KR20040019506A - Bonding Equipment For Circuit Board And Anisotropic Conductive Film Of Flat Panel Display - Google Patents

Abstract

PURPOSE: A device for bonding an anisotropic conductive film and a PCB of a flat display device is provided to simplify the bonding an anisotropic conductive film and a PCB to a glass in a short time. CONSTITUTION: A device for bonding an anisotropic conductive film and a PCB of a flat display device includes a rotation stage(4) rotatably mounted to a top surface of a working die(2), and a plurality of loading parts(6) radially mounted to the rotation stage to load and set a glass(G) and a PCB(B). A film bonding part(8) is adjacent to the rotation stage on the working die and bonds an anisotropic film(F) to a pattern part of the glass on the loading part. A scanning part is mounted on the working die with a predetermined distance from the film bonding part and scans setting positions of the glass and the PCB. A monitor(D) displays the scanned setting positions. A PCB bonding part(12) is mounted on the working die with a predetermined distance from the scanning part for bonding the PCB to the pattern part of the glass.

Description

Bonding Equipment For Circuit Board And Anisotropic Conductive Film Of Flat Panel Display}

The present invention relates to a circuit board and an anisotropic conductive film bonding device of a flat panel display, and more particularly, by bonding the circuit board while rotating the loaded glass in one direction, significantly reducing the time and the process required for bonding work efficiency and productivity And it relates to a circuit board and anisotropic conductive film bonding device of a flat panel display that can improve the efficiency of the equipment.

Generally, the glass of flat panel displays such as LCD, ELD, and fluorescent display tubes (VFD) has a drive chip or a circuit board (eg, PCB / Printed Circuit Board, FPC / Flexible Printed). Circuit, TCP / Tape Carrier Package) are directly bonded.

Since the circuit board has a relatively large area bonded to the pattern portion of the glass, the bonding precision is not required as much as that of the driving chip, so that the bonding operation is easier and the electrical compatibility is improved. There is a trend that is widely used.

In order to bond the circuit board, a film that provides insulation and adhesion to the pattern portion formed on the glass, that is, an insulating adhesive layer of an anisotropic conductive film, is separately separated by a film bonding apparatus. After bonding in the process of bonding the anisotropic conductive film bonded glass to the circuit board bonding process to bond the circuit board.

The structure of the above-described conventional circuit board bonding apparatus will be briefly described as follows: a table, a glass fixing plate provided on an upper side of the table, a circuit board fixing plate adjacent to the glass fixing plate and fixing the circuit board, It includes a circuit board bonding portion for bonding while pressing the pattern portion of the glass and the circuit board loaded and set on the glass fixing plate and the circuit board fixing plate.

However, since the conventional circuit board bonding apparatus has an inline structure and has different indexing times during loading and unloading of glass and circuit boards and bonding, the holding time is not necessary because the work is not continuously performed. It is difficult to expect satisfactory work efficiency and productivity.

In addition, since the conventional circuit board bonding apparatus has a structure capable of simply bonding the circuit board to the glass, in order to bond the anisotropic conductive film to the glass, the anisotropic conductive film is bonded in a separate film bonding apparatus. Bonding of the circuit boards is a structural limitation to improve the efficiency of the process and equipment.

The present invention has been made to solve the conventional problems as described above, the object of the present invention is to easily bond the anisotropic conductive film and the circuit board to the pattern portion of the glass, as well as the process and time required for bonding It is to provide a circuit board and anisotropic conductive film bonding device of a flat panel display that can greatly improve the work efficiency, productivity, and equipment efficiency by greatly shortening.

In order to realize the object of the present invention as described above, a worktable, a rotating stage rotatably installed on an upper side of the worktable, and a plurality of rotary stages are installed in the circumferential direction of the rotating stage to load and set the glass and the circuit board. And a film bonding unit for bonding the anisotropic conductive film to the pattern portion of the glass, which is installed adjacent to the rotary stage in the workbench, and loaded into the loading unit, and the film bonding unit in the workbench. A scanning unit which is spaced apart from the scanning unit for scanning the setting position of the glass and the circuit board, a monitor for displaying the setting position scanned by the scanning unit, and is set apart from the scanning unit in the work table and set in the pattern portion of the glass Circuit board and anisotropic conductive film bonding sheet of a flat panel display including a circuit board bonding portion for bonding the printed circuit board It provides.

