CN103769778A - Eutectic welding platform for LED packaging - Google Patents
Eutectic welding platform for LED packaging Download PDFInfo
- Publication number
- CN103769778A CN103769778A CN201310578958.4A CN201310578958A CN103769778A CN 103769778 A CN103769778 A CN 103769778A CN 201310578958 A CN201310578958 A CN 201310578958A CN 103769778 A CN103769778 A CN 103769778A
- Authority
- CN
- China
- Prior art keywords
- support
- outside track
- inner orbit
- eutectic welding
- welding stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention relates to the field of LED machining, and discloses a eutectic welding platform for LED packaging. The eutectic welding platform comprises a machine base, an inner track and an outer track are arranged on the machine base in parallel, a support slides on the inner track and the outer track, an electromagnetic heating device is arranged below the part between the inner track and the outer track, and a welding carrying suction nozzle corresponding to the electromagnetic heating device is arranged above the part between the inner track and the outer track. The eutectic welding platform has the advantage that electromagnetic waves are adopted to perform fast heat to carry out chip eutectic welding.
Description
Technical field
The present invention relates to LED manufacture field, especially relate to a kind of eutectic welding stage that adopts the LED encapsulation that electromagnetic wave Fast Heating carries out eutectic welding chip.
Background technology
In recent years, along with the development of LED industry, the application aspect of material, chip, encapsulation and LED illumination has formed an industrial chain with high content of technology, market prospects are wide, and especially high-power, high-brightness LED module has become international semiconductor illumination and shown the hot spot for competition in field.
A new generation's great power LED module packaging technical and equipment are manufactured the research emphasis of Ge great LED leading enterprise and research institution in the world especially, and its barrier in the core technology of high-power, high-brightness LED industry development is shaped gradually.LED packaging technology is the accurate assembly technology of the one of chip attach is fixing and seal protection.LED sealed in unit comprises a set of production technologies such as cleaning, die bond, die bond baking, bonding wire, dot fluorescent powder, mounted lens, embedding lens, testing package; Its core is die bond and bonding (bonding wire) technique.Aspect the chip manufacturing of LED, tube core (module) encapsulation and product apply three, packaging technology and equipment are closer to market, more direct to the impetus of industry.Wherein, eutectic solder technology is one of core technology of crux the most in upside-down mounting high-power LED chip package technique of future generation, and the quality of eutectic welding technology can directly have influence on luminous efficiency, life-span, heat dispersion and the end product quality of great power LED module.
Summary of the invention
The object of the invention is to provide a kind of eutectic welding stage that adopts the LED encapsulation that electromagnetic wave Fast Heating carries out eutectic welding chip.
The present invention realizes by following technical measures, a kind of eutectic welding stage of LED encapsulation, comprise support, on described support, be arranged with the inner orbit and the outside track that slide for support in parallel, below between described inner orbit and outside track is provided with electromagnetic heater, be provided with welding carrying suction nozzle corresponding to electromagnetic heater on described inner orbit and outside track.
As a kind of optimal way, on described support, be provided with conveyor frame, in described conveyor frame, be arranged with the inner orbit and the outside track that slide for support in parallel, described inner orbit slides and is provided with material loading conveyance pawl near one end of support charging crane, the other end of described inner orbit slides and is provided with feeding conveyance pawl and feeding rod, and described material loading conveyance pawl and feeding conveyance pawl are strip shape gob that can folding.
As a kind of optimal way, the corresponding material loading conveyance pawl of described outside track place is provided with charging resistance gauge, and the corresponding feeding conveyance pawl of described outside track place is provided with feeding resistance gauge.
As a kind of optimal way, described inner orbit and outside track are positioned at welding stage place across being provided with welding compressing tablet, are set to the bar-shaped trough entering for chip in the middle of described welding compressing tablet.
As a kind of optimal way, in described conveyor frame, be provided with the inner orbit Y-axis motor that drives inner orbit translation and the outside track Y-axis motor that drives outside track translation.
