KR20030055778A - Bonding equipment for chips of flat panel display and bonding method using the same - Google Patents

Abstract

PURPOSE: A chip bonding device of an FPD(Flat Panel Display) and the bonding method thereof are provided to increase the efficiency and the productivity of a process by improving the bonding accuracy and reducing the operating time. CONSTITUTION: A chip bonding device contains a worktable, a rotating device(R), a loading portion(16), a cleaning portion(18), a chip setting portion(20), a bonding portion(22) and an unloading portion(24). The rotating device is installed on the worktable and moves a loaded glass. The loading portion is installed in the circumferential direction of the rotating device. The bonding portion comprises more than two bonding units(B1,B2). The bonding unit comprises a fixing plate(40), a horizontal plate(42), a vertical plate(44) and a bonding head. The fixing plate is installed in an upper plate(4) of the worktable. The horizontal plate is moved leftward and rightward by combining with a slide member to be horizontally installed in the fixing plate. The vertical plate is moved upward and downward by combining with a slide member to be vertically installed in the horizontal plate. The bonding head bonds a chip while moving at the same direction as the vertical plate by combining with the vertical plate. A heater is inserted in the bonding head. A pressure detecting member is installed between the bonding head and the vertical plate. Thereby, the adhesive strength of the chip is improved and the improved bonding accuracy is maintained.

Description

Chip Bonding Device for Flat Panel Display and Bonding Method Using It {BONDING EQUIPMENT FOR CHIPS OF FLAT PANEL DISPLAY AND BONDING METHOD USING THE SAME}

The present invention relates to a chip bonding apparatus for a flat panel display and a bonding method using the same. More particularly, the productivity can be improved by significantly reducing the bonding time, and further improved bonding precision can be maintained to minimize the defect rate. A chip bonding apparatus of a flat panel display device and a bonding method using the same.

Generally, a driving chip is mounted on a flat panel display device, and the driving chip is mounted on a separate circuit board and coupled to a display unit.

In response to the trend of thin and short products, such flat panel displays have a chip directly mounted on a glass or a film of a substrate.

As a method of bonding the chip to glass or film, each process is performed by a bonding apparatus made of an IN-LINE SYSTEM, which is loaded in a straight line after loading the glass or film onto a work table. The chip is bonded to the surface to be bonded while being sequentially moved to the process installed in the process, and then unloaded.

In addition, a bonding head is installed at the bonding portion of the bonding apparatus, and the head presses the upper side of the chip to press the chip onto the glass or the film. In this case, the time for the head to press the chip to bond the specifications is required. The bonding time is generally completed within 10 seconds, but this bonding time takes up most of the time during the bonding operation of the chip.

However, in the conventional bonding apparatus, since each process is in-line, the glass or film is moved by a separate feeder each time, so it is difficult to maintain the precision set initially by this operation, and thus the chip. The bonding accuracy of is degraded and excessive defect rate must be taken.

In addition, the conventional bonding apparatus has a limitation in improving work efficiency and productivity due to the bonding time because the bonding is continuously pressed by the chip during the bonding time required for one bonding head.

In addition, there is a problem that the bonding head is one-pass operation to bond by pressing the chip continuously for a predetermined time to cause the adhesive force is lowered or thermal changes.

In addition, the bonding apparatus has an inline shape, which makes it inevitable to increase the size of the apparatus, and excessive manufacturing costs are required, thereby causing a cost increase.

SUMMARY OF THE INVENTION The present invention has been made to solve the conventional problems as described above, and an object of the present invention is to improve the bonding accuracy and significantly shorten the working time to significantly increase the efficiency and productivity of the chip of the flat panel display device The present invention provides a bonding apparatus and a bonding method using the same.

In order to realize the object of the present invention as described above,

A work table, a rotating means for moving the glass installed and loaded on the upper side of the work table in the circumferential direction, and a loading part, the cleaning part, the chipseting part, the bonding part, and the unloading part installed in the circumferential direction of the means, The bonding unit provides a chip bonding apparatus of a flat panel display device composed of two or more bonding units.

