CN210775925U

CN210775925U - Light emitter and optical module

Info

Publication number: CN210775925U
Application number: CN201921605827.XU
Authority: CN
Inventors: 孙飞龙; 周小军; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-09-25
Filing date: 2019-09-25
Publication date: 2020-06-16
Anticipated expiration: 2029-09-25

Abstract

The application provides a light emitter and an optical module, wherein the light emitter comprises a tube cap and a tube seat used for bearing a device, the tube cap and the tube seat are combined to form a cavity for packaging the device, the light emitter further comprises an upright post arranged on the tube seat and a substrate arranged on the side wall of the upright post, the basic edge is provided with an avoiding gap, and the surface of the basic edge is provided with a first signal line transmission layer and a second signal line transmission layer; the laser chip is arranged in a non-edge area of the substrate, the cathode of the bottom surface is arranged on the surface of the first signal line transmission layer, the anode of the top surface is connected with the surface of the second signal line transmission layer in a routing mode, laser emitted by the laser chip is emitted to the pipe cap through the avoiding notch, and the avoiding notch enables the substrate not to block the propagation of the laser. Therefore, the light beam emitted by the laser chip can not irradiate the substrate any more, and further can not interfere with the substrate. This application need not to adjust laser chip's fixed position through seting up the mode of dodging the breach, can solve the light interference problem, can solve again with the compatibility problem of pipe cap.

Description

Light emitter and optical module

Technical Field

The present application relates to the field of optical communication technologies, and in particular, to an optical transmitter and an optical module.

Background

An optical transceiver module, called optical module for short, is a standard module in the field of optical communication. A standard optical module generally includes an tosa, an rosa, a microprocessor, etc., and in some optical modules, the tosa and the rosa are packaged together in a metal housing to form a bi-directional optical sub-module, which is also called an rosa.

Compared with other packaging technologies, the TO (Through-hole) -based packaging technology has the advantages of small parasitic parameters, low process cost and the like, so that the optical transmitter in the tosa usually adopts a coaxial TO packaging mode. Fig. 1 is an exploded view of a typical tosa. As shown in fig. 1, the tosa comprises a light emitter (formed by two parts, a base 11 and a cap 12), a package 20, a connector 30 and a fiber adapter in sequence from left to right. Fig. 2 is a cross-sectional view of the socket of fig. 1. As shown in fig. 2, a substrate 112 is attached to the pillar 111 of the base 11, a signal transmission layer (not shown) is plated on the surface of the substrate 112, and the back electrode of the laser chip 114 is attached to the signal transmission layer of the substrate 112 by solder. For the convenience of mounting the substrate 112, the substrate 112 is usually designed to have a structure with the same height as the columns 111, that is, the substrate 112 is flush with the tops of the columns 111. However, when the divergence angle of the light beam emitted from the laser chip 114 is large, as shown in fig. 2, a part of the light beam emitted from the laser chip 114 is irradiated onto the ceramic substrate 112, and interferes with the substrate 112, thereby affecting the quality of the emitted light beam and the coupling efficiency.

In view of the above problems, the conventional solution is to adjust the fixing position of the laser chip 114 on the substrate 112 to be high, i.e. to be toward the top of the substrate 112. However, since the collimating lens for collimating the light beam emitted from the laser chip 114 is disposed on the tube cap 12, and the position of the light-emitting point of the laser chip 114 needs to be matched with the focal position of the collimating lens, the interference problem is solved after the laser chip 114 is adjusted high, but a new tube cap needs to be selected again to adapt to the change of the fixed position of the laser chip 114, so that the product compatibility is poor, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a light emitter and an optical module, which aim to solve the problem that light beams emitted by a laser chip interfere with a substrate.

According to a first aspect of embodiments of the present application, there is provided an optical transmitter comprising:

a header for carrying the device;

the tube cap is combined with the tube seat to form a cavity of the packaging device;

a column carried by the tube socket for dissipating heat through the tube socket;

the substrate is arranged on the side wall of the upright column, the edge of the substrate is provided with an avoidance notch, and the surface of the substrate is provided with a first signal line transmission layer and a second signal line transmission layer which are made of metal materials;

the laser chip is arranged in the non-edge area of the substrate, the cathode of the bottom surface is arranged on the surface of the first signal line transmission layer to realize electric connection, the anode of the top surface is connected with the surface of the second signal line transmission layer in a routing way, the emitted laser is emitted to the pipe cap through the avoidance notch, and the avoidance notch enables the substrate not to block the transmission of the laser.

According to a second aspect of embodiments of the present application, there is provided an optical module comprising the optical transmitter provided by the first aspect of embodiments of the present application.

