KR20040015945A - Bonding Equipment For Circuit Board And Anisotropic Conductive Film Of Flat Panel Display - Google Patents

Abstract

PURPOSE: A circuit board of a flat panel display and an anisotropic conductive film bonding apparatus are provided to improve work efficiency and process efficiency further by bonding the circuit board and the anisotropic conductive film on a bidirectional pattern part. CONSTITUTION: A rotation stage(4) is installed on an upper plane of a work table(2). A loading part(6) loads and sets a glass and a circuit board by being installed in a circumference direction of the rotation stage. A film bonding part(8) is installed adjacently to the rotation stage, and bonds an anisotropic conductive film(F) on a pattern part of the glass. A circuit board bonding part(10) bonds a circuit board on the glass. And a glass inversion part(12) is installed separately from the circuit board bonding part and resets the glass to enable to bond the circuit board and the anisotropic conductive film.

Description

Bonding Equipment For Circuit Board And Anisotropic Conductive Film Of Flat Panel Display}

The present invention relates to a circuit board and anisotropic conductive film bonding apparatus of a flat panel display, and more particularly, it is possible to easily bond the circuit board and the anisotropic conductive film to a two-way pattern portion formed on the glass, as well as the requirements for bonding The present invention relates to a circuit board and anisotropic conductive film bonding apparatus of a flat panel display that can significantly increase the efficiency of equipment by shortening the time and process.

In general, flat panel display devices such as LCD, ELD, and fluorescent display tube (VFD) have been diversified in use and function with the development of digital technology. Drive chip or circuit board (for example, PCB / Printed Circuit Board, FPC / Flexible Printed Circuit, TCP / Tape Carrier Package) is directly bonded to cope with this as it becomes smaller. have.

The glass to which the driving chip or the circuit board is bonded is formed adjacent to each other at the edge portion of the glass, and pattern portions of two or more directions are formed to bond the driving chip or the circuit board to the pattern portion, and the circuit board is made of glass. Since bonding accuracy is not much greater than that of the driving chip when bonding to the pattern portion of the bonding part, the bonding operation is easy and the electrical compatibility is improved. In recent years, the bonding part has been widely used together with the driving chip.

As described above, in order to bond the circuit board to the glass, the insulating adhesive layer of the anisotropic conductive film, that is, a film that provides insulation and adhesiveness to the pattern portion formed on the glass, is first bonded. After the process is performed in a separate process by the film bonding apparatus, the glass on which the film bonding is completed is transferred to the circuit board bonding apparatus to bond the circuit board.

The structure of the conventional circuit board bonding apparatus described above is briefly described, a table, a glass fixing plate provided on an upper side of the table, a circuit board fixing plate adjacent to the glass fixing plate, and fixing the circuit board; And a circuit board bonding unit for bonding the circuit board while pressing the surface to be bonded of the glass loaded on the glass fixing plate.

However, the above-described conventional circuit board bonding apparatus has an inline structure, which not only has different index times during loading and unloading of glass and circuit boards, but also bonds, and each process is made discontinuously, resulting in excessive holding time. Is inevitable, and it is difficult to expect satisfactory work efficiency and productivity.

In addition, the conventional circuit board bonding apparatus has a structure in which only a circuit board is bonded to glass, and thus structural limitations are involved in improving efficiency of processes and facilities.

In addition, in the conventional circuit board bonding apparatus, in order to bond the circuit board to the pattern portion of the glass formed in two directions, the glass must be set and loaded again each time, so that the bonding operation is discontinuous and takes excessive time. There is a problem that the efficiency and process efficiency is significantly reduced.

The present invention has been made to solve the conventional problems as described above, the object of the present invention is to easily bond the circuit board and the anisotropic conductive film to the two-way pattern portion formed on the glass, the work efficiency and process efficiency It is to provide a circuit board and anisotropic conductive film bonding device of a flat panel display that can further improve the efficiency of the equipment.

In order to realize the object of the present invention as described above, a worktable, a rotating stage rotatably installed on the upper side of the worktable, and a plurality of circumferential directions of the rotating stage are installed to load and set the glass and the circuit board. And a film bonding unit for bonding the anisotropic conductive film to the pattern portion of the glass, which is installed adjacent to the rotary stage in the workbench, and loaded into the loading unit, and the film bonding unit in the workbench. A circuit board bonding portion which is installed spaced apart from and bonded to the glass on which the insulating adhesive layer of the anisotropic conductive film is bonded by the film bonding portion, and spaced apart from the circuit board bonding portion described above on the glass Glass panel for resetting the glass to bond the circuit board and the anisotropic conductive film to the formed two-way pattern portion It provides a circuit substrate of a flat panel display and anisotropic conductive film bonding apparatus comprising: a.

1 is an overall perspective view of a circuit board and anisotropic conductive film bonding apparatus of a flat panel display according to the present invention.

FIG. 2 is a plan view illustrating the loading unit of FIG. 1; FIG.

3 is a side cross-sectional view of FIG.

Figure 4 is an enlarged cross-sectional view of the main portion for explaining the scanning member of FIG.

FIG. 5 is a front view illustrating a state in which an image scanned by the scanning member of FIG. 4 is displayed through a monitor; FIG.

Figure 6 is a plan view showing a cam plate of the separation portion of the loading portion of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention.