In addition, the bonding method proposed by the present invention through such an apparatus includes a loading process for loading glass or a film, a cleaning process for removing foreign matter adhering to the adhered surface of the loaded glass or film, and a cleaned glass or A chipset setting process for setting a chip on the surface to be bonded to the film, two or more bonding processes for pressing and bonding the upper surface of the set chip, and an unloading process for unloading the glass or film to which the chip is bonded, In the chipset setting process, the chip is set after performing an alignment process to accurately set the chip on the adhered surface of the loaded glass or film, and the bonding process divides the bonding time determined by two or more bonding units. Provided is a chip bonding method of a flat panel display device, characterized in that bonding is performed continuously.

1 is a perspective view of a bonding apparatus according to the present invention.

2 is a front view of FIG. 1;

3 is a plan view of FIG.

Figure 4 is a side view showing the structure of the supply plate according to the present invention.

5 is an enlarged plan view of the main portion of FIG. 3;

6 is a partially enlarged plan view showing a state in which a chip is set by a chipset setting unit according to the present invention;

7 is a front view showing a state in which the bonding portion is installed according to the present invention.

8 is a side cross-sectional view of FIG.

9 is a process diagram showing a preferred process embodiment of the bonding method according to the present invention.

10 is a perspective view showing an operating state of the bonding portion according to the present invention.

FIG. 11 is a plan view of another embodiment of FIG. 6; FIG.

12 is a front view illustrating an operating embodiment of the bonding unit according to FIG. 11.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in more detail.

1, 2, and 3 are perspective, front and plan views of the bonding apparatus according to the present invention, with reference numeral 2 designating a work bench.

The work table 2 is formed by a pipe member or a rod member made of a conventional metal by welding or bolting to form a rectangular frame, and one or more auxiliary frames 2a are horizontally installed inside.

On the upper side of the work table 2, a top plate 4 having a predetermined thickness and having a plate shape is integrally provided, and an opening 4a is formed inside the top plate 4.

In consideration of the object of the present invention, the material of the upper plate 4 is preferably made of a material which prevents the surface from sagging or being deformed by a load or the like and always maintains a constant flatness.

Rotating means (R) is provided below the opening (4a) of the upper plate 4, the structure of the rotating means (R) will be described in more detail with reference to the accompanying drawings.

The rotating means (R) is made of a cylindrical shape and an indexing drive table (INDEXING DRIVE TABLE) consisting of a rotating table (R1) on the upper side can be used, briefly explaining the general configuration and operation of such a table as follows. .

The indexing drive table is composed of a separate drive source, that is, a cam mechanism installed on the shaft of the motor and a cam follower guided to the cam mechanism in a radial manner in which the upper side table is connected to the taper rib of the cam mechanism. Is a mechanism capable of precise rotation without backlash of the pallet because of its preloaded state, and is generally used widely in machine tools or automation devices requiring accurate rotation. .

Therefore, the rotating means (R) having the above-described structure is coupled to the ball slide member (S1) installed in the auxiliary frame (2a) of the work table (2) as well as the rotary table (R1) is rotated, as well as to the transfer part It is also configured to be movable in one direction from the work table (2).

The structure of the conveying part 6 is a guider (8) coupled to the lower side of the rotating means (R), the screw hole is drilled, a screw shaft (10) coupled to the screw hole of the guider (8), and It consists of a motor (M1) for rotating the screw shaft 10, the motor (M1) and the screw shaft (10) is respectively provided on the auxiliary plate 14 installed between the auxiliary frame (2a) of the work table (2) Combined.

In addition, the driving shaft of the motor M1 and the tip of the screw shaft 10 are coupled to the coupling 12 so that the screw shaft 10 rotates forward and reverse by driving the motor M1. The means R is moved in one direction.

Although the rotation means (R) according to the present invention is described as being made of an indexing drive table and shown in the drawings, this is not limited thereto, but is not limited thereto, and preferred rotation means satisfying the object of the present invention. It is possible to apply all of them.

