KR100808937B1 - Apparatus for Bonding Chip On Glass - Google Patents

Abstract

The present invention relates to a chip on glass bonding apparatus. Chip on glass bonding apparatus according to the present invention, the base table; A main body installed at an upper portion of the base table; A chip rotation unit installed at the center of the base table; A pre-align unit disposed at a predetermined distance from the chip rotation unit; A chip loader installed at one side of the main body to load chips from the tray to the pre-aligned side; A pressing head and a main pressing head installed on the other side of the main body; Driving means for driving a rotary table provided at one side of the base table; And first and second bonding tables provided on an upper portion of the rotary table. The present invention configured as described above can reduce the break time of the bonding apparatus and shorten the bonding time, and can adjust the height of the pressing head according to the thickness of the LCD panel and the chip, thereby preventing breakage and breakage of the LCD glass.

Bonding, COG, Pressing, Main Pressing, Rotating Table

Description

Chip on Glass Bonding Device {Apparatus for Bonding Chip On Glass}

1 is an overall configuration diagram of a chip on glass bonding apparatus according to the present invention.

2 is a perspective view of a pre-align unit that is a main part of the present invention.

Figure 3 is an enlarged view of the main portion of the chip on glass bonding apparatus according to the present invention.

Figure 4 is an enlarged perspective view of the bonding head and the bonding table applied to the chip on glass bonding apparatus according to the present invention.

5 is a plan view showing the arrangement of the bonding table applied to the chip on glass bonding apparatus according to the present invention.

Figure 6 is a perspective view of a rotary table rotating means applied to the chip on glass bonding apparatus according to the present invention.

Figure 7 is an exploded perspective view of the crimping head applied to the chip on glass bonding apparatus according to the present invention.

<Code Descriptions Used in Main Parts of Drawing>

10: base table 20: chip rotation unit

30: pre-align unit 40: camera unit

100: main body 200: pressing head

300: main compression head 400: first bonding table

500: second bonding table 600: chip loader

700: turntable

The present invention relates to a chip on glass bonding apparatus, and more particularly, to a chip on glass bonding apparatus for directly bonding a chip on glass (LCD) to a liquid crystal display panel (LCD). It is about.

In general, as the modern society becomes information socialized, the importance of the liquid crystal display device, which is one of the information display devices, is gradually increasing.

CRT (Cathode Ray Tube), which is widely used so far, has many advantages in terms of performance and price, but has disadvantages in terms of miniaturization or portability.

On the other hand, liquid crystal displays have the advantages of miniaturization, light weight, low power consumption, etc., and as the alternative means to overcome the disadvantages of the CRT, the size of the LCD panel of the screen is continuously increasing.

In order to meet the trend of larger LCD panels and higher resolution, an increase in chip-on-glass in which gate lines and driving driver ICs are mounted is inevitable.

This increase in the number of chip-on-glass increases the bonding process of attaching the input and output pads of TCP to LCD panels and printed circuit boards (PCBs), which not only reduces production efficiency but also yields and reliability of LCD panels. Is lowered.

The chip on glass is largely composed of a polyimide tape carrier and one or more driving drive chips mounted on the tape carrier across a chip mounting hole formed at a predetermined position of the tape carrier.

The tape carrier has a conductive input lead formed to extend at a predetermined pitch from the chip mounting hole to one short side in the long side direction, and an output lead of conductive material is formed to extend at a predetermined pitch from the chip mounting hole to the other short side. have.

The driving drive chip mounted across the chip mounting hole is in electrical contact with an input lead and an output lead.

As an example of a chip on glass method of directly attaching the chip on glass structured as described above to the LCD panel, a Korean Patent Application No. 2001-58586 has proposed a TCP repair bonding machine in an LCD display.

The pre- filed bonding machine comprises: a stage unit for connecting the glass camera unit and the pressing unit for TCP repair bonding; TCP holder unit connected for loading alignment of camera and glass between TCP and glass installed on the pressure-adhesive bracket; descending by LM guide and press TCP for 3 to 5 seconds at the temperature of 70 ℃ ~ 80 ℃ Pressing unit to be; After the completion of the pressure bonding, the main compression position is moved down to the same as the compression head is composed of a main compression unit for main compression of TCP for 20 seconds at a temperature of 170 ℃ to 190 ℃.

