CN214954233U

CN214954233U - Optical module

Info

Publication number: CN214954233U
Application number: CN202121170714.9U
Authority: CN
Inventors: 袁威; 王扩; 阎世奇
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-05-27
Filing date: 2021-05-27
Publication date: 2021-11-30
Anticipated expiration: 2031-05-27

Abstract

The application discloses optical module includes: and the TO tube seat is provided with a first sub-pin and a second sub-pin. The side platform is arranged on the surface of the TO tube seat and is vertically and fixedly connected with the TO tube seat; the metal coating ceramic substrate is arranged on one side of the side platform, and the surface of the metal coating ceramic substrate is provided with a first conducting strip and a second conducting strip which are not communicated with each other; the first sub pin is connected with the first conducting strip through a gold thread, and the second sub pin is connected with the second conducting strip through a gold thread; the first connecting piece is arranged on the surface of the TO tube seat and is close TO but not connected with the first sub-pin; and the second connecting piece is arranged on the surface of the TO tube seat and is close TO but not connected with the second sub-pin. The first connecting piece and the second connecting piece provide backflow for signals in the first sub-pin and the second sub-pin, the GND reference surface is drawn close, namely the backflow surface is drawn close, the backflow path is shortened, equivalent inductance is reduced, signal reflection is weakened, impedance adaptation is achieved, and high-frequency signal bandwidth is greatly improved.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

The optical module is mainly used for photoelectric and electro-optical conversion, an electric signal is converted into an optical signal by a transmitting end of the optical module and is transmitted out through an optical fiber, and a received optical signal is converted into an electric signal by a receiving end of the optical module. The current packaging form of the optical module mainly includes a TO (Transistor-out) package and a COB (Chip on Board) package.

The core devices of the optical module are two parts, namely a light emitting device and a light receiving device, which are respectively used for realizing the emission of optical signals and the reception of the optical signals. The light emitting device adopts coaxial TO encapsulation and comprises a TO tube seat and a TO tube cap covering the TO tube seat. The refrigerator is arranged on the surface of the TO tube seat. Photoelectric devices such as a laser, a photodiode and the like are placed on the surface of the refrigerator, and the photoelectric devices and the refrigerator are packaged in the sealed cavity by the TO tube seat and the TO tube cap.

With the market having higher demand for the speed of the optical network system, the speed of the optical transmitter and the optical receiver in the corresponding optical network system is also higher and higher, and the relatively higher cost of the optical module is a key problem of network bearing development, which also puts forward a requirement for reducing the cost of the industrial chain of the optical transceiver module.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to improve the bandwidth of high-frequency signals of the optical module.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, includes: the TO tube seat is provided with a first sub-pin and a second sub-pin; the first sub-pin and the second sub-pin penetrate through the TO tube seat and protrude out of the surface of the TO tube seat;

the side platform is arranged on the surface of the TO tube seat and is vertically and fixedly connected with the TO tube seat;

the metal coating ceramic substrate is arranged on one side of the side platform, and the surface of the metal coating ceramic substrate is provided with a first conducting strip and a second conducting strip which are not communicated with each other;

the first sub pin is connected with the first conducting strip through a gold thread, and the second sub pin is connected with the second conducting strip through a gold thread;

the first connecting piece is arranged on the surface of the TO tube seat, is close TO but not connected with the first sub-pin and provides a backflow path for signals in the first sub-pin;

and the second connecting piece is arranged on the surface of the TO tube seat, is close TO but not connected with the second sub-pin and provides a return path for signals in the second sub-pin. Compared with the prior art, the beneficial effect of this application is:

the application discloses optical module includes: the TO tube seat is provided with a first sub-pin and a second sub-pin; the first sub-pin and the second sub-pin penetrate through the TO tube seat and protrude out of the surface of the TO tube seat. The side platform is arranged on the surface of the TO tube seat and is vertically and fixedly connected with the TO tube seat; the metal coating ceramic substrate is arranged on one side of the side platform, and the surface of the metal coating ceramic substrate is provided with a first conducting strip and a second conducting strip which are not communicated with each other; the first sub pin is connected with the first conducting strip through a gold thread, and the second sub pin is connected with the second conducting strip through a gold thread; the first connecting piece is arranged on the surface of the TO tube seat, is close TO but not connected with the first sub-pin and provides a backflow path for signals in the first sub-pin; and the second connecting piece is arranged on the surface of the TO tube seat, is close TO but not connected with the second sub-pin and provides a return path for signals in the second sub-pin. The first connecting piece and the second connecting piece provide backflow for signals in the first sub-pin and the second sub-pin, the GND reference surface is drawn close, namely the backflow surface is drawn close, the backflow path is shortened, equivalent inductance is reduced, signal reflection is weakened, impedance adaptation is achieved, and high-frequency signal bandwidth is greatly improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

fig. 2 is a schematic structural diagram of an optical network terminal;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a light emitting device according to an embodiment of the present application;

fig. 6 is a schematic exploded view of a light emitting device according to an embodiment of the present disclosure;

fig. 7 is a schematic partial structure diagram of a light emitting device according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram illustrating a split structure of a light emitting device according to an embodiment of the present application;

fig. 9 is a partially broken away schematic view of a light emitting device according to an embodiment of the present disclosure;

fig. 10 is another schematic view of a light emitting device according to an embodiment of the present disclosure.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 via the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and an optical transceiver module.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity generally presents a square body. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper shell 201 on the lower shell 202.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect an optical transceiver module inside the optical module; the photoelectric devices such as the circuit board 300 and the optical transceiver module are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver module and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the module; the upper shell and the lower shell are made of metal materials generally, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component generally, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.

The unlocking component 203 is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.

The optical transceiver module includes two parts, namely an optical transmitter 400 and an optical receiver, which are respectively used for transmitting and receiving optical signals. The light emitting device generally comprises a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively positioned on different sides of the light emitter, light beams are respectively emitted from the front side and the back side of the light emitter, and the lens is used for converging the light beams emitted from the front side of the light emitter so that the light beams emitted from the light emitter are converging light to be conveniently coupled to an external optical fiber; the optical detector is used for receiving the light beam emitted by the reverse side of the optical emitter so as to detect the optical power of the optical emitter. Specifically, light emitted by the light emitter enters the optical fiber after being converged by the lens, and the light detector detects the light emitting power of the light emitter so as to ensure the constancy of the light emitting power of the light emitter.

Fig. 5 is a schematic structural diagram of a light emitting device according to an embodiment of the present application; fig. 6 is a schematic exploded view of a light emitting device according to an embodiment of the present application. Referring TO fig. 5 and 6, the light emitting device is a coaxial TO package, the light emitter is a laser 406, the light detector is a light detector 407, the optical device further includes a TO tube seat 402 and a TO tube cap 401 covering the TO tube seat 402, the photoelectric devices such as the laser 406 and the light detector 407 are disposed on the surface of the TO tube seat 402, the TO tube cap 401 has a light window for light TO pass through, and the photoelectric devices such as the laser 406 and the light detector 407 are packaged in a sealed cavity by the TO tube seat 402 and the TO tube cap 401.

In the embodiment of the present application, the lens is hermetically connected TO the TO cap 401 instead of the optical window. The lens material mainly includes glass, silicon, and plastic PEI (Polyetherimide). TO stem 402 materials include, but are not limited TO, tungsten copper, raft alloy, SPCC (Steel Plate Cold rolled Commercial), copper, and the like.

The TO header 402 has a plurality of pins 403, the pins 403 pass through the TO header 402 and protrude from the surface of the TO header 402, and the pins 403 are wrapped by glass TO insulate the pins 403 from the TO header 402. The optoelectronic device is sealed between the TO header 402 and the TO cap 401, which establishes electrical connection TO the outside by pins 403 passing through the TO header 402.

The refrigerator is generally adhered TO the TO socket 402 by silver paste for heat dissipation of the optoelectronic devices such as the laser 406. Namely, the photoelectric devices such as the laser 406 and the optical detector 407 are arranged on the refrigerator, and heat generated by the photoelectric devices such as the laser 406 and the optical detector 407 is transferred to the refrigerator for heat dissipation.

