KR200291772Y1 - Bonding Equipment For Circuit Board And Anisotropic Conductive Film Of Flat Panel Display - Google Patents

Abstract

Bonding circuit boards to flat panel displays such as LCD, ELD, and fluorescent display tubes (VFD) simultaneously bonds the anisotropic conductive film and the circuit board to improve process efficiency and equipment efficiency. It provides a device that can maximize and maximize the work efficiency and productivity.

Such a device includes a work table, a table rotatably installed on the work table, a setting part installed on the table for loading and setting glass and a circuit board, and a glass fixed to the work table and loaded on the setting part. A first bonding portion for bonding the anisotropic conductive film to the pattern portion of the substrate, and one or more installed on the work table spaced apart from the first bonding portion and bonding the circuit board to the pattern portion of the glass on which the anisotropic conductive film is bonded. Provided is a circuit board and anisotropic conductive film bonding apparatus for a flat panel display including two bonding portions.

Description

Bonding Equipment For Circuit Board And Anisotropic Conductive Film Of Flat Panel Display}

The present invention relates to a circuit board and anisotropic conductive film bonding device of a flat panel display, and more particularly, to significantly shorten the time and process required for bonding the circuit board, thereby maximizing work efficiency, productivity, and facility efficiency. The present invention relates to a circuit board and an anisotropic conductive film bonding apparatus of a flat panel display.

In general, flat panel display devices such as LCD, ELD, and fluorescent display tubes (VFD) are directly connected with circuit boards (eg, PCBs, FPCs) to meet the trend of thin and short. It is manufactured in a bonded TCP (Tape Carrier Package) type.

Thus, when the circuit board is directly bonded to the glass, the structure does not require complicated wiring, so assembly and maintenance are easy, and there is no need to secure a separate wiring space, so that the product can be miniaturized.

As described above, in order to bond the circuit board to the glass, the insulating adhesive layer of the anisotropic conductive film is first bonded to the pattern portion formed on the glass, and then the circuit board is bonded to the upper side of the insulating adhesive layer.

The reason for attaching the anisotropic conductive film is that one or more patterns formed on the pattern portion of the glass are insulated from each other and the circuit board adhered to the pattern can be smoothly bonded.

The structure of the conventional circuit board bonding apparatus described above is briefly described, a table, a glass fixing plate provided on an upper side of the table, a circuit board fixing plate adjacent to the glass fixing plate, and fixing the circuit board; It consists of a structure including a bonding portion for bonding the circuit board while pressing the adhered surface of the glass loaded on a glass fixing plate, in order to bond the circuit board in this way, a separate process, that is, an anisotropic conductive film bonding device of the glass After bonding the insulating adhesive layer of the anisotropic conductive film to the pattern portion, it is common to transfer the glass bonded the insulating adhesive layer to the circuit board bonding apparatus described above to bond the circuit board.

However, the above-described conventional circuit board bonding apparatus has an in-line structure, and thus, the bonding operation is discontinuous due to its structure, and the holding time is excessively generated, thereby significantly reducing work efficiency and productivity, thereby providing satisfactory facilities. Efficiency is not obtained.

In the conventional circuit board bonding apparatus, the anisotropic conductive film is bonded to the pattern portion of the glass in a separate anisotropic conductive film bonding process and then moved again to bond the circuit board, thereby significantly reducing the efficiency of the process, and And there is a problem that adds to the burden of additional costs due to the expansion of the process.

The present invention is devised to solve the conventional problems as described above, the object of the present invention is to reduce the work process significantly and to improve the work efficiency and equipment efficiency and productivity of the flat panel circuit board and anisotropy It is to provide a conductive film bonding apparatus.

In order to realize the object of the present invention as described above, a worktable, a table rotatably installed on the worktable, a setting portion installed on the table for loading and setting the glass and the circuit board, and fixed to the worktable And a first bonding portion for bonding the anisotropic conductive film to the pattern portion of the glass loaded in the setting portion, one or more installed on the work table spaced apart from the first bonding portion and the anisotropic conductive film bonded Provided are a circuit board and anisotropic conductive film bonding apparatus for a flat panel display including a second bonding part for bonding a circuit board to a pattern part.

