are electrically conductive to each other.

The grounding capacitor 6 is packaged on the bearing surface 1a of the tube seat 1, and meanwhile, the grounding capacitor 6 is electrically connected with the laser chip. The grounding capacitor adjusts the harmonic point of the laser chip, so that the harmonic point moves towards the high-frequency direction, and the purpose of improving the high-frequency performance of the optical module is achieved.

The connection relationship of each device is described in detail with reference to specific embodiments to demonstrate how the ground capacitance can be adjusted by adjusting the harmonic point of the laser chip to move the harmonic point in the high frequency direction, thereby achieving the purpose of improving the high frequency performance of the optical module.

Fig. 11 is a schematic structural diagram of a base 4025 according to a preferred embodiment, and reference numerals of some devices in fig. 11 can refer to fig. 9 and 10. Fig. 11 shows that the base 4025 includes: the device comprises a tube seat 1, a supporting plate 2, a substrate 3, a laser chip 4, a backlight detector 5, a grounding capacitor 6, a

heat sink

7 and 5 transmitting terminal pins 8, wherein one transmitting terminal pin is a grounding pin 8b which is used for grounding and can be grounded through a grounding circuit on a circuit board; the others are electrode pins 8 a. The electrode pins 8a are a first laser pin 8a1, a first backlight pin 8a2, a second backlight pin 8a3, and a second laser pin 8a4, respectively.

The tube seat 1 comprises a bearing surface 1a and a bottom surface 1b which are arranged oppositely, and the support plate 2 is vertically arranged on the bearing surface 1 a; the supporting plate 2 is provided with a first attaching surface 2a, and the first attaching surface 2a is perpendicular to the bearing surface 1 a; the substrate 3 has a second bonding surface (not shown) and a first packaging surface 3a, which are oppositely arranged, and the second bonding surface is bonded with the first bonding surface 2 a. The first package face 3a has a first metal plate 3a1 and a second metal plate 3a2 that are disposed apart from each other.

The negative electrode of the laser chip 4 is fixed to one end of the first metal plate 3a1 by solder or conductive adhesive, and the other end of the first metal plate 3a1 is attached to the second laser pin 8a 4. Meanwhile, the second laser pin 8a4 is electrically connected with the negative electrode of the grounding capacitor 6 through at least one gold wire; the positive electrode of the grounding capacitor 6 is electrically connected with the tube seat 1 through at least one gold thread, and because the bottom surface of the tube seat 1 is provided with the grounding pin 8b, and the tube seat 1 and the grounding pin 8b are mutually electrified, the positive electrode of the grounding capacitor 6 can be electrically connected with the grounding pin 8b through the tube seat 1.

The positive electrode of the laser chip 4 is electrically connected to one end of the second metal plate 3a2 through at least one gold wire, and the other end of the second metal plate 3a2 is attached to the first laser pin 8a 1. In a possible embodiment, the second metal plate 3a2 may be a microstrip line; the microstrip line is packaged on the surface of the first packaging surface 3 a; one end of the microstrip line is electrically connected with the anode of the laser chip 4 through at least one gold thread, and the microstrip line is used for feeding a high-speed modulation signal into the electro-absorption modulator of the laser chip 4.

The back light-emitting surface of the laser chip 4 faces the light-receiving surface of the backlight detector 5, and the backlight detector 5 is fixed on the bearing surface 1a through the heat sink 7. Specifically, the heat sink has a third attaching surface (not shown in the figure) and a second package surface 7 a; the second packaging surface is obliquely arranged relative to the third attaching surface; the third attaching surface is attached to the bearing surface 1a, the negative electrode of the backlight detector 5 is attached to the second packaging surface 7a, and the second packaging surface 7a is electrically connected with the second backlight pin 8a3 through at least one gold wire; the second packaging surface 7a can realize the electrical connection between the cathode of the backlight detector 5 and the second backlight pin 8a 3. The positive electrode of the backlight detector 5 is electrically connected with the first backlight pin 8a2 through at least one gold wire.

