CN111822811B - Automatic wafer welding machine and wafer welding method - Google Patents
Automatic wafer welding machine and wafer welding method Download PDFInfo
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- CN111822811B CN111822811B CN202010835720.5A CN202010835720A CN111822811B CN 111822811 B CN111822811 B CN 111822811B CN 202010835720 A CN202010835720 A CN 202010835720A CN 111822811 B CN111822811 B CN 111822811B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
Abstract
The application provides an automatic wafer welding machine and a wafer welding method; the automatic wafer welder includes: a frame; a track mechanism for transferring the substrate; a bonding mechanism for bonding the die to the substrate; the gantry moving platform is used for driving the welding mechanism to move on a horizontal plane above the track mechanism along two directions which are vertical to each other; the rail mechanism is arranged on the rack, the welding mechanism is arranged on the gantry mobile platform, and the gantry mobile platform is arranged on the rack; the welding mechanism comprises a welder and a lifting mechanism, wherein the welder is used for heating the wafer to be welded on the substrate, the lifting mechanism is used for driving the welder to lift, and the lifting mechanism is arranged on the gantry moving platform. This application wafer automatic weld machine conveys the base plate through rail mechanism, removes wafer department with the soldering apparatus through longmen moving platform and elevating system to heat the welding to this wafer, need not to carry out reflow soldering with whole base plate, avoid influencing other wafers and components and parts on the base plate, reduce the wasting of resources, it is efficient.
Description
Technical Field
The application belongs to the technical field of die bonding, and particularly relates to an automatic wafer welding machine and a wafer welding method.
Background
A Light Emitting Diode (LED) is a Light Emitting element that converts electrical energy into Light energy. Display technologies such as Mini LED/Micro LED are becoming the mainstream technology. Users have higher requirements on the quality of LED products, especially the color temperature, brightness, color rendering, etc. of LEDs have good consistency, and then have more requirements and challenges for huge LED packaging processes. In the die bonding process of the LED, there is a positional deviation of the die after die bonding or die missing due to various reasons. In this case, the shifted wafer needs to be removed and the wafer needs to be repaired again. After the crystal repairing operation, solder paste solidification welding is required. At present, the method generally adopted is to put the whole substrate after the crystal is repaired into a reflow furnace for reflow soldering, so that the bottom of the wafer is soldered with the substrate through solder paste. However, since only a few chips on one substrate need to be cured and soldered, placing the entire substrate in a reflow furnace is likely to damage the cured chips and devices, which causes resource waste and low efficiency.
Disclosure of Invention
An object of the embodiments of the present application is to provide an automatic wafer welding machine and a wafer welding method, so as to solve the problems that in the related art, the whole substrate after the wafer is placed in a reflow furnace for reflow soldering, the cured wafer and components are easily damaged, the resource waste is caused, and the efficiency is low.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions: provided is an automatic wafer welding machine, including:
a frame;
a track mechanism for transferring the substrate;
a bonding mechanism for bonding the die to the substrate; and the number of the first and second groups,
the gantry moving platform is used for driving the welding mechanism to move on a horizontal plane above the track mechanism along two directions which are vertical to each other;
the track mechanism is arranged on the rack, the welding mechanism is arranged on the gantry mobile platform, and the gantry mobile platform is arranged on the rack;
the welding mechanism comprises a welder for heating the wafer to be welded on the substrate, a lifting mechanism for driving the welder to lift and a code scanning gun for scanning the substrate codes, the code scanning gun is installed on the gantry mobile platform, and the lifting mechanism is installed on the gantry mobile platform;
the welding device comprises a welding head for abutting against and heating the wafer, a lifting block for supporting the welding head, a guide assembly for guiding the lifting block to move up and down, a voice coil motor for driving the lifting block to lift, a support for supporting the voice coil motor, an elastic piece for elastically abutting against the lifting block downwards and a pressing plate for supporting the elastic piece, wherein the pressing plate is arranged on the support, the support is connected with the lifting mechanism, and the guide assembly is arranged on the support.
