KR20040006224A - Bonding Equipment For Anisotropic Conductive Film And Drive Chip Of Flat Panel Display - Google Patents

Abstract

PURPOSE: An anisotropic conductive film of a flat display and a device for bonding a drive chip are provided to reduce a time required for a bonding work by shortening a holding time for loading and unloading a glass. CONSTITUTION: A first rotary stage(4) is rotatively installed on one side of a work table(2) for loading and unloading a glass(G). A second rotary stage(6) is installed on the work table, separated from the first rotary stage. A glass transfer unit(8) is installed between the first rotary stage and the second rotary stage on the work table. A film bonding unit is arranged on one side of a peripheral surface of the second rotary stage for bonding an anisotropic conductive film. A chip setting unit(12) sets a drive chip to a pattern part of the glass. A chip bonding unit(14) is arranged on one side of an outer peripheral surface of the second rotary stage for bonding the set drive chip.

Description

Bonding Equipment For Anisotropic Conductive Film And Drive Chip Of Flat Panel Display}

The present invention relates to an anisotropic conductive film and a driving chip bonding apparatus of a flat panel display, and more particularly, to minimize the holding time generated during loading and unloading of glass and setting the driving chip, while rotating the loaded glass in one direction. The present invention relates to an anisotropic conductive film and a driving chip bonding apparatus of a flat panel display that can significantly improve the productivity, work efficiency, and facility efficiency by significantly reducing the time and process required for bonding by bonding an anisotropic conductive film and a driving chip.

In general, flat panel display devices such as LCD, ELD, and fluorescent display tubes (VFD) are bonded directly to the pattern portion of the glass in order to meet the trend of light and thin. It is becoming.

In order to bond the driving chip to the pattern portion of the glass as described above, first, the insulating adhesive layer of the anisotropic conductive film is bonded by an anisotropic conductive film bonding process of bonding the anisotropic conductive film to the pattern portion of the glass. Then, the glass bonded with the insulating adhesive layer is transferred to the driving chip bonding process, that is, the driving chip bonding apparatus, so that the driving chip is set on the upper surface of the insulating adhesive layer bonded to the pattern portion of the glass by the anisotropic conductive film bonding process. do.

As described above, when the anisotropic conductive film is attached to the pattern portion of the glass, the driving chip bonded to the pattern portion of the glass has the optimum conductivity and is smoothly bonded, and the glass and the driving chip are bonded when the glass and the driving chip are bonded. At least one of the patterns formed on the pattern portion of the to maintain the state insulated from each other to meet the adhesion, insulation, conductivity, etc. required for bonding the glass and the driving chip to improve the bonding quality.

The general structure of the conventional driving chip bonding apparatus includes a work table, a glass fixing plate installed on an upper side of the work table for loading glass, and a pattern portion of the glass loaded on the glass fixing plate in the work table. And a chip bonding part for setting a driving chip in the chip, and a chip bonding part for bonding the driving chip set in the pattern part of the glass to the workbench.

However, the above-described conventional driving chip bonding apparatus has an inline structure, which requires an excessive number of people and time in loading and unloading the glass and setting the chip. Improving efficiency and productivity is structurally bounded.

In addition, the conventional driving chip bonding apparatus has only a structure for bonding the driving chip to the loaded glass and bonds the insulating adhesive layer of the anisotropic conductive film to the pattern portion of the glass by a separate anisotropic conductive film bonding process. It is difficult to expect a satisfactory efficiency of the process since the bonding to the driving chip bonding apparatus to the driving chip bonding apparatus.

The present invention has been made to solve the conventional problems as described above, the object of the present invention is to load and unload the glass, and the pattern portion of the loaded glass while minimizing the holding time generated during the setting of the driving chip The present invention provides an anisotropic conductive film and a driving chip bonding apparatus for a flat panel display that can significantly reduce work time and process by bonding an anisotropic conductive film and a driving chip to improve productivity and work efficiency.

In order to realize the object of the present invention as described above, a worktable, a first rotating stage rotatably installed on one side of the upper surface of the worktable and the glass is loaded and unloaded, and spaced apart from the first rotating stage as described above A second rotating stage installed on the upper surface of the work table, a glass conveying part provided between the first rotating stage and the second rotating stage on the working table, and disposed on one side of the circumferential surface of the second rotating stage. A chip bonding part for bonding a conductive film, and a chip set part disposed on one side of the circumferential surface of the second rotating stage and setting a driving chip on a pattern part of the glass to which the anisotropic conductive film is bonded by the film bonding part; A flat plate disposed on one side of the outer circumferential surface of the second rotating stage and including a chip bonding unit for bonding the driving chip set to the pattern unit of the glass by the chipset setting unit; It provides an anisotropic conductive film, and the driving chip bonding device for display.

1 is an overall perspective view of an anisotropic conductive film and a driving chip bonding apparatus of a flat panel display according to the present invention.

2 is a plan view showing a first rotating stage and a second rotating stage of the anisotropic conductive film and driving chip bonding apparatus of the flat panel display according to the present invention.

Figure 3 is a partial perspective view showing a first glass loading portion of the glass transfer portion of the anisotropic conductive film and driving chip bonding apparatus of the flat panel display according to the present invention.

4 is a partial perspective view illustrating a second glass loading part of FIG. 3;

Figure 5 is a partial perspective view of the main part of Figure 1;

Figure 6 is a partial perspective view showing the film bonding portion of the anisotropic conductive film and driving chip bonding apparatus of a flat panel display according to the present invention.

7 is a front view of FIG. 6;

8 is a partial perspective view illustrating a state in which the film bonding head of FIG. 6 bonds the insulating adhesive layer of the anisotropic conductive film.

FIG. 9 is a perspective view illustrating a state in which an insulating adhesive layer of an anisotropic conductive film is bonded to the pattern portion of glass by FIG. 8; FIG.

FIG. 10 is a bottom view of the film bonding head of FIG. 8. FIG.

FIG. 11 is a partial perspective view illustrating a chipsetting unit of an anisotropic conductive film and a driving chip bonding apparatus of a flat panel display according to the present invention; FIG.

12 is an enlarged view of FIG. 11;

FIG. 13 is a perspective view illustrating the chip centering unit of FIG. 11; FIG.

14 is a cross-sectional view of FIG.

FIG. 15 is a bottom view illustrating an adsorption head of the first adsorption part of FIG. 11; FIG.

16 is a bottom view illustrating an adsorption head of the second adsorption part of FIG. 11;

17 is a perspective view illustrating a chip bonding portion of an anisotropic conductive film and a driving chip bonding apparatus of a flat panel display according to the present invention;

18 is a bottom view of the adsorption head of FIG. 17.

