CN214474114U - Optical module - Google Patents

Abstract

The application provides an optical module includes circuit board and emission time module, emission time module includes the cavity, be provided with heat sink in the cavity, laser assembly, collimating lens and TEC, wherein heat sink includes the substrate, high heat-conducting plate, low heat-conducting plate or heat-insulating shield, wherein, the TEC surface is provided with heat sink, the TEC upper surface contacts with the substrate bottom surface, laser assembly sets up on high heat-conducting plate, collimating lens sets up on low heat-conducting plate or heat-insulating shield, because laser assembly sets up on high heat-conducting plate, collimating lens sets up on low heat-conducting plate, when heating or refrigeration to laser assembly, the less or not change of collimating lens temperature variation range, the collimating lens receives the influence less promptly. Like this, the UV glue of pasting collimating lens takes place that deformation is less or even not takes place to deform, and then collimating lens takes place that the displacement is less or even not takes place to shift, can guarantee the stability of light path propagation direction finally, guarantees signal transmission's quality and luminous power.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

The optical communication technology can be applied to novel services and application modes such as cloud computing, mobile internet, video and the like. The optical module realizes the function of photoelectric conversion in the technical field of optical communication, is one of key devices in optical communication equipment, and the intensity of an optical signal input into an external optical fiber by the optical module directly influences the quality of optical fiber communication.

The light emitting part of the optical module is packaged in a micro-optical form, namely, light emitted by a laser chip enters air, devices such as a lens, an optical fiber adapter and the like are arranged on an optical path, the light emitted by the laser chip is coupled into the optical fiber adapter after passing through the lens, and the optical fiber adapter is connected with an optical fiber.

For an optical module with adjustable wavelength, a single chip can debug a plurality of channels to work, the working temperature range of a laser chip is large, for example, for a first wavelength, the working temperature of the laser chip is 30-40 ℃, for a second wavelength, the working temperature of the laser chip is 40-50 ℃, and the like, when the working temperature of the laser chip changes, the temperature of a lens nearby the laser chip can change along with the change, and the UV glue adhered to the lens can deform due to the temperature change, so that the lens generates displacement, and the propagation direction of an optical path is changed, and therefore, the instability of the direction of the optical path caused by the temperature change of the lens is a technical problem which needs to be solved all the time.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module to reduce the temperature variation amplitude of a lens and glue thereof and ensure the stability of an optical path.

In a first aspect, the present application provides an optical module, including:

a circuit board;

the optical transmitter sub-module is electrically connected with the circuit board and used for outputting optical signals;

the transmitter optical subassembly includes:

a cavity;

the heat sink is arranged in the cavity and comprises a substrate, a high heat conducting plate and a low heat conducting plate, the high heat conducting plate is arranged at one end of the surface of the substrate, the low heat conducting plate is arranged at the other end of the surface of the substrate, and a gap is formed between the high heat conducting plate and the low heat conducting plate;

the laser assembly is arranged on the surface of the high heat conduction plate and used for generating signal light;

the collimating lens is arranged on the surface of the low heat conducting plate, arranged on a transmission light path of the signal light and used for converging the signal light;

and the upper surface of the thermoelectric refrigerator is connected with the lower surface of the substrate and is used for adjusting the working temperature of the laser assembly.

In a second aspect, the present application provides an optical module, including:

a circuit board;

the optical transmitter sub-module is electrically connected with the circuit board and used for outputting optical signals;

the transmitter optical subassembly includes:

a cavity;

the heat sink is arranged in the cavity and comprises a substrate, a high heat conduction plate and a heat insulation plate, the high heat conduction plate is arranged at one end of the surface of the substrate, the heat insulation plate is arranged at the other end of the surface of the substrate, and a gap is formed between the high heat conduction plate and the heat insulation plate;

the laser assembly is arranged on the surface of the high heat conduction plate and used for generating signal light;

the collimating lens is arranged on the surface of the heat insulation plate, arranged on a transmission light path of the signal light and used for converging the signal light;

and the upper surface of the thermoelectric refrigerator is connected with the lower surface of the substrate and is used for adjusting the working temperature of the laser assembly.

