KR200266542Y1 - A bonding device of chip on glass in Liquid Crystal Display - Google Patents

Abstract

The present invention relates to a bonding device of a COG in a liquid crystal display device, and more particularly, a chip on glass for directly attaching an LCD chip (Liquid Crystal Display Drive Chip) to a TFT glass of an LCD (Liquid Crystal Display) device. When the IC chip is supplied by the robot unit operating in the XY axis in a state in which the bonding head unit and the workbench unit are formed to be connected to the chip carrying unit to bond the IC chip to the glass with a chip on glass, the bonding is performed. As the bonding head assembled in the head unit descends by sliding, the IC chip can be thermally pressurized to the glass and bonded.

Description

A bonding device of chip on glass in Liquid Crystal Display

The present invention relates to a bonding device of a COG in a liquid crystal display device, and more particularly, to a chip on glass for directly attaching an LCD chip (Liquid Crystal Display Drive Chip) to a TFT glass of a liquid crystal display (LCD) device. Chip on Glass).

In general, as shown in FIG. 14 (a), as all devices are light and short and small, the prototype of the LCD is being prototyped. After the first package by the TAP (Tape Automated Bonding) method was mounted on the PCB and the outlead of the chip was bent and widely used as a structure connected to the TFT glass.

In addition, Figure 14 (b) is a structural diagram showing the configuration of the LCD by the chip-on-glass method (chip-on-glass) method that directly package the chip for the LCD drive to the TFT glass in order to further reduce the thin and thin, the structure of the As shown in (c) of FIG. 14, the LCD forms a metallization layer (Matallization) on both sides of the TFT glass, and attaches a chip for LCD drive to the portion, and the attachment method is SBB COG. The conductive polymer is placed on the gold bump formed on the pad of the chip as a stud bump-bonding chip on glass, and then polymerized and attached while thermally compressing the conductive polymer.

However, the conventional structure as described above requires very precise accuracy when placing the conductive polymer on each pad, and there are many technical difficulties, and therefore, the cost is increased.

In addition, the conductive polymer has a problem in conductivity because the electrical resistance is about 10-100 times higher than that of a normal metal, and it is difficult to repair the polymer by attaching the chip once it is polymerized.

An object of the present invention is to provide a chip on glass bonder that directly attaches a liquid crystal display drive chip to a glass of a liquid crystal display (LCD) device.

In order to achieve the above object, the bonding material used for the chip on glass is a vinyl chloride resin, a vinyl acetate resin, a vinyl acetyl resin, a thermosetting resin, a phenol resin, or a urea resin, which is a thermoplastic resin. The IC chip is melted by the high heat of the heater plate in a state in which a bonding material formed of melanin resin, alkyd resin, polyester resin, silicone resin, epoxy resin, urethane resin, or fran resin is in close contact with the glass. It relates to a bonding machine of Chip on Glass capable of adhering to glass.

1 is a front view of the main portion of the present invention assembled

Figure 2 is a side view of the main portion of the present invention assembled

3 is an enlarged front view of the bonding head unit of the present invention.

Figure 4 is an enlarged side view of the bonding head unit of the present invention

5 is a front view showing a workbench unit of the present invention

6 is a plan view showing a work bench unit of the present invention;

7 is a plan view showing a chip carrying unit which is the main part of the present invention;

8 is a side view showing a chip carrying unit which is a main part of the present invention;

9 is a front view of the robot unit operating in the X-Y axis.

10 is a side view of the robot unit operating in the X-Y axis.

11 is a side view of the glass attached to the ACF

12 is a side view of a state in which a COG type IC chip is attached

13 is a side view of a state in which the main part is partially enlarged;

(A), (b) and (c) of FIG. 14 illustrate a LCD structure using a conventional TAP.