7A and 7B are a plan view and a cross-sectional view showing a state before the loading portions of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention are spaced apart by the separating means.

8A and 8B are a plan view and a sectional view showing a state after the operation of FIGS. 7A and 7B.

Figure 9 is a partially enlarged cross-sectional view showing another embodiment of the loading portion of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention.

Figure 10 is a partially enlarged cross-sectional view showing another embodiment of the loading portion of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention.

Figure 11 is an enlarged partial perspective view showing the enlarged film bonding portion of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention.

12 is a front view of FIG. 11;

FIG. 13 is an enlarged view illustrating main parts of the cutter part of FIG. 11 in an enlarged manner; FIG.

14 is a front view showing the film bonding head of FIG.

15 is a partially enlarged perspective view showing an enlarged circuit board bonding part of a circuit board and anisotropic conductive film bonding apparatus of a flat panel display according to the present invention;

16 is a plan view for explaining the glass sensing means of FIG.

FIG. 17 is a front view illustrating the circuit board bonding head of FIG. 15. FIG.

18 is a partially enlarged perspective view showing an enlarged glass inverting portion of a circuit board and anisotropic conductive film bonding apparatus of a flat panel display according to the present invention;

19 is a perspective view for explaining an operating state of the glass suction head of FIG.

20A is a plan view illustrating a state before glass is reset by the glass inverting portion of FIG. 18.

20B is a plan view illustrating a state in which the glass is reset by the glass inverting unit of FIG. 18.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in more detail.

1, 2, and 3, the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention, the worktable 2, the rotation is rotatably installed on the upper side of the worktable (2) The stage 4 and the loading part 6 which is provided in the circumferential direction of this rotating stage 4, and loads and sets the glass G and the circuit board B, and the said worktable 2 are mentioned above. A film bonding part 8 installed adjacent to the rotary stage 4 and bonding the anisotropic conductive film F to the pattern part G1 of the glass G loaded in the loading part 6; Bonding the circuit board B to the glass G in which the anisotropic conductive film F is bonded by the film bonding part 8 and spaced apart from the film bonding part 8 in one worktable 2. Of the glass (G) formed in two directions and spaced apart from the circuit board bonding portion (10) and the circuit board bonding portion (10) in the work table (2). And a turning sections (G1) to the circuit board (B) and all of the glass half of re-setting the above-described glass (G) to allow for bonding of the anisotropic conductive film (F) (12).

The work table 2 is a pipe member or a rod member of a metal material is joined by welding or bolting is made in the form of a box and the upper plate 14 is installed on the upper side.

The upper plate 14 is made of a plate-shaped metal material having a constant thickness and is integrally installed by welding or bolting on the upper side of the work table 2 described above.

The upper plate 14 may be a structure and a material that can prevent the surface from being deformed due to a load or an impact, and can maintain a constant flatness at all times.

On the lower side of the work bench 2, a plurality of supports 16 are provided for supporting the work bench 2 from the bottom, and the support 16 is not shown in the figure but is a cushioning member such as rubber or spring. It is preferable that the worktable 2 is provided with a structure capable of sufficiently buffering the shaking of the work table 2 by the minute vibration or the impact.

The rotating stage 4 is formed in the shape of a circular plate is fixed by a fastening member such as a bolt on the upper side of the rotary table (T) installed on the auxiliary frame 18 of the work table (2) is drilled in the upper plate (14) It is disposed inside the jin through hole 20.

The material of the rotating stage 4 may be a metal or synthetic resin material that minimizes vibrations or shocks and has less deformation.

An indexing drive table may be used as the rotary table T, and is connected to a drive switch 22 installed in the work table 2 so that the rotary table T may be rotated in one direction by manipulation of the switch 22. Since the table is configured to rotate itself by a separate driving source, the table is already widely used in a machine tool, an automation device, and a semiconductor device requiring accurate rotation operation, and thus a detailed description thereof will be omitted.

On the upper side of the rotating stage 4, a loading unit 6 for loading and setting the glass G and the circuit board B is installed, with reference to the accompanying drawings of the structure of the loading unit 6. It will be described in detail as follows.

The loading section 6 includes two circuit board setting units 24 mounted on one circumferential side of the rotary stage 4 for loading and setting the circuit board B, and the circuit board setting unit ( Adjacent to 24, the rotation stage (4) comprises a glass stage (26) which is movably installed by means of spaced apart and the glass (G) is loaded.

The circuit board setting unit 24 may be a conventional manual stage provided with one or more adjustment stages. In this embodiment, the positions of the X direction, the Y direction, and the θ direction are respectively corrected from the upper side. It consists of three stages 24a, 24b and 24c, and these stages are provided with adjustment knobs N, respectively.

Since the manual stage generally has the same or similar structure as that widely used for the purpose of setting the position and orientation of the loaded object in machine tools or semiconductor equipment, more detailed description will be omitted.

In the X-direction stage 22a of the circuit board setting unit 24, an adsorption hole H is formed, and the adsorption hole H is connected to a separate vacuum hose (not shown) to be loaded. The circuit board B can be adsorbed by vacuum.

The glass stage 26 is the rotary stage 4 inside the guide groove 28 and the auxiliary guide hole 30 formed adjacent to the circuit board setting unit 24 fixed to the rotary stage 4. The slide is installed to the guide rail (U1) arranged toward the center of the, the guide rail (U1) may be used "LM guide" consisting of a pair of guiders and a slider.