Has the advantages that: the optical module comprises a circuit board and a light emission secondary module, wherein the light emission secondary module comprises a cavity, a heat sink, a laser assembly, a collimating lens and a TEC are arranged in the cavity, the heat sink comprises a substrate, a high heat-conducting plate, a low heat-conducting plate or a heat-insulating plate, the surface of the TEC is provided with the heat sink, the upper surface of the TEC is in contact with the bottom surface of the substrate, the laser assembly is arranged on the high heat-conducting plate, the collimating lens is arranged on the low heat-conducting plate, when the working temperature of the laser assembly needs to be increased, the laser assembly is heated through the TEC, the collimating lens is arranged on the high heat-conducting plate, the collimating lens is arranged on the low heat-conducting plate, and compared with the laser assembly, the heat transferred to the surface of the collimating lens is small and the transfer rate is slow, so that the variation amplitude of the surface temperature of the collimating lens is small in the same time period, and particularly the heating amplitude of the collimating lens is smaller than the heating amplitude of the laser assembly, the temperature change of the collimating lens is smaller than the temperature change of the laser assembly, even the surface temperature of the collimating lens remains unchanged, correspondingly, when the working temperature of the laser assembly needs to be reduced, the laser assembly is refrigerated through the TEC, as the laser assembly is arranged on the high heat conducting plate and the collimating lens is arranged on the low heat conducting plate, compared with the laser assembly, the heat quantity led out from the surface of the collimating lens is small, and the leading-out speed is slow, so that the surface temperature change amplitude of the collimating lens is small in the same time period, specifically, the refrigeration amplitude of the collimating lens is smaller than that of the laser assembly, the temperature change of the collimating lens is smaller than that of the laser assembly, even the surface temperature of the collimating lens remains unchanged.

Wherein the heat sink is a novel heat sink, and it is prepared by the heat conduction material of difference, and substrate and high heat-conducting plate are prepared by high heat conduction material, and low heat-conducting plate is prepared by low heat conduction material, and like this in the heat transfer process, laser subassembly and collimating lens receive the thermal influence different, and then temperature variation is different, then the temperature of these two regions of laser subassembly and collimating lens is different, therefore the heat sink that this application provided is a heat sink that has the temperature to distinguish.

Through the above, the laser assembly is arranged on the high heat-conducting plate, the collimating lens is arranged on the low heat-conducting plate, and when the laser assembly is heated or refrigerated, the temperature change amplitude of the collimating lens is small or even does not change, namely the collimating lens is less influenced. Like this, the UV glue of pasting collimating lens takes place that deformation is less or even not takes place to deform, and then collimating lens takes place that the displacement is less or even not takes place to shift, can guarantee the stability of light path propagation direction finally, guarantees signal transmission's quality and luminous power.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present application;

fig. 5 is a schematic diagram illustrating an overall structure of an tosa according to an embodiment of the present disclosure;

fig. 6 is an exploded schematic view of an tosa according to an embodiment of the present disclosure;

fig. 7 is a schematic view of various structures inside a cavity of an tosa according to an embodiment of the present disclosure;

fig. 8 is an exploded view of the internal structures of the cavity of the tosa according to the embodiment of the present disclosure;

fig. 9 is a partial schematic view of various structures inside a cavity of an tosa according to an embodiment of the present disclosure;

fig. 10 is a schematic perspective view of a heat sink according to an embodiment of the present disclosure;

fig. 11 is a schematic cross-sectional view of a heat sink according to an embodiment of the present disclosure;

fig. 12 is an exploded schematic view of a heat sink according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical communication is the interconversion of optical and electrical signals. Optical communication uses optical signals carrying information to transmit in information transmission equipment such as optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fiber/optical waveguide; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network unit 100 having the optical module 200.

The optical port of the optical module 200 is connected to the optical fiber 101, and establishes a bidirectional optical signal connection with the optical fiber. The electrical port of the optical module 200 is connected to the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit. The optical module realizes the interconversion between an optical signal and an electrical signal, thereby realizing the connection between the optical fiber 101 and the optical network unit 100.

Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber 101. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and in the photoelectric conversion process, the carrier of the information is converted between the light and the electricity, but the information itself is not changed.