In order to facilitate the installation of the optoelectronic device, the optical module further includes a metal boss 404, and the optoelectronic devices such as a laser 406 and a photodetector 407 are disposed on the metal boss 404. The metal boss 404 includes a bottom platform 4041 and a side platform 4042 that are perpendicular to each other, and bottom platform 4041 and refrigerator fixed connection, side platform 4042 and metal-plated ceramic substrate 405 fixed connection. Heat generated by optoelectronic devices such as a laser 406 and a photodetector 407 is transmitted to the refrigerator through the metal boss 404, and the refrigerator 4021 is used for temperature control. Typically, the metal boss 404 is attached to the refrigerator by silver paste. The bottom platform 4041 carries the light detector 407.

The laser 406 comprises a laser chip and a laser ceramic heat sink, the laser chip is welded on the laser ceramic heat sink by using gold-tin solder, the laser ceramic heat sink is pasted on a side platform of the metal boss 404 by using silver colloid and is used for emitting signal beams, and the light emitting direction of the laser 406 is consistent with the light transmitting direction of the TO pipe cap 401. After the laser 406 is fixed on the side platform 4042 of the metal boss, the positive electrode and the negative electrode of the laser 406 need to be electrically connected with the corresponding pins 403 through gold wires, so that the positive electrode of the laser 406 and the negative electrode of the laser are electrically connected with the outside separately.

The optical detector 407 is attached TO the PD ceramic heat sink 4025 by silver glue, the PD ceramic heat sink 4025 is attached TO the TO tube seat 402 by glue, and then the optical detector 407 is electrically connected TO the corresponding pins 403 on the TO tube seat 402 by gold wire bonding TO realize the optical power monitoring function of the optical detector 407.

Fig. 7 is a partial structural schematic diagram of a light emitting device provided in an embodiment of the present application, and fig. 8 is a schematic diagram of a split structure of the light emitting device provided in the embodiment of the present application. Fig. 9 is a partially broken away schematic view of a light emitting device according to an embodiment of the present disclosure. Referring to fig. 7, 8 and 9, in the embodiments of the present application, the laser 406 is fixed to one side of the metal-coated ceramic substrate 405, and the laser 406 is generally fixedly connected to the metal-coated ceramic substrate 405 by silver paste. In order to realize the electrical connection of the optoelectronic device, a first conductive sheet 4051 and a second conductive sheet 4052 are disposed on the metal-coated ceramic substrate 405, wherein the laser 406 is attached to the first conductive sheet 4051, the first conductive sheet 4051 is electrically connected to the corresponding pin by a gold wire, the other electrode of the laser 406 is electrically connected to the second conductive sheet 4052 by a gold wire, and the first conductive sheet 4051 is electrically connected to the corresponding pin by a gold wire. In this embodiment, the first conductive sheet 4051 corresponds to a first sub-pin 4031, and the second conductive sheet 4052 corresponds to a second sub-pin 4032.

The first sub-pin 4031 and the second sub-pin 4032 penetrate through the TO stem 402, the first sub-pin 4031 is provided with a first bonding portion 40311, the second sub-pin 4032 is provided with a second bonding portion 40321, and the first bonding portion 40311 and the second bonding portion 40321 protrude out of the end face of the TO stem 402 and are located between the TO stem 402 and the TO cap 401.

In order to enhance the bonding connection capability between the gold wires and the pins, one side of the first bonding portion 40311 is a first bonding plane 40312, the first bonding plane 40312 is electrically connected to the first conductive sheet 4051 by the gold wires, one side of the second bonding portion 40321 is a second bonding plane 40322, and the second bonding plane 40322 is electrically connected to the first conductive sheet 4051 by the gold wires.

In the embodiment of the present application, the first bonding portion 40311 is an oblate structure with a symmetrical structure, and one end of the original circular pin is flattened during the machining process.

The first sub-pin 4031 and the second sub-pin 4032 are higher than the other sub-pins by the TO socket, so as TO reduce the length of the gold wire between the first bonding plane 40312 and the first conductive sheet 4051. The other sub-pins are non-high-speed signal sub-pins, and may be a ground pin, a power supply pin, a detector signal pin, and the like.