1 is an overall perspective view of a circuit board and anisotropic conductive film bonding apparatus of a flat panel display according to the present invention.

2 is a partial partial cross-sectional view of FIG.

Figure 3 is a plan view showing a setting portion of the circuit board and the anisotropic conductive film bonding device of the flat panel display according to the present invention.

4 is a partially enlarged perspective view illustrating a first bonding part of a circuit board and anisotropic conductive film bonding apparatus of a flat panel display according to the present invention;

5 is a partially enlarged perspective view illustrating a second bonding part of a circuit board and anisotropic conductive film bonding apparatus of a flat panel display according to the present invention;

Figure 6 is a main cross-sectional view showing a scanning member according to the present invention.

Figure 7 is a reference diagram showing an example of displaying the setting state of the glass and the circuit board loaded on the aligning portion of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention through a monitor.

8 is an enlarged front view of the first bonding head of FIG. 4;

9 is an enlarged front view of the second bonding head of FIG. 5;

10 is a perspective view illustrating a state in which an anisotropic conductive film is supplied from a first bonding part of a circuit board and an anisotropic conductive film bonding apparatus of a flat panel display according to the present invention;

11 is a front view for explaining an operating state of the first bonding portion of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in more detail.

1, 2, 3, and 4, the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention,

A work table 2, a table 4 rotatably mounted on the work table 2, and an upper side of the table 4 for setting and loading the glass G and the circuit board B. The first bonding part (10) and the first bonding part for bonding the anisotropic conductive film (F) to the pattern part (G1) of the glass (G), which is fixed to the work table (2) and loaded on the setting part (6) ( 8) and the circuit board B on the pattern portion G1 of the glass G bonded to the anisotropic conductive film F and installed on the work table 2 spaced apart from the first bonding portion 8. It includes a second bonding portion 10 for bonding.

First, in the work table 2, a pipe member or a rod member made of a common metal material is joined by welding or bolting to form a rectangular frame, and an upper plate 12 is provided on the upper side.

The upper plate 12 is made of a plate-like metal material is integrally installed by welding or bolting on the upper side of the work table (2), and prevents the surface from sagging or deforming due to load or impact and always has a constant plan view ( It is better if it is a structure and a material which can maintain flatness.

A plurality of supports 14 are provided at the bottom of the work table 2 to be supported on the floor, and the supports 14 are provided with a cushioning member (not shown) such as rubber or spring. It is preferable that the work table 2 be made of a structure that can sufficiently buffer the shaking due to minute vibrations or shocks.

The table 4 is installed on the auxiliary top plate 16 installed inside the work table 2, and the table 4 is the table 4 described above on the top plate 12 of the work table 2. It is disposed inwardly of the through hole 18 formed in a size that can accommodate the upper side of the.

Indexing drive table (INDEXING DRIVE TABLE) can be used as the table 4, this indexing drive table is a structure that the above-mentioned table itself rotates by a separate drive source briefly described the general configuration and operation Is as follows.

The indexing drive table is composed of a separate drive source, that is, a cam mechanism installed on the shaft of the motor and a cam follower guided to the cam mechanism in a radial manner in which the upper side table is connected to the taper rib of the cam mechanism. Is a mechanism capable of precise rotation without backlash of the pallet because of its preloaded state, and is generally used widely in machine tools or automation devices requiring accurate rotation. .

The table 4 is set to stop after the rotation at a predetermined angle by the operation of the drive button 20 installed above the work table (2), in the present embodiment, the drive button 20 once When pressed, the table 4 is rotated so that the setting part 6 installed on the table rotates 120 ° clockwise when the table is set to FIG. 1 and then the first bonding part 8 and the second bonding part ( 10) is set to stop at a position corresponding to each.

As described above, the electrical connection structure for rotating the table 4 in a predetermined direction and angle by operating the driving button 20 can be easily implemented by those skilled in the art. Omit.

On the other hand, a setting portion 6 is provided on the upper side of the table 4. In this embodiment, the setting portion is divided 120 degrees in the circumferential direction of the upper side of the table 4, so that the three alignment portions, namely, As an example, it is comprised from the 1st aligning part 6a, the 2nd aligning part 6b, and the 3rd aligning part 6c.