As a kind of optimal way, described support is ceramics bracket.
As a kind of optimal way, slide and be provided with the welding bench of Motionless electromagnetic heater in described support top, the heater Z axis motor that drives electromagnetic heater to move up and down is installed on described welding bench, the eutectic welding stage X-axis motor and the eutectic welding stage Y-axis motor that drive welding bench translation are all around installed on described support.
As a kind of optimal way, on described support, be provided with the upper and lower change gear of support conveyance.
As a kind of optimal way, on described inner orbit and outside track, be provided with chips welding corresponding to electromagnetic heater detects CCD camera lens.
As a kind of optimal way, described chips welding detects on CCD camera lens and is provided with the coaxial lens barrel of CCD, and the coaxial lens barrel side of described CCD is also provided with CCD fine setting micrometer and CCD coaxial-illuminating light source.
The present invention delivers to electromagnetic heater by blank support between inner orbit and outside track, carry out after preheating, welding carrying suction nozzle is placed on the chip locating the relevant position of support, by electromagnetic heater, chip is welded, utilize nitrogen to carry out fast coolingly by feeding conveyance pawl, the support that welds chip being delivered to next operation again.The present invention adopts electromagnetic wave Fast Heating to carry out eutectic welding chip.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention.
The specific embodiment
Below in conjunction with embodiment and contrast accompanying drawing the present invention is described in further detail.
A kind of eutectic welding stage of LED encapsulation, with reference to figure 1, comprise support 704, on described support 704, be arranged with the inner orbit 610 and the outside track 607 that slide for support 300 in parallel, below between described inner orbit 610 and outside track 607 is provided with electromagnetic heater 701, be provided with welding carrying suction nozzle 215 corresponding to electromagnetic heater 701 on described inner orbit 610 and outside track 607.Blank support 300 is delivered to electromagnetic heater 701 between inner orbit 610 and outside track 607, carry out after preheating, welding carrying suction nozzle 215 is placed on the chip locating the relevant position of support 300, by electromagnetic heater 701, chip is welded, utilize nitrogen to carry out fast coolingly by feeding conveyance pawl 604, the support that welds chip being delivered to next operation again.
The eutectic welding stage of LED encapsulation of the present invention, with reference to figure 1, on the basis of previous technique scheme, specifically on support 704, be provided with conveyor frame 609, in described conveyor frame 609, be arranged with the inner orbit 610 and the outside track 607 that slide for support 300 in parallel, described inner orbit 610 slides and is provided with material loading conveyance pawl 601 near one end of support charging crane, the other end of described inner orbit 610 slides and is provided with feeding conveyance pawl and feeding rod 604 and feeding rod 605, and described material loading conveyance pawl 601 and feeding conveyance pawl 604 are strip shape gob that can folding.Utilize the strip shape gob of material loading conveyance pawl 601 can stably clamp the support 300 of being sent here by support charging crane, electromagnetic heater 701 places delivered to by support 300 by material loading conveyance pawl 601, after by electromagnetic heater 701, chip being welded, delivers to next operation again by feeding conveyance pawl 604.
The eutectic welding stage of LED encapsulation of the present invention, with reference to figure 1, on the basis of previous technique scheme, specifically the corresponding material loading conveyance of outside track 607 pawl 601 places are provided with charging resistance gauge 602, and described outside track 607 corresponding feeding conveyance pawl 604 places are provided with feeding resistance gauge 606.Charging resistance gauge 602 and feeding resistance gauge 606, for making support 300 be fitted in outside track 607, are avoided its perk.
The eutectic welding stage of LED of the present invention encapsulation, with reference to figure 1, on the basis of previous technique scheme, specifically inner orbit 610 and outside track 607 are positioned at welding stage place across being provided with welding compressing tablet 608, are set to the bar-shaped trough entering for chip in the middle of welding compressing tablet 608.
