KR20050013367A - Bonding Equipment For Bonding Anisotropic Conductive Film And Flexible Circuit Board Of Flat Panel Display - Google Patents

Abstract

PURPOSE: A bonding apparatus for bonding an anisotropic conductive film and a circuit board in a flat panel display is provided to improve bonding quality and efficiency in work processes by making the film and the circuit board easily bonded onto glass by using one equipment. CONSTITUTION: A film bonding part(4) installed on a work stand(2) bonds an anisotropic conductive film(F) onto glass(G). A circuit board bonding part(6) sets and bonds a circuit board(B) on the glass at the work stand. The film bonding part includes a turn table(T1) rotatably installed at the work stand, a loading state(12) which is installed at the turn table and loads the glass and a film bonding unit(14) for bonding the film onto the glass. The circuit board bonding part includes a turn table(T2), a loading unit(24) for loading the glass, a setting unit(26) for setting the circuit board on the loaded glass and a board bonding unit(28) for bonding the set circuit board onto the glass.

Description

Bonding Equipment For Bonding Anisotropic Conductive Film And Flexible Circuit Board Of Flat Panel Display}

The present invention relates to an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display, and more particularly, to easily set and bond a glass and a circuit board to which driving chips are bonded, respectively, by one equipment, as well as the bonding quality. The present invention relates to an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display that can greatly improve the efficiency of the.

In general, flat panel display devices such as LCD, ELD, and fluorescent display tubes (VFDs) are driven in the form of thinner and lighter devices, which are mainly separated into driving chips that are connected to the lead portion of the glass electrode pattern part. The drive chips are bonded directly to the pattern portion of the glass, and the circuit board is bonded together to the pattern portion of the glass so that it can be directly connected to the electrical devices of the applied product.

As described above, the bonding method of the glass and the circuit board is performed by bonding the driving chips to the glass and the circuit board, respectively, in each bonding process, and then bonding the glass and the circuit board to which the driving chips are bonded.

When performing such a bonding process, a film bonding device is used to bond a conductive insulating film such as an anisotropic conductive film to a pattern portion of the glass, and then transfer the same to a substrate bonding device to bond the circuit board.

As described above, when the anisotropic conductive film is attached to the pattern portion of the glass in the film bonding process, the pattern portion of the circuit board bonded to the pattern portion of the glass has an optimal conductivity and is smoothly bonded. Since the formed patterns are insulated from each other, bonding is performed while providing conductivity only to the patterns of the circuit board corresponding to the patterns, thereby improving the bonding quality by satisfying the conductivity, adhesiveness, and insulation required for bonding the circuit board. It becomes possible.

The general structure of the conventional circuit board bonding apparatus includes a work table, a glass plate installed on an upper side of the work table and loaded with glass, a circuit board plate positioned corresponding to the glass plate on the work table and loaded with a circuit board; The glass and the circuit board is made of a structure including a bonding portion for bonding the glass and the circuit board loaded on the plate.

However, in order to bond the circuit board to the glass by the conventional bonding method described above, after bonding the anisotropic conductive film in two independent processes, that is, the film bonding process, the glass on which the film is bonded is transferred back to the circuit board bonding apparatus. Therefore, it is difficult to expect satisfactory process efficiency.

In addition, since the film bonding apparatus and the circuit board bonding apparatus to be used in the above process must be manufactured, there is a problem in that an excessive cost is required for production cost and maintenance. In addition, since the bonding apparatuses are limited to the function of simply bonding a film or a circuit board with one piece of equipment, there is a limit in improving work efficiency and productivity in terms of their structure.

The present invention has been made to solve the conventional problems as described above, an object of the present invention is to easily bond the circuit board and the glass bonded to the driving chip in one process, and to the glass in one equipment The present invention provides an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display that can improve productivity and work efficiency by greatly reducing work time and process by sequentially bonding an anisotropic conductive film and a circuit board.

