WO1998014821A1 - Apparatus for press-bonding liquid crystal panel and method of production of liquid crystal device - Google Patents

Apparatus for press-bonding liquid crystal panel and method of production of liquid crystal device Download PDF

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Publication number
WO1998014821A1
WO1998014821A1 PCT/JP1997/003577 JP9703577W WO9814821A1 WO 1998014821 A1 WO1998014821 A1 WO 1998014821A1 JP 9703577 W JP9703577 W JP 9703577W WO 9814821 A1 WO9814821 A1 WO 9814821A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid crystal
panel
crystal panel
crimping
panel support
Prior art date
Application number
PCT/JP1997/003577
Other languages
French (fr)
Japanese (ja)
Inventor
Tsutomu Sasaki
Sadaaki Yui
Original Assignee
Seiko Epson Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corporation filed Critical Seiko Epson Corporation
Publication of WO1998014821A1 publication Critical patent/WO1998014821A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Definitions

  • the present invention relates to a pressure bonding apparatus for bonding electronic components such as TCP and liquid crystal driving ICs to electrode terminals formed on a transparent substrate of a liquid crystal panel, and a method for manufacturing a liquid crystal device using the pressure bonding apparatus.
  • a liquid crystal panel is formed by enclosing liquid crystal in a cell gap formed between a pair of opposing transparent substrates.
  • various methods have been conventionally known.
  • a liquid crystal driving IC to a transparent substrate of a liquid crystal panel using a bonding member such as ACF (Anisotropiconpiconductievefi1m: anisotropic conductive film).
  • ACF Adisotropiconpiconductievefi1m: anisotropic conductive film
  • TCP Tepe CarririerPackage: Tape Carrier Package
  • this TCP is a TAB (Tape Automated Bonding) method on a FPC (Flexible Printed Circuit) with a wiring pattern formed on it.
  • a liquid crystal driving IC is mounted by using.
  • the TCP is conductively connected to a transparent substrate of the liquid crystal panel through an ACF heat shield or the like.
  • PCB Print C ircuit B oa (rd: printed circuit board)
  • a liquid crystal driving IC is bonded onto the printed circuit board, and the PCB is conductively connected to the liquid crystal panel using a heat seal.
  • various electronic components such as the liquid crystal driving IC itself, a TCP, and a heat seal are connected on the transparent substrate of the liquid crystal panel.
  • the FPC which is a component of TCP
  • the crimping process was conventionally performed using a crimping device as shown in FIG.
  • the main body of the liquid crystal panel 52 is placed on the panel support 51, and the protruding portion of the transparent substrate 53 a of the liquid crystal panel 52 is placed on the panel support 54. Then, ACF56 is stuck on the overhanging portion of the transparent substrate 53a, and FPC57 is temporarily bonded thereon. After that, the FPC 57 is lowered on the transparent substrate 53 a by lowering the pressure bonding head 58 heated to a predetermined temperature and pressing the FPC 57 onto the protruding portion of the transparent substrate 53 a. Glue to
  • the crimp head is set. With 58, uniform pressure bonding can be performed. However, if the panel support 51 is higher than the predetermined position, as shown in FIG. 9, the overhang portions of the FPC 57 and the substrate 53a cannot be uniformly pressed by the crimping head 58. If the panel support 51 is lower than the predetermined position, as shown in FIG. 10, the liquid crystal panel 52 rises, so that uniform pressing cannot be performed. Further, as a conventional crimping device, there is, for example, a device disclosed in Japanese Patent Application Laid-Open No. 4-70816 or Japanese Patent Application No.
  • Japanese Unexamined Patent Publication No. Hei 7-170816 discloses a structure for electrically connecting a carrier including an IC chip on a transparent substrate of a liquid crystal panel, in which a carrier tape is attached to the transparent substrate. There is disclosed a structure in which a compression head for pressing is supported by an elastic swinging mechanism. Also, Japanese Patent Application Laid-Open No. 5-314130 discloses a structure for conductively connecting a liquid crystal driving IC as a TAB component on a substrate of a liquid crystal panel. There is disclosed a structure in which a liquid crystal driving IC is pressed against a substrate by a pressure block while the liquid crystal driving IC is placed on the substrate. In this structure, a fixed pressure can be instantaneously applied to the liquid crystal drive IC by driving the crimping pro- cedure using two pressurizing cylinders.
  • a support base for supporting the main body of the liquid crystal panel is fixedly installed and corresponds to the above-mentioned panel support.
  • the backup jig can move up and down.
  • arranging the backup jig so that it can move up and down complicates the structure and increases the cost.
  • the bonding between the transparent substrate of the liquid crystal panel and electronic components such as FPCs The state may be unstable.
  • a support table for supporting a liquid crystal panel can be moved in the left-right direction to transport the liquid crystal panel.
  • it cannot move up and down. Therefore, it includes the above-described problems described with reference to FIGS. 8 to 10.
  • the present invention has been made in view of the above problems, and has a simple structure to uniformly cover the entire surface of electronic components such as a liquid crystal driving IC and a heat seal with respect to a liquid crystal panel. It is an object of the present invention to provide a pressure bonding device that can be pressed and adhered evenly. Disclosure of the invention
  • a pressure bonding device for a liquid crystal panel is a pressure bonding device for bonding an electronic component under pressure to a substrate overhanging portion of a liquid crystal panel having a main body portion and a substrate overhanging portion, and supports the liquid crystal panel main body portion.
  • a panel support that supports the overhanging part of the liquid crystal panel, And a crimping head that is arranged to face the panel receiver and is movable in a direction approaching and away from the panel receiver.
  • the panel support is movable in parallel in the same direction as the direction of movement of the crimp head, and is supported by the reaction force applying means.
  • the reaction force applying means can be configured by using an elastic force due to a spring or the like, pneumatic pressure, oil pressure, or the like as a reaction force source.
  • the liquid crystal driving IC itself the heat seal, the TCP (TapEcarRirierPaccage) and the like can be considered.
  • the liquid crystal driving IC itself is directly bonded to the transparent substrate of the liquid crystal panel, that is, when producing a COG (Chip On G 1 ass) type liquid crystal panel, the liquid crystal driving IC and the transparent substrate are used.
  • a bonding member such as ACF is interposed between them to bond them.
  • the situation where the heat seal is bonded to the transparent substrate occurs when the PCB mounting the liquid crystal driving IC is connected to the transparent substrate via the heat seal.
  • an adhesive member such as ACF and a heat seal are interposed between the TCP and the transparent substrate.
  • the panel support supporting the main body of the liquid crystal panel is held in a so-called floating state by the reaction force applying means, so that the liquid crystal panel follows the movement of the crimp head.
  • the liquid crystal panel can move freely, so that the pressure bonding process can be performed while the liquid crystal panel is always placed horizontally, so that the entire area of electronic components such as a liquid crystal driving IC can be pressed with a uniform pressure.
  • the panel supporting base has a movable structure
  • the panel supporting base for supporting the overhanging portion of the liquid crystal panel substrate can be fixedly arranged, so that the portion corresponding to the panel supporting base can be moved up and down.
  • the pressing force applied between the substrate and the electronic component can be stably maintained at a certain level.
  • the liquid crystal panel and the electronic components can be stably and firmly bonded without any variance.
  • the panel support Since a driving device for moving up and down is not required, the structure is simplified and the cost is reduced.
  • the panel support is movably arranged under the action of the reaction force applying means, but the reaction force applying means does not include a special driving device, so that the structure is complicated and the cost is increased. None.
  • the panel support moves in the same direction as the crimping head, as described above, but in addition, the panel support is installed so that it can be tilted and moved within a relatively small angle range. can do. This allows the entire surface of the electronic component to be pressed evenly by the crimping head, even if the temporary bonding state of the electronic component to the liquid crystal panel varies.
  • the method for manufacturing a liquid crystal panel includes: (1) a step of placing a main body of the liquid crystal panel on a panel support; and (2) placing a substrate overhang of the liquid crystal panel on a panel receiving stand. And (3) placing the electronic component on the substrate overhang with an adhesive member in between, and (4) pressing the electronic component toward the panel cradle with a crimping head. Bonding a component to a substrate overhang of the liquid crystal panel.
  • the panel support can be moved in the same direction as the direction of movement of the crimping head and the spring can be moved. It is supported by reaction force applying means such as. BRIEF DESCRIPTION OF THE FIGURES
  • FIG. 1 is a perspective view showing an embodiment of a liquid crystal panel crimping apparatus according to the present invention.
  • FIG. 2 is a side view showing a main part of the crimping device of FIG. 1, particularly a structure of a part supporting a liquid crystal panel.
  • FIG. 3 is a plan view of the structure shown in FIG.
  • FIG. 4 is a front view of the structure shown in FIG.
  • Fig. 5 is a side view showing the state of the structure shown in Fig. 2 during crimping work. is there.
  • FIG. 6 is a perspective view showing an example of a liquid crystal panel to be subjected to a crimping operation.
  • FIG. 7 is a sectional view showing a sectional structure of the liquid crystal panel of FIG.
  • FIG. 8 is a sectional view showing an example of a conventional liquid crystal panel crimping apparatus.
  • FIG. 9 is a sectional view showing one operation state of the conventional device in FIG.
  • FIG. 10 is a sectional view showing another operation state of the conventional device of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 shows an embodiment of a liquid crystal panel crimping apparatus according to the present invention.
  • This crimping apparatus has a crimping operation stage 11, a left panel loading stage 12, and a right panel loading stage 13.
  • the panel positioning unit 16 is disposed on the base 14.
  • the panel positioning unit 16 has a support frame 17 that can rotate about the vertical axis X as a center as shown by an arrow A and can also translate in the front-rear direction as shown by an arrow B, and its support frame 17. It has a guide panel 18 fixed to the upper end of the frame 17 and elongated in the lateral direction.
  • the support frame 17 and the guide panel 18 supported by the support frame 17 can be translated in the direction of arrow B by rotating the front / rear adjustment knob 19 in either direction. .
  • the support frame 17 and the guide panel 18 supported by the support frame 17 are moved around the vertical axis X. Can be rotated.
