CN210775926U

CN210775926U - Light emitter and optical module

Info

Publication number: CN210775926U
Application number: CN201921607886.0U
Authority: CN
Inventors: 孙飞龙; 周小军; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-09-25
Filing date: 2019-09-25
Publication date: 2020-06-16
Anticipated expiration: 2029-09-25

Abstract

The application provides a light emitter and optical module, be equipped with laser chip, first metal wire, second metal wire, tube socket at the light emitter, fix base plate on the tube socket is equipped with the signal line transmission layer on the base plate. The laser chip is connected with a signal line transmission layer corresponding to the anode of the laser chip through two or more metal wires, only one metal wire is directly welded on a bonding pad of the laser chip, the area of a welding spot formed by the metal wire on the bonding pad is larger than one half of the area of the bonding pad, and the rest metal wires are welded in a mode that the upper metal wires are welded on the metal wire at the bottom of the metal wire. Therefore, on the premise of not increasing the area of the bonding pad of the laser chip, the number of the metal wires is increased, and compared with a single metal wire, the total diameter of the metal wire can be increased, so that the inductance generated in the working process of the optical module can be reduced, and the high-speed photoelectric performance of the optical module can be improved.

Description

Light emitter and optical module

Technical Field

The present application relates to the field of optical communication technologies, and in particular, to an optical transmitter and an optical module.

Background

An optical transceiver module, called optical module for short, is a standard module in the field of optical communication. A standard optical module generally includes an tosa, an rosa, a microprocessor, etc., and in some optical modules, the tosa and the rosa are packaged together in a metal housing to form a bi-directional optical sub-module, which is also called an rosa.

Compared with other packaging technologies, the TO (Through-hole) -based packaging technology has the advantages of small parasitic parameters, low process cost and the like, so that the optical transmitter in the tosa usually adopts a coaxial TO packaging mode. Specifically, in the light emitter, the light emitter is mainly composed of a base and a cap. The laser chip comprises a base, a stand column, a ceramic substrate, a signal transmission layer, a back electrode, a front electrode and a back electrode, wherein the stand column of the base is pasted with the ceramic substrate, the surface of the ceramic substrate is plated with the signal transmission layer, the back electrode of the laser chip is pasted on one signal line transmission layer through a welding material, and the front electrode is connected to the other signal line transmission layer through a metal conducting wire welded on the laser chip. Because the volume of the existing laser chip is small, the area of a corresponding bonding pad for welding a metal wire in the front electrode is also very small, and only one ball welding point, namely only one metal wire can be welded on the bonding pad.

However, considering the control of the size of the metal ball pad, the metal wire is usually set to be thinner, that is, the diameter is smaller, and then the parasitic inductance introduced by the metal wire is larger, and along with the improvement of the communication rate of the optical module, the parasitic inductance introduced by the metal wire is also continuously increased, and then the influence of the parasitic inductance on the high-speed photoelectric performance of the optical module is more and more obvious.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a light emitter and an optical module, so that parasitic inductance generated by a metal wire welded on a laser chip in the working process of the optical module is reduced, and the high-speed photoelectric performance of the optical module is improved.

According to a first aspect of embodiments of the present application, there is provided an optical transmitter comprising:

a header for carrying the device;

a substrate carried by the socket and having a first signal line transmission layer and a second signal line transmission layer formed of a metal material on a surface thereof;

the cathode of the bottom surface of the laser chip is arranged on the surface of the first signal line transmission layer to realize electric connection, and the anode of the top surface of the laser chip forms a bonding pad;

one end of the first metal wire is welded on the bonding pad, the other end of the first metal wire is welded on the surface of the transmission layer of the second signal wire, and the area of a welding spot formed by the first metal wire on the bonding pad is larger than one half of the area of the bonding pad;

one end of the second metal wire is welded on one end of the first metal wire, and the other end of the second metal wire is welded on the surface of the transmission layer of the second signal wire;

and the anode is electrically connected with the second signal line transmission layer through the first metal wire and the second metal wire.

According to a second aspect of the embodiments of the present application, there is provided an optical module, in which the optical transmitter provided in the first aspect of the embodiments of the present application is provided.

