KR200334227Y1 - Bonding Equipment For Circuit Board And Anisotropic Conductive Film Of Flat Panel Display - Google Patents

Abstract

Bonding a circuit board to a flat panel display such as LCD, ELD, or fluorescent display tube (VFD), after setting the circuit board on the glass and rotating it in one direction, the anisotropic conductive film and circuit on the loaded glass By bonding the board, not only can the work process and productivity be improved, but the structure is simple, and the device is provided to maximize the efficiency of the equipment by minimizing the cost of manufacturing and maintenance.

Such an apparatus includes a working table, a rotating stage rotatably installed on an upper side of the working table, a plurality of plurally installed in the circumferential direction of the rotating stage, and a loading unit for loading and setting a glass and a circuit board. A film bonding unit which is installed adjacent to the rotating stage and bonds the anisotropic conductive film to the pattern portion of the glass loaded in the loading unit, and is spaced apart from the film bonding unit in the workbench and the film bonding The present invention provides a circuit board and anisotropic conductive film bonding apparatus for a flat panel display including a circuit board bonding unit for bonding a circuit board to a glass on which an insulating adhesive layer of the anisotropic conductive film is bonded.

Description

Bonding Equipment For Circuit Board And Anisotropic Conductive Film Of Flat Panel Display}

The present invention relates to a circuit board and anisotropic conductive film bonding apparatus of a flat panel display, and more particularly, it can not only significantly reduce the time and process required for bonding the circuit board, but also the pattern portion of the glass on which the circuit board is set. The present invention relates to a circuit board and an anisotropic conductive film bonding apparatus of a flat panel display that can easily bond an anisotropic conductive film.

In general, flat panel display devices such as LCD, ELD, and fluorescent display tubes (VFD) have been diversified in use and function with the development of digital technology. In order to cope with this, a driving chip or a circuit board (eg, a PCB / Printed Circuit Board, an FPC / Flexible Printed Circuit, and a TCP / Tape Carrier Package) is directly bonded.

Since the circuit board is not required to have a greater bonding accuracy than the driving chip when bonded to the pattern portion of the glass, the bonding operation is easy and has improved electric warfare compatibility. have.

As described above, in order to bond the circuit board to the glass, the insulating adhesive layer of the anisotropic conductive film, that is, a film that provides insulation and adhesiveness to the pattern portion formed on the glass, is first bonded. After the process is performed in a separate process by the film bonding apparatus, the glass on which the film bonding is completed is transferred to the circuit board bonding apparatus to bond the circuit board.

The structure of the conventional circuit board bonding apparatus described above is briefly described, a table, a glass fixing plate provided on an upper side of the table, a circuit board fixing plate adjacent to the glass fixing plate, and fixing the circuit board; And a circuit board bonding unit for bonding the circuit board while pressing the surface to be bonded of the glass loaded on the glass fixing plate.

However, the conventional circuit board bonding apparatus has an in-line structure and has different indexing times for loading and unloading glasses and circuit boards, and bonding, so that the work cannot be continuously performed and excessive holding time. Because of this, it is difficult to expect satisfactory work efficiency and productivity.

In addition, the conventional circuit board bonding apparatus has a structure in which only a circuit board is bonded to glass, and thus structural limitations are involved in improving efficiency of processes and facilities.

The present invention was devised to solve the above-mentioned problems, and an object of the present invention is to reduce the bonding process and time of the circuit board significantly, and to improve work efficiency, productivity, and efficiency of equipment. To provide a circuit board and an anisotropic conductive film bonding device of the display.

In order to realize the object of the present invention as described above, a worktable, a rotary stage rotatably installed on the upper side of the worktable, and a plurality of circumferential directions of the rotary stage are installed to load and set the glass and the circuit board. And a film bonding unit for bonding the anisotropic conductive film to the pattern portion of the glass, which is installed adjacent to the rotary stage in the workbench, and loaded into the loading unit, and the film bonding unit in the workbench. The present invention provides a circuit board and anisotropic conductive film bonding apparatus of a flat panel display, including a circuit board bonding unit which is spaced apart from and bonded to the glass on which the insulating adhesive layer of the anisotropic conductive film is bonded by the film bonding unit.

