CN213091954U

CN213091954U - Optical module

Info

Publication number: CN213091954U
Application number: CN202021955658.5U
Authority: CN
Inventors: 杨世海; 张晓磊; 庞广宁; 陈金磊
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-09-08
Filing date: 2020-09-08
Publication date: 2021-04-30
Anticipated expiration: 2030-09-08
Also published as: WO2022052842A1

Abstract

The optical module comprises a metal shell, an optical fiber adapter, a round square tube body and a light emission secondary module, wherein the light emission secondary module comprises a metal tube seat; the metal shell is electrically connected with the optical fiber adapter, the optical fiber adapter is electrically connected with the round and square tube body, and the round and square tube body is electrically connected with the metal tube seat; the laser is arranged on the metal tube seat, the metal tube seat is provided with a grounding tube pin and a grounding tube pin through hole, a gap is arranged between the grounding tube pin and the grounding tube pin through hole, and an insulating medium is arranged in the gap; the grounding of the laser can be realized by directly connecting the grounding end of the laser with the grounding pin. The grounding mode avoids the electrical connection between the laser and the metal tube seat, namely the laser and the metal tube seat are in an electrical insulation state, and the metal shell, the optical fiber adapter, the round and square tube body and the metal tube seat are integrated, so that the laser and the metal shell are also in the electrical insulation state, and further the electrical isolation between the optical transmitter sub-module and the metal shell of the optical module is realized.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

The optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment. With the rapid development of the 5G network, the optical module at the core position of optical communication has been developed greatly. The current packaging form of the optical module mainly includes a TO (Transistor-out) package and a COB (Chip on Board) package.

In order TO ensure that the devices such as the laser, the optical detector and the like work normally, the devices such as the laser, the optical detector and the like need TO be connected with the ground; in the existing grounding mode, devices such as a laser, an optical detector and the like are connected with a tube seat, and the tube seat is connected with a grounding wire of a circuit board, so that the devices such as the laser, the optical detector and the like are grounded.

Although the above-mentioned manner can realize the grounding of the laser, in the implementation process, the devices such as the laser and the optical detector are connected with the tube seat, and the tube seat is not in an electrical isolation state due to the contact between the tube seat and the metal shell of the optical module, so the devices such as the laser and the optical detector are not in an electrical isolation state.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to solve the problem that although the existing grounding mode can realize grounding, the device cannot be in an electric isolation state.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

a metal housing;

the optical fiber adapter is electrically connected with the metal shell;

the round and square tube body is electrically communicated and connected with the optical fiber adapter and is provided with a tube opening;

the light emission secondary module comprises a metal pipe seat, and the metal pipe seat is electrically connected with the round and square pipe body;

be equipped with ground pin and ground pin through-hole on the metal tube seat, wherein:

the grounding pin penetrates from the bottom surface of the metal tube seat to the top surface of the tube seat through the grounding pin through hole, a gap is formed between the grounding pin and the grounding pin through hole, and an insulating medium is arranged in the gap;

the metal tube seat is provided with a laser, and the grounding end of the laser is connected with the grounding tube pin.

The beneficial effect of this application does:

according to the technical scheme, the optical module comprises a metal shell, an optical fiber adapter, a round square tube body and a light emission secondary module, wherein the light emission secondary module comprises a metal tube seat; the metal shell is electrically connected with the optical fiber adapter, the optical fiber adapter is electrically connected with the round and square tube body, and the round and square tube body is electrically connected with the metal tube seat; the laser is arranged on the metal tube seat, the metal tube seat is provided with a grounding tube pin and a grounding tube pin through hole, wherein the grounding tube pin penetrates from the bottom surface of the metal tube seat to the top surface of the tube seat through the grounding tube pin through hole, a gap is arranged between the grounding tube pin and the grounding tube pin through hole, and an insulating medium is arranged in the gap; the grounding of the laser can be realized by directly connecting the grounding end of the laser with the grounding pin. In the embodiment of the application, the metal shell, the optical fiber adapter, the round and square tube body and the metal tube seat of the optical module are integrated and are in an electrically conducted state; the grounding mode avoids the electrical connection between the laser and the metal tube seat, namely the laser and the metal tube seat are in an electrical insulation state, and the metal shell, the optical fiber adapter, the round and square tube body and the metal tube seat are integrated, so that the laser and the metal shell are also in the electrical insulation state, and further the electrical isolation between the optical transmitter sub-module and the metal shell of the optical module is realized. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