  • Base 1 4 over 3 stages: left panel loading stage 1 2, crimping stage 1 1 1, and right panel loading stage 1 3
  • each of these table units 23 and 24 has a slide table 26 slidably mounted on a guide rail 22 and a slide table 26. It has an elevating table 28 that is guided by a guide rod 27 that is set up on one bull 26 and moves up and down. The elevating table 28 is driven by an air cylinder 29 disposed on the slide table 26 to move up and down as indicated by an arrow C.
  • the slide table 26 of the left table unit 23 and the slide table 26 of the right table unit 24 are connected to each other by a connection plate 31.
  • a linear drive (not shown) is connected to either the left tape unit 23 or the right table unit 24, and driven by the linear drive unit to drive the left table unit 23 and the right table unit 2 together. 4 As a body, move left and right on guide rails 2 2.
  • This linear drive device can be constituted by an arbitrary structure. For example, it can be constituted by using a feed screw.
  • the left table unit 23 is located on the left panel loading stage 12 and the right table unit 24 is located on the crimping stage 11.
  • the left table unit 23 is driven by the linear drive device and carried to the crimping work stage 11, the right table unit 24 is automatically moved to the right panel loading stage 13 accordingly. Carried.
  • Each of the left table unit 23 and the right table unit 24 is provided with a plurality of, in this embodiment, five, panel supports 1. As shown in FIG. 2, these panel supports 1 are fixed to the upper end of a lift port 32 supported by a lift table 28 so as to be movable up and down.
  • the lifting rod 32 has one panel as shown in Fig. 4. Two are provided in the horizontal direction with respect to the table support table 1, and a balance spring 33 is provided between the lift ports 32.
  • the balance spring 33 is arranged between the adjustment screw 34 fitted to the panel support 1 and the lifting table 28.
  • a guide bin 41 for positioning the liquid crystal panel 2 to be worked from the side is fixed to the upper surface of the panel support 1.
  • a V-groove block 36 is provided at the rear end (left end in the figure) of the panel support 1 and is supported by a bracket 38 extending from the rear end of the lifting table 28.
  • the locking air cylinder 37 thus provided is disposed to face the V-groove block 36.
  • the locking piece 39 formed at the tip of the output shaft of the locking air cylinder 37 is shown in FIG. 2 when the air cylinder 37 is operated and the output shaft is extended. So that it fits in the V groove of the V groove block 36.
  • the panel support 1 is fixedly held, that is, locked so as not to move in any of the vertical and horizontal directions.
  • the locked state of the panel support 1 is released, and the panel support 1 is pushed upward by the elastic force of the balance spring 33 while being supported by the lifting / lowering opening 32.
  • the panel support 1 in this state is floating in the space only by the elastic force of the balance spring 33, and therefore, when an external force in the vertical direction is applied to this panel support 1, Can move freely in the direction of the external force.
  • the panel support 1 Since the panel support 1 is fixed to the upper end of the lift port 3 2 which moves vertically with respect to the lifting table 28, the direction of movement of the panel support 1 is restricted almost vertically. Is done. However, in this embodiment, a slight margin, that is, a gap is provided for the fitting between the lifting / lowering opening pad 32 and the lifting / lowering table 28. For this reason, the panel In addition to the vertical movement, the support base 1 can be tilted and moved within a very small angle range as shown by an arrow D in FIG. 5 and an arrow E in FIG.
  • an air suction opening 54 is opened on the surface of the panel support 1 toward the outside, and an air passage 53 extending from the opening 54 is formed inside the panel support 1. .
  • An air intake device 55 is connected to the air passage 53. When the air intake device 55 is operated, external air is sucked through the opening 54. By this air suction, the liquid crystal panel 2 placed on the non-nel support 1 is held by suction.
  • a plurality of panel supports 4 in this embodiment, five panel supports 4 are arranged in parallel with the guide rails 22 on the base 14. Further, the top plate 4 3 is supported by the columns 42, and five crimping heads 8 are provided so as to hang down from the top plate 4 3. These crimping heads 8 are accurately positioned above the individual panel supports 4. At the upper position of the top plate 43, air cylinders 44 are arranged corresponding to the individual crimp heads 8. The compression head 8 is driven by these air cylinders 44, and moves up and down as shown by arrows FF in FIG.
  • each crimping head 8 is heated to a predetermined temperature by the heater.
  • tape take-up reels 46a and 46b are fixedly installed at left and right side ends of a top plate 43.
  • Tapes 47 made of fluororesin, for example, Teflon (trade name) are wound around these reels.
  • the fluororesin film tape 47 protrudes below the crimping head 8 as shown in FIG.
  • the temperature adjustment and the position adjustment can be performed independently. Therefore, the individual crimping heads 8 can perform the crimping process under the best crimping conditions without being influenced by other crimping heads.
  • this liquid crystal panel 2 is made of a sealing material 7 with a glass 9 second transparent substrate 3b and a spacer 9 interposed therebetween as well as a glass first transparent substrate 3a.
  • a sealing material 7 with a glass 9 second transparent substrate 3b and a spacer 9 interposed therebetween as well as a glass first transparent substrate 3a.
  • the part of the liquid crystal panel 2 in which the liquid crystal 5 is sealed is the main part of the liquid crystal panel.
  • a first transparent electrode 10a is formed on the inner surface of the first transparent substrate 3a, and a second transparent electrode 10b is formed on the inner surface of the second transparent substrate 3b. Then, electrode terminals 48 connected to these transparent electrodes are formed on the protruding portion 3c of the first transparent substrate 3a. A connection terminal 49 for conductively connecting an external circuit is formed at an end of the substrate extension 3c. Further, polarizing plates 51a and 51b are attached to the outer surfaces of the transparent substrates 3a and 3b, respectively.
  • the liquid crystal driving IC 15 When the liquid crystal driving IC 15 is mounted on the liquid crystal panel 2, first, as shown in FIG. 6, ACF 6 is attached to a predetermined position on the overhanging portion 3c of the substrate 3a. Further, the liquid crystal driving IC 15 is placed on the ACF 6, and the liquid crystal driving IC 15 is heated to a predetermined temperature and simultaneously pressed against the substrate extension 3c. Due to this heat-compression bonding, the liquid crystal driving IC 15 and the substrate overhanging portion 3c are fixed to each other by the resin portion of the ACF 6, and at the same time, the liquid crystal driving IC is dispersed by the conductive particles dispersed in the resin.
  • the input and output bumps of IC 15 Conductively connect to the external connection terminal 49 and the electrode terminal 48 on the board.
  • the crimping apparatus is configured such that, for the liquid crystal panel 2 on which the ACF 6 and the liquid crystal driving IC 15 are temporarily bonded at predetermined positions of the substrate overhang portion 3C, the liquid crystal driving IC 15
  • the formal crimping that is, the actual crimping operation, is performed, and the main crimping work will be described below.
  • the left table unit 23 is set on the left panel loading stage 12.
  • the output shaft of the locking air cylinder 37 is extended as shown in FIG. 2, and the locking piece 39 at the end of the output shaft is connected to the V-groove block 3 of the panel support 1. 6, and as a result, the panel support 1 is in an immovable locked state.
  • the air cylinder 29 on the slide table 26 is in an extended state, and the lift table 28 is set to the upper position.
  • the liquid crystal panel 2 to be worked is placed on each panel support 1 in the left table unit 23, and is fixed by suction by air suction.
  • the ACF 6 and the liquid crystal driving IC 15 are temporarily bonded at predetermined positions.
  • the side edge of the liquid crystal panel 2 is pressed against the guide bin 41, and the front end is further guided to the guide panel 1. 8
  • the liquid crystal panel 2 is positioned at a fixed position on the panel support 1. Note that the position of the guide panel 18 can be adjusted to a desired position by appropriately turning both or one of the front / rear adjustment knob 19 and the angle adjustment knob 21 in FIG.
  • the linear drive unit (not shown) for driving the table is activated, and the left table unit 23 moves along the guide rail 22. Then, it is transported to the crimping work stage 11. At this time, the right table unit 24 is carried from the crimping work stage 11 to the right panel loading stage 13. left When the side table 23 is carried to the crimping work stage 11 and stopped there, in FIG. 2, the overhang 3 c of the liquid crystal panel 2 on the panel support 1 is provided with a panel support. It is located at an appropriate distance from the platform 4 at an upper position.
  • the locking air cylinder 37 operates to release the locking piece 39 from the V-groove block 36, releasing the opening of the panel support base 1. Then, the elevating and lowering air cylinder 29 is operated and its output shaft is retracted. Then, the force pushing up the panel support 1 is released, and the panel support 1 descends as shown by the arrow G in FIG. 5, and the substrate overhang 3 c of the liquid crystal panel 2 is moved downward. Stop when the bottom touches or approaches the upper end of panel support 4. Regarding whether to stop the liquid crystal panel 2 in contact with the panel support 4 or in the proximity, that is, in a slightly floating state, there is no problem in terms of function. However, which state is to be set can be adjusted by turning the adjustment screw 34 in FIG.
  • the crimping head 8 descends along with the fluorine-inclined resin film tape 47 as shown by the arrow F, and hits the upper surface of the liquid crystal driving IC 15 on the liquid crystal panel 2, and further. It is pressed against the panel support 4 with a predetermined pressure. As a result, the ACF 6 interposed between the liquid crystal driving IC 15 and the substrate overhang portion 3c of the liquid crystal panel 2 is heated and pressurized. As a result, the liquid crystal driving IC 15 extends over the substrate. Glued to part 3c. In this way, the final pressure bonding of the liquid crystal drive IC 15 is completed.
  • the reason that the fluorine-inclined resin film tape 47 is interposed between the crimping head 8 and the liquid crystal driving IC 15 is that the crimping head 8 directly contacts the bonding IC 15. This is to avoid it.
  • the panel support 1 is supported in a substantially floating state by the elastic reaction force of the balance spring 33 and can move freely in the vertical direction. Hold horizontal It is pressed by the crimping head 8 in the pressed state.
  • the liquid crystal driving IC 15 is stably and strongly adhered to the substrate of the liquid crystal panel 2 without variation.
  • the panel support 1 can be slightly tilted and moved. Even if the temporary bonding state of the liquid crystal driving IC 15 varies, the pressure bonding head 8 can uniformly press the entire surface of the liquid crystal driving IC 15.
  • the pressure bonding head 8 is moved up as shown by the arrow F in FIG. 29 is activated and its output shaft is extended.