1 is an overall perspective view of a circuit board and anisotropic conductive film bonding apparatus of a flat panel display according to the present invention.

2 is a plan view of main parts of FIG. 1;

3A is a side cross-sectional view of FIG. 1.

3B is an enlarged view illustrating main parts of FIG. 3A;

Figure 3c is an enlarged view of the main portion for explaining another embodiment of the glass stage according to the present invention.

Figure 3d is an enlarged view for explaining another embodiment of the glass stage according to the present invention.

Figure 4 is an enlarged perspective view of the film bonding portion of FIG.

5 is an enlarged perspective view of the circuit board bonding part of FIG. 1;

Figure 6 is a partially enlarged cross-sectional view for explaining a scanning member for scanning the circuit board and the glass loaded on the loading portion of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention.

FIG. 7 is a front view illustrating an example in which a setting state of a glass and a circuit board loaded to a loading unit by the scanning member of FIG. 6 is displayed on a monitor; FIG.

Figure 8 is an enlarged plan view of the cam plate installed in the loading portion of the circuit board and the anisotropic conductive film bonding device of the flat panel display according to the present invention.

9 is an enlarged front view of the film bonding head of FIG. 4.

10 is a perspective view for explaining the cutter structure of FIG.

11 is a front view of FIG. 4.

12A and 12B are plan and cross-sectional views showing a state before the glass stage of the loading unit according to the present invention is spaced apart from the circuit board setting unit in the film bonding unit.

13A and 13B are plan views and cross-sectional views illustrating a glass stage of the loading unit according to the present invention spaced apart from the circuit board setting unit in the film bonding unit.

14 is a perspective view illustrating a state in which an anisotropic conductive film is bonded to a pattern portion of glass by a film bonding part of a circuit board and an anisotropic conductive film bonding apparatus of a flat panel display according to the present invention;

FIG. 15 is an enlarged front view of the bonding head of FIG. 5.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in more detail.

1, 2, 3a, 3b, 4, and 5, the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention, the work table (2) and the work table (2) A rotating stage 4 rotatably installed on an upper side, and a plurality of rotating stages 4 installed in the circumferential direction of the rotating stage 4 to load and set the glass G and the circuit board B; Bonding the anisotropic conductive film (F) to the pattern portion (G1) of the glass (G) is installed adjacent to the rotary stage (4) in the worktable (2) and loaded in the loading section (6) The insulating bonding layer F1 of the anisotropic conductive film F is installed by the film bonding part 8 and the said film bonding part 8 spaced apart from the said film bonding part 8 by the said work bench 2, and the said film bonding part 8 is mentioned above. The circuit board bonding part 10 which bonds the circuit board B to this bonded glass G is included.

The work table 2 is a pipe member or rod member made of a common metal material is joined by welding or bolting to form a box and the upper plate 12 is installed on the upper side.

The upper plate 12 is made of a plate-shaped metal material having a certain thickness is integrally installed by welding or bolting on the upper side of the work table (2) to prevent the surface from being deformed by load or impact and always constant It is better if it is a structure and a material which can maintain a flatness.

The lower side of the work table 2 is provided with a plurality of supports 14 for supporting the work table 2 from the bottom, which is not shown in the figure, but a cushioning member such as rubber or spring. It is preferable that the worktable 2 is provided with a structure capable of sufficiently buffering the shaking of the work table 2 by the minute vibration or the impact.

The rotating stage 4 is formed in a circular plate shape is fixed by a fastening member such as a bolt in the upper side of the rotary table (T) installed on the auxiliary frame 16 of the work table 2 is drilled in the upper plate 12 It is disposed inside the true through hole 18.

The material of the rotating stage 4 may be a metal or synthetic resin material that can minimize vibration or impact.

An indexing drive table may be used as the rotary table T, and is connected to a drive switch 20 installed in the work table 2 so that the rotary table T is rotated in one direction by manipulation of the switch 20. Since the indexing drive table has a structure that rotates itself by a separate driving source, it is already widely used in machine tools, automation devices, semiconductor equipment, etc. requiring accurate rotation operation, and thus, detailed description thereof will be omitted.