fig. 2 is a schematic structural diagram of an optical network terminal;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 4 is an exploded schematic structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 5 is a schematic diagram of an internal structure of an optical module according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of an tosa according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a heat sink provided in an embodiment of the present application;

fig. 8 is a schematic structural diagram of another view angle of the heat sink provided in the embodiment of the present application;

fig. 9 is a layout diagram of pins according to an embodiment of the present application.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 via the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. An optical network terminal in the optical communication terminal of the foregoing embodiment is described below with reference to fig. 2; as shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of the optical module. The following describes the optical module in the optical communication terminal according to the foregoing embodiment with reference to fig. 3 and 4; as shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and an optical transceiver module 400.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity generally presents a square body. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper shell 201 on the lower shell 202.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect with the optical transceiver module 400 inside the optical module; the photoelectric devices such as the circuit board 300 and the optical transceiver module 400 are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver module 400 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the module; the upper shell and the lower shell are made of metal materials generally, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component generally, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.

The optical transceiver module 400 includes two parts, namely an optical transmitter sub-module and an optical receiver sub-module, which are respectively used for transmitting and receiving optical signals. The emission secondary module generally comprises a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively positioned on different sides of the light emitter, light beams are respectively emitted from the front side and the back side of the light emitter, and the lens is used for converging the light beams emitted from the front side of the light emitter so that the light beams emitted from the light emitter are converging light to be conveniently coupled to an external optical fiber; the optical detector is used for receiving the light beam emitted by the reverse side of the optical emitter so as to detect the optical power of the optical emitter. Specifically, light emitted by the light emitter enters the optical fiber after being converged by the lens, and the light detector detects the light emitting power of the light emitter so as to ensure the constancy of the light emitting power of the light emitter. The optical transceiver module 400 will be described in detail below.

Fig. 5 is a schematic diagram of an internal structure of an optical module according to an embodiment of the present disclosure; as shown in fig. 5, the optical transceiver module 400 in the foregoing embodiment includes an optical transmitter sub-module 500 and an optical receiver sub-module 700, and the optical module further includes a round square tube 600 and a fiber adapter 800, in this embodiment, the optical transceiver sub-module is preferably the fiber adapter 800 for connecting optical fibers, that is, the fiber adapter 800 is embedded on the round square tube 600 for connecting optical fibers. Specifically, the round and square tube 600 is provided with a third tube opening 603 for inserting the optical fiber adapter 800, the optical fiber adapter 800 is embedded into the third tube opening 603, the light emission sub-module 500 and the light reception sub-module 700 respectively establish optical connection with the optical fiber adapter 800, light emitted from the light receiving and emitting assembly and received light are transmitted through the same optical fiber in the optical fiber adapter, that is, the same optical fiber in the optical fiber adapter is a transmission channel for the light entering and exiting from the light receiving and emitting assembly, and the light receiving and emitting assembly realizes a single-fiber bidirectional light transmission mode.

The round and square tube 600 is used for carrying the tosa 500 and the tosa 700, and in the embodiment of the present application, the round and square tube 600 is made of a metal material, which is beneficial to implementing electromagnetic shielding and heat dissipation. The round and square tube body 600 is provided with a first tube orifice 601 and a second tube orifice 602, and the first tube orifice 601 and the second tube orifice 602 are respectively arranged on the adjacent side walls of the round and square tube body 600. Preferably, the first nozzle 601 is disposed on a side wall of the round and square tube 600 in the length direction, and the second nozzle 602 is disposed on a side wall of the round and square tube 600 in the width direction.