According to the optical transmitter and the optical module provided by the embodiment of the application, in the optical transmitter, when the laser chip is connected with the signal line transmission layer corresponding to the anode of the laser chip, two or more metal wires are welded, only one metal wire is directly welded on the bonding pad of the laser chip, the area of the welding point formed by the metal wire on the bonding pad is larger than one half of the area of the bonding pad, the rest metal wires are welded in a mode that the metal wires above the bonding pad are welded on the metal wire at the bottom of the bonding pad, and therefore only one welding point is formed on the bonding pad of the laser chip by the metal wires. Therefore, the optical transmitter provided by the application can increase the number of the metal wires on the premise of not increasing the area of the bonding pad of the laser chip, and compared with a single metal wire, the total diameter of the metal wire can be increased, so that the inductance generated in the working process of the optical module can be reduced, and the high-speed photoelectric performance of the optical module can be improved.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;

fig. 4 is an exploded structural schematic diagram of an optical module provided in an embodiment of the present application;

fig. 5 is a schematic structural diagram of an optical transceiver sub-assembly provided in an embodiment of the present application;

fig. 6 is an exploded schematic view of an tosa provided in an embodiment of the present application;

fig. 7 is a schematic diagram of a first structure of a light emitter provided in an embodiment of the present application;

fig. 8 is a schematic diagram of a second structure of a light emitter provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without any creative effort belong to the protection scope of the present invention.

One of the core elements of fiber optic communications is the conversion of optical to electrical signals. The optical fiber communication uses the optical signal carrying information to transmit in the optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fiber. The information processing devices such as computers use electrical signals, which require the interconversion between electrical signals and optical signals during the signal transmission process.

The optical module realizes the photoelectric conversion function in the technical field of optical fiber communication, and the interconversion of optical signals and electric signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on a circuit board, main electrical connections comprise power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the golden finger becomes a standard mode of the optical module industry, and on the basis, the circuit board is a necessary technical characteristic in most optical modules.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber is connected with the far-end server, one end of the network cable is connected with the local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber and the network cable; and the connection between the optical fiber and the network cable is completed by an optical network unit with an optical module.

An optical port of the optical module 200 is connected with the optical fiber 101 and establishes bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.

The optical network unit is provided with an optical module interface 102, which is used for accessing an optical module and establishing bidirectional electric signal connection with the optical module; the optical network unit is provided with a network cable interface 104 for accessing a network cable and establishing bidirectional electric signal connection with the network cable; the optical module is connected with the network cable through the optical network unit, specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit is used as an upper computer of the optical module to monitor the work of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network unit and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected with the optical fiber 101.

The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present application, and fig. 4 is an exploded structural diagram of the optical module 200 according to an embodiment of the present invention. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an optical transceiver sub-assembly 205, and further includes an upper housing 201, a lower housing 202, an unlocking handle 203, and a circuit board 204.

The upper shell 201 and the lower shell 202 form a wrapping cavity with two openings, specifically, two ends of the wrapping cavity are opened (206, 207) in the same direction, or two openings in different directions are opened; one of the openings is an electrical port 206 for inserting into an upper computer such as an optical network unit, the other opening is an optical port 207 for accessing an external optical fiber to connect an internal optical fiber, and the photoelectric devices such as the circuit board 204 are positioned in the packaging cavity.

The upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realizing electromagnetic shielding and heat dissipation; the assembly mode that upper housing 201 and lower housing 202 combine is adopted, be convenient for install devices such as circuit board 204 in the casing, generally can not make the casing of optical module into an organic whole structure, like this when devices such as assembly circuit board, locating component, heat dissipation and electromagnetic shield structure can't install, also do not do benefit to production automation yet.

The unlocking handle 203 is positioned on the outer wall of the packaging cavity/lower shell 202, and the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; when the optical module is inserted into the host computer, the optical module is fixed in the cage of the host computer by the unlocking handle 203, and the optical module can be pulled out from the cage of the host computer by pulling the unlocking handle 203 to release the engagement relation between the optical module and the host computer.