  • the lifting table 28 is raised, and the panel support 1 is returned to the upper position shown in FIG.
  • the left table unit 23 in Fig. 1 is returned from the crimping work table 11 to the left panel loading stage 12 again, and the liquid crystal panel 2 that has completed the crimping work is moved from the panel support 1 to the left panel unit 2. Collected.
  • the operator While the left table unit 23 is set on the crimping work stage 11 and the above-described final crimping operation is performed, the operator operates the right table unit 24 placed on the right panel loading stage 13. Then, load the unprocessed liquid crystal panel 2.
  • the right table unit The brunit 24 is automatically carried to the crimping stage 11 and subjected to the final crimping operation. In this way, the final crimping work is performed alternately on the left table brunet 23 and the right table brunet 24.
  • the present invention was applied to the panel.
  • the liquid crystal drive IC itself as an electronic component to be crimped to the liquid crystal panel.
  • the present invention can be applied to the case where another electronic component such as a heat shield TCP is electrically connected to the liquid crystal panel. In these cases, the heat seal, the TCP, and the like are pressed by the pressure bonding head 8.
  • the number of panel supports 1 prepared for each table unit 23, 24 is not limited to five, but may be smaller or larger, and may be one in some cases.
  • one table unit is fixedly installed and the table unit is installed. The crimping work can be performed using only Industrial applicability
  • the entire surface of an electronic component such as a liquid crystal driving IC and a heat seal can be uniformly pressed against a liquid crystal panel by uniformly pressing the same. It is possible to provide a crimping device suitable for the above.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A press-bonding apparatus which can uniformly press the entire surface areas of electronic components such as a liquid crystal driving IC, a heat seal, etc., onto a liquid crystal panel and can bond them evenly by a simple construction. A panel support table (1) is fixed to the upper end of an elevation rod (32) erected vertically movably to a table (28). The panel support table (1) is supported by a spring (33) and a liquid crystal panel (2) is placed on this support table (1). The liquid crystal panel (2) is balanced and stops at a position at which an extension portion (3c) of a transparent substrate comes into contact with, or comes close to, the upper end of a panel receiving table (4). An IC (15) which is tentatively bonded to the substrate (3c) is pushed to the substrate (3c) by a descending press-bonding head (8) and is bonded. Since the panel support table (1) is supported by the spring (33), it can move freely in such a manner as to follow the movement of the press-bonding head (8). Therefore, the IC (15) can be pushed to the liquid crystal panel always stably under a constant state.

Description

明 細 書  Specification
液晶パネルの圧着装置及び液晶装置の製造方法 技術分野  Liquid crystal panel pressure bonding apparatus and liquid crystal device manufacturing method
本発明は、 液晶パネルの透明基板上に形成された電極端子に T C P、 液晶駆動用 I C等といった電子部品を接着するための圧着装置 及びその圧着装置を用いた液晶装置の製造方法に関する。 背景技術  The present invention relates to a pressure bonding apparatus for bonding electronic components such as TCP and liquid crystal driving ICs to electrode terminals formed on a transparent substrate of a liquid crystal panel, and a method for manufacturing a liquid crystal device using the pressure bonding apparatus. Background art
一般に、 液晶パネルは、 対向する一対の透明基板の間に形成され るセルギャ ッ プ内に液晶を封入するこ とによって形成される。 この 液晶パネルによって文字、 数字、 絵柄等といった可視情報を表示す るためには、 一対の透明基板上に形成された複数の電極を液晶駆動 用 I Cに導電接続する必要がある。 この導電接続の具体的な方法と しては、 従来よ り、 種々の方法が知られている。  Generally, a liquid crystal panel is formed by enclosing liquid crystal in a cell gap formed between a pair of opposing transparent substrates. In order to display visible information such as characters, numbers, and pictures on the liquid crystal panel, it is necessary to conductively connect a plurality of electrodes formed on a pair of transparent substrates to the liquid crystal driving IC. As a specific method of the conductive connection, various methods have been conventionally known.
例えば、 第 1 に、 A C F (A n i s o t r o p i c c o n d u c t i v e f i 1 m ： 異方性導電膜） 等の接着用部材を用いて液 晶パネルの透明基板上に液晶駆動用 I Cを直接に接着する方法があ る。 この方法によれば、 いわゆる C O G ( C h i p O n G 1 a s s ) 方式の液晶パネルが作製される。  For example, first, there is a method of directly bonding a liquid crystal driving IC to a transparent substrate of a liquid crystal panel using a bonding member such as ACF (Anisotropiconpiconductievefi1m: anisotropic conductive film). According to this method, a so-called COG (ChipOnG1ass) type liquid crystal panel is manufactured.
また第 2に、 T C P ( T a p e C a r r i e r P a c k a g e ： テープキャ リ アパヅケ一ジ） の形で液晶駆動用 I Cを液晶パネ ルに導電接続する方法がある。 この T C Pというのは、 周知の通り、 配線パターンが形成された F P C ( F l e x i b l e P r i n t e d C i r c u i t ： フ レキシブルプリ ン ト配線板） 上に T A B ( T a p e A u t o m a t e d B o n d i n g : テープ自動化 実装） の手法を用いて液晶駆動用 I Cを実装したものである。 この 場合、 T C Pは、 A C Fゃヒ一 ト シ一ル等を介して液晶パネルの透 明基板に導電接続される。  Second, there is a method of conductively connecting a liquid crystal driving IC to a liquid crystal panel in the form of TCP (Tape CarririerPackage: Tape Carrier Package). As is well known, this TCP is a TAB (Tape Automated Bonding) method on a FPC (Flexible Printed Circuit) with a wiring pattern formed on it. A liquid crystal driving IC is mounted by using. In this case, the TCP is conductively connected to a transparent substrate of the liquid crystal panel through an ACF heat shield or the like.
また第 3に、 P C B (P r i n t e d C i r c u i t B o a r d ： プリ ン ト基板） 上に液晶駆動用 I Cを接合した後、 その P C Bをヒー ト シールを用いて液晶パネルに導電接続する方法がある。 以上のよう に、 液晶パネルに液晶駆動用 I Cを導電接続する場合 には、 液晶駆動用 I Cそれ自体、 T C P、 ヒー ト シール等といった 各種の電子部品が液晶パネルの透明基板上に接続される。 今、 T C Pの構成要素である F P Cを A C Fを用いて液晶パネルに接続する 場合を考える と、 従来は、 第 8図に示すような圧着装置を用いて圧 着処理を行っていた。 Third, PCB (Printed C ircuit B oa (rd: printed circuit board) There is a method in which a liquid crystal driving IC is bonded onto the printed circuit board, and the PCB is conductively connected to the liquid crystal panel using a heat seal. As described above, when a liquid crystal driving IC is conductively connected to a liquid crystal panel, various electronic components such as the liquid crystal driving IC itself, a TCP, and a heat seal are connected on the transparent substrate of the liquid crystal panel. Considering the case where the FPC, which is a component of TCP, is connected to the liquid crystal panel using ACF, the crimping process was conventionally performed using a crimping device as shown in FIG.
すなわち、 パネル支持台 5 1上に液晶パネル 5 2の本体部分を置 き、 さ らに液晶パネル 5 2の透明基板 5 3 aの張出 し部分をパネル 受け台 5 4の上に置く 。 そ して、 透明基板 5 3 aの張出 し部分の上 に A C F 5 6 を貼着し、 さ らにその上に F P C 5 7 を仮接着する。 その後、 所定温度に加熱した圧着へッ ド 5 8を降下して F P C 5 7 を透明基板 5 3 aの張出し部分に所定圧力で押し付けるこ とによ り、 F P C 5 7を透明基板 5 3 a上に接着する。  That is, the main body of the liquid crystal panel 52 is placed on the panel support 51, and the protruding portion of the transparent substrate 53 a of the liquid crystal panel 52 is placed on the panel support 54. Then, ACF56 is stuck on the overhanging portion of the transparent substrate 53a, and FPC57 is temporarily bonded thereon. After that, the FPC 57 is lowered on the transparent substrate 53 a by lowering the pressure bonding head 58 heated to a predetermined temperature and pressing the FPC 57 onto the protruding portion of the transparent substrate 53 a. Glue to
この従来の圧着装置においては、 パネル支持台 5 1 の高さ とパネ ル受け台 5 4の高さが液晶パネル 5 2の形状に正確に合致して高さ 設定されていれば圧着へッ ド 5 8によって均一な圧着処理を行う こ とができる。 しかしながら、 パネル支持台 5 1 が所定位置よ り も高 いと、 第 9図に示すよう に、 圧着ヘッ ド 5 8によって F P C 5 7及 び基板 5 3 aの張出 し部分を均一に押圧できない。 また、 パネル支 持台 5 1 が所定位置よ り も低いと、 第 1 0図に示すよう に、 液晶パ ネル 5 2が浮き上がって しまい、 やは り均一な押圧ができない。 また、 従来の圧着装置と して、 例えば、 特開平 4— 7 0 8 1 6号 公報又は特閧平 5 — 3 4 1 3 0 3号公報に開示された装置がある。 特開平 4一 7 0 8 1 6号公報には、 液晶パネルの透明基板上に I C チッ プを含んだキャ リ アテ一ブを導電接続するための構造であって、 キヤ リ アテープを透明基板に押圧するための圧着へッ ドを弾性揺動 機構によって支持する構造が開示されている。 また、 特開平 5— 3 4 1 3 0 3号公報には、 T A B部品と しての 液晶駆動用 I Cを液晶パネルの基板上に導電接続するための構造で あって、 液晶パネルを支持テーブル上に置いた状態で、 圧着ブロ ッ クによって液晶駆動用 I Cを基板に押圧する構造が開示されている。 この構造では、 圧着プロ ヅクを 2個の加圧用シ リ ンダを用いて駆動 するこ とによ り、 液晶駆動用 I Cに瞬時に一定の圧力をかけるこ と を可能に している。 In this conventional crimping machine, if the height of the panel support 51 and the height of the panel support 54 match the shape of the liquid crystal panel 52 exactly, the crimp head is set. With 58, uniform pressure bonding can be performed. However, if the panel support 51 is higher than the predetermined position, as shown in FIG. 9, the overhang portions of the FPC 57 and the substrate 53a cannot be uniformly pressed by the crimping head 58. If the panel support 51 is lower than the predetermined position, as shown in FIG. 10, the liquid crystal panel 52 rises, so that uniform pressing cannot be performed. Further, as a conventional crimping device, there is, for example, a device disclosed in Japanese Patent Application Laid-Open No. 4-70816 or Japanese Patent Application No. 5-314130. Japanese Unexamined Patent Publication No. Hei 7-170816 discloses a structure for electrically connecting a carrier including an IC chip on a transparent substrate of a liquid crystal panel, in which a carrier tape is attached to the transparent substrate. There is disclosed a structure in which a compression head for pressing is supported by an elastic swinging mechanism. Also, Japanese Patent Application Laid-Open No. 5-314130 discloses a structure for conductively connecting a liquid crystal driving IC as a TAB component on a substrate of a liquid crystal panel. There is disclosed a structure in which a liquid crystal driving IC is pressed against a substrate by a pressure block while the liquid crystal driving IC is placed on the substrate. In this structure, a fixed pressure can be instantaneously applied to the liquid crystal drive IC by driving the crimping pro- cedure using two pressurizing cylinders.