The tosa 500 is embedded in the first pipe 601, and the tosa 500 is in heat conduction contact with the round and square pipe 600 through the first pipe 601; the light receiving sub-assembly 700 is inserted into the second pipe 602, and the light receiving sub-assembly 700 is in thermal contact with the round-square pipe 600 through the second pipe 602. Alternatively, the tosa 500 and the rosa 700 are directly press-fitted into the round and square tube 600, and the round and square tube 600 is in contact with the tosa 500 and the rosa 700 directly or through a heat conducting medium. The round and square tube can be used for heat dissipation of the tosa 500 and the tosa 700, and the heat dissipation effect of the tosa 500 and the tosa 700 is ensured.

Fig. 6 is a schematic structural diagram of an tosa according to an embodiment of the present disclosure; the tosa in the optical transceiver module 400 in the foregoing embodiment will be described with reference to fig. 6. As shown in fig. 6, the tosa 500 includes a metal stem 501, the tosa 500 is connected to the round and square tube 600 through the metal stem 501, and specifically, the metal stem 501 is embedded in the first pipe port 601 of the round and square tube 600. The tosa 500 is a coaxial TO package, the optical transmitter is a laser 502, the tosa 500 further includes an optical detector 503, a lens 504 and a heat sink 505, in this embodiment, the optical devices such as the laser 502, the optical detector 503 and the lens 504 are placed on the surface of the metal stem 501.

The laser 502 comprises a laser chip and a laser ceramic heat sink, the laser chip is welded on the laser ceramic heat sink by using gold-tin solder, and the laser ceramic heat sink is adhered on a side platform of the heat sink 505 by using silver adhesive and is used for emitting signal beams. The Laser of the optical module is currently of two types, one is a Direct Modulated Laser (DML), and the other is an electro-absorption Modulated Laser (EML), which is an integrated device of an Electric Absorption Modulator (EAM) and a Distributed Feedback (DFB) Laser, and has better effect and larger power consumption than the DML. Compared with the DML, the EML adds a refrigerator, a heat sink, a thermistor, and the like.

The lens 504 is disposed above the laser 502, and a central axis of the lens 504 coincides with a central axis of the laser 502, and is configured to converge the signal beam emitted by the laser 502, for example, directly converge the signal beam emitted by the laser 502, and the converged beam is coupled into an external optical fiber. The position of the lens 504 can be determined by the optical parameters of the lens, such as the focal length and the position of the laser 502, for example, the distance between the lens 504 and the light emitting surface of the laser 502 can be the focal length of the lens 504, and the position of the lens 504 can be determined according to the focal length of the lens 504 and the position of the laser 502, so as to fix the lens 504 above the laser 502.

The heat sink 505 is disposed on the top surface of the metal stem 501, and the heat sink 505 may be directly fixed on the top surface of the metal stem 501, or may be indirectly fixed on the top surface of the metal stem 501 through other devices. The heat sink 505 may be made of an alloy, such as a copper alloy, a nickel alloy, etc., and mainly plays a role of heat dissipation and carrying, such as for carrying the laser 502, the light detector 503, the lens 504, etc., and assisting the laser 502, the light detector 503, the lens 504 in heat dissipation. Fig. 7 is a schematic structural diagram of a heat sink provided in an embodiment of the present application, and fig. 8 is a schematic structural diagram of another view angle of the heat sink provided in the embodiment of the present application; the heat sink in the tosa 500 of the previous embodiment is described below with reference to fig. 7 and 8. As shown in fig. 7 and 8, the heat sink 505 includes a first surface 505-1, a second surface 505-2, and a third surface 505-3. In the embodiment of the present application, the first surface 505-1 and the second surface 505-2 are located on the front side of the heat sink 505, the first surface 505-1 and the second surface 505-2 are opposite and intersect, the third surface 505-3 is located on the back side of the heat sink 505, and the first surface 505-1 and the third surface 505-3 are opposite. Specifically, when heat sink 505 is disposed on metal header 501, first surface 505-1 is perpendicular to the top surface of metal header 501 and second surface 505-2 is approximately parallel to the top surface of metal header 501.