In order to realize the object of the present invention as described above, a workbench, a film bonding portion which is provided on the workbench to bond the anisotropic conductive film to the glass, and the film bonding portion is provided spaced apart from the film bonding portion in the workbench It includes a circuit board bonding portion for setting and bonding the circuit board to the glass bonded the anisotropic conductive film,

The film bonding unit includes a rotary table rotatably installed on the work table, a loading stage installed on the rotary table and loaded with glass, and a bonding table positioned to correspond to the loading stage on the work table to bond the anisotropic conductive film to the glass. A film bonding unit,

The circuit board bonding unit includes a rotary table rotatably installed on the work table, loading units installed on the rotary table and loaded with glass, and a glass substrate positioned and loaded on the work table so as to correspond to the loading unit. It provides an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display including a substrate setting unit for setting, and a substrate bonding unit for bonding a circuit board set on the glass to correspond to the loading unit in the workbench.

1 is an overall perspective view of an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display according to an embodiment of the present invention.

2 is a plan view of FIG.

3 is a partially enlarged perspective view for explaining the structure of the film bonding unit of FIG.

4 is a partially enlarged cross-sectional view illustrating a state in which a film is bonded by the film bonding head of FIG. 3.

FIG. 5 is a partially enlarged perspective view illustrating a structure of a substrate setting unit and a substrate bonding unit of FIG. 1. FIG.

6 is a partially enlarged perspective view illustrating a structure of a loading unit of the circuit board bonding part of FIG. 1;

7 is a side cross-sectional view for explaining the glass loading structure of FIG.

8 is a partially enlarged perspective view for explaining the operation of the substrate setting unit of FIG.

9 is a partially enlarged plan view for explaining a structure of a transfer apparatus installed between the film bonding portion and the circuit board bonding portion of FIG. 1.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the present invention will be described in detail as follows.

1 and 2, an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display according to an embodiment of the present invention are installed on a work table 2 and the work table 2 to be anisotropic on glass G. The film bonding part 4 bonding the conductive film F, and the worktable 2 is spaced apart from the film bonding part 4 and the anisotropic conductive film F is bonded at the film bonding part 4. And a circuit board bonding part 6 for setting and bonding the circuit board B to the glass G.

The working table (G) is manufactured in the form of a rectangular frame as shown in the drawing by combining the metal pipe and plate with a fastening member such as welding or bolt. The upper plate 8 is installed on the upper side of the work table 2, and the supporters 10 for supporting the bottom are installed on the lower side as shown in the drawing.

The upper plate 8 is made of a material which has a constant thickness and prevents the surface from being damaged or deformed due to a load, an impact, a change in temperature, etc., and maintains a constant flatness at all times. It is installed in a horizontal position so that a flat working area can be provided at the top of the.

Although not shown in the drawings, the supporters 10 may be provided with a cushioning member such as rubber or a spring to offset shocks or vibrations, as well as a structure capable of adjusting height and height.

In addition, although not shown in the drawing, the work table 2 is provided with a control box for supplying electricity to the driving devices of the film bonding unit 4 and the circuit board bonding unit 6 or controlling their operation.

The film bonding unit 4 includes a rotary table T1, a loading stage 12 mounted on the rotary table T1 and loaded with glass G, and the loading stage 12 on the work table 2. ) And a film bonding unit 14 which is positioned to correspond to and bonds the anisotropic conductive film F to the glass G.

The rotary table (T1) is made in the shape of a disk having a constant diameter as shown in the figure is positioned horizontally on the top plate 8 of the work table (2) and installed in the drive source (M1) to rotate about the center Structure.

The drive source M1 has a structure in which a servo motor is used and the rotary table T1 is rotated by an angle set at the work table 2 by the driving of the motor, or an indexing drive table and an indexing drive table. The same well known rotating device can be used.

The loading stage 12 is manufactured in the form of a square plate provided with a loading surface 12a having a size on which the glass G can be horizontally seated, as shown in the drawing, and the loading surface 12 is made of glass G. A region other than the pattern portion G1 of the bottom side) may be seated and two sides may be guided and formed to have a step on the surface of the loading stage 12 so as to be loaded while being guided. In this embodiment, as shown in Fig. 1, four loading stages 12 are divided into equal parts in the circumferential direction of the rotary table T1.

A plurality of suction holes 12b are formed in the loading surface 12a of the loading stage 12 as shown in FIG. 2, and the suction holes 12b are vacuum generators installed at the center of the rotary table T1. It is connected to V), and the negative pressure is applied from this device to fix the loaded glass (G) in a vacuum.