In an optional embodiment, the welding head comprises a heat conducting head for pressing and heating the wafer, a heating rod for heating the heat conducting head, a heat insulating sleeve sleeved on the heating rod, a fixing clamp for fixing the heat conducting head at the lower end of the heat insulating sleeve, and a fixing block for supporting the heat insulating sleeve, wherein the fixing block is supported on the lifting block.
In an optional embodiment, the welding head further comprises a heat insulation block arranged between the fixed block and the lifting block, the fixed block is connected with the heat insulation block, and the heat insulation block is connected with the lifting block.
In an optional embodiment, the welder further comprises a connecting seat supporting the welding head, and the connecting seat is connected with the lifting block.
In an optional embodiment, the welder further comprises a heat insulation seat supporting the welding head, the heat insulation seat being supported on the lifting block.
In an optional embodiment, the pressure plate is provided with an adjusting piece for adjusting the pressure of the elastic piece against the lifting block.
In an optional embodiment, the bonding mechanism further comprises a lens module for capturing an image of the wafer on the substrate, and the lens module is mounted on the gantry moving platform.
In an alternative embodiment, the track mechanism comprises:
a conveyor belt for conveying the substrate;
a plurality of support wheels which are matched with and support the conveyor belt;
a guide plate; and the number of the first and second groups,
the conveying motor is connected with one of the plurality of supporting wheels corresponding to the conveying belt;
the conveying motor is arranged on the guide plate, the supporting wheels are rotatably arranged on the guide plate, and the guide plate is supported on the rack.
In an optional embodiment, the number of the guide plates is two, a plurality of the support wheels are respectively arranged on each guide plate, the number of the conveyor belts is two, the plurality of the support wheels on each guide plate support one conveyor belt in a matched manner, the conveyor motor is respectively installed on each guide plate, the conveying mechanism further comprises a support plate and a linear driver for driving the two guide plates to approach or separate from each other, the support plate is installed on the rack, one guide plate is fixed on the support plate, the other guide plate is slidably installed on the support plate, the linear driver is installed on the support plate, and the other guide plate is connected with the linear driver.
Another object of an embodiment of the present application is to provide a wafer welding method, including the automatic wafer welding machine according to any one of the above embodiments, the wafer welding method further including:
the track mechanism conveys the substrate below the welding mechanism;
the gantry moving platform drives the welding mechanism to move on a horizontal plane, so that the welding head of the welding mechanism is opposite to the wafer to be welded;
the lifting mechanism drives the welding device to be close to the substrate;
the voice coil motor drives the lifting block to drive the welding head to abut against the wafer;
the bonding head heats the wafer to bond the wafer to the substrate.
The automatic wafer welding machine and the wafer welding method provided by the embodiment of the application have the beneficial effects that: compared with the prior art, this application wafer automatic weld machine conveys the base plate through rail mechanism, removes wafer department through longmen moving platform and elevating system with the soldering apparatus to heat the welding to this wafer, need not to carry out reflow soldering with whole base plate, avoid influencing other wafers and components and parts on the base plate, reduce the wasting of resources, it is efficient.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an automatic wafer welder provided in an embodiment of the present application;
FIG. 2 is a schematic structural view of the track mechanism of FIG. 1;
FIG. 3 is an exploded view of the track mechanism of FIG. 2;
FIG. 4 is a schematic structural diagram of the gantry moving platform in FIG. 1;
FIG. 5 is a schematic structural view of the welding mechanism of FIG. 1;
FIG. 6 is a schematic view of the welder of FIG. 5;
FIG. 7 is a schematic view of the structure of the weld head of FIG. 6;
fig. 8 is an exploded view of the welding head of fig. 7.