On the other hand, in the upper plate 4 of the work table 2, the loading unit 16, the cleaning unit 18, the chipsetting unit 20, the bonding unit 22, the unloading unit 24 is the rotation means (R) Installed in the circumferential direction, the structure of the loading unit 16 will be described with reference to the accompanying drawings as follows.

The loading part 16 is installed on the upper plate 4 of the work table 2 on one side of the circumferential direction of the rotating means R to mount the glass G on the rotating means R, that is, the rotating table R1. As for the structure, the structure has a transfer unit (F1) is installed on the upper plate 4 of the work table (2) on one side of the circumferential direction of the rotating means (R) by the motor M2 of the transfer unit (F1) The vacuum member (V1) is installed in the slide member S2 moving in one direction.

The vacuum suction unit (V1) is adsorbed to the rotating table (R1) of the rotating means (R) by adsorbing the surface of the glass (G) deposited on the supply plate 26 as its length is changed in the up and down direction. .

And, referring to Figure 4, the supply plate 26 for supporting the glass (G) to be loaded as described above is the position of the cylinder member 27 installed on one side of the auxiliary frame (2a) of the worktable (2) While being properly adjusted up and down, the vacuum adsorber V1 provides a structure capable of smoothly adsorbing the surface of the glass G.

The transfer unit F1 of the loading unit 16 has a structure in which the slider member S2 (for example, ball slider) moves in the longitudinal direction by a rotation shaft of the motor M2 or a piston rod of a cylinder. As such a structure is a structure widely used in general automation equipment, etc., a detailed description thereof is omitted, and in addition to the above structure, all of the structures of the transfer unit satisfying the object of the present invention may be applied, and the cleaning unit 18 and the chipset setting may be applied. The transfer units of the unit 20 and the unloading unit 24 also have the same or similar structure as above, and thus detailed description thereof will be omitted.

One side of the loading unit 16 is provided with a correction plate (P1) so that the glass (G) deposited on the supply plate 26 can be precisely set and seated on the table (R1) of the rotating means (R) Doing.

The correction plate (P1) is rotatably coupled by a bracket 30 fixed to the upper plate 4 is formed with a guide surface 28 in the form orthogonal to the outer shape of the glass (G) on the upper side.

In addition, a motor M3 is installed on the hinge shafts of the correction plate P1 and the bracket 30 so that the correction plate 26 is rotated inclined by driving the motor M3. That is, the correction plate P1 is rotated. When the glass (G) is placed on the), when the motor (M3) is driven and the contact point portion of the guide surface 28 is inclined downward, the glass (G) is accurately set on the guide surface (28) by its own weight. will be.

In the above description, the correction plate P1 is rotated and set on the guide surface 28 by the weight of the glass G. However, in addition to such a structure, a vacuum suction hole (not shown) is provided in the guide surface 28. ) May be forcibly set by the vacuum.

The adhered surface G1 of the glass G seated on the rotating means R is cleaned by the cleaning unit 18.

The cleaning unit 18 has a structure in which the injection nozzle N is installed in the slide member S3 of the transfer unit F2 having the same structure as the loading unit 16, and the nozzle N is carbon dioxide. By spraying to remove the foreign matter attached to the surface to be bonded (G1).

The glass G, which has been cleaned by the cleaning unit 18, is moved to one side of the circumferential direction of the means R by the rotating means R, and then adhered to the glass G by the chipseting unit 20. The chip C is set on the surface G1, and the structure of the chipset setting unit 20 will be described in detail with reference to the accompanying drawings.

The chipseting part 20 includes a transfer unit F3 installed in a direction orthogonal to the longitudinal direction of the surface to be glued G1 of the glass G loaded on the rotating means R, and the transfer unit F3. It consists of a configuration including a subsidiary transfer unit (F31) to move up and down, and a vacuum adsorber (V2) is installed in the subsidiary transfer unit (F31) for adsorbing the chip in a vacuum.

The transfer unit F3 is fixed to the support 32 at one side of the upper plate 4 of the work table 2 and coupled to the guide plate 34 installed across the rotation means R.

