JPH10111484A - Press bonding device of liquid crystal panel, and production of liquid crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure bonding device which is capable of evenly adhering electronic parts, such as IC for driving liquid crystals and heat seals, to a liquid crystal panel by pressing the entire area of the surfaces of these parts to the panel with a simple structure. SOLUTION: A panel supporting base 1 is fixed to the top end of a lifting rod 32 freely vertically movably erected on a table 28. This panel supporting base 1 is supported by a spring 33 and the liquid crystal panel 2 is placed thereon. The liquid crystal panel 2 balances and stops in the position where the overhanging part 3c of a transparent substrate comes into contact or proximity with the top end of a panel receiving base 4. The IC 15 temporally adhered onto the substrate 3c is pressed and adhered to the substrate 3c by a descending press bonding head 8. Since the panel supporting base 1 is supported by the spring 33, the base is freely movable in follow up to the movement of the press bonding head 8. The IC 15 is thereby stably pressed to the liquid crystal panel 2 in always the constant state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal panel, comprising: an electrode terminal formed on a transparent substrate of a liquid crystal panel;
TECHNICAL FIELD The present invention relates to a pressure bonding device for bonding electronic components such as the above, and a method for manufacturing a liquid crystal device using the pressure bonding device.

[0002]

2. Description of the Related Art Generally, a liquid crystal panel is formed by sealing liquid crystal in a cell gap formed between a pair of opposing transparent substrates. In order to display visible information such as characters, numbers, and patterns on the liquid crystal panel, it is necessary to electrically connect a plurality of electrodes formed on a pair of transparent substrates to a liquid crystal driving IC. As a specific method of the conductive connection, various methods have been conventionally known.

For example, first, ACF (Anisotropic c)
There is a method of directly bonding a liquid crystal driving IC on a transparent substrate of a liquid crystal panel using a bonding member such as an onductive film (anisotropic conductive film). According to this method, so-called COG
(Chip On Glass) liquid crystal panel is manufactured.

Second, TCP (Tape Carrier Packa)
ge: tape carrier package) in the form of a liquid crystal drive IC
Is electrically connected to a liquid crystal panel. This TCP is, as is well known, an FP on which a wiring pattern is formed.
A liquid crystal driving IC is mounted on a C (Flexible Printed Circuit) using a TAB (Tape Automated Bonding) technique. In this case, the TCP is conductively connected to the transparent substrate of the liquid crystal panel via an ACF, a heat seal, or the like.

Third, a PCB (Print Circuit Boa)
(rd: printed circuit board)
There is a method of electrically connecting the PCB to a liquid crystal panel using heat sealing.

As described above, the liquid crystal driving I / O
When C is conductively connected, the liquid crystal driving IC itself
Various electronic components such as TCP and heat seal are connected on the transparent substrate of the liquid crystal panel. Considering the case where the FPC, which is a component of TCP, is connected to a liquid crystal panel using an ACF, conventionally, a crimping process is performed using a crimping device as shown in FIG.

That is, the main body of the liquid crystal panel 52 is placed on the panel supporting base 51, and the overhang of the transparent substrate 53 a of the liquid crystal panel 52 is placed on the panel receiving base 54. Then, the ACF is placed on the overhanging portion of the transparent substrate 53a.
56, and an FPC 57 is temporarily bonded thereon. Then, the FPC 57 is adhered onto the substrate 53a by lowering the pressure bonding head 58 heated to a predetermined temperature and pressing the FPC 57 against a protruding portion of the transparent substrate 53a with a predetermined pressure.

In this conventional crimping apparatus, if the height of the panel support 51 and the height of the panel support 54 are set to exactly match the shape of the liquid crystal panel 52, the crimping head 58 will make the height uniform. Crimping treatment can be performed. However, when the panel support 51 is higher than the predetermined position, as shown in FIG.
The overhanging portions of the PC 57 and the substrate 53a cannot be pressed uniformly. If the panel support 51 is lower than the predetermined position, the liquid crystal panel 52 rises as shown in FIG.

