KR200285449Y1 - Bonding equipment for circuit board of flat panel display - Google Patents

Abstract

Improves the bonding quality and bonding accuracy of circuit boards bonded to flat panel displays such as LCD, ELD, and fluorescent display tubes (VFD), as well as significantly shortens the time required for bonding and improves productivity and productivity. And it provides a device that can improve the equipment efficiency.

Such an apparatus includes a work table, a table rotatably installed on the work table, an aligning part installed on the table to load and set glass and a circuit board, and a fixed part loaded on the work table to the aligning part. Provided is a circuit board bonding apparatus for a flat panel display device including two or more bonding portions for bonding the glass and the circuit board.

Description

Circuit board bonding device of flat panel display device {BONDING EQUIPMENT FOR CIRCUIT BOARD OF FLAT PANEL DISPLAY}

The present invention relates to a circuit board bonding device of a flat panel display device, and more particularly, to a circuit board bonding device of a flat panel display device that can significantly shorten the time required for the bonding operation, thereby further improving work efficiency and productivity. It is about.

In general, flat panel display devices such as LCD, ELD, and fluorescent display tubes (VFD) are used for driving chips or circuit boards (e.g., PCBs, FPCs) in order to meet the trend of becoming thinner and shorter. ) Is directly bonded and manufactured into a unified article.

If the driving chip or circuit board is directly adhered to the glass, complex wiring is not necessary, so it is not only easy to assemble and maintain, but also it is not necessary to secure a separate wiring space, so that the product can be miniaturized and have improved productability. do.

In particular, in the above case, since the compatibility of various wirings is maintained, the circuit board is widely used without being limited to the use and specification of the display device. The circuit board is bonded to the surface to be bonded of the glass by a separate bonding device.

The structure of the conventional circuit board bonding apparatus described above is briefly described, a table, a glass fixing plate provided on an upper side of the table, a circuit board fixing plate for fixing a circuit board adjacent to the glass fixing plate, and It consists of a structure including a bonding portion for bonding the circuit board while pressing the surface to be bonded of the glass loaded on one glass fixing plate.

The bonding apparatus is provided with a bonding head which presses and adheres the surface to be bonded of the glass so that the circuit board set on the surface to be bonded of the glass by a one-pass operation of the bonding head has a predetermined bonding time (approx. Bonding is completed by applying a predetermined heat and pressure for 15 seconds to 20 seconds, or two bonding devices are installed to perform temporary adhesion (approximately 3 to 7 seconds) in one device and then move it to another device. Bonding is performed in such a manner that the main bonding (approximately 8 seconds to 15 seconds) is performed at.

However, in the conventional circuit board bonding apparatus, the bonding operation is performed discontinuously by continuously bonding for a predetermined bonding time (about 15 to 20 seconds) by the one-pass operation of the bonding head. However, the holding time is excessively generated, and work efficiency and productivity are significantly reduced, and thus satisfactory efficiency of the equipment cannot be obtained.

In addition, since the conventional bonding apparatus is provided with one bonding portion in its structure, two apparatuses must be installed in order to divide the bonding time and perform temporary bonding and main bonding. This causes a decrease in the efficiency of the process.

In addition, the conventional bonding apparatus described above has a problem in that practical productivity and work efficiency do not meet expectations because the worker has to move the temporarily bonded glass to another bonding apparatus when bonding with two bonding apparatuses.

The present invention is devised to solve the conventional problems as described above, the object of the present invention is to significantly reduce the time required for bonding, the circuit of the flat panel display device that can maximize the work efficiency and productivity and equipment efficiency To provide a substrate bonding apparatus.

In order to realize the object of the present invention as described above, a worktable, a table rotatably installed on the worktable, an aligning portion provided on the table for loading and setting a glass and a circuit board, and the worktable described above. Provided is a circuit board bonding apparatus for a flat panel display device including two or more bonding portions fixed to bond the glass and the circuit board loaded to the aligning portion.

1 is an overall perspective view of a circuit board bonding apparatus of a flat panel display device according to the present invention.

2 is a cross-sectional view taken along the line A-A of FIG.

Figure 3 is a plan view showing an aligning portion of the circuit board bonding apparatus of the flat panel display device according to the present invention.

4 is a plan view of FIG.

5A is a partial perspective view illustrating a first bonding part of a circuit board bonding apparatus of a flat panel display device according to the present invention;

5B is a side cross-sectional view of FIG. 5A.