The optical transceiver sub-assembly 205 is used for transmitting and receiving laser light, so as to realize the optical module 200 to transmit and receive optical signals. Fig. 5 is a schematic structural diagram of an optical transceiver sub-assembly provided in the embodiment of the present application. As shown in fig. 5, the optical sub-transceiver 300 includes an optical transmitter 10, a circular tube 20, and an optical receiver 40.

As shown in fig. 5, the round and square tube body 20 is used to carry the fixed optical transmitter 10 and the optical receiver 40. In the embodiment of the present application, the round and square tube 20 is generally made of a metal material, which is beneficial to implementing electromagnetic shielding and heat dissipation. The round and square tube body 20 is provided with a first tube opening and a second tube opening. Typically, the first and second nozzles are disposed on adjacent sidewalls of the round and square tube 20. Preferably, the first nozzle is disposed on the side wall of the round and square tube 20 in the length direction, and the second nozzle is disposed on the side wall of the round and square tube 20 in the width direction.

The light emitter 10 is embedded into the first pipe orifice, and the light emitter 10 is in heat conduction contact with the round and square pipe body 20 through the first pipe orifice; the light receiver 40 is inserted into the second pipe orifice, and is in heat conduction contact with the round and square pipe body 20 through the second pipe orifice. Alternatively, the optical transmitter 10 and the optical receiver 40 are directly press-fitted into the round-square tube 20, and the round-square tube 20 is in contact with the optical transmitter 10 and the optical receiver 40, respectively, directly or through a heat conducting medium. The round and square tube 20 can be used for heat dissipation of the optical transmitter 10 and the optical receiver 40, and the heat dissipation effect of the optical transmitter 10 and the optical receiver 40 is ensured. The optical fiber adapter 30 is embedded on the other side of the round and square tube body 20 and is used for connecting optical fibers with the optical transceiver sub-module.

It should be noted that, in the present embodiment, the optical transmitter 10 and the optical receiver 40 are packaged integrally, and in a specific implementation, an independent packaging structure may also be adopted. Fig. 6 is an exploded schematic view of an tosa provided in an embodiment of the present application. Referring to fig. 6, the tosa comprises a light emitter (formed by two parts, a stem 11 and a cap 12), a package 50, a connector 60 and a fiber adapter 30 in sequence from left to right.

The optical transmitter in the tosa/rosa of the present embodiment is improved. Fig. 7 is a schematic diagram of a first structure of a light emitter provided in an embodiment of the present application; fig. 8 is a schematic diagram of a second structure of a light emitter provided in an embodiment of the present application. As shown in fig. 7 and 8, the optical transmitter 10 in the present embodiment is a coaxial TO package, and it should be noted that only the structure of the stem portion is shown, and the cap portion is not shown in the drawings, and the specific structure thereof can refer TO the cap in fig. 6.

Wherein the stem 11 is generally designed as an oblate cylindrical structure for carrying the various devices in the light emitter 10. The socket 11 is provided with a plurality of pin through holes for the pins 116 to pass through, wherein a part of the pins are inserted into the pin through holes and protrude from the top surface of the socket 11 to be connected with the device fixed on the socket 11, and then the other end of the pins 116 can be connected with the circuit board 204 in the optical module.

The stem 11 is provided with a semi-cylindrical pillar 111, wherein the pillar 111 may be integrated with the stem 11, and the pillar 111 may be made of an alloy, such as a copper alloy, a nickel alloy, etc., and mainly plays a role in heat dissipation and load bearing, such as for bearing the laser chip 114 and assisting heat dissipation thereof. It should be noted that the structure for fixing the laser chip 114 is not limited to the pillar 111 provided in this embodiment, and may be designed in other shapes, and may be replaced with a heat sink fixed to the stem.

In the embodiment of the present application, as shown in fig. 8, in order to facilitate control of the conduction path and heat dissipation of the laser chip 114, the laser chip 114 is attached to the pillar 111 through the substrate 112, wherein the substrate 112 and the pillar 111 are fixedly connected by soldering using solder, and the substrate 112 may be made of ceramic materials such as aluminum nitride and aluminum oxide, but may also be made of other materials. Further, a first signal line transmission layer 1131 and a second signal line transmission layer 1132 which are made of metal are disposed on the substrate 112, a certain insulation gap is provided between the first signal line transmission layer 1131 and the second signal line transmission layer 1132, the first signal line transmission layer 1131 and the second signal line transmission layer 1132 are respectively connected to a pin, for example, the first signal line transmission layer 1131 is connected to a laser cathode driving pin, and the second signal line transmission layer 1132 is connected to a laser anode driving pin.