The glass stage 26 has a length in which two glasses G can be loaded corresponding to the two setting units 24, and the circuit board setting unit 24 has an upper side. Similarly, an adsorption hole H is formed to adsorb the glass G loaded in a vacuum, and the adsorption hole H is connected to a separate vacuum hose (not shown).

On the upper side of the glass stage 26, two long hole scanning holes 32 corresponding to the two glass G pattern portions G1 to be loaded are drilled, so that the auxiliary guide of the rotating stage 4 is formed. The setting position of the glass G and the circuit board B loaded on the glass stage 26 and the circuit board setting unit 24 is scanned by the scanning member S under the hole 30.

3 and 4, the scanning member S is set to face the scanning hole 32 of the glass stage 26 from the inside of the work table 2, and the glass G and The scanning hole 32 of the glass stage 26 is formed by a pair of pairs so as to scan two alignment points G2 and B2 marked on the pattern portions G1 and B1 of the circuit board B, respectively. It is fixed by the bracket 34 to correspond to.

The scanning member S may be a micro camera, and the camera is connected to the monitor 36 installed on the work table 2 and the glass G loaded on the loading unit 6. The alignment points G2 and B2 of the circuit board B are scanned and displayed through the monitor 36 in the conventional manner as shown in FIG.

In the above-described embodiment, the scanning member S is shown as being a microcamera in the description and drawings, but is not limited thereto. In addition, the alignment points G2 and B2 displayed on the glass G and the circuit board B may be used. Well-known types of sensing members for sensing the position of may also be used and it is natural that such a configuration falls within the scope of the present invention.

The glass stage 26 is set to maintain the state adjacent to the circuit board setting unit 24 while being supported by the elastic member 38 in the guide groove 28 of the rotary stage 4, Both ends of the elastic member 38 are fitted into fixing grooves 40 and 42 formed on sidewalls of the glass stage 26 and the guide groove 28, respectively.

The elastic member 38 may be used as a coiled compression coil spring, in addition to the elastic member that satisfies the object of the present invention can be applied to all.

In addition, a protruding extension portion 44 is formed on the lower side of the glass stage 26 to penetrate the auxiliary guide hole 30 drilled in the bottom of the guide groove 28 of the rotating stage 4. It extends downward, the separation means, that is, the cam plate 46 is fixed to the extension portion 44 of the glass stage 26 by a fastening member such as a bolt.

Referring to FIG. 6, the cam plate 46 has a guide surface 48 formed in a wedge shape with a gentle curve, and the guide surface 48 is formed in the auxiliary frame 18 of the work table 2. It is set to be in contact with the cam guide wheel 50 fixed at a position corresponding to the film bonding portion (8).

The cam plate 46 is guided to the cam guide wheel 50 when the loading part 6 is disposed on the film bonding part 8 while being rotated by the rotating stage 4. The glass stage 26 is spaced apart from the circuit board setting unit 24 at predetermined intervals (see 7a, 7b, 8a, and 8b).

The deviation D between the lower acting point P1 and the upper acting point P2 of the cam plate 46 is set by overlapping the pattern part B1 of the circuit board B with the pattern part G1 of the glass G. After that, the pattern portion G1 of the glass G is in a range in which the upper side can be opened from the pattern portion B1 of the circuit board B (see FIG. 6), and the cam plate ( 46) may be used a metal or synthetic resin material excellent in wear resistance.

In addition, the cam guide wheel 50 is formed in a roller shape, the material may be a metal or synthetic resin material having excellent wear resistance, the support shaft 52 fixed to the auxiliary frame 18 of the work table (2) Is rotatably fixed to the tip of the head.

The cam guide wheel 50 is an outer circumferential surface of the cam guide wheel 50 when the loading portions 6 are disposed on the film bonding portion 8 while being rotated by the rotating stage 4. The cam guide wheel 50 is set on the auxiliary frame 18 of the work table 2 so as to guide the guide surface 48 of the cam plate 46 to contact the upper operating point P2. Is preferably configured to smoothly rotate by a rolling member, such as a bearing (not shown), at the tip of the support shaft 52.

In the above embodiment, the glass stage 26 is configured to move horizontally along the guide rail U1 installed in the guide groove 28, but is not limited thereto.

For example, as shown in FIG. 9, the bottom surface 28a of the guide groove 28 is formed to be inclined downward toward the center of the rotating stage 4 and the guide rail U1 provided on the bottom surface 28a. ), The glass stage 26 can be slidably installed.

At this time, the lower surface 26a of the glass stage 26 is formed to be inclined to correspond to the inclination angle of the bottom surface 28a of the guide groove 28 so that the glass G loaded on the glass stage 26 is formed. It is set to move while keeping level.

When the glass stage 26 is installed on the bottom surface 28a of the guide groove 28 inclined at a predetermined angle as described above, the glass stage 26 is spaced apart, that is, the cam plate 46 and When the cam guide wheel 60 is separated from the circuit board setting unit 24 by the film bonding section 8 and returns to the original setting position, the pattern portion G1 of the glass G is connected to the circuit board (8). Since it is set while moving obliquely under the pattern portion B1 of B), the pattern portion G1 of the glass G loaded by the movement of the glass stage 26 and the pattern portion B1 of the circuit board B. Can be prevented from coming in contact with each other to prevent damage or deterioration in setting accuracy.