Figure 5c is a partial perspective view showing a second bonding portion of the circuit board bonding apparatus of the flat panel display device according to the present invention.

Figure 6 is a partial cross-sectional view showing a scanning member of the circuit board bonding apparatus of the flat panel display device according to the present invention.

7 is a front view illustrating the bonding head of FIGS. 5A and 5B.

8 is a setting state diagram illustrating an example of a setting state of a glass and a circuit board displayed by a monitor of a circuit board bonding apparatus of a flat panel display device according to the present invention;

9 is a process chart showing a preferred bonding process of the circuit board bonding apparatus of the flat panel display device according to the present invention.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in more detail.

1 and 2, 3, and 4, the circuit board bonding apparatus of the flat panel display device according to the present invention,

Working table 2, a table 4 rotatably mounted on the working table 2, and an alignment for mounting, loading, and setting the glass G and the circuit board B by arranging the table 4 And a bonding portion 8 fixed to the worktable 2 to bond the glass G and the circuit board B loaded on the aligning portion 6.

First, the work table 2 is a pipe member or a rod member made of a conventional metal is joined by welding or bolting to form a rectangular frame, the upper plate 10 is provided on the upper side.

The upper plate 10 is made of a plate-shaped metal material and is integrally installed by the work table 2 by welding or bolting, and prevents the surface from sagging or deforming due to a load or an impact and always has a constant flatness. It is better if the structure and the material) can be maintained.

Below the work table 2 is provided with a plurality of supports 12 to be supported on the floor, the support 12 is provided with a cushioning member (not shown), such as rubber or spring, It is preferable that 2) is made of a structure capable of sufficiently buffering the shaking by the minute vibration or shock, etc. In addition, a roller caster (not shown) having a locking device may be used.

The table 4 is installed on the auxiliary top plate 14 installed inside the work table 2, and the table 4 is the table 4 described above on the top plate 10 of the work table 2. It is disposed inwardly of the through-hole 16 formed to accommodate the size.

Indexing drive table (INDEXING DRIVE TABLE) can be used as the table 4, this indexing drive table is a structure that the above-mentioned table itself rotates by a separate drive source briefly described the general configuration and operation Is as follows.

The indexing drive table is composed of a separate drive source, that is, a cam mechanism installed on the shaft of the motor and a cam follower guided to the cam mechanism in a radial manner in which the upper side table is connected to the taper rib of the cam mechanism. Is a mechanism capable of precise rotation without backlash of the pallet because of its preloaded state, and is generally used widely in machine tools or automation devices requiring accurate rotation. .

The table 4 is rotated by the operation of the drive button 18 installed above the work table 2, and when the drive button 18 is pressed once, the table 4 is driven and clockwise. It is set to stop after rotating 120 °.

As described above, the electrical connection structure for operating the table 4 by the operation of the driving button 18 can be easily implemented by those skilled in the art, and thus a detailed description thereof will be omitted.

An aligning portion 6 is provided above the table 4. In this embodiment, the aligning portion 6 is divided 120 degrees in the circumferential direction of the upper surface of the table 4. As an example, it is comprised from the inning part 6a, the 2nd aligning part 6b, and the 3rd aligning part 6c.

1, 2, and 3, the first, second, and third aligning parts 6a, 6b, and 6c include a glass stage 20 on which glass G is loaded, and the glass. The setting unit 22 which is installed adjacent to the stage 20 and loads the circuit board B to set on the adhered surface G1 of the glass G, and the glass which is loaded on the glass stage 20 described above. And a scanning member 24 for scanning the to-be-attached surface G1 of (G).

The glass stage 20 is fixed by a separate fastening member in the table 4 and formed of a size that can be loaded and loaded with the glass G loaded smoothly. The scanning hole 26 corresponding to the adhesive surface G1 is drilled.

A protruding guide protrusion 28 is formed at an edge of the glass stage 20, and the protrusion smoothly guides to a setting point when loading the glass G on the upper side of the glass stage 20. To be loaded.

The scanning hole 26 is formed in the shape of a long hole so that the entire surface to be bonded G1 of the glass G can be viewed from the lower side of the table 4 and corresponds to the scanning hole 26. Auxiliary scanning hole 30 is formed in the table 4.