Wherein, in the drawings, the reference numerals are mainly as follows:
100-automatic wafer welding machine;
10-a frame;
20-a track mechanism; 21-a guide plate; 22-a conveyor belt; 23-a support wheel; 24-a conveyor motor; 251-a linear drive; 252-a support plate; 253-a guide rail; 254-a slide mount; 26-a holding assembly; 261-pressing the frame; 262-a pallet; 263-a lifter; 27-a positioning assembly; 271-a baffle plate; 272-a lift drive;
30-a gantry mobile platform; 31-a support seat; 32-a longitudinal mover; 33-a lateral mover; 34-a fixing frame; 341-a first scaffold; 342-a second bracket; 35-a slide rail; 36-a slide block;
40-a welding mechanism; 41-a lifting mechanism; 411-a support frame; 412-a lift motor; 413-vertical screw; 414-lifting nut; 415-a hinged seat; 416-a mounting plate; 417-a guide rail; 418-a slider; 42-a welder; 421-a welding head; 4211-a heat conducting head; 4212-heating rod; 4213-heat insulating sleeve; 4214-fixation block; 4215-a fixing clip; 4216-a heat insulation block; 422-lifting block; 423-voice coil motor; 424-seat; 425-a guide assembly; 4261-an elastic member; 4262-pressing plate; 4263-an adjustment piece; 427-a connecting seat; 4271-heat insulation seat; 4272-heat insulating pad; 43-a lens module; 44-code scanning gun.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be a mechanical connection; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Reference throughout this specification to "one embodiment," "some embodiments," or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring to fig. 1 and 5, an automatic wafer welder 100 provided by the present application will now be described. The automatic wafer welding machine 100 comprises a frame 10, a track mechanism 20, a welding mechanism 40 and a gantry moving platform 30; the rail mechanism 20 and the gantry mobile platform 30 are installed on the frame 10, and the welding mechanism 40 is installed on the gantry mobile platform 30. The rail mechanism 20 is used for transferring the substrate to the welding mechanism 40, and the gantry moving platform 30 is used for driving the welding mechanism 40 to move in two directions perpendicular to each other on a horizontal plane above the rail mechanism 20 so as to move the welding mechanism 40 to a rear wafer on the substrate in the rail mechanism 20.
Referring to fig. 5, the soldering mechanism 40 includes a soldering device 42 and a lifting mechanism 41, the lifting mechanism 41 is installed on the gantry moving platform 30, the soldering device 42 is used for heating the wafer to solder the wafer on the substrate, so that when the gantry moving platform 30 moves the soldering device 42 to the upper side of the wafer on the substrate in the track mechanism 20, the lifting mechanism 41 drives the soldering device 42 to move downwards to the corresponding wafer to heat the wafer, so as to melt the solder paste of the soldered wafer, and solder the wafer on the substrate, thereby realizing the fixed-point automatic soldering of the wafer on the substrate, without reflowing the whole substrate, with high efficiency, and avoiding affecting other wafers on the substrate.
Compared with the prior art, the automatic wafer welding machine 100 provided by the application conveys the substrate through the rail mechanism 20, and the welder 42 is moved to the wafer through the gantry moving platform 30 and the lifting mechanism 41 so as to heat and weld the wafer, thereby avoiding influencing other wafers and components on the substrate, reducing resource waste and being high in efficiency.
The embodiment of the present application further provides a wafer welding method for welding a wafer by using the automatic wafer welding machine 100 according to the embodiment of the present application, the wafer welding method including:
the track mechanism 20 conveys the substrate under the soldering mechanism 40;
the gantry moving platform 30 drives the welding mechanism 40 to move on a horizontal plane, so that the welding head 421 of the welding mechanism 40 faces the wafer to be welded;
the lifting mechanism 41 drives the welder 42 to approach the substrate;
the voice coil motor 423 drives the lifting block 422 to drive the welding head 421 to press against the wafer;
the bond head 421 heats the wafer to bond the wafer to the substrate.
By the wafer welding method, the automatic welding of the wafer on the substrate with accurate fixed point can be realized, other wafers and devices around the wafer can be prevented from being influenced, the resource waste can be reduced, and the efficiency is high.
In one embodiment, referring to fig. 2 and 3, the track mechanism 20 includes a conveyor belt 22, a plurality of support wheels 23, a guide plate 21, and a conveyor motor 24, the conveyor motor 24 is mounted on the guide plate 21, each support wheel 23 is rotatably mounted on the guide plate 21, the guide plate 21 is supported on the frame 10, the plurality of support wheels 23 cooperate with the support belt 22, and the conveyor motor 24 is connected to one of the support wheels 23, so that the support wheels 23 are driven to rotate by the conveyor motor 24 to drive the conveyor belt 22 to move, thereby conveying the substrate. The track mechanism 20 has a simple structure and low cost. In other embodiments, a linear motion mechanism may be used to push the substrate to effect transfer of the substrate.
