CN115274568A - Radio frequency front end three-dimensional integrated structure - Google Patents
Radio frequency front end three-dimensional integrated structure Download PDFInfo
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- CN115274568A CN115274568A CN202210917861.0A CN202210917861A CN115274568A CN 115274568 A CN115274568 A CN 115274568A CN 202210917861 A CN202210917861 A CN 202210917861A CN 115274568 A CN115274568 A CN 115274568A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
Abstract
The invention discloses a radio frequency front end three-dimensional integrated structure, which belongs to the technical field of radio frequency component packaging, and comprises a ceramic quadrilateral flat packaging CQFP tube shell with a three-level cavity structure, wherein a first-level radio frequency circuit is installed in a first-level cavity at the bottom of the ceramic tube shell, a second-level radio frequency functional circuit sub-packaging module with a metal shielding shell is embedded and installed in a second-level cavity of the ceramic tube shell, bonding gold wires are bonded at the bottom of the third-level cavity corresponding to a bonding pad position to realize the electrical connection of the second-level radio frequency functional circuit sub-packaging module and the ceramic tube shell, a Kovar cover plate is welded by using a parallel seal welding process to complete the airtight packaging of the inner space of the tube shell structure, and the third-level radio frequency circuit module is welded on the tube shell in a stacking manner. The invention simplifies the integrated assembly process of the radio frequency front-end circuit, well shields each functional area in the circuit, improves the electromagnetic compatibility of the radio frequency module and reduces the size of the radio frequency front-end circuit.
Description
Technical Field
The invention relates to the technical field of radio frequency assembly packaging, in particular to a radio frequency front end three-dimensional integrated structure.
Background
In the face of the requirement of miniaturization and multi-functionalization of wireless communication systems, designing a miniaturized radio frequency front end based on a micro-system technology has become a research hotspot in the electronic field at home and abroad, and is considered as a mainstream trend of future radio frequency electronic technology development. The existing three-dimensional high-density integrated radio frequency microsystem has two types of realization forms, one is to use a wafer level bonding mode to flip-chip bond a plurality of bare chips on one or a plurality of silicon substrates containing Through Silicon Vias (TSV) and a rewiring layer to form a three-dimensional stacked radio frequency microsystem; another implementation manner is to install the radio frequency components inside a plurality of BGA package packages respectively, and then stack and weld the plurality of package packages together to form a three-dimensional stacked radio frequency microsystem.
The radio frequency microsystem is constructed in a wafer level bonding mode, the process requirement is high, the radio frequency microsystem is suitable for large-scale mass production, the process development cost is high when small-batch customized design is carried out, chips inside the package are required to be bare chips, the chip selection range is narrow, and radio frequency performance is difficult to take into account.
The radio frequency microsystem is constructed in a multi-package tube shell stacking mode, the process flow is complex, multiple micro-assembly flows are needed in the assembly process, meanwhile, the process is limited by the height of the BGA solder balls and the welding strength, the stacked package structure is not too high, the height of components inside each layer of package structure is greatly limited, and bare chips can be generally packaged. Since a plurality of stack welds are required, the welding temperature must be controlled for each stack weld in order to ensure the reliability of the weld, and the welding temperature must be lowered for each welding process to prevent the failure of the last welding position, so that the whole welding process requires a plurality of temperature gradients. In addition, since each welding reduces the yield of the product, the more the assembly process, the more the number of stacked layers, the lower the yield of the final product, and the higher the production cost.