The loading stage 12 is manufactured by selecting a material from which metal is not deformed or scratched due to external force or temperature, etc., from a metal or synthetic resin material, and as a fastening member such as a bolt to the rotary table T1 as shown in the drawing. It is fixed.

1 and 3, the film bonding unit 14 is moved by the fixed plate 16 and the cylinder C installed on the fixed plate 16, and the pattern portion G1 of the glass G is moved. ), And a film bonding head 18 for bonding the anisotropic conductive film (F) to, and a film supply device (20) for supplying the anisotropic conductive film (F) to the film bonding head (18).

The fixed plate 16 is formed in the shape as shown in the figure is coupled to the metal plate having a constant thickness, as shown in Figure 2 the cylinder (C) at a position corresponding to the loading stage 12 installed on the rotary table (T1) It is installed to be movable along the guide member (L). At this time, the moving direction of the fixing plate 16 is set to be the longitudinal direction of the pattern portion (G1) of the glass (G).

As the cylinder C and the guide member L, a conventional pneumatic cylinder and an "LM" guide may be used, and cylinders and guide members described later may be used in the same or similar structure.

As shown in FIG. 3, the film bonding head 18 has a structure corresponding to the pressing portion of the pattern portion G1 of the glass G, and has a structure C of the cylinder C installed in the fixing plate 16. It is fixed to the end of the piston rod.

The film bonding head 18 is set to move along the guide member L on the fixed plate 16 as shown in FIG. 3 when the film bonding head 18 is pressed by the cylinder C. As shown in FIG.

Although not shown in the drawing, the film bonding head 18 may be heat-bonded to the pattern portion G1 of the glass G. A well known heater device consisting of a coil can be installed.

And, although not shown in the figure between the film bonding head 18 and the piston rod of the cylinder (C) pressure sensing sensor such as a load cell (Load Cell) to sense and control the excessive pressure of the film bonding head 18 Can be installed. This sensor is set so that the operation of the cylinder C can be stopped if a pressure exceeding an allowable range is sensed in the pressing operation of the film bonding head 18.

3 and 4, the work table 2 is provided with a support plate 22 corresponding to the bottom surface of the pattern portion G1 of the glass G positioned in the film bonding area, and the support plate 22 is made of glass (glass). In order to smoothly support the bottom surface region of the pattern portion G1 of G), a rectangular plate shape as shown in the drawing is firmly fixed to the work table 2.

The film supply device 20 is a certain amount of the anisotropic conductive film (F) is wound to be supplied between the film bonding head 18 and the pattern portion (G1) of the glass (G), as shown in the anisotropic conductive film It consists of a conventional film supply structure consisting of a drive reel and guide reels so that F can be supplied to the film bonding head 18.

As the anisotropic conductive film (F), a conventional conductive insulating film that provides adhesion, insulation, and conductivity when the circuit board B is bonded to the pattern portion G1 of the glass G is used. .

On the other hand, the worktable 2 is provided with a circuit board bonding part 6 spaced apart from the film bonding part 4, the structure of the circuit board bonding part 6 will be described in more detail.

1, 2, and 5, the circuit board bonding part 6 includes a rotary table T2 and a loading unit 24 mounted to the rotary table T2 and loaded with glass G. And a substrate setting unit 26 installed on the work table 2 and setting the circuit board B on the glass G loaded on the loading unit 24, and installed on the work table 2 and having a glass ( And a substrate bonding unit 28 for bonding the circuit board B set in G).

The rotary table T2 is manufactured in the same structure as that of the rotary table T1 of the film bonding unit 4, that is, in a disk shape having a constant diameter, and as shown in FIG. 1, the film bonding unit in the work table 2. It is horizontally spaced apart from the rotary table T1 of (4).

The rotary table T2 is configured to rotate at a predetermined angle with respect to the center by a driving source M2 such as a servo motor, similarly to the rotary table T1 of the film bonding unit 4.

1 and 6, the loading unit 24 includes a glass stage 30 on which glass G is loaded, and the glass stage 30 supporting the glass stage 30 in a horizontal posture at the rotation table T2. The fixed block 32 and the glass stage 30 is fixed and includes a movable block 34 that is vertically moved along the guide member (L) in the fixed block 32, the rotation as shown in FIG. An example is shown in which four pieces are provided at equal angles in the table T2.