In one embodiment, the guide plates 21 are two, the number of the support wheels 23 is two, the support wheels 23 are matched to support one of the conveyor belts 22, and the conveyor motors 24 are arranged on the guide plates 21, so that the conveyor belts 22 on the two guide plates 21 are matched to support two sides of the substrate, and the substrate can be conveyed more stably. In other embodiments, a guide plate 21 may be provided and the substrate may be conveyed by a conveyor belt 22.
In one embodiment, the rail mechanism 20 further includes a support plate 252 and a linear drive 251, the support plate 252 being mounted on the frame 10. Of the two guide plates 21: one guide plate 21 is fixed on the support plate 252, and the other guide plate 21 is slidably mounted on the support plate 252; the linear driver 251 is installed on the support plate 252 and the other guide plate 21 is connected to the linear driver 251, that is, the linear driver 251 is connected to the guide plate 21 slidably installed on the support plate 252, so that the two guide plates 21 can be driven to move closer to or away from each other to adjust the distance between the two guide plates 21, and thus the distance between the two conveyor belts 22, to accommodate substrates of different widths.
In one embodiment, the linear driver 251 may be a linear motor, a lead screw-nut mechanism, a rack and pinion mechanism, or other linear movement mechanism.
In one embodiment, the supporting plate 252 is provided with a guide rail 253 for guiding the movement of the other guide plate 21, the other guide plate 21 is slidably mounted on the guide rail 253, and the guide rail 253 is provided for guiding the other guide plate 21 to slide so as to ensure the smooth sliding of the guide plates 21 and thus the smooth adjustment of the distance between the two guide plates 21.
In one embodiment, the guide rail 253 is provided with a sliding seat 254, and the other guide plate 21 is fixedly connected to the sliding seat 254 so as to guide the other guide plate 21 to move smoothly.
In one embodiment, the track mechanism 20 further includes a holding member 26, and the holding member 26 is used for holding the substrate so as to perform heat bonding on a designated chip on the substrate. The supporting member 26 includes a pressing frame 261, a supporting plate 262, and a lifter 263. The pressing frame 261 is installed on the guide plate 21 and used for pressing against the side edge of the substrate; the supporting plate 262 is mounted on the lifter 263, the lifter 263 pushes the supporting plate 262 to rise, so as to lift the substrate on the conveyor belt 22 to press against the pressing frame 261, the pressing frame 261 and the supporting plate 262 cooperate to clamp the substrate, and the supporting plate 262 supports the substrate, so that the welder 42 can heat-weld the corresponding wafer; the lifter 263 descends to drive the support plate 262 to descend, so as to place the substrate on the conveyor belt 22, and the conveyor belt 22 continues to convey the substrate.
In one embodiment, the lifter 263 can be a linear moving mechanism such as a cylinder, a linear motor, or the like.
In one embodiment, the track mechanism 20 further comprises a positioning assembly 27, and the substrate is positioned by the positioning assembly 27 when the conveyor 22 transports the substrate, so that the bonding mechanism 40 positions the wafer on the substrate. The positioning assembly 27 comprises a blocking piece 271 and a lifting driver 272, when the substrate is transferred to the corresponding position of the welding mechanism 40, the lifting driver 272 pushes the blocking piece 271 to ascend so as to stop and position the substrate, thereby positioning the substrate; after the die on the substrate is soldered, the lifting driver 272 drives the blocking plate 271 to descend, so that the conveyor belt 22 continues to convey the substrate.
In one embodiment, the positioning assembly 27 is combined with the support assembly 26 to position the substrate via the positioning assembly 27, and the support assembly 26 supports and holds the substrate to better position and hold the substrate for the bonding mechanism 40 to heat bond the die to the substrate.
In one embodiment, the lifting drive 272 may be a linear motion mechanism such as a pneumatic cylinder, linear motor, or the like.