The first surface 505-1, the second surface 505-2 and the third surface 505-3 of the heat sink 505 are the main bearing surfaces of the heat sink 505, and the first surface 505-1, the second surface 505-2 and the third surface 505-3 of the heat sink 505 are used for bearing the laser 502, the light detector 503, the lens 504 and other devices. Specifically, the laser 502 is disposed on the first surface 505-1 of the heat sink 505 such that the laser beam generated by the laser 502 is transmitted in a direction perpendicular to the top surface of the metal stem 501 and away from the second surface 503-2; as such, the lens 504 is also disposed on the first surface 505-1 of the heat sink 505.

In the present implementation, the light detector 503 is fixed to a surface of the heat sink 505. Further, the light detector 503 is disposed at a backlight end of the laser 502, and is used for performing backlight collection and feedback of the laser beam generated by the laser 502. In particular, the light detector 503 is secured to a second surface 505-2 of the heat sink 505. The light detector 503 and the lens 504 are respectively located on different sides of the laser 502, the lens 504 is located on the optical path of the light beam emitted by the front surface of the laser 502, and the light detector 503 is located on the optical path of the light beam emitted by the back surface of the laser 502. That is, the two opposite sides of the laser 502 can emit light beams, the front surface of the laser 502 emits light beams with the main optical axis perpendicular to the metal stem 501, and the light beams are converged by the lens 504; the light emitted from the back of the laser 502 enters the light detector 503, and the light power of the light emitted from the back of the laser 502 is detected by the light detector 503, so as to detect the light power of the light emitted from the front of the laser 502. After the light power emitted by the front surface of the laser 502 is detected, the laser 502 can be dynamically adjusted, if the light detector 503 detects that the light power is increased, the light power emitted by the laser 502 is increased, and the light emission of the laser 502 is reduced by controlling the laser driving circuit to reduce the driving power applied to the laser; if the light detector 503 detects that the light power becomes smaller, the light power emitted by the laser 502 becomes smaller, and the laser driving circuit can be controlled to increase the driving current of the laser to make the light emission of the laser 502 smaller, thereby ensuring the constant light emission power of the laser.

In the embodiment of the present application, the tosa 500 further includes a thermistor 506 and a TEC (thermoelectric cooler) 507. The thermistor 506 is disposed on the heat sink 505 and is used for acquiring the temperature of the heat sink 505 to monitor the operating temperature of the laser 502. The TEC507 is fixed to the top surface of the metal stem 501, and the TEC507 supports the heat sink 505, i.e., the heat sink 505 is fixed to the metal stem 501 by the TEC 507. In the embodiment of the present application, one heat exchange surface of the TEC507 is directly attached to the metal tube seat 501, and the other heat exchange surface of the TEC507 is used for directly attaching the heat sink 505, so that efficient heat transfer between the laser 502 and the TEC507 is ensured. Specifically, the temperature of the heat sink 505 is acquired through the thermistor 506, and the operation of the TEC507 is controlled according to the temperature of the heat sink 505, so that the temperature of the laser 502 is controlled within a target temperature range. As shown in fig. 8, in the present embodiment, to accurately monitor the temperature of the laser 502, a thermistor 506 is disposed on the third surface 505-3 of the heat sink 505.

With the improvement of the performance of the optical module, the optical device inside the optical module is required to be electrically isolated from the metal shell of the optical module, so that the performances of conduction emission, electrostatic disturbance resistance and the like can be effectively improved. The tosa and the rosa in the embodiment of the present application should both maintain an electrical isolation state, in the embodiment of the present application, the rosa 700 is fixed on the round tube 600 by curing adhesives such as UV, and since the curing adhesives are insulating adhesives, the rosa 700 is in an electrical isolation state. The metal shell of the optical module is connected with the optical fiber adapter 800 in a laser welding mode, the optical fiber adapter 800 is connected with the round square tube body 600 in a laser welding mode, and the round square tube body is connected with the metal tube seat 501 in a welding mode, so that the metal shell, the optical fiber adapter 800, the round square tube body 600 and the metal tube seat 501 are integrated and are electrically conducted with one another, and in order to guarantee normal operation of devices such as a laser and a light detector, the devices such as the laser and the light detector need to be connected with the ground; generally, devices such as a laser, a light detector and the like are connected with a metal tube seat, and the metal tube seat is connected with a grounding pin, so that grounding of the laser and the like is realized; however, this grounding method requires the laser and the like to be connected to the metal stem, and since the metal stem is electrically connected to the metal case, the laser and the like are also electrically connected to the metal case, and the tosa is not in an electrically isolated state at this time.