The transfer unit F3 has the same or similar structure as the transfer unit F1 of the loading unit 16, and a transverse plate 36 is installed on the slide member S4 of the transfer unit F3.

In addition, the transverse plate 36 is provided with an auxiliary transfer unit F31 having the same structure as the transfer unit F3 and installed only in the vertical direction, and the slide member S5 of the auxiliary transfer unit F31. The vertical plate 38 is installed in the plate, and the plate is provided with a vacuum absorber V2.

Thus, the vacuum adsorption unit V2 installed in the auxiliary transfer unit F31 is moved to the left and right directions by the transfer unit F3 on the basis of FIG. 2 and is also moved up and down by the auxiliary transfer unit F31. It is also possible to feed in the direction.

The vacuum adsorber V2 is for absorbing and transporting one side of the chip C by pneumatic pressure. This structure is such that the surface of the chip C is damaged when the adsorbed material, that is, the chip C is adsorbed and transported. This can be prevented, and since the conventional structure is generally known and used, a more detailed description thereof will be omitted.

The chips C transferred by the chipset setting unit 20 and set on the surface to be bonded G1 of the glass G are not shown in the drawing, but a plurality of chips C are arranged in separate trays and then transferred to the transfer unit. It is provided on the upper side of the XY slider (S6) installed on one side of the chipsetting unit 20 by.

On one side of the chipset setting unit 20, the correction plate for correcting the position of the chip (C) set on the glass (G) more precisely to be set on the surface to be bonded (G1) of the glass (G) (P2) is installed and the plate (P2) is made of the same structure as the correction plate (P1) of the loading portion 16, so a detailed description thereof will be omitted.

Referring to FIG. 5, a separate sensing camera 39 is provided on the upper side of the glass G in the standby state by the rotating means R so that the chip C may be set by the chipset setting unit 20. Is installed.

The camera 40 detects the position of the glass G and the position of the chip C set on the surface to be glued G1 of the glass G and aligns it to the correct setting position. In 39), after monitoring the correct setting positions of the glass G and the chip C, if a deviation thereof is detected, the signal is applied to a separate controller (not shown).

Thus, the control unit (not shown) receives this signal to drive the transfer unit 6 installed below the rotating means R to correct the longitudinal deviation based on FIG. 6, and the chipsetting unit 20 By the transfer unit (F3) of the transverse deviation is corrected, the chip (C) can be set to the correct position on the surface to be bonded (G1) of the glass (G).

As described above, when the setting of the chip C is completed on the surface to be bonded G1 of the glass G, the rotating means R rotates so that the glass G on which the chip C is set is bonded to the bonding part 22. The bonding is carried out by the reference numeral), and the structure of the bonding part 22 will be described in more detail with reference to FIGS. 5, 7, and 8 as follows.

The bonding portion 22 is composed of one or more units, that is, the first bonding unit (B1) and the second bonding unit (B2) are spaced apart at regular intervals from one side of the circumferential direction of the rotating means (R), Units B1 and B2 are coupled to the fixed plate 40 installed on the upper plate 4 of the work table 2, and the slide member S7 provided in the width direction of the fixed plate 40, and to the left and right directions. The horizontal plate 42 and the longitudinal plate 44, which is coupled to the slide member S8 provided in the longitudinal direction of the horizontal plate 42 and is conveyed in the upper and lower directions, and the vertical plate 44 It is composed of a configuration including a bonding head 46 coupled to one side and performing bonding while moving in the same direction as this plate.

A motor M4 is installed at one upper end of the fixed plate 40, and a screw shaft 48 is installed at the motor M4 shaft, and the screw shaft 48 is a screw groove of the horizontal plate 42. The horizontal plate 42 is moved in the width direction of the fixed plate 40 by the forward and reverse rotation of the motor M4 coupled to 50.

A fixing bracket 52 is installed on the longitudinal plate 44 to fix the tip of the piston rod 54a of the cylinder member 54 coupled to the upper side of the horizontal plate 42. At the bottom of the bonding head 46 is coupled.