Referring to the accompanying drawings, the first aligning portion 6a, the second aligning portion 6b, and the third aligning portion 6c may include a glass stage 22 on which the glass G is loaded. And the circuit board B is loaded adjacent to the glass stage 22 to load the pattern portion B1 of the substrate onto the pattern portion G1 of the glass G loaded on the glass stage 22. It comprises a setting unit 24 for setting each, and the glass stage 22 and the setting unit 24 described above are composed of one set each.

The glass stage 22 is fixed by a separate fastening member in the table 4 and formed of a size that can be loaded and loaded with the glass G to be smoothly loaded and loaded on one side of the glass G. The scanning hole 26 corresponding to the pattern portion G1 of is drilled.

A guide protrusion 28 for guiding one side edge of the glass G to be loaded is formed at the corner of the glass stage 22.

The scanning hole 26 is formed in a long hole shape so that the entire pattern portion G1 of the glass G can be viewed from the lower side of the table 4, and the scanning hole 26 corresponds to the scanning hole 26. An auxiliary scanning hole 30 is formed in one table 4.

One or more adsorption holes H are formed in the glass stage 22, and the adsorption holes H are not shown in the drawing, but are connected to a separate vacuum hose to stably fix the glass G loaded by the vacuum. Done.

The setting unit 24 is a conventional manual stage (MANUAL STAGE) is provided with one or more adjustment stages, in this embodiment to correct the position of the X direction, Y direction and θ direction of the loaded circuit board, respectively It consists of three stages, and these stages are provided with adjustment knobs N, respectively.

Since the manual stage is generally made of the same or similar structure as that widely used for adjusting a setting point in a semiconductor device or the like, more detailed description will be omitted.

A suction hole H is formed in the stage where the circuit board is loaded on the setting unit 24 and the circuit board is loaded, and the suction hole H is connected to a separate vacuum hose. And the circuit board (B) to be loaded is sucked by vacuum.

2 and 6, a scanning member S is installed below the scanning hole 26 and the auxiliary scanning hole 30, and the scanning member S is formed of the work table 2. It is fixed to the support bracket 32 on the lower side of the upper plate 12 and is disposed and set to face the inside of the scanning hole 26 and the auxiliary scanning hole 30 drilled in the glass stage 22 and the table 4. Scanning of the setting points G2 and B2, which are displayed at two intervals at a predetermined interval, respectively, on the pattern portion G1 of the glass G and the pattern portion B1 of the circuit board B. FIG.

The scanning member S is composed of two sets corresponding to the setting points G2 and B2 of the glass G and the circuit board B, and is spaced apart from the upper side of the table 4. Corresponding to the two glass stages 22, respectively.

The scanning member (S) is a conventional micro camera (MICRO CAMERA) is used, is electrically connected to the monitor 34 installed on one side of the top plate 12 of the work table (2) through the monitor 34 The scanned image is displayed in a conventional manner. (See FIG. 7).

In the above description, the micro-camera is used as the scanning member S, but the present invention is not limited thereto. For example, the position of the setting points G2 and B2 displayed on the glass G and the circuit board B may be sensed. Sensing members of various forms may be used, and in addition, all the scanning members satisfying the object of the present invention may be applied.

The first bonding portion 8 is for bonding the anisotropic conductive film F to the pattern portion G1 of the loaded glass G. Referring to the accompanying drawings, the first bonding portion 8 The structure is described in more detail as follows.

1 and 4, the first bonding part 8 is a first transfer plate 36 which is installed to be movable by the transfer unit U adjacent to the outer circumferential surface of the table 4. And anisotropic to the pattern portion G1 of the glass G which is installed at the tip of the piston rod of the first cylinder C1 provided on one side of the first transfer plate 36 and loaded on the glass stage 22. The first bonding head 38 for bonding the conductive film (F) and the first transfer plate (36) interposed between the first bonding head 38 to supply the anisotropic conductive film (F) The feed reel R1 and recovery reel R2 and the above-mentioned first bonding head 38 and the feed reel R1 are moved inside the cutter housing 40 provided in the first transfer plate 36. The cutter 42 may be installed to cut the insulating adhesive layer F1 of the anisotropic conductive film F supplied from the supply reel R1 to a length corresponding to the pattern portion G1 of the glass G. do.