19 is a partially enlarged view for explaining a process in which a glass scanning member of an anisotropic conductive film and a driving chip bonding apparatus of a flat panel display scans a glass position according to the present invention;

20 is a partially enlarged view illustrating a state in which a driving chip is set in a pattern portion of glass by a chipset setting portion of an anisotropic conductive film and a driving chip bonding apparatus of a flat panel display according to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1, 2, 3, and 4, the anisotropic conductive film and the driving chip bonding apparatus of the flat panel display according to the present invention, the worktable 2, and the worktable 2 is rotatably rotatable on one side of the upper surface. The first rotary stage 4 is installed and the glass (G) is loaded and unloaded, and the second rotary stage (6) spaced apart from the first rotary stage 4 is installed on the upper side of the work table (2) ), A glass feeder 8 provided between the first rotating stage 4 and the second rotating stage 6 in the worktable 2, and the circumferential surface of the second rotating stage 6. An anisotropic conductive film (10) disposed on one side and bonded to the anisotropic conductive film (F) and disposed on one side of the circumferential surface of the second rotating stage (6) by the film bonding portion (10) The chipset setting part 12 for setting the driving chip C to the pattern part G1 of the glass G bonded with F) is disposed on one side of the outer circumferential surface of the second rotating stage 6. It is includes a chip bonding unit 14 for bonding the driving chip (C) setting the pattern portion (G1) of the glass (G) by the chip setting part 12.

The workbench 2 is formed by connecting a metal plate by welding or bolting to form a frame in a rectangular shape, and an upper plate 16 is installed on an upper side and a supporter 18 for supporting on a bottom side. Is installed.

The upper plate 16 is made of a plate-shaped metal material having a constant thickness and is integrally installed by welding or bolting on the upper side of the work table 2, and the surface sags due to load, impact, and temperature change. It is better if the shape and material that can prevent the deformation or deformation and always maintain a constant flatness (flat surface).

The support 18 is for supporting the work table 2 spaced apart from the bottom at regular intervals and may be formed in various forms in addition to the shape shown in the drawings, more preferably a shock absorbing member such as rubber or spring ( Not shown) is provided is more preferably made of a structure capable of sufficiently buffering the workbench shaken by a fine vibration or shock.

In addition, the upper plate 16 installed on the work bench 2 is not necessarily required in the configuration of the present invention, and when the work bench 2 is manufactured, the role of the upper board 16, that is, a constant plan view is maintained. It may be formed into a structure that can prevent the surface from being deformed by the load.

The first rotating stage 4 is formed in the form of a circular plate made of metal and is fixed to the upper side of the rotary table T installed on the pedestal 20 from the upper side of the work table 2.

The rotating table (T) is used as an indexing drive table (Indexing Drive Table), the table is composed of a structure that rotates itself by a separate drive source is a general machine tool and automated equipment requiring accurate rotation (Rotation) Since it is widely used and the like, more detailed description thereof will be omitted.

The rotary table T is electrically connected to the drive switch 22 installed on the upper side of the work table 2, and when the drive switch 22 is pressed once, the rotary table T rotates 90 ° in the direction of the arrow shown in FIG. 2. It is set to stop.

According to the above embodiment, the rotary table T is controlled by a button-type drive switch 22 for switching by the hand of the body, but it is shown in the description and drawings, but is not limited thereto.

For example, by installing a foot pedal (not shown) on the bottom surface of the work table (2), the operator can control the driving of the rotary table (T) using the feet of the body. It is also possible to configure so that it can be configured or a separate timer (not shown) can be configured to automatically rotate and stop after the set time elapses, in addition to the object of the present invention in consideration of working conditions The control structure and method of satisfying the table can be implemented by various applications.

The pedestal 20 is a box-shaped metal or synthetic resin material which is installed on the upper side of the upper plate 16 of the work table 2 to fix the rotary table T on the upper side of the work table 2. It may be made of, it is better if the material is not deformed and reduced the impact or vibration.

The height of the pedestal 22 is such that the first rotating stage 4 of the rotary table T installed on the upper side of the pedestal 22 can be fixed at the same height as the second rotating stage 6 described later. This structure is not necessary for the configuration of the present invention, and the rotary table T provided with the first rotary stage 4 can be directly fixed to the upper plate 16, and of course, the above described It is preferable that the same height is set in consideration of the height deviation from the second rotating stage 6.

On the upper side surface of the first rotating stage 4, a pair of stages 24 are spaced apart at intervals of 90 degrees along the circumferential direction of the first rotating stage 6.

The stage 24 is formed in the shape of a square plate having a predetermined thickness corresponding to the shape of the glass G to be loaded, and the entire surface of the glass G so that the glass G can be loaded and seated smoothly. It is made of a size that can accommodate.

The material of the stage 24 may be a metal or a synthetic resin, in addition to the material that can minimize and prevent the surface of the loaded glass (G) to be scratched or broken.

The second rotary stage 6 has the same structure as that of the first rotary stage 4, that is, a circular plate shape, and the rotary table T1 of the first rotary stage 4 in the work table 2. It is fixed to the upper side of the rotary table T2 spaced apart from the scanning hole 26 for scanning the pattern portion G1 of the glass G to be loaded in the circumferential direction.

The scanning holes 26 are formed to have a size to accommodate the entire pattern portion G1 of the loaded glass G and are spaced apart from each other in the circumferential direction of the second rotating stage 6.

As the rotary table T2 in which the second rotary stage 6 is installed, the same indexing drive table as the rotary table T1 fixing the first rotary stage 4 is used. The table T2 is provided to be movable in the transverse direction and the longitudinal direction by the transverse plate 28 and the longitudinal plate 30 which move in the direction orthogonal to each other on the upper plate 16 of the work table 2 described above.

On the lower surfaces of the transverse plate 28 and the longitudinal plate 30, guide rails U disposed in the transverse direction and the longitudinal direction, respectively, are installed at the work table 2, and the plates 28 and 30 are installed. It is supported to be movable in the worktable 2 mentioned above.

The guide rail U may be a conventional LM guide composed of a pair of sliders and guiders, and the glass transfer unit 8, the film bonding unit 10, the chipset bonding unit 12, and the chip bonding unit (described later) may be used. The guide rails installed in 14) also have the same or similar structure.

In addition, the horizontal plate 28 and the vertical plate 30 are installed through the drive motor M1 shaft having a thread formed therebetween the guide rails U, and the above-mentioned by the driving of this motor M. The transverse plate 28 and the longitudinal plate 30 are moved in the transverse direction and the longitudinal direction, respectively, on the upper surface of the work table 2 described above.