On the upper side of the rotating stage 4 is provided with a loading unit 6 for loading and setting the glass (G) and the circuit board (B), with reference to the accompanying drawings the structure of the loading unit (6) It will be described in detail as follows.

The loading section 6 is provided on one circumferential side of the rotary stage 4, two circuit board setting units 22 for loading and setting the circuit board B, and the circuit board setting unit ( It comprises a glass stage 24 adjacent to the 22 to be movable by the spacer member in the above-described rotary stage 4, the glass (G) is loaded.

The circuit board setting unit 22 may be a conventional manual stage provided with one or more adjustment stages, and in this embodiment, the positions of the X direction, the Y direction, and the θ direction are respectively corrected from the upper side. It consists of three stages 22a, 22b, 22c, and these stages are provided with adjustment knobs N, respectively.

Since the manual stage generally has the same or similar structure as that widely used for the purpose of setting the position and orientation of the loaded object in machine tools or semiconductor equipment, more detailed description will be omitted.

In the X-direction stage 22a of the circuit board setting unit 22, an adsorption hole H is formed, and the adsorption hole H is connected to a separate vacuum hose (not shown) to be loaded. The circuit board B can be adsorbed by vacuum.

The glass stage 24 is a guide disposed toward the center of the rotating stage 4 inside the guide groove 26 formed adjacent to the circuit board setting unit 22 fixed to the rotating stage 4. The slide U1 is installed to be slidable, and the guide rail U1 may be an "LM guide" composed of a pair of guiders and a slider.

On the upper surface of the glass stage 24, a guide member 25 for supporting the glass G to be loaded is formed at one edge portion, and the glass G to be loaded in the same manner as the circuit board setting unit 22 described above. Adsorption hole (H) is formed to adsorb the vacuum by the suction hole (H) is connected to a separate vacuum hose (not shown).

On the upper side of the glass stage 24, a scanning hole 28 having a long hole shape corresponding to the pattern portion G1 of the glass G to be loaded is drilled, and the guide groove 26 of the rotating stage 4 is formed. ), An auxiliary scanning hole 30 corresponding to the scanning hole 28 of the glass stage 24 to be set is drilled, and the scanning stage S is connected to the glass stage 24 and the circuit board setting unit 22. It is formed to scan the setting position of the glass (G) and the circuit board (B) to be loaded.

3 and 6, the scanning member S is set to face the scanning hole 28 of the glass stage 24 from the inside of the work table 2, and the glass G and A pair of pairs are configured to scan two alignment points G2 and B2 marked on the pattern portions G1 and B1 of the circuit board B, respectively, so that the scanning holes of the two glass stages 24 It is fixed by the bracket member 32 to correspond to 28.

The scanning member (S) may be a micro camera (Micro Camera) can be used, the camera is connected to the motini 34 installed on the worktable (2) glass (G) loaded on the loading unit (6) And aligning points G2 and B2 of the circuit board B and displayed in a conventional manner through the monitor 34 described above (see FIG. 7).

In the above-described embodiment, the scanning member S is shown as being a microcamera in the description and drawings, but is not limited thereto. In addition, the alignment points G2 and B2 displayed on the glass G and the circuit board B may be used. Well-known types of sensing members for sensing the position of may also be used and it is natural that such a configuration falls within the scope of the present invention.

The glass stage 24 is set to maintain the state adjacent to the circuit board setting unit 22 while being supported by the elastic member 36 in the guide groove 26 of the rotary stage 4, Both ends of the elastic member 36 are fitted into fixing grooves 38 and 40 formed on the front end of the glass stage 24 and the sidewalls of the guide groove 26.

The elastic member 36 may be used in the coil-shaped compression coil spring, in addition to the elastic member that satisfies the object of the present invention can be applied to all.

In addition, the lower side surfaces of the two glass stages 24 are provided with an extension part 42 having a protruding shape, and the auxiliary guide hole 44 bored in the bottom of the guide groove 26 of the rotating stage 4. It extends downward through the through and the spacer 42, the cam plate 46 is fixed to the extension portion 42 of these glass stage 24 by a fastening member such as a bolt.

