CN104600016B - Flip LED chips positioning package equipment - Google Patents
Flip LED chips positioning package equipment Download PDFInfo
- Publication number
- CN104600016B CN104600016B CN201410806003.4A CN201410806003A CN104600016B CN 104600016 B CN104600016 B CN 104600016B CN 201410806003 A CN201410806003 A CN 201410806003A CN 104600016 B CN104600016 B CN 104600016B
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- CN
- China
- Prior art keywords
- nozzle part
- substrate
- suction nozzle
- led chips
- flip led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
The flip LED chips positioning package equipment of the present invention, including：Support platform；Chip apparatus for placing, is placed in support platform, and places LED chip；Substrate apparatus for placing, is placed in support platform, and places substrate；And mobile support, moved in support platform；Mobile support includes：The cross bar of strut piece and connection strut piece；Suction nozzle part, around cross bar rotation or transverse shifting；Control device, mobile support movement and suction nozzle part is controlled to rotate.Using this programme flip LED chips positioning package equipment, mobile support movement and suction nozzle part is controlled to rotate by control device, control device controls mobile support to be moved to the overhead of corresponding LED chip, and pick up LED chip automatically by suction nozzle part according to default LED chip position data.Then, according to default substrate position data, the LED chip for determining to choose is placed at substrate position to be welded, completes the moving operation of full-automation.
Description
Technical field
The present invention relates to flip LED encapsulation technology field, more particularly to a kind of flip LED chips positioning package equipment.
Background technology
LED (Light Emitting Diode), light emitting diode, it is that a kind of can convert electrical energy into consolidating for visible ray
The semiconductor devices of state.LED can be finally applied in daily life, it is necessary to be packaged to LED.For different LED cores
Chip architecture, there is different modes, flip LED encapsulates especially specific encapsulation scheme,
The structures such as the encapsulation of flip LED at present, including encapsulating compound, wire, substrate, while a variety of packaging process are also needed to,
Such as silk-screen printing etc..
But in the welding process of LED chip, the degree automated at present is also relatively low, continues to improve.
The content of the invention
Based on this, a kind of higher flip LED chips positioning package equipment of automaticity is provided with.
A kind of flip LED chips positioning package equipment, including：Support platform；Chip apparatus for placing, it is placed on the support
On platform, and place LED chip；Substrate apparatus for placing, it is placed in the support platform, and places substrate；And mobile branch
Frame, moved in the support platform；The mobile support includes：Strut piece and the cross bar for connecting the strut piece；Suction nozzle part,
Around the cross bar rotation or transverse shifting；Control device, the control mobile support movement and the suction nozzle part rotate.
In one of the embodiments, the other end installation solder shower nozzle part of the suction nozzle part, the control system control
The solder shower nozzle part is made to rotate.
In one of the embodiments, fixture, the fixture fixed substrate are set in the substrate apparatus for placing.
In one of the embodiments, the substrate apparatus for placing bottom sets heating member, heats substrate.
In one of the embodiments, the fixture is provided with optical sensor, and the sensor connects with the control device
Connect.
In one of the embodiments, the suction nozzle part is provided with generating laser.
In one of the embodiments, the chip apparatus for placing opens up multiple grooves, and the flip LED chips are placed on
In the groove.
In one of the embodiments, the edge track of the support platform, the bottom of the mobile support are set
Pulley, the mobile support move along the track.
Using this programme flip LED chips positioning package equipment, mobile support movement and suction nozzle are controlled by control device
Part rotates, and control device is moved to the overhead of corresponding LED chip according to default LED chip position data, the mobile support of control,
And LED chip is picked up by suction nozzle part automatically.Then, according to default substrate position data, the LED chip for determining to choose is put
Put at substrate position to be welded, complete the moving operation of full-automation.
Brief description of the drawings
Fig. 1 is the schematic diagram of the flip LED chips positioning package equipment of an embodiment；
Fig. 2 is the schematic diagram of the chip apparatus for placing of Fig. 1 flip LED chips positioning package equipment；
Fig. 3 is the schematic diagram of the substrate apparatus for placing of Fig. 1 flip LED chips positioning package equipment.
Embodiment
With reference to embodiment and accompanying drawing, flip LED chips positioning package equipment is described in further detail.
With reference to accompanying drawing 1~3, an embodiment flip LED chips positioning package equipment, including：Support platform, chip are placed
Device, substrate apparatus for placing, mobile support and control device (not shown).