Between the first rotary stage 4 and the second rotary stage 6 is provided with a glass transfer unit 10 for transferring the glass (G) loaded on these rotary stages (4, 6), such a glass Referring to the structure of the sending unit 8 in more detail with reference to the accompanying drawings as follows.

The glass transfer unit 8 is a slide plate 32 which is installed to be movable on one side of the pedestal 20 of the first rotating stage 4, and is provided on the upper side of the slide plate 32 A guide plate 34 extending in a form connecting the first rotating stage 4 and the second rotating stage 6, and the first rotating stage 4 installed on one side of the guide plate 34; The first glass loading portion 36 to transfer the glass (G) loaded on the) to the second rotating stage (6) and to load the glass (G), and the first glass loading portion 36 in the guide plate 34 It is installed on the other side of the) includes a second glass loading unit 38 for loading the glass (G) loaded on the second rotary stage (6) to the first rotary stage (4).

The slide plate 32 is fixed to a pair of guide rails U on the upper surface of the pedestal 20 so as to be movable between the first rotating stage 4 and the second rotating stage 6. Is installed.

Between the guide rails U, the drive motor M2 shaft having a screw thread is screwed with one side of the slide plate 32 to drive the slide plate 32 by driving the motor M3. It moves along one guide rail (U).

The guide plate 34 is a vertical portion (34a) and the horizontal portion (34b) of the "T" shaped plate made of a lower surface of the vertical portion (34a) on the upper side of the slide plate (32). Both sides of the horizontal portion 34b are fixed and extended to a position corresponding to the glass G loaded on the first rotating stage 4 and the second rotating stage 6.

The first glass loading portion 36 is provided on one side of the horizontal portion 34b of the guide plate 34 and moves horizontally to the horizontal portion 40 of the horizontal portion 34b. Coupled to the shaft of the vertical plate 42 which moves up and down by the piston rod of the cylinder C1 provided at the tip of the plate 40 and the step motor M4 fixed to the vertical plate 42, Adsorption plate (44) for adsorbing the glass (G) loaded on the first rotary stage (4) and loaded on the second rotary stage (6).

The horizontal plate 40 is installed to be movable in the horizontal direction by the guide rail (U) installed on the guide plate 34, between the guide rail (U) of the drive motor (M5) is formed with a thread The shaft penetrates and moves along the guide rail U by the driving of the motor M5.

In addition, the vertical plate 42 is also fixed to the guide rail (U) installed in the horizontal plate 40 is moved in the vertical direction by the driving of the cylinder (C1).

The suction plate 44 installed at the tip end of the step motor M5 may be a conventional vacuum suction plate that adsorbs the adsorbed object by using a vacuum, and the suction plate 44 may include the adsorbed glass G. The driving chip C when the pattern portion G1 formed in various forms on the glass G to be sucked by the motor M4 and loaded on the second rotating stage 6 is loaded. ) Is properly rotated to the position to be set and bonded.

Referring to FIG. 4, the second glass loading unit 38 includes a horizontal plate 46 installed on the other side of the first glass loading unit 36 in the guide plate 34. It consists of a suction plate 48 provided at the tip of the piston rod of the cylinder (C2) is installed on the horizontal plate 46.

The horizontal plate 46 is movable in the longitudinal direction of the guide plate 34 by the same transport structure as the first glass loading unit 36, that is, the guide rail U and the drive motor M6. The glass (G) in which the driving chip (C) is bonded on the second rotating stage (6) by the suction plate (48) installed on the piston rod of the cylinder (C2) installed on the horizontal plate (46). It is adsorbed to move to the first rotating stage (4) to be loaded.

On the other hand, in the horizontal plate 28 provided below the second rotating stage 6, the support frame 50 is installed in a form that crosses the center of the second rotating stage 6, and this support frame ( 50) On one side, a film bonding portion 10 for bonding the anisotropic conductive film F to the pattern portion G1 of the glass G loaded on the second rotating stage 6 is installed. Referring to the structure of 10 in more detail with reference to the accompanying drawings as follows.

1, 5, 6, and 7, the film bonding part 10 includes a support plate 52 and a pattern of the glass G loaded from one side of the support plate 52. A slide plate 54 which is installed to be movable in the longitudinal direction of the portion G1, a film supply reel R1 which is provided on one side of the slide plate 54 to supply the anisotropic conductive film F, and the film Only the insulating adhesive layer F1 of the anisotropic conductive film F, which is installed at one side of the slide plate 54 spaced apart from the supply reel R1 and sequentially supplied from the film supply reel R1, has a predetermined length. Of the anisotropic conductive film F cut into a predetermined length by the film cutter 56 coupled to the film cutter 56 to be cut and the piston rod of the cylinder C3 installed on the slide plate 54. A film bonding head 58 for bonding the insulating adhesive layer F1 to the pattern portion G1 of the loaded glass G, and the film bonding It includes a film recovery reel (R2) for recovering the backing paper (F2) attached to the back of the insulating adhesive layer (F1) of the anisotropic conductive film (F) bonded to the pattern portion (G1) of the glass (G) by the head (58). do.

First, the anisotropic conductive film F wound around the film supply reel R1 will be briefly described. The film includes an insulating adhesive layer F1 and a backing paper F2 attached to one side of the insulating adhesive layer F1. .

The insulating adhesive layer F1 has a constant width and is formed in the pattern portion G1 of the glass G by embedding ball-shaped fine conductive particles (not shown) inside the insulator formed of a thin film. The anisotropic conductive film (F) is already known and used in the art so that patterns (not shown) are bonded to the driving chip (C) in an insulated state from each other, and thus a detailed description thereof will be omitted.

The slide plate 54 is made of a plate-like metal material, is installed to be movable by the guide rail (U) and the drive motor (M7) in the support plate 52 fixed to the support frame (50) The film bonding head 58 fixed to one slide plate 54 moves along the pattern portion G1 of the glass G to bond the insulating adhesive layer F1 only to the pattern formed on the pattern portion G1. Is done.

The film supply reel (R1) is made of a conventional reel (Reel) form of the anisotropic conductive film (F) is wound in a roll state, the film recovery reel (R2) and anisotropically installed on one side of the slide plate (54) The anisotropic conductive film F is supplied to the film bonding head 58 while being connected to the conductive film F and rotating in one direction by the rotation of the film recovery reel R2.

The film cutter 56 cuts only the insulating adhesive layer F1 of the anisotropic conductive film F supplied from the film supply reel R1 to the film bonding head 58, and the slide plate ( 54 is slidably installed in the vertical direction from the inside of the cutter housing 60 provided between the film supply reel (R1) and the film bonding head (58).