The optical network unit 100 has an optical module interface 102 for accessing the optical module 200 and establishing a bidirectional electrical signal connection with the optical module 200. The optical network unit is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through an optical network unit. Specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit serves as an upper computer of the optical module to monitor the operation of the optical module.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device sequentially through the optical fiber 101, the optical module 200, the optical network unit 100, and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an Optical Line Terminal (OLT) and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electrical connector connected to the circuit board 105 is provided in the cage 106, and is used for connecting an electrical port of an optical module such as a gold finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into the optical network unit 100, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is located on the circuit board 105 of the optical network unit 100, and the electrical connectors on the circuit board 105 are wrapped in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.

Fig. 3 is an optical module structure schematic diagram provided by the embodiment of the present application, and fig. 4 is an optical module structure explosion schematic diagram provided by the embodiment of the present application, as shown in fig. 3 and fig. 4, an optical module 200 provided by the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, a tosa 400, a tosa 500, and an optical fiber adapter, where a transmitting optical fiber ribbon of the tosa 400 and a receiving optical fiber ribbon of the tosa 500 are both connected to the optical fiber adapter, and the optical fiber adapter is used for establishing optical connection between the transmitting optical fiber ribbon and the receiving optical fiber ribbon and external optical fiber.

The upper shell 201 and the lower shell 202 form a wrapping shell with two ports, specifically two ports (204, 205) in the same direction, or two ports in different directions; one of the ports is an electrical port 204 which is used for being inserted into an upper computer such as an optical network unit; the other port is an optical port 205 for connecting an external optical fiber 101; the optoelectronic devices such as the circuit board 300, the transmitter sub-module 400 and the receiver sub-module 500 are disposed in the packaging housing formed by the upper and lower housings.

The upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that adopts upper housing, casing combination down is convenient for install devices such as circuit board in the casing, generally can not make the casing of optical module structure as an organic whole, like this when devices such as assembly circuit board, locating part, heat dissipation and electromagnetic shield structure are not convenient for install, are unfavorable for production automation.

The unlocking handle 203 is positioned on the outer wall of the wrapping shell/lower shell 202, and the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; when the optical module is inserted into the upper computer, the cage 106 is clamped by the unlocking handle 203, so that the optical module is fixed in the upper computer; by pulling the unlocking handle, the engagement between the optical module 200 and the cage 106 is released, and the optical module can be pulled out from the upper computer.

The circuit board 300 is located in a casing formed by the upper casing and the casing, the circuit board 300 is electrically connected with the transmitter sub-module 400 and the receiver sub-module 500 respectively, and the circuit board is provided with chips, capacitors, resistors and other electric devices. The method comprises the following steps of selecting corresponding chips according to the requirements of products, wherein common chips comprise a microprocessor MCU, a clock data recovery chip CDR, a laser driving chip, a transimpedance amplifier TIA chip, a limiting amplifier LA chip, a power management chip and the like. The transimpedance amplifier is closely associated with the optical detection chip, and the transimpedance amplifier and the optical detection chip can be packaged together by a part of products, such as in the same TO (TO optical) tube shell or the same shell; the optical detection chip and the transimpedance amplifier can be separately packaged, and the transimpedance amplifier is arranged on the circuit board.

The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driver chip and an MCU chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is an integrated circuit, but the functions of the circuits do not disappear due to the integration, and only the circuit appears and changes, and the chip still has the circuit form. Therefore, when the circuit board is provided with three independent chips, namely, the MCU, the laser driver chip and the limiting amplifier chip, the scheme is equivalent to that when the circuit board 300 is provided with a single chip with three functions in one.

The surface of the end part of the circuit board 300 is provided with a golden finger, the golden finger consists of one pin which is mutually independent, the circuit board is inserted into an electric connector in the cage, and the golden finger is in conductive connection with a clamping elastic sheet in the electric connector; the golden fingers can be arranged on the surface of one side of the circuit board, and the golden fingers are generally arranged on the upper surface and the lower surface of the circuit board in consideration of the large requirement on the number of pins; the golden finger is used for establishing electrical connection with the upper computer, and the specific electrical connection can be power supply, grounding, I2C signals, communication data signals and the like.

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

The overall structure of the light emitting portion of the optical module of the present application will be described with reference to fig. 5 to 9.

Fig. 5 is a schematic diagram illustrating an overall structure of an tosa according to an embodiment of the present disclosure; fig. 6 is an exploded schematic view of an tosa according to an embodiment of the present disclosure; fig. 7 is a schematic view of various structures inside a cavity of an tosa according to an embodiment of the present disclosure; fig. 8 is an exploded view of the internal structures of the cavity of the tosa according to the embodiment of the present disclosure; fig. 9 is a partial schematic view of the internal structures of the cavity of the tosa according to the embodiment of the present disclosure.