In addition, a pressure sensing member 56 is installed between the bonding head 46 and the fixing bracket 52, which is moved downward by the cylinder member 54 and is set in the glass G. Sensing the pressing force of the bonding head 46 for pressing the upper side of the.

The pressure sensing member 56 may be a conventional load cell, and the load cell is electrically connected to a control unit (not shown) so that the bonding head 46 presses the chip C above the allowable pressure. When the sensing signal is applied to the control unit to control the cylinder member 54, the bonding head 46 always presses the chip C at a constant pressure to perform bonding.

In the above description, the load cell is used to sense the pressing force of the bonding head 46. In addition, the pressure sensing member satisfying the object of the present invention may be variously applied.

In addition, a heater coil (H) is installed inside the bonding head (46), and the coil (H) presses the bonding head (46) when the bonding head (46) presses the surface of the chip (C). The surface 46a is heated to melt the adhesive applied to the lower surface of the chip C. The molten adhesive material is melted on the surface to be glued G1 of the glass G and then solidified to smoothly bond. This is done.

In addition, the first and second bonding units B1 and B2 divide the bonding time determined at the time of bonding the chip C, and perform bonding discontinuously.

The glass G in which the chip C is bonded by the bonding part 22 is rotated again by the rotating means R at a constant angle, and is unloaded from the rotating means R by the unloading part 24. The transfer unit F4 of the unloading part 24 is installed on the auxiliary guide plate 34a provided on the upper plate 4 of the work table 2.

The unloading part 24 has the same or similar structure as that of the loading part 16, that is, the vacuum suction unit V3 is installed on the slide member S9 of the transfer unit F4 and moves in one direction. The glass G bonded with (C) is unloaded from the rotating table R1 of the rotating means R.

Then, the glass (G) to be unloaded as described above is sequentially loaded on the loading plate 58 installed on the upper plate 4 at one end of the unloading portion 24, the loading plate 58 is the loading Since it is made of the same structure as that of the supply plate 26 of the part 16, detailed description is abbreviate | omitted.

The loading unit 16, the cleaning unit 18, the chipsetting unit 20, the bonding unit 22, and the unloading unit 24 according to the present invention are electrically connected to a separate controller (not shown). It is automatically operated and controlled by the set setting value, and this electrical connection structure is easily implemented by those of ordinary skill in the art, so a detailed description thereof will be omitted.

In addition, the transport structure of the loading unit 16, the chipsetting unit 20, the bonding unit 22, and the unloading unit 24 is a structure that satisfies the object of the present invention in addition to the structure according to the above embodiment It is possible to carry out.

Next, a preferred embodiment of bonding a chip using a bonding apparatus according to an embodiment of the present invention described above will be described in detail. In this embodiment, the pattern portion formed on one side of the glass, that is, the surface to be bonded is described. An example of COG bonding in which a chip is bonded will be described.

9 is a view showing an embodiment of a preferred bonding process of the present invention with reference to the drawings, the bonding process according to the present invention, the loading step (S1) for loading the glass (G), the blood of the loaded glass Cleaning process (S2) for removing foreign matter adhered to the adhesive surface (G1), Chipsetting process (S3) for setting the chip (C) on the surface to be bonded (G1) of the cleaned glass (G), and setting The bonding step (S4) for pressing and bonding the upper surface of the chip (C), and the unloading step (S5) for unloading the glass (G) bonded the chip (C).

First, the loading step (S1) is a vacuum suction machine (V1) installed in the transfer unit (F1) of the loading unit 16 in the state that the glass (G) is loaded on the supply plate 26 is the supply plate 26 After moving to the upper side of the glass (G) to adsorb the surface of the transfer unit (F1) to be seated on the guide surface 28 of the correction plate (P1).

Then, the correction plate P1 is rotated by the motor M3, and the contact point portion of the guide surface 28 of the plate is inclined downward, so that the glass G mounted on the plate P1 moves by its own weight. It is set to the correct position by the face 28.

The glass G whose setting position is corrected by the correction plate P1 as described above is resorbed by the vacuum adsorber V1 of the loading unit 16 and seated on the table R1 of the rotating means R. .