In one embodiment, referring to fig. 1 and 4, the gantry moving platform 30 includes a supporting seat 31, a longitudinal mover 32, a transverse mover 33 and a fixing frame 34, the longitudinal mover 32 is mounted on the transverse mover 33, the transverse mover 33 is supported on the fixing frame 34, the fixing frame 34 is mounted on the frame 10, the supporting seat 31 is mounted on the longitudinal mover 32, and the welding mechanism 40 is mounted on the supporting seat 31, so that the supporting seat 31 is driven by the longitudinal mover 32 to move longitudinally, i.e., along the conveying direction of the track mechanism 20, to drive the welding mechanism 40 to move longitudinally; the transverse mover 33 drives the longitudinal mover 32 to move in a direction perpendicular to the conveying direction to drive the welding mechanism 40 to move transversely, so as to drive the welding mechanism 40 to move in two directions perpendicular to each other on the horizontal table. Of course, in other embodiments, the supporting seat 31 may be mounted on the lateral mover 33, the lateral mover 33 may be mounted on the longitudinal mover 32, and the longitudinal mover 32 may be mounted on the fixed frame 34.
In one embodiment, the longitudinal mover 32 may be a linear motor, a lead screw-nut mechanism, a rack and pinion mechanism, or other linear movement mechanism.
In one embodiment, the lateral mover 33 may be a linear motor, a lead screw-nut mechanism, a rack and pinion mechanism, or other linear moving mechanism.
In one embodiment, the fixing frame 34 includes a first bracket 341 and a second bracket 342, the first bracket 341 is disposed across the rail mechanism 20, the second bracket 342 is disposed across the rail mechanism 20, the lateral shifter 33 is mounted on the first bracket 341, one end of the longitudinal shifter 32 is mounted on the lateral shifter 33, and the other end of the longitudinal shifter 32 is slidably supported on the second bracket 342. The structure can more stably support the transverse mover 33 and the longitudinal mover 32, so that the transverse mover 33 and the longitudinal mover 32 can drive the supporting seat 31 to move stably on the horizontal plane, and further the welding mechanism 40 can be driven to move stably on the horizontal plane.
In one embodiment, the second bracket 342 is provided with a slide rail 35, the slide rail 35 is provided with a slide block 36, and the slide block 36 is connected with the other end of the longitudinal mover 32, so that the transverse mover 33 can drive the longitudinal mover 32 to move more smoothly.
In one embodiment, referring to fig. 5, the lifting mechanism 41 includes a support frame 411, a mounting plate 416, a guide rail 417, a sliding block 418, a vertical screw 413, a lifting nut 414, a hinge seat 415, and a lifting motor 412, wherein the guide rail 417 is vertically installed on the support frame 411, the sliding block 418 is slidably installed on the guide rail 417, the lifting nut 414 and the sliding block 418 are connected to the mounting plate 416, the lifting nut 414 is installed on the vertical screw 413, the vertical screw 413 is rotatably installed on the hinge seat 415, the hinge seat 415 is installed on the support frame 411, the lifting motor 412 is supported on the support frame 411, the lifting motor 412 is connected to the vertical screw 413, and the lifting motor 412 drives the vertical screw 413 to rotate so as to drive the lifting nut 414 to drive the mounting plate 416 to lift and. In other embodiments, the lifting mechanism 41 may also be a linear motor, a rack and pinion mechanism, or the like.
In one embodiment, referring to fig. 5, the bonding mechanism 40 further includes a lens module 43, the lens module 43 is used for capturing the image of the wafer on the substrate, the lens module 43 is mounted on the gantry 30, and the lens module 43 is disposed to accurately position the wafer on the substrate for the bonding of the bonder 42. In one embodiment, the lens module 43 is mounted on the supporting frame 411. In other embodiments, the lens module 43 can be mounted on the support base 31.
In one embodiment, referring to fig. 5, the bonding mechanism 40 further includes a code scanning gun 44, the code scanning gun 44 is used for scanning the substrate code, and the code scanning gun 44 is installed on the gantry 30 to identify the corresponding substrate and further heat-bond the corresponding wafer on the substrate.
In one embodiment, the yard scanning gun 44 is mounted to a support bracket 411. In other embodiments, the yard scanning gun 44 may be mounted to the support base 31.
