KR100879005B1 - Laser bonding apparatus and laser bonding method - Google Patents

Abstract

The present invention provides a laser bonding device for a large-area display that can reduce the cost of unnecessary laser sources and optical systems and maximize productivity by irradiating a laser beam formed by using a plurality of laser oscillators to an ACF in a region where a junction terminal is formed. And a bonding method.

According to an aspect of the present invention, there is provided a laser bonding apparatus for a large area display, comprising: a laser irradiation unit for bonding a large area display substrate and a driver driver substrate using an anisotropic conductive film; A jig portion for fixing the large area display substrate; And a monitoring unit for aligning the large area display substrate, the anisotropic conductive film, and the drive driver substrate.

Laser, Beamforming, Monitoring, ACF

Description

LASER BONDING APPARATUS AND LASER BONDING METHOD}

1 is a block diagram of a laser bonding device for a large-area display according to an embodiment of the present invention,

2 is a block diagram of a laser bonding apparatus for a large-area display according to another embodiment of the present invention,

3 is a block diagram of a laser bonding apparatus for a large-area display according to another embodiment of the present invention.

* Description of the main parts of the drawings *

110: laser oscillator 120: beam former

130: CCD camera 140: ACF

150: laser transmitter 160: optical system holder

170: drive driver substrate 180: large area display substrate

181: junction 190: transparent press

The present invention relates to a bonding apparatus and a bonding method using a laser, and more particularly, to a laser bonding apparatus and a bonding method used to bond a large area display panel and a driving driver substrate by irradiating a laser to an anisotropic conductive film.

Anisotropic Conductive Film (ACF) is an adhesive on a film in which conductive particles such as metal-coated plastic or metal particles are dispersed. LCD panels and flexible circuit boards (FPCs) in liquid crystal display (LCD) mounting fields. It is widely used for electrical connection between a printed circuit (PCB) or a printed circuit board (PCB) and a flexible circuit board. With the recent development of LCD technology, ACF is rapidly improving connection reliability and minimizing connection pitch, and as a result, COG (Chip On) in which a bare chip is directly connected to an LCD panel and mounted is mounted. Glass) can be mounted. The connection principle of ACF is to place the ACF between two mediums to be connected, pressurize it with heating under a predetermined temperature and pressure, and melt the adhesive of ACF, and connect the dispersed conductive balls between the electrodes to replace the conductive. On the other hand, the adhesive is filled between the adjacent electrodes.

In general, a hot bar is used as a heat source for bonding a display and a driving driver substrate using an anisotropic conductive film. In the heat fusion process and apparatus using the hot bar, it is difficult to uniformize the temperature of the entire hot bar because it uses the heater to heat and control the heat required for ACF heat fusion. Falling, the hot bar surface is contaminated during continuous use of the hot bar has a problem that it is difficult to secure reproducibility.

In order to solve this problem, a laser and a transparent pressing unit through which the laser penetrates to other heat sources are used. After pressurizing the ACF using the transparent pressing unit, the laser was irradiated to bond the display panel and the driving driver substrate.

However, the laser irradiation apparatus of the conventional laser bonding apparatus irradiates the entire region including not only the junction terminal formed at the junction where the display panel and the driver driver substrate are to be bonded but also the region where no wiring is formed. Therefore, processing time is added to irradiate unnecessary areas, and in particular, when applied to a large display of 40 inches or more, which is recently produced, there is a disadvantage in that the productivity is adversely affected.

The present invention provides a laser bonding device for a large-area display that can reduce the cost of unnecessary laser sources and optical systems and maximize productivity by irradiating a laser beam formed by using a plurality of laser oscillators to an ACF in a region where a junction terminal is formed. And a bonding method.

According to an aspect of the present invention, there is provided a laser bonding apparatus for a large area display, comprising: a laser irradiation unit for bonding a large area display substrate and a driver driver substrate using an anisotropic conductive film; A jig portion for fixing the large area display substrate; And a monitoring unit for aligning the large area display substrate, the anisotropic conductive film, and the drive driver substrate.