As a conventional crimping device, for example, Japanese Patent Application Laid-Open No. 4-70816 or Japanese Patent Application Laid-Open No. 5-341303
There is an apparatus disclosed in Japanese Unexamined Patent Publication (Kokai) Publication. JP-A-4-70816
Japanese Patent Application Laid-Open Publication No. H11-163873 discloses a structure for conductively connecting a carrier tape including an IC chip on a transparent substrate of a liquid crystal panel, and supports a pressure bonding head for pressing the carrier tape against the transparent substrate by an elastic swinging mechanism. The structure is disclosed.

Japanese Unexamined Patent Publication No. Hei 5-341303 discloses a structure for electrically connecting a liquid crystal driving IC as a TAB component on a substrate of a liquid crystal panel, wherein the liquid crystal panel is placed on a support table. There is disclosed a structure in which a liquid crystal driving IC is pressed against a substrate by a pressure bonding block. In this structure, a constant pressure can be instantaneously applied to the liquid crystal driving IC by driving the pressure bonding block using two pressing cylinders.

[0011]

Problems to be Solved by the Invention Japanese Patent Laid-Open No. 4-70816
In the crimping device disclosed in Japanese Patent Application Laid-Open Publication No. H11-157, a support base for supporting the main body of the liquid crystal panel is fixedly installed, and a backup jig corresponding to the above-mentioned panel support can be moved up and down. However, arranging the backup jig so that it can be moved up and down complicates the structure, increases the cost, and also makes the bonding state between the transparent substrate of the liquid crystal panel and the electronic components such as the FPC unstable. Can be considered.

On the other hand, in the crimping apparatus disclosed in Japanese Patent Application Laid-Open No. Hei 5-341303, the support table for supporting the liquid crystal panel can be moved in the left and right direction to transport the liquid crystal panel, but can be moved in the vertical direction. You cannot move to. Therefore, it includes the above-described problems described with reference to FIGS.

The present invention has been made in view of the above-mentioned problems, and has a simple structure in which the entire surface of an electronic component such as a liquid crystal driving IC or a heat seal is uniformly pressed against a liquid crystal panel. It is an object of the present invention to provide a pressure bonding device capable of bonding evenly.

[0014]

According to the present invention, there is provided a pressure-bonding apparatus for a liquid crystal panel, comprising: A panel support for supporting the main body, a panel support for supporting the substrate overhang of the liquid crystal panel, and a crimp that is arranged to face the panel support and is movable in a direction approaching and away from the panel support. And a head. The panel support is movable in parallel in the same direction as the moving direction of the pressure bonding head, and is supported by a reaction force applying means.

[0015] In the above configuration, the reaction force applying means can be constituted by using an elastic force of a spring or the like, pneumatic pressure, hydraulic pressure or the like as a reaction force source. In the above configuration, the electronic components to be bonded to the liquid crystal panel may be a liquid crystal driving IC itself, a heat seal, a TCP (Tape Carrier Package), or the like. When the liquid crystal driving IC itself is directly adhered to the transparent substrate of the liquid crystal panel, that is, when COG (Chi
In the case of manufacturing a p-on-glass type liquid crystal panel, an adhesive member such as an ACF is interposed between a liquid crystal driving IC and a transparent substrate to bond them. The situation where the heat seal is bonded to the transparent substrate is a situation that occurs when a PCB on which a liquid crystal driving IC is mounted is connected to the transparent substrate via the heat seal. Further, when the TCP is bonded to the transparent substrate, AC is applied between the TCP and the transparent substrate.
An adhesive member such as F or a heat seal is interposed.

According to the pressure bonding apparatus of the present invention, the panel supporting base supporting the main body of the liquid crystal panel is held in a so-called floating state by the reaction force applying means, so that the liquid crystal panel follows the movement of the pressure bonding head. Can move freely,
Therefore, the pressure bonding process can be performed while the liquid crystal panel is always placed horizontally, and the entire area of the electronic component such as the liquid crystal driving IC can be pressed with a uniform pressure.