As can be seen from the above embodiments, the light emitter and the optical module provided in the embodiments of the present application provide an avoidance notch for avoiding a light beam emitted by the laser chip on the top of the substrate on the light emitting surface side corresponding to the laser chip, so that the light beam emitted by the laser chip does not irradiate the substrate again, and further does not interfere with the substrate. In addition, the embodiment of the application does not need to adjust the fixed position of the laser chip by arranging the avoidance notch, so that the problem of light interference can be solved, and the problem of compatibility with a pipe cap can be solved.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.

FIG. 1 is an exploded view of a typical tosa;

FIG. 2 is a cross-sectional view of the socket of FIG. 1;

fig. 3 is a schematic diagram of the connection relationship of the optical communication terminal;

FIG. 4 is a schematic diagram of an optical network unit;

fig. 5 is a schematic structural diagram of an optical module provided in an embodiment of the present application;

fig. 6 is an exploded schematic structural diagram of an optical module provided in an embodiment of the present application;

fig. 7 is a schematic structural diagram of an optical transceiver sub-assembly provided in an embodiment of the present application;

fig. 8 is a schematic diagram of a first structure of a light emitter provided in an embodiment of the present application;

fig. 9 is a schematic diagram of a second structure of a light emitter provided in an embodiment of the present application;

fig. 10 is a schematic diagram of a basic structure of a substrate provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without any creative effort belong to the protection scope of the present invention.

One of the core elements of fiber optic communications is the conversion of optical to electrical signals. The optical fiber communication uses the optical signal carrying information to transmit in the optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fiber. The information processing devices such as computers use electrical signals, which require the interconversion between electrical signals and optical signals during the signal transmission process.

The optical module realizes the photoelectric conversion function in the technical field of optical fiber communication, and the interconversion of optical signals and electric signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on a circuit board, main electrical connections comprise power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the golden finger becomes a standard mode of the optical module industry, and on the basis, the circuit board is a necessary technical characteristic in most optical modules.

Fig. 3 is a schematic diagram of the connection relationship of the optical communication terminal. As shown in fig. 3, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber is connected with the far-end server, one end of the network cable is connected with the local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber and the network cable; and the connection between the optical fiber and the network cable is completed by an optical network unit with an optical module.

An optical port of the optical module 200 is connected with the optical fiber 101 and establishes bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.

The optical network unit is provided with an optical module interface 102, which is used for accessing an optical module and establishing bidirectional electric signal connection with the optical module; the optical network unit is provided with a network cable interface 104 for accessing a network cable and establishing bidirectional electric signal connection with the network cable; the optical module is connected with the network cable through the optical network unit, specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit is used as an upper computer of the optical module to monitor the work of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network unit and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 4 is a schematic diagram of an optical network unit structure. As shown in fig. 4, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected with the optical fiber 101.

The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.

Fig. 5 is a schematic structural diagram of an optical module 200 according to an embodiment of the present application, and fig. 6 is an exploded structural diagram of the optical module 200 according to an embodiment of the present invention. As shown in fig. 5 and 6, an optical module 200 provided in the embodiment of the present application includes an optical transceiver sub-assembly 205, and further includes an upper housing 201, a lower housing 202, an unlocking handle 203, and a circuit board 204.

The upper shell 201 and the lower shell 202 form a wrapping cavity with two openings, specifically, two ends of the wrapping cavity are opened (206, 207) in the same direction, or two openings in different directions are opened; one of the openings is an electrical port 206 for inserting into an upper computer such as an optical network unit, the other opening is an optical port 207 for accessing an external optical fiber to connect an internal optical fiber, and the photoelectric devices such as the circuit board 204 are positioned in the packaging cavity.

The upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realizing electromagnetic shielding and heat dissipation; the assembly mode that upper housing 201 and lower housing 202 combine is adopted, be convenient for install devices such as circuit board 204 in the casing, generally can not make the casing of optical module into an organic whole structure, like this when devices such as assembly circuit board, locating component, heat dissipation and electromagnetic shield structure can't install, also do not do benefit to production automation yet.

The unlocking handle 203 is positioned on the outer wall of the packaging cavity/lower shell 202, and the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; when the optical module is inserted into the host computer, the optical module is fixed in the cage of the host computer by the unlocking handle 203, and the optical module can be pulled out from the cage of the host computer by pulling the unlocking handle 203 to release the engagement relation between the optical module and the host computer.

The optical transceiver sub-module 205 is configured to emit two laser beams with different wavelengths and receive two laser beams with different wavelengths, so as to implement dual optical path emission and dual optical path receiving of optical signals by the optical module 200. Fig. 7 is a schematic structural diagram of an optical transceiver sub-assembly provided in the embodiment of the present application. As shown in fig. 7, the rosa 300 includes a circular-square tube 60, an optical transmitter 10, and an optical receiver 50.