In addition, according to the above-described embodiment, the separation means for moving the glass stage 26 is composed of a cam plate 46 and a cam guide wheel 50 for guiding the cam plate 46. However, the separation means according to the present invention is not limited to the above embodiment.

For example, as illustrated in FIG. 10, the glass stage 26 of the loading unit 6 may be configured to be spaced apart from the circuit board setting unit 24 by using the cylinder C1.

The cylinder C1 is installed on the side wall of the bottom surface 28a while maintaining the same angle corresponding to the inclination angle of the bottom surface 28a of the guide groove 28, and the cylinder C1 is described above. When the loading unit 6 moves to the bonding position of the film bonding unit 8, the piston rod is operated to move the glass stage 26 of the loading unit 6 along the guide rails U1 at predetermined intervals. It is configured to be spaced apart from the circuit board setting unit 24 described above.

When the cylinder C1 is used as the separating means of the glass stage 26 as described above, when the anisotropic conductive film F is bonded to the pattern portion G1 of the glass G, the guide groove of the rotating stage 4 described above. The glass stage 26, which is inclined at 28, prevents backlash from being generated due to vertical pressing force during film bonding, so that a constant setting accuracy and bonding quality can be obtained at all times.

In addition to the above-described embodiment, the above-described separation means may be implemented by applying all means that satisfy the object of the present invention, and it is obvious that this also falls within the scope of the present invention.

1, 11, 12, and 13, the film bonding portion 8 is installed at the support plate 54 and the piston rod end of the cylinder C2 provided on the support plate 54. And a film bonding head 56 for bonding the anisotropic conductive film F to the pattern portion G1 of the glass G loaded in the loading portion 6, and the film bonding head 56 interposed therebetween. A supply reel R1 and a recovery reel R2 installed on the support plate 54 to supply and recover the anisotropic conductive film F, and between the film bonding head 56 and the supply reel R1. The insulating adhesive layer F1 of the anisotropic conductive film F supplied from the supply reel R1 to the inside of the cutter housing 58 installed on the support plate 54 is moved to the glass G. The cutter 60 cut | disconnects to the length corresponding to the pattern part G1.

First, the anisotropic conductive film F wound around the supply reel R1 will be briefly described. When bonding the circuit board B to the pattern portion G1 of the glass G, adhesiveness is maintained. And an insulating adhesive layer F1 and back paper F2 attached to the back surface of the insulating adhesive layer F1 for imparting insulating properties.

In the insulating adhesive layer F1, fine conductive particles having a ball shape are embedded in an insulator made of a thin film, and the patterns formed in the pattern portion G1 of the glass G are insulated from each other. It is to be bonded to the pattern portion (B1) of one circuit board (B), this anisotropic conductive film (F) is widely known and used in the art, so a detailed description thereof will be omitted.

The support plate 54 has a vertical portion 54a and a horizontal portion 54b substantially perpendicular to each other to form an “L” shape, and the circumferential one side of the rotating stage 4 in the work table 2 is formed. Sliding is installed on the guide rail (U2) installed adjacent to the.

The support plate 54 is screwed with a screw shaft connected to the drive motor M1 shaft between the guide rails U2 to drive the guide rail U2 by driving the drive motor M1. The drive motor M1 is set to be driven by the drive switch 22 installed in the work table 2, and the guide rail U2 is formed of a pair of guiders and sliders. Guide ”may be used.

Referring to FIG. 14, the film bonding head 56 may cover the entire pattern portion B1 corresponding to the pattern portion B1 of the circuit board B loaded on the loading portion 6. A pressing surface 56a of size is formed and a heat generating member W is installed inside.

The film bonding head 56 of the glass G loaded in the loading section 6 while moving in the vertical direction by the cylinder (C2) installed in the vertical portion (54a) of the support plate 54. The insulating adhesive layer F1 of the anisotropic conductive film F is bonded to the pattern portion G1.

In addition, the setting position of the film bonding head 56 is that the glass stage 26 of the loading part 6 moving to the film bonding position by the rotating stage 4 is the cam plate 46 and the cam guide wheel. The pattern portion G1 of the glass G, which is moved and loaded by the 50, is set at a point opened on the upper side from the pattern portion B1 of the circuit board B.

As the heating member W installed inside the film bonding head 56, a common coil heater in which the heating element has a coil shape may be used, and the heating member W may be used as the film bonding head 56. Electricity is applied when the bonding operation is set so as to generate heat by itself. Since the electrical connection structure is easily implemented by those skilled in the art, more detailed description thereof will be omitted.

The supply reel (R1) and the recovery reel (R2) is made of a common reel (REEL) form, the anisotropic conductive film (F) is wound around the supply reel (R1), the recovery reel (R2) The anisotropic conductive film F wound around the supply reel R1 is connected.

The recovery reel R2 is rotated in one direction by the driving motor M2 provided on the rear surface of the vertical portion 54a of the support plate 54, thereby rotating the supply reel R1 to supply the reel R1. ) Is supplied to the cutter housing 58 and the film bonding head 56 wound on the anisotropic conductive film F. When the insulating adhesive layer F1 of the anisotropic conductive film F is bonded, the insulating adhesive layer F1 is bonded. Collect the backing paper (F2) attached to the back of the).