Explanation of symbols on the main parts of the drawings

10. Plate 11. Support

12. Slide support 13. Pad

14. Bracket 15. Head support guide

16. Slide bracket 17. Heater plate

18. Head support plate 19. Housing

20. Cylinder 21. Rod

22. Guide 23. Roller

24. Clamp 25. Bolt Clamp

26. Block Clamp 27. Block Space

28. Air cylinder 29. Bonding head

30. Stage bracket 31. Plate stage

32.Mirror clamp 33.Nozzle

34. Nozzle Bracket 35. Cylinder Bracket

36. Rotary actuator 37. Chip pin

38. Vacuum Pad (Suction Pad) 39. Ball Screw

40. Base plate 41. Top cover

42. Joint plate 43. Tray pad

44. Motor bracket 45. IC chip

46. Slide 47. Camera

48. Robot Unit 49. Workbench Unit

50. Chip Carrying Unit 51. Bonding Head Unit

52. Glass 53. Bonding Material (ACF)

In order to bond the IC chip to the glass, the present invention is divided into a bonding head unit, a workbench unit, and a chip carrying unit so that the IC chip can be automatically moved by the robot unit operating in the X-Y axis.

Hereinafter, the configuration of the present invention with reference to the accompanying drawings in detail as follows.

1 is a front view of the main portion of the present invention assembled state, Figure 2 is a side view of the main portion of the present invention assembled state, Figure 3 is an enlarged front view of the bonding head unit of the present invention, Figure 4 is the present invention 5 is a front view showing a workbench unit of the present invention, FIG. 6 is a plan view showing the workbench unit of the present invention, and FIG. 7 is a plan view showing a chip carrying unit that is the main part of the present invention. 8 is a side view showing the chip conveying unit which is the main part of the present invention, FIG. 9 is a front view showing the robot unit operating in the XY axis, and FIG. 10 is a plan view showing the robot unit operating in the XY axis, and FIG. Is a side view of a state in which a bonding material is attached to glass, and FIG. 12 is a side view of a state in which an IC chip of COG type (Chip on Glass) is attached, and FIG. 13 is a side view of a state in which the main part is partially enlarged. 14 (a), (b) and (c) are LCD structural diagrams using a conventional TAB.

First, an air cylinder 28 is fixed to the support 11 at an upper side of the slide support 12 formed at both sides as shown in FIGS. 3 and 4, and is connected to a bonding head 29 at a lower side of the air cylinder 28. The plate 10 is composed of.

At this time, the temperature generated in the bonding head 29 is applied differentially according to the working conditions, the temperature range is preferably 170 ℃ to 220 ℃, the time is suitable for 5 to 10 seconds.

Moreover, 2 Mpa and 40 kg / cm <2> are appropriate pressures according to a bonding material.

And the bonding head 29 is configured to move up and down while riding the slide 46 by the action of the air cylinder 28.

5 and 6 illustrate a front view and a plan view showing a workbench unit stage. The Miller stage 32 is assembled to the plate stage 31, and the camera 47 is fixed to the stage bracket 30. Since the glass 52, the bonding material 53, and the IC chip 45 are bonded to each other, the monitor can be closely observed.

7 and 8 illustrate a plan view and a side view of the chip carrying unit, in which a key (not shown) to which the chip pin 37 is fixed is fixed to another plate 10 to operate the air cylinder 28. While moving from side to side, the IC chip 45 stored in the robot unit 48 is sucked by vacuum and then automatically moved to the bonding head 29 to be sucked by vacuum, and then the chip conveying unit is returned and the cylinder 28 After lowering by), the position is adjusted by the camera 47 and the IC chip 45 is bonded to the glass surface mounted on the work bench unit 49.

9 and 10 illustrate a front view and a plan view of the robot unit operating in the XY axis. First, the joint plate 42 rotates left and right by rotating the ball screw 39 connected to the motor bracket 44. It is configured to be possible.

In addition, the plurality of IC chips 45 are positioned above the joint plate 42 and configured to be moved by the chip carrying unit 50.