The glass stage 30 is manufactured in the form of a square plate provided with a loading surface 30a having a size on which the glass G can be horizontally seated, as shown in FIG. 6, and the loading surface 30a is made of glass G. A region other than the pattern portion G1 of) is seated and is stepped as shown in the figure so that the two sides can be loaded while being guided.

One or more adsorption holes 30b are formed in the loading surface 30a of the glass stage 30, and the adsorption holes 30b are connected to a vacuum generator V installed at the center of the rotation table T2. While the negative pressure is applied from this device, the loaded glass G is fixed in a vacuum.

The glass stage 30 is manufactured by selecting any one of a metal or a synthetic resin material whose shape is not deformed or scratched due to external force or temperature.

The fixing block 32 is made of, for example, a "L" shape as shown in Figure 6, and has a posture standing in a substantially vertical direction at the circumferential edge of the rotary table T2, and fastening member such as a bolt. Is fixed.

For example, as shown in FIG. 6, the movable block 34 is manufactured to have an “L” shape, and the movable block 34 is installed to be slidably moved along the guide member L in the fixed block 32. At this time, the movable block 34 is set to the fixed block 32 in the horizontal position as shown in FIG.

The fixed block 32 and the movable block 34 are made of the same material as the glass stage 30.

As shown in FIG. 6, the auxiliary plate 36 is installed on the movable block 34 so that the glass stage 30 may be fixed to the auxiliary plate 36 in a horizontal posture. In this case, the glass stage 30 is detachably fixed to the auxiliary plate 36 by a fastening member such as a bolt or a fitting coupling.

The moving block 34 is fixed to the position set in the fixed block 32 to be elastically adjustable, to describe in more detail such a structure, as shown in Figure 6 the moving direction of the moving block 34 An adjustment member N having a structure similar to a micrometer is installed on the fixed block 32 in a posture corresponding to the position, and the movable block 34 has a screw rod N1 of the adjustment member N. The extension part 34a which contacts is protruded.

In addition, an elastic member 38, such as a leaf spring, is installed on the fixed block 32 such that one side of the bottom surface of the movable block 34 or the guide member L is supported as shown in FIG. By the adjustment of the adjustment member (N) is a structure in which the up and down position is elastically adjusted in the fixed block (32). Such a structure can buffer the pressing force when bonding the glass G and the circuit board B in the substrate bonding units 28 described later to prevent the set position of the circuit board B from being changed. Can be.

In the above description of the structure using a screw rod (N1), such as a micrometer as the adjusting member (N) as shown in the description and drawings as an example, but not limited to this, in addition to the control member that satisfies the object of the present invention is variously applied Can be.

In the above description, the loading unit 24 is fixed to the rotary table T2 by a fastening member such as a bolt, but is illustrated in the description and drawings as an example, but is not limited thereto. In addition, although not shown in the drawings, the loading unit 24 is installed in a conventional manual stage in which one or more adjustment stages are stacked so that the fixed position of the rotary table T2 can be changed. The rotation table T2 may be set to be positioned in two directions or more.

The rotation table T2 is provided with a circuit board stage 40 for loading the circuit board B by the substrate setting unit 26 which will be described later corresponding to the glass stage 30. In the present embodiment, as shown in FIG. 1, four pieces are provided corresponding to the glass stages 30 as an example.

The circuit board stage 40 is manufactured in the form of a square plate provided with a loading surface 40a having a size on which the circuit board B can be horizontally mounted, and the loading surface 40a is the glass stage 30. The circuit board (B), which is loaded in the same manner as the above, is made of a structure for fixing in a vacuum.

The circuit board stage 40 is spaced apart from the glass stage 30 in the rotation table T2 and fixed to the posture as shown in FIG. 7. At this time, the distance between the glass stage 30 and the circuit board stage 40 overlaps the glass G loaded on the stages 30 and 40 and the pattern portions G1 and B1 of the circuit board B within the allowable range. It is set to be good.

Between the glass stage 30 and the circuit board stage 40 is a support plate 42 for supporting the bottom surface of the pattern portion G1 of the loaded glass G, the support plate 42 is a transparent material, for example Any one of glass, synthetic resin, and quartz is manufactured as shown in the drawing.