Disclosure of Invention
In view of this, the present invention provides a three-dimensional integrated structure of a radio frequency front end. The structure decomposes the radio frequency front-end circuit into three independent parts, and the three independent parts are assembled at one time respectively, and three functional components after the assembly are completed are stacked together to form the radio frequency front-end circuit with complete functions. Compared with the traditional method, the method provided by the invention does not need high-temperature welding during lamination assembly, and only needs to bake and solidify the conductive adhesive at a lower temperature. The whole three-dimensional packaging radio frequency micro-system assembling process only needs one temperature gradient, and the assembling process flow is simple. In addition, because three functional circuit are independently assembled, each part breaks down and all has the chance of repairing for the yield of whole encapsulation module promotes by a wide margin, and manufacturing cost reduces by a wide margin. Meanwhile, the integration capability of the internal elements is stronger, and radio frequency elements with larger volume can be accommodated. In addition, each layer of packaging structure is provided with an independent metal shielding cavity, so that better electromagnetic compatibility can be obtained.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a radio frequency front end three-dimensional integrated structure comprises an HTCC high-temperature co-fired ceramic tube shell (1) with a three-layer step cavity, wherein the ceramic tube shell adopts a ceramic quadrilateral flat package CQFP form (10), and an exposed bonding pad (11) for welding a third-level functional circuit module (9) is reserved at the top of the ceramic tube shell;
a first-stage radio frequency functional circuit (5) and a second-stage radio frequency functional circuit sub-packaging module (6) are arranged in a first-layer step cavity and a second-layer step cavity of the ceramic tube shell according to the sequence from bottom to top; the secondary radio frequency function circuit sub-packaging module (6) is inversely arranged in the second-layer step cavity, a front metal shielding cover (4) of the secondary radio frequency function circuit sub-packaging module (6) is attached to a step surface (14) of the second-layer step cavity (3) of the ceramic tube shell, and a bottom substrate of the secondary radio frequency function circuit sub-packaging module (6) is flush with a step surface of a third-layer step cavity (7) of the ceramic tube shell;
a first metal disc (15) for electrical connection is arranged on a substrate at the bottom of the second-stage radio frequency functional circuit sub-packaging module (6), a second metal disc (12) for electrical connection is arranged at a position corresponding to a third step surface of a third-layer step cavity (7) of the ceramic tube shell (1), and a bonding gold wire connects the first metal disc (15) at the bottom of the second-stage radio frequency functional circuit sub-packaging module (6) with the second metal disc (12) at the third-layer step surface of the ceramic tube shell;
the Kovar cover plate (8) is welded on an annular welding ring (13) reserved at the top of the ceramic tube shell in a parallel seam welding mode above the second-stage radio frequency functional sub-packaging module (6) to seal a step cavity of the ceramic tube shell (1), and the third-stage functional circuit module (9) is brazed on an exposed bonding pad (11) reserved on the upper surface of the ceramic tube shell.
Furthermore, the outer side of the second-stage radio frequency function sub-packaging module (6) is covered with a metal shielding cover (4) made of kovar material, the metal shielding cover (4) made of the kovar material is used as the second-stage radio frequency function sub-packaging module (6) to be installed on a supporting structure of the second-stage step cavity (3) of the ceramic tube shell, and the kovar material adopted by the metal shielding cover is used for ensuring that the thermal expansion coefficients of the two assembly components are matched.
Furthermore, the thickness of a metal shielding cover (4) of the second-stage radio frequency function sub-packaging module (6) is larger than 3mm, and the height of a cavity inside the metal shielding cover is larger than 2mm.
Furthermore, after the second-stage radio frequency functional sub-packaging module (6) is inversely arranged and installed inside the ceramic tube shell, the metal shielding cover (4) is simultaneously used as an electromagnetic shielding structure of the first-stage radio frequency functional circuit (5);
furthermore, a square blind groove (16) is reserved at the bottom of the third-stage functional circuit module and is welded to the upper surface of the ceramic tube shell without interfering with the sealing cover of the ceramic tube shell, and meanwhile, a copper foil (17) and a metalized through hole (18) are laid in the square blind groove to conduct the heat in the third-stage functional circuit module to the kovar cover plate (8) of the ceramic tube shell so as to improve the heat dissipation performance of the third-stage functional circuit module (9).
Furthermore, the second-stage radio frequency function sub-packaging module (6) and the ceramic tube shell (1) are fixed in a high-temperature cured conductive adhesive mode, and the conductive adhesive is used for structural fixing and grounding shielding of the second-stage radio frequency function sub-packaging module and the ceramic tube shell.
The invention adopts the technical scheme to produce the beneficial effects that:
1. the traditional stack packaging method mostly adopts BGA ball grid array packaging, is limited by the height of a solder ball and the welding strength, and the thickness of each layer of module is greatly limited. Many critical passive devices contained in the radio frequency circuit, such as a high-performance ceramic filter, a broadband radio frequency balun, etc., have a large thickness, and the traditional three-dimensional integration technology cannot integrate such large-volume passive devices inside a three-dimensional packaged micro-system. The design of the invention adopts an ultra-thick HTCC ceramic tube shell, so that a radio frequency element with larger volume can be integrated in the three-dimensional stacked microsystem. Considering the thickness of the tube shell and the complicated three-layer cavity structure inside, in order to ensure that the green ceramic tube shell does not deform in the cavity in the processing process, the special filling and hydraulic pressure control technology is designed and used, and the HTCC ceramic tube shell is ensured not to deform in the cavity in the green ceramic stage.