特開平 4 一 7 0 8 1 6号公報に鬨示された圧着装置では、 液晶パ ネルの本体部分を支持するための支持台は固定設置されてお り、 上 記のパネル受け台に相当するバッ クアツ プ治具が上下移動可能にな つている。 しかしながら、 バッ クアッ プ治具を上下移動可能に配設 するこ とは構造が複雑にな り、 コス トが高く な り、 しかも液晶パネ ルの透明基板と F P C等の電子部品との間の接着状態が不安定にな るこ とが考えられる。  In the crimping device disclosed in Japanese Patent Application Laid-Open No. Hei 7-170816, a support base for supporting the main body of the liquid crystal panel is fixedly installed and corresponds to the above-mentioned panel support. The backup jig can move up and down. However, arranging the backup jig so that it can move up and down complicates the structure and increases the cost. In addition, the bonding between the transparent substrate of the liquid crystal panel and electronic components such as FPCs The state may be unstable.
一方、 特開平 5— 3 4 1 3 0 3号公報に開示された圧着装置では、 液晶パネルを支持するための支持テ一ブルはその液晶パネルを搬送 するために左右方向へは移動可能であるが、 上下方向へは移動でき ない。 従って、 第 8 図〜第 1 0 図に関連して説明した上記の問題点 を含んでいる。  On the other hand, in the crimping device disclosed in Japanese Patent Application Laid-Open No. 5-314130, a support table for supporting a liquid crystal panel can be moved in the left-right direction to transport the liquid crystal panel. However, it cannot move up and down. Therefore, it includes the above-described problems described with reference to FIGS. 8 to 10.
本発明は、 上記の問題点に鑑みて成されたものであって、 簡単な 構造によ り、 液晶駆動用 I C、 ヒー ト シール等の電子部品の表面全 域を液晶パネルに対して均一に押圧してむらな く接着できる圧着装 置を提供するこ とを目的とする。 発明の開示  The present invention has been made in view of the above problems, and has a simple structure to uniformly cover the entire surface of electronic components such as a liquid crystal driving IC and a heat seal with respect to a liquid crystal panel. It is an object of the present invention to provide a pressure bonding device that can be pressed and adhered evenly. Disclosure of the invention
本発明に係る液晶パネルの圧着装置は、 本体部分及び基板張出 し 部を有する液晶パネルの基板張出 し部に電子部品を圧力下で接着す る圧着装置において、 液晶パネルの本体部分を支持するパネル支持 台と、 液晶パネルの基板張出 し部を支持するパネル受け台と、 パネ ル受け台に対向して配置されていてパネル受け台に近づ く 方向及び それから離れる方向へ移動可能な圧着へッ ド とを有する。 そ して、 上記パネル支持台は、 圧着へッ ドの移動方向と同じ方向へ平行移動 可能である と共に反力付与手段によって支持される。 A pressure bonding device for a liquid crystal panel according to the present invention is a pressure bonding device for bonding an electronic component under pressure to a substrate overhanging portion of a liquid crystal panel having a main body portion and a substrate overhanging portion, and supports the liquid crystal panel main body portion. A panel support that supports the overhanging part of the liquid crystal panel, And a crimping head that is arranged to face the panel receiver and is movable in a direction approaching and away from the panel receiver. The panel support is movable in parallel in the same direction as the direction of movement of the crimp head, and is supported by the reaction force applying means.
上記構成において、 反力付与手段は、 スプリ ング等による弾性力、 空圧力、 油圧力等を反力源と して構成できる。 また、 上記構成にお いて、 液晶パネルに接着される電子部品と しては、 液晶駆動用 I C それ自体、 ヒ一 ト シ一ル、 T C P ( T a p e C a r r i e r P a c k a g e ) 等が考えられる。 液晶駆動用 I Cそれ自体を液晶パ ネルの透明基板に直接に接着する場合、 すなわち C O G ( C h i p O n G 1 a s s ) 方式の液晶パネルを作製する場合には、 液晶駆 動用 I Cと透明基板との間に A C F等の接着部材を介在させてそれ らを接着する。 また、 ヒー ト シールを透明基板に接着する という状 況は、 液晶駆動用 I Cを搭載した P C Bをそのヒ一 ト シ一ルを介し て透明基板に接続する とき等に生じる状況である。 また、 T C Pを 透明基板に接着する場合には、 T C Pと透明基板との間に A C F等 の接着部材ゃヒー ト シール等を介在させる。  In the above configuration, the reaction force applying means can be configured by using an elastic force due to a spring or the like, pneumatic pressure, oil pressure, or the like as a reaction force source. Further, in the above configuration, as the electronic components to be bonded to the liquid crystal panel, the liquid crystal driving IC itself, the heat seal, the TCP (TapEcarRirierPaccage) and the like can be considered. When the liquid crystal driving IC itself is directly bonded to the transparent substrate of the liquid crystal panel, that is, when producing a COG (Chip On G 1 ass) type liquid crystal panel, the liquid crystal driving IC and the transparent substrate are used. A bonding member such as ACF is interposed between them to bond them. Further, the situation where the heat seal is bonded to the transparent substrate occurs when the PCB mounting the liquid crystal driving IC is connected to the transparent substrate via the heat seal. When the TCP is bonded to the transparent substrate, an adhesive member such as ACF and a heat seal are interposed between the TCP and the transparent substrate.
本発明の圧着装置によれば、 液晶パネルの本体部分を支持したパ ネル支持台が反力付与手段によって、 いわゆる浮いた状態に保持さ れるので、 液晶パネルは圧着ヘッ ドの動きに追従して自由に動く こ とができ、 従って、 液晶パネルを常に水平に置いた状態で圧着処理 を行う こ とができ、 よって、 液晶駆動用 I C等といった電子部品の 全域を均一な圧力で押圧できる。  According to the crimping device of the present invention, the panel support supporting the main body of the liquid crystal panel is held in a so-called floating state by the reaction force applying means, so that the liquid crystal panel follows the movement of the crimp head. The liquid crystal panel can move freely, so that the pressure bonding process can be performed while the liquid crystal panel is always placed horizontally, so that the entire area of electronic components such as a liquid crystal driving IC can be pressed with a uniform pressure.
また、 パネル支持台の方を可動構造に したので、 液晶パネルの基 板の張出 し部分を支持するパネル受け台は固定配置でき、 よって、 パネル受け台に相当する部分を上下移動するよ う に した従来の圧着 装置に比べて、 基板と電子部品との間に加わる押圧力を一定の大き さに安定して維持できる。 その結果、 液晶パネルと電子部品とをバ ラ ツキな く 安定して しっか り と接着でき る。 また、 パネル受け台を 上下移動させるための駆動装置が不要になるので、 構造が簡単にな り、 しかもコス トが安 く済む。 パネル支持台は反力付与手段の作用 下で移動可能に配設されるが、 この反力付与手段は特別な駆動装置 を含むものではないので、 構造を複雑にした り、 コス ト を高く する こ ともない。 In addition, since the panel supporting base has a movable structure, the panel supporting base for supporting the overhanging portion of the liquid crystal panel substrate can be fixedly arranged, so that the portion corresponding to the panel supporting base can be moved up and down. Compared with the conventional crimping device described above, the pressing force applied between the substrate and the electronic component can be stably maintained at a certain level. As a result, the liquid crystal panel and the electronic components can be stably and firmly bonded without any variance. Also, the panel support Since a driving device for moving up and down is not required, the structure is simplified and the cost is reduced. The panel support is movably arranged under the action of the reaction force applying means, but the reaction force applying means does not include a special driving device, so that the structure is complicated and the cost is increased. Nothing.
なお、 パネル支持台は上述のよう に圧着へッ ドの移動方向と同 じ 方向へ平行移動するのであるが、 それに加えて、 パネル支持台を比 較的小さな角度範囲で傾き移動可能に配設するこ とができる。 こ う すれば、 液晶パネルに対する電子部品の仮接着状態にバラツキがあ る場合でも、 電子部品の全面を圧着ヘッ ドによって均一に押圧でき る。  As described above, the panel support moves in the same direction as the crimping head, as described above, but in addition, the panel support is installed so that it can be tilted and moved within a relatively small angle range. can do. This allows the entire surface of the electronic component to be pressed evenly by the crimping head, even if the temporary bonding state of the electronic component to the liquid crystal panel varies.