Further, since the panel support is made to have a movable structure, the panel support for supporting the overhanging portion of the substrate of the liquid crystal panel can be fixedly arranged, so that the portion corresponding to the panel support can be moved up and down. The pressing force applied between the substrate and the electronic component can be stably maintained at a constant level as compared with the conventional crimping device. As a result, the liquid crystal panel and the electronic component can be stably and firmly bonded without variation.
Further, since a driving device for vertically moving the panel support is not required, the structure is simplified, and the cost can be reduced. The panel support is movably arranged under the action of the reaction force applying means, but since this reaction force applying means does not include a special driving device, the structure can be complicated and the cost can be increased. Absent.

The panel support moves in the same direction as the moving direction of the pressure bonding head as described above.
In addition, the panel support can be arranged to be tiltable and movable in a relatively small angle range. In this case, even when the electronic component is temporarily bonded to the liquid crystal panel, the entire surface of the electronic component can be uniformly pressed by the pressure bonding head.

Further, in the method of manufacturing a liquid crystal panel according to the present invention, there are provided (1) a step of placing a main body of the liquid crystal panel on a panel support, and (2) a step of placing a substrate overhang of the liquid crystal panel on a panel receiving stand. A step of (3) placing an electronic component on the substrate overhang with an adhesive member interposed therebetween; and (4) pressing the electronic component toward a panel receiving base by a crimping head, thereby converting the electronic component to a substrate of a liquid crystal panel. A method of manufacturing a liquid crystal panel having a step of bonding to an overhang portion,
The panel support is movable in parallel in the same direction as the moving direction of the pressure bonding head, and is supported by a reaction force applying means such as a spring.

[0020]

FIG. 1 shows an embodiment of a liquid crystal panel crimping apparatus according to the present invention. This crimping apparatus has a crimping work stage 11, a left panel loading stage 12, and a right panel loading stage 13. In both of the left panel loading stage 12 and the right panel loading stage 13, a panel positioning unit 16 is disposed on the base. These panel positioning units 16 can rotate around the vertical axis X as shown by the arrow A and can also translate in the front-rear direction as shown by the arrow B in FIG.
7 and a guide panel 18 fixed to the upper end of the support frame 17 and elongated in the lateral direction. The support frame 17 and the guide panel 18 supported by the support frame 17 are rotated by turning the front / rear adjustment knob 19 in either the forward or reverse direction.
Can be translated in the direction of arrow B. Further, by selecting and turning one of the pair of left and right angle adjustment knobs 21, the support frame 17 and the guide panel 18 supported by the support frame 17 can be rotated about the vertical axis X.

A linear guide rail 22 is provided on the base 14 over three stages of a left panel loading stage 12, a crimping work stage 11, and a right panel loading stage 13. A left table unit 23 and a right table unit 24 are slidably mounted on the guide rail 22. As shown in FIG. 2, these table units 23 and 24 are respectively slidably mounted on a guide rail 22, and guided by a guide rod 27 erected on the slide table 26 to move up and down. A lifting table 28 that moves. Lifting table 28
Is driven by an air cylinder 29 disposed on the slide table 26 to move up and down as indicated by an arrow C.

Returning to FIG. 1, the left table unit 23
The slide table 26 and the slide table 26 of the right side table unit 24 are connected to each other by a connection plate 31. Also, the left table unit 2
A linear drive (not shown) is connected to either the third table unit 24 or the right table unit 24, and driven by the linear drive unit, the left table unit 23 and the right table unit 24 are integrated on the guide rail 22. Move left and right. Although this linear drive device can be configured by any structure, for example, it can be configured by using a feed screw.

FIG. 1 shows a state in which the left table unit 23 is located on the left panel loading stage 12 and the right table unit 24 is located on the crimping work stage 11. When the left table unit 23 is carried to the crimping work stage 11 by being driven by the linear drive device, the right table unit 2 is correspondingly moved.
4 is automatically carried to the right panel loading stage 13.