At this time, the feed plate 26 is already set in position so that the surface to be bonded G1 of the glass G seated on the rotating means R can be loaded toward the circumferential direction of the means. .

When the glass G is loaded on the rotating means R as described above, the cleaning process S2 is performed. When the rotating means R is rotated and the glass G is positioned at the cleaning point, the glass G stops. The injection nozzle N of the cleaning unit 18 moves along the transfer unit F2 and stops at the injection position, and then sprays carbon dioxide on the adhered surface G1 of the glass G so that the glass G Remove foreign substances or dust from the adhered surface (G1) of the.

At this time, the loading unit 16 is operated again when the loaded glass G is disposed on the cleaning unit 18 by the rotating means R to rotate the glass G in the same loading method as the above-mentioned. Will be loaded into R).

The cleaning unit 18 has a structure in which the injection nozzle N is movable along the transfer unit F2 in the longitudinal direction of the surface to be bonded G1, and thus the chip is disposed on the surface G1 of the glass G. Only the part where (C) is to be set will be intensively injected with carbon dioxide, so that an improved cleaning effect can be obtained.

The glass G, which has been cleaned as described above, moves to the chipsetting point by the rotating means R and stands by, and the chipsetting process S3 for setting the chip C by the chipsetting unit 20. Will be done.

At this time, the to-be-attached surface G1 of the glass G waiting by the rotating means R stops and waits in a direction orthogonal to the transfer direction of the transfer unit F3 of the chipsetting unit 20. will be.

In the chipsetting process S3, the chip C accommodated in the tray is sucked from the upper surface of the XY slider S6 of the chipsetting unit 20 and then placed on the correction plate P2. ) Operates in the same way as the correction plate P1 of the loading unit 16 to correct the setting position of the chip (C).

The chip C whose setting position is corrected by the correction plate P2 is again transferred by the vacuum adsorber V2 of the chip setting unit 20 to be seated on the rotating means R and in a glass state in a standby state. It is located above the to-be-attached surface G1 of G).

At this time, when the chip (C) is located on the surface to be glued (G1) of the glass (G) to perform the alignment process of the glass (G) and the chip (C), that is, the glass by the detection camera 39 The position deviation of the to-be-attached surface G1 of (G) and the chip C set on this to-be-adhered surface G1 is monitored, and this signal is applied to a control part (not shown), and the detection of such a position deviation is The setting point G2 is displayed on the surface to be glued G1 to detect and correct the deviation smoothly.

Thus, when a position deviation occurs by the detection camera 39, the control unit calculates the correction and corrects it to the correct position. This will be described in detail with reference to FIGS. 3 and 6 as follows.

First, when a positional deviation in the longitudinal direction is generated based on the drawing, the transfer part 6 installed at the lower side of the rotating means R operates to correct it, and the horizontal positional deviation is the chipsetting unit 20. Since the position is accurately corrected by the transfer unit F3), the chip C is set within a predetermined position deviation range, thereby further maintaining the bonding accuracy.

As described above, when the setting of the chip C is completed, the rotating means R is rotated again at a predetermined angle so as to perform the bonding step S4, and stops at the bonding position of the bonding part 22.

The bonding unit 22 is composed of one or more bonding units, and in this embodiment, the first bonding unit B1 and the second bonding unit B2 are spaced apart at regular intervals and are shown in the drawing.

The bonding units B1 and B2 divide the predetermined bonding time and discontinuously bond the chip C. In this embodiment, the bonding time required for bonding the glass G and the chip C is 10. For example, the bonding is performed by dividing each second into five seconds by the first and second bonding units B1 and B2.

Therefore, when the operation of the bonding part 22 is described, as shown in FIG. 10, the chip C is set on the surface to be bonded G2 of the glass G so that the bonding head 46 of the first bonding unit B1 may be formed. When positioned below the cylinder member 54 is operated to move the bonding head 46 to the lower side to press the upper surface of the chip (C).