The optical module can have better high-frequency performance by the electric connection mode. In particular, when the frequency of excitation of the laser chip is equal to the natural frequency of the laser chip, the amplitude of the electromagnetic oscillation of the laser chip will also reach a peak, also called the resonance point, near which the laser core is locatedThe output power of the chip decays rapidly. For example, the laser chip is excited with an electrical signal of a fixed input power, the frequency of the electrical signal is gradually changed during the experiment, and the output power of the laser chip is recorded. Then based on the input power P_{Output of}And the output power P_{Input device}Calculating a power gain value from the ratio of (A) to (B). Finally based on the logarithm of the power gain value (loga)^(P _{Output of} ^/P _{Input device} ⁾) Corresponding relation with input frequency to construct loga^(P _{Output of} ^/P _{Input device} ⁾-a frequency response curve. When P is present_{Output of}/P_{Input device}When less than 1, the corresponding loga^(P _{Output of} ^/P _{Input device} ⁾And when the output power is less than 0, the output power of the laser chip is in a decay state. loga^(P _{Output of} ^/P _{Input device} ⁾The more negative the corresponding value, the more severely the output power of the laser chip is attenuated. FIG. 12 shows a loga of a laser chip^(P _{Output of} ^/P _{Input device} ⁾-a frequency response curve. As can be seen from FIG. 12, the laser chip exhibits a resonance point at aGHz, while in the vicinity of aGHz, loga^(P _{Output of} ^/P _{Input device} ⁾The corresponding value is shifted to a negative value, the corresponding P_{Output of}The response power (also referred to as output power) of the laser rapidly decreases in the vicinity of aGHz. In general, the resonance point of the laser chip is located in the high frequency band, which results in a low response of the laser chip to the excitation signal of the high frequency band, thereby limiting the high frequency performance of the optical module.

In order to improve the high-frequency performance of the optical module product, in the process of packaging the optical module illustrated in this embodiment, a ground capacitor is connected to the negative electrode of the laser chip. The frequency of the resonant point of the laser chip is known to be in direct proportion to the total capacitance of the power-on loop where the laser chip is located, and since the negative electrode of the laser chip is connected with a grounding capacitor in the embodiment, the capacitance value of the grounding capacitor is larger than that of the laser chip, the total capacitance of the power-on loop where the laser chip is located is improved. The total capacitance increases and the frequency of the corresponding resonance point increases.

The frequency increase of the resonance point of the laser chip in the optical module shown in the embodiments of the present application will be described below with reference to specific experimental data. Single laser chip and laser chip connected grounding capacitor loga^(P _{Output of} ^/P _{Input device} ⁾A comparison of the frequency response curves can be seen in fig. 13. In FIG. 13, the dotted line represents a loga of the laser chip^(P _{Output of} ^/P _{Input device} ⁾Frequency response curve, solid line loga of laser chip connection to ground capacitance^(P _{Output of} ^/P _{Input device} ⁾-a frequency response curve. It can be seen that the resonance point of the single laser chip is a, and the resonance point of the laser chip connected with the grounding capacitor is B; the frequency is clearly increased by B compared to a.

In the course of optical module application, loga^(P _{Output of} ^/P _{Input device} ⁾When-3 dB is reached, the output power is attenuated to 0.707, and the frequency of the corresponding input signal is called the cut-off frequency. Usually, loga^(P _{Output of} ^/P _{Input device} ⁾An input signal with a frequency less than-3 dB cannot be used as an input signal of the optical module because of severe signal attenuation. In the experimental results shown in fig. 13, it can be seen that, compared to the single laser chip, the frequency of the resonance point of the laser chip connected with the ground capacitor is shifted in the high frequency direction, and the cutoff frequency D corresponding to the cutoff frequency C of the laser chip is also shifted in the high frequency direction in the attenuation process of the output power of the corresponding laser chip, so that the applicable frequency range of the optical module is also shifted in the high frequency direction, thereby achieving the purpose of improving the high frequency performance of the product.