As shown in fig. 7, the round and square tube body 60 is used for carrying and fixing the optical transmitter 10 and the optical receiver 50. In the embodiment of the present application, the round and square tube 60 is generally made of a metal material, which is beneficial to implementing electromagnetic shielding and heat dissipation. The round and square tube body 60 is provided with a first tube opening and a second tube opening. Typically, the first and second nozzles are disposed on adjacent sidewalls of the round and square tube 60. Preferably, the first nozzle is disposed on the side wall of the round and square tube body 60 in the length direction, and the second nozzle is disposed on the side wall of the round and square tube body 60 in the width direction.

The light emitter 10 is embedded into the first pipe orifice, and the light emitter 10 is in heat conduction contact with the round and square pipe body 60 through the first pipe orifice; the light receiver 50 is embedded in the second pipe orifice, and is in heat-conducting contact with the round and square pipe body 60 through the second pipe orifice. Alternatively, the optical transmitter 10 and the optical receiver 50 are directly press-fitted into the round and square tube 60, and the round and square tube 60 is in contact with the optical transmitter 10 and the optical receiver 50, respectively, directly or through a heat conducting medium. The round and square tube 60 can be used for heat dissipation of the optical transmitter 10 and the optical receiver 50, and the heat dissipation effect of the optical transmitter 10 and the optical receiver 50 is ensured. The optical fiber adapter 40 is embedded on the other side of the round and square tube body 60 and is used for connecting optical fibers with the optical transceiver sub-module.

It should be noted that, in this embodiment, the optical transmitter 10 and the optical receiver 50 are packaged integrally, and in a specific implementation, a separate packaging structure as shown in fig. 1 may also be adopted.

Fig. 8 is a schematic diagram of a first structure of a light emitter provided in an embodiment of the present application. As shown in fig. 8, the optical transmitter 10 in the present embodiment is a coaxial TO package, and it should be noted that only the structure of the stem portion is shown, and the cap portion is not shown in the figure, and the specific structure can refer TO the cap in fig. 1.

Wherein the stem 11 is generally designed as an oblate cylindrical structure for carrying the various devices in the light emitter 10. The socket 11 is provided with a plurality of pin through holes for the pins 116 to pass through, wherein a part of the pins are inserted into the pin through holes and protrude from the top surface of the socket 11 to be connected with the device fixed on the socket 11, and then the other end of the pins 116 can be connected with the circuit board 204 in the optical module.

The stem 11 is provided with a semi-cylindrical pillar 111, wherein the pillar 111 may be integrated with the stem 11, and the pillar 111 may be made of an alloy, such as a copper alloy, a nickel alloy, etc., and mainly plays a role in heat dissipation and load bearing, such as for bearing the laser chip 114 and assisting heat dissipation thereof. It should be noted that the structure for fixing the laser chip 114 is not limited to the pillar 111 provided in this embodiment, and it may be replaced with a heat sink fixed to the stem.

In the embodiment of the present application, as shown in fig. 8, in order to facilitate control of the conduction path and heat dissipation of the laser chip 114, the laser chip 114 is attached to the pillar 111 through the substrate 112, and the top of the substrate 112 is flush with the top of the pillar 111, but the heights of the two may also be different. The substrate 112 and the vertical column 111 can be fixed by welding with solder, and the substrate 112 can be made of ceramic materials such as aluminum nitride and aluminum oxide. Further, a first signal line transmission layer 1131 and a second signal line transmission layer 1132 which are made of metal materials are arranged on the substrate 112, a certain insulation interval is provided between the first signal line transmission layer 1131 and the second signal line transmission layer 1132, and the first signal line transmission layer 1131 and the second signal line transmission layer 1132 are respectively connected with a pin.

As shown in fig. 8, the cathode and the anode of the laser chip 114 in the present embodiment are disposed on two opposite surfaces, wherein the cathode is disposed on the lower surface (bottom surface) and the anode is disposed on the upper surface (top surface), and in order to distinguish the two opposite surfaces, the present embodiment will be described as the upper surface and the lower surface. The lower surface of the laser chip 114, i.e., the cathode thereof, is attached to the first signal line transmission layer 1131, and the anode of the laser chip 114 is connected to the second signal line transmission layer 1132 by a metal wire, such as a gold wire bonding.

Meanwhile, an avoidance notch 1121 for avoiding the light beam emitted from the laser chip 114 is formed at the top of the substrate 112 corresponding to the light emitting surface side of the laser chip 114. Fig. 9 is a schematic diagram of a second structure of a light emitter provided in an embodiment of the present application. As shown in fig. 9, the avoidance gap 1121 prevents the light beam emitted from the laser chip 114 from being irradiated onto the substrate 112 and interfering therewith. In addition, the embodiment of the application does not need to adjust the fixed position of the laser chip 114 in a slot mode, so that the problem of light interference can be solved, and the problem of compatibility with a pipe cap can be solved.