In one embodiment, referring to fig. 6, the welder 42 includes a welding head 421, a lifting block 422, a guiding assembly 425, a voice coil motor 423, a support 424, an elastic member 4261 and a pressure plate 4262, wherein the pressure plate 4262 is mounted on the support 424, and the support 424 is connected with the lifting mechanism 41. Voice coil motor 423 is mounted on mount 424, and voice coil motor 423 is supported by mount 424. The bonding head 421 is supported on the lift block 422, and the bonding head 421 is used to press and heat the wafer. The lifting block 422 is connected with the voice coil motor 423, and the lifting block 422 is driven to lift by the voice coil motor 423 so as to drive the welding head 421 to lift. And the lifting block 422 is connected to the guide assembly 425, and the lifting block 422 is guided to be lifted and lowered by the guide assembly 425. A guide assembly 425 is mounted on the mount 424. The elastic member 4261 is mounted on the pressure plate 4262, and the elastic member 4261 is supported by the pressure plate 4262, and the elastic member 4261 elastically presses the lifting block 422 downward. The elastic member 4261 may be a spring, or the like. When the gantry moving platform 30 moves the soldering mechanism 40 above the wafer on the substrate, the lifting mechanism 41 drives the soldering machine 42 to descend to approach the corresponding wafer; then the voice coil motor 423 drives the lifting block 422 to drive the welding head 421 to descend to press against the wafer, and due to the elastic action of the elastic member 4261, the pressure of the welding head 421 against the wafer can be adjusted to play a role in protecting the wafer; while the bonding head 421 is pressed against the wafer, the wafer is heated to bond the wafer to the substrate. The structure can not only accurately heat and weld the wafer, but also protect the wafer.
In some embodiments, the bonding head 421 can be directly mounted on the lifting mechanism 41, and the bonding head 421 is directly driven against the wafer by the lifting mechanism 41.
In one embodiment, referring to fig. 6, the guiding assembly 425 may be a cross guide rail to more accurately and smoothly guide the lifting block 422 to drive the welding head 421 to move up and down. In some embodiments, the guiding assembly 425 may also be a rail and sliding block assembly, such as a sliding block slidably mounted on the rail, the rail mounted on the support 424, and the sliding block connected to the lifting block 422 to guide the lifting block 422 to lift.
In one embodiment, referring to fig. 6, an adjusting member 4263 is mounted on the pressure plate 4262, and the adjusting member 4263 is used for adjusting the pressure of the elastic member 4261 against the lifting block 422. In one embodiment, the adjustment member 4263 is a screw. In some embodiments, the adjustment members 4263 may also use shims or the like.
In one embodiment, referring to fig. 6, the welder 42 further includes a connecting seat 427, the connecting seat 427 is connected to the lifting block 422, the welding head 421 is supported on the connecting seat 427, and the connecting seat 427 is configured to fixedly connect the welding head 421 to the lifting block 422.
In one embodiment, the welder 42 further comprises a heat insulation seat 4271, the heat insulation seat 4271 is connected with the lifting block 422, and the welding head 421 is supported on the heat insulation seat 4271 for heat insulation, so that the influence of the heat of the welding head 421 on the voice coil motor 423 is reduced.
In one embodiment, the heat insulation seat 4271 is disposed between the connecting seat 427 and the lifting block 422, that is, the heat insulation seat 4271 is connected to the lifting block 422, and the connecting seat 427 is connected to the heat insulation seat 4271, so that the lifting block 422 can be conveniently installed and can also perform a heat insulation function.
In one embodiment, the welder 42 further comprises an insulation pad 4272, the welding head 421 is connected to the insulation pad 4272, and the insulation pad 4272 is mounted on the connecting base 427 for better insulation.