An adsorption hole 32 is formed in the glass stage 20, and the adsorption hole 32 is connected to the vacuum hose H to stably fix the glass G loaded by the vacuum.

The setting unit 22 is a conventional manual stage (MANUAL STAGE) is provided with one or more adjustment stages, in this embodiment the position of the X direction and Y direction and θ direction of the circuit board (B) to be loaded The first stage 34 to be corrected, the second stage 36, and the third stage 38 are sequentially stacked in a slidable structure, and adjustment stages N are provided in these stages.

Since the manual stage is generally made of the same or similar structure as that widely used for adjusting a setting point in a semiconductor device or the like, more detailed description will be omitted.

In the third stage 38, the suction hole 40 is formed in the same manner as the glass stage 20, and the hole is connected to the vacuum hose H to suck the circuit board B loaded in a vacuum. do.

2 and 6, the scanning member 24 is fixed to the support 42 under the upper plate 10 of the work table 2 to the glass stage 20 and the table 4. Aligning points P1 which are disposed to face the inside of the perforated scanning hole 26 and the auxiliary scanning hole 30 and are spaced apart from each other at predetermined intervals by the glass G and the circuit board B, respectively. 2 are spaced apart from each other so as to smoothly scan P2).

The conventional micro camera (MICRO CAMERA) of the scanning member 24 is used, and is connected to the monitor 44 installed on one side of the upper plate 10 of the work table 2 and scanned through the monitor 44. Is displayed in a conventional manner.

Thus, the operator visually checks the error between the alignment points P1 and P2 of the glass G and the circuit board B displayed by the monitor 44, and sets the setting position through the setting unit 22 described above. It is precisely corrected. (See FIG. 8)

In the above description, the scanning member 24 is described as using a micro camera, but the present invention is not limited thereto. For example, a sensing member may be used, and in addition, all the scanning members satisfying the purpose of the present invention may be applied. .

The bonding portion 8 is provided on the work table 2 so as to correspond to the aligning portion 6 provided on the table 4 adjacent to the outer peripheral surface of the table 4 and the first bonding portion 8a. ) And the second bonding portion 8b.

5A and 5B, the first bonding portion 8a is installed to be movable in the vertical direction by the fixing plate 46a and the guide member F provided on the front portion of the fixing plate 46a. And a bonding head 52a provided at the front end of the piston rod of the cylinder 50a provided at the upper horizontal portion of the fixed plate 46a.

The fixing plate 46a is connected to the fixing bracket 54a installed on the upper plate 10 of the work table 2 to be fixed in a vertical shape, and the cylinder 50a is installed on the upper horizontal portion 56a.

In the above, the fixing plate 46a is coupled to the fixing bracket 54a and fixed to the upper plate 10 of the work table 2. However, the fixing plate 46a is fixed to the upper plate 10. It is also possible to fix it directly.

As the guide member F installed on the front portion of the fixed plate 46a, a conventional LM guide composed of a pair of sliders and guiders may be used.

The vertical plate 48a is coupled to the guide member F of the fixed plate 46a and is installed to be movable in the vertical direction from the fixed plate 46a. One side of the piston rod of the 50a is fixed to the support bracket 58a, and slides in the vertical direction in the fixing plate 46a according to the operation of the cylinder 50a.

Referring to FIG. 7, the bonding head 52a is formed with a pressing surface 60a of a size capable of pressing the entire blood-glued surface G1 of the glass G, and an inner side of the heating member 62a. The heater is installed.

The heat generating member 62a receives heat separately and heats itself to transfer heat to the pressing surface 60a of the bonding head 52a. The pressing surface 60a to which the heat is transferred is predetermined. Temporary bonding is performed by pressing the circuit board B set on the glass G while generating heat at a temperature, wherein the bonding head 52a is the circuit described above for a predetermined bonding time (about 3 to 7 seconds). Temporary bonding is performed while pressing the substrate B.

Referring to FIG. 5C, the second bonding portion 8b has the same structure as that of the first bonding portion 8a. In the following, reference numerals are the same as or similar to those of the first bonding portion 8a. Do.

That is, the second bonding portion 8b includes a fixed plate 46b and a vertical plate 48b which is installed to be movable in the vertical direction by a guide member F provided on the front portion of the fixed plate 46b. And a bonding head 52b installed at the tip of the piston rod of the cylinder 50b installed on the upper horizontal portion 56b of the fixing plate 46b, and the first bonding in the circumferential direction of the table 4 described above. It is provided in the above-mentioned work bench 2 at the position corresponding to the aligning part 6 spaced apart from the part 8a.