Referring to FIG. 8, the cam plate 46 has a guide surface 48 formed in a wedge shape with a gentle curve, and the guide surface 48 is formed on the auxiliary frame 16 of the work table 2. It is set to be able to contact the cam guide wheel 50 fixed at a position corresponding to one film bonding portion (8).

The cam plate 46 is guided to the cam guide wheel 50 when the loading part 6 is disposed on the film bonding part 8 while being rotated by the rotating stage 4. The glass stage 24 is spaced apart from the circuit board setting unit 22 at predetermined intervals.

The deviation D between the lower acting point P1 and the upper acting point P2 of the cam plate 46 is set by overlapping the pattern part B1 of the circuit board B with the pattern part G1 of the glass G. After the pattern portion (G1) of the glass (G) is made within the range that can be opened from the pattern portion (B1) of the circuit board (B), the material of the cam plate 46 is Metals or synthetic resin materials excellent in wear resistance may be used.

In addition, the cam guide wheel 50 is formed in a roller shape, the material may be a metal or synthetic resin having excellent wear resistance, the support shaft 52 fixed to the auxiliary frame 16 of the work table (2) It is rotatably fixed to the tip of the).

The cam guide wheel 50 is an outer circumferential surface of the cam guide wheel 50 when the loading portions 6 are disposed on the film bonding portion 8 while being rotated by the rotating stage 4. The auxiliary frame 16 of the work table 2 is provided to be in contact with the upper working point P2 of the cam plate 46.

The cam guide wheel 50 is provided with a rolling member such as a bearing (not shown in the drawing) and is configured to be smoothly rotated while being supported by the support shaft 52.

In the above embodiment, the glass stage 24 is configured to move horizontally along the guide rail U1 installed in the guide groove 26, but is not limited thereto.

For example, as shown in FIG. 3C, the bottom surface 26a of the guide groove 26 is formed to be inclined downward toward the center of the rotating stage 4, and the guide rail U1 provided on the bottom surface 26a. ), The glass stage 24 is slidably installed.

At this time, the glass stage 24 is formed so that the lower surface is inclined to correspond to the inclination angle of the bottom surface (26a) of the guide groove 26 to set the loaded glass (G) to be horizontal.

When the glass stage 24 is installed on the bottom surface 26a of the guide groove 26 inclined at a predetermined angle, the glass stage 24 is the cam plate 46 and the cam guide wheel ( 50 is separated from the circuit board setting unit 22 by the film bonding section 8, and then the pattern portion G1 of the glass G is patterned on the circuit board B when it returns to the original setting position. Since it is set while moving obliquely under the portion B1, the pattern portion G1 of the glass G loaded by the movement of the glass stage 24 and the pattern portion B1 of the circuit board B come into contact with each other. It is possible to prevent breakage or deterioration of the setting accuracy.

In addition, according to the above-described embodiment, the spacer member for moving the glass stage 24 includes a cam plate 46 and a cam guide wheel 50 for guiding the cam plate 46. However, the spacer member according to the present invention is not limited to the above embodiment, and the circuit board setting unit described above using the cylinder C4 for the glass stage 24 of the loading unit 6 as shown in FIG. 3D. It may also be configured to be spaced apart from (22).

At this time, the cylinder (C4) is preferably installed on the side wall of the bottom surface (26a), the same as the inclination angle of the bottom surface (26a) of the guide groove 26, this cylinder (C4) is the above loading portion When 6 moves to the bonding position of the film bonding unit 8, the piston rod is operated to move the glass stage 24 of the loading unit 6 along the guide rail U1 at a predetermined interval. It is configured to be spaced apart from the circuit board setting unit 22.

When the cylinder C4 is used as the spacer member of the glass stage 24 as described above, when the anisotropic conductive film F is bonded to the pattern portion G1 of the glass G, the guide groove of the rotation stage 4 described above. The glass stage 24 provided to be inclined at 26 prevents the backlash from occurring due to the vertical pressing force of the film bonding head 56, so that a constant setting accuracy and bonding quality can be obtained at all times.