In one embodiment, referring to fig. 6 to 8, the welding head 421 includes a heat conducting head 4211, a heating rod 4212, a heat insulating sleeve 4213, a fixing clip 4215 and a fixing block 4214, and the fixing block 4214 is connected to the lifting block 422. The heat conducting head 4211 is used for pressing and heating a wafer, the heating rod 4212 is connected with the heat conducting head 4211 to heat the heat conducting head 4211, the heat insulating sleeve 4213 is sleeved on the heating rod 4212 to reduce the influence of the heat of the heating rod 4212 on the wafer around the wafer, in addition, the heat conducting head 4211 can be made to be better matched with the wafer by using the heat conducting head 4211, so that the heat of the heating rod 4212 can be better conducted to the wafer, the influence on the wafer around the wafer is reduced, the fixing clamp 4215 is installed on the heat insulating sleeve 4213 to fix the heat conducting head 4211 at the lower end of the heat insulating sleeve 4213, and the heat insulating sleeve 4213 is supported on the lifting block 422. The bond head 421 can provide better heating of the wafer while reducing the impact on the wafer or devices surrounding the wafer. In other embodiments, the soldering head 421 can also use electric soldering iron directly.
In one embodiment, the welding head 421 further includes a heat insulation block 4216, the heat insulation block 4216 is disposed between the fixing block 4214 and the lifting block 422, the fixing block 4214 is connected to the heat insulation block 4216, the heat insulation block 4216 is supported on the lifting block 422, and the heat insulation block 4216 is disposed to better insulate heat and reduce the heat influence of the welding head 421 on the lifting block 422.
In the above embodiment, the thermal insulation block 4216 is connected to the thermal insulation pad 4272 to reduce the influence on the voice coil motor 423 by multiple thermal insulation. In the above embodiment, the voice coil motor 423 is used to rapidly drive the lifting block 422 to lift, and when the pressure is applied, a certain buffer can be performed to avoid crushing the wafer.
The automatic wafer welder 100 of the present application works as follows:
the rail mechanism 20 transfers the substrate to the corresponding position of the soldering mechanism 40, the gantry moving platform 30 drives the soldering mechanism 40 to move on the horizontal plane, so that the soldering device 42 of the soldering mechanism 40 is positioned above the wafer on the substrate, the lifting mechanism 41 drives the soldering device 42 to descend, the soldering head 421 is close to the substrate, the voice coil motor 423 drives the soldering head 421 to press against the wafer to heat the wafer, so that the solder paste between the wafer and the substrate is melted, and the wafer is soldered on the substrate. After the wafer is bonded, the lifting mechanism 41 drives the bonder 42 to ascend; the gantry 30 moves the bonding mechanism 40 to the next wafer for bonding.
The automatic wafer welding machine 100 can conveniently connect with a wafer processing device by using the track mechanism 20 to transfer the substrate. In addition, the wafer can be accurately welded, the efficiency is high, and the resources are saved.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (9)
1. Wafer automatic weld machine, its characterized in that includes:
a frame (10);
a rail mechanism (20) for conveying the substrate;
a bonding mechanism (40) for bonding the die to the substrate; and the number of the first and second groups,
the gantry moving platform (30) is used for driving the welding mechanism (40) to move on a horizontal plane above the track mechanism (20) along two directions which are vertical to each other;
the track mechanism (20) is arranged on the rack (10), the welding mechanism (40) is arranged on the gantry moving platform (30), and the gantry moving platform (30) is arranged on the rack (10);
the welding mechanism (40) comprises a welder (42) for heating the wafer to be welded on the substrate, a lifting mechanism (41) for driving the welder (42) to lift and a code scanning gun (44) for scanning the substrate code, the code scanning gun (44) is installed on the gantry moving platform (30), and the lifting mechanism (41) is installed on the gantry moving platform (30);
the welder (42) comprises a welding head (421) for pressing and heating the wafer, a lifting block (422) for supporting the welding head (421), a guide assembly (425) for guiding the lifting block (422) to move up and down, a voice coil motor (423) for driving the lifting block (422) to lift up and down, a support (424) for supporting the voice coil motor (423), an elastic member (4261) for elastically pressing the lifting block (422) downwards and a pressing plate (4262) for supporting the elastic member (4261), wherein the pressing plate (4262) is installed on the support (424), the support (424) is connected with the lifting mechanism (41), and the guide assembly (425) is installed on the support (424);
the welding head (421) comprises a heat conducting head (4211) used for pressing and heating the wafer, a heating rod (4212) used for heating the heat conducting head (4211), a heat insulation sleeve (4213) sleeved on the heating rod (4212), a fixing clamp (4215) used for fixing the heat conducting head (4211) at the lower end of the heat insulation sleeve (4213) and a fixing block (4214) used for supporting the heat insulation sleeve (4213), and the fixing block (4214) is supported on the lifting block (422).