As shown in fig. 5-9, the tosa 400 includes a cover plate 401, a cavity 402, a laser assembly 405, a collimating lens 406, a heat sink 407, and a TEC (Thermoelectric Cooler) 408, and specifically, the laser assembly 405, the collimating lens 406, the heat sink 407, and the TEC408 are all disposed in the cavity 402.

In the signal transmission process, after receiving the electrical signal transmitted from the circuit board 300, the optical transmitter in the cavity 402 converts the electrical signal into an optical signal, and then the optical signal enters the optical fiber adapter and is transmitted to the outside of the optical module.

The transmitter optical subassembly module is provided with a packaging structure for packaging laser chips and the like, and the existing packaging structure comprises a coaxial packaging TO-CAN, a silicon optical packaging, a chip-on-board LENS assembly packaging COB-LENS and a micro-optical XMD packaging. The package is further divided into hermetic package and non-hermetic package, which provides a stable and reliable working environment for the laser chip on one hand and forms external electrical connection and optical output on the other hand.

According to product design and process, the optical module can adopt different packages to manufacture the transmitter optical subassembly. The laser chip has vertical cavity surface light emitting and edge light emitting, and the different light emitting directions of the laser chip can influence the selection of the packaging form. The various packages have obvious technical differences, whether they are different from the structure or from the process, and those skilled in the art know that although different packages achieve the same purpose, different packages belong to different technical routes, and different packaging technologies do not give technical suggestions to each other.

The application discloses light emission part adopts the encapsulation of little optics form, and during the light that the optical chip sent got into the air promptly, set up devices such as lens, fiber adapter on optical path, couple to fiber adapter behind the light that sends the optical chip behind the lens, fiber adapter and fiber connection.

As shown in fig. 5 and 6, the tosa 400 includes a cover plate 401 and a cavity 402, and the cover plate 401 and the cavity 402 are connected in a covering manner.

The cover plate 401 covers the cavity 402 from above.

One side wall of the cavity 402 has an opening 403 for insertion of the circuit board 300 and the other side wall of the cavity 402 has a through hole 404 for insertion of a fiber optic adapter. Specifically, the circuit board 300 extends into the cavity 402 through the opening 403, and the circuit board 300 is fixed with the lower housing 202; the circuit board 300 is plated with metal traces, and the optical device can be electrically connected to the corresponding metal traces by wire bonding, so as to electrically connect the optical device in the cavity 402 to the circuit board 300. The signal light emitted by the light emitting device is emitted into the through hole 404, the optical fiber adapter extends into the through hole 404 to be coupled and received with the signal light, the assembling structure design can enable the optical fiber adapter to move back and forth in the through hole 404, the required size of the optical fiber between the light emitting sub-module and the optical fiber plug can be adjusted, and when the optical fiber is short, the optical fiber adapter can move backwards (towards the outer direction of the cavity) in the through hole to meet the requirement of the connecting size; when the optical fiber is longer, the optical fiber adapter can be moved forwards (towards the inner direction of the cavity) in the through hole so as to straighten the optical fiber and avoid bending the optical fiber. The fiber optic adapters are inserted into the through holes 404 to achieve fixation with the tosa 400; during assembly, the fiber optic adapter may be moved within the through-hole 404 to select a fixed position.

As shown in fig. 7 and 8, a laser assembly 405, a collimating lens 406, a heat sink 407, and a TEC408 are sequentially disposed from the top to the bottom of the cavity, wherein the structures are sequentially connected in a contact manner from top to bottom, the laser assembly 405 and the collimating lens 406 are in the same optical path transmission direction, the laser assembly 405 and the collimating lens 406 are disposed on the upper surface of the heat sink 407, and the lower surface of the heat sink 407 is in contact with the upper surface of the TEC 408. I.e., heat sink 407 supports and carries heat sink 407, and heat sink 407 supports and carries laser assembly 405 and collimating lens 406.

The laser assembly 405 includes a laser chip 4051 and a chip substrate 4052, specifically as shown in fig. 9, the chip substrate 4052 supports and carries the laser chip 4051.