1 is an overall perspective view of a circuit board and anisotropic conductive film bonding apparatus of a flat panel display according to the present invention.

2 is a cross-sectional view taken along the line A-A of FIG.

3 is a plan view for explaining the loading unit of FIG.

4 is a partially enlarged perspective view illustrating the film bonding unit of FIG. 1;

5 is a front view of FIG. 4.

6 is a partially enlarged front view showing an enlarged view of the film bonding head of FIG. 4.

7 is an enlarged partial perspective view showing the film cutter of FIG. 4 in an enlarged manner.

8 is a partially enlarged view for explaining a scanning unit of FIG. 2;

FIG. 9 is a front view illustrating an example in which an alignment point of a glass and a circuit board is scanned and displayed on a monitor by the scanning unit of FIG. 8; FIG.

FIG. 10 is a partially enlarged perspective view illustrating the circuit board bonding unit of FIG. 1. FIG.

FIG. 11 is a partially enlarged front view illustrating an enlarged bonding head of FIG. 10.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in more detail.

1, 2, and 3, the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention, the worktable 2, a rotation rotatably installed on the upper side of the worktable (2) The stage 4 and the loading part 6 which is provided in the circumferential direction of this rotating stage 4, and loads and sets the glass G and the circuit board B, and the said worktable 2 are mentioned above. A film bonding part 8 installed adjacent to the rotary stage 4 and bonding the anisotropic conductive film F to the pattern part G1 of the glass G loaded in the loading part 6; A scanning unit 10 spaced apart from the film bonding unit 8 at one work table 2 to scan the setting positions of the glass G and the circuit board B, and scanned from the scanning unit 10 The monitor (D) for displaying the setting position, and is installed spaced apart from the scanning unit 10 in the work table (2) is set in the pattern portion (G1) of the glass (G) It includes a circuit board (B) the substrate bonding unit 12 for bonding the circuit.

The upper plate 14 is installed on the work table 2, and the upper plate 14 is formed of a plate-shaped metal material and has a predetermined thickness, and is installed in a form covering the entire upper surface of the work table 2. It is fixed by welding or bolting on the upper side of the work table 2.

The upper plate 14 may be a structure and a material which can prevent the surface from being deformed or damaged by a load or an impact, and can maintain a constant flatness at all times.

On the lower side of the work bench 2, a plurality of supports 16 are provided for supporting the work platform 2 from the bottom, and the support 16 is not shown in the figure but is a cushioning member such as rubber or spring. It is preferable that the worktable 2 is provided with a structure capable of sufficiently buffering the shaking of the work table 2 by the minute vibration or the impact.

The rotating stage 4 is formed in a circular plate shape is fixed by a fastening member such as a bolt on the upper side of the rotating means (T) located in the auxiliary frame 18 fixed to the inside of the work table (2) The upper plate 14 is rotatably disposed inside the through hole 20.

The material of the rotating stage 4 may be a plate-like metal or synthetic resin material having a certain thickness and capable of minimizing vibration or impact.

An indexing drive table may be used as the rotating means T. The rotating means T may be electrically connected to the drive switch 22 installed in the work table 2 in one direction by manipulation of the switch 22. Since the indexing drive table is configured to rotate itself by a separate driving source, it is already widely used in machine tools, automation devices, semiconductor equipment, etc. requiring precise rotation operation, and thus, further description thereof will be omitted.

On the upper side of the rotating stage 4, a loading unit 6 for loading and setting the glass G and the circuit board B is installed. Refer to the accompanying drawings of the structure of the loading unit 6. If described in detail as follows.

The loading unit 6 is installed on one side of the circumferential direction of the rotating stage 4, and the glass stage 24 of two sets for loading glass, and the glass described above in the rotating stage 4 Respectively installed adjacent to the stage 24 and including a circuit board setting unit 26 for loading and setting the circuit board B, each of which is installed at a quarter position of the rotating stage 4 as described above. The worktable 2 is positioned corresponding to the film bonding portion 8, the scanning portion 10, the circuit board bonding portion 12 and the loading position, respectively.

The glass stage 24 is made of a plate-shaped metal material having a size that can be smoothly seated and supported by the glass (G) to be loaded is fixed to the rotating stage (4) by a fastening member such as a bolt.

On the upper side of the glass stage 24, a guide member 28 for supporting the glass G to be loaded is formed at one corner, and a separate vacuum hose to suck the glass G to be loaded in a vacuum. Adsorption holes H are formed which are connected to (not shown).