2. The automatic wafer welding machine according to claim 1, wherein the welding head (421) further comprises a heat insulation block (4216) arranged between the fixing block (4214) and the lifting block (422), the fixing block (4214) is connected with the heat insulation block (4216), and the heat insulation block (4216) is connected with the lifting block (422).
3. The automatic wafer welding machine according to claim 1 or 2, characterized in that said welder (42) further comprises a connection seat (427) supporting said welding head (421), said connection seat (427) being connected to said lifting block (422).
4. The automatic wafer welding machine according to claim 1 or 2, characterized in that the welder (42) further comprises a heat insulating seat (4271) supporting the welding head (421), the heat insulating seat (4271) being supported on the lifting block (422).
5. The automatic wafer welding machine according to claim 1 or 2, characterized in that an adjusting member (4263) for adjusting the pressure of the elastic member (4261) against the lifting block (422) is mounted on the pressure plate (4262).
6. The automatic wafer welding machine according to claim 1 or 2, wherein the welding mechanism (40) further comprises a lens module (43) for capturing an image of the wafer on the substrate, the lens module (43) being mounted on the gantry moving platform (30).
7. The automatic wafer welder according to claim 1 or 2, characterized in that said track mechanism (20) comprises:
a conveyor belt (22) for conveying the substrate;
a plurality of support wheels (23) which support the conveyor belt (22) in a matching manner;
a guide plate (21); and the number of the first and second groups,
a conveyor motor (24) connected to one of the plurality of support wheels (23) corresponding to the conveyor belt (22);
the conveying motor (24) is mounted on the guide plate (21), the supporting wheels (23) are rotatably mounted on the guide plate (21), and the guide plate (21) is supported on the rack (10).
8. The automatic wafer welder according to claim 7, characterized in that: the guide plates (21) are arranged in parallel, a plurality of support wheels (23) are respectively arranged on each guide plate (21), the number of the conveyor belts (22) is two, the support wheels (23) on each guide plate (21) are matched with and support one conveyor belt (22), the conveyor motors (24) are respectively installed on each guide plate (21), the rail mechanism (20) further comprises a support plate (252) and a linear driver (251) for driving the two guide plates (21) to approach or separate from each other, the supporting plate (252) is arranged on the frame (10), one guide plate (21) is fixed on the supporting plate (252), the other guide plate (21) is arranged on the supporting plate (252) in a sliding way, the linear driver (251) is arranged on the supporting plate (252), the other guide plate (21) is connected to the linear actuator (251).
9. A wafer bonding method including the automatic wafer bonding machine according to any one of claims 1 to 8, wherein the wafer bonding method further includes:
the track mechanism (20) conveys a substrate under the welding mechanism (40);
the gantry moving platform (30) drives the welding mechanism (40) to move on a horizontal plane, so that the welding head (421) of the welding mechanism (40) is opposite to a wafer to be welded;
the lifting mechanism (41) drives the welding device (42) to be close to the substrate;
the voice coil motor (423) drives the lifting block (422) to drive the welding head (421) to be pressed against the wafer;
the bond head (421) heats the wafer to bond the wafer to the substrate.
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| CN202010835720.5A CN111822811B (en) | 2020-08-19 | 2020-08-19 | Automatic wafer welding machine and wafer welding method |
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| CN202010835720.5A CN111822811B (en) | 2020-08-19 | 2020-08-19 | Automatic wafer welding machine and wafer welding method |
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| CN210429877U (en) * | 2019-11-07 | 2020-04-28 | 深圳新益昌科技股份有限公司 | Feeding mechanism of mini-LED full-automatic die bonder |
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| JPH09270442A (en) * | 1996-04-01 | 1997-10-14 | Matsushita Electric Ind Co Ltd | Conductive balls mounting apparatus and method for mounting |
| CN202758925U (en) * | 2012-06-01 | 2013-02-27 | 深圳市新益昌自动化设备有限公司 | LED chip bracket automatic in and out system of LED die bonder |
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| CN111822811A (en) | 2020-10-27 |
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