CN203658528U

CN203658528U - Photoelectric testing apparatus for LED packaging

Info

Publication number: CN203658528U
Application number: CN201320730000.8U
Authority: CN
Inventors: 代克明
Original assignee: SHENZHEN EMPIRE TECHNOLOGY Co Ltd
Current assignee: SHENZHEN EMPIRE TECHNOLOGY Co Ltd
Priority date: 2013-11-18
Filing date: 2013-11-18
Publication date: 2014-06-18
Anticipated expiration: 2023-11-18

Abstract

The utility model, which belongs to the LED processing field, discloses a photoelectric testing apparatus for LED packaging. The photoelectric testing apparatus comprises an assembling-disassembling pedestal; two parallel inner material box clamps are vertically arranged at the assembling-disassembling pedestal; two material box clamp connecting tracks extend vertically from the outer sides of the two inner material box clamps; and two outer material box clamps are fixed at the two material box clamp connecting tracks. The two inner material box clamps and the two outer material box clamps form a material box channel with a material box arranged downwardly; a material box rack is arranged in the material box channel by a sliding way and particularly, is arranged at a lead screw between the inner material box clamps; and the lead screw is driven by a drive device to drive the material box rack to slide up and down in the material box channel. The material blanking space that is larger than the material box height is formed between the lower ends of the outer material box clamps and the assembling-disassembling pedestal. The provided apparatus has the advantage of being capable of carrying out photoelectric testing on an LED chip intelligently.

Description

The opto-electronic testing apparatus of LED encapsulation

Technical field

The utility model relates to LED manufacture field, especially relates to a kind of opto-electronic testing apparatus that can carry out intelligently the LED encapsulation of photoelectricity test to LED chip.

Background technology

In recent years, along with the development of LED industry, the application aspect of material, chip, encapsulation and LED illumination has formed an industrial chain with high content of technology, market outlook are wide, and especially high-power, high-brightness LED module has become international semiconductor illumination and shown the hot spot for competition in field.

A new generation's great power LED module packaging technical and equipment are manufactured the research emphasis of Ge great LED leading enterprise and research institution in the world especially, and its barrier in the core technology of high-power, high-brightness LED industry development is shaped gradually.LED packaging technology is the accurate assembly technology of the one of chip attach is fixing and seal protection.LED sealed in unit comprises a set of production technologies such as cleaning, die bond, die bond baking, bonding wire, dot fluorescent powder, mounted lens, embedding lens, testing package; Its core is die bond and bonding (bonding wire) technique.Aspect the chip manufacturing of LED, tube core (module) encapsulation and product apply three, packaging technology and equipment are closer to market, more direct to the impetus of industry.Wherein, eutectic solder technology is one of core technology of crux the most in upside-down mounting high-power LED chip package technique of future generation, and the quality of eutectic welding technology can directly have influence on luminescence efficiency, life-span, heat dispersion and the end product quality of great power LED module.Packaged LED because quantity is larger, must will have a kind of instrument of automatically full test in the time testing.

Summary of the invention

The utility model object is to provide a kind of opto-electronic testing apparatus that can carry out intelligently the LED encapsulation of photoelectricity test to LED chip.

The utility model is realized by following technical measures, a kind of opto-electronic testing apparatus of LED encapsulation, comprise testing base, described testing base is provided with test tracks, in described test tracks, slide and be provided with testing jig, the top, middle part of described test tracks is across being provided with an integrating sphere device for optical measurement, described testing jig top is provided with a test board parallel with test tracks, on described test board, be laid with multiple test syringe needles, described testing jig top is provided with at least three semi-girders of vertical checkout plate, the free end of each semi-girder is equipped with and is positioned at conplane barb, between the plane that the plane that described barb forms and test syringe needle form, can block and establish ceramics bracket, when described ceramics bracket is fastened between barb and test syringe needle, the pad of described test syringe needle and ceramics bracket bottom is corresponding and electric connection one by one, described testing jig is slidably to the thieff hatch of the bottom of integrating sphere device.

As a kind of optimal way, described semi-girder is to be arranged on four of four jiaos of test boards.

As a kind of optimal way, described testing jig is driven and is slided in test tracks by a testing of electric motors.

As a kind of optimal way, in described testing jig, be provided with testing host, described testing host is electrically connected each test syringe needle.

As a kind of optimal way, on described testing jig, be provided with the communication port that is electrically connected testing host.

Integrating sphere is the hollow ball with highly reflective inside surface, is used for to being placed in ball or ball is outer and near the scattered light of the sample at thief hatch place or a kind of high-level efficiency device that utilizing emitted light is collected.Collected light, after integrating sphere internal integral, is transformed into simulating signal by detector by light signal, after sampling, amplifying, converts digital signal to through A/D, obtains afterwards as calculated light flux values.