The scanning hole 30 having a size corresponding to the pattern portion G1 of the glass G to be loaded is drilled on the upper surface of the glass stage 24, and the scanning stage is formed in the rotating stage 4. Auxiliary scanning hole 32 corresponding to 30 is drilled.

The circuit board setting unit 26 may be a conventional manual stage provided with one or more adjustment stages. Three circuit board setting units each of which may correct positions in the X, Y, and θ directions from the upper side may be used. It consists of stages 26a, 26b and 26c, and these stages are provided with adjustment knobs N, respectively.

Since the manual stage is generally made of the same or similar structure as the method of using the rotation of the screw shaft to set the position and direction of the object loaded in the machine tool or semiconductor equipment, more detailed description thereof will be omitted.

In the X-direction stage 26a of the circuit board setting unit 26, an adsorption hole H is formed in the same manner as the glass stage 24, and the adsorption hole H is provided with a separate vacuum hose. It is a structure that can be adsorbed in a vacuum to the circuit board (B) to be loaded in connection with).

1, 4, and 5, the film bonding portion 8 is provided at the end of the piston rod of the support plate 34 and the cylinder C1 provided on the support plate 34 and described above. The above-mentioned support with the film bonding head 36 bonding the anisotropic conductive film F to the pattern portion G1 of the glass G loaded in the loading section 6, and the film bonding head 36 interposed therebetween. The above-mentioned support is provided between the supply reel R1 and the reel R2 and the film bonding head 36 and the supply reel R1 which are installed on the plate 34 to supply and recover the anisotropic conductive film F. The cutter 40 is installed to the inside of the cutter housing 38 installed on the plate 34 to move the insulating adhesive layer F1 of the anisotropic conductive film F supplied from the supply reel R1 to the glass G. Cut into lengths corresponding to the pattern portion G1.

First, the anisotropic conductive film F wound around the supply reel R1 will be briefly described. When bonding the circuit board B to the pattern portion G1 of the glass G, adhesiveness and insulation are provided. It consists of an insulating adhesive layer (F1) and a backing paper (F2) attached to the back surface of the insulating adhesive layer (F1) to form a normal double-sided tape.

In the insulating adhesive layer F1, the circuit board is formed in a state in which fine conductive particles having a ball shape are embedded in an insulator made of a thin film, and the patterns formed in the pattern portion G1 of the glass G are insulated from each other. It is to be bonded with the pattern portion (B1) of (B), this anisotropic conductive film (F) is well known and used in the art, so a detailed description thereof will be omitted.

The support plate 34 has a vertical portion 34a and a horizontal portion 34b orthogonal to each other and is formed in an “L” shape. The support plate 34 is located at one side of the circumferential direction of the rotary stage 4 in the work table 2. Sliding movement is installed along the guide rail (U) installed adjacently.

The support plate 34 is screwed with the screw shaft 42 connected to the drive motor M1 shaft between the guide rails U, so that the loading portion (B) by the drive of the drive motor M1. 6) That is, to move along the guide rail (U) to a position corresponding to the two glass stages 24 are spaced apart, the drive motor (M1) is a drive switch (installed on the work table (2) ( 22), the guide rail U may be a " LM guide " consisting of a pair of guiders and a slider.

Referring to FIG. 6, the film bonding head 36 corresponds to the pattern portion G1 of the glass G loaded in the loading portion 6, and the size of the film bonding head 36 may be pressed against the entirety of the pattern portion G1. Pressurizing surface (36a) is formed inside the heating member (W) that is heated by electrical energy is installed.

The film bonding head 36 is loaded on the glass stage of the loading unit 6 while moving upward and downward by a cylinder C1 installed on the vertical portion 34a of the support plate 34. The insulating adhesive layer F1 of the anisotropic conductive film F is bonded to the pattern part G1 of G).

As the heating member W installed inside the film bonding head 36, a common coil heater in which the heating element has a coil shape may be used, and the heating member W may be used as the film bonding head 36. During the bonding operation, electricity is applied to set itself to generate heat.

The supply reel (R1) and the recovery reel (R2) is made of a common reel (REEL) form, the anisotropic conductive film (F) is wound around the supply reel (R1), the recovery reel (R2) The anisotropic conductive film F wound around the supply reel R1 is connected.