As shown in fig. 6, a plurality of pins are disposed on the metal tube seat 501, and fig. 9 is a layout diagram of the pins provided in the embodiment of the present application; as shown in fig. 9, the pins pass through the metal stem 501 and protrude from the surface of the metal stem 501, and the pins are wrapped by glass to achieve insulation between the pins and the metal stem 501. In the embodiment of the present application, in order to facilitate connection between each electronic device and the corresponding pin, the pins on the metal tube seat 501 are uniformly distributed around the TEC 507.

As shown in fig. 9, the metal tube seat 501 is provided with a ground pin 508a, a laser pin 508b, a photodetector pin 508c, a thermistor pin 508d, and a TEC pin 508e, and correspondingly, the metal tube seat 501 is further provided with a ground pin through hole 509a, a laser pin through hole 509b, a photodetector pin through hole 509c, a thermistor pin through hole 509d, and a TEC pin through hole 509 e; the grounding pin 508a penetrates from the bottom surface of the metal tube seat 501 to the top surface of the metal tube seat 501 through the grounding pin through hole 509a, a gap is formed between the grounding pin 508a and the grounding pin through hole 509a, and an insulating medium is arranged in the gap; the laser pin 508b penetrates from the bottom surface of the metal tube seat 501 to the top surface of the metal tube seat 501 through the laser pin through hole 509b, a gap is formed between the laser pin 508b and the laser pin through hole 509b, and an insulating medium is arranged in the gap; the optical detector pin 508c penetrates from the bottom surface of the metal tube seat 501 to the top surface of the metal tube seat 501 through the optical detector pin through hole 509c, a gap is formed between the optical detector pin through hole 509c and the grounding pin through hole 509a, and an insulating medium is arranged in the gap; the thermistor pin 508d penetrates from the bottom surface of the metal tube seat 501 to the top surface of the metal tube seat 501 through the thermistor pin through hole 509d, a gap is formed between the thermistor pin 508d and the thermistor pin through hole 509d, and an insulating medium is arranged in the gap; the TEC pin 508e penetrates from the bottom surface of the metal tube seat 501 to the top surface of the metal tube seat 501 through the TEC pin through hole 509e, a gap is formed between the TEC pin 508e and the TEC pin through hole 509e, and an insulating medium is arranged in the gap; in the present embodiment, the insulating medium may be glass or ceramic; by filling the gap with an insulating medium, each pin is electrically isolated from the metal stem 501 by the insulating medium.

On the basis that each pin is electrically isolated from the metal tube seat 501, the negative electrode of the laser 502 is connected with the grounding tube pin 508a in a routing manner, the negative electrode of the optical detector 503 is connected with the grounding tube pin 508a in a routing manner, one end of the thermistor 506 is connected with the grounding tube pin 508a in a routing manner, and the negative electrode of the TEC507 is connected with the grounding tube pin 508a in a routing manner, so that the grounding ends of the laser 502, the optical detector 503 and other devices are directly connected with the grounding tube pin, the electrical connection between the laser and other devices and the metal tube seat is avoided, the laser and other devices are in an electrical insulation state with the metal tube seat, and the metal shell, the optical fiber adapter, the round square tube body and the metal tube seat are integrated, so that the laser and other devices are in an electrical insulation state with the metal shell, and further the electrical isolation between. The laser pin 508b is connected to the anode of the laser 502 by a gold wire, the photodetector pin 508c is connected to the anode of the photodetector 503 by a gold wire, the thermistor pin 508d is connected to one end of the thermistor 506 by a gold wire, and the TEC pin 508e is connected to the anode of the TEC by a gold wire.