さ らに、 本発明に係る液晶パネルの製造方法は、 （ 1 ) 液晶パネ ルの本体部分をパネル支持台上に置く 工程と、 （ 2 ) 液晶パネルの 基板張出し部をパネル受け台上に置く 工程と、 （ 3 ) 基板張出 し部 の上に接着用部材を挟んで電子部品を置く 工程と、 （ 4 ) 圧着へッ ドによって電子部品をパネル受け台方向へ押圧するこ とによって電 子部品を液晶パネルの基板張出し部へ接着する工程とを有する液晶 パネルの製造方法であ り、 特に、 上記パネル支持台は、 圧着ヘッ ド の移動方向と同じ方向へ平行移動可能である と共にスプリ ング等の 反力付与手段によって支持される。 図面の簡単な説明  Furthermore, the method for manufacturing a liquid crystal panel according to the present invention includes: (1) a step of placing a main body of the liquid crystal panel on a panel support; and (2) placing a substrate overhang of the liquid crystal panel on a panel receiving stand. And (3) placing the electronic component on the substrate overhang with an adhesive member in between, and (4) pressing the electronic component toward the panel cradle with a crimping head. Bonding a component to a substrate overhang of the liquid crystal panel. In particular, the panel support can be moved in the same direction as the direction of movement of the crimping head and the spring can be moved. It is supported by reaction force applying means such as. BRIEF DESCRIPTION OF THE FIGURES
第 1 図は、 本発明に係る液晶パネルの圧着装置の一実施形態を示 す斜視図である。  FIG. 1 is a perspective view showing an embodiment of a liquid crystal panel crimping apparatus according to the present invention.
第 2 図は、 第 1 図の圧着装置の要部、 特に液晶パネルを支持する 部分の構造を示す側面図である。  FIG. 2 is a side view showing a main part of the crimping device of FIG. 1, particularly a structure of a part supporting a liquid crystal panel.
第 3 図は、 第 2 図に示す構造の平面図である。  FIG. 3 is a plan view of the structure shown in FIG.
第 4図は、 第 2 図に示す構造の正面図である。  FIG. 4 is a front view of the structure shown in FIG.
第 5 図は、 第 2 図に示す構造の圧着作業時の状態を示す側面図で ある。 Fig. 5 is a side view showing the state of the structure shown in Fig. 2 during crimping work. is there.
第 6 図は、 圧着作業の対象である液晶パネルの一例を示す斜視図 である。  FIG. 6 is a perspective view showing an example of a liquid crystal panel to be subjected to a crimping operation.
第 7 図は、 第 6 図の液晶パネルの断面構造を示す断面図である。 第 8 図は、 従来の液晶パネルの圧着装置の一例を示す断面図であ る。  FIG. 7 is a sectional view showing a sectional structure of the liquid crystal panel of FIG. FIG. 8 is a sectional view showing an example of a conventional liquid crystal panel crimping apparatus.
第 9 図は、 第 8 図の従来装置の 1 つの動作状態を示す断面図であ る。  FIG. 9 is a sectional view showing one operation state of the conventional device in FIG.
第 1 0 図は、 第 8図の従来装置の他の 1 つの動作状態を示す断面 図である。 発明を実施するための最良の形態  FIG. 10 is a sectional view showing another operation state of the conventional device of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
第 1 図は、 本発明に係る液晶パネルの圧着装置の一実施形態を示 している。 この圧着装置は、 圧着作業ステージ 1 1 と、 左側パネル 装填ステージ 1 2 と、 そ して右側パネル装填ステージ 1 3 とを有 し ている。 左側パネル装填ステージ 1 2及び右側パネル装填ステージ 1 3 の両ステージにおいて、 ベース 1 4の上にパネル位置决めュ二 ヅ ト 1 6 が配設されている。 これらのパネル位置決めュニヅ ト 1 6 は、 垂直軸線 Xを中心と して矢印 Aのよう に回転移動できる と共に 矢印 Bのよう に前後方向へ平行移動するこ ともできる支持フ レーム 1 7 と、 その支持フ レーム 1 7 の上端に固定されていて横方向に長 いガイ ドパネル 1 8 とを有している。 前後調節ツマ ミ 1 9 を正反い ずれかの方向へ回すこ とによ り、 支持フ レーム 1 7及びそれに支持 されたガイ ドパネル 1 8 を矢印 B方向へ平行移動させるこ とがで き る。 また、 左右一対の角度調節ツマ ミ 2 1 のどち らかを選択してそ れを回すこ とによ り、 支持フ レーム 1 7及びそれに支持されたガイ ドパネル 1 8 を垂直軸線 Xの周 り に回転移動するこ とができる。 左側パネル装填ステージ 1 2、 圧着作業ステージ 1 1 、 そ して右 側パネル装填ステージ 1 3 の 3個のステージにわたってベース 1 4 の上に直線状のガイ ド レール 2 2 が施設されている。 そ して、 その ガイ ド レ一ル 2 2 の上に左側テ一ブルュニッ ト 2 3及び右側テープ ルュニッ ト 2 4 が滑り移動自在に載っている。 これらのテーブルュ ニヅ ト 2 3及び 2 4は、 それそれ第 2 図に示すよう に、 ガイ ド レ一 ル 2 2 に滑り移動自在に載置されたスライ ドテ一ブル 2 6 と、 その スライ ドテ一ブル 2 6 に立てられたガイ ドロ ッ ド 2 7 にガイ ドされ て上下移動する昇降テーブル 2 8 とを有している。 昇降テーブル 2 8は、 スライ ドテ一ブル 2 6 の上に配設されたエアシ リ ンダ 2 9 に よって駆動されて矢印 Cのよう に昇降移動する。 FIG. 1 shows an embodiment of a liquid crystal panel crimping apparatus according to the present invention. This crimping apparatus has a crimping operation stage 11, a left panel loading stage 12, and a right panel loading stage 13. In both of the left panel loading stage 12 and the right panel loading stage 13, the panel positioning unit 16 is disposed on the base 14. The panel positioning unit 16 has a support frame 17 that can rotate about the vertical axis X as a center as shown by an arrow A and can also translate in the front-rear direction as shown by an arrow B, and its support frame 17. It has a guide panel 18 fixed to the upper end of the frame 17 and elongated in the lateral direction. The support frame 17 and the guide panel 18 supported by the support frame 17 can be translated in the direction of arrow B by rotating the front / rear adjustment knob 19 in either direction. . In addition, by selecting and turning one of the pair of left and right angle adjustment knobs 21, the support frame 17 and the guide panel 18 supported by the support frame 17 are moved around the vertical axis X. Can be rotated. Base 1 4 over 3 stages: left panel loading stage 1 2, crimping stage 1 1 1, and right panel loading stage 1 3 There is a straight guide rail 22 above the building. On the guide rail 22, there are a left table unit 23 and a right tape unit 24 slidably mounted. As shown in FIG. 2, each of these table units 23 and 24 has a slide table 26 slidably mounted on a guide rail 22 and a slide table 26. It has an elevating table 28 that is guided by a guide rod 27 that is set up on one bull 26 and moves up and down. The elevating table 28 is driven by an air cylinder 29 disposed on the slide table 26 to move up and down as indicated by an arrow C.
第 1 図に戻って、 左側テーブルュニッ ト 2 3 のスライ ドテ一ブル 2 6 と右側テーブルュニッ ト 2 4 のスライ ドテ一ブル 2 6 とは、 連 結プレー ト 3 1 によって互いに連結されている。 また、 左側テープ ルュニッ ト 2 3又は右側テーブルュニッ ト 2 4のいずれかに直線駆 動装置 （図示せず） が連結され、 この直線駆動装置によって駆動さ れて左側テーブルュニッ ト 2 3及び右側テーブルュニッ ト 2 4 がー 体になってガイ ド レール 2 2 の上で左右へ移動する。 この直線駆動 装置は任意の構造によって構成できるが、 例えば、 送り ネジを用い て構成できる。  Returning to FIG. 1, the slide table 26 of the left table unit 23 and the slide table 26 of the right table unit 24 are connected to each other by a connection plate 31. A linear drive (not shown) is connected to either the left tape unit 23 or the right table unit 24, and driven by the linear drive unit to drive the left table unit 23 and the right table unit 2 together. 4 As a body, move left and right on guide rails 2 2. This linear drive device can be constituted by an arbitrary structure. For example, it can be constituted by using a feed screw.
第 1 図に示す状態は、 左側テーブルュニッ ト 2 3 が左側パネル装 填ステージ 1 2 に位置し、 右側テーブルュニッ ト 2 4 が圧着作業ス テージ 1 1 に位置している状態である。 上記の直線駆動装置によつ て駆動されて左側テーブルュニッ ト 2 3 が圧着作業ステージ 1 1 へ 持ち運ばれる と、 それに対応して右側テーブルュニッ ト 2 4は自動 的に右側パネル装填ステージ 1 3へ持ち運ばれる。  In the state shown in FIG. 1, the left table unit 23 is located on the left panel loading stage 12 and the right table unit 24 is located on the crimping stage 11. When the left table unit 23 is driven by the linear drive device and carried to the crimping work stage 11, the right table unit 24 is automatically moved to the right panel loading stage 13 accordingly. Carried.
左側テーブルュニッ ト 2 3及び右側テーブルュニッ ト 2 4のそれ それには、 複数個、 本実施形態では 5個のパネル支持台 1 が設けら れる。 これらのパネル支持台 1 は、 第 2 図に示すよう に、 昇降テー ブル 2 8 に昇降移動自在に支持された昇降口 ッ ド 3 2 の上端に固着 されている。 昇降ロ ッ ド 3 2 は、 第 4図に示すよう に、 1 個のパネ ル支持台 1 に対して横方向に 2個設けられてお り、 それらの昇降口 ヅ ド 3 2 の間にバラ ンススプリ ング 3 3 が設けられる。 このバラ ン ススプリ ング 3 3は、 パネル支持台 1 にネジ嵌合する調整ネジ 3 4 と昇降テーブル 2 8 との間に配置される。 パネル支持台 1 の上面に は、 作業対象である液晶パネル 2 を側面方向から位置決めするため のガイ ドビン 4 1 が固定されている。 Each of the left table unit 23 and the right table unit 24 is provided with a plurality of, in this embodiment, five, panel supports 1. As shown in FIG. 2, these panel supports 1 are fixed to the upper end of a lift port 32 supported by a lift table 28 so as to be movable up and down. The lifting rod 32 has one panel as shown in Fig. 4. Two are provided in the horizontal direction with respect to the table support table 1, and a balance spring 33 is provided between the lift ports 32. The balance spring 33 is arranged between the adjustment screw 34 fitted to the panel support 1 and the lifting table 28. A guide bin 41 for positioning the liquid crystal panel 2 to be worked from the side is fixed to the upper surface of the panel support 1.