According to the pre-bonded bonding machine, the pressing and the main compression proceeds sequentially so that the pressing is prepared after the main compression is completed, so that the break time of the bonding device is long, and thus there is a lot of time loss.

Although the degree of bonding should be different depending on the thickness of the LCD glass and the chip, the thickness of the LCD glass and the chip should be ignored. do.

On the other hand, if the flatness of the bonding tool and the LCD glass does not match during bonding, bonding defects are generated. Therefore, the flatness of the bonding tool is adjusted. In the related art, the bonding tool is fastened with bolts through steel balls, and the bolts are fastened / released. Although the flatness of the bonding tool is adjusted, the flatness cannot be precisely adjusted by this method, and there are disadvantages in that adjustment technique and time are required.

The present invention has been invented to solve the above problems, and an object thereof is to provide a chip on glass bonding apparatus capable of shortening the bonding time between pressing and main bonding.

In addition, another object of the present invention is to be able to adjust the bonding pressure according to the thickness of the LCD glass and the chip.

Another object of the present invention is to make it possible to match the flatness of the bonding tool by a simple operation.

Chip on glass bonding apparatus according to the present invention for achieving the above object, the base table; A main body installed at an upper portion of the base table; A chip rotation unit installed at the center of the base table; A pre-align unit disposed at a predetermined distance from the chip rotation unit; A chip loader installed on one side of the main body to load chips from the tray to the pre-aligned side; A pressing head and a main pressing head installed on the other side of the main body; Drive means for driving a rotary table provided at one side of the base table; It consists of a 1st and 2nd bonding table installed in the upper part of the said rotary table.

The prealign unit includes a main block, an auxiliary block provided on one side of the main block, a main block, a cylinder provided between the auxiliary blocks, and a finger moved by the cylinder.

The pressing head and the main pressing head may include a micro seat mounted on an upper portion of each clamping block formed at a predetermined distance from the housing and the first and second brackets installed on both sides of the housing and the first and second brackets. A meter, a joint block provided in the lower portion of the housing, a ceramic plate provided in the lower portion of the joint block, a heater block provided in the lower portion of the ceramic plate, and a bonding provided for bonding under the heater block. It consists of a tool.

The height adjusting means of the pressure-adhesive head includes a support plate, an upper plate installed on the support plate, an upper plate installed on the upper plate, a housing installed on the upper palm, and the upper plate. An elevating cylinder for elevating, a height adjusting handle for adjusting the operation of the elevating cylinder, and a dial gauge for checking the degree of height adjustment.

The driving means includes a pneumatic cylinder, a cylinder rod connected to the pneumatic cylinder, a moving block connected to one end of the cylinder rod, a belt connected to the moving block, and a first pulley installed at a lower portion of the rotary table in which the belt is wound. And a second pulley corresponding to the first pulley.

The first and second bonding tables include an XY stage movably installed in the X and Y directions on a rotating table, a circular stage seated on an upper portion of the XY stage, a vacuum plate provided on an upper portion of the circular stage, Each micrometer is configured to adjust the XY direction dimension of the XY stage.

Hereinafter, the chip on glass bonding apparatus of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 1, the chip on glass bonding apparatus of the present invention is largely divided into a base table 10 and a main body 100 installed on the base table 10.

One side of the base table 10 is provided with a tray table 12 for seating a plurality of trays 2, the tray table 12 is seated on the tray seating frame 14.

In addition, a chip rotation unit 20 and a prealign unit 30 disposed at a predetermined distance from the chip rotation unit 20 are installed at the center of the base table 10.

The other side of the base table 10, the rotary table 700 is installed, the first and second bonding table 400, 500 is installed on the top of the rotary table 700, the base table ( The camera unit 40 is installed below the 10.

On the other hand, the frame 60 is installed in the center of the main body 100, the chip loader 600 for loading the chip 22 from the tray 2 to the pressing head 200 side on one side of the frame 60. Is installed, and the other side of the frame 60, the pressing head 200 and the main pressing head 300 is installed at a predetermined interval so as to be movable.

A vision monitor 70 for checking the bonding state of the chip on glass is installed on the main body 100, and a control button 80 for operating the equipment is installed on one side of the main body 100.

As shown in FIG. 2, the prealign unit 30 includes a main block 32 and an auxiliary block 34 disposed on one side of the main block 32, and the main block 32 and the auxiliary block 34. The cylinder 36 is provided between the blocks 34, and the cylinder 36 is comprised so that the finger 38 can be moved. The finger 38 is configured to cope with a change in the size of the chip 22 located on the seating portion 39.