The second bonding portion 8b is temporarily bonded to the first bonding portion 8a, and the bonding head 52b is formed at a predetermined temperature for the circuit board B moved by the table 4. The bonding head 52b performs bonding while pressing the circuit board B for a predetermined bonding time (about 5 seconds to about 13 seconds) while being heated again while being pressurized.

In addition, a pressure sensor 64 is installed between the piston rods and the bonding heads 52a and 52b of the cylinders 50a and 50b installed in the first bonding portion 8a and the second bonding portion 8b. This sensor may be used a conventional load cell (LOAD CELL).

The pressure sensor 64 detects contact pressure when the bonding heads 52a and 52b press while bonding the circuit board B, thereby preventing contact with excessive pressure.

In the above, the provisional bonding time is 3 seconds to 7 seconds and the main bonding time is 5 seconds to 13 seconds when the temporary bonding and the main bonding are performed by the first bonding part 8a and the second bonding part 8b. Although described as being made within, but not limited to this, in addition to the bonding time that satisfies the object of the present invention can be applied in a variety of applications, this also belongs to the scope of the present invention.

Next, with reference to the accompanying drawings, preferred embodiments of the bonding using the circuit board bonding apparatus of the flat panel display device according to the present invention having the above-described structure will be described in more detail.

9 is a process diagram showing a preferred bonding process of the circuit board bonding apparatus of the flat panel display device according to the present invention, the loading step (S1) for loading the glass and the circuit board, and setting the circuit board on the surface to be bonded of the loaded glass The setting step S2, the first bonding step S3 for temporarily bonding the set circuit board, the second bonding step S4 for bonding the temporarily bonded circuit board, and the glass to which the circuit board is bonded. And an unloading step (S5) for unloading.

First, the loading process S1 will be described with reference to FIGS. 1, 2, and 3. The aligning unit 6, that is, the first aligning unit 6a disposed on the loading side of the work table 2 will be described. The glass stage 20 is loaded on the glass stage 20 and the circuit board B is loaded on the third stage 38 of the setting unit 22.

At this time, the glass stage 20 and the third stage 38 are stably fixed to the glass (G) and the circuit board (B) loaded through the adsorption holes (32, 40) drilled on the surface thereof. .

When the loading is completed as described above, the scanning member 24 is the glass (G) through the scanning hole 26 drilled in the glass stage 20 and the auxiliary scanning hole 30 drilled in the table (4) ) And the setting state of the circuit board B is scanned and displayed on the monitor 44 (see FIGS. 7 and 8).

Then, as shown in FIG. 8, the positional deviation between the alignment point P1 displayed on the adhered surface G1 of the glass G displayed on the monitor 44 and the alignment point P2 displayed on the circuit board B is determined. The setting step S2 for checking and correcting is performed.

If the positional deviation is larger than the allowable range in the setting process, the X direction of the circuit board through the first stage 34, the second stage 36, and the third stage 38 of the setting unit 22 is described. , Y, and θ direction is adjusted within the allowable deviation by adjusting the adjustment knob (N).

Although not shown in the drawing, the anisotropic and conductive tapes are adhered to each other on the surface to be bonded G1 of the glass G by an attachment machine, and the tapes are bonded to each other when the bonding heads 52a and 52b are bonded. When the heat is applied to the circuit board (B) and the glass (G) to be bonded between the surface to be glued (G1) serves to smoothly bond.

Also, the alignment points P1 and P2 displayed on the glass G and the circuit board B are also provided with the points displayed at the correct positions in advance when manufacturing them. It is possible to smoothly correct their position deviation while visually checking.

When the driving button 18 installed on the work table 2 is pressed after the loading process S1 and the setting process S2 are completed as described above, the first aligning unit 6a as shown in FIG. 5A. The glass G and the circuit board B loaded therein are rotated 120 ° clockwise by the table 4, and then stop below the first bonding portion 8a.

Then, the bonding head 52a of the first bonding portion 8a is operated by the cylinder 50a, and the pressing surface 60 of the head 52a generates heat at a predetermined temperature by the heat generating member 62a. While pressing the upper surface of the circuit board B loaded in the first aligning section 6a, a first bonding step S3 is performed to temporarily attach the film to a predetermined bonding time.