The cutter housing 60 is formed with a film guide groove 62 for guiding the anisotropic conductive film F transported in the horizontal direction, and the film cutter 56 in a direction perpendicular to the film guide groove 62. Cutter guide groove 64 for guiding) is formed.

The film guide groove 62 may move while the anisotropic conductive film F supplied from the film supply reel R1 is guided, and the film cutter 56 is perpendicular to the cutter guide groove 64. It is configured to be able to cut only the insulating adhesive layer (F1) of the anisotropic conductive film (F) passing through the film guide groove 62 and is slidably positioned by the cylinder (C4).

As described above, the length of the insulating adhesive layer F1 cut into the predetermined length by the film cutter 56 is set to be cut into a size corresponding to the pattern formed in the loaded glass G pattern portion G1, and in addition to insulation. In order to cut the adhesive layer F1 into various lengths, an operation cycle of the cylinder C4 for moving the film cutter 56 may be appropriately set.

The film bonding head 58 is coupled to the tip of the piston rod of the cylinder (C3) installed in the vertical direction on one side of the slide plate 54, and moved in the vertical direction by the driving of the cylinder (C3) anisotropic conductivity The insulating adhesive layer F1 of the film F is bonded to the pattern portion G1 of the glass G loaded on the second rotating stage 6 described above (see FIGS. 8 and 9).

Referring to FIG. 10, the film bonding head 58 has a pressing surface 58a corresponding to the pattern portion G1 of the loaded glass G, and generates heat inside the heat generating member H. Is installed.

The heating member (H) may be used as a conventional coil heater for generating heat depending on whether or not the application of electricity, in addition to the heating member to improve the bonding quality of the anisotropic conductive film (F) is carried out by applying a variety It is possible to do

In addition, a pressure sensing member S is installed between the film bonding head 58 and the piston rod of the cylinder C3, which is a film bonding head 58 coupled to the piston rod of the cylinder C3. When bonding the insulating adhesive layer F1 of the anisotropic conductive film F, if the pressing force detected by the pressure sensing member S is greater than the set pressure, the operation of the cylinder C3 is stopped and the glass loaded. Since the pattern portion G1 of (G) is prevented from being pressurized with an excessive pressure, the pattern portion G1 or the insulating adhesive layer F1 of the glass G may be prevented from being damaged by excessive pressing force or deteriorating the bonding quality. Can be.

The pressure sensing member (S) may be used a conventional load cell, in addition to the pressure sensing member that satisfies the object of the present invention can be implemented in various applications.

The film recovery reel R2 is formed by bonding the insulating adhesive layer F1 of the anisotropic conductive film F to the pattern portion G1 of the glass G by the film bonding head 58. It is for recovering the back paper (F2) attached to the back of the F1), and is formed in the same shape as the film supply reel (R1), that is, in the form of a conventional reel (Reel) installed on the back of the slide plate 54 When the backing paper (F2) is rolled up and recovered in a roll state while being rotated in one direction by the driving motor (M8), when the film recovery reel (R2) is wound and the backing paper (F2) is wound, the film supply reel (R1) While rotating also to supply the anisotropic conductive film (F).

In addition, anisotropic conductivity sequentially moves between the film supply reel R1, the film cutter 56, the film bonding head 58, and the film recovery reel R2, which are installed on one side of the slide plate 54. A guide roller 66 for guiding the film F is installed.

The guide roller 66 is formed in a conventional roller form and is rotatably fixed on the slide plate 54 to guide the anisotropic conductive film F supplied from the film supply reel R1.

The guide roller 66 may have a structure provided with a tension adjusting member (not shown) such as a spring so that the anisotropic conductive film F guided can be supplied while maintaining a constant tension.

In the upper plate 16 of the work table 2, the driving chip C is set on the glass G to which the insulating adhesive layer F1 of the anisotropic conductive film F is bonded by the film bonding part 10. The chipsetting part 12 is installed by the pedestal 68.

The structure of the chipseting unit 12 will be described in more detail with reference to FIGS. 1, 11, 12, 13, and 14 as follows.

The chipseting part 12 moves in the longitudinal direction of the guide plate 70 and the guide plate 70 which are arranged toward the center of the second rotating stage 6 in the work table 2. A first adsorption portion 76 provided with a horizontal plate 72 capable of being installed, a first adsorption part 76 provided on one side of the horizontal plate 72 and adsorbing the driving chip C stored in the chip tray 74; The second adsorption unit 78 is installed on the horizontal plate 72 and spaced apart from the adsorption unit 76, and the chipset terminating unit 80 is provided in the pedestal 68 corresponding to the second adsorption unit ).

The guide plate 70 is fixed to the two support (82) on the upper side of the pedestal 68 installed on one side of the work table (2) to be fixed toward the center of the second rotating stage (6) do.

The horizontal plate 72 is movably installed by a guide rail U installed in the longitudinal direction of the guide plate 70 on one side of the guide plate 70, and a screw-shaped drive motor M9. ) Axis is connected and moves in the longitudinal direction of the guide plate 70 by the drive of this motor (M9).

The first suction part 76 has a structure in which a suction head 84 is installed at a tip of a piston rod of a cylinder C5 fixed in a vertical direction at one side of the horizontal plate 72.

Referring to FIG. 15, the adsorption head 84 is provided with an adsorption surface 84a for adsorbing the driving chip C accommodated in the chip tray 74 provided on the upper surface of the pedestal 68. The suction surface 84a is provided with a suction hole 84b for suctioning the drive chip C with a vacuum, and the suction hole 84b is connected to a separate vacuum device.

The suction surface 84a of the suction head 84 is formed to have a size that accommodates the entire surface of the driving chip C to be sucked, and the material is the driving chip C when the suction chip C is sucked. It is preferable to be made of a material that can prevent the surface of the scratches or damage.

In the lower side of the chip tray 74, a normal X and Y stage 86 is installed, and the driving chip C accommodated in the chip tray 74 is provided with the first adsorption portion 76. It is preferably configured to be able to move to a position corresponding to the suction head 84 of the).

The second suction part 78 is installed at the piston rod end of the cylinder C6 which is spaced apart from the first suction part 76 by a predetermined distance from the guide plate 70 in the vertical direction. It consists of a moving vertical plate 88 and an adsorption head 90 coupled to the shaft end of the step motor M10 provided on the vertical plate 88.

The vertical plate 88 is installed to be movable in the vertical direction by a guide rail U disposed in a vertical direction at one side of the horizontal plate 72, the upper side of the vertical plate 88 One side is connected to the front end of the piston rod of the cylinder (C6) fixed to one horizontal plate 72 to move up and down in the horizontal plate 72 along the guide rail (U).