The cutter housing 58 has a film guide groove 58a for guiding the anisotropic conductive film F and a cutter groove 58b for guiding the cutter 60.

The cutter 60 is installed in the cutter groove 58b of the cutter housing 58, and the piston rod of the cylinder C3 is coupled to the lower side thereof so that the cylinder C3 is driven upward and downward. While moving to set the insulating adhesive layer (F1) of the anisotropic conductive film (F) to be cut.

The cutter 60 is set to be cut to a length corresponding to the pattern portion G1 of the loaded glass G when cutting the insulating adhesive layer F1 of the anisotropic conductive film F, and such a cutting structure It is possible to appropriately adjust the piston operating cycle of the cylinder (C3) described above.

In addition, one or more guide rollers 62 are installed on the support plate 54 so that the anisotropic conductive film F sequentially supplied by the supply reel R1 and the recovery reel R2 may be smoothly guided. Is done.

The guide roller 62 is formed in a conventional roller shape so as to be rotatably installed in the vertical portion 54a of the support plate 54, and more preferably, the guide roller 62 is not shown in the drawings. It is better if the structure is provided with a tension control member that can smoothly adjust the tension of the anisotropic conductive film (F) guided by.

Referring to FIGS. 15 and 16, the circuit board bonding part 10 is provided at the tip of the piston rod of the fixed plate 64 and the two cylinders C4 provided on the fixed plate 64 and is anisotropically conductive. The circuit board bonding head 66 which bonds the circuit board B to the pattern part G1 of the glass G by which the film F was bonded, and the said fixing plate 64 are provided, and the circuit board B Glass sensing means for sensing the size and pattern portion of the glass (G) to be bonded.

The fixing plate 64 may be firmly fixed to the fixing bracket 68 installed adjacent to the circumferential surface of the rotating stage 4 in the work table (2).

Referring to FIG. 17, the circuit board bonding head 66 corresponds to the pattern portion B1 of the circuit board B set in the pattern portion G1 of the glass G. The pressing surface 66a of the size which can cover the whole is formed, and the heat generating member W which consists of a coil heater is installed inside.

The circuit board bonding head 66 having the above-described pattern portion G1 of the glass G loaded in the loading section 6 while moving upward and downward by the cylinder C4 provided on the fixed plate 64. The circuit board B is bonded.

The glass sensing means includes a first sensor 70 for sensing the pattern portion G1 of the glass G loaded on the glass stage 6, and a second length for sensing the diagonal length of the glass G. It consists of a sensor 72 is fixed in a fixed posture by the sensor bracket 74 in the fixed plate 64 is made to sense the two glasses (G).

The first sensor 70 corresponds to another pattern portion G1 formed adjacent to the pattern portion G1 of the glass G to which the circuit board B is bonded by the sensor bracket 74. It is set at a position to sense whether the circuit board B is set in the pattern portion G1.

In addition, the second sensor 72 determines the size by sensing the diagonal length of the loaded glass (G) by installing three spaced apart from the inside of the glass loaded by the sensor bracket 74 in the outer diagonal direction. The second sensors 72 are configured to sense diagonal edges of the glass G loaded in the glass stage 26 while sequentially operating from the outer sensor.

Although the data sensed by the first sensor 70 and the second sensor 72 is not shown in the drawing, the glass inverting unit 12 is operated by the control unit by being electrically connected to the control unit. It is made to reset the pattern portion (G1) of.

In the above description, although the second sensor 72 is fixed to the sensor bracket 74 and three are spaced apart from each other, the description and drawings are not limited thereto. In addition, the glass loaded on the glass stage 26 is described above. In consideration of the size of the model (G), at least one or more may be spaced apart from the sensor bracket 74 so as to determine the size by sensing the diagonal edges of the glass G loaded correspondingly.

The first sensor 70 and the second sensor 72 may be an optical sensor that emits light on the sensing surface of the object to sense by the reflected light, in addition to the glass (G) as described above Sensors of well-known types can be used to facilitate the sensing of.

In addition, referring to the accompanying drawings, the pressure sensor is located between the cylinder (C2, C4) piston rod of the film bonding portion 8, the circuit board bonding portion 10 and the bonding heads (56, 66). (L) is installed and this sensor (L) can be used a conventional load cell (LOAD CELL).

The pressure sensor (L) detects that the bonding heads 56 and 66 come into contact with excessive pressure when bonding while pressing the anisotropic conductive film (F) or the circuit board (B). It is set to stop the operation of (C2, C4) so that the pattern portion G1 of the glass G or the pattern portion B1 of the circuit board B is caused by excessive pressure of the bonding heads 56 and 66. Not only can damage be prevented in advance, but also optimum bonding quality can be obtained.

1, 18, and 19, the glass inverting portion 12 described above can slide on the guide plate 76 and the guide rail U3 arranged in the longitudinal direction of the guide plate 76. Horizontal plate 78, the vertical plate 80 which is slidably mounted on the guide rail U4 installed in the vertical direction from the horizontal plate 78, and the rotary plate installed in the vertical direction in the vertical plate 80. The suction head 82 is installed on the piston rod of the cylinder C5 and absorbs the glass G to which the circuit board B is bonded.

The guide plate 76 is installed on the movable bracket 84, which is slidably mounted on the guide rail U5 from the worktable 2, and is installed to be slidably moved toward the center of the rotating stage 4 above. do.