Support platform, it is horizontal working top, plays a part of support.
Chip apparatus for placing, is placed in support platform, and places LED chip.In the present embodiment, place and fill in chip
Put and open up multiple grooves, the groove size matches with LED chip size.And the LED chip with welded encapsulation be placed on it is recessed
The direction of groove, electrode cathode and anode directions are consistent.
Substrate apparatus for placing, is placed in support platform, and places substrate.In the present embodiment, substrate is a piece of tape welding
The substrate connect, naturally it is also possible to be that the substrate fixed by multiple in the same size, positional informations forms substrate film.
In addition, setting fixture in substrate apparatus for placing, the fixture is that substrate is diagonally set, can flexible clamping welding
Substrate.Further, fixture is provided with optical sensor, and the optical sensor is connected with control device.
In other embodiments, substrate apparatus for placing bottom sets heating member (not shown), heats substrate.It can be heated
Substrate can be the high temperature resistants such as ceramic substrate, aluminium base, copper base, transcalent substrate.And heating member can be temperature controllable
Heater strip of degree etc..
Mobile support, is moved in support platform.Specifically, mobile support includes：Strut piece, the cross bar for connecting strut piece
And the suction nozzle part rotated around cross bar.Strut piece forms the structure at a similar gantry with connection strut piece, can be in support platform
Move back and forth, suction nozzle part can slide laterally around connection strut piece rotation and along strut piece, pass through the mutual of strut piece and suction nozzle part
Coordinate, the optional position that suction nozzle part can be moved to where chip apparatus for placing institute chip placement.
In the present embodiment, the edge track of support platform, the bottom of mobile support set pulley, mobile support edge
The track movement so that mobile support moves more smoothly.
Control device, mobile support movement and suction nozzle part is controlled to rotate.Specifically, control device includes computer and transmission
Actuating unit, according to default LED chip position data, the mobile support of computer control is moved to the overhead of corresponding LED chip,
And LED chip is picked up by suction nozzle part automatically.Then, according to default substrate position data, the LED chip for determining to choose is put
Put at substrate position to be welded, complete the moving operation of full-automation.
In one embodiment, the other end installation solder shower nozzle part of suction nozzle part, control system control the solder shower nozzle
Part rotates.Specifically, suction nozzle part is connected as a single entity with shower nozzle part, and sets up separately at both ends.Moved when the LED chip for determining to need to connect
Move to substrate overhead, the computer of control system and send control instruction, the control shower nozzle part rotation of controlling transmission actuating unit is simultaneously right
The heating member heating of substrate solder application, then control base board apparatus for placing bottom, melts solder；Then control system uses
Identical mode controls suction nozzle part to rotate, and the LED chip of band connection is pressed to corresponding substrate position.Finally, band solder
Cooling, completes the fixation of chip.Using this programme, cleverly suction nozzle part and shower nozzle part are connected as a single entity, quickly finish chip
Welding and fixed, raising production efficiency.
In one embodiment, suction nozzle part is provided with generating laser, at mobile suction nozzle part to the substrate of welding, due to solid
Determine to set optical sensor at the fixture of substrate, when optical sensor gets the laser by laser transmitter projects, i.e. control fills
The information for getting accurate positioning is put, control device control shower nozzle part solder application and control suction nozzle part push LED chip, realized
Last encapsulation.Due to having obtained first accurate substrate position information, then the batch or substrate of the same size exist
The position of the fixture of substrate apparatus for placing is identical, achieves that batch is accurately positioned by a laser positioning.Can be with
Understand, generating laser can set generating laser at shower nozzle part.
But be consistent for LED chip to be welded, but substrate to be welded is just not necessarily consistent, especially not
It is often all different with the size of the substrate of batch, therefore only need to determine the substrate of different batches using the laser positioning of this programme
Position is once.