Referring to FIG. 16, the adsorption head 90 of the second adsorption part 78 has the same structure as that of the adsorption head 84 of the first adsorption part 76, that is, the driving chip C is adsorbed. An adsorption surface 90a is formed, and an adsorption hole 90b is formed in the adsorption surface 90a for adsorbing the driving chip C in a vacuum, and the adsorption hole 90b is a separate vacuum device. Connected with

The first adsorption part 76 and the second adsorption part 78 are separated from each other by the first adsorption part 76 and the chip tray 74. At the time of loading to 80, the second adsorption portion 78 is loaded onto the second rotation stage 6, and the upper portion of the pattern portion G1 of the glass G for the driving chip C to be adsorbed. It is formed to be spaced apart within the range to set the driving chip (C), which is the second adsorption portion (78) by the chip centering unit 80 to suck the driving chip (C) pattern portion of the glass (G) At the time of setting to G1, the first adsorption part 76 adsorbs the driving chip C from the chip tray 74 and moves in the same direction as the second adsorption part 78 while the chipset terminating part is moved. Since the driving chip C is loaded on the 80, the continuous working can be performed without any holding time.

The chip centering part 80 is installed on the pedestal 68 of the work table 2 corresponding to the first adsorption part 76 and the driving chip C loaded by the first adsorption part 76. ) Will be described in more detail with reference to the accompanying drawings, the structure of the chip centering unit 80.

The chip centering portion 80 includes a housing 94 in which a space portion is formed on the inner side, and a chip loading plate 92 is installed in the upper center portion thereof, and four cylinders are circumferentially toward the center portion from the upper side surface of the housing 94. An alignment plate 96 provided in a direction and rotatably installed on an upper circumferential surface of the housing 94 to move the alignment plate 96 to retract or spread toward the center of the housing 94. It comprises a rolling wheel 98 to make.

The housing 94 is formed in a cylindrical flange shape, the through hole 100 is drilled in a predetermined diameter in the center of the upper side, and the chip loading plate 92 is installed on the upper side of the through hole 100. .

In the inner space portion of the housing 94, a first chip scanning member 102 for scanning the position of the driving chip C loaded on the chip loading plate 94 installed on the upper side of the housing 94 is installed. It is fixed to the guide rail (U) arranged in the direction orthogonal to the guide plate 70 and the horizontal plate 72 in the pedestal 68, the lower side, and is not shown in the drawing by the drive motor It is made to move in a direction orthogonal to the one plate (70, 72).

The first chip scanning member 102 may be a conventional micro camera, and the first chip scanning member 102 is connected to a separate control unit (not shown).

The chip loading plate 92 is formed in a circular plate shape and is fixed to the upper side of the through-hole 100, and a material may be quartz.

As described above, when the chip loading plate 92 is made of quartz, the driving chip C loaded on the plate 92 may not only be prevented from being scratched or damaged while contacting, but the material itself is transparent. The position of the driving chip C loaded with the first chip scanning member 102 installed inside the housing 94 may be more smoothly scanned.

The alignment plate 96 is made of a plate-shaped metal material having a predetermined thickness and a wedge-shaped pressing surface 96a is formed at one end thereof, and the position adjusting member 104 and the cam plate 106 are formed at the lower side thereof. Four guide rails U are fixed in a stacked form and are spaced apart from each other so as to face the chip loading plate 92 of the housing 94.

The position adjusting member 104 may be used a conventional micrometer equipped with a control knob, the position adjusting member 104 is the size of the drive chip (C) loaded on the chip loading plate 92 described above. Accordingly, the setting position can be adjusted while moving the alignment plate 96 in the longitudinal direction.

In addition, the cam plate 106 is made of a plate-like metal material, a fixed shaft 108 is installed at one end of the cam plate 106 and a roller 112 of the roller type by the bearing member 110 at the front end of the fixed shaft 108. ) Is rotatably installed and set to contact the outer circumferential surface of the rolling wheel 98.

Both sides of the cam plate 106 is connected to the elastic member 114 fixed to one side of the upper side of the housing 94, the elastic member 114 is made of a conventional tension coil spring the cam plate 106 is set to move to the center of the housing 94 by the elastic member 114.

The rolling wheel 98 is rotatably installed by the bearing member 116 on the upper outer circumferential surface of the housing 94, and the cam provided on the cam plate 106 on the outer circumferential surface of the wheel 98. Cam guide surface 118 for guiding 112 is formed.

An extension part 120 is formed at a lower side of the rolling wheel 98, and the extension part 120 is connected to a piston rod of a cylinder C7 installed at one side of the outer circumferential surface of the housing 94. The rolling wheel 98 is rotated about the housing 94 by the driving of C7).

When the rolling wheel 98 rotates as described above, the cam guide surfaces 118 formed on the outer circumferential surface of the rolling wheel 98 are cams 112 installed on the four cam plates 106 installed in the circumferential direction of the housing. Guided to move toward the center of the housing 94 to press the edge portion of the driving chip (C) loaded on the chip loading plate 92 to align the position.

When the piston rod of the cylinder C7 moves to its original position, the cam 112 is guided to the cam guide surface 118 and the alignment plates 96 are centered on the housing 94. Spaced outward to return to its original position.

One side of the pedestal 68 is loaded on the second rotating stage 6, the glass scanning member 122 and the glass (G) for scanning the position of the glass (G) for setting the driving chip (C) Each of the second chip scanning members 124 for scanning the position of the driving chip C set in the pattern portion G1 of FIG.

The glass scanning member 122 is fixed to the bracket 126 at one side of the pedestal 68 so that the insulating portion F1 of the anisotropic conductive film F is bonded to the pattern portion G1 of the glass G. It is spaced apart from the upper side of the second rotating stage 6 so as to scan the alignment point (G2) displayed at both ends.

At this time, the glass scanning member 122 is glass (G) disposed so that the chips are not set to contact each other when setting the driving chip (C) to the glass (G) by the second adsorption portion (78). The pattern portion G1 is spaced apart by a predetermined length and fixed.

The second chip scanning member 124 is a glass for setting the driving chip (C) in the lower side of the second rotating stage 6 by the bracket 128 installed on one side of the pedestal 68 The position of the driving chip C fixed in the pattern portion G1 of the glass G is fixed so as to face upward from the scanning hole 26 corresponding to the pattern portion G1 of G).

The glass scanning member 122 and the second chip scanning member 124 may be a micro camera, and the second chip scanning member 124 may be a monitor installed on the work table 2. The data scanned in connection with the 130 is displayed through the monitor 130 in a conventional manner.