Each of the left table unit 23 and the right table unit 24 is provided with a plurality of, in this embodiment, five, panel supports 1. As shown in FIG. 2, these panel supports 1 are fixed to the upper end of an elevating rod 32 movably supported by an elevating table 28. As shown in FIG. 4, two lifting rods 32 are provided in a lateral direction with respect to one panel support table 1, and a balance spring 33 is provided between the lifting rods 32. The balance spring 33 is disposed between the adjusting screw 34 which is screw-fitted to the panel support 1 and the lifting table 28. On the upper surface of the panel support 1, a guide pin 41 for positioning the liquid crystal panel 2 to be worked from the side is fixed.

In FIG. 2, a V-groove block 36 is provided at the rear end (left end in the figure) of the panel support 1 and a locking air cylinder 37 supported by a bracket 38 extending from the rear end of the lifting table 28. Is the V-groove block 36
Are disposed opposite to each other. The lock piece 39 formed at the tip of the output shaft of the locking air cylinder 37, when the air cylinder 37 operates and the output shaft extends, as shown in FIG. Fit. As a result, the panel support 1 is fixedly held, that is, locked so as not to move in any of the vertical, horizontal, and horizontal directions.

On the other hand, when the output shaft of the air cylinder 37 retracts, the lock piece 39 comes off the V-groove of the V-groove block 36 as shown in FIG. Then, the panel support 1
Is unlocked, and the panel support 1 is supported by the lifting rod 32 while the balance spring 3
The state is pushed upward by the elastic force of 3.
That is, the panel support 1 in this state is in a state of floating in the space only by the elastic force of the balance spring 33,
Therefore, when an external force in the vertical direction is applied to the panel support 1, the panel support 1 can freely move in the direction in which the external force acts.

The panel support 1 is provided with a lifting table 2
8 is fixed to the upper end of the elevating rod 32 that moves in the vertical direction, so that the direction of movement of the panel support 1 is restricted substantially in the vertical direction. However, in the present embodiment, the fitting between the lifting rod 32 and the lifting table 28 has a slight margin, that is, a gap. For this reason, in addition to the vertical movement of the panel support 1,
As shown by an arrow D in FIG. 5 and an arrow E in FIG. 4, the tilting movement is possible in a very small angle range.

In FIG. 2, an air suction opening 54 is opened to the outside of the surface of the panel support 1, and an air passage 53 extending from the opening 54 is formed inside the panel support 1. The air passage 53 has an intake device 5
5 is connected, and external air is sucked through the opening 54 when the suction device 55 is operated. Due to this air suction, the liquid crystal panel 2 placed on the panel support 1 is firmly sucked and held.

Returning to FIG. 1, a plurality of, in this embodiment, five panel receiving bases 4 are arranged in parallel with the guide rails 22 on the base 14 in the crimping work stage 11. Further, the top plate 43 is supported by the columns 42, and five crimping heads 8 are provided so as to hang down from the top plate 43. These crimping heads 8 are accurately positioned above individual panel supports 4. At the upper position of the top plate 43, air cylinders 44 are arranged corresponding to the respective pressure bonding heads 8. The crimping head 8 is driven by these air cylinders 44, as shown in FIG.
It moves up and down as shown by -F '. Further, heaters (not shown) are built in each of the pressure bonding heads 8, and the respective pressure bonding heads 8 are heated to a predetermined temperature by the heaters.

In FIG. 1, tape take-up reels 46a and 46b are fixedly installed at left and right side ends of a top plate 43. A tape 47 made of fluororesin, for example, Teflon (trade name) is wound around these reels. This fluororesin film tape 47, as shown in FIG.
It protrudes below the pressure bonding head 8. When the pressure bonding head 8 is moved downward by being driven by the air cylinder 44, the fluororesin film tape 47 is pushed down by the pressure bonding head 8, and the reels 46a and 46b are pressed.
It moves downward while being pulled out from.

In the present embodiment, with respect to the five panel supports 4 and the five crimping heads 8 corresponding thereto,
Temperature adjustment and position adjustment can be performed separately and independently. Therefore, the individual crimping heads 8 can perform the crimping process under the best crimping conditions without being influenced by other crimping heads.

Hereinafter, the operation of the crimping apparatus having the above configuration will be described.