As shown in fig. 8, the cathode and the anode of the laser chip 114 in the present embodiment are disposed on two opposite surfaces, wherein the cathode is disposed on the lower surface (bottom surface) and the anode is disposed on the upper surface (top surface), and in order to distinguish the two opposite surfaces, the present embodiment will be described as the upper surface and the lower surface. The lower surface of the laser chip 114, i.e., the cathode thereof, is attached to the first signal line transmission layer 1131, and a bonding pad 1141 is disposed on the upper surface thereof for facilitating wire bonding on the anode of the laser chip 114, and the bonding pad 1141 is connected to the anode of the laser chip 114.

Specifically, in the present embodiment, two metal wires are selected, which are the first metal wire 1151 and the second metal wire 1152, respectively, and the first metal wire 1151 and the second metal wire 1152 may be gold wires made of gold, and of course, may also be made of other metal materials. One end of the first metal wire 1151 is soldered to the pad 1141, and the other end is connected to the second signal transmission layer 1132, wherein a portion of the first metal wire 1151 contacting the pad 1141 is called a solder joint, and an area of the solder joint formed by the first metal wire 1151 on the pad 1141 is greater than half of an area of the pad 1141. Meanwhile, one end of the second metal wire 1152 is soldered to the first metal wire 1151, wherein the second metal wire 1152 is preferably soldered to a position close to a solder point formed by the first metal wire 1151 and the pad 1141, or directly soldered to the solder point; the other end of the second metal wire 1152 is also connected to the second signal line transmission layer 1132.

Thus, the anode of the laser chip 114 is connected to the second signal transmission layer 1132 through two metal wires, and since the first metal wire 1151 is directly welded to the pad 1141 and the second metal wire 1152 is welded to the first metal wire 1151, only one welding point is formed on the pad 1141 of the laser chip by the two metal wires. Therefore, the light emitter provided by the application can increase the number of the metal wires on the premise of not increasing the area of the bonding pad of the laser chip, and compared with a single metal wire, the total diameter of the metal wire can be increased. According to an inductance calculation formula, the inductance L ^ 1/r is the radius of the wire, so that after the total diameter of the metal wire is increased, the parasitic inductance generated in the working process of the optical module is also reduced, the electromagnetic interference caused by the parasitic inductance is also correspondingly reduced, and the high-speed photoelectric performance of the optical module is further improved.

Of course, in this embodiment, only two metal wires are soldered, and more metal wires, such as three or four metal wires, may be disposed as required, and the metal wire above the wire is soldered to the metal wire at the bottom of the wire.

Further, in order to increase the firmness of the metal wire bonding and reduce the contact resistance between the metal wire and the pad, in this embodiment, when the metal wire is bonded, one end of the first metal wire 1151 is melted into a spherical metal solder ball 1153 by high temperature, and then, by applying a certain pressure, the first metal wire 1151 is bonded to the pad 1141 through the metal solder ball 1153. Similarly, one end of the second metal wire 1152 is also melted into a spherical metal solder ball 1154 by high temperature, and in order to facilitate the bonding of the second metal wire 1152, the second metal wire 1152 is bonded to the metal solder ball 1153 of the first metal wire 1151 through the metal solder ball 1154 by applying a certain pressure.

In order to ensure the firmness of the bonding wire, the diameter of the solder ball 1154 of the second metal wire 1152 is set to be smaller than or equal to the diameter of the solder ball 1153 of the first metal wire 1151, that is, when a plurality of metal wires are bonded, the diameter of the solder ball of each wire is reduced from top to bottom, and the direction close to the pad is referred to as downward in this embodiment.