Looking at the operation of the scanning member, the glass scanning member 122 is loaded on the second rotating stage 6 to the pattern portion G1 of the glass G for setting the driving chip (C). The indicated alignment point G2 is scanned, and the position of the driving chip is scanned by the first chip scanning member 102 of the chip centering unit 80, and these data are sent to a control unit (not shown).

Then, the control unit calculates the setting deviation of the driving chip (C) and the glass (G), and if the deviation occurs more than the allowable error range is performed as follows.

That is, the above-mentioned adsorption head 90 of the second adsorption part 78 may be set within the tolerance range when the driving chip C is adsorbed and set in the pattern part G1 of the glass G. The horizontal plate 28 and the longitudinal plate 30 of the second rotating stage 6 are controlled by the control unit described above, and the position is corrected while moving the loaded glass G in the X and Y directions, and The adsorption head 90 of the adsorption portion 78 moves the driving chip C in the θ direction by the step motor M10 to correspond to the angular deviation of the glass G. The driving chip C is set in the pattern portion G1 of (G).

As described above, when setting of the driving chip C is completed in the pattern portion G1 of the glass G, the lower side of the rotating stage 6 is provided through the scanning hole 26 of the second rotating stage 6. The second chip scanning member 124 disposed in the scanning unit 120 scans the position of the driving chip C set in the pattern portion G1 of the glass G, and then, through the monitor 130 installed on the work table 2, is typically used. Display it to the operator.

When the setting of the driving chip C is completed by the above process, the driving chip C set by the chip bonding unit 14 is bonded. Referring to the accompanying drawings, the structure of the chip bonding unit 14 is described. It will be described in detail.

Referring to FIGS. 1 and 17, the chip bonding unit 14 may include a support plate 132 and a glass G for bonding the driving chip C to one side of the support plate 132. A horizontal plate 134 installed to be movable in the longitudinal direction of the pattern portion G1, and a chip bonding head 136 installed at the tip of the piston rod of the cylinder C8 installed in the vertical direction from the horizontal plate 134. .

The support plate 132 is spaced apart from the film bonding part 10 in the support frame 50 installed on the transverse plate 28 of the second rotating stage 6 to the second rotating stage 6. It is fixed in between.

The horizontal plate 134 is installed to be movable in the longitudinal direction of the support plate 132 by the guide rail U and the driving motor M11 installed in the longitudinal direction of the support plate 132.

The cylinder C8 is installed in a vertical direction on one side of the horizontal plate 134, and the chip bonding head 136 is installed at the tip of the piston rod of the cylinder C8.

Referring to FIG. 18, the chip bonding head 136 is set by bonding to the pattern portion G1 of the glass G while pressing the upper surface of the driving chip C set on the glass G. The pressing surface 136a is formed to accommodate the entire upper side of the chip, and the heat generating member H is installed inside.

The heating member 138 may be a conventional coil heater that generates heat according to whether the electricity is applied, this heating member 138 is the chip bonding head 136 is the image of the driving chip (C) When bonding while pressing the side is generated so that it can be bonded smoothly by generating a predetermined heat.

The pressure sensing member S is installed between the chip bonding head 136 and the piston rod of the cylinder C8, and the pressure sensing member S includes the driving chip C as the chip bonding head 136. Conventional load cells may be used as a means for preventing pressurization with excessive pressure when bonding while pressing.

Accordingly, a preferred embodiment of the anisotropic conductive film and the driving chip bonding apparatus of the flat panel display according to an embodiment of the present invention made as described above will be described in more detail with reference to the accompanying drawings.

First, as shown in FIG. 1, the glass G is loaded and unloaded in the direction in which the monitor 13 and the driving switch 22 are installed on the work table 2, and the first rotating stage 4 is installed. Of the two stages 24 arranged at the loading position of the glass (G) by a worker by hand or by using a conventional loading device (not shown). Load

When the driving switch 22 is pressed after loading the glass G as described above, the first rotation stage 4 is rotated by 90 ° in the direction shown in FIG. 2 and then stopped.

Then, after loading the glass (G) in the same loading method to the other stage 24 disposed at the loading position in the first rotation stage 4 by pressing the drive switch 22 again the first rotation stage (4) is rotated and it moves to the said glass feed part 8 sequentially.

The glass G moved to the glass transfer unit 8 by the above process is unloaded by the glass transfer unit 8 and loaded on the second rotation stage 6. It will be described in more detail with reference.

1 and 3, the suction plate 44 of the first glass loading unit 36 of the glass transfer unit 8 moves along the guide plate 34 to the first rotating stage 4. The glass G thus adsorbed is loaded on the second rotating stage 6 described above.

At this time, the glass G adsorbed to the adsorption plate 44 of the first glass loading unit 36 is rotated by the step motor M4 as the adsorption plate 44 is the pattern portion of the glass G. Even if (G1) is formed in various ways, the insulating adhesive layer (F1) and the driving chip (C) of the anisotropic conductive film (F) is rotated to a position where it can be bonded and set to the second rotating stage (6) Can be loaded

When the glass G is loaded on the second rotating stage 6 as described above, the second rotating stage 6 is rotated by 90 ° in the same direction as the first rotating stage 4 and then stopped, thereby bonding the film. The portion 10 bonds the insulating adhesive layer F1 of the anisotropic conductive film F to the pattern portion G1 of the glass G.

Referring to FIGS. 6 and 7, the bonding process of the insulating adhesive layer F1 is described above. When the glass G is loaded at the second rotating stage 6 and disposed at the film bonding position, the film bonding is performed. The film supply reel R1 of the unit 10 rotates in one direction to supply the anisotropic conductive film F to the film cutter 56, and the film cutter 56 is provided with a pattern portion of the loaded glass G. G1) Only the insulating adhesive layer F1 of the anisotropic conductive film F is cut to a length corresponding to the pattern (not shown) to be supplied to the film bonding head 58.

As described above, the insulating adhesive layer F1 cut and supplied to a predetermined length is bonded to the pattern portion G1 of the glass G by the film bonding head 58 described above (see FIGS. 8 and 9).

At this time, the film bonding head 58 is installed to be movable in the longitudinal direction of the pattern portion G1 of the glass G by the slide plate 54, so that the film bonding head 58 is longitudinally in the pattern portion G1 of the glass G. The insulating adhesive layer F1 of the anisotropic conductive film F may be bonded to one or more patterns formed of the same.

When the bonding of the insulating adhesive layer F1 is completed as described above, the second rotating stage 6 is rotated again so that the glass G bonded with the insulating adhesive layer F1 is driven by the chipset coating part 12. The setting moves to a position where the chip C can be set.