In this embodiment, a COG (Chip On Glass) type liquid crystal panel 2 as shown in FIG. As shown in FIG. 7, the liquid crystal panel 2 has a first transparent substrate 3a made of glass and a second transparent substrate 3b made of glass similarly joined to each other by a sealing material 7 with a spacer 9 interposed therebetween. It is formed by enclosing the liquid crystal 5 in a cell gap G formed between the substrates. The portion of the liquid crystal panel 2 in which the liquid crystal 5 is sealed is the main body of the liquid crystal panel.

The first transparent electrode 10a is formed on the inner surface of the first transparent substrate 3a, and the second transparent electrode 10b is formed on the inner surface of the second transparent substrate 3b. Then, electrode terminals 48 connected to these transparent electrodes are formed on the protruding portion 3c of the first transparent substrate 3a. Further, a connection terminal 49 for conductively connecting an external circuit is formed at an end of the substrate overhang portion 3c. In addition, each transparent substrate 3a
Polarizing plates 51a and 51b are adhered to the outer surfaces of and 3b, respectively.

When mounting the liquid crystal driving IC 15 on the liquid crystal panel 2, as shown in FIG. 6, first, an ACF 6 is attached to a predetermined position on the overhanging portion 3c of the substrate 3a, and then the ACF 6 The liquid crystal driving IC 15 is placed on the substrate, and the liquid crystal driving IC 15 is simultaneously heated to a predetermined temperature and pressed against the substrate overhang 3c. By this heat-compression bonding, the liquid crystal driving IC 15 and the substrate overhang portion 3c are fixed to each other by the resin portion of the ACF 6, and at the same time, the input / output bumps of the liquid crystal driving IC 15 are formed by the conductive particles dispersed in the resin, respectively. It is conductively connected to the external connection terminal 49 and the on-board electrode terminal 48.

The pressure bonding apparatus according to the present embodiment relates to the liquid crystal panel 2 on which the ACF 6 and the liquid crystal driving IC 15 are temporarily adhered to predetermined positions of the substrate overhang 3C.
5 is performed by the ACF 6 to formally press-bond, that is, the actual press-fitting operation.

In FIG. 1, the left panel loading stage 1
The left table unit 23 is set to 2. At this time, the output shaft of the locking air cylinder 37 is extended and moved as shown in FIG. 2, and the locking piece 39 at the tip thereof is fitted into the V-groove block 36 of the panel support 1, and as a result, the panel support The table 1 is in a locked state that cannot be moved. The air cylinder 29 on the slide table 26 is in an extended state, and the elevating table 28 is set at an upper position.

Next, in FIG. 1, the liquid crystal panel 2 to be worked is placed on each panel support 1 in the left side table unit 23, and is fixed by suction by air suction. The liquid crystal panel 2 includes an ACF 6 and a liquid crystal driving IC.
C15 is temporarily bonded at a predetermined position. LCD panel 2
When the is mounted on the panel support 1, the side end of the liquid crystal panel 2 is pressed against the guide pin 41 as shown in FIG.
Further, the front end is pressed against the guide panel 18. Thus, the liquid crystal panel 2 is positioned at a fixed position on the panel support 1. The position of the guide panel 18 is shown in FIG.
, The front and rear adjustment knob 19 and the angle adjustment knob 21
By turning both or one of them appropriately, the desired position can be adjusted.

After the above operation is completed, when a predetermined start switch is operated, a linear driving device (not shown) for driving the table is operated, and the left table unit 23 moves along the guide rails 22 to perform the crimping operation stage. It is carried to 11. At this time, the right table unit 24 is carried from the crimping work stage 11 to the right panel loading stage 13. When the left side table unit 23 is carried to the crimping work stage 11 and stops there, in FIG. 2, the substrate overhang portion 3c of the liquid crystal panel 2 on the panel support 1 is
It is arranged at an upper position at an appropriate distance from the panel support 4.