The eutectic welding stage of LED encapsulation of the present invention, with reference to figure 1, at the specifically ceramics bracket of basic upper bracket 300 of previous technique scheme.
The eutectic welding stage of LED encapsulation of the present invention with reference to figure 1, is specifically provided with the inner orbit Y-axis motor 612 that drives inner orbit 610 translations and the outside track Y-axis motor 611 that drives outside track 607 translations in conveyor frame 609 on the basis of previous technique scheme.
The eutectic welding stage of LED encapsulation of the present invention, with reference to figure 1, on the basis of previous technique scheme, specifically slide above support 704 and be provided with the welding bench 705 of Motionless electromagnetic heater 701, the heater Z axis motor 703 that drives electromagnetic heater 701 to move up and down is installed on described welding bench 705, the eutectic welding stage X-axis motor 707 and the eutectic welding stage Y-axis motor 702 that drive welding bench 705 translation are all around installed on described support 704.
The eutectic welding stage of LED encapsulation of the present invention with reference to figure 1, is specifically provided with the upper and lower change gear 706 of support conveyance on support 704 on the basis of previous technique scheme.
The eutectic welding stage of LED of the present invention encapsulation, with reference to figure 1, on the basis of previous technique scheme, be specifically provided with chips welding corresponding to electromagnetic heater 701 detects CCD camera lens 204 on inner orbit 610 and outside track 607.Chips welding detect CCD camera lens 204 be positioned at welding chip directly over, for taking the position of chip and support, by control device order welding carrying suction nozzle 215, chip is adjusted to correct position.
The eutectic welding stage of LED encapsulation of the present invention, with reference to figure 1, on the basis of previous technique scheme, specifically chips welding detects on CCD camera lens 204 and is provided with the coaxial lens barrel 203 of CCD, and coaxial lens barrel 204 sides of described CCD are also provided with CCD fine setting micrometer 202 and CCD coaxial-illuminating light source 214.CCD fine setting micrometer 202 is for adjusting camera lens, and CCD coaxial-illuminating light source 214 is for light filling.
More than that the eutectic welding stage of LED encapsulation of the present invention is set forth; be used for helping to understand the present invention; but embodiments of the present invention are not restricted to the described embodiments; anyly do not deviate from the change done under the principle of the invention, modification, substitute, combination, simplify; all should be equivalent substitute mode, within being included in protection scope of the present invention.
Claims (10)
1. the eutectic welding stage of a LED encapsulation, it is characterized in that: comprise support, on described support, be arranged with the inner orbit and the outside track that slide for support in parallel, below between described inner orbit and outside track is provided with electromagnetic heater, be provided with welding carrying suction nozzle corresponding to electromagnetic heater on described inner orbit and outside track.
2. the eutectic welding stage that LED encapsulates according to claim 1, it is characterized in that: on described support, be provided with conveyor frame, in described conveyor frame, be arranged with the inner orbit and the outside track that slide for support in parallel, described inner orbit slides and is provided with material loading conveyance pawl near one end of support charging crane, the other end of described inner orbit slides and is provided with feeding conveyance pawl and feeding rod, and described material loading conveyance pawl and feeding conveyance pawl are strip shape gob that can folding.
3. the eutectic welding stage that LED encapsulates according to claim 2, is characterized in that: the corresponding material loading conveyance pawl of described outside track place is provided with charging resistance gauge, and the corresponding feeding conveyance pawl of described outside track place is provided with feeding resistance gauge.
4. the eutectic welding stage that LED encapsulates according to claim 2, is characterized in that: described inner orbit and outside track are positioned at welding stage place across being provided with welding compressing tablet, is set to the bar-shaped trough entering for chip in the middle of described welding compressing tablet.
5. the eutectic welding stage that LED encapsulates according to claim 2, is characterized in that: in described conveyor frame, be provided with the inner orbit Y-axis motor that drives inner orbit translation and the outside track Y-axis motor that drives outside track translation.