As shown in FIGS. 3 to 6, the first and second bonding tables 400 and 500 of the present invention are fixed to the upper surface of the rotary table 700, and the rotary table 700 is driven by driving means to be described later. It is installed rotatably.

The first bonding table 400 includes an XY stage 410 installed on the rotation table 700 so as to be movable in the X and Y directions, a circular stage 412 seated on an upper portion of the XY stage 410, It consists of a vacuum plate 420 installed on the upper portion of the circular stage 412, and micrometers (430, 440) for adjusting the XY direction dimensions of the XY stage (410).

On the other hand, since the second bonding table 500 is configured in the same manner as the first bonding table 400, a detailed description thereof will be omitted, and reference numerals 530 and 540 in FIG. 5 are micrometers.

Meanwhile, the driving means DM for driving the rotary table 700 includes a pneumatic cylinder 710, a cylinder rod 712 connected to the pneumatic cylinder 710, and the like. And a belt 740 wound between the first and second pulleys 720 and 730 provided at predetermined intervals, the belt 740 wound between the first and second pulleys 720 and 730, and installed on one side of the belt 740. The mobile block 744 is connected to the rod 712.

In order to reduce the impact when the rotary table 700 rotates 180 degrees, a shock absorber 760 is installed on the bracket 750 to mitigate the impact despite the rotation of the rotary table 700.

On the other hand, as shown in Figure 4, the pressing head 200, the height adjusting means (HC) is adopted to cope with the height change according to the size of the chip on glass.

The height adjusting means HC of the pressing head 200 includes a support plate 120, an upper plate 121 installed on the support plate 120, and an upper portion installed on the upper plate 121. Plate 130, the housing 132 is installed on the upper plate 130, the lifting cylinder 140 for lifting the upper plate 121, and is installed on the housing 132 It is composed of a height adjusting handle 160 for adjusting the operation of the lifting cylinder 140, and a dial gauge 180 for checking the degree of height adjustment.

The main compression head 300 may apply the same height adjustment means HC as the compression head 200 but is not applied here, which is within the scope of the present invention.

As shown in FIG. 7, the pressurized head 200 includes a housing 210, a pair of first and second brackets 220 and 230 installed at both sides of the housing 210, and the first and second parts. 2 brackets 220 and 230 are formed at a predetermined interval, and the micrometers 240 and 250 with clamping blocks 241 and 251 mounted thereon, respectively, the joint block 244 and the ceramic plate 254 installed under the housing 210. The heater block 260 is installed in the lower portion of the, and is installed in the lower portion of the heater block 260 is composed of a bonding tool 270 for bonding.

An adjustment bar 243 is installed at one side of the clamping block 241, a clamping plate 246 is installed inside the clamping block 241, and the clamping plate 246 is provided with a washer 248. It is fixed to the clamping block 241. Reference numeral 245 is a stop ring.

One side of the clamping block 251 is provided with a bracket 252, the bracket 252 is installed on the upper portion of the adjustment bar 253, the adjustment bar 253 penetrates to the inside of the bracket 230 Is installed.

A plurality of bearings 282, 284 and a cover 288 are inserted into the first shaft 211 of the housing 210 to be fixed by the stop ring 290. A bearing 286 and a spacer 287 are inserted into the rear side of the shaft 211. In addition, a plurality of bearings 292 and 294 and a cover 298 are inserted into the second shaft 213 of the housing 210 to be fixed by the stop ring 299.

Now, an operation relationship of the chip on glass bonding apparatus of the present invention will be described.

As shown in FIG. 1, the chip 22 is loaded by the chip loader 600 from the tray 2 seated on the tray table 12 and seated on the chip turn table 20. When the chip turn table 20 rotates, the pressing head 200 loads the chip 22 to be seated on the first bonding table 400. At this time, the pressing head 200 is lowered to an appropriate position to raise the vision by capturing the lower surface of the chip 22.

Then, an LCD (not shown) is loaded into the first bonding table 400. When the chip 22 and the LCD are loaded, the vision monitor 70 displays the captured image of the chip 22 and the image of the LCD in real time.