The ceramics bracket that has welded chip is fastened between barb and test syringe needle, now test the pad corresponding and electric connection one by one of syringe needle and ceramics bracket bottom, in the time that testing jig slides in the thieff hatch of bottom of integrating sphere device, chip on ceramics bracket is lighted successively by testing syringe needle, by calculating its light flux values, thereby form the photoelectricity test report of each chip.The utility model test syringe needle is lighted successively the LED of required test in integrating sphere device, need not manually intervene by other, thereby can carry out photoelectricity test to LED chip intelligently.

Accompanying drawing explanation

Fig. 1 is the structural representation of the utility model embodiment;

Fig. 2 is the C partial enlarged drawing of Fig. 1.

Embodiment

Below in conjunction with embodiment and contrast accompanying drawing the utility model is described in further detail.

A kind of opto-electronic testing apparatus of LED encapsulation, with reference to figure 1 and Fig. 2, comprise testing base 502, in described testing base 502, be provided with test tracks 504, in described test tracks 504, slide and be provided with testing jig 507, the top, middle part of described test tracks 504 is across being provided with an integrating sphere device 501 for optical measurement, described testing jig 507 tops are provided with a test board 510 parallel with test tracks 504, on described test board 510, be laid with multiple test syringe needles 511, described testing jig 507 tops are provided with four semi-girders 509 of vertical checkout plate, the free end of four semi-girders 509 is equipped with and is positioned at conplane barb, between the plane that the plane that described barb forms and test syringe needle 511 form, can block and establish ceramics bracket 300, when described ceramics bracket 300 is fastened between barb and test syringe needle 511, the pad of described test syringe needle 511 and ceramics bracket 300 bottoms is corresponding and be electrically connected one by one, described testing jig 507 is slidably to the thieff hatch of the bottom of integrating sphere device 501.The ceramics bracket 300 that has welded chip 100 is fastened between barb and test syringe needle 511, the pad of now testing syringe needle 511 and ceramics bracket 300 bottoms is corresponding and be electrically connected one by one, in the time that testing jig 507 slides in the thieff hatch of bottom of integrating sphere device 501, chip 100 on ceramics bracket 300 is lighted successively by test syringe needle 511, by calculating its light flux values, thereby form the photoelectricity test report of each chip.

The opto-electronic testing apparatus of LED encapsulation of the present utility model, with reference to figure 1 and Fig. 2, on the basis of previous technique scheme, specifically testing jig 507 is driven and is slided in test tracks 504 by a testing of electric motors 503.

The opto-electronic testing apparatus of LED encapsulation of the present utility model with reference to figure 1 and Fig. 2, is specifically provided with testing host (not shown) in testing jig 507 on the basis of previous technique scheme, and described testing host is electrically connected each test syringe needle 511.For controlling the energising order of each test syringe needle.

The opto-electronic testing apparatus of LED encapsulation of the present utility model with reference to figure 1 and Fig. 2, is specifically provided with the communication port 508 that is electrically connected testing host on testing jig on the basis of previous technique scheme.For being connected with extraneous control device.

More than that the opto-electronic testing apparatus of the utility model LED encapsulation is set forth; be used for helping to understand the utility model; but embodiment of the present utility model is not restricted to the described embodiments; anyly do not deviate from the change done under the utility model principle, modification, substitute, combination, simplify; all should be equivalent substitute mode, within being included in protection domain of the present utility model.

Claims

1. the opto-electronic testing apparatus of a LED encapsulation, it is characterized in that: comprise testing base, described testing base is provided with test tracks, in described test tracks, slide and be provided with testing jig, the top, middle part of described test tracks is across being provided with an integrating sphere device for optical measurement, described testing jig top is provided with a test board parallel with test tracks, on described test board, be laid with multiple test syringe needles, described testing jig top is provided with at least three semi-girders of vertical checkout plate, the free end of each semi-girder is equipped with and is positioned at conplane barb, between the plane that the plane that described barb forms and test syringe needle form, can block and establish ceramics bracket, when described ceramics bracket is fastened between barb and test syringe needle, the pad of described test syringe needle and ceramics bracket bottom is corresponding and electric connection one by one, described testing jig is slidably to the thieff hatch of the bottom of integrating sphere device.

2. the opto-electronic testing apparatus of LED encapsulation according to claim 1, is characterized in that: described semi-girder is to be arranged on four of four jiaos of test boards.

3. the opto-electronic testing apparatus that LED encapsulates according to claim 1, is characterized in that: described testing jig is driven and slided in test tracks by a testing of electric motors.

4. the opto-electronic testing apparatus that LED encapsulates according to claim 1, is characterized in that: in described testing jig, be provided with testing host, described testing host is electrically connected each test syringe needle.

5. the opto-electronic testing apparatus that LED encapsulates according to claim 4, is characterized in that: on described testing jig, be provided with the communication port that is electrically connected testing host.