The first transfer plate 36 is made of a metal material or a synthetic resin material, the horizontal portion 44 and the vertical portion 46 is formed in a "┗" shape, the transfer unit below the horizontal portion 44 U is provided to slidably support the first transfer plate 36 in the worktable 2 described above.

The transfer unit (U) is a conventional LM guide consisting of a pair of sliders and guiders are used, the drive shaft of the transfer motor (M1) is screwed to the first transfer plate 36, the motor (M1) Positions corresponding to the two setting units 24 and the glass stage 22 disposed in the first bonding portion 8 in the table 4 while the first transfer plate 36 is slid by driving of the table 4. The first bonding head 38 is moved.

Referring to FIG. 8, the first bonding head 38 may cover the entire pattern portion G1 corresponding to the pattern portion G1 of the glass G loaded on the glass stage 22. A pressing surface 38a of size is formed and a heater W is installed inside.

The bonding head 38 is installed at the tip of the piston rod of the first cylinder (C1) installed in the vertical direction from the first transfer plate 36 of the glass (G) loaded on the glass stage (22) The insulating adhesive layer of the anisotropic conductive film F is bonded to the pattern portion G1.

The heater W installed inside the bonding head 38 may be a conventional coil heater having a heating element in the form of a coil, and electricity is applied when the bonding head 38 is bonded. It is set to generate heat.

The supply reel R1 and the recovery reel R2 are respectively installed on the first transfer plate 36 with the bonding head 38 interposed therebetween, so as to bond the anisotropic conductive film F to the bonding head ( 38) to the side.

First, the anisotropic conductive film F wound around the supply reel R1 will be briefly described. The insulating adhesive layer F1 and the backing paper F2 attached to one side of the insulating adhesive layer F1 will be described.

The insulating adhesive layer (F1) is a circuit board (B) in a state in which the ball-shaped fine conductive particles are embedded in the insulator formed in the form of a thin film and the patterns formed in the pattern portion (G1) of the glass (G) are insulated from each other. Since the anisotropic conductive film (F) to be bonded to the pattern portion (B1) of the) is widely known and used in the art, more detailed description thereof will be omitted.

The supply reel R1 is formed in a general reel form and rotates to the first bonding head 38 while being rotated by the driving motor M2 provided on the rear surface of the first transfer plate 36. The anisotropic conductive film F is sequentially supplied.

And, the recovery reel (R2) is made of the same form as the supply reel (R1) and the bonding is completed while rotating in one direction by the drive motor (M3) installed on the back of the first transfer plate (36) The back paper F2 of the insulating adhesive layer F1 is sequentially collected.

The cutter 42 is installed to be movable upward and downward from the inside of the cutter housing 40 installed at one side of the first transfer plate 36, and the cylinder 42 is disposed at the lower end of the cutter 42. The piston rod of C3 is coupled to move only the insulating adhesive layer F1 of the anisotropic conductive film F while moving upward and downward by the driving of the cylinder C3.

The cutter 42 is set to be cut to a length corresponding to the pattern portion G1 of the loaded glass G when cutting the insulating adhesive layer F1.

One or more guide rollers 48 are installed in the first transfer plate 36 to smoothly supply the anisotropic conductive film F sequentially supplied by the supply reel R1 and the recovery reel R2. To guide you.

The guide roller 48 is formed in a conventional roller shape so as to be rotatably installed in the first transfer plate 36, and more preferably anisotropic conductivity guided by the guide roller 48, although not shown in the drawings. It is more preferable that a tension control device capable of adjusting the tension of the film F is provided.

The circuit board B is set in the pattern portion G1 of the glass G to which the insulating adhesive layer F1 of the anisotropic conductive film F is attached by the first bonding portion 8, thereby forming the second bonding portion ( The circuit board B set by 10) is bonded to the glass G. The structure of the second bonding part 10 will be described in more detail with reference to the accompanying drawings.