Next, as shown in FIG. 5, the lock air cylinder 37 is operated to lock the lock piece 39 with the V-groove block 3.
6, the lock of the panel support base 1 is released, and the air cylinder 29 for raising and lowering is actuated, so that the output shaft thereof is retracted. Then, the force pushing up the panel support 1 is released, so that the panel support 1 is
, And stops at a position where the bottom surface of the substrate overhang portion 3c of the liquid crystal panel 2 contacts or approaches the upper end of the panel receiving base 4. Regarding the function of stopping the liquid crystal panel 2 in a state of being in contact with the panel support 4 or in a state of approaching, that is, a state of being slightly floating, there is no problem in terms of the function. However, as to which state is to be set, in FIG.
By adjusting the length of the balance spring 33 by turning the dial 4, the adjustment can be made.

Thereafter, the pressure-bonding head 8 descends along with the fluorine-inclined resin film tape 47 as shown by an arrow F and hits the upper surface of the liquid crystal driving IC 15 on the liquid crystal panel 2 and further presses it with a predetermined pressure on the panel receiving base 4. Press As a result, the ACF 6 interposed between the liquid crystal driving IC 15 and the substrate overhang portion 3c of the liquid crystal panel 2 is heated and pressurized.
Adhered to. Thus, the final pressure bonding of the liquid crystal driving IC 15 is completed. The reason why the fluorine-inclined resin film tape 47 is interposed between the pressure bonding head 8 and the liquid crystal driving IC 15 is as follows.
This is to prevent the pressure bonding head 8 from directly contacting the bonding IC 15.

At the time of the main pressure bonding operation, the panel support 1 is supported in a state of being substantially floating in the space by the elastic reaction force of the balance spring 33 and can move freely in the vertical direction, so that the liquid crystal panel 2 is always horizontal. It is pressed by the pressure bonding head 8 while maintaining the state. As a result, the liquid crystal driving IC 15 can be stably and firmly made without variation.
Conductively adhered on the substrate. In the present embodiment, as shown by an arrow E in FIG. 4 and further by an arrow D in FIG.
Since the panel support 1 can be slightly tilted and moved, even if the liquid crystal driving IC 15 is temporarily adhered to the liquid crystal panel 2, the pressure bonding head 8 can uniformly press the entire surface of the liquid crystal driving IC 15. .

When the main press-fitting operation of the liquid crystal driving IC 15 to the liquid crystal panel 2 is completed as described above, the press-fit head 8 is raised as shown by an arrow F 'in FIG. Moves by extension. By this extension movement, the elevating table 28 rises and the panel support 1 is returned to the upper position shown in FIG. Then, as shown in FIG.
Is returned to the left panel loading stage 12, and the liquid crystal panel 2 that has completed the pressure bonding operation is collected from the panel support 1.

While the left table unit 23 is set on the crimping work stage 11 and the above-described main crimping work is performed, the operator operates the right panel loading stage 13.
The unprocessed liquid crystal panel 2 is loaded into the right side table unit 24 placed at the position. Crimping work stage 11
When the crimping operation for the left table unit 23 set in the first stage is completed and the left table unit 23 is returned to the left panel loading stage 12, the right table unit 24 is automatically carried to the crimping stage 11. It receives the final crimping work. In this way, the final crimping operation is performed on the left table unit 23 and the right table unit 24 alternately.

As described above, the present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and can be variously modified within the technical scope described in the claims.

For example, in the above embodiment, the present invention is applied to the COG type liquid crystal panel shown in FIG.
That is, the liquid crystal driving IC itself was considered as an electronic component to be crimped to the liquid crystal panel. However, it goes without saying that the present invention can be applied to the case where other electronic components such as heat seal and TCP are conductively connected to the liquid crystal panel. In these cases, heat sealing, TCP, or the like is pressed by the pressure bonding head 8.

The number of panel supports 1 prepared in each of the table units 23 and 24 is not limited to five, but may be smaller or larger, and may be one in some cases. In addition to the structure in which two table units are alternately carried to the crimping work stage 11 and the crimping operation is continuously performed, one table unit is fixedly installed and crimping is performed using only the table unit. You can also do work.