Further, in order to reduce the length of the gold wire between the first bonding plane 40312 and the first conductive sheet 4051, reduce impedance, and improve signal integrity, the surfaces of the first bonding plane 40312 and the first conductive sheet 4051 are located on the same horizontal plane, and the first bonding plane 40312 is as close to the first conductive sheet 4051 as possible. Similarly, the second bonding plane 40322 is located on the same horizontal plane as the surface of the second conductive sheet 4052, and the second bonding plane 40322 is as close to the second conductive sheet 4052 as possible.

Further, the projection of the first bonding plane 40312 on the first conductive sheet 4051 covers the height direction of the first conductive sheet 4051, and the projection of the second bonding plane 40322 on the second conductive sheet 4052 covers the height direction of the second conductive sheet 4052, so that the length of a gold wire between the first bonding plane 40312 and the first conductive sheet 4051 is reduced, the impedance is reduced, and the signal integrity is improved.

Further, in order to increase the number of gold wires connected between the first bonding plane 40312 and the first conductive sheet 4051 and the number of gold wires connected between the second bonding plane 40322 and the second conductive sheet 4052, the first conductive sheet 4051 covers the height direction of the metal-plated ceramic substrate 405, and the second conductive sheet 4052 covers the height direction of the metal-plated ceramic substrate 405, the length of the gold wires connected between the first bonding plane 40312 and the first conductive sheet 4051 and the length of the gold wires connected between the second bonding plane 40322 and the second conductive sheet 4052 are shortened.

The number of gold wires connected between the first bonding plane 40312 and the first conductive sheet 4051 is 4-12, preferably not less than 8. The parasitic capacitance effect of the laser chip and the substrate can be compensated by adjusting the number of the bonding gold wires and utilizing the parasitic inductance of the gold wires, so that the attenuation of high-frequency signals is reduced, and the bandwidth of the high-frequency signals is optimally improved. In the embodiment of the present invention, the height directions of the first conductive sheet 4051, the second conductive sheet 4052, and the metal-plated ceramic substrate 405 are perpendicular TO the plane direction of the TO stem 402 in the drawing.

Further, in the embodiment of the present application, the TO stem 402 is grounded. First connector 4043 and second connector 4044 are disposed on both sides of side platform 4042, wherein the material of first connector 4043 and second connector 4044 includes but is not limited to tungsten copper, raft alloy, SPCC (Steel Plate Cold rolled Commercial, Cold rolled carbon Steel), copper, etc.

Fig. 10 is another schematic view of a light emitting device according to an embodiment of the present disclosure. As shown in fig. 7 to 10, one end of the first connecting member 4043 is as close to the first sub-pin 4031 as possible, but is not electrically connected to the first sub-pin 4031, so as to provide a return current for the signal in the first sub-pin 4031, and draw the GND reference plane, that is, draw the return current plane, shorten the return current path, reduce the equivalent inductance, and weaken the signal reflection, so as to achieve impedance matching and greatly improve the bandwidth of the high-frequency signal.

The distance between one end of the first connecting piece 4043 and the first sub-pin 4031 is selected to be 50-300 um, and the distance is selected to be greater than or equal to 50 um so as to avoid the first connecting piece 4043 or the first sub-pin 4031 from being slightly deformed due to heating and the like, so that the first connecting piece 4043 and the first sub-pin 4031 are short-circuited to cause a fault. Preferably, the distance between the first connecting part 4043 and the first sub-pin 4031 is 150 μm or less.

One end of the second connecting piece 4044 is as close to the second sub-pin 4032 as possible, but is not electrically connected to the second sub-pin 4032, so as to provide a backflow for the signal in the second sub-pin 4032, and the GND reference surface, that is, the backflow surface, is pulled close, so that the backflow path is shortened, the equivalent inductance is reduced, and the signal reflection is weakened, so as to achieve impedance adaptation and greatly improve the bandwidth of the high-frequency signal.

The distance between one end of the second connecting member 4044 and the second sub-pin 4032 is selected to be 50-300 um, and the distance is selected to be greater than or equal to 50 um so as to avoid the second connecting member 4044 or the second sub-pin 4032 from being slightly deformed due to heating and the like, which causes short circuit between the second connecting member 4044 and the second sub-pin 4032 and causes failure. Preferably, the distance between the second connector 4044 and the second sub-pin 4032 is 150 μm or less.