2. In order to reduce the thickness of the final HTCC ceramic tube shell as much as possible, the invention creatively stacks the third-stage functional circuit module directly above the ceramic tube shell instead of embedding the third-stage functional circuit module into the ceramic tube shell, and the thickness of the HTCC ceramic tube shell is reduced by more than 30 percent by the design method. Because the thickness of the HTCC ceramic tube shell is reduced, the corresponding processing cost is also greatly reduced.
3. The second-stage radio frequency functional circuit sub-packaging module can be manufactured by using a low-cost substrate material and a low-cost printed board processing technology. The substrate of the second layer of sub-packaging module is not in direct contact with the HTCC ceramic tube shell, the thermal expansion coefficient of the substrate does not need to be matched with the HTCC high-temperature ceramic tube shell, and the low-cost substrate material can meet the process assembly requirement. The Kovar shielding cover is covered on the second layer of sub-packaging module and the HTCC ceramic tube shell, the coefficient of thermal expansion of Kovar materials is matched with that of the HTCC ceramic tube shell, matching of the coefficient of thermal expansion of the embedded sub-packaging module and the coefficient of thermal expansion of the HTCC ceramic tube shell is achieved ingeniously, and reliability of the module under high-temperature and low-temperature working conditions is guaranteed. The RF front end microsystem processed by the method of the invention successfully passes low temperature work/storage (-40 ℃) and high temperature work/storage tests (+ 85 ℃).
4. According to the invention, the continuous grounding metal layer is arranged on the bottom surface of the second layer cavity of the HTCC ceramic tube shell, and after the Kovar shield cover of the second layer sub-packaging module is bonded with the bottom surface of the second layer cavity of the HTCC ceramic tube shell by using the conductive adhesive, the first layer cavity of the HTCC ceramic tube shell realizes good electromagnetic shielding, and simulation results show that the structure can enable the spatial isolation degree of the first layer cavity and the second layer cavity to reach more than 70dB, and meets the harsh requirement of a radio frequency front-end circuit on the spatial isolation degree.
5. In the traditional multi-shell stacking scheme, each layer of shell needs to undergo a high-temperature welding process; when stacking the packages, in order to ensure that the solder balls welded at the previous time will not melt and deform during the next welding, the temperature of the next welding is lower than that of the previous welding to form a temperature gradient, or the heating time during the next welding needs to be strictly controlled to prevent the solder balls welded at the previous time from melting and deforming. Due to the limitation of the process, the more the number of stacked layers in the traditional scheme is, the more the required temperature gradient is, the greater the assembly difficulty is, and the lower the yield is. The three-dimensional stacking method provided by the invention reduces the temperature gradient during assembly, only needs to undergo a high-temperature welding process in the whole assembly process, greatly simplifies the process requirements during assembly, and improves the yield.
Drawings
FIG. 1 is a schematic cross-sectional view of an embodiment of the present invention;
FIG. 2 is a schematic top view of an embodiment of the present invention;
FIG. 3 is a schematic bottom view of an embodiment of the present invention;
fig. 4 is an exploded view of the structure of an embodiment of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments.
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Referring to fig. 1 to 4, the radio frequency front end three-dimensional integrated structure of the embodiment constructs an HTCC high temperature co-fired ceramic tube (1) with three layers of cavities, the ceramic tube adopts a ceramic quadrilateral flat package CQFP form (10), the inside of the tube constructs an interlayer interconnection transmission line, an exposed bonding pad (11) is reserved on the top of the tube and is used for welding a third-stage functional circuit module (9), and a first-stage radio frequency functional circuit (5) and a second-stage radio frequency functional circuit sub-package module (6) are installed inside the ceramic tube (1) according to the sequence from bottom to top. After the two-stage circuit assembly is completed, a Kovar cover plate (8) is welded on an annular welding ring (13) reserved at the top of the ceramic tube shell in a parallel seam welding mode so as to seal the cavity structure of the tube shell. And finally, welding a third-stage functional circuit (9) on the pad which is exposed from the top of the ceramic tube shell to complete the assembly of the three-dimensional radio frequency microsystem.
The first-stage radio frequency functional circuit (5) is directly designed at the bottom of the first-layer cavity (2) at the bottom of the ceramic tube shell. When the cavity is processed, a special filling and hydraulic pressure control technology is used, so that the height of the processed cavity can be larger than 1.5mm, and besides a bare chip, a tape packaging component and an SMT surface mounting component can be mounted.