The recovery reel R2 is rotated in one direction by a driving motor M2 provided on the rear surface of the vertical portion 34a of the support plate 34, thereby rotating the supply reel R1 to supply the reel R1. ) Is supplied to the cutter housing 38 and the film bonding head 36 wound on the anisotropic conductive film F. When the insulating adhesive layer F1 of the anisotropic conductive film F is bonded, the insulating adhesive layer F1 is bonded. It is made to recover the backing paper (F2) attached to the back of the).

Referring to FIG. 7, the cutter housing 38 includes a film guide groove 44 for guiding the anisotropic conductive film F and a cutter groove 46 for guiding the cutter 40.

The cutter 40 is located in the cutter groove 46 of the cutter housing 38, and the piston rod of the cylinder C2 is coupled to the lower side thereof, thereby driving the cutter groove (C2). 46, the insulating adhesive layer F1 of the anisotropic conductive film F is set to be cut while sliding upward and downward.

The cutter 40 is set to be cut to a length corresponding to the pattern portion G1 of the loaded glass G when cutting the insulating adhesive layer F1 of the anisotropic conductive film F, which is described above. It is possible to appropriately adjust the feed rate of the anisotropic conductive film F wound around the supply reel R1 and the operation cycle of the cylinder C2.

Referring to the accompanying drawings, at least one guide roller 48 is installed on the vertical portion 34a of the support plate 34 to move by the supply reel R1 and the recovery reel R2. The movement of the film F is smoothly guided.

The guide roller 48 is formed in a conventional roller shape so as to be rotatably installed on the support plate 34, and more preferably, an anisotropic conductive film guided by the guide roller 48, although not shown in the drawings. It is better if the structure is provided with a tension control member that can smoothly adjust the tension of F).

2 and 8, the scanning unit 10 is spaced apart from the film bonding unit 8 at the work table 2, and the loading unit 6 is disposed at the lower side of the upper plate 14. It consists of a plurality of scanning members (S) fixed toward the scanning hole 30 of the glass stage 24 of the.

The scanning member S includes two alignment points G2 and B2 marked on the glass G loaded on the loading unit 6 and the pattern portions G1 and B1 of the circuit board B, respectively. The pair is configured to be scanned so that the pair is fixed by the bracket member 50 to correspond to the scanning holes 30 of the two glass stages 24 described above.

The scanning member (S) may be a micro camera (Micro Camera) can be used, the camera is connected to the motini (D) installed on the worktable (2) is loaded on the glass (G) loading portion (6) And scanning the alignment points G2 and B2 of the circuit board B and displaying them in the usual manner through the monitor D described above (see FIG. 9).

The monitor D may be a flat panel display or a display device made of a CRT that displays input image data in a conventional manner.

In the above-described embodiment, the scanning member S is shown as being a microcamera in the description and drawings, but is not limited thereto. In addition, the alignment points G2 and B2 displayed on the glass G and the circuit board B may be used. Well-known types of sensing members for sensing the position of may also be used and it is natural that such a configuration falls within the scope of the present invention.

Referring to FIGS. 1 and 10, the circuit board bonding part 12 includes a fixed plate 52, two cylinders C3 provided on the fixed plate 52, and a piston of the cylinder C3. A bonding head 54 is installed at the tip of the rod to bond the circuit board B to the pattern portion G1 of the glass G to which the anisotropic conductive film F is bonded.

The fixing plate 52 may be firmly fixed to the fixing bracket 56 installed adjacent to the circumferential surface of the rotating stage 4 spaced apart from the scanning unit 10 in the work table (2). have.

Referring to FIG. 11, the bonding head 54 corresponds to the pattern portion G1 of the glass G loaded in the glass stage 24, and has a size capable of pressing the entire pattern portion G1. The pressing surface 54a is formed and the heater W is provided inside.

The bonding head 54 bonds the glass G and the pattern portions G1 and B1 of the circuit board B while moving upward and downward by the cylinder C3 installed on the fixed plate 52. The two cylinders C3 are spaced apart from each other at predetermined intervals so as to correspond to the loading unit 6, that is, the two glass stages 24, in the fixed plate 52.

Referring to the accompanying drawings, the pressure bonding sensor (L) between the film bonding portion 8, the cylinder (C1, C3) piston rod of the circuit board bonding portion 12 and the bonding heads (36, 54) ), The sensor can be used a conventional load cell (LOAD CELL).