[0048]

According to the liquid crystal panel crimping device of the first aspect and the method of manufacturing the liquid crystal device of the fifth aspect, the panel support supporting the main body of the liquid crystal panel is provided with a reaction force applying means such as a spring. Since the liquid crystal panel is kept in a so-called floating state, the pressure bonding process can be performed while the liquid crystal panel is always placed horizontally, so that the entire area of the electronic component such as the liquid crystal driving IC can be pressed with a uniform pressure.

Further, since the panel supporting base is supported by the reaction force applying means, the panel receiving base for supporting the projecting portion of the substrate of the liquid crystal panel can be fixedly arranged. as a result,
Compared with a conventional crimping device in which the portion corresponding to the panel support is moved up and down, the pressing force applied between the substrate and the electronic component can be stably maintained at a constant magnitude,
The liquid crystal panel and electronic components can be stably and firmly bonded without variation. In addition, since a driving device for vertically moving the panel support is not required, the structure is simplified,
Moreover, the cost can be reduced.

According to the liquid crystal panel crimping apparatus of the second aspect, in addition to the parallel movement of the panel support in the same direction as the moving direction of the crimping head, the panel support can also be tilted.
The liquid crystal panel mounted on the panel support can be moved more freely in accordance with the pressure bonding head.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a liquid crystal panel crimping apparatus according to the present invention.

FIG. 2 is a side view showing a structure of a main part of the pressure bonding apparatus of FIG. 1, particularly, a part supporting a liquid crystal panel.

FIG. 3 is a plan view of the structure shown in FIG. 2;

FIG. 4 is a front view of the structure shown in FIG. 2;

FIG. 5 is a side view showing a state at the time of crimping work of the structure shown in FIG. 2;

FIG. 6 is a perspective view showing an example of a liquid crystal panel to be subjected to a crimping operation.

FIG. 7 is a sectional view showing a sectional structure of the liquid crystal panel of FIG. 6;

FIG. 8 is a cross-sectional view showing an example of a conventional liquid crystal panel pressure bonding apparatus.

FIG. 9 is a sectional view showing one operation state of the conventional device of FIG. 8;

FIG. 10 is a sectional view showing another operation state of the conventional device of FIG. 8;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Panel support stand 2 Liquid crystal panel 3c Overhang part of the transparent substrate of a liquid crystal panel 4 Panel receiving stand 8 Crimping head 11 Crimping work stage 12 Left panel loading stage 13 Right panel loading stage 14 Base 15 Liquid crystal drive IC (electronic parts) 16 Panel Positioning unit 22 Guide rail 23 Left table unit 24 Right table unit 33 Balance spring (reaction applying means) 34 Spring force adjusting screw 54 Air suction opening

Claims (5)

[Claims] 1. A pressure bonding apparatus for bonding an electronic component under pressure to a substrate overhang of a liquid crystal panel having a main body and a substrate overhang, comprising: a panel support for supporting the main body of the liquid crystal panel; A panel support for supporting the panel support, and a crimping head disposed opposite to the panel support and movable in a direction approaching the panel support and in a direction away from the panel support. A liquid crystal panel crimping device, which is capable of being translated in the same direction as the moving direction of the liquid crystal panel and is supported by a reaction force applying means. 2. A pressure bonding apparatus for a liquid crystal panel according to claim 1, wherein the panel support can be tilted and moved. 3. The liquid crystal panel crimping apparatus according to claim 1, wherein the electronic component is a tape carrier package in which a liquid crystal driving IC is mounted on a flexible printed board on which a wiring pattern is formed. LCD panel crimping device. 4. The liquid crystal panel crimping apparatus according to claim 1, wherein the electronic component is a liquid crystal driving IC. 5. A liquid crystal panel main body portion is placed on a panel support, a substrate overhang of the liquid crystal panel is placed on a panel support, and an electronic component is placed on the substrate overhang with an adhesive member interposed therebetween. A method for manufacturing a liquid crystal device, comprising: a pressing step of bonding an electronic component to a substrate overhang of a liquid crystal panel by pressing an electronic component toward a panel receiving base with a head. A method for manufacturing a liquid crystal device, wherein the liquid crystal device is movable in a parallel direction and is supported by a reaction force applying means.