At this time, the bonding materials used are vinyl chloride resin, vinyl acetate resin, vinyl acetyl resin, and thermosetting resin waste resin, urea resin, melanin resin, alkyd resin, polyester resin, and silicone resin. And bonding the IC chip 45 to the glass 52 by melting the bonding material 53 by the high heat of the heater plate in a state in which the bonding material formed of epoxy resin, urethane resin, or fran resin is in close contact with the glass. Can be.

The above situation is possible because the robot unit 48, the chip carrying unit 50, the work bench unit 49, and the bonding head unit 51 operate continuously.

Referring to the operation and effects of the present invention made in the above configuration in detail as follows.

First, the operator raises several IC chips 45 on the upper side of the plate 10 operating in the XY axis by the action of the ball screw 39 assembled to the robot unit 48, and then waits for the next operation. .

At this time, the heater plate 17 and the bonding head 29 assembled to the bonding head unit 51 are lifted by the slide 46 by the operation of the air cylinder 28.

In addition, the housing 19 and the pad 13 formed integrally with the chip carrying unit 50 are moved to the IC chip 45 located above the plate 10 by the operation of the air cylinder 28.

Next, the chip conveying unit 50 is fixed to the vacuum pad 38 connected to the rotary actuator 36 connected to the MOUNT so that the IC chip 45 can be temporarily sucked and moved by supply of air.

In the above situation, the vacuum-sucked IC chip 45 is transferred to the bonding head 29 to be vacuum-sucked and the chip carrying unit 50 is returned.

The bonding head 29 is then lowered by the operation of the air cylinder 28.

At this time, since the bonding material 53 is attached to the surface of the glass 52, the IC chip 45 does not move.

In addition, an ITO line (not shown) etched on the glass 52 by the camera 47 attached to the lower side of the work unit unit 49 and an XYθ stage are adjusted to match the BUMP of the IC chip 45. When the next switch (not shown) is pressed, the slide 46 moves backward by the operation of the cylinder 28 and the bonding head 29 descends to pressurize the glass and the IC chip.

After the next set time, the bonding head 29 is lifted up, and one cycle of work is completed, and then the work is returned to the original work process.

The present invention described above is possible to those skilled in the art to which the present invention belongs to various modifications and changes can be made within the scope without departing from the technical spirit of the present invention in the foregoing embodiments and the accompanying drawings. It is not limited.

According to the wiring structure of the liquid crystal display panel according to the embodiment of the present invention described above, the interference and EMI of the signal generated between a plurality of data lines mounted on the glass of the COG-type LCD panel is reduced with Therefore, the distortion of each signal transmitted through the data line and each input wiring unit is reduced.

Claims (5)

In the bonding machine of the chip-on glass which directly attaches the IC chip for LCD drive to the TFT glass of the LCD device, When the IC chip is supplied by the robot unit operating on the XY axis in a state where the bonding head unit and the workbench unit are connected to the chip carrying unit to bond the IC chip to the glass, the bonding head assembled to the bonding head unit is In the liquid crystal display device, a chip-on-glass bonding machine, characterized in that the IC chip is bonded to the glass for 5 to 10 seconds at a temperature of 170 ° C to 220 ° C by descending on a slide. The method of claim 1, In the liquid crystal display device, the bonding device of the chip on glass, characterized in that the camera attached to the stage bracket connected to the plate stage of the workbench unit to adjust the glass and the IC chip while checking the alignment state of the glass with the monitor The method of claim 1, The key pin is fixed to the chip conveying unit is fixed to the plate is moved to the left and right by the operation of the air cylinder while adsorbing the IC chip stored in the robot unit by vacuum to move to the work unit unit, characterized in that the liquid crystal In the display device, a chip-on-glass bonding machine The method of claim 1, Wherein the robot unit is configured to rotate the robot unit to the left, right by the rotation of the ball screw connected to the joint plate and the motor bracket, in the liquid crystal display device, chip on glass bonding machine The method of claim 1, In the liquid crystal display device, the bonding material is formed of a thermoplastic resin and a thermosetting resin and configured to melt the bonding material by high heat of the bonding head to bond the IC chip to the glass.