The operator aligns the chip 22 with the LCD terminal through the vision monitor 70. As shown in FIG. 4, in the terminal alignment method, since the chip 22 is fixed and the first bonding table 400 is movable, the micrometers 430 and 440 are manipulated to operate the first bonding table 400. The position is adjusted by moving in the Y direction.

When the chip 22 and the LCD terminal are precisely aligned as described above, the pressing head 200 descends to proceed with pressing.

However, since the height is different according to the thickness of the chip 22 and the LCD, it is necessary to adjust the height of the pressing head 200. Thus, the pressing head 200 of the present invention is provided with a height adjusting means (HC) for adjusting the height.

In the height adjusting method of the pressing head 200, when the operator turns the height adjusting handle 160 in a predetermined direction, the upper plate 130 is elevated by the lifting cylinder 140 to change the height. At this time, while the operator visually checks the degree of height adjustment while watching the dial gauge 180, the height is adjusted by adjusting the height adjustment handle 160.

When the height of the pressing head 200 is adjusted, accordingly, the main pressing head 300 is also adjusted by the pressing head 200 by hand. Here, the height adjustment means of the main compression head 300 is not applied, but may be configured as the height adjustment means of the compression head 200.

On the other hand, the pressure bonding is made by about 1 to 3 seconds at a temperature of 70 ℃ ~ 80 ℃ by the pressing head 200.

When the pressing is completed, the rotary table 700 is rotated 180 ° to move the first bonding table 400 to the second bonding table 500 side. At this time, the main compression head 300 main compression of the chip 22 and the LCD terminal moved to the second bonding table 500 side.

As such, when the rotary table 700 is rotated, the first bonding table 400 that has been press-fitted is moved to the lower side of the main head 300 to wait for main compression, and the empty second bonding table ( 500 moves to the lower side of the pressing head 200 to wait for the pressing of the chip.

When the air is supplied to the pneumatic cylinder 710, the pneumatic cylinder 710 pushes the cylinder rod 712, and the movable block 744 rotates the rotary table 700 so that the rotary table 700 rotates. ) Will rotate.

As described above, according to the configuration according to the present invention, since the bonding table can be moved to the bonding position of the next process, the preparatory work / pressing pressure for pressing can be performed while the main pressing is in progress. This reduces the resulting bonding time.

In addition, since the height of the crimping head can be adjusted according to the thickness of the LCD panel and the chip, it is possible to prevent breakage and breakage of the LCD glass.

Claims (6)

A base table; A main body installed at an upper portion of the base table; A chip rotation unit installed at the center of the base table; The chip rotation unit is disposed at a predetermined interval, and comprises a main block, an auxiliary block provided on one side of the main block, a cylinder provided between the main block and the auxiliary block, and a finger moved by the cylinder. A pre-align unit; A chip loader installed at one side of the main body to load chips from the tray to the pre-aligned side; Micros installed on the other side of the main body and seated on the upper portion of each clamping block formed at a predetermined distance from the housing, the first and second brackets provided on both sides of the housing, and the first and second brackets. A meter, a joint block provided in the lower portion of the housing, a ceramic plate provided in the lower portion of the joint block, a heater block provided in the lower portion of the ceramic plate, and a bonding provided for bonding under the heater block. A pressing head and a main pressing head made of a tool; Drive means for driving a rotary table provided at one side of the base table; An XY stage installed on an upper portion of the rotary table and movable on the rotary table in a X and Y direction, a circular stage seated on an upper portion of the XY stage, a vacuum plate provided on an upper portion of the circular stage, Chip on glass bonding apparatus comprising a first and a second bonding table each made of a micrometer for adjusting the XY direction dimensions of the XY stage. delete delete According to claim 1, wherein the pressing head has a height adjusting means (HC), the height adjusting means (HC) is installed on the support plate, the upper plate is installed on the support plate, the upper plate An upper plate, a housing installed on an upper portion of the upper plate, an elevating cylinder for elevating the upper plate, a height adjusting handle installed on an upper portion of the housing for adjusting an operation of the elevating cylinder, Chip on glass bonding apparatus comprising a dial gauge for checking the accuracy. According to claim 1, wherein the drive means is a pneumatic cylinder, a cylinder rod connected to the pneumatic cylinder, a moving block connected to one end of the cylinder rod, a belt connected to the moving block, the rotary table of the rotating table Chip on glass bonding apparatus comprising a first pulley installed in the lower portion, and a second pulley corresponding to the first pulley. delete

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