In addition to the above-described embodiment, the spacer member may be applied to all members satisfying the object of the present invention, and this also belongs to the scope of the present invention.

The film bonding portion 8 is provided on the support plate 54 and the piston rod end of the cylinder C1 provided on the support plate 54 and loaded on the loading portion 6. An anisotropic conductive film (F) installed on the support plate (54) with the film bonding head (56) bonding the anisotropic conductive film (F) to the pattern portion (G1) and the film bonding head (56) therebetween. ) Of the cutter housing 58 provided on the support plate 54 between the feed reel R1 and the reel R2 and the film bonding head 56 and the supply reel R1. A cutter 60 installed to be movable inside to cut the insulating adhesive layer F1 of the anisotropic conductive film F supplied from the supply reel R1 to a length corresponding to the pattern portion G1 of the glass G. ).

First, the anisotropic conductive film F wound around the supply reel R1 will be briefly described. When bonding the circuit board B to the pattern portion G1 of the glass G, adhesiveness and insulation are provided. It consists of an insulating adhesive layer F1 and the back paper F2 attached to the back surface of this insulating adhesive layer F1.

In the insulating adhesive layer F1, the circuit board is formed in a state in which fine conductive particles having a ball shape are embedded in an insulator made of a thin film, and the patterns formed in the pattern portion G1 of the glass G are insulated from each other. It is to be bonded with the pattern portion (B1) of (B), this anisotropic conductive film (F) is well known and used in the art, so a detailed description thereof will be omitted.

The support plate 54 has a vertical portion 54a and a horizontal portion 54b substantially perpendicular to each other to form an “L” shape, and the circumferential one side of the rotating stage 4 in the work table 2 is formed. Sliding movement is installed in the guide rail (U2) installed adjacent to the.

The support plate 54 is screwed with the screw shaft 62 connected to the drive motor M1 shaft between the guide rails U2 to guide the guide rails by driving the drive motor 62. Move along U2), and the drive motor M1 is set to be driven by the drive switch 20 installed in the work table 2, and the guide rail U2 is a pair of guiders and sliders. "LM guide" can be used.

The film bonding head 56 corresponds to the pattern portion G1 of the glass G loaded on the loading portion 6 so as to cover the entirety of the pattern portion G1. Is formed and a heat generating member W is provided on the inner side thereof (see FIG. 9).

The film bonding head 56 of the glass G loaded in the loading section 6 while moving in the vertical direction by the cylinder (C1) installed in the vertical portion 54a of the support plate 54. The insulating adhesive layer F1 of the anisotropic conductive film F is bonded to the pattern portion G1.

And, the setting position of the film bonding head 56 is that the glass stage 24 of the loading section 6 moving to the bonding position of the film by the rotating stage 4 is the cam plate 46 and the cam guide The pattern portion G1 of the glass G, which is moved and loaded by the wheel 50, is set at a point opened to the upper side from the pattern portion B1 of the circuit board B.

As the heating member W installed inside the film bonding head 56, a common coil heater in which the heating element has a coil shape may be used, and the heating member W may be used as the film bonding head 56. Electricity is applied when the bonding operation is set to generate heat itself, and this electrical connection structure is easily carried out by those skilled in the art, and thus a detailed description thereof will be omitted.

The supply reel (R1) and the recovery reel (R2) is made of a common reel (REEL) form, the anisotropic conductive film (F) is wound around the supply reel (R1), the recovery reel (R2) The anisotropic conductive film F wound around the supply reel R1 is connected.

The recovery reel R2 is rotated in one direction by the driving motor M2 provided on the rear surface of the vertical portion 54a of the support plate 54, thereby rotating the supply reel R1 to supply the reel R1. ) Is supplied to the cutter housing 58 and the film bonding head 56 wound on the anisotropic conductive film F. When the insulating adhesive layer F1 of the anisotropic conductive film F is bonded, the insulating adhesive layer F1 is bonded. Collect the backing paper (F2) attached to the back of the).