The substrate setting unit 26 includes a first moving plate 44, a second moving plate 46 moving in a direction orthogonal to the moving direction of the first moving plate 44, and the second moving plate. A substrate adsorption head 48 installed at 46 and adsorbing the circuit board B with a vacuum, and a scanning unit 50 for scanning positions of the glass G and the circuit board B to be set, respectively. 1, the working table 2 is positioned to correspond to the loading unit 24 of the rotary table T2.

The first moving plate 44 may be a plate-like metal or synthetic resin material having a predetermined thickness, and the guide member by the cylinder (C) in the work table 2, that is, the upper plate (8) in a posture as shown in FIG. Sliding along (L) is installed.

The second moving plate 46 is formed in an "L" shape as shown in the figure and the guide member (1) of the first moving plate 44 by the cylinder (C) on the upper surface of the first moving plate 44 ( The sliding member is installed to the guide member L in a posture perpendicular to L). At this time, the second moving plate 46 is moved to a position corresponding to the pattern portion G1 of the glass G in which the substrate adsorption head 48, which will be described later, is located in the setting region, and a circuit board on the pattern portion G1. It is installed in the range of movement which can easily set (B).

The substrate adsorption head 48 has a conventional vacuum adsorption structure for adsorbing the circuit board B with a vacuum, and is located on the second moving plate 46 and the cylinder C and the rotating device 52. In the reference to the surface of the upper plate (8), it is vertically moved and rotatably fixed.

The rotating device 52 may be a conventional step motor (step motor), as shown in the vertical movement along the guide member (L) by the cylinder (C) in the second moving plate 46 as shown in the figure It is installed on the slide plate 54 to be moved, and the substrate adsorption head 48 is fixed to this motor shaft.

In addition, a storage tray 54 in which a plurality of circuit boards B to be set in the glass G is accommodated on one side of the moving section 44 of the first moving plate 44, as shown in FIG. 5. It is located so that adsorption is possible.

The scanning unit 50 includes a first scanning member S1 for scanning the pattern portion G1 of the glass G located in the circuit board setting region on the work table 2, and the substrate adsorption head 48. Setting of the substrate adsorption head 48 by calculating the second scanning member S2 for scanning the circuit board B moving by the second data and the data scanned by the first and second scanning members S1 and S2. It includes a control unit (U) for controlling the position.

As shown in FIG. 7, the first scanning member S1 has a pattern portion of the glass G on the bottom surface of the support plate 42 of the glass stage 30 located in the setting area of the circuit board B in the work table 2. G1) is placed in a position capable of scanning. In this case, a scanning hole 56 is drilled in the rotation table T2 in a predetermined area so that the first scanning member S1 can scan the pattern portion G1 of the glass G through the support plate 42. Lose.

As shown in FIG. 5, the second scanning member S2 is positioned between the moving sections of the first moving plate 44 and is patterned on the circuit board B to be absorbed and moved by the substrate adsorption head 48. B1) is fixed in a position capable of scanning.

As the first scanning member S1 and the second scanning member S2, a conventional micro camera may be used, and although not shown in the drawing, an alignment point marked on the glass G and the circuit board B, respectively. It is a structure for scanning a position.

Although not shown in the drawings, the first scanning member S1 and the second scanning member S2 are, for example, the glass G or the circuit board B scanned by the guide member or the adjusting stage. The scanning position may be set to change according to the size or pattern shape of the.

The first scanning member S1 and the second scanning member S2 are set such that the data scanned by them can be transmitted to the control unit U, and the control unit U mutually computes the two scanned data. For example, a micro computer that can control the setting position of the substrate adsorption head 48 may be used.

In more detail, the control unit U includes data in which positions of the glass G and the circuit board B are scanned from the first and second scanning members S1 and S2. Is transmitted, and after calculating these data, if a deviation exceeding the allowable error range occurs, the circuit board B is allowed to the pattern portion G1 of the glass G while controlling the substrate adsorption head 48 as follows. Set within the range.