The pressure sensor (L) detects when the bonding heads 36 and 54 come into contact with excessive pressure when bonding while pressing the anisotropic conductive film F or the circuit board B, and immediately detects the cylinder. Since the operation of (C1, C3) is stopped, the pattern portion G1 of the glass G or the pattern portion B1 of the circuit board B can be prevented from being damaged by excessive pressure. In addition, optimum bonding quality can be obtained.

Next, the bonding operation of the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention having the above-described structure will be described in more detail with reference to the accompanying drawings.

Referring to FIGS. 1, 2, and 3, the glass G is loaded on the glass stage 24 of the loading unit 6 installed at the rotation stage 4 and disposed at the loading position, respectively. The loading of the glass (G) may be loaded by a separate loading device (V) such as a vacuum adsorber in the opposite direction in which the drive switch 22 is installed on the work table (2).

When the loading of the glass G to the glass stage 24 is completed as described above, by pressing the drive switch 22 to rotate the rotary stage 4, the rotary stage 4 is based on FIG. 2. If it is stopped by rotating 90 ° clockwise, the loading unit 6 loaded with glass G moves to the film bonding unit 8 and the loading unit for loading glass G at the loading position. The glass stage 24 of (6) is again positioned.

In the loading unit 6 moved to the loading position by the above process, the glass G is loaded in the same manner as the loading method, and the two glass stages 24 moved to the film bonding unit 8. The film bonding head 36 of the film bonding unit 8 operates on the pattern portion G1 of the loaded glass G to bond the insulating adhesive layer F1 of the anisotropic conductive film F to each other.

The film bonding process will be described in more detail, wherein the anisotropic conductive film F unrolled between the supply reel R1 and the recovery reel R2 is cut only by the insulating layer F1 by the cutter 40. When the film bonding head 36 is supplied to the film bonding head 36, the film bonding head 36 is moved downward by the cylinder C1 to the pattern portion G1 of the glass G loaded on one glass stage 24. The insulating adhesive layer F1 is pressed and bonded.

Then, when the driving motor M1 is driven to move the support plate 34 along the guide rails U, the pattern portion G1 and the film bonding head of the glass G loaded on the adjacent glass stage 24. Since 36 is in the opposite position, the film bonding head 36 presses and bonds the insulating adhesive layer F1 of the anisotropic conductive film F in the same manner as described above.

After the film bonding process is completed, when the rotary stage 4 is rotated 90 ° clockwise by pressing the drive switch 22, the loading part 6 disposed on the film bonding part 8 is a scanning part. The loading unit 6 which is moved to 10 and is disposed at the loading position moves to the film bonding unit 8, and another loading unit 6 is disposed at the loading position.

As described above, the circuit board setting unit 26 of the loading unit 6 disposed in the scanning unit 10 is loaded with a circuit board B so that the pattern portion of the glass G to which the anisotropic conductive film F is bonded ( The pattern portion B1 of the circuit board B is set in G1).

In this case, the scanning unit 10 scans two alignment points G2 and B2 marked on the pattern portion G1 of the glass G and the pattern portion B1 of the circuit board B, respectively. (S) and display through the monitor (D) as shown in Figure 9, if the alignment point (G2, B2) deviation occurs more than the allowed setting range of the circuit board setting unit 26 Using the knob (N), the operator directly moves the positions of the adjustment stages 22a, 22b, and 22c while watching the monitor D. At this time, the positions of the alignment points G2 and B2 to be corrected are continuously monitored ( Displayed in D), the deviation over the setting range can be set within the allowable range.

When the setting of the glass G and the circuit board B is completed in the loading unit 6 disposed in the scanning unit 10 by the above process, the driving stage 20 is pressed to press the rotation stage 4. Rotate).

Then, the rotating stage 4 is rotated 90 degrees clockwise again so that the loading unit 6 located in the scanning unit 10 moves to the circuit board bonding unit 12.

When the pattern portions G1 and B1 of the glass G and the circuit board B are set and disposed in the circuit board bonding part 12, the bonding head 54 of the circuit board bonding part 12 is a cylinder. Bonding is performed while pressing the glass G and the pattern portions G1 and B1 of the circuit board B set while moving downward by C3.

In addition, the glass G of the loading unit 6 disposed on the film bonding unit 8 and the scanning unit 10 by the rotation of the rotating stage 4 is anisotropic conductive film in the same manner as described above. (F) and the circuit board (B) are bonded and set, and the loading unit 6 arranged at the loading position is loaded with the glass G.