The moving bracket 84 is screwed to a screw shaft coupled with a drive motor M3 shaft installed between the guide rails U5 to guide the guide rail U5 by driving the motor M3. Is moved along.

The horizontal plate 78 is slidably installed on the guide rail U3 installed in the longitudinal direction of the guide plate 76, the horizontal plate 78 is a guide rail of the guide plate 76 above. Screwed to the screw shaft connected to the drive motor (M4) shaft between the (U3) is moved in the longitudinal direction of the guide plate 76 by the drive of the drive motor (M4).

The vertical plate 80 is made to move in the vertical direction along the guide rail (U4) installed in the vertical direction from the horizontal plate 78 by a cylinder (C6) installed on the upper side of the horizontal plate (78). The vertical plate 80 is provided with a rotary cylinder C5 and an adsorption head 82 is installed on the piston rod of the cylinder C5.

The adsorption head 82 is formed in a conventional rubber adsorption plate shape (conical shape), and is connected to a separate vacuum hose to adsorb the upper surface of the glass G loaded on the glass stage 26 by vacuum.

As the guide rails U3, U4, and U5 installed on the guide plate 76, the horizontal plate 78, and the moving bracket 84, a "LM guide" composed of a pair of guiders and sliders may be used. The driving motors M4 and M3 and the rotary cylinder C5 installed between the rails U3 and U5 are sent by the control unit when the data sensed by the glass sensing means of the circuit board bonding unit 10 is sent to the control unit. The following control takes place and the glass (G) is reset.

Another pattern portion G1 adjacent to the sensing portion of the circuit board bonding portion 10, that is, the pattern portion G1 on which the circuit board B is set in the glass G loaded with the first sensor 70. And the second sensor 72 senses an outer edge of the loaded glass G and sends the sensor to the controller. The controller inverts the glass inverting unit 12 according to the data sensed by the sensing means. Drive brackets (M3, M4) of the movable bracket (84) and the guide plate (76), the cylinder (C6) of the horizontal plate (78), the rotary cylinder (C5) and the suction head (82) of the vertical plate (80). 19) by adsorbing the glass G by the adsorption head 82 as shown in FIG. 19, and then moving another pattern portion G1 of the glass G while moving in the X, Y and θ directions. The circuit board B is reset to a position where setting and bonding are possible (see FIGS. 20A and 20B).

As described above, the data sensed by the circuit board bonding unit 10 is sent to the control unit, and the glass inverting unit 12 is controlled by the control unit so that the electrical connection structure for resetting the glass G is common in the art. If the knowledge is easy to implement it will be omitted more detailed description.

Next, the bonding operation of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention having the above-described structure will be described in more detail with reference to the accompanying drawings.

1, 2, and 3, the loading unit 6 installed in the rotating stage 4 and disposed at the loading position, that is, the glass stage 26 and the two circuit board setting units 24, is provided. The glass G and the circuit board B are loaded, respectively, wherein the glass G and the circuit board B are loaded in the direction in which the drive switch 22 is installed on the work table 2.

When the loading of the glass G and the circuit board B to the loading unit 6 is completed, the glass G and the circuit board B on which the scanning member S installed under the loading unit 6 is loaded. Scanning the alignment points (G2, B2) is displayed on the monitor 36, as shown in Figure 5, if the deviation of the alignment point (G2, B2) exceeds the allowable setting range, the circuit board The adjustment knob N of the setting unit 24 is used to move the position of the adjustment stages 245a, 34b, and 24c while setting them within the allowable range.

After the loading and setting of the glass G and the circuit board B are completed in the loading part disposed at the loading position by the above process, the driving stage 22 of the work table 2 is pressed to rotate the above-mentioned stage 4. Rotation of this stage 4 rotates the counterclockwise 120 ° and then stops, so that the loading part 6 which has been placed in the loading position is moved to the film bonding part 8 and the loading position of the work table 2 Another loading section 6 is arranged.

At this time, the glass stage 26 of the loading part 6 moving from the loading position to the film bonding part 8 has the work table described above with spaced apart means installed on the lower side, that is, the cam plate 46 as shown in FIGS. 7A and 7B. Guided by the cam guide wheel 50 installed in the (2) while moving along the guide groove 28 of the rotary stage 26, the pattern portion (G1) of the loaded glass (G) to the circuit board (B) Are spaced apart from the pattern portion B1 of FIG. 8 (see FIGS. 8A and 8B).

In the loading part 6 disposed at the loading position by the above-described process, the glass G and the circuit board B are set in the same manner as the above loading method, and the moving part is moved to the film bonding part 8 to the circuit board. The insulating adhesive layer F1 of the anisotropic conductive film F is bonded to the pattern portion G1 of the glass G spaced apart from the pattern portion B1 of (B) by the film bonding head 56. 11, see FIG. 12)

In the film bonding part 8, the anisotropic conductive film F wound around the supply reel R1 is rotated by the cutter 60 while the supply reel R1 and the recovery reel R2 are rotated. When only (F1) is cut and supplied to the film bonding head 56, the film bonding head 56 is moved downward by the cylinder C2 and the pattern of the glass G loaded on one glass stage 26. After bonding the insulating adhesive layer F1 to the portion G1, the glass substrate B is set in the glass stage 26 by moving along the guide rail U2 by the driving motor M1. The insulating adhesive layer F1 of the anisotropic conductive film F is bonded to the pattern part G1 of G).