From the inductance L ═ Ln, where Ln is the wire length, it can be seen that the longer the metal wire is, the larger the parasitic inductance generated by the metal wire is, so the shorter the length of each metal wire is, the better, but the condition that the metal wire can be soldered to the second signal line transmission layer 1132 needs to be satisfied. For the above reasons, the smaller the difference between the lengths of the first metal wire 1151 and the second metal wire 1152, the better, and meanwhile, since the second metal wire 1152 is welded on the first metal wire 1151, the difference between the lengths of the first metal wire and the second metal wire is also obtained, therefore, the difference between the lengths of the first metal wire and the second metal wire is smaller than the first preset value and greater than or equal to 0, and the specific value is set according to the requirement that both the two wires can be welded on the signal line transmission layer.

Further, in order to increase the bonding speed, in this embodiment, the other end of the first metal wire 1151 is bonded to the second signal wire transmission layer 1132 by pressure welding, for example, a gold wire bonding cleaver is used to press the other end of the first metal wire 1151 to the second signal wire transmission layer 1132, and in this embodiment, a point of the first metal wire 1151, which is in contact with the second signal wire transmission layer 1132, is referred to as a first bonding point 1155. Similarly, the other end of the second metal wire 1152 is also bonded to the second signal-wire transmitting layer 1132 by pressure welding, and the point where it contacts the second signal-wire transmitting layer 1132 is referred to as a second welding point 1156.

Since the solder points of the metal wires on the second signal transmission layer 1132 are usually formed by pressing on the second signal transmission layer 1132, in order to prevent the soldered metal wires from being affected by the subsequent soldering, the embodiment provides that the solder points of the first metal wire 1151 and the second metal wire 1152 on the second signal transmission layer 1132 have a certain distance L therebetween. Meanwhile, as the distance between the two metal wires is larger, the length of the corresponding metal wire is longer, so that the inductance value generated by the metal wire and the requirement of the gold wire bonding riving knife on the solder joint distance are reduced as much as possible, and the distance L between the solder joints of the adjacent metal wires on the second signal wire transmission layer 1132 is set to be any value between 50 and 150um in the embodiment.

That is, if the second metal wire 1152 is soldered to the metal solder ball 1153 of the first metal wire 1151 through the metal solder ball 1154, the first metal wire 1151 and the second metal wire 1152 form a certain included angle θ, and the included angle between the first metal wire 1151 and the second metal wire 1152 is set to be greater than or equal to 15 ° and less than 180 ° in this embodiment, taking into consideration factors such as the distance between two signal line transmission layers, the size of the laser chip, and the location where the laser chip is attached.

In this embodiment, only one laser chip is attached to the stem, and in the specific implementation process, two or more laser chips may be attached to the stem, so as to implement the emission of the multi-optical-path optical signal.

In addition, other components, such as a backlight detector 117 for detecting the light emitting power of the laser chip 114, a thermistor for acquiring the temperature of the pillar 111 and monitoring the operating temperature of the laser chip 114, and a thermoelectric cooler for dissipating heat from the laser chip 114, may be disposed in the stem of the light emitter.

All the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments, and the relevant points may be referred to the part of the description of the method embodiment. It is noted that other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims

1. An optical transmitter, comprising:

a header for carrying the device;

2. The light emitter of claim 1, wherein the difference between the lengths of the first metal wire and the second metal wire is greater than or equal to 0 and less than a first predetermined value.

3. The optical transmitter of claim 1, wherein the first metal wire forms a first pad on the second signal line transmission layer, and the second metal wire forms a second pad on the second signal line transmission layer, the first pad and the second pad having a spacing therebetween.

4. The light emitter of claim 3, wherein the first solder joint and the second solder joint are spaced apart by a distance of between 50um and 150 um.

5. The light emitter of claim 1, wherein one end of the first metal wire is melted to form a solder ball and then bonded to the pad, and one end of the second metal wire is melted to form a solder ball and then bonded to the solder ball of the first metal wire.

6. The light emitter of claim 5, wherein an included angle between the first metal wire and the second metal wire is greater than or equal to 15 ° and less than 180 °.

7. The light emitter of claim 1, wherein a diameter of the metal solder ball of the second metal wire is smaller than or equal to a diameter of the metal solder ball of the first metal wire.

8. The light emitter of claim 1, wherein the first and second metal wires are gold wires.

9. A light module characterized in that it comprises a light emitter according to any one of claims 1 to 8.