Referring to FIG. 10, the cutter housing 58 is formed with a film guide groove 64 for guiding the anisotropic conductive film F and a cutter groove 66 for guiding the cutter 60.

The cutter 60 is installed in the cutter groove 66 of the cutter housing 58, and the piston rod of the cylinder C2 is coupled to the lower side thereof so that the cylinder C2 is driven up and down. While moving to set the insulating adhesive layer (F1) of the anisotropic conductive film (F) to be cut.

The cutter 60 is set to be cut to a length corresponding to the pattern portion G1 of the loaded glass G when cutting the insulating adhesive layer F1 of the anisotropic conductive film F, and such a cutting structure It is possible to appropriately adjust the operating cycle of the cylinder C2 described above.

One or more guide rollers 68 are installed on the support plate 54 so that the anisotropic conductive film F sequentially supplied by the supply reel R1 and the recovery reel R2 may be smoothly guided. (See FIG. 11)

The guide roller 68 is formed in a conventional roller shape so as to be rotatably installed on the support plate 54, and more preferably, an anisotropic conductive film guided by the guide roller 68, although not shown in the drawings. It is better if the structure is provided with a tension control member that can smoothly adjust the tension of F).

1 and 5, the above-described circuit board bonding part 10 is provided at the tip of the piston rod of the fixed plate 70 and the two cylinders C3 provided on the fixed plate 70 and is anisotropically conductive. And a bonding head 72 for bonding the circuit board B to the pattern portion G1 of the glass G to which the film F is bonded.

The fixing plate 70 may be firmly fixed to the fixing bracket 74 installed adjacent to the circumferential surface of the rotating stage 4 in the work table (2).

Referring to FIG. 15, the bonding head 72 may cover the entire pattern portion G1 corresponding to the pattern portion G1 of the glass G loaded on the glass stage 24. The pressing surface 72a is formed and the heater W is provided inside.

The bonding head 72 formed as described above has a circuit in the pattern portion G1 of the glass G loaded in the loading portion 6 while moving upward and downward by the cylinder C3 installed on the fixed plate 70. The substrate B is bonded.

Referring to the accompanying drawings, the pressure sensing sensor (L) between the film bonding portion 8, the cylinder (C1, C3) piston rod of the circuit board bonding portion 10 and the bonding heads (56, 72). ), The sensor can be used a conventional load cell (LOAD CELL).

The pressure sensor (L) detects when the bonding heads 56 and 72 come in contact with excessive pressure when bonding while pressing the anisotropic conductive film (F) or the circuit board (B). Since the operation of (C1, C3) is stopped, the pattern portion G1 of the glass G or the pattern portion B1 of the circuit board B can be prevented from being damaged by excessive pressure. In addition, optimum bonding quality can be obtained.

Next, the bonding operation of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention having the above-described structure will be described in more detail with reference to the accompanying drawings.

1, 2, 3A, 3B, 4, and 5, the loading unit 6 installed on the rotating stage 4 and disposed at the loading position, that is, two glass stages 24. And the glass (G) and the circuit board (B) are loaded into the circuit board setting unit 22, respectively. In this case, the loading of the glass (G) and the circuit board (B) is performed on the worktable (2). It is made in the direction in which 20 is installed.

When the loading of the glass G and the circuit board B to the loading unit 6 is completed, the glass G and the circuit board B on which the scanning member S installed under the loading unit 6 is loaded. 11 and scan the alignment points (G2, B2) indicated on the monitor 34 as shown in FIG. 11, and if the alignment points (G2, B2) are more than the allowable setting range deviation occurs, the circuit board The knob N of the setting unit 22 is used to set within the allowable range while moving the positions of the adjustment stages 22a, 22b and 22c.

After the loading and setting of the glass G and the circuit board B are completed in the loading part 6 disposed at the loading position by the above process, the driving switch 20 of the work table 2 is pressed to rotate as described above. When the stage 4 is rotated, the stage 4 rotates counterclockwise 120 ° and then stops to move the loading part 6, which has been placed in the loading position, to the film bonding part 8 described above, and to the worktable 2 In the loading position of the other loading section 6 is arranged.