1, 2, and 5, the second bonding part 10 is installed on the table 4 spaced apart from the first bonding part 8 on the outer circumferential surface of the table 4. The second conveying plate 50, which is installed on the work table 2 so as to correspond to the setting unit 4, and is movably installed by the conveying unit U, and the second conveying plate 50 It includes a second bonding head 52 is installed on the front end of the piston rod of the second cylinder (C2) installed on the upper side.

The second conveying plate 50 has a horizontal portion 54 and a vertical portion 56 formed in a “┗” shape to be adjacent to the outer circumferential surface of the table 4 on the upper plate 12 of the work table 2. The same structure as that of the transfer unit U of the first transfer plate 36, that is, the transfer unit U and the transfer motor M4 formed of a pair of LM guides is movable.

An auxiliary horizontal portion 54a is formed at the tip of the vertical portion 56 of the second conveying plate 50, and the auxiliary horizontal portion 54a is provided with the second cylinder C2 in the vertical direction. A second bonding head 52 is installed at the tip of the piston rod of the second cylinder C2.

Referring to FIG. 9, the second bonding head 52 has the same structure as that of the first bonding head 38, that is, a size capable of pressing the entire pattern portion G1 of the glass G. A pressurizing surface 52a is formed and a heater W made of a coil-like heating element is provided inside.

The piston rods of the first cylinder C1 and the second cylinder C2 of the first bonding part 8 and the second bonding part 10, the first bonding head 38, and the second bonding head 52 are described. Pressure sensor (L) is provided between each of which can be used a conventional load cell (LOAD CELL).

The pressure sensor L detects that the bonding heads 38 and 52 come into contact with excessive pressure when bonding while pressing the anisotropic conductive film F or the circuit board B. Optimum bonding quality can be obtained by preventing the pattern portion G1 of the C) or the pattern portion B1 of the circuit board B from being damaged in advance.

In the above description, the second bonding part 12 bonding the circuit board B to the glass G is provided adjacent to the outer circumferential surface of the table 4 as an example. It is also possible to install two pieces at a predetermined interval from the outer circumferential surface of the table 4, divide the bonding time, and perform temporary adhesion and main adhesion, and bond the circuit board B.

Next, a preferred operating embodiment of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention having the above structure will be described in more detail with reference to the accompanying drawings.

1, 2, 3, 4, and 5, the setting part 6, that is, the first aligning part 6a and the second aligning part ( 6b) and a third aligning portion 6c are provided in the counterclockwise direction of the table 4, respectively, and based on FIG. The inning part 6a is arrange | positioned and is shown by drawing.

First, the glass G is loaded on the glass stage 22 of the first aligning part 6a. The glass G is loaded at the same time as the pattern part G1 faces upward. Loading is directed toward the setting unit 24 installed adjacent to the glass stage 22.

The loading operation of the glass G may be loaded by a separate loading device although the worker directly loads the glass G or is not shown in the drawings.

After the loading of the glass G is completed as described above, when the driving button 20 installed on one side of the work table 2 is pressed, the table 4 is rotated counterclockwise so that the glass G is loaded. The first aligning portion 6a stops at a position corresponding to the first bonding portion 8.

The second aligning portion 6b is positioned on the second bonding portion 10 side by the rotation of the table 4, and the third aligning portion 6c is the work table 2 described above. Is placed in the loading position of the front of the.

When the glass 8 loaded in the first aligning portion 6a is positioned in the first bonding portion 8 as described above, the supply reel R1 and the recovery reel as shown in FIGS. 10 and 11. (R2) and while the cutter 42 operates, the anisotropic conductive film F having the insulating adhesive layer F1 cut to a predetermined length is supplied to the lower side of the first bonding head 38 of the first bonding portion 8 described above. The first cylinder C1 of the first bonding part 8 is operated to move the first bonding head 38 installed on the piston rod of the cylinder C1 downward, so that the first aligning is performed. The insulating adhesive layer F1 is bonded to the pattern portion G1 of the glass G loaded on the glass stage 22 of the portion 6a.