The laser chip 4051 is a commonly used light emitting chip, and becomes a preferred light source for optical module and even optical fiber transmission with better single-wavelength characteristic and better wavelength tuning characteristic; even if a special optical communication system adopts the light source, the characteristics and chip structure of the light source are greatly different from those of laser, so that the optical module adopting laser and the optical module adopting other light sources have great technical difference, and a person skilled in the art generally does not consider that the two types of optical modules can give technical inspiration to each other.

The chip substrate 4052 supports and bears the laser chip 4051, the surface of the chip substrate 4052 forms a circuit pattern which can supply power to the laser chip 4051, and meanwhile, the chip substrate 4052 has better heat-conducting property and can transfer heat to the laser chip 4051; the material of the chip substrate 4052 includes, but is not limited to, tungsten copper, raft alloy, SPCC (Steel Plate Cold rolled Commercial, Cold rolled carbon Steel), copper, etc., which facilitates transferring heat generated by the optoelectronic device to the heat sink 407 and the TEC408 for heat dissipation.

The collimating lens 406 mainly functions to converge light, and the light emitted from the laser chip 4051 is in a divergent state, so that the light needs to be converged for facilitating subsequent optical path design and optical coupling into an optical fiber; the common convergence is to converge the divergent light into the parallel light, so the collimating lens 406 is disposed on the light-emitting path of the laser chip 4051, and further converges the divergent light emitted from the laser chip 4051 into the parallel light. Accordingly, the chip substrate 4052 may be a single-layer substrate or a double-layer substrate, and the thickness thereof is sufficient to keep the center line of the optical path emitted from the laser chip 4051 coincident with the axis of the collimator lens 406.

A plurality of parallel lights emitted by the collimating lens 406 are combined into a light beam by a light multiplexing component (not shown in the figure), wherein the light beam comprises lights with different wavelengths, and the light beam enters the optical fiber adapter through the through hole 404 on the side wall of the cavity 402; a focusing lens can be arranged between the through hole 404 and the optical multiplexing component, light is converged by the focusing lens so as to be convenient for subsequent light coupling, and the optical fiber adapter extends into the through hole 404 to couple and receive the light from the optical multiplexing component; the light received by the optical fiber adapter is transmitted to the outside of the optical module through the optical fiber.

The quantity of collimating lens 406 is unanimous with laser assembly 405's quantity, if set up 4 laser assembly, then, 4 laser assembly include 4 laser chip, 4 laser chip send 4 different wavelength's light, realize promoting data transmission capacity through increasing light path quantity like this, then corresponding have 4 collimating lens to be located corresponding laser chip's light-emitting direction for the divergent light that sends 4 laser chip assembles 4 way parallel light, then through the optical multiplexing subassembly 4 way parallel light amalgamation for 1 way light.

The heat sink 407 is used for supporting and carrying the laser component 405 and the collimating lens 406, specifically, the laser component 405 is adhered to one end of the surface of the heat sink 407 through a conductive silver paste, and the collimating lens 406 is adhered to the other end of the surface of the heat sink 407 through a UV glue; the heat sink 407 in the present application has a specific structure as shown in fig. 10, 11, and 12. For the wavelength-adjustable optical module, a single chip can debug a plurality of channels to work, the working temperature range of the laser chip is large, for example, for a first wavelength, the working temperature of the laser chip is 30-40 ℃, for a second wavelength, the working temperature of the laser chip is 40-50 ℃, and the like, when the working temperature of the laser chip changes, the temperature of the collimating lens 406 can change along with the change, but because the UV glue used for pasting the collimating lens 406 is sensitive to the temperature change, when the temperature of the collimating lens 406 changes, the UV glue can deform, so that the collimating lens 406 is displaced, and further, the transmission direction of an optical path is changed. The heat sink 407 provided in the present application is a novel heat sink, which includes a substrate 4071, a high thermal conductive plate 4072 and a low thermal conductive plate 4073, wherein the low thermal conductive plate may also be an insulating plate, and a gap 4074 is provided between the high thermal conductive plate 4072 and the low thermal conductive plate 4073. In the embodiment of the present application, the thicknesses of the substrate 4071, the high thermal conductive plate 4072, and the low thermal conductive plate 4073 may be the same, and the specific thickness value may be adjusted according to the optical design, and may be 0.1 mm; the gap distance between the high thermal conductive plate 4072 and the low thermal conductive plate 4073 can be adjusted according to the optical design, and can be 0.1 mm; the substrate is a ceramic substrate, the high heat conduction plate is a ceramic heat conduction plate, and the low heat conduction plate is a non-ceramic heat conduction plate, namely, the substrate and the high heat conduction plate are high heat conduction materials such as aluminum nitride ceramics, the low heat conduction plate is a low heat conduction material or a heat insulation material, and the non-ceramic low heat conduction material or the heat insulation material can be selected.