Further, in the embodiment of the present application, to draw the reflow surface closer, shorten the reflow path, reduce the equivalent inductance, and weaken the signal reflection, the orthographic projection of the first connector 4043 on the first bonding plane 40312 covers the first bonding plane 40312 as much as possible. Similarly, to draw the return surface closer, shorten the return path, lower the equivalent inductance, and reduce signal reflection, the orthographic projection of the second connector 4044 on the second bonding plane 40322 covers the second bonding plane 40322 as much as possible.

The end surface of the first connecting piece 4043 near the first sub-pin 4031 may be configured to be a rectangular structure the same as the first bonding plane 40312, or may be configured to be a semicircular structure or a trapezoidal structure, and the specific configuration may be set according to the end surface of the first sub-pin 4031 near the first connecting piece 4043.

If the opposite side of the first bonding plane 40312 of the first sub-stub 4031 is rectangular in configuration, the end surface of the first connector 4043 adjacent to the first sub-stub 4031 may be configured in the same rectangular configuration as the opposite side of the first bonding plane 40312. If the opposite side of the first bonding plane 40312 of the first sub-stub 4031 is in the shape of a circular arc, the end surface of the first connecting member 4043 close to the first sub-stub 4031 may be configured to wrap the same circular arc-shaped structure on the opposite side of the first bonding plane 40312, and the first connecting member 4043 forms a half-enclosed configuration for the first sub-stub 4031.

In this embodiment, the bottom surface of the side platform 4042 is connected TO the TO header 402, and the first side surface is fixedly connected TO the metal-coated ceramic substrate 405, wherein the first side surface is the side adjacent TO the bottom surface. The second side is connected to the first connector 4043, the second side being opposite the first side.

In this embodiment, the side platform 4042 is a rectangular parallelepiped, and the distance that the side platform 4042 is higher than the TO header 402 does not affect the mounting of the lens TO the TO header 401.

The first connecting member 4043 has an "L" shaped structure, and includes a first reflow portion and a first connecting portion that are perpendicular to each other, where the first reflow portion is close to the first sub-pin 4031, and forms a half-enclosed shape for the first sub-pin 4031, and the first connecting portion is connected to the side platform 4042. Further, a second side of the side platform 4042 is provided with a connecting groove, which is connected to the first connecting portion.

In the embodiment of the present application, the first connecting element 4043 may be made of kovar alloy with a thermal expansion coefficient close to that of the heat dissipation pillar of the socket, or may be made of metal material such as copper, aluminum, or stainless steel, or other material with good electrical conductivity.

Further, the first connecting piece 4043 may be designed independently, and is bonded to the tube seat by laser welding, brazing or conductive silver paste, or may be stamped by a tube seat die to form a special integrated tube seat heat-dissipating stud; or may be integrally formed with the side platform 4042.

The second connecting member 4044 has an "L" shape, and includes a second return portion and a second connecting portion that are perpendicular to each other, in which the second return portion is close to the first sub-pin 4031, and forms a half-enclosed shape with respect to the first sub-pin 4031, and the first connecting portion is connected to the side surface platform 4042. Further, a second side of the side platform 4042 is provided with a connecting groove, which is connected to the first connecting portion.

Further, the second connecting part 4044 may be designed independently, and is bonded to the tube seat by laser welding, brazing or conductive silver paste, or may be stamped by a tube seat die to form a special integrated tube seat heat-dissipating stud; or may be integrally formed with the side platform 4042.