In addition, at the same time as the bonding of the anisotropic conductive film F, the worker may attach the glass G to one glass stage 22 of the third aligning part 6c in the same manner as the glass G. When the loading and loading is completed, press the drive button 20 again to rotate the table 4 counterclockwise.

Then, the first aligning portion 6a is positioned on the second bonding portion 10 by the rotation of the table 4 and the third aligning portion 6c on which the glass G is loaded. ) Is located in the first bonding part 8 and the second aligning part 6b is arranged at the front part loading position of the work table 2 so that another glass G can be loaded.

In the above state, the first bonding part 8 bonds the insulating adhesive layer F1 of the anisotropic conductive film F to the glass G loaded in the third aligning part 6c by the same process as described above. The worker loads the glass G on one side of the glass stage 22 of the second aligning part 6b.

In this case, the second bonding part 10 maintains the standby state because the circuit board B is not set in the pattern part G1 of the glass G loaded in the first aligning part 6a. do.

After the above process is completed, if the table 4 is rotated again, the first aligning portion 6a rotates 360 ° to rotate to the first loading position and stops. Thus, the insulating adhesive layer of the anisotropic conductive film F When the glass G to which F1 is attached is placed in the loading position, the circuit board B is set in the setting unit 24 which is composed of a pair of the glass stage 22 loading the glass G. .

In the setting operation, when the circuit board B is loaded on the stage of the setting unit 24, the scanning member S disposed under the scanning hole 26 formed in the glass stage 22 is located. The setting point G2 displayed on the pattern portion G1 of the glass G and the setting point B2 displayed on the pattern portion B1 of the circuit board B are scanned.

Then, the monitor 34 installed on the upper side of the work table 2 displays the image scanned by the scanning member S as shown in FIG. 7, and the glass displayed through the monitor 34 is thus displayed. After the operator visually confirms the deviation between the setting point G2 of G) and the setting point B2 of the circuit board B, the above-mentioned circuit board is controlled using the adjusting knob N of the setting unit 24 described above. Setting (B) within the allowable range while adjusting in the X, Y and θ directions.

When the setting of the glass G and the circuit board B loaded in the first aligning part 6a is completed as described above, the glass (22) is added to the other glass stage 22 of the first aligning part 6a. G) is loaded and then the drive button 20 is operated to rotate the table 4 again to move to the first bonding part 8, and thus to move the first aligning part 6a. The two glass stages 22 are bonded with the insulating adhesive layer F1 of the anisotropic conductive film F, and the glass G on which the circuit board is set and the glass G without the insulating adhesive layer F1 are respectively loaded. Will move together.

Thus, when the first aligning portion 6a is stopped in the first bonding portion 8, the first bonding portion 8 of the first bonding portion 8 is directed toward the glass stage 22 to which the anisotropic conductive film F is not attached. The first transfer plate 36 moves to bond the insulating adhesive layer F1 of the anisotropic conductive film F to the pattern portion G1 of the glass G.

When the above process is completed, press the drive button 20 again to rotate the table 4, and the first aligning unit 6a moves to the second bonding unit 10 and then stops. do.

Then, the direction corresponding to the one-side glass stage 22 and the setting unit 24 in which the glass G and the pattern portions G1 and B1 of the circuit board B are set in the first aligning portion 6a. After the second transfer plate 50 of the second bonding part 10 moves along the transfer unit U, the second cylinder C2 installed on the second transfer plate 50 operates to operate the second transfer plate 50. Bonding is performed while pressing the glass portions G and the pattern portions G1 and B1 of the circuit board B through the bonding head 52.

After the bonding of the glass G and the circuit board B loaded in the glass stage 22 of the first aligning part 6a and the setting unit 24 corresponding thereto is completed, After the table 4 is rotated again to the initial loading position, the bonded glass G and the circuit board B are unloaded from the first aligning part 6a, and then the bonded glass ( The glass stage 22 in which G) is unloaded is loaded with another glass G.

In addition, the pattern portion G1 of the glass G, which is loaded on the other glass stage 22 of the first aligning part 6a and the insulating adhesive layer F1 of the anisotropic conductive film F is bonded, is formed as described above. The circuit board B may be loaded and set in the same manner, and then bonding may be performed sequentially through the same process as described above.