第 2 図において、 パネル支持台 1 の後端部 （図の左端部） に V溝 ブロ ック 3 6 が設けられ、 昇降テ一ブル 2 8 の後端部から延びるブ ラケッ ト 3 8 に支持されたロ ッ ク用エアシ リ ンダ 3 7 がその V溝ブ ロ ック 3 6 に対向 して配設される。 ロ ッ ク用エアシ リ ンダ 3 7 の出 力軸の先端に形成されたロ ッ ク片 3 9 は、 エアシ リ ンダ 3 7 が作動 してその出力軸が伸張移動する とき、 第 2 図に示すよう に、 V溝ブ ロ ヅ ク 3 6 の V溝に嵌合する。 この結果、 パネル支持台 1 は上下左 右のいずれの方向へも移動しないよう に固定保持、 すなわちロ ッ ク される。  In FIG. 2, a V-groove block 36 is provided at the rear end (left end in the figure) of the panel support 1 and is supported by a bracket 38 extending from the rear end of the lifting table 28. The locking air cylinder 37 thus provided is disposed to face the V-groove block 36. The locking piece 39 formed at the tip of the output shaft of the locking air cylinder 37 is shown in FIG. 2 when the air cylinder 37 is operated and the output shaft is extended. So that it fits in the V groove of the V groove block 36. As a result, the panel support 1 is fixedly held, that is, locked so as not to move in any of the vertical and horizontal directions.
他方、 エアシ リ ンダ 3 7 の出力軸が引込み移動する と、 第 5 図に 示すよう に、 ロ ッ ク片 3 9 は V溝ブロ ッ ク 3 6 の V溝から外れる。 する と、 パネル支持台 1 のロ ッ ク状態が解除され、 そのパネル支持 台 1 は昇降口 ッ ド 3 2 によって支持されながらバラ ンススプリ ング 3 3 の弾性力によって上方へ押し上げられる状態となる。 つま り、 この状態のパネル支持台 1 は、 バラ ンススプリ ング 3 3 の弾性力だ けで空間に浮いている状態であ り、 よって、 このパネル支持台 1 は これに上下方向の外力が加わる と きにその外力の作用方向へ自由に 移動できる。  On the other hand, when the output shaft of the air cylinder 37 is retracted, the locking piece 39 comes off the V-groove of the V-groove block 36 as shown in FIG. Then, the locked state of the panel support 1 is released, and the panel support 1 is pushed upward by the elastic force of the balance spring 33 while being supported by the lifting / lowering opening 32. In other words, the panel support 1 in this state is floating in the space only by the elastic force of the balance spring 33, and therefore, when an external force in the vertical direction is applied to this panel support 1, Can move freely in the direction of the external force.
なお、 パネル支持台 1 は、 昇降テーブル 2 8 に対して上下方向へ 移動する昇降口 ヅ ド 3 2 の上端に固定されているので、 そのパネル 支持台 1 の移動方向は、 ほぼ上下方向に規制される。 しかしながら、 本実施形態では、 昇降口 ッ ド 3 2 と昇降テーブル 2 8 との間の嵌合 にわずかの余裕、 すなわち間隙を持たせてある。 このため、 パネル 支持台 1 は上下方向への移動に加えて、 第 5 図に矢印 D及び第 4 図 に矢印 Eで示すよう に、 ごく微小の角度範囲で傾斜移動可能となつ ている。 Since the panel support 1 is fixed to the upper end of the lift port 3 2 which moves vertically with respect to the lifting table 28, the direction of movement of the panel support 1 is restricted almost vertically. Is done. However, in this embodiment, a slight margin, that is, a gap is provided for the fitting between the lifting / lowering opening pad 32 and the lifting / lowering table 28. For this reason, the panel In addition to the vertical movement, the support base 1 can be tilted and moved within a very small angle range as shown by an arrow D in FIG. 5 and an arrow E in FIG.
なお、 第 2 図においてパネル支持台 1 の表面には空気吸引用開口 5 4が外部へ向けて開けられ、 その開口 5 4 から延びる空気通路 5 3 がパネル支持台 1 の内部に形成されている。 この空気通路 5 3 に は吸気装置 5 5 が接続されてお り、 この吸気装置 5 5 が作動する と 開口 5 4 を通して外部空気が吸引される。 この空気吸引によ り、 ノ ネル支持台 1 の上に載せられた液晶パネル 2 がしつか り と吸着保持 される。  In FIG. 2, an air suction opening 54 is opened on the surface of the panel support 1 toward the outside, and an air passage 53 extending from the opening 54 is formed inside the panel support 1. . An air intake device 55 is connected to the air passage 53. When the air intake device 55 is operated, external air is sucked through the opening 54. By this air suction, the liquid crystal panel 2 placed on the non-nel support 1 is held by suction.
第 1 図に戻って、 圧着作業ステージ 1 1 においてべ一ス 1 4の上 に複数個、 本実施形態では 5個のパネル受け台 4 がガイ ド レール 2 2 と平行に並べて配置されている。 また、 支柱 4 2 によって天板 4 3 が支持され、 その天板 4 3 から垂下するよう に 5個の圧着へッ ド 8 が設けられる。 これらの圧着ヘッ ド 8は、 個々のパネル受け台 4 の上方位置に正確に位置決めされている。 天板 4 3 の上部位置には、 個々の圧着へッ ド 8 に対応してエアシ リ ンダ 4 4 が配設される。 圧 着へッ ド 8はこれらのエアシ リ ンダ 4 4 によって駆動されて、 第 5 図に矢印 F— F ， で示すよう に上下方向へ昇降移動する。 また、 各 圧着ヘッ ド 8 の内部にはヒータ （図示せず） が内蔵され、 それらの ヒータによって個々の圧着へッ ド 8 が所定の温度に加熱される。 第 1 図において、 天板 4 3の左右の側端部にテープ巻取り リール 4 6 a及び 4 6 bが固定設置されている。 これらの リールには、 フ ッ素樹脂、 例えばテフロ ン （商品名） 製のテープ 4 7 が掛け渡され ている。 このフ ッ素樹脂フ ィ ルムテープ 4 7は、 第 2 図に示すよ う に、 圧着ヘッ ド 8の下方位置に張り 出 している。 圧着ヘッ ド 8 がェ ァシ リ ンダ 4 4 によって駆動されて下方へ移動する と き、 フ ヅ素樹 脂フ ィ ルムテープ 4 7はその圧着へッ ド 8 によって押し下げられて、 リール 4 6 a及び 4 6 bから繰り 出されながら下方へ移動する。 本実施形態において、 5個のパネル受け台 4及びそれに対応する 5個の圧着へッ ド 8 に関しては、 温度調節や位置調節をそれそれ別 個独立に行う こ とができる。 従って、 個々の圧着ヘッ ド 8 は、 他の 圧着へッ ドに左右されるこ とな く、 それそれに最良の圧着条件で圧 着処理を行う こ とができる。 Returning to FIG. 1, on the crimping work stage 11, a plurality of panel supports 4, in this embodiment, five panel supports 4 are arranged in parallel with the guide rails 22 on the base 14. Further, the top plate 4 3 is supported by the columns 42, and five crimping heads 8 are provided so as to hang down from the top plate 4 3. These crimping heads 8 are accurately positioned above the individual panel supports 4. At the upper position of the top plate 43, air cylinders 44 are arranged corresponding to the individual crimp heads 8. The compression head 8 is driven by these air cylinders 44, and moves up and down as shown by arrows FF in FIG. Further, heaters (not shown) are built in each crimping head 8, and each crimping head 8 is heated to a predetermined temperature by the heater. In FIG. 1, tape take-up reels 46a and 46b are fixedly installed at left and right side ends of a top plate 43. Tapes 47 made of fluororesin, for example, Teflon (trade name) are wound around these reels. The fluororesin film tape 47 protrudes below the crimping head 8 as shown in FIG. When the crimp head 8 is moved downward by being driven by the oil cylinder 44, the resin film tape 47 is pushed down by the crimp head 8 and the reels 46a and 4 It moves downward while being fed from 6 b. In the present embodiment, with respect to the five panel supports 4 and the five crimping heads 8 corresponding thereto, the temperature adjustment and the position adjustment can be performed independently. Therefore, the individual crimping heads 8 can perform the crimping process under the best crimping conditions without being influenced by other crimping heads.
以下、 上記構成よ り成る圧着装置に関してその動作を説明する。 なお、 本実施形態では、 第 6図に示すような C 0 G ( C h i 〇 n G 1 a s s ) 方式の液晶パネル 2 を圧着作業の作業対象とする。 この液晶パネル 2 は、 第 7 図に示すよう に、 ガラス製の第 1 透明基 板 3 a と同じ く ガラス製の第 2透明基板 3 b とをスぺーサ 9 を間に 挟んでシール材 7 によって互いに接合し、 それらの基板間に形成さ れるセルギヤ ッ ブ G内に液晶 5 を封入するこ とによって形成される。 液晶パネル 2 のう ち液晶 5 が封入されている部分が液晶パネルの本 体部分である。  Hereinafter, the operation of the crimping device having the above configuration will be described. In the present embodiment, the C0G (Chi〇nG1ass) liquid crystal panel 2 as shown in FIG. As shown in FIG. 7, this liquid crystal panel 2 is made of a sealing material 7 with a glass 9 second transparent substrate 3b and a spacer 9 interposed therebetween as well as a glass first transparent substrate 3a. Are formed by sealing the liquid crystal 5 in a cell gear G formed between the substrates. The part of the liquid crystal panel 2 in which the liquid crystal 5 is sealed is the main part of the liquid crystal panel.
第 1 透明基板 3 aの内側表面には第 1 透明電極 1 0 aが形成され、 また、 第 2透明基板 3 bの内側表面には第 2透明電極 1 0 bが形成 される。 そ して、 これらの透明電極につながる電極端子 4 8 が第 1 透明基板 3 aの張出 し部分 3 c上に形成される。 また、 この基板張 出 し部分 3 cの端部には、 外部回路を導電接続するための接続端子 4 9 が形成される。 また、 各透明基板 3 a及び 3 bの外側表面には、 それそれ、 偏光板 5 1 a及び 5 1 bが貼着される。  A first transparent electrode 10a is formed on the inner surface of the first transparent substrate 3a, and a second transparent electrode 10b is formed on the inner surface of the second transparent substrate 3b. Then, electrode terminals 48 connected to these transparent electrodes are formed on the protruding portion 3c of the first transparent substrate 3a. A connection terminal 49 for conductively connecting an external circuit is formed at an end of the substrate extension 3c. Further, polarizing plates 51a and 51b are attached to the outer surfaces of the transparent substrates 3a and 3b, respectively.