At this time, since the heater coil H installed inside the bonding head 46 generates heat to heat the pressing surface 46a of the bonding head 46, the adhesive material applied to one side of the chip C is coated on the glass. Bonding is performed while melting at the to-be-attached surface G1 of (G).

When bonding is performed for the bonding time (5 seconds) divided by the first bonding unit B1, the bonding head 46 is returned to its original position, and the glass G first bonded by the unit is The chip C moves to the bonding position of the second bonding unit B2 by the rotating means R and stops.

Then, the second bonding unit B2 performs bonding for the remaining bonding time (5 seconds) divided by the same operation process as that of the first bonding unit B1.

The structure of the bonding unit 22 as described above not only improves productivity by the divided time but also discontinuously by dividing the bonding time by one or more bonding units during bonding of the chip C. By bonding the chip to prevent the thermal change of the adhesive material to obtain a more improved bonding quality.

As described above, the glass G, in which the bonding of the chip C is completed by the second bonding unit B2, is moved to the unloading point by the rotation means R, and the glass is unloaded by the unloading unit 24. The unloading step (S5) of (G) is performed.

In the unloading process S5, when the glass G is positioned at the unloading point, the vacuum adsorption unit V3 of the unloading unit 24 moves by the transfer unit F4 so that the surface of the glass G is moved. After the adsorption, the glass G is unloaded from the rotating means R, and the unloaded glass G is sequentially loaded on the loading plate 58.

In the above embodiment, one chip is set on the surface to be bonded G1 of the glass G as an example and illustrated in the drawing, but the surface to be bonded G1 of the glass G is required. One or more chips may be bonded according to the specification. In this case, when the controller is reset, the cleaning unit 18, the rotation unit R, the chipsetting unit 20, and the bonding unit 22 may be controlled. By controlling the operation to the position set by the it is possible to bond the chip (C1) to another position on the surface to be bonded (G1) of the glass (G).

The bonding embodiment as described above will be described with reference to the accompanying drawings.

First, the loading operation of the glass G is performed in the same manner as in the above embodiment, and the cleaning operation is performed by the injection nozzle N of the cleaning unit 18 moving along the transfer unit F2 and bonding of the chip ( Cleaning is performed by spraying carbon dioxide on the surface to be bonded G1 of the glass G, which is spaced apart from C) and another chip C1 is set.

As shown in FIG. 11, the chipseting operation is spaced apart from the chip C already bonded to the surface to be bonded G1 of the glass G so that the chip C1 can be bonded to another setting position. The transfer part 6 of (R) is operated to move the glass G in the longitudinal direction with reference to FIG.

When the chip C1 is set after the alignment process is performed on the surface to be bonded G1 of the glass G as described above in the same manner as in the above embodiment, the transfer unit 6 operates to rotate the rotation means R. It will return to this original position.

As described above, the glass G on which the chip C1 is set moves to the bonding position of the bonding unit 22 by the rotating means R and then stops.

Then, as shown in FIG. 12, the chip C1 is set by the motor M4 in which the bonding plate 22, that is, the horizontal plate 42 of the first bonding unit B1, is installed above the fixed plate 40. It stops after moving to the location.

When the above process is completed, the cylinder member 54 of the first bonding unit B1 is operated to bond the chip C1 by the bonding head 46 in the same process as the above embodiment.

In addition, the glass G in which the chip C1 is first bonded by the first bonding unit B1 is moved to the bonding position of the second bonding unit B2 by the rotating means R. The second bonding unit B2 operates in the same manner as in the bonding process of the first bonding unit B1, thereby bonding the chip C1.

The glass G, which has been bonded by the above process, is unloaded from the rotating means R by the unloading part 24 and loaded on the loading plate 58 again.

Thus, in the bonding apparatus according to the present invention, one or more bonded to the surface to be glued (G1) of COG, that is, the glass (G) through the above bonding method can easily adhere the chip (C, C1), Although not shown, the chip may be bonded to the surface to be bonded of the film in the same manner as described above even during COF (CHIP ON FILM) bonding.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims, the detailed description of the invention, and the accompanying drawings. It is also obvious that it belongs to the scope of the present invention.