After the above process is completed, when the driving switch 22 is pressed again, the rotating stage 4 is rotated so that the loading part 6 disposed at the loading position is disposed as the film bonding part 8 and the film The loading part 6, which is loading the glass G to which the anisotropic conductive film F is bonded in the bonding part 8, moves to the circuit board bonding part 10.

At this time, the glass stage 26 of the loading unit 6 moving from the film bonding unit 8 to the circuit board bonding unit 10 is rotated by the rotation stage 4. The cam plate 46 installed at 26 is guided to the cam guide wheel 50 and is returned to its original setting position by the elastic member 38. Thus, the pattern portion G1 of the glass G is described above. It overlaps with the circuit board B and is set again within the setting range.

When the glass G and the circuit board B set to the original setting positions as described above are moved to the position where the circuit board bonding unit 10 can bond, the bonding of the circuit board bonding unit 10 is performed. While the head 66 moves downward by the cylinder C4, bonding is performed while pressing the set glass G and the pattern portions G1 and B1 of the circuit board B. The glass sensing means, that is, the first sensor 70 and the second sensor 72 is another pattern formed in a direction substantially orthogonal to the pattern portion G1 of the glass G on which the circuit board B is set. The setting of the circuit board B and the size of the glass G are sensed by the unit G1, and the sensed data is sent to the controller (not shown).

After the bonding of the circuit board B and the sensing of the glass G are completed in the circuit board bonding unit 10 as described above, by pressing the drive switch 22 again, the rotation stage 4 is rotated again. The loading part 6 located in one circuit board bonding part 10 is disposed in the glass inverting part 12 by stopping after rotating 120 ° counterclockwise, and the loading position and the film bonding part 8 described above. The loading parts 6 that were disposed in the film bonding part 8 and the circuit board bonding part 10 are respectively disposed.

The glass G loaded in the loading unit 6 located in the glass inverting unit 12 by the above process is sensed by the sensing means when the glass inverting unit 12 bonds the circuit board B. After the operation is controlled by the controller according to the sensed data, the glass G is adsorbed, and then another circuit board is connected to the pattern part G1 adjacent to the pattern part G1 of the glass G to which the circuit board B is bonded. Resetting is performed while moving in the X direction, the Y direction, and the θ direction to enable the setting of.

In addition, the glass substrate G of the loading units 6 disposed in the circuit board bonding unit 10 and the film bonding unit 8 by the rotation of the rotating stage 4 is the circuit board B in the same manner as described above. ) And the anisotropic conductive film (F) is bonded, the glass (G) and the circuit board (B) is loaded and set in the loading section 6 disposed in the loading position, respectively.

When the rotating stage 4 is rotated again after the above process is completed, the glass G in which the position of the pattern part G1 is reset in the glass inverting unit 12 is disposed and reset to the initial loading position. After loading and setting the circuit board B in the pattern part G1 again, the anisotropic conductive film F and the circuit board B are sequentially bonded while the rotating stage 4 is rotated. Done.

In addition, the circuit board B is bonded to the pattern portion G1 formed in the glass G in two directions by the above-described process, and thus the circuit board is bonded by the first sensor 70 of the glass sensing means. When (B) is detected, the glass inverting unit 12 is not operated by the control unit and passes the glass G loaded on the loading unit 6 as it is, and the glass G thus passed is the loading position. In the loading unit 6, which is unloaded from and stored in a separate storage tray (not shown), and the glass G is unloaded, the glass G and the circuit board B are loaded and set respectively. Bonding is performed through the above process.

In the above, a preferred embodiment of a circuit board and an anisotropic conductive film bonding apparatus of a flat panel display according to the present invention has been described. However, the present invention is not limited thereto, and the claims and the detailed description of the invention and the accompanying drawings are various. It is possible to carry out modification by branch, and this also belongs to the scope of the present invention.

As described above, the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention have a glass pattern formed in two directions while the glass inverting part is operated in accordance with the data sensed by the glass sensing means of the circuit board bonding part. By resetting the circuit board to enable bonding, the anisotropic conductive film and the circuit board are continuously bonded, thereby greatly reducing the time and process required for the bonding operation, thereby improving work efficiency and equipment efficiency.

In addition, the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention are returned again after the glass stage of the loading unit is spaced apart from the circuit board setting unit at a predetermined interval from the film bonding unit by a spaced apart means. It is composed of a structure that is set so that the film can be continuously bonded without any holding time during film bonding, and the film can be easily bonded to the pattern portion of the loaded glass without installing additional processes and devices. Bonding efficiency and quality can be further improved.