It should be noted that, the specific shape of the heat sink is not limited in the present application, and the heat sink that is made of different heat conduction materials and can support the laser assembly and the collimating lens is within the protection scope of the present application.

The high thermal conductive plate 4072 is fabricated from a high thermal conductive material, such as aluminum nitride; the low heat conducting plate 4073 is formed by processing low heat conducting materials, and when the low heat conducting plate is an insulating plate, the low heat conducting plate is formed by processing insulating materials, and for convenience of description, the embodiments of the present application are described in a unified manner as follows: the low heat-conducting plate 4073 is processed by low heat-conducting material or heat-insulating material, set up the laser subassembly 405 on the surface of high heat-conducting plate 4072, collimating lens 406 sets up on the surface of low heat-conducting plate 4073, like this when to the heat transfer of laser subassembly 405 or derive the heat from laser subassembly 405, because collimating lens 406 sets up on the low heat-conducting plate, in the heat transfer process, collimating lens 406 receives the influence less, therefore collimating lens 406's temperature variation range is less, thereby UV glue temperature variation is less, collimating lens 406's displacement change is less, thereby the light path transmission direction is more stable. And due to the gap 4074, the laser assembly 405 and the collimating lens 406 have a spacing therebetween that increases the distance that heat on the laser assembly 405 can transfer to the surface of the collimating lens 406, and decreases the temperature of the collimating lens 406 from the laser assembly 405.

The heat sink 407 is made of different heat conduction materials, the substrate 4071 and the high heat conduction plate 4072 are made of high heat conduction materials, and the low heat conduction plate 4073 is made of low heat conduction materials, so that in the heat transfer process, the laser component 405 and the collimating lens 406 are affected by different heat, and further the temperature change is different, the temperatures of the two areas of the laser component 405 and the collimating lens 406 are different, and therefore the heat sink 407 provided by the application is a heat sink with temperature differentiation.

And the gap 4074 can play a role in collecting glue for adhering the laser component and the collimating lens, so that the glue is prevented from polluting the laser chip and the lens, and the quality of light path transmission is ensured.

The heat sink 407 has a particularly obvious effect on the wavelength-tunable optical module, the working temperature of the laser component 405 needs to be adjusted by cooling or heating, when the working temperature of the laser component needs to be raised, the laser component 405 is heated by the TEC408, because the laser component 405 is disposed on the high thermal conductive plate 4072 and the collimating lens 406 is disposed on the low thermal conductive plate 4073, the amount of heat transferred to the surface of the collimating lens 406 is small and the transfer rate is slow compared with the laser component 405, so that the amplitude of change in the surface temperature of the collimating lens 406 is small in the same time period, specifically, the amplitude of temperature rise of the collimating lens 406 is smaller than the amplitude of temperature rise of the laser component 405, the temperature change of the collimating lens 406 is smaller than the temperature change of the laser component 405, even the surface temperature of the collimating lens 406 remains unchanged, accordingly, when the working temperature of the laser component 405 needs to be lowered, the laser component 405 is cooled by the TEC408, because the laser component 405 is disposed on the high thermal conductive plate 4072, the collimating lens 406 is arranged on the low heat conducting plate 4073, the heat quantity led out from the surface of the collimating lens 406 is small and the leading-out speed is slow compared with the laser component 405, so that the temperature change amplitude of the surface of the collimating lens 406 is small in the same time period, specifically, the refrigeration amplitude of the collimating lens 406 is smaller than that of the laser component 405, the temperature change of the collimating lens 406 is smaller than that of the laser component 405, and even the temperature of the surface of the collimating lens 406 is kept unchanged.