As described above, the glass G disposed in the chipset setting unit 12 scans the position of the glass G by the glass scanning member 122 before setting the driving chip C. The scanning process of G) is performed by using the glass plate loaded on the second rotating stage 6 with the vertical plate 30 installed under the second rotating stage 6. 122, the alignment point displayed on both ends of the pattern portion G1 of the glass G by the glass scanning member 122 while the horizontal plate 30 is moved. (G2) is sequentially scanned to transmit the scanned data to the control unit (see FIGS. 5 and 19).

11, 12, 13, and 14, at the same time as the above-described process, the adsorption head 84 of the chipsetting part 12, that is, the first chip adsorption part 76, is the chip. The driving chip C stored in the tray 74 is adsorbed and loaded into the chip loading plate 92 of the chip centering unit 80, and is disposed outside the housing 94 of the chip centering unit 80. The installed cylinder C7 is operated to rotate the rolling wheel 98, and the cam guide surface 118 formed on the outer circumferential surface of the wheel 98 by the rotation of the rolling wheel 98 is the alignment plate 96 described above. The alignment plate 96 slides toward the center of the housing 94 to guide the cam 112 of the cam 112, and the setting position of the driving chip C loaded on the chip loading plate 92 is allowed. Will be sorted into.

When the alignment process of the driving chip C is completed, the chip adsorption head 90 of the second chip adsorption unit 78 adsorbs the driving chip C to be set on the glass G. do.

At this time, the control unit calculates the setting deviation between the driving chip (C) and the glass (G), and if a deviation more than the allowable error range occurs, the driving chip scanned by the first chip scanning member (102) The driving chip C is loaded by being loaded on the second rotation stage 6 while moving the horizontal plate 28 and the longitudinal plate 30 of the second rotation stage 6 so as to correspond to the position of (C). The setting position of the glass G to be set is moved in the X direction and the Y direction to be corrected within the allowable range, and the driving chip C is moved to the position to be set.

In addition, the suction head 90 of the second chip adsorption portion 78 is driven by the control unit described above so as to correspond to the angular deviation of the glass G scanned by the glass scanning member 122. The driving chip C is set in the pattern portion G1 of the glass G described above while the chip C is rotated in the θ direction and the setting position is corrected within the allowable range.

The first chip adsorption part 76 and the second chip adsorption part 78 of the chipset setting part 12 are horizontal plates installed on the guide plate 70 when setting the driving chip C as described above. Since 72 are spaced apart at predetermined intervals, the driving chip C is sequentially aligned and set while simultaneously moving only to a predetermined transfer stroke.

When the setting of the driving chip C is completed in the pattern portion G1 of the glass G by the chipset setting part 12, the second chip scanning member installed below the second rotating stage 6 may be formed. 124 again scans the setting position of the driving chip C set in the pattern portion G1 of the glass G and displays it on the monitor 130 installed in the work table 2 (see FIG. 20). When the setting position of the driving chip C is displayed through the monitor 130 and provided to the operator, the setting state of the driving chip C is checked before bonding of the driving chip C, so that the setting is poor. And it can be prevented in advance that the bonding quality is deteriorated.

As described above, when setting and scanning of the driving chip C are completed in the pattern portion G1 of the glass G, the second rotating stage 6 is rotated so that the driving chip C is set to the glass G. After the rotation to the above-described chip bonding unit 14 is stopped.

As described above, when the glass G stops at the chip bonding position, the chip bonding head 136 of the chip bonding unit 14 operates to set the driving chip set in the pattern portion G1 of the glass G. Bonding is performed for a predetermined time while pressing (C).

At this time, the chip bonding head 136 is moved along the horizontal plate 134 installed to the support plate 132 in the longitudinal direction of the pattern portion G1 of the glass (G) at least one driving chip ( C) can be bonded.

When the bonding of the driving chip C is completed by the chip bonding unit 14, the second rotating stage 6 is rotated again, so that the glass G bonded with the driving chip C is bonded. It moves to sending (8).

As described above, the glass G, which is bonded to the driving chip C and moved to the glass transfer unit 8, is the suction plate of the glass transfer unit 8, that is, the second glass loading unit 38, as shown in FIG. 4. It is adsorbed by the 48 and reloaded on the one side stage 24 of the first rotating stage 4, and the glass G thus loaded is first rotated by the rotation of the first rotating stage 4. After being moved to the loading position, it is unloaded by an operator or a separate unloading device and stored in a separate storage tray (not shown).

As described above, the first rotating stage 4 and the second rotating stage 6 are rotated in the same direction by the driving switch 22, and the anisotropic conductive film is formed on the pattern portion G1 of the loaded glass G. The insulating adhesive layer F1 and the driving chip C of F) are sequentially bonded.

In the above, a preferred embodiment of an anisotropic conductive film and a driving chip bonding apparatus of a flat panel display according to the present invention has been described. It is possible to carry out modification by branch, and this also belongs to the scope of the present invention.

As described above, the anisotropic conductive film and the driving chip bonding apparatus of the flat panel display according to the present invention are provided with two rotating stages on which the glass is loaded, that is, the first rotating stage and the second rotating stage. After loading, the film is formed in the circumferential direction of the second rotating stage, the film bonding portion, chipsetting portion, the chip bonding portion while moving to the structure consisting of bonding the anisotropic film and the driving chip is generated when loading and unloading the glass By minimizing the holding time, the time required for the bonding work can be drastically reduced to obtain satisfactory work efficiency and productivity, and the efficiency of the equipment can be doubled to significantly reduce the manufacturing cost.

In addition, the anisotropic conductive film and the driving chip bonding apparatus of the flat panel display according to the present invention minimize the range of errors generated when the driving chips are aligned by aligning the driving chips loaded by the one-touch operation of the chip centering unit of the chipsetting unit. The time required for sorting can be greatly reduced.

In addition, the anisotropic conductive film and the driving chip bonding apparatus of the flat panel display according to the present invention include a glass scanning member, a first chip scanning member, and a second chip scanning when the chip is set in the pattern portion of the glass by the chipset setting portion. Since the driving chip is set while scanning the glass and chip positions by the members and correcting them to the optimal setting position, the optimum bonding quality can be obtained by improving the setting precision.