That is, when a deviation occurs beyond the allowable range due to the scanned data, the substrate suction head while controlling the movement range of the first and second moving plates 44 and 46 in response to the positional deviation of the glass G. The circuit board B adsorbed on the 48 is corrected for the position deviation within the allowable range so as to correspond to the pattern portion G1 of the glass G, and the angle of the glass G is caused by the rotating device 52. The circuit board B is rotated so as to correspond to the deviation so as to be set while correcting the angle deviation within the allowable range. (See Fig. 8).

1 and 5, the substrate bonding unit 28 is pressed by the fixing plate 58 and the cylinder C provided on the fixing plate 58, and the pattern portion of the glass G ( And a substrate bonding head 60 for bonding the circuit board B set in G1). In this embodiment, two bonding units, that is, a first bonding unit 28a and a second bonding unit 28b, are provided on the work table 2, and the first bonding unit 28a is provided with the substrate setting unit 26. Positioning in the setting area of is shown as an example.

The fixed plate 58 is formed in a shape as shown in the figure by combining the metal plate having a constant thickness, and is adjacent to the outer circumferential surface of the rotary table T2 in the work table (2) as shown in Figure 2 It is located so as to correspond to the glass stage 30 of T2). At this time, the fixing plate 58 of the first bonding unit 28a should be set so as not to contact the setting unit 26 in consideration of the operating range of the substrate setting unit 26.

As shown in FIG. 1, the fixing plate 58 is slidably mounted to the guide member L on the upper plate 8 of the work table 2, and the guide member L is moved by the cylinder C. FIG. It is installed to move along. At this time, the guide member (L) is the pattern portion (G1) of the glass (G), the fixing plate 58 is loaded on the glass stage 30 located in the first and second bonding area in the rotary table (T2). It is set to be movable along the longitudinal direction.

The substrate bonding head 60 is connected to the piston rod of the cylinder C in a posture that can be pressed against the pattern portion G1 of the glass G in the fixing plate 58.

The substrate bonding head 60 has a conventional structure capable of pressing the pattern portion B1 of the circuit board B set on the pattern portion G1 of the glass G, and is not shown in the drawing. When bonding, a conventional heater device including a heating coil may be installed so that the circuit board B may be bonded to the pattern portion G1 of the glass G as heat together with physical pressure.

The substrate bonding head 60 is a guide member (L) in the fixed plate 58 as shown in the figure so that it can be moved only in a predetermined pressing section when the pressing operation by the cylinder (C) in the fixed plate 58 It is set to pressurize along).

Although not shown in the drawings, an excessive pressing force of the substrate bonding head 60 may be sensed and controlled between the substrate bonding head 60 and the piston rod of the cylinder C in the same manner as the film bonding unit 14. A pressure sensor such as a load cell may be installed.

The substrate bonding unit 28, that is, the first bonding unit 28a and the second bonding unit 28b divides the bonding time defined by the substrate bonding head 60, thereby temporarily attaching and bonding the circuit board B. The first bonding unit 28a is temporarily bonded to the glass G so that the first bonding unit 28a may be bonded to the glass G, and the second bonding unit 28b may be attached to the glass substrate G. 1)

In addition, a transfer device 62 is installed between the film bonding part 4 and the rotary tables T1 and T2 of the circuit board bonding part 6 as shown in FIG. 2 to bond the film to the transfer device 62. The glass G loaded on the rotary table T1 of the unit 4 may be moved to the rotary table T2 of the circuit board bonding unit 6.

The transfer device 62 has a conventional structure in which the glass G is sucked by a vacuum and moved to a predetermined transfer section.

When the glass G is moved from the rotary table T1 of the film bonding part 4 to the rotary table T2 of the circuit board bonding part 6 by the transfer device 62, The glass G is rotated in a posture such as to be set to be loaded on the rotation table T2 of the circuit board bonding part 6, that is, the glass stage 30.

Referring to the accompanying drawings, preferred embodiments of the anisotropic conductive film and the circuit board bonding apparatus of the flat panel display according to an embodiment of the present invention having the above-described structure will be described in detail as follows.

First, the loading and unloading of the glass G on the work table 2 is loaded in the direction of "A" of the film bonding part 4 when referring to FIG. It is unloaded in the "B" direction.

When the glass G is loaded on the loading stage 12 corresponding to the loading direction A, the rotary table T1 is rotated 90 degrees counterclockwise when the rotary table T1 is driven by the driving source M1 with reference to FIG. 2. In the bonding area of the film bonding unit 14.