Further, since the first signal line transmission layer 1131 and the second signal line transmission layer 1132 are used for transmitting a high-frequency signal for controlling the operation of the laser chip 114 during the operation of the optical module, the design shape thereof may affect the signal transmission quality. After the avoidance gap 1121 is formed, the layout area of the signal line transmission layer is limited, especially the first signal line transmission layer 1131 for fixing the laser chip 114. For the above reasons, the present embodiment designs the signal line transmission layer to ensure the signal transmission quality thereof.

Fig. 10 is a schematic diagram of a basic structure of a substrate provided in an embodiment of the present application. As shown in fig. 10, the first signal line transmission layer 1131 in this embodiment includes a chip fixing region 311 and a signal transmission region 312, that is, the chip fixing region 311 is on the right side of the dotted line in the figure, and the signal transmission region 312 is on the left side of the dotted line in the figure. The edge of the chip fixing region 311 connected to the signal transmission region 312 is a first side edge, an edge close to the second signal line transmission layer is a second side edge, and an edge close to the avoidance notch 1121 is a third side edge. Meanwhile, the width of the first side edge is larger than that of the second side edge, and the third side edge is of an arc-shaped structure and is smoothly connected with the first side edge and the second side edge. Through the above design, not only the width of the signal transmission layer can be ensured, but also the smooth transition design to the third side edge can avoid the influence of the sharp corner on the first signal line transmission layer 1131 on the signal transmission quality. In order to further widen the width of the signal transmission layer, the side of the signal transmission region 312 near the top of the substrate 112 is disposed parallel to the top surface of the substrate 112.

Further, in order to reduce the influence of the avoidance notch 1121 on the arrangement position of the first signal line transmission layer 1131 and ensure that the light beam emitted by the laser chip 114 is not blocked by the substrate 112, based on the characteristic that the light beam emitted by the laser chip 114 is a cone-shaped light beam, the width L of the avoidance notch 1121 is gradually increased in the light emitting direction along the laser chip 114 in the present embodiment. Meanwhile, in terms of the size of the avoidance gap 1121, it is only necessary to ensure that the light beam emitted by the laser chip 114 can be avoided. The design shape of the avoidance notch 1121 is designed to be an arc-shaped groove according to the high-frequency simulation result of the optical module, but this embodiment does not specifically limit the design shape, and the design shape can be designed as needed in the specific implementation process.

Further, based on the characteristic that the light beam emitted by the laser chip 114 is a cone-shaped light beam, it is convenient to paste the laser chip 114, and it is prevented that a part of the laser chip 114 is suspended after being pasted, and for the depth of the avoidance gap 1121, the design is performed according to the requirement that a certain distance is formed between the light-emitting surface of the laser chip 114 and the bottom of the avoidance gap 1121.

In this embodiment, only one laser chip is attached to the stem, and in the specific implementation process, two or more laser chips may be attached to the stem, so as to implement the emission of the multi-optical-path optical signal. Meanwhile, an avoidance notch is formed in the light emitting side of each laser chip corresponding to the top of the substrate 112, and of course, the avoidance notches can also be communicated with each other to form an integral groove.

In addition, other components, such as a backlight detector 115 for detecting the light emitting power of the laser chip 114, a thermistor for acquiring the temperature of the pillar 111 to monitor the operating temperature of the laser chip 114, and a thermoelectric cooler for dissipating heat from the laser chip 114, may be disposed in the stem of the light emitter.

All the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments, and the relevant points may be referred to the part of the description of the method embodiment. It is noted that other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims

1. An optical transmitter, comprising:

a header for carrying the device;

2. The optical transmitter of claim 1, wherein the first signal line transmission layer comprises a chip mounting region and a signal transmission region, wherein:

the width of a first side edge of the chip fixing area, which is connected with the signal transmission area, is larger than that of a second side edge of the second signal line transmission layer;

the third side edge, close to the avoidance notch, in the chip fixing area is of an arc-shaped structure and is smoothly connected with the first side edge and the second side edge.

3. The optical transmitter of claim 2, wherein a side of the signal transmission region near the top of the substrate is parallel to the top surface of the substrate.

4. The optical transmitter of claim 1, wherein a distance is provided between the light emitting surface of the laser chip and the bottom of the avoiding gap.

5. The light emitter of claim 1, wherein the avoidance notch is a circular arc shaped groove.

6. The optical transmitter according to claim 1 or 5, wherein the width of the avoidance gap gradually increases along the light emitting direction of the laser chip.

7. The light emitter of claim 1, wherein the substrate is secured to a post of the light emitter stem, and wherein a top of the substrate is flush with a top of the post.

8. A light module characterized in that it comprises a light emitter according to any one of claims 1 to 7.