At this time, the glass stage 24 of the loading part 6 moving from the loading position to the film bonding part 8 is a workbench provided by the spacer member installed on the lower side, that is, the cam plate 46, as shown in FIGS. 12A and 12B. Guided by the cam guide wheel 50 installed in the (2) while moving along the guide grooves 26 of the rotating stage (4) the pattern portion (G1) of the loaded glass (G) circuit board (B) Are spaced apart from the pattern portion B1 (see FIGS. 13A and 13B).

In the loading part 6 disposed at the loading position by the above-described process, the glass G and the circuit board B are set in the same manner as the above loading method, and the moving part is moved to the film bonding part 8 to the circuit board. The insulating adhesive layer F1 of the anisotropic conductive film F is bonded to the pattern portion G1 of the glass G spaced apart from the pattern portion B1 of (B) by the film bonding head 56. 14)

In the film bonding part 8, the anisotropic conductive film F wound around the supply reel R1 is rotated by the cutter 60 while the supply reel R1 and the recovery reel R2 are rotated. When only F1 is cut and supplied to the film bonding head 56, the film bonding head 56 is moved downward by the cylinder C1 and the pattern of the glass G loaded on the one glass stage 24. After bonding the insulating adhesive layer F1 to the portion G1, the pattern portion G1 of the glass G, which is moved along the guide rail U2 by the driving motor M1 and loaded on another glass stage 24, is attached. The insulating adhesive layer F1 of the anisotropic conductive film F is bonded.

After the above process is completed, when the driving switch 20 is pressed again, the rotating stage 4 is rotated so that the loading part 6 disposed at the loading position is disposed as the film bonding part 8 and the film The loading part 6, which is loading the glass G to which the anisotropic conductive film F is bonded in the bonding part 8, moves to the circuit board bonding part 10.

At this time, the glass stage 24 of the loading unit 6 moving from the film bonding unit 8 to the circuit board bonding unit 10 is rotated by the rotation stage 4. The cam plate 46 installed at 24 is guided to the cam guide wheel 50, and is returned to its original setting position by the elastic member 36, so that the pattern portion G1 of the glass G is described above. It overlaps with the circuit board B and is set again within the setting range.

When the glass G and the circuit board B set to the original setting positions as described above move to the position where the circuit board bonding unit 10 can bond, the bonding of the circuit board bonding unit 10 is performed. Bonding is performed while the head 72 moves downward by the cylinder C3 while pressing the set glass G and the pattern portions G1 and B1 of the circuit board B. FIG.

In addition, the anisotropic conductive film F is bonded to the glass G of the loading unit 6 disposed in the film bonding unit 8 by the rotation of the rotating stage 4 in the same manner as described above. The loading unit 6 disposed at the position loads and sets the glass G and the circuit board B, respectively.

When the rotating stage 4 is rotated again after the above process is completed, the loading unit 6, which is loading the glass G to which the circuit board B is bonded, is loaded by the circuit board bonding unit 10. It will rotate to the position and stop.

As described above, when the glass G bonded with the circuit board B is placed in the loading position, the glass G is unloaded and stored in a separate storage tray (not shown), and then the glass G and the circuit board B are reloaded. ) And load them respectively.

In addition, the glass G disposed on the film bonding part 8 and the circuit board bonding part 10 has an anisotropic conductive film F and a circuit board B in the same manner as in the above-described film and circuit board bonding process. Bonding sequentially and then unloading as described above.

In the above description of the preferred embodiment of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention, the present invention is not limited to this, the utility model registration claim and the detailed description of the invention and the scope of the accompanying drawings. It is possible to carry out various modifications within, and this also belongs to the scope of the present invention.

As described above, the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention bond the anisotropic conductive film and the circuit board to the loaded glass while one or more loading units are rotated in one direction by a rotating stage, thereby reducing the work process and time. It can greatly reduce the efficiency of the equipment.

In addition, the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention are set while the glass stage of the loading unit is spaced apart from the circuit board setting unit at a predetermined interval from the film bonding unit by a spaced apart member and then returned again. Bonding of film by easily bonding the film to the patterned part of the loaded glass without installing any additional process and device, as well as bonding the film continuously without any holding time during film bonding. Efficiency and quality can be further improved.