In the above description of the preferred embodiment of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention, the present invention is not limited to this, the utility model registration claim and the detailed description of the invention and the scope of the accompanying drawings. It is possible to carry out various modifications within, and this also belongs to the scope of the present invention.

As described above, the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention have a structure in which the anisotropic conductive film and the circuit board are sequentially bonded to the glass loaded in the setting unit while rotating the table in one direction. Can greatly improve the efficiency and efficiency of the installation.

In addition, the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention is composed of two pairs of aligning portions each consisting of a glass stage and a setting unit, one or more are installed in the circumferential direction of the table described above Since the first bonding portion and the second bonding portion move in correspondence with the glass stage of the aligning portion, the first bonding portion and the second bonding portion have a more improved work compatibility, thereby further improving work efficiency and productivity.

Claims (6)

A work table, a table rotatably installed on the work table, a setting part installed on the table for loading and setting glass and a circuit board, and a pattern part of glass fixed to the work table and loaded on the setting part. A first bonding part for bonding the anisotropic conductive film, and a second bonding part for bonding a circuit board to a pattern portion of the glass on which the at least one is installed on the work table spaced apart from the first bonding part and to which the anisotropic conductive film is bonded. A circuit board and anisotropic conductive film bonding apparatus of a flat panel display. The method according to claim 1, wherein the setting portion is composed of one or more aligning portions provided in the circumferential direction of the table, the aligning portion is provided with a glass stage, the glass is loaded, adjacent to the glass stage and the circuit board And a setting unit for loading and setting the pattern portion of the substrate to the pattern portion of the glass loaded on the glass stage, and spaced at predetermined intervals from the upper side of the table so that the two constitute one set. A circuit board and anisotropic conductive film bonding apparatus for a flat panel display. The piston of the first cylinder according to claim 1, wherein the first bonding portion is installed to be movable by the transfer unit adjacent to the outer circumferential surface of the table, and the piston of the first cylinder provided on one side of the first transfer plate. A first bonding head for bonding an anisotropic conductive film to a pattern portion of the glass loaded on the glass stage and installed at the tip of the rod, and an anisotropic conductive film installed on the first transfer plate with the first bonding head interposed therebetween. And an insulating adhesive layer of the anisotropic conductive film, which is installed between the supply reel and the recovery reel and the first bonding head and the supply reel, which are sequentially supplied to the inner side of the cutter housing provided on the first transfer plate. And a cutter for cutting to a size corresponding to the pattern portion of the loaded glass, wherein the first bonding head is supplied from the supply reel and cut into a predetermined length by the cutter. The anisotropic conductive film of the insulating adhesive layer and a circuit substrate of a flat panel display and anisotropic conductive film bonding apparatus which comprises bonding a pattern portion of the loaded glass pressure. 2. The piston of claim 1, wherein the second bonding part is disposed to be movable by a transfer unit adjacent to the outer circumferential surface of the table, and a piston of a second cylinder provided on an upper side of the second transfer plate. And a second bonding head installed at the tip of the rod, wherein the second bonding head bonds the pattern portion of the circuit board set to the pattern portion of the glass to which the insulating adhesive layer of the anisotropic conductive film is bonded. Circuit board and anisotropic conductive film bonding apparatus. The method of claim 3 or claim 4, wherein the shaft of the feed motor with a screw thread is coupled to one side of the first transfer plate and the second transfer plate, the first transfer plate and the second transfer plate is driven by the drive of this motor The first bonding head and the second bonding head installed on the first conveying plate and the second conveying plate by moving along the conveying unit are composed of two pairs of glass stages and a glass loaded in the setting unit. A circuit board and anisotropic conductive film bonding apparatus for a flat panel display, characterized by moving to a position corresponding to the pattern portion of the circuit board. The method of claim 1, wherein the table is composed of an indexing drive table (Indexing Drive Table), the first bonding portion and the second bonding portion in which the aligning portion at least one is installed in the circumferential direction from the upper side of the table A circuit board and anisotropic conductive film bonding apparatus for a flat panel display, characterized in that it moves to a corresponding position.