The optical module comprises a metal shell, an optical fiber adapter, a round square tube body and a light emission secondary module, wherein the light emission secondary module comprises a metal tube seat; the metal shell is electrically connected with the optical fiber adapter, the optical fiber adapter is electrically connected with the round and square tube body, and the round and square tube body is electrically connected with the metal tube seat; the laser is arranged on the metal tube seat, the metal tube seat is provided with a grounding tube pin and a grounding tube pin through hole, wherein the grounding tube pin penetrates through the top surface of the metal tube seat from the bottom surface of the metal tube seat through the grounding tube pin through hole, a gap is arranged between the grounding tube pin and the grounding tube pin through hole, and an insulating medium is arranged in the gap; the grounding of the laser can be realized by directly connecting the grounding end of the laser with the grounding pin. In the embodiment of the application, the metal shell, the optical fiber adapter, the round and square tube body and the metal tube seat of the optical module are integrated and are in an electrically conducted state; the grounding mode avoids the electrical connection between the laser and the metal tube seat, the laser and the metal tube seat are in an electrical insulation state, and the metal shell, the optical fiber adapter, the round and square tube body and the metal tube seat are integrated, so that the laser and the metal shell are also in the electrical insulation state, and further the electrical isolation between the optical transmitter sub-module and the metal shell of the optical module is realized.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims

1. A light module, comprising:

a metal housing;

a fiber optic adapter in electrically conductive connection with the metal housing;

the light emission secondary module comprises a metal pipe seat, and the metal pipe seat is electrically connected with the round and square pipe body through the pipe orifice;

the metal tube seat is provided with a grounding pin and a grounding pin through hole, wherein:

2. The optical module of claim 1, wherein the metal housing is laser welded to the fiber optic adapter, the fiber optic adapter is laser welded to the round-square tube, and the round-square tube is laser welded to the metal tube base.

3. The optical module of claim 1, wherein the tosa further comprises a heat sink disposed on a top surface of the metal stem;

the heat sink comprises a first surface, a second surface and a third surface, wherein the first surface and the second surface are opposite and intersect, the third surface is positioned on the back surface of the heat sink, and the first surface and the third surface are opposite;

the laser is arranged on the first surface, the optical detector is arranged on the second surface, and the thermistor is arranged on the third surface.

4. The optical module of claim 3, wherein a negative electrode of the laser is wire bonded to the ground pin, a negative electrode of the photodetector is wire bonded to the ground pin, and one end of the thermistor is wire bonded to the ground pin.

5. The optical module according to claim 3, wherein a TEC is arranged between the metal tube seat and the heat sink, one heat exchange surface of the TEC is connected with the metal tube seat, and the other heat exchange surface of the TEC is connected with the heat sink;

and the cathode of the TEC is connected with the grounding pin in a routing way.

6. The optical module according to claim 3, wherein a laser pin, a photodetector pin, a thermistor pin and a TEC pin are further disposed on the metal tube base, and the laser pin, the photodetector pin, the thermistor pin and the TEC pin are respectively connected to the anode of the laser, the anode of the photodetector, the other end of the thermistor and the anode of the TEC.

7. The optical module of claim 6, wherein the metal tube base is further provided with a laser pin through hole, a photodetector pin through hole, a thermistor pin through hole and a TEC pin through hole;

the laser pin, the optical detector pin, the thermistor pin and the TEC pin penetrate through the laser pin through hole, the optical detector pin through hole, the thermistor pin through hole and the TEC pin through hole from the bottom surface of the metal tube seat to the top surface of the metal tube seat respectively.

8. The optical module of claim 7, wherein a gap is formed between each of the laser pin through hole, the photodetector pin through hole, the thermistor pin through hole, and the TEC pin through hole and the metal tube seat, and an insulating medium is disposed in the gap.

9. The optical module of claim 1, wherein the ground pin protrudes from a top surface of the metal header.

10. The optical module of claim 5, wherein the laser, photodetector, thermistor, and TEC pins protrude above a top surface of the metal header.