Claims (11)

A working stage, a rotating stage rotatably installed on an upper side of the working stage, a plurality of plurally installed in the circumferential direction of the rotating stage, for loading and setting a glass and a circuit board, and the rotating stage described above in the working bench. A film bonding part for bonding an anisotropic conductive film to a pattern portion of the glass which is installed adjacent to and loaded in the loading part, and spaced apart from the film bonding part in the workbench, and is anisotropic by the film bonding part A circuit board and anisotropic conductive film bonding apparatus for a flat panel display including a circuit board bonding portion for bonding a circuit board to a glass on which an insulating adhesive layer of a conductive film is bonded. The circuit board and anisotropic conductive film bonding apparatus of claim 1, wherein the rotating stage is rotated in one direction by a rotating table installed on the work table, and the rotating table comprises an indexing drive table. The method according to claim 1, wherein the loading unit is installed on the rotary stage by at least two circuit board setting unit for loading and setting the circuit board, and the spaced member on the rotation stage corresponding to the circuit board setting unit And a glass stage that is movably installed and loaded with glass, wherein the glass stage is disposed on a guide rail disposed toward the center of the rotating stage in a guide groove formed adjacent to a circuit board setting unit fixed to the rotating stage. A circuit board and anisotropic conductive film bonding apparatus of a flat panel display, which is installed to be slidable and is returned to the circuit board setting unit at a predetermined interval by the spacer in the film bonding unit and then returned. The circuit board of claim 3, wherein the circuit board setting unit comprises a manual stage provided with three stages for correcting positions of the loaded circuit board in the X, Y, and θ directions. And anisotropic conductive film bonding apparatus. (Correction) The glass stage according to claim 1 or 3, wherein the glass stage loading surface of the loading portion is provided with a scanning hole having a long hole shape corresponding to the pattern portion of the glass to be loaded, and the glass stage being set in the guide groove of the rotating stage. A substrate and anisotropic conductive film bonding of a flat panel display for scanning an alignment point of a glass and a circuit board loaded by a scanning member fixed toward the hole in the workbench by drilling an auxiliary scanning hole corresponding to the scanning hole of Device. The method of claim 5, wherein the scanning member is a circuit board and anisotropic conductive film bonding device of a flat panel display consisting of a micro camera (Micro Camera). The apparatus of claim 3, wherein the spacer for moving the glass stage comprises one of a pair of cam plates, a cam guider, and a cylinder. The film bonding head of claim 1, wherein the film bonding unit comprises: a support plate; and a film bonding head attached to a tip of a piston rod of a cylinder installed on the support plate, and bonding an anisotropic conductive film to a pattern portion of glass loaded in the loading unit. A feed reel and a reel installed on the support plate with the film bonding head interposed therebetween to supply and recover the anisotropic conductive film, and a cutter housing provided on the support plate between the film bonding head and the supply reel. The circuit board and the anisotropic conductive film bonding apparatus of the flat panel display including a cutter which is installed to be movable inside to cut the insulating adhesive layer of the anisotropic conductive film supplied from the supply reel to a length corresponding to the pattern portion of the glass. The glass plate according to claim 8, wherein the support plate is slidably installed on the guide rail installed on the workbench, and two or more film bonding heads installed on the plate are adjacent to each other in the loading unit. Circuit board and anisotropic conductive film bonding device of a flat panel display to move to a position. The said circuit board bonding part is a fixed plate provided adjacent to the outer peripheral surface of the said rotary table in the said work table, and the cylinder piston rod tip provided corresponding to the glass stage of the said loading part by this fixed plate. The circuit board and the anisotropic conductive film bonding apparatus of the flat panel display including a bonding head for bonding the circuit board to the pattern portion of the glass bonded to the bonded anisotropic conductive film. The method according to claim 3, wherein the guide groove of the rotating stage, the glass stage is installed is a circuit board and anisotropic conductive film bonding of the flat panel display bottom surface is inclined in the range of 0 ° to 10 ° downward toward the center of the rotating stage Device.