The optical module product shown in the present application has better high-frequency performance, which is further described below with reference to specific examples. In particular, the results of the experiment can be continued with reference to FIG. 13. Fig. 13 shows a logo of an optical module shown in the prior art by a dotted line^(P _{Output of} ^/P _{Input device} ⁾Frequency response curve, solid line being loga of optical module shown in the example of the application^(P _{Output of} ^/P _{Input device} ⁾-a frequency response curve. It can be seen that the frequency adaptation range of the input signal of the optical module shown in the prior art is (0-15.5). The frequency adaptation range of the input signal of the optical module shown in the embodiment of the application is (0-22.1). It can be seen that the high frequency performance of the optical module shown in the embodiments of the present application is improved compared to the optical module shown in the prior art.

In order to further prove that the high-frequency performance of the optical module shown in the embodiment of the present application is improved, the embodiment of the present application further describes that the high-frequency performance of the optical module shown in the embodiment of the present application is improved in combination with another test result (S11 input reflection coefficient). Generally, on the premise that the input power is constant, the smaller S11 is, the larger the output power of the corresponding optical module is.

Fig. 14 is a graph comparing S11-frequency response curves of the optical module shown in the related art and the optical module shown in the embodiment of the present application. In fig. 14, the dotted line represents an S11-frequency response curve of the optical module shown in the related art, and the solid line represents an S11-frequency response curve of the optical module shown in the embodiment of the present application. It can be seen that, in the frequency band (15.5 to 22.1), the S11 coefficients of the optical module shown in the embodiment of the present application are all smaller than S11 of the optical module shown in the prior art, and this experimental data also proves that the response performance of the optical module shown in the embodiment of the present application in the frequency band (15.5 to 22.1) is stronger than that of the optical module in the prior art. It can be seen that the high frequency performance of the optical module shown in the embodiments of the present application is improved compared to the optical module shown in the prior art.

It should be understood that the terms "first," "second," "third," and the like in the description and in the claims of the present application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used are interchangeable under appropriate circumstances and can be implemented in sequences other than those illustrated or otherwise described herein with respect to the embodiments of the application, for example.

Furthermore, the terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a product or device that comprises a list of elements is not necessarily limited to those elements explicitly listed, but may include other elements not expressly listed or inherent to such product or device.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A light module, comprising:

a circuit board having an electrical circuit and electrical components connected by the electrical circuit;

a header for carrying the device;

a base plate carried by the socket and having a first metal plate and a second metal plate formed of a metal material on a surface thereof;

2. The optical module of claim 1, wherein the capacitance of the ground capacitor is greater than the capacitance of the laser chip.

3. The optical module of claim 1, further comprising: a support plate;

the supporting plate is borne by the tube seat and is vertically arranged on the bearing surface of the tube seat; the supporting plate is provided with a first binding surface which is vertical to the bearing surface;

the substrate is provided with a second binding surface and a first packaging surface which are oppositely arranged, and the second binding surface is bound on the first binding surface;

the second binding surface is attached to the first binding surface;

the first package face has a first metal plate and a second metal plate formed of a metal material.

4. A light module according to any one of claims 1-3, characterized by further comprising: a backlight detector;

the backlight detector is arranged on the bearing surface of the tube seat, and the light receiving surface of the backlight detector faces the rear light-emitting surface of the laser chip.

5. The light module of claim 4, further comprising: a second backlight pin and a first backlight pin;

the negative electrode of the backlight detector is electrically connected with the second backlight pin in a routing mode, and the positive electrode of the backlight detector is electrically connected with the first backlight pin in a routing mode.

6. The light module of claim 4, further comprising: a heat sink for supporting the backlight detector;

the backlight detector is arranged on the bearing surface of the tube seat through the heat sink.

7. The optical module of claim 6, wherein the heat sink has a third mating face and a second package face; the second packaging surface is obliquely arranged relative to the third attaching surface;

the third attaching surface is attached to the bearing surface of the tube seat;

and the negative electrode of the backlight detector is attached to the second packaging surface.