この液晶パネル 2 に液晶駆動用 I C 1 5 を装着する際には、 第 6 図に示すよう に、 まず初めに、 基板 3 aの張出し部分 3 c上の所定 位置に A C F 6 を貼着し、 さ らにその A C F 6 の上に液晶駆動用 I C 1 5 を載せ、 さ らにその液晶駆動用 I C 1 5 を所定温度に加熱し ながら同時に基板張出 し部 3 c に押し付ける。 この加熱圧着処理に よ り、 A C F 6 の樹脂部分によつて液晶駆動用 I C 1 5 と基板張出 し部 3 c とが互いに固着し、 それと同時に樹脂内に分散した導電粒 子によって液晶駆動用 I C 1 5 の入出力用のバンプが、 それそれ、 外部接続端子 4 9及び基板上電極端子 4 8 に導電接続する。 When the liquid crystal driving IC 15 is mounted on the liquid crystal panel 2, first, as shown in FIG. 6, ACF 6 is attached to a predetermined position on the overhanging portion 3c of the substrate 3a. Further, the liquid crystal driving IC 15 is placed on the ACF 6, and the liquid crystal driving IC 15 is heated to a predetermined temperature and simultaneously pressed against the substrate extension 3c. Due to this heat-compression bonding, the liquid crystal driving IC 15 and the substrate overhanging portion 3c are fixed to each other by the resin portion of the ACF 6, and at the same time, the liquid crystal driving IC is dispersed by the conductive particles dispersed in the resin. The input and output bumps of IC 15 Conductively connect to the external connection terminal 49 and the electrode terminal 48 on the board.
本実施形態の圧着装置は、 A C F 6及び液晶駆動用 I C 1 5 が基 板張出し部 3 Cの所定位置に仮接着されている液晶パネル 2 に関 し て、 液晶駆動用 I C 1 5 を A C F 6 によって正式に圧着、 すなわち 本圧着する という作業を実行するものであ り、 以下、 その本圧着作 業を説明する。  The crimping apparatus according to the present embodiment is configured such that, for the liquid crystal panel 2 on which the ACF 6 and the liquid crystal driving IC 15 are temporarily bonded at predetermined positions of the substrate overhang portion 3C, the liquid crystal driving IC 15 The formal crimping, that is, the actual crimping operation, is performed, and the main crimping work will be described below.
第 1 図において、 左側パネル装填ステージ 1 2 に左側テーブルュ ニヅ ト 2 3 をセ ッ トする。 このとき、 ロ ッ ク用エアシ リ ンダ 3 7 の 出力軸は第 2 図に示すよう に伸張移動していて、 その先端のロ ッ ク 片 3 9 がパネル支持台 1 の V溝ブロ ッ ク 3 6 に嵌合し、 その結果、 パネル支持台 1 は移動不能なロ ッ ク状態になっている。 また、 スラ ィ ドテ一ブル 2 6上のエアシ リ ンダ 2 9 は伸張状態にあって昇降テ —ブル 2 8 を上方位置にセ ヅ ト している。  In FIG. 1, the left table unit 23 is set on the left panel loading stage 12. At this time, the output shaft of the locking air cylinder 37 is extended as shown in FIG. 2, and the locking piece 39 at the end of the output shaft is connected to the V-groove block 3 of the panel support 1. 6, and as a result, the panel support 1 is in an immovable locked state. In addition, the air cylinder 29 on the slide table 26 is in an extended state, and the lift table 28 is set to the upper position.
次いで、 第 1 図において、 左側テーブルユニッ ト 2 3 内の個々の パネル支持台 1 の上に作業対象である液晶パネル 2 を載せ、 空気吸 引によって吸着固定する。 この液晶パネル 2 には、 A C F 6及び液 晶駆動用 I C 1 5 が所定の位置に仮接着されている。 液晶パネル 2 をパネル支持台 1 上に載せる と きには、 第 3 図に示すよ う に、 液晶 パネル 2 の側端をガイ ドビン 4 1 に押し当て、 さ らにその前端をガ イ ドパネル 1 8 に押し当てる。 これによ り、 液晶パネル 2 をパネル 支持台 1 上の一定位置に位置決めする。 なお、 ガイ ドパネル 1 8 の 位置は、 第 1 図において、 前後調節ツマ ミ 1 9及び角度調節ツマ ミ 2 1 の両方又は一方を適宜に回すこ とによって希望の位置に調節で きる。  Next, in FIG. 1, the liquid crystal panel 2 to be worked is placed on each panel support 1 in the left table unit 23, and is fixed by suction by air suction. On this liquid crystal panel 2, the ACF 6 and the liquid crystal driving IC 15 are temporarily bonded at predetermined positions. When placing the liquid crystal panel 2 on the panel support 1, as shown in FIG. 3, the side edge of the liquid crystal panel 2 is pressed against the guide bin 41, and the front end is further guided to the guide panel 1. 8 As a result, the liquid crystal panel 2 is positioned at a fixed position on the panel support 1. Note that the position of the guide panel 18 can be adjusted to a desired position by appropriately turning both or one of the front / rear adjustment knob 19 and the angle adjustment knob 21 in FIG.
以上の作業の終了後、 所定のスター トスィ ッチを操作する とテー ブル駆動用の直線駆動装置 （図示せず） が作動して左側テーブルュ ニッ ト 2 3 がガイ ド レール 2 2 に沿って移動して圧着作業ステージ 1 1 へと運ばれる。 このと き、 右側テーブルユニッ ト 2 4は圧着作 業ステージ 1 1 から右側パネル装填ステージ 1 3へと運ばれる。 左 側テ一ブルュニヅ ト 2 3 が圧着作業ステージ 1 1 へ運ばれてそこに 停止したと き、 第 2 図において、 パネル支持台 1 上の液晶パネル 2 の基板張出 し部 3 cは、 パネル受け台 4 から適宜の間隔をおいた上 方位置に配置される。 After the above operation, when the specified start switch is operated, the linear drive unit (not shown) for driving the table is activated, and the left table unit 23 moves along the guide rail 22. Then, it is transported to the crimping work stage 11. At this time, the right table unit 24 is carried from the crimping work stage 11 to the right panel loading stage 13. left When the side table 23 is carried to the crimping work stage 11 and stopped there, in FIG. 2, the overhang 3 c of the liquid crystal panel 2 on the panel support 1 is provided with a panel support. It is located at an appropriate distance from the platform 4 at an upper position.
次いで、 第 5 図に示すよう に、 ロ ック用エアシ リ ンダ 3 7 が作動 してロ ッ ク片 3 9 が V溝ブロ ッ ク 3 6 から外れてパネル支持台 1 の 口 ヅ クが解除され、 そ して、 昇降用エアシ リ ンダ 2 9 が作動してそ の出力軸が引込み移動する。 する と、 パネル支持台 1 を上方へ押 し 上げていた力が解除されるのでそのパネル支持台 1 は第 5 図に矢印 Gで示すよう に下降し、 液晶パネル 2 の基板張出し部 3 cの底面が パネル受け台 4の上端に接触又は近接する位置で停止する。 液晶パ ネル 2 をパネル受け台 4 に接触した状態で停止させるか、 あるいは、 近接すなわち少し浮いた状態で停止させるかに関しては、 機能的に 見ればどち らであっても支障はない。 但し、 いずれの状態に設定さ せるかに関しては、 第 4図において、 調整ネジ 3 4 を回 してバラ ン ススプリ ング 3 3 の長さを変化させるこ とによって調整できる。 その後、 圧着へッ ド 8 がフ ッ素傾樹脂フ ィルムテープ 4 7 を伴つ て矢印 Fのよう に降下して液晶パネル 2上の液晶駆動用 I C 1 5 の 上面に当た り、 さ らにそれを所定の圧力でパネル受け台 4 に押し付 ける。 これによ り、 液晶駆動用 I C 1 5 と液晶パネル 2 の基板張出 し部 3 c との間に介在する A C F 6 が加熱及び加圧され、 その結果、 液晶駆動用 I C 1 5が基板張出し部 3 c に接着される。 こ う して、 液晶駆動用 I C 1 5 の本圧着が完了する。 圧着へッ ド 8 と液晶駆動 用 I C 1 5 との間にフ ッ素傾樹脂フ イ ルムテープ 4 7 を介在させる のは、 圧着へッ ド 8 が接着用 I C 1 5 に直接に接触するのを回避す るためである。  Next, as shown in FIG. 5, the locking air cylinder 37 operates to release the locking piece 39 from the V-groove block 36, releasing the opening of the panel support base 1. Then, the elevating and lowering air cylinder 29 is operated and its output shaft is retracted. Then, the force pushing up the panel support 1 is released, and the panel support 1 descends as shown by the arrow G in FIG. 5, and the substrate overhang 3 c of the liquid crystal panel 2 is moved downward. Stop when the bottom touches or approaches the upper end of panel support 4. Regarding whether to stop the liquid crystal panel 2 in contact with the panel support 4 or in the proximity, that is, in a slightly floating state, there is no problem in terms of function. However, which state is to be set can be adjusted by turning the adjustment screw 34 in FIG. 4 to change the length of the balance spring 33. Then, the crimping head 8 descends along with the fluorine-inclined resin film tape 47 as shown by the arrow F, and hits the upper surface of the liquid crystal driving IC 15 on the liquid crystal panel 2, and further. It is pressed against the panel support 4 with a predetermined pressure. As a result, the ACF 6 interposed between the liquid crystal driving IC 15 and the substrate overhang portion 3c of the liquid crystal panel 2 is heated and pressurized. As a result, the liquid crystal driving IC 15 extends over the substrate. Glued to part 3c. In this way, the final pressure bonding of the liquid crystal drive IC 15 is completed. The reason that the fluorine-inclined resin film tape 47 is interposed between the crimping head 8 and the liquid crystal driving IC 15 is that the crimping head 8 directly contacts the bonding IC 15. This is to avoid it.