The laser bonding method for a large area display of the present invention is a method of bonding a large area display substrate and a driver driver substrate using an anisotropic conductive film, wherein the large area display substrate, the anisotropic conductive film and the driver driver substrate are aligned to form a bonding portion. Forming; Pressing the driving driver substrate on the driving driver substrate; And irradiating the joints with lasers output from a plurality of laser oscillators.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a configuration diagram of a laser bonding apparatus for a large area display according to the present invention, and comprises a jig portion for fixing a laser irradiation part and a large area display substrate.

The laser irradiator according to the present invention includes a plurality of laser oscillators 110 for outputting a plurality of lasers and a beam former 120 for outputting the plurality of lasers into a single laser beam converted into a predetermined size and shape. The beam former 120 includes an optical system (not shown) made of a lens for irradiating the ACF 140.

The laser oscillator 110 according to the present invention may use a diode laser or an Nd: YAG laser in the infrared wavelength band, and an attenuator (not shown) is provided at the output end of the laser oscillator 110 to output a laser beam of a predetermined intensity. can do. The beam former 120 converts the size and shape of the plurality of laser beams output from the plurality of laser oscillators. For example, the beam shaper 120 may convert a single laser beam of a line shape having a length of several tens of mm and a width of several mm. . The optical system included in the beam former 120 is composed of lenses, and serves to adjust the focus to irradiate the junction portion 181 with the laser converted into a line shape in the beam former 120. On the other hand, the junction part 181 is laminated | stacked by the large area display substrate in which the junction terminal was formed, the ACF 140, and the drive driver substrate. In addition, the laser irradiator includes a laser transmitter 150 including an optical fiber or a mirror and an optical system holder 160 to transfer the laser output from the plurality of laser oscillators 110 to the beam former 120.

The optical system holder 160 may change the irradiation position of the laser while stably irradiating the laser transmitted to the beam former 120 and the optical system positioned in the beam former through the laser transmitter 150 without shaking. The beam former 120 and the optical system are mounted to the optical system holder 160 on an area corresponding to the junction 181 of the large area display substrate. Therefore, it is not necessary to install the beam former 120 and the optical system in the region where the junction part 181 is not formed, thereby saving the cost of installing the expensive laser irradiation part.

The driving device (not shown) serves to irradiate a laser beam to the bonding portion to be bonded by allowing the beam former 120 to move on the optical system holder 160. The controller (not shown) determines the irradiation method with the driving device (not shown) according to the size of the laser. For example, when the size of the laser is in the form of a spot or a line, the driving apparatus irradiates the laser beam output from the beam former 102 in a scanning manner moving in one direction on the optical system holder 160, thereby providing a large-area display substrate 180. ) And the driving driver substrate 170 may be bonded to each other. On the other hand, when irradiating a rectangular laser, the laser beam output from the beam former 120 moving on the optical system holder by the driving device is irradiated onto the sample at a predetermined time interval by the controller (not shown), so-called The substrate can be bonded in a block shot manner.

According to an embodiment of the present invention, the laser may be irradiated to the ACF 140 using an optical system. The irradiated laser serves to raise the temperature of the ACF 140, and when the ACF 140 becomes above a predetermined temperature, it is cured due to its characteristics. At this time, the control of the time required for melting and curing of the ACF 140, which is raised to a constant temperature and the thermosetting adhesive, is made through a controller capable of precisely adjusting the output of the laser beam.

Conductive bumps for electrically connecting the large-area display substrate 180 and the driver driver substrate 170 are respectively formed. The transparent presser 190 positions the ACF 140 between the conductive bumps and then fixes the ACF 140 using the jig part. In this case, since the bumps formed on the large-area display substrate 180 and the driving driver substrate 170 need to be precisely aligned so that the connection is made, the monitoring unit including the CCD camera 130 installed at both ends of the substrate is used.