In the first bonding step S3, the worker places the glass G and the circuit board B on the second aligning part 6b which is waiting at the loading position by the table 4. Loading and setting in the same manner as S1) and the setting step (S2).

After the temporary bonding is completed by the first bonding process S3, when the table 4 is rotated by operating the driving button 18 again, the first aligning unit located in the first bonding unit 8a is provided. After 6a rotates clockwise again by 120 °, it stops at the position where bonding is possible in the second bonding portion 8b as shown in FIG. 5C, and at the same time, the glass (on the loading side of the worktable 2 is The second aligning portion 6b on which G) and the circuit board B are loaded and set is also rotated to move to the bonding position of the first bonding portion 8a.

As described above, the circuit board B temporarily bonded to the glass G by the first bonding step S3 is stopped at the bonding position of the second bonding part 8b by the first aligning part 6a. In this case, the bonding head 52b of the bonding part 8b is operated to perform the second bonding step S4 of main bonding, and at the same time, the first bonding part 8a is the second aligning part ( The circuit board B is temporarily bonded to the glass G while pressing the circuit board B loaded in 6b).

When the table 4 is rotated again after the second bonding process S4 is completed, the first aligning unit 6a positioned in the second bonding unit 8b rotates to the first loading position. At the same time, the second aligning portion 6b and the third aligning portion 6c move together to the bonding positions of the second bonding portion 8b and the first bonding portion 8a. .

Then, the worker performs the unloading step S5 of unloading the glass G, which has been bonded, and storing it in a separate storage tray (not shown), and the first aligning part 6a in which the glass G is unloaded. ) Is loaded on the glass (G) and the circuit board (B), respectively, and the circuit board (G) on the glass (G) through the above-described setting process (S2), first bonding process (S3), and second bonding process (S4). Bond B).

In the above description of the preferred embodiment of the circuit board bonding apparatus of the flat panel display device according to the present invention, the present invention is not limited to this, but various modifications within the scope of the claims and the detailed description of the invention and the accompanying drawings. It is possible to carry out by, and this also belongs to the scope of the present invention.

As described above, according to the circuit board bonding apparatus of the flat panel display device according to the present invention, further improved bonding quality can be obtained by sequentially performing temporary adhesion and main bonding while rotating the glass and the circuit board loaded by the table in the circumferential direction. In addition to being able to work continuously, the productivity can be doubled.

In addition, the circuit board bonding apparatus of the flat panel display device according to the present invention, the bonding portion is composed of a plurality of bonding time by dividing the predetermined bonding time can significantly shorten the time required for bonding to improve the efficiency of the equipment accordingly have.

Claims (7)

A work table, a table rotatably installed on the work table, an aligning part installed on the table for loading and setting glass and a circuit board, and a glass and a circuit fixed to the work table and loaded on the aligning part. A circuit board bonding apparatus for a flat panel display device comprising two or more bonding portions for bonding a substrate. The glass aligning unit according to claim 1, wherein the aligning unit comprises: a glass stage on which the glass is loaded, a setting unit installed adjacent to the glass stage and loading a circuit board to set on the adhered surface of the glass; A circuit board bonding apparatus for a flat panel display device, comprising: a scanning member for scanning the adhered surface of the glass loaded on the stage, and three or more are installed in the circumferential direction of the table. 3. The circuit board bonding apparatus of claim 2, wherein a scanning hole corresponding to an adhered surface of the glass to be loaded is drilled on the glass stage. The circuit board of claim 2, wherein the setting unit comprises a manual stage, and the stage adjusts the position of the loaded circuit board in the X, Y, and θ directions. Bonding device. The circuit board bonding apparatus of claim 2, wherein the scanning member is a micro camera. The piston rod tip of the cylinder according to claim 1, wherein the bonding portion is provided with a fixed plate, a vertical plate movably installed in a vertical direction by a guide member provided on the front portion of the fixed plate, and a cylinder provided on an upper horizontal portion of the fixed plate. And a bonding head mounted on the bonding head, wherein the bonding head has a pressing surface formed in a form corresponding to the surface to be bonded of the glass. 7. The circuit board bonding apparatus of claim 6, wherein a pressure sensing sensor is installed between the bonding head and the piston rod of the cylinder and the sensor is a load cell.