The second-level radio frequency functional circuit sub-packaging module adopts an independent assembly mode, firstly required radio frequency elements are welded on a packaging substrate or installed by adopting a micro-assembly process, then a Kovar shielding cover with a plurality of cavity structures is pasted and fixed on the packaging substrate by using conductive adhesive, and a metal disc for electrical connection is designed below the packaging substrate. In this embodiment, a large number of SMT surface mount components and bare chips are mounted on a single substrate.
And after the second-stage radio frequency functional circuit sub-packaging module (6) is assembled and the function and performance test is finished by using a special test fixture, the second-stage radio frequency functional circuit sub-packaging module is inverted in the second-layer cavity (2) of the ceramic tube shell (1). Before installing second level radio frequency function circuit sub-packaging module (6), evenly paint the conducting resin on the plane of ceramic tube second floor cavity bottom (14) and sub-packaging module shield cover contact, use special frock to exert suitable holding down force to second level radio frequency function circuit sub-packaging module (6), guarantee sub-packaging module's front shield cover (4) with the second level cavity bottom (14) of ceramic tube closely laminate, later place tube and special frock together in programme-controlled incubator heat and bake, make the conducting resin solidification, accomplish sub-packaging module and ceramic tube's fixed. After the two are assembled, the bottom surface of the substrate of the sub-packaging module is flush with the bottom surface of the third-stage cavity of the ceramic tube shell. And a metal disc (12) for electrical connection is designed on the bottom surface of the third layer cavity of the ceramic tube shell and at a position corresponding to the bottom metal disc of the sub-packaging module, and the bottom metal disc (15) of the sub-packaging module is connected with the bottom metal disc (12) of the third layer cavity of the ceramic tube shell by using a bonding gold wire so as to realize the electrical connection between the second-level radio frequency functional circuit sub-packaging module and the ceramic tube shell.
After the ceramic tube shells of the two stacked layers of radio frequency functional modules use a special test fixture to complete the function and performance index test, a Kovar cover plate (8) is welded on an annular welding ring (13) reserved at the top of the ceramic tube shell in a parallel seam welding mode above the secondary radio frequency functional sub-packaging module (6) so as to seal the cavity structure of the tube shell.
After the ceramic tube shell after gas-tight seam welding is subjected to leak detection, a proper amount of high-temperature soldering paste is printed on a bonding pad (11) at the top of the ceramic tube shell through a steel mesh, then a third-stage functional circuit module (9) is stacked above the ceramic tube shell, and the ceramic tube shell and the third-stage functional circuit module are welded together in a welding mode, so that the assembly of the whole three-dimensional stacked radio frequency micro-system is completed. Because the parallel seal welding cover plate of the ceramic tube shell protrudes out of the ceramic tube shell by about 0.5mm, a blind groove (16) with the depth of 0.5mm is reserved at the bottom of the third-stage functional circuit module substrate, and when the third-stage functional circuit module is welded above the ceramic tube shell, the third-stage functional circuit module does not interfere with the seal cover of the ceramic tube shell. In addition, copper foils (17) and a large number of metal through holes (18) are laid in the blind grooves of the third-stage functional circuit substrate, so that the heat inside the third-stage functional circuit module is conducted to the kovar sealing cover of the ceramic tube shell, and the heat dissipation performance of the third-stage radio frequency functional sub-module is improved. The exposed bonding pad reserved on the side wall of the third-level functional circuit is convenient to be manually welded with the bonding pad on the top of the ceramic tube shell, the whole packaging structure only needs to be slightly preheated during welding, high-temperature baking is not needed, and the temperature gradient during assembly can not be increased.
After the assembled module is subjected to functional performance test by using a special test tool, the module can be assembled and generated through a quality inspection process.
It will be understood by those skilled in the art that the foregoing is not intended to limit the invention, and although the invention has been described in detail with reference to the foregoing examples, those skilled in the art will recognize that changes may be made in the form and details of the embodiments described in the foregoing examples, or that equivalents may be substituted for elements thereof. All modifications, equivalents and the like which come within the spirit and principle of the invention are intended to be included within the scope of the invention.