The jig unit according to the present invention has a base for stacking the ACF 140 and the driver driver substrate 170 on a large area display substrate 180 having a length of several hundred mm to several thousand mm, and the upper part of the driver driver substrate. While applying pressure, it comprises a transparent pressurizer 190 for allowing the laser to be transmitted. When the substrate is pressed while irradiating the laser, both bumps are electrically connected in one direction by the conductive balls of the ACF 140, and the adhesive of the ACF 140 is filled between the bumps to adhere the substrates.

In addition, a plurality of jig parts according to the present invention may be provided to load a plurality of large area display substrates 180. The laser irradiation apparatus mounted on the optical system holder 160 performs a bonding operation by irradiating a laser onto a plurality of loaded large-area display substrates 180. When bonding is completed, the next jig is driven by a driving device (not shown). It moves to the large area display substrate 180 fixed to the part. While the laser irradiation unit irradiates the laser for the next bonding, the large-area display substrate 180 previously bonded is unloaded by the robot arm (not shown) and the other large-area display substrate 180 is attached to the jig portion. Will load. When loaded, the ACF 140 and drive driver substrate 170 are stacked on a large area display substrate. The stacked substrates are aligned by a monitoring unit including the CCD camera 130, and then pressurized by the transparent presser 190 to stand by. Therefore, when using a plurality of jig portion, the laser irradiation unit may perform a bonding operation by irradiating a laser to another substrate at a time required for loading and unloading the large area display substrate 180. That is, the continuous bonding process of the continuous large-area display substrate 180 is possible, and thus the yield can be expected to be improved.

The laser irradiator and the jig unit according to the present invention may be connected to an operation panel unit (not shown) to control each component of the laser bonding apparatus using a keypad. For example, each variable (laser wavelength or intensity, irradiation method, irradiation time, pressure, etc.) of a work process may be set using a value input through a keypad. And the display panel is provided with the operation, it is possible to align the substrate more precisely while checking the image input through the CCD camera 130.

2 is a block diagram of a laser bonding apparatus according to another embodiment of the present invention.

When the large area display substrate 180 is loaded in one of the plurality of jig parts, the ACF 140 is placed on one side of the large area display substrate on which the junction terminal is formed, and then the driving driver substrate 170 is placed again. . In this case, since the bumps formed on the large-area display substrate 180 and the driving driver substrate 170 need to be aligned precisely to be connected to each other, the monitoring unit including the CCD camera 130 installed at both ends of the substrate is used. When the alignment is completed, the driving driver substrate 170 is pressed to a predetermined pressure using the transparent pressurizer 190, and a plurality of lasers are output from the plurality of laser oscillators 110. The output plurality of lasers are transmitted to the beam former 120 including the optical system (not shown) through the laser transmitter 150 composed of an optical fiber or a mirror. The plurality of lasers are converted into a single laser beam 210 in the form of lines by the beam formers 120 and then irradiated to the junction 181 of the substrate. In this case, the laser oscillator 110, the beam former 120, and the optical system are prepared in plural and the bonding operation may be completed through one irradiation on all the joints 181 in the longitudinal direction formed on one side of the large-area display substrate 180. To be able. In addition, while the bonding operation is performed in one jig part, the other jig part loads / unloads the large-area display substrate 180 and then loads the ACF 140 and aligns the CCD 130. By performing in advance, the bonding operation is awaited.

3 is a block diagram of a laser bonding apparatus according to another embodiment of the present invention.