When the loading stage 12 loaded with the glass G is positioned in the film bonding region as described above, the film bonding unit 14 bonds the anisotropic conductive film F to the pattern portion G1 of the glass G. do.

Referring to FIGS. 3 and 4, the bonding process of the anisotropic conductive film F is described in more detail. The anisotropic conductive film F is formed of a glass by the film supply device 20 of the film bonding unit 14. Conductive insulation of the anisotropic conductive film F is supplied to the pattern portion G1 of the glass G while the film bonding head 18 is pressed by the cylinder C and supplied to the upper surface of the pattern portion G1 of G). Bonding the adhesive layer.

When the film bonding process is completed, the rotary table T1 is rotated by 90 ° in the same direction again, and is positioned in an area corresponding to the transfer device 62 as shown in FIG. 2, and the transfer device 62 includes the glass ( G) is adsorbed and loaded into the circuit board bonding portion 6, ie, the glass stage 30 of the rotary table T2, as shown in FIG.

When the glass G is loaded as described above, when the rotary table T2 is rotated 90 ° counterclockwise based on FIG. 2, the glass table G is positioned in the setting area of the substrate setting unit 26 and the substrate setting unit 26. Sets the circuit board (B) to the glass (G) while operating as follows.

Referring to FIG. 5, the substrate adsorption head 48 of the substrate setting unit 26 adsorbs the circuit board B accommodated in the accommodation tray 54, moves along the first moving plate 44, and then again. The circuit board B is loaded on the circuit board stage 40 corresponding to the glass stage 30 on which the glass G is loaded while moving along the second moving plate 46 to form the pattern portion of the glass G ( G1) and the pattern portion B1 of the circuit board B are set to overlap each other.

In this case, the scanning unit 50, that is, the first scanning member S1 scans the alignment point position displayed on the pattern portion G1 of the glass G loaded in the glass stage 30 as shown in FIG. 7. To transmit the scanned data to the control unit (U).

In addition, the second scanning member S2 scans an alignment point displayed on the pattern portion B1 of the circuit board B, which is sucked by the substrate adsorption head 48 and transports the scanned data to the control unit ( U) to transmit.

Then, the control unit U calculates the two data, and when the deviation exceeds the allowable range, the first moving plate 44 and the first moving plate 44 are set when the circuit board B is set by the substrate adsorption head 48. 2, while controlling the operation of the movable plate 46 and the rotating device 52 for rotating the substrate adsorption head 48, while correcting the setting position of the circuit board (B) corresponding to the position of the glass (G) Is set within range.

As described above, when the setting of the circuit board B is completed, the substrate bonding unit 28, that is, the substrate bonding head 60 of the first bonding unit 28a is pressed to operate the pattern portion G1 of the glass G. Temporary bonding of the circuit board (B) set in the for a predetermined bonding time, and when the temporary bonding is completed, the rotating table (T2) is rotated again to move the temporarily bonded glass (G) and the circuit board (B) to the second The main bonding is performed for a predetermined time by the substrate bonding head 60 of the second bonding unit 28b so as to be located in the bonding region of the bonding unit 28b.

Then, when the bonding of the circuit board B to the pattern portion G1 of the glass G is completed in the second bonding unit 28b, the rotation table T2 rotates in the unloading direction “B” of FIG. 2. After that, the glass G to which the circuit board B is bonded is unloaded. Therefore, in this process, the anisotropic conductive film F and the circuit board B may be sequentially bonded to the pattern portion G1 of the glass G.

In the above, a preferred embodiment of an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display according to the present invention has been described, but the present invention is not limited thereto, but the scope of the claims and the detailed description of the invention and the accompanying drawings are various. It is possible to carry out modification by branch, and this also belongs to the scope of the present invention.

As described above, the anisotropic conductive film and the circuit board bonding apparatus of the flat panel display according to the present invention, by installing two rotary tables in one equipment by bonding the anisotropic conductive film and the circuit board to the pattern portion of the glass in sequence Of course, the holding time generated during bonding can be greatly reduced to obtain satisfactory work efficiency and productivity.