Claims (14)

A worktable, a first rotating stage rotatably installed on an upper side of the worktable, and having a glass loaded and unloaded, a second rotating stage spaced apart from the first rotating stage, and installed on an upper side of the worktable; A glass transfer unit installed between the first rotating stage and the second rotating stage in one workbench, a film bonding unit disposed on one side of the circumferential surface of the second rotating stage to bond the anisotropic conductive film, and the second A chip set part disposed on one side of the circumferential surface of the rotating stage to set the driving chip on the pattern portion of the glass bonded with the anisotropic conductive film by the film bonding part, and the chip disposed on one side of the outer circumferential surface of the second rotating stage. An anisotropic conductive film and a driving chip bonding apparatus for a flat panel display comprising a chip bonding unit for bonding the driving chip set in the pattern portion of the glass by the setting unit. The method according to claim 1, wherein the first rotating stage is formed in the form of a circular plate and the upper side is provided with a plurality of stages in the circumferential direction, the glass loaded on the stage in one direction by the rotary table installed on the upper side of the work table Anisotropic conductive film and driving chip bonding device of a flat panel display which rotates and moves. The first rotation stage of claim 1, wherein the second rotation stage has a circular plate shape and is installed on an upper surface of the rotary table spaced apart from the rotary table on which the first rotary stage is installed. An anisotropic conductive film and a driving chip bonding apparatus of a flat panel display for moving the glass moved from the stage while rotating in one direction by the rotating table. The anisotropic conductive film and driving chip bonding apparatus of claim 2, wherein the rotating table for rotating the first rotating stage and the second rotating stage comprises an indexing drive table. The setting position of the driving chip according to claim 3, wherein the lower surface of the rotating table of the second rotating stage is set on a horizontal plate and a longitudinal plate fixedly mounted to the horizontal plate and the longitudinal plate so as to be movable in the horizontal and longitudinal directions on the work table. Anisotropic conductive film and driving chip bonding apparatus of a flat panel display for correcting the setting position while moving in the X direction and the Y direction to correspond to. The said glass conveying part is a slide plate installed between the said 1st rotation stage and a 2nd rotation stage by the guide rail, and the said 1st glass installation part is provided in the upper side of this slide plate, and the said 1st The guide plate extends in the form of connecting the rotating stage and the second rotating stage, and the glass is installed on one side of the guide plate and loaded on the first rotating stage to bond the anisotropic conductive film and the driving chip. A first rotating stage which moves to the second rotating stage and loads the first glass loading unit and a glass in which the anisotropic conductive film and the driving chip are bonded to the second rotating stage and installed on the other side of the guide plate. Anisotropic conductive film and driving chip bonding apparatus of a flat panel display comprising a second glass loading unit for moving and loading. The method according to claim 6, wherein the first glass loading unit is a horizontal plate which is installed to be movable in the longitudinal direction of the slide plate, a vertical plate which moves in the vertical direction by a cylinder provided on one side of the horizontal plate, And a suction plate coupled to a step motor shaft provided on one side of the vertical plate, wherein the second glass loading unit includes a horizontal plate installed to be movable in the longitudinal direction of the slide play, and on one side of the horizontal plate. And a suction plate coupled to the piston rod end of the installed cylinder, wherein the first glass loading part is loaded on the first rotating stage to adsorb the glass for bonding the anisotropic conductive film and the driving chip to the X direction, the Y direction, and the Z. Direction, and loading in the second rotating stage while moving in the θ direction, the second glass loading unit The anisotropic conductive film of the flat panel display, characterized in that for loading on the first rotating stage while moving in the X direction, Y direction, Z direction by absorbing the glass bonded to the anisotropic conductive film and the driving chip is loaded on the second rotation stage and Driving chip bonding device. The method according to claim 1, wherein the film bonding portion, the support plate, the slide plate which is installed to be movable in the longitudinal direction of the pattern portion of the glass loaded from one side of the support plate, and is provided on one side of the slide plate is anisotropic A film for supplying a conductive film and a film for cutting only an insulating adhesive layer of an anisotropic conductive film which is spaced apart from the film supply reel and installed on one side of the slide plate and sequentially supplied from the film supply reel. A film bonding head which bonds to the cutter, the piston rod of the cylinder provided in the slide plate, and cuts the insulating adhesive layer cut to a predetermined length by the film cutter to the pattern portion of the glass, and the glass by the film bonding head. The film recovery reel to recover the backing paper attached to the back of the insulating adhesive layer bonded to the pattern portion of Anisotropic conductive films, and the driving chip bonding apparatus for flat panel displays which must. The method of claim 8, wherein the film bonding head is moved in the longitudinal direction of the pattern portion of the glass by the slide plate and anisotropic conductive film and driving chip of the flat panel display bonding the insulating adhesive layer of the anisotropic conductive film only to the pattern of the pattern portion Bonding device. The said chipsetting part is a guide plate arrange | positioned toward the center part of the said 2nd rotation stage in the said work bench, the horizontal plate installed so that the movement to the longitudinal direction of this guide plate, and this horizontal plate is carried out. A first adsorption part installed at one side of the second adsorption part for adsorbing the driving chip housed in the chip tray, a second adsorption part installed on the horizontal plate and spaced apart from the first adsorption part, and the second work part described above in the work table. An anisotropic conductive film and a driving chip bonding apparatus for a flat panel display including a chipset terminating unit installed at a position corresponding to an adsorption unit. The method of claim 10, wherein the first adsorption portion is provided with a suction head at the end of the piston rod of the cylinder provided in the horizontal plate, the second adsorption portion is a predetermined distance from the first adsorption portion in the above-mentioned horizontal plate The suction head is installed on the step motor shaft spaced apart from each other. Anisotropic conductive film and driving chip bonding apparatus for a flat panel display, characterized in that each of the driving chip loaded in the centering portion is absorbed and loaded into the pattern portion of the chip centering portion and the glass, respectively. The method of claim 11, wherein the adsorption head of the second adsorption portion is an anisotropic conductive film and driving chip bonding apparatus of the flat panel display is set within the allowable perpendicularity range with the glass while moving the adsorbed drive chip in the θ direction. The method according to claim 10, wherein the chip centering portion, the space is formed in the inner side of the upper side of the housing is provided with a chip loading plate made of a quartz material, and the four are provided in the circumferential direction from the upper side of the housing toward the center An anisotropic conductive film and driving chip bonding apparatus for a flat panel display including an alignment plate and a rolling wheel rotatably installed by a cylinder on an upper circumferential surface of the housing to move the alignment plate toward the center of the housing. . The method according to claim 13, wherein the rollers of the roller-shaped cams are provided on the alignment plate and the cam guide surface for guiding the cams of the alignment plate is formed on the outer circumferential surface of the rolling wheel, the rotation of the rolling wheel An anisotropic conductive film and driving chip bonding apparatus of a flat panel display, wherein one of the cams is guided to a cam guide surface to align the positions of the driving chips loaded on the chip loading plates of the housing.