An embodiment of the present application provides an optical module, including: and the TO tube seat is provided with a first sub-tube foot 4031 and a second sub-tube foot 4032, and the first sub-tube foot 4031 and the second sub-tube foot 4032 penetrate through the TO tube seat and protrude out of the surface of the TO tube seat. And the side platform is arranged on the surface of the TO tube seat and is vertically and fixedly connected with the TO tube seat. The metal-plated ceramic substrate is disposed on one side of the side platform, and the metal-plated ceramic substrate 405 is disposed with a first conductive sheet 4051 and a second conductive sheet 4052, where the first conductive sheet 4051 and the second conductive sheet 4052 are not conducted with each other. The laser 406 is carried on the surface of the metal-coated ceramic substrate 405, and one electrode is electrically connected to the first conductive sheet 4051, and the other electrode is electrically connected to the second conductive sheet 4052. The first connector 4043 is provided on the surface of the TO stem 402 as close TO the first sub-stem 4031 as possible, but is not connected TO the first sub-stem 4031. The first connector 4043 is grounded. The second connecting part 4044 is provided on the surface of the TO stem 402 as close as possible TO the second sub-stem 4032, but is not connected TO the second sub-stem 4032. The second connector 4044 is grounded. The first connecting piece 4043 and the second connecting piece 4044 provide backflow for signals in the first sub-pin 4031 and the second sub-pin 4032, and the GND reference surface is pulled close, namely the backflow surface is pulled close, so that the backflow path is shortened, equivalent inductance is reduced, signal reflection is weakened, impedance adaptation is achieved, and the bandwidth of a high-frequency signal is greatly improved. The first sub-pin 4031 is connected to the first conductive sheet 4051 by a gold wire, the first conductive sheet 4051 covers the height direction of the metal-plated ceramic substrate, the second conductive sheet 4052 covers the height direction of the metal-plated ceramic substrate, the first sub-pin 4031 covers the height direction of the first conductive sheet 4051 in the shadow of the metal-plated ceramic substrate, and the second sub-pin 4032 covers the height direction of the second conductive sheet 4052 in the shadow of the metal-plated ceramic substrate. Or the top ends of the first sub-pin 4031 and the second sub-pin 4032 are flush with the top end of the metal-plated ceramic substrate, which is beneficial to increasing the number of the bonding alloy wires and shortening the length of the bonding alloy wires, reducing signal loss and improving the signal transmission efficiency of the optical module.

Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.

It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims

1. A light module, comprising: the TO tube seat is provided with a first sub-pin and a second sub-pin; the first sub-pin and the second sub-pin penetrate through the TO tube seat and protrude out of the surface of the TO tube seat;

the second connecting piece is arranged on the surface of the TO tube seat, is close TO but not connected with the second sub-pin and provides a backflow path for signals in the second sub-pin;

the TO tube seat is connected with a grounding circuit.

2. The optical module of claim 1, wherein the first and second sub-pins are higher than a non-high speed signal sub-pin by the TO socket.

3. The optical module of claim 2, wherein the first sub-pin comprises a first key configured TO protrude from a surface of the TO header;

the second sub-pin comprises a second bonding part which is arranged TO protrude out of the surface of the TO tube seat; and the first key part and the second key part are flat structures.

4. The optical module according to claim 3, wherein a first bonding plane is provided on one side of the first bonding portion, and the first bonding plane is electrically connected to the first conductive sheet by gold wire bonding;

a second bonding plane is arranged on one side of the second bonding part, and the second bonding plane is electrically connected with the second conducting strip through gold wire bonding; the first bonding plane and the second bonding plane are positioned in the same plane with the first conducting strip and the second conducting strip.

5. The optical module of claim 1, wherein the first connector is an "L" shaped structure, one end of which is connected to the side platform and the other end of which is close to the first sub-pin; the second connecting piece is of an L-shaped structure, one end of the second connecting piece is connected with the side platform, and the other end of the second connecting piece is close to the second sub-pin.

6. The optical module of claim 1, wherein the top ends of the first sub-pin and the second sub-pin are flush with the top end of the metal-coated ceramic substrate.

7. The optical module according to claim 1, wherein the distance between the first connector and the first sub-pin is 50-300 um; the second connecting piece with the distance between the second sub-pipe foot is 50 ~ 300 um.

8. The optical module of claim 1, wherein the first connector is close to an opposite side of the gold wire on the first sub-pin, and the second connector is close to an opposite side of the gold wire on the second sub-pin.

9. The optical module of claim 1, further comprising: and the laser is borne on one side of the side platform, one electrode is electrically connected with the first conducting strip, and the other electrode is electrically connected with the second conducting strip.

10. The optical module of claim 1, wherein a projection of the first connector on the first sub-pin covers the first sub-pin protruding from the TO header portion;

the projection of the second connecting piece on the second sub-pin covers the second sub-pin and protrudes out of the TO tube seat part.