この本圧着作業のと き、 パネル支持台 1 はバラ ンススプリ ング 3 3 の弾性反力力によってほぼ空間中に浮いた状態で支持されて自 由 に上下方向へ移動できるので、 液晶パネル 2 は常に水平状態を保持 した状態で圧着ヘッ ド 8 によって押圧される。 この結果、 液晶駆動 用 I C 1 5はバラツキな く 安定して強固に液晶パネル 2 の基板上に 導電接着される。 また、 本実施形態では、 第 4図に矢印 Eで示し、 さ らに第 5 図に矢印 Dで示すよう に、 パネル支持台 1 をわずかに傾 斜移動できるよう にしたので、 液晶パネル 2 に対する液晶駆動用 I C 1 5の仮接着状態にバラツキがある場合でも、 圧着ヘッ ド 8 によ つて液晶駆動用 I C 1 5 の表面全域を均一に押圧できる。 During this final crimping work, the panel support 1 is supported in a substantially floating state by the elastic reaction force of the balance spring 33 and can move freely in the vertical direction. Hold horizontal It is pressed by the crimping head 8 in the pressed state. As a result, the liquid crystal driving IC 15 is stably and strongly adhered to the substrate of the liquid crystal panel 2 without variation. Further, in the present embodiment, as shown by an arrow E in FIG. 4 and by an arrow D in FIG. 5, the panel support 1 can be slightly tilted and moved. Even if the temporary bonding state of the liquid crystal driving IC 15 varies, the pressure bonding head 8 can uniformly press the entire surface of the liquid crystal driving IC 15.
以上によ り液晶駆動用 I C 1 5 の液晶パネル 2への本圧着作業が 完了する と、 第 5 図において、 圧着ヘッ ド 8 が矢印 F ， のよう に上 昇し、 さ らにエアシ リ ンダ 2 9 が作動してその出力軸が伸張移動す る。 この伸張移動によ り、 昇降テーブル 2 8 が上昇してパネル支持 台 1 が第 2 図に示す上方位置へ戻される。 その後、 第 1 図に置いて 左側テーブルュニッ ト 2 3 が圧着作業テーブル 1 1 から再び左側パ ネル装填ステージ 1 2へ戻され、 そ して圧着作業を終了した液晶パ ネル 2 がパネル支持台 1 から回収される。  When the liquid crystal driving IC 15 is completely bonded to the liquid crystal panel 2 as described above, the pressure bonding head 8 is moved up as shown by the arrow F in FIG. 29 is activated and its output shaft is extended. By this extension movement, the lifting table 28 is raised, and the panel support 1 is returned to the upper position shown in FIG. Then, the left table unit 23 in Fig. 1 is returned from the crimping work table 11 to the left panel loading stage 12 again, and the liquid crystal panel 2 that has completed the crimping work is moved from the panel support 1 to the left panel unit 2. Collected.
左側テーブルュニッ ト 2 3 が圧着作業ステージ 1 1 にセ ッ ト され て上述した本圧着作業が実行されている間、 オペレータは、 右側パ ネル装填ステージ 1 3 に置かれた右側テ一ブルュニッ ト 2 4 に対し て未処理の液晶パネル 2 の装填作業を行う。 圧着作業ステージ 1 1 にセ ッ ト された左側テーブルュニッ ト 2 3 に対しての圧着作業が完 了 してその左側テ一ブルュニッ ト 2 3 が左側パネル装填ステージ 1 2へ戻されたとき、 右側テ一ブルュニッ ト 2 4は自動的に圧着作業 ステージ 1 1 へ持ち運ばれ、 そ して本圧着作業を受ける。 こ う して、 左側テ一ブルュニッ ト 2 3及び右側テ一ブルュニッ ト 2 4 に対して 交互に本圧着作業が行われる。  While the left table unit 23 is set on the crimping work stage 11 and the above-described final crimping operation is performed, the operator operates the right table unit 24 placed on the right panel loading stage 13. Then, load the unprocessed liquid crystal panel 2. When the crimping work on the left table unit 23 set on the crimping work stage 11 is completed and the left table unit 23 is returned to the left panel loading stage 12, the right table unit The brunit 24 is automatically carried to the crimping stage 11 and subjected to the final crimping operation. In this way, the final crimping work is performed alternately on the left table brunet 23 and the right table brunet 24.
以上、 好ま しい実施形態を挙げて本発明を説明したが、 本発明は その実施形態に限定されるものではな く 、 請求の範囲に記載した技 術的範囲内で種々に改変できる。  As described above, the present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and can be variously modified within the technical scope described in the claims.
例えば、 上記の実施形態では、 第 6 図に示した C 0 G方式の液晶 パネルに対して本発明を適用 した。 つま り、 液晶パネルに圧着すベ き電子部品と して液晶駆動用 I Cそれ自体を考えた。 しかしながら、 液晶パネルにヒー ト シ一ルゃ T C P といったその他の電子部品を導 電接続する場合にも本発明を適用できるこ とはもちろんである。 こ れらの場合には、 圧着へヅ ド 8 によってヒー ト シールや T C P等を 押圧するこ とになる。 For example, in the above embodiment, the C 0 G type liquid crystal shown in FIG. The present invention was applied to the panel. In other words, we considered the liquid crystal drive IC itself as an electronic component to be crimped to the liquid crystal panel. However, it goes without saying that the present invention can be applied to the case where another electronic component such as a heat shield TCP is electrically connected to the liquid crystal panel. In these cases, the heat seal, the TCP, and the like are pressed by the pressure bonding head 8.
また、 各テーブルュニッ ト 2 3， 2 4 に準備するパネル支持台 1 の数は 5個に限られず、 よ り少な く 又はよ り多 く 、 場合によっては 1 個とするこ ともできる。 また、 2個のテーブルユニッ ト を交互に 圧着作業ステージ 1 1 に持ち運んで圧着作業を連続して行う という 構造以外に、 1 個のテーブルユニッ ト を固定設置しておいて、 その テ一ブルユニッ トだけを用いて圧着作業を行う こ ともできる。 産業上の利用可能性  Further, the number of panel supports 1 prepared for each table unit 23, 24 is not limited to five, but may be smaller or larger, and may be one in some cases. In addition to the structure in which two table units are alternately carried to the crimping work stage 11 and crimping work is performed continuously, one table unit is fixedly installed and the table unit is installed. The crimping work can be performed using only Industrial applicability
以上述べたよう に、 本発明は、 簡単な構造によ り、 液晶駆動用 I c、 ヒー ト シール等の電子部品の表面全域を液晶パネルに対して 均一に押圧してむらな く接着するのに好適な、 圧着装置を提供する こ とができるものである。  As described above, according to the present invention, with a simple structure, the entire surface of an electronic component such as a liquid crystal driving IC and a heat seal can be uniformly pressed against a liquid crystal panel by uniformly pressing the same. It is possible to provide a crimping device suitable for the above.

Claims

請 求 の 範 囲 The scope of the claims
1 . 本体部分及び基板張出し部を有する液晶パネルの基板張 出し部に電子部品を圧力下で接着する圧着装置において、  1. A pressure bonding device for bonding an electronic component to a substrate overhang of a liquid crystal panel having a main body portion and a substrate overhang under pressure.
液晶パネルの本体部分を支持するパネル支持台と、  A panel support for supporting the main body of the liquid crystal panel,
液晶パネルの基板張出し部を支持するパネル受け台と  A panel support for supporting the substrate overhang of the liquid crystal panel
パネル受け台に対向して配置されていてパネル受け台に近づく方 向及びそれから離れる方向へ移動可能な圧着ヘッ ドとを有しており、 上記パネル支持台は、 圧着へッ ドの移動方向と同じ方向へ平行移 動可能であると共に反力付与手段によって支持される  It has a crimping head that is arranged to face the panel support and is movable toward and away from the panel support. Can be translated in the same direction and supported by the reaction force applying means
ことを特徴とする液晶パネルの圧着装置。 A liquid crystal panel crimping device, characterized in that:
2 . 請求の範囲第 1項記載の圧着装置において、 パネル支持 台は傾き移動可能であることを特徴とする液晶パネルの圧着装置。  2. The liquid crystal panel crimping apparatus according to claim 1, wherein the panel support is tiltable and movable.
3 . 請求の範囲第 1項又は第 2項記載の液晶パネルの圧着装 置において、 電子部品は、 配線パターンが形成されたフレキシブル ブリ ン ト板に液晶駆動用 I Cを実装したテ一プキャ リアパッケージ であることを特徴とする液晶パネルの圧着装置。  3. The liquid crystal panel crimping apparatus according to claim 1 or 2, wherein the electronic component is a tape carrier package in which a liquid crystal driving IC is mounted on a flexible printed circuit board on which a wiring pattern is formed. A liquid crystal panel crimping apparatus, characterized in that:
4 . 請求の範囲第 1項又は第 2項記載の液晶パネルの圧着装 置において、 電子部品は、 液晶駆動用 I Cであることを特徴とする 液晶パネルの圧着装置。  4. The liquid crystal panel crimping apparatus according to claim 1, wherein the electronic component is a liquid crystal driving IC.
5 . 液晶パネルの本体部分をパネル支持台上に置き、 液晶パネルの基板張出し部をパネル受け台上に置き、  5. Place the main body of the LCD panel on the panel support, and place the overhang of the LCD panel on the panel support.
基板張出し部の上に接着用部材を挟んで電子部品を置き、 圧着ヘッ ドによって電子部品をパネル受け台方向へ押圧する ことによって電子部品を液晶パネルの基板張出し部へ接着する圧着 工程を有する液晶装置の製造方法において、  A liquid crystal having a crimping process in which an electronic component is placed on an overhang portion of a substrate with an adhesive member interposed therebetween, and the electronic component is pressed toward the panel receiving pedestal by a crimping head to bond the electronic component to the overhang portion of the liquid crystal panel. In the method of manufacturing the device,
上記パネル支持台は、 圧着へッ ドの移動方向と同じ方向へ平行移 動可能であると共に反力付与手段によって支持されることを特徴と する液晶装置の製造方法。  A method of manufacturing a liquid crystal device, characterized in that the panel support is movable in parallel in the same direction as the direction of movement of the crimp head and is supported by a reaction force applying means.
PCT/JP1997/003577 1996-10-04 1997-10-06 Apparatus for press-bonding liquid crystal panel and method of production of liquid crystal device WO1998014821A1 (en)

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