Specifically, when the laser component needs to be heated, heat is transferred to the surface of the high heat conducting plate 4072 through the substrate 4071 made of the high heat conducting material, so that the temperature of the laser component is controlled within a target range; when the laser module needs to be cooled down, heat is conducted out to the optical module shell through the high heat conducting plate 4072, the substrate 4071 and the TEC 408. Based on this, the material for preparing the substrate 4071 is also highly thermally conductive.

By arranging the laser component 405 on the high thermal conductive plate 4072 and the collimating lens 406 on the low thermal conductive plate 4073, when the laser component 405 is heated or cooled, the temperature change amplitude of the collimating lens 406 is small or even does not change, i.e., the collimating lens 406 is less affected. Like this, the UV glue of pasting collimating lens 406 takes place deformation less or even not takes place deformation, and then collimating lens 406 takes place the displacement less or even not takes place the displacement, can guarantee the stability of light path propagation direction finally, guarantees signal transmission's quality and optical power.

TEC408 is used for adjusting the operating temperature range of laser subassembly 405, specifically, the transmitter optical subassembly 400 of this application still includes thermistor, and thermistor sets up in cavity 402 for the operating temperature who gathers the laser instrument and then realize the monitoring to laser chip 4051 operating temperature. Specifically, the temperature of the laser is collected in real time through the thermistor, and the collected temperature of the laser is fed back to the driving circuit of the thermoelectric refrigerator, the driving circuit of the thermoelectric refrigerator determines to input heating or refrigerating current into the TEC408 according to the received temperature of the laser, so as to heat or refrigerate the laser, and thus the temperature of the laser chip can be controlled within a target temperature range.

The TEC408 is used to transfer heat to or from the laser chip. Specifically, TEC408 includes an upper heat exchange surface, a structural member, and a lower heat exchange surface. The upper heat exchange surface is used for absorbing heat generated by the laser chip or transferring the heat to the laser chip. Go up the bottom of heat exchange surface and be connected with the structure, the structure is fixed on heat exchange surface down, and the structure is used for going up the absorptive heat transfer of heat exchange surface to down on the heat exchange surface, still is used for passing heat to the heat exchange surface through last heat exchange surface, and then realizes the regulation to laser chip temperature. In this embodiment, the TEC408 further includes an anode and a cathode, and the anode and the cathode are respectively connected to the circuit board by wire bonding, so as to implement power supply of the TEC and transmission of signals.

When the working temperature of the laser component needs to be raised, the laser component 405 is heated through the TEC408, because the laser component 405 is arranged on the high heat conducting plate 4072, the collimating lens 406 is arranged on the low heat conducting plate 4073, the heat transferred to the surface of the collimating lens 406 is small and the transfer rate is slow relative to the laser component 405, so that the change amplitude of the surface temperature of the collimating lens 406 is small in the same time period, specifically, the temperature rise amplitude of the collimating lens 406 is smaller than that of the laser component 405, the temperature change of the collimating lens 406 is smaller than that of the laser component 405, even the surface temperature of the collimating lens 406 is kept unchanged, correspondingly, when the working temperature of the laser component 405 needs to be lowered, the laser component 405 is cooled through the TEC408, because the laser component 405 is arranged on the high heat conducting plate 4072, the collimating lens 406 is arranged on the low heat conducting plate 4073, the heat conducted from the surface of the collimating lens 406 is small and the conduction rate is slow relative to the laser component 405, therefore, the change amplitude of the surface temperature of the collimating lens 406 is small in the same time period, specifically, the refrigeration amplitude of the collimating lens 406 is smaller than that of the laser assembly 405, the temperature change of the collimating lens 406 is smaller than that of the laser assembly 405, and even the surface temperature of the collimating lens 406 is kept unchanged.