Claims (15)

A working stage, a rotating stage rotatably installed on an upper side of the working stage, a plurality of plurally installed in the circumferential direction of the rotating stage, for loading and setting a glass and a circuit board, and the rotating stage described above in the working bench. A film bonding part for bonding an anisotropic conductive film to a pattern portion of the glass which is installed adjacent to and loaded in the loading part, and spaced apart from the film bonding part in the workbench, and is anisotropic by the film bonding part Circuit board bonding part for bonding a circuit board to the glass on which the insulating adhesive layer of the conductive film is bonded, and a circuit board and anisotropic conductivity in the pattern part of the glass formed in two directions and spaced apart from the circuit board bonding part in the work table Circuit board of the flat panel display including a glass inverting part for resetting the glass to enable bonding of the film and Anisotropic conductive film bonding device. The circuit board and anisotropic conductive film bonding apparatus of claim 1, wherein the rotating stage is rotated in one direction by a rotating table installed on the work table, and the rotating table comprises an indexing drive table. The method according to claim 1, wherein the loading unit is installed on the rotary stage by at least two circuit board setting unit for loading and setting the circuit board, and the spaced apart means in the rotation stage corresponding to the circuit board setting unit And a glass stage that is movably installed and loaded with glass, wherein the glass stage is disposed toward the center of the rotating stage in a guide groove and an auxiliary guide hole formed adjacent to a circuit board setting unit fixed to the rotating stage. The circuit board and the anisotropic conductive film bonding apparatus of a flat panel display, which is installed to be slidable on the guide rail, which is spaced apart from the circuit board setting unit by a predetermined distance from the film bonding unit at a predetermined interval and then returned. . The circuit board of claim 3, wherein the circuit board setting unit comprises a manual stage provided with three stages for correcting positions of the loaded circuit board in the X, Y, and θ directions. And anisotropic conductive film bonding apparatus. The scanning stage of the glass stage according to claim 1, wherein the glass stage loading surface of the loading unit is provided with a scanning hole having a long hole shape corresponding to the pattern portion of the glass to be loaded, and the scanning groove of the glass stage is set in the guide groove of the rotating stage. A substrate and anisotropic conductive film bonding apparatus of a flat panel display for scanning the alignment point of the glass and the circuit board loaded by the scanning member fixed toward the hole in the worktable is drilled corresponding to the hole. The method of claim 5, wherein the scanning member is a circuit board and anisotropic conductive film bonding device of a flat panel display consisting of a micro camera (Micro Camera). The method of claim 3, wherein the separation means for moving the glass stage is a circuit board and anisotropic conductive film bonding apparatus of a flat panel display made of any one of a pair of cam plate, cam guider or cylinder. The film bonding head of claim 1, wherein the film bonding unit comprises: a support plate; and a film bonding head attached to a tip of a piston rod of a cylinder installed on the support plate, and bonding an anisotropic conductive film to a pattern portion of glass loaded in the loading unit. A feed reel and a reel installed on the support plate with the film bonding head interposed therebetween to supply and recover the anisotropic conductive film, and a cutter housing provided on the support plate between the film bonding head and the supply reel. The circuit board and the anisotropic conductive film bonding apparatus of the flat panel display including a cutter which is installed to be movable inside to cut the insulating adhesive layer of the anisotropic conductive film supplied from the supply reel to a length corresponding to the pattern portion of the glass. The method according to claim 8, wherein the support plate is slidably installed on the guide rail installed on the workbench to the film bonding head installed on the plate to a position corresponding to the two or more glass pattern portion loaded on the glass stage Circuit board and anisotropic conductive film bonding device for moving flat panel display. The circuit board bonding unit according to claim 1, wherein the circuit board bonding unit comprises a fixed plate and a bonding head for bonding the circuit board to the pattern portion of the glass on which the anisotropic conductive film is bonded to the front end of the piston rod of the two cylinders provided on the fixed plate; The circuit board and the anisotropic conductive film bonding apparatus of the flat panel display comprising a glass sensing means for sensing the size and pattern portion of the glass for bonding the circuit board is bonded to the fixed plate. The method according to claim 10, wherein the glass sensing means comprises a first sensor for sensing the pattern portion of the glass loaded on the glass stage, and the second sensor for sensing the size of the glass fixed by the sensor bracket in the fixing plate The first sensor is set at a position corresponding to another pattern portion formed adjacent to the pattern portion of the glass to which the circuit board is bonded by the sensor bracket to sense whether the circuit board is set in the pattern portion. Wherein, the second sensor is a circuit board and anisotropic conductive film bonding device of the flat panel display for sensing the size of the loaded glass is installed two or more spaced apart in the diagonal direction of the glass loaded by the sensor bracket. 12. The circuit board and anisotropic conductive film bonding apparatus of claim 11, wherein the first sensor and the second sensor of the above means comprise an optical sensor which senses by the reflected state of the emitted light. The glass inverting portion as set forth in claim 1, wherein the glass inverting portion is slidably movable on a guide plate, a horizontal plate slidably mounted on a transport rail disposed in the longitudinal direction of the guide plate, and a guide rail provided in a vertical direction on the horizontal plate. And an adsorption head mounted on a piston rod of a rotary cylinder installed in a vertical direction on the vertical plate, and a suction head for adsorbing glass bonded to the circuit board. The method according to claim 13, wherein the glass inverting portion by the sensing means of the circuit board bonding portion of the glass substrate with the adsorption head so that the circuit board can be set to another pattern portion adjacent to the pattern portion of the glass bonded the circuit board. Circuit board and anisotropic conductive film bonding apparatus of a flat panel display which is reset while being moved in the X, Y and θ directions after adsorption. The method according to claim 3, wherein the guide groove of the rotating stage, the glass stage is installed is a circuit board and anisotropic conductive film bonding of the flat panel display bottom surface is inclined in the range of 0 ° to 10 ° downward toward the center of the rotating stage Device.