For example, it will be described that the bonding head 46 of the first bonding unit B1 and the second bonding unit B2 is transferred upward and downward by the cylinder member 54 provided above the fixing plate 40. However, the present invention is not limited thereto, but it is also possible to install another driving source, that is, a motor, and couple the screw shaft to the motor shaft so that the screw shaft can be moved along the screw shaft.

As described above, the chip bonding apparatus of the flat panel display according to the present invention performs bonding by pressing and heating the chip discontinuously by the bonding units during bonding of the chip, so that the adhesive strength of the chip is further improved, thereby providing good bonding. Quality can be obtained.

In the chip bonding apparatus of the flat panel display according to the present invention, after the glass is loaded on the rotating means, the device rotates itself and transfers the glass, thereby maintaining a more improved bonding accuracy and greatly reducing the defective rate.

In addition, in the chip bonding apparatus of the flat panel display device according to the present invention, the loading part, the cleaning part, the chipsetting part, the bonding part, and the unloading part are respectively installed in the circumferential direction of the rotating means, thereby achieving a structural miniaturization, and thus the manufacturing cost. And the cost of maintenance can be minimized.

In addition, the chip bonding method of the flat panel display device according to the present invention performs bonding by dividing the bonding time by one or more bonding units, respectively, during the bonding process, thereby significantly reducing the bonding time, thereby improving production efficiency and work efficiency. You can.

In addition, in the chip bonding method of the flat panel display device according to the present invention, an improved bonding accuracy can be obtained by setting the chip after performing the alignment step in the chip setting step.

Claims (7)

A work table, a rotating means for moving the glass installed and loaded on the upper side of the work table in the circumferential direction, and a loading part, the cleaning part, the chipseting part, the bonding part, and the unloading part installed in the circumferential direction of the means, And the bonding unit comprises two or more bonding units. The said bonding unit is a fixed plate provided in the upper board of the said work table, the horizontal plate couple | bonded with the slide member provided in the width direction of this fixed plate, and conveyed to a left and right direction, A vertical plate coupled to the slide member installed in the longitudinal direction and conveyed in the upper and lower directions, bonded to one side of the vertical plate and bonded in the same direction as the plate while bonding the chip and the bonding head in which the heater is inserted in one side And a pressure sensing member installed between the bonding head and the longitudinal plate. The chip bonding apparatus of claim 2, wherein the pressure sensing member is a load cell. The method of claim 1, wherein the rotating means is composed of an indexing drive table (INDEXING DRIVE TABLE) that rotates itself by a drive source, the means is self-rotating the glass loaded on the rotating table cleaning unit, chipsetting unit, bonding unit And a chip bonding device of the flat panel display device which moves to the unloading part and changes the position of the glass loaded at the time of chipseting in the longitudinal direction of the surface to be bonded while being slid by the conveying part in the auxiliary frame of the work table. The chip of the flat panel display of claim 1, wherein the cleaning unit is provided with a spray nozzle on a slide member of a transfer unit moving in one direction by driving of a motor, and the spray nozzle sprays carbon dioxide on a surface to be bonded of glass or a film. Bonding device. A loading process for loading glass or film, a cleaning process for removing foreign matter adhering to the adhered surface of the loaded glass or film, a chipseting process for setting chips on the adhered surface of the cleaned glass or film, Two or more bonding processes for pressing and bonding the upper side of the set chip, and an unloading process for unloading the glass bonded the chip, wherein the chipset setting process is a chip on the adhered surface of the loaded glass or film A chip bonding method for a flat panel display device, characterized in that the chip is set after performing an alignment process so as to be accurately set, and the bonding process divides the bonding time determined by two or more bonding units in discontinuous bonding. The method of claim 6, wherein in the alignment process, the sensing camera monitors the position deviation of the chip and the adhered surface of the glass or film, and corrects the position deviation by the transfer unit of the rotating means and the transfer unit of the chip setting unit. Chip bonding method of a flat panel display device.