6. the eutectic welding stage that LED encapsulates according to claim 1, is characterized in that: described support is ceramics bracket.
7. the eutectic welding stage that LED encapsulates according to claim 1, it is characterized in that: slide and be provided with the welding bench of Motionless electromagnetic heater in described support top, the heater Z axis motor that drives electromagnetic heater to move up and down is installed on described welding bench, the eutectic welding stage X-axis motor and the eutectic welding stage Y-axis motor that drive welding bench translation are all around installed on described support.
8. the eutectic welding stage that LED encapsulates according to claim 1, is characterized in that: on described support, be provided with the upper and lower change gear of support conveyance.
9. the eutectic welding stage that LED encapsulates according to claim 1, is characterized in that: on described inner orbit and outside track, be provided with chips welding corresponding to electromagnetic heater detects CCD camera lens.
10. the eutectic welding stage that LED encapsulates according to claim 9, is characterized in that: described chips welding detects on CCD camera lens and is provided with the coaxial lens barrel of CCD, and the coaxial lens barrel side of described CCD is also provided with CCD fine setting micrometer and CCD coaxial-illuminating light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310578958.4A CN103769778A (en) | 2013-11-18 | 2013-11-18 | Eutectic welding platform for LED packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310578958.4A CN103769778A (en) | 2013-11-18 | 2013-11-18 | Eutectic welding platform for LED packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103769778A true CN103769778A (en) | 2014-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310578958.4A Pending CN103769778A (en) | 2013-11-18 | 2013-11-18 | Eutectic welding platform for LED packaging |
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| Country | Link |
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| CN (1) | CN103769778A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105171308A (en) * | 2015-08-30 | 2015-12-23 | 深圳英飞自动化设备有限公司 | Automatic welding fixture of semiconductor chip |
| CN107123927A (en) * | 2017-06-02 | 2017-09-01 | 广东瑞谷光网通信股份有限公司 | LD chip eutectic welding systems |
| CN107424951A (en) * | 2017-06-02 | 2017-12-01 | 广东瑞谷光网通信股份有限公司 | Chip rotates eutectic welding bench |
| CN107004679B (en) * | 2015-03-02 | 2018-09-04 | G思玛特有限公司 | Transparent display screen manufacture light emitting diode chip package device |
| CN111822811A (en) * | 2020-08-19 | 2020-10-27 | 深圳新益昌科技股份有限公司 | Automatic wafer welding machine and wafer welding method |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107004679B (en) * | 2015-03-02 | 2018-09-04 | G思玛特有限公司 | Transparent display screen manufacture light emitting diode chip package device |
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| CN107424951A (en) * | 2017-06-02 | 2017-12-01 | 广东瑞谷光网通信股份有限公司 | Chip rotates eutectic welding bench |
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| KR20190002451A (en) * | 2017-06-02 | 2019-01-08 | 광둥 루이구 옵티컬 네트워크 커뮤니케이션 컴퍼니 리미티드 | Chip rotation process welding stand |
| KR102165651B1 (en) | 2017-06-02 | 2020-10-14 | 광둥 루이구 옵티컬 네트워크 커뮤니케이션 컴퍼니 리미티드 | Chip rotation process welding stand |
| CN107123927B (en) * | 2017-06-02 | 2023-04-18 | 广东瑞谷光网通信股份有限公司 | Eutectic welding system for LD chip |
| CN107424951B (en) * | 2017-06-02 | 2023-08-18 | 广东瑞谷光网通信股份有限公司 | Chip rotary eutectic welding table |
| CN111822811A (en) * | 2020-08-19 | 2020-10-27 | 深圳新益昌科技股份有限公司 | Automatic wafer welding machine and wafer welding method |
| CN111822811B (en) * | 2020-08-19 | 2021-02-26 | 深圳新益昌科技股份有限公司 | Automatic wafer welding machine and wafer welding method |
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Effective date of abandoning: 20170503 |