The optical module comprises a circuit board and a light emission secondary module, wherein the light emission secondary module comprises a cavity, a heat sink, a laser assembly, a collimating lens and a TEC are arranged in the cavity, the heat sink comprises a substrate, a high heat-conducting plate, a low heat-conducting plate or a heat-insulating plate, the surface of the TEC is provided with the heat sink, the upper surface of the TEC is in contact with the bottom surface of the substrate, the laser assembly is arranged on the high heat-conducting plate, the collimating lens is arranged on the low heat-conducting plate, when the working temperature of the laser assembly needs to be increased, the laser assembly is heated through the TEC, the collimating lens is arranged on the high heat-conducting plate, the collimating lens is arranged on the low heat-conducting plate, and compared with the laser assembly, the heat transferred to the surface of the collimating lens is small and the transfer rate is slow, so that the variation amplitude of the surface temperature of the collimating lens is small in the same time period, and particularly the heating amplitude of the collimating lens is smaller than the heating amplitude of the laser assembly, the temperature change of the collimating lens is smaller than the temperature change of the laser assembly, even the surface temperature of the collimating lens remains unchanged, correspondingly, when the working temperature of the laser assembly needs to be reduced, the laser assembly is refrigerated through the TEC, as the laser assembly is arranged on the high heat conducting plate and the collimating lens is arranged on the low heat conducting plate, compared with the laser assembly, the heat quantity led out from the surface of the collimating lens is small, and the leading-out speed is slow, so that the surface temperature change amplitude of the collimating lens is small in the same time period, specifically, the refrigeration amplitude of the collimating lens is smaller than that of the laser assembly, the temperature change of the collimating lens is smaller than that of the laser assembly, even the surface temperature of the collimating lens remains unchanged.

Through the above, the laser assembly is arranged on the high heat-conducting plate, the collimating lens is arranged on the low heat-conducting plate, and when the laser assembly is heated or refrigerated, the temperature change amplitude of the collimating lens is small or even does not change, namely the collimating lens is less influenced. Like this, the UV glue of pasting collimating lens takes place that deformation is less or even not takes place to deform, and then collimating lens takes place that the displacement is less or even not takes place to shift, can guarantee the stability of light path propagation direction finally, guarantees signal transmission's quality and luminous power.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (8)

1. A light module, comprising:

a circuit board;

the optical transmitter sub-module is electrically connected with the circuit board and used for outputting optical signals;

the transmitter optical subassembly includes:

a cavity;

the heat sink is arranged in the cavity and comprises a substrate, a high heat conducting plate and a low heat conducting plate, the high heat conducting plate is arranged at one end of the surface of the substrate, the low heat conducting plate is arranged at the other end of the surface of the substrate, and a gap is formed between the high heat conducting plate and the low heat conducting plate;

the laser assembly is arranged on the surface of the high heat conduction plate and used for generating signal light;

the collimating lens is arranged on the surface of the low heat conducting plate, arranged on a transmission light path of the signal light and used for converging the signal light;

and the upper surface of the thermoelectric refrigerator is connected with the lower surface of the substrate and is used for adjusting the working temperature of the laser assembly.

2. The optical module of claim 1, wherein the substrate is a highly thermally conductive substrate.

3. The optical module of claim 2, wherein the substrate is a ceramic substrate, the high thermal conductive plate is a ceramic thermal conductive plate, and the low thermal conductive plate is a non-ceramic thermal conductive plate.

4. The light module of claim 1, wherein the laser assembly axis is on a same horizontal line as the collimating lens axis.

5. The optical module of claim 1, wherein one end of the cavity is provided with an opening for insertion of the circuit board;

the other end of the cavity is provided with a through hole, the through hole is used for inserting an optical fiber adapter, and the optical fiber adapter is used for receiving signal light from the collimating lens.

6. The optical module of claim 1, wherein the laser assembly is connected to the high thermal conductive plate by a conductive silver paste, and the collimating lens is connected to the low thermal conductive plate by a UV paste.

7. The optical module of claim 1, wherein the laser assembly comprises a laser chip and a chip substrate, and the laser chip is adhered to a surface of the chip substrate.

8. A light module, comprising:

a circuit board;

the optical transmitter sub-module is electrically connected with the circuit board and used for outputting optical signals;

the transmitter optical subassembly includes:

a cavity;

the heat sink is arranged in the cavity and comprises a substrate, a high heat conduction plate and a heat insulation plate, the high heat conduction plate is arranged at one end of the surface of the substrate, the heat insulation plate is arranged at the other end of the surface of the substrate, and a gap is formed between the high heat conduction plate and the heat insulation plate;

the laser assembly is arranged on the surface of the high heat conduction plate and used for generating signal light;

the collimating lens is arranged on the surface of the heat insulation plate, arranged on a transmission light path of the signal light and used for converging the signal light;

and the upper surface of the thermoelectric refrigerator is connected with the lower surface of the substrate and is used for adjusting the working temperature of the laser assembly.

Images