After the above process is completed, when the rotating stage 4 is rotated again, the loading unit 6 which is loading the glass G bonded with the circuit board B in the circuit board bonding unit 12 is loaded for the first time. It will rotate to the position and stop.

As described above, when the glass G bonded with the circuit board B is disposed at the loading position, the glass G is unloaded by the loading device V, stored in a separate storage tray (not shown), and then re-glassed. G) is loaded.

In addition, the glass G disposed on the film bonding unit 8, the scanning unit 10, and the circuit board bonding unit 12 is anisotropic conductive film F and the circuit board B in the same process as described above. Bond sequentially and unload.

In the above, a preferred embodiment of a circuit board and an anisotropic conductive film bonding apparatus of a flat panel display has been described, but the present invention is not limited thereto, and various modifications are made within the scope of the claims and the detailed description of the invention and the accompanying drawings. It is possible to implement, and this also belongs to the scope of the present invention.

As described above, the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display according to the present invention may be easily bonded by bonding the anisotropic conductive film and the circuit board to the loaded glass while one or more loading units are rotated in one direction by a rotating stage. In addition, it significantly reduces work processes and time, further improving work efficiency, productivity and plant efficiency.

Claims (10)

A worktable, a rotating stage rotatably installed on an upper side of the worktable, a plurality of plurally installed in the circumferential direction of the rotating stage, for loading and setting a glass and a circuit board, and the above-mentioned rotating stage in the worktable. A film bonding part for bonding an anisotropic conductive film to a pattern portion of the glass which is installed adjacent to and loaded in the loading part, and spaced apart from the film bonding part in the work table to scan the setting position of the glass and the circuit board A flat panel including a scanning unit, a monitor displaying a setting position scanned by the scanning unit, and a circuit board bonding unit bonding a circuit board set apart from the scanning unit on the work table and set on the pattern portion of the glass. Display circuit board and anisotropic conductive film bonding device. The circuit board and anisotropic conductive film bonding apparatus of claim 1, wherein the rotating stage rotates in one direction by rotating means installed on the work table, and the rotating means comprises an indexing drive table. The apparatus of claim 1, wherein the loading unit comprises at least two glass stages for loading the glass, and a circuit board setting unit for loading and setting the circuit boards respectively installed adjacent to the glass stage in the rotating stage. Circuit board and anisotropic conductive film bonding apparatus of a flat panel display comprising. The circuit board of claim 3, wherein the circuit board setting unit comprises a manual stage including three stages for correcting positions of the loaded circuit board in the X, Y, and θ directions. Anisotropic conductive film bonding device. 4. The circuit board of claim 3, wherein a scanning hole corresponding to the pattern portion of the glass to be loaded is drilled through the glass stage of the loading unit, and an auxiliary scanning hole corresponding to the scanning hole is drilled to the rotating stage. And anisotropic conductive film bonding apparatus. The method according to claim 1, wherein the scanning unit is composed of a plurality of scanning members arranged on the lower side of the loading unit on the worktable and fixed toward the loading unit, the scanning member is a glass and circuit loaded on the loading unit A circuit board and anisotropic conductive film bonding apparatus of a flat panel display for scanning two alignment points respectively marked on the pattern portion of the substrate. The apparatus of claim 6, wherein the scanning member comprises a micro camera. The film bonding head of claim 1, wherein the film bonding unit comprises: a support plate; A feed reel and a reel for supplying and recovering the anisotropic conductive film, and the cutter housing provided on the support plate between the film bonding head and the supply reel. Circuit board and anisotropic conductive film bonding apparatus of a flat panel display including a cutter which is installed to be movable inward. The glass stage according to claim 8, wherein the support plate is slidably moved along the guide rail installed on the workbench, and two or more film bonding heads installed on the plate are adjacent to each other in the loading unit. A circuit board and anisotropic conductive film bonding apparatus of a flat panel display for moving to a corresponding position. The said circuit board bonding part is a fixed plate provided adjacent to the outer peripheral surface of the said rotary stage in the said work table, The some cylinder provided corresponding to the glass stage of the said loading part in this fixed plate, And a bonding head for bonding the circuit board to the pattern portion of the glass to which the anisotropic conductive film is bonded to the piston rod end of the cylinder, wherein the circuit board and the anisotropic conductive film bonding apparatus of the flat panel display are included.