In one embodiment, the LED chip placed on chip apparatus for placing, optical sensor can also be set, pass through suction
Head accurately obtains LED chip position provided with generating laser, wrong in the positional information or information of Non-precondition LED chip
When, LED chip also can be accurately drawn onto, reduces error rate in production process.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
- A kind of 1. flip LED chips positioning package equipment, it is characterised in that including：Support platform；Chip apparatus for placing, it is placed in the support platform, and places LED chip, the chip apparatus for placing opens up multiple Groove, the flip LED chips are placed in the groove；Substrate apparatus for placing, it is placed in the support platform, and places substrate；AndMobile support, is moved in the support platform；The mobile support includes：Strut piece and the horizontal stroke for connecting the strut piece Bar；Suction nozzle part, around the cross bar rotation or transverse shifting；Control device, the control mobile support movement and the suction nozzle part rotate；Wherein, the other end installation solder shower nozzle part of the suction nozzle part, the control device control the solder shower nozzle part to turn Dynamic, the suction nozzle part is connected as a single entity with the solder shower nozzle part, and sets up separately at both ends.
- 2. flip LED chips positioning package equipment according to claim 1, it is characterised in that the substrate apparatus for placing Interior setting fixture, the fixture fixed substrate.
- 3. flip LED chips positioning package equipment according to claim 2, it is characterised in that the substrate apparatus for placing Bottom sets heating member, heats substrate.
- 4. flip LED chips positioning package equipment according to claim 3, it is characterised in that the fixture is provided with light Sensor, the sensor are connected with the control device.
- 5. flip LED chips positioning package equipment according to claim 4, it is characterised in that the suction nozzle part, which is provided with, to swash Optical transmitting set.
- 6. flip LED chips positioning package equipment according to claim 1, it is characterised in that the side of the support platform Edge opens up track, and the bottom of the mobile support sets pulley, and the mobile support moves along the track.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410806003.4A CN104600016B (en) | 2014-12-18 | 2014-12-18 | Flip LED chips positioning package equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410806003.4A CN104600016B (en) | 2014-12-18 | 2014-12-18 | Flip LED chips positioning package equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104600016A CN104600016A (en) | 2015-05-06 |
| CN104600016B true CN104600016B (en) | 2017-12-22 |
Family
ID=53125704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410806003.4A Active CN104600016B (en) | 2014-12-18 | 2014-12-18 | Flip LED chips positioning package equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104600016B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102416621B1 (en) | 2015-08-31 | 2022-07-05 | 삼성디스플레이 주식회사 | A light emitting diode transfer |
| KR102426709B1 (en) * | 2016-02-23 | 2022-07-29 | 삼성디스플레이 주식회사 | Apparatus and method for transferring light emitting diode |
| US10211363B2 (en) | 2017-02-21 | 2019-02-19 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Transfer printing template and transfer printing device of micro light-emitting diode |
| CN106903978B (en) * | 2017-02-21 | 2019-01-11 | 深圳市华星光电技术有限公司 | Transfer the transfer device of template and micro- light emitting diode |
| TWI667728B (en) * | 2017-10-30 | 2019-08-01 | Industrial Technology Research Institute | Chip bonding apparatus, chip bonding method and a chip package structure |
| CN108421999A (en) * | 2018-02-07 | 2018-08-21 | 广州方阁建筑工程技术开发有限公司 | A kind of novel slick boring device |
| CN108436125A (en) * | 2018-02-07 | 2018-08-24 | 广州方阁建筑工程技术开发有限公司 | A kind of slick boring device |
| CN108405896A (en) * | 2018-02-07 | 2018-08-17 | 广州方阁建筑工程技术开发有限公司 | A kind of modified slick boring device |
| CN113284429B (en) * | 2021-05-13 | 2023-06-16 | 深圳市幻真科技有限公司 | LED assembly for mounting display screen |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202839576U (en) * | 2012-09-17 | 2013-03-27 | 东莞华中科技大学制造工程研究院 | Bonding head of LED flip chip bonding machine |
| CN203787388U (en) * | 2014-04-03 | 2014-08-20 | 日月光半导体（昆山）有限公司 | Semiconductor device packaging system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8870051B2 (en) * | 2012-05-03 | 2014-10-28 | International Business Machines Corporation | Flip chip assembly apparatus employing a warpage-suppressor assembly |
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2014
- 2014-12-18 CN CN201410806003.4A patent/CN104600016B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202839576U (en) * | 2012-09-17 | 2013-03-27 | 东莞华中科技大学制造工程研究院 | Bonding head of LED flip chip bonding machine |
| CN203787388U (en) * | 2014-04-03 | 2014-08-20 | 日月光半导体（昆山）有限公司 | Semiconductor device packaging system |
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| Publication number | Publication date |
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| CN104600016A (en) | 2015-05-06 |
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