Claims (5)
1. A radio frequency front end three-dimensional integrated structure is characterized by comprising an HTCC high-temperature co-fired ceramic tube shell (1) with a three-layer step cavity, wherein the ceramic tube shell adopts a ceramic quadrilateral flat package CQFP form (10), and an exposed bonding pad (11) for welding a third-level functional circuit module (9) is reserved at the top of the ceramic tube shell; an interlayer interconnection transmission line is constructed in the ceramic tube shell;
a first-stage radio frequency functional circuit (5) and a second-stage radio frequency functional circuit sub-packaging module (6) are arranged in a first-layer step cavity and a second-layer step cavity of the ceramic tube shell according to the sequence from bottom to top; the second-level radio frequency functional circuit sub-packaging module (6) is inversely arranged in the second-level step cavity, the front metal shielding cover (4) of the second-level radio frequency functional circuit sub-packaging module (6) is attached to the step surface (14) of the second-level step cavity (3) of the ceramic tube shell, and the bottom substrate of the second-level radio frequency functional circuit sub-packaging module (6) is flush with the step surface of the third-level step cavity (7) of the ceramic tube shell;
a first metal disc (15) for electrical connection is arranged on a substrate at the bottom of the second-stage radio frequency functional circuit sub-packaging module (6), a second metal disc (12) for electrical connection is arranged at a position corresponding to a third step surface of a third-layer step cavity (7) of the ceramic tube shell (1), and a bonding gold wire connects the first metal disc (15) at the bottom of the second-stage radio frequency functional circuit sub-packaging module (6) with the second metal disc (12) at the third-layer step surface of the ceramic tube shell;
and a Kovar cover plate (8) is welded on an annular welding ring (13) reserved at the top of the ceramic tube shell by using a parallel seam welding mode above the second-stage radio frequency functional sub-packaging module (6) to seal a step cavity of the ceramic tube shell (1), and a third-stage functional circuit module (9) is brazed on an exposed bonding pad (11) reserved on the upper surface of the ceramic tube shell.
2. The three-dimensional integrated structure of the radio frequency front end according to claim 1, characterized in that the second-stage rf functional sub-package module (6) is covered with a metal shielding cover (4) made of kovar material, the metal shielding cover (4) made of kovar material is installed as a supporting structure of the second-stage step cavity (3) of the ceramic package as the second-stage rf functional sub-package module (6), and the kovar material is used to ensure the thermal expansion coefficient matching between the two assembled components.
3. The three-dimensional integrated structure of a radio frequency front end as claimed in claim 2, wherein after the second stage radio frequency functional sub-package module (6) is mounted inside the ceramic tube, the metal shielding cover (4) is used as an electromagnetic shielding structure for the first stage radio frequency functional circuit (5).
4. The radio frequency front-end three-dimensional integrated structure according to claim 1, wherein a square blind groove (16) is reserved at the bottom of the third-stage functional circuit module, when the square blind groove is welded on the upper surface of the ceramic tube shell, the square blind groove does not interfere with the ceramic tube shell cover, meanwhile, a copper foil (17) and a metalized through hole (18) are laid inside the square blind groove, and the heat inside the third-stage functional circuit module is conducted to the ceramic tube shell Kovar cover plate (8) so as to improve the heat dissipation performance of the third-stage functional circuit module (9).
5. The radio frequency front end three-dimensional integrated structure according to claim 1, wherein the second stage radio frequency functional sub-package module (6) is fixed to the ceramic package (1) by a high temperature cured conductive adhesive, the conductive adhesive is used for structural fixation and ground shielding of the second stage radio frequency functional sub-package module and the ceramic package, the curing temperature is lower than the device soldering temperature, and only one temperature gradient is required for assembling the three-dimensional integrated structure.
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| CN202210917861.0A CN115274568A (en) | 2022-08-01 | 2022-08-01 | Radio frequency front end three-dimensional integrated structure |
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| CN202210917861.0A CN115274568A (en) | 2022-08-01 | 2022-08-01 | Radio frequency front end three-dimensional integrated structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117316837A (en) * | 2023-11-29 | 2023-12-29 | 武汉大学 | Vacuum interconnection equipment and digital twin system for wafer hybrid bonding process |
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2022
- 2022-08-01 CN CN202210917861.0A patent/CN115274568A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117316837A (en) * | 2023-11-29 | 2023-12-29 | 武汉大学 | Vacuum interconnection equipment and digital twin system for wafer hybrid bonding process |
| CN117316837B (en) * | 2023-11-29 | 2024-03-08 | 武汉大学 | Hybrid bonding continuity simulation model establishment method, system and equipment |
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