First, after the large area display substrate 180 is loaded in one of the plurality of jig parts, the ACF 140 is placed on one side of the large area display substrate on which the junction terminal is formed, and then the driving driver substrate 170 is again. Locate it. In this case, since the bumps formed on the large-area display substrate 180 and the driving driver substrate 170 need to be aligned precisely to be connected to each other, the monitoring unit including the CCD camera 130 installed at both ends of the substrate is used. When the alignment is completed, the driving driver substrate 170 is pressed to a predetermined pressure using the transparent pressurizer 190, and a plurality of lasers are output from the plurality of laser oscillators 110. The output plurality of lasers are transmitted to the beam former 120 including the optical system (not shown) through the laser transmitter 150 composed of an optical fiber or a mirror. The plurality of lasers are converted into a line-shaped laser beam 310 by the beam former 120 and then irradiated to any one of the plurality of junctions 181 formed on the substrate. At this time, the number of the laser oscillator 110 is selected to have an output capable of generating the laser beam 310 of a line shape corresponding to the size of one junction portion 181, and the beam former 120 and the optical system are also joined. (181) Predesigned to correspond with one. The joining method is as follows. First, a beam in the form of a line is irradiated onto one of the joints 181 to be bonded. Then, the beam former 120 is moved on the optical system holder 160 so that a laser can be irradiated to the next junction 181, and then irradiated and bonded to the laser. In this way, all the bonding portions 181 are sequentially irradiated with a laser beam to bond all the bonding portions 181. In addition, while the bonding operation is performed in one jig part, the other jig part loads / unloads the large-area display substrate 180 and then loads the ACF 140 and aligns the CCD 130. By performing in advance, the bonding operation is awaited.

Although the present invention has been shown and described with reference to the preferred embodiments as described above, the present invention is not limited to the above embodiments, and those skilled in the art without departing from the spirit of the present invention. Various changes and modifications will be possible.

The laser irradiation apparatus of the present invention has an advantage of processing a sample without energy loss of the laser output from the laser oscillator. Therefore, it is possible to save the processing time of the sample and the additional equipment cost of the high power laser oscillator, thereby improving the productivity of the product and lowering the unit cost of the produced product.

Claims (10)

A jig part for fixing a display substrate and a plurality of driving driver substrates electrically connected to one side of the display substrate, and a plurality of anisotropic conductive films electrically connecting the display substrate and the driving driver substrates, respectively; A plurality of laser oscillators; And Each laser output from the plurality of laser oscillators is input, and converting the input lasers into a single laser beam and irradiating each of the anisotropic conductive films to include one or more beam formers for heating the anisotropic conductive film. Laser bonding apparatus characterized in that. The method of claim 1, The single laser beam is a laser bonding apparatus, characterized in that the line shape corresponding to the size of the anisotropic conductive film. The method according to claim 1 or 2, The apparatus further includes an optical system holder, arranged substantially parallel to the one side of the display substrate fixed on the jig portion, to which a plurality of beam formers are mounted, And the beam formers are movable in parallel with the one side along the optical system holder. The method of claim 1, The apparatus further comprises a monitoring unit for monitoring the alignment of the display substrate, the anisotropic conductive film, the driving driver substrate. The method of claim 1, The jig portion, A base for depositing the display substrate, the anisotropic conductive film and the drive driver substrate; And And a transparent pressurizer for pressing the driving driver substrate on the driving driver substrate. First and second display substrates, a plurality of first and second drive driver substrates electrically connected to one side of the first and second display substrates disposed in parallel with each other, and the first and second display substrates; A jig part for fixing a plurality of first and second anisotropic conductive films electrically connecting the first and second drive driver substrates to each other; A plurality of laser oscillators; And A plurality of beam formers for inputting respective lasers output from the laser oscillators to heat the anisotropic conductive film by converting the input lasers into a single laser beam and irradiating the respective anisotropic conductive films; It further comprises an optical system holder which is disposed substantially parallel to one side of the first and second display substrates fixed on the jig portion to which the beam formers are mounted. And the beam formers move along the optical system holder and disposed at an upper position of the first display substrate or an upper position of the second display substrate. A laser bonding method for electrically connecting a display substrate and a plurality of drive driver substrates electrically connected to one side of the display substrate using an anisotropic conductive film, Arranging the display substrate, the anisotropic conductive film, and the driving driver substrate to form a plurality of junctions; And heating the anisotropic conductive film by converting each laser output from a plurality of laser oscillators into a single laser beam and irradiating the anisotropic conductive film. The method of claim 7, wherein And the method further comprises pressing the drive driver substrate on top of the drive driver substrate. The method of claim 7, wherein The single laser beam is a laser bonding method, characterized in that the line shape corresponding to the size of the anisotropic conductive film. The method according to claim 1 or 6, The apparatus further comprises a laser transmitter for guiding a path of each laser output from the laser oscillators to a beam former.

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