In addition, the anisotropic conductive film and the circuit board bonding apparatus of the flat panel display according to the present invention, the scanning unit senses the attitude of the glass and the circuit board when the circuit board is set on the glass by the substrate setting unit of the circuit board bonding portion Since the setting is performed while the deviation is corrected within the allowable range corresponding to the position of the glass, the setting accuracy of the circuit board is further improved, and as a result, a better bonding quality can be obtained.

Claims (10)

A circuit board is set on a worktable, a film bonding portion which is attached to the workbench and bonds the anisotropic conductive film to the glass, and which is spaced apart from the film bonding portion on the worktable, and which is bonded to the anisotropic conductive film on the film bonding portion. It includes a circuit board bonding portion for bonding, The film bonding unit includes a rotary table rotatably installed on the work table, a loading stage installed on the rotary table and loaded with glass, and a bonding table positioned to correspond to the loading stage on the work table to bond the anisotropic conductive film to the glass. A film bonding unit, The circuit board bonding unit includes a rotary table rotatably installed on the work table, loading units installed on the rotary table and loaded with glass, and a glass substrate positioned and loaded on the work table so as to correspond to the loading unit. An anisotropic conductive film and a circuit board bonding apparatus for a flat panel display comprising a substrate setting unit for setting and a substrate bonding unit for bonding a circuit board set on the glass to correspond to the loading unit in the workbench. The said board | substrate setting unit is a 1st moving plate installed so that a movement is possible to the said work table, the 2nd moving plate which moves in the direction orthogonal to the moving direction of this 1st moving plate, and this 2nd movement An anisotropic conductive film and a circuit board bonding apparatus of a flat panel display comprising a substrate adsorption head mounted on a plate and adsorbing a circuit board by vacuum, and a scanning unit scanning positions of glass and circuit boards to be set. The glass unit of claim 1, wherein the loading unit comprises: a glass stage into which glass is loaded, a fixed block for supporting the glass stage in a horizontal position on the rotating table, and the glass stage is fixed and moved up and down in the fixed block. An anisotropic conductive film and a circuit board bonding apparatus of a flat panel display including a movable block which can be installed so as to be divided into two or more spaced apart in the circumferential direction of the rotary table. The scanning unit of claim 2, wherein the scanning unit is configured to calculate a first scanning member for scanning a position of a glass, a second scanning member for scanning a position of a circuit board, and data scanned by the first and second scanning members. Anisotropic conductive film and circuit board bonding apparatus of a flat panel display comprising a control unit for controlling the setting operation of the substrate suction head. The film bonding unit according to claim 1, wherein the film bonding unit comprises a film bonding head for bonding an anisotropic conductive film to a pattern portion of the glass while being moved by a fixed plate, a cylinder provided on the fixed plate, and an anisotropic conductive film on the film bonding head. Anisotropic conductive film and circuit board bonding apparatus of a flat panel display including a film supply device to supply. The method according to claim 1, wherein the two rotary table is formed in a disk form and is rotatably installed in a horizontal position by a drive source in the work table, the drive source is a servo motor (Servo Motor) or an indexing drive table (Indexing Drive Table) Anisotropic conductive film and circuit board bonding apparatus of a flat panel display made of any one of the. The substrate bonding unit of claim 1, wherein the substrate bonding unit includes a fixed plate and a substrate bonding head for bonding a circuit board set to a pattern portion of glass while being pressed by a cylinder installed on the fixed plate, wherein the rotation is performed on the work table. An anisotropic conductive film and a circuit board bonding apparatus of a flat panel display provided with one or more corresponding to a table. The flat panel display of claim 7, wherein the fixing plate is set to be slidably moved along the guide member by a cylinder or a motor in the worktable to move the substrate bonding head in the longitudinal direction of the pattern portion of the glass located in the circuit board bonding region. Anisotropic conductive film and circuit board bonding devices. 2. The anisotropic conductive film and circuit board bonding apparatus of claim 1, wherein a circuit board stage on which the circuit board is loaded corresponding to the loading unit is installed on the rotation table of the circuit board bonding unit. The method of claim 9, wherein a support plate for supporting the bottom surface of the pattern portion of the glass is located between the loading unit and the circuit board stage, the support plate is an anisotropic conductive film and circuit board bonding of a flat panel display made of any one of transparent synthetic resin or quartz (Quartz) Device.