KR100476126B1 - Manufacturing method of liquid crystal panel crimping device and liquid crystal device - Google Patents

Abstract

With a simple structure, an object of the present invention is to provide a crimping device capable of uniformly pushing an entire surface of an electronic component such as a liquid crystal driving IC and a heat seal against a liquid crystal panel to be bonded without unevenness. do.

The panel support 1 is fixed to the upper end of the elevating rod 32 arranged to be movable up and down on the table 28. The panel support 1 is supported by a spring 33, on which a liquid crystal panel 2 is placed. The liquid crystal panel 2 is stopped in a balanced manner at a position where the flange portion 3c of the transparent substrate is in contact with or close to the upper end of the panel reception stand 4. The IC 15 temporarily bonded onto the substrate 3c is pushed onto the substrate 3c by the lowering compression head 8 to be bonded. Since the panel support 1 is supported by the spring 33, the panel support 1 can move freely following the movement of the crimping head 8. Therefore, the IC 15 can be pushed and pushed on the liquid crystal panel 2 stably in a constant state at all times.

Description

Pressing device of liquid crystal panel and manufacturing method of liquid crystal device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crimping device for adhering electronic components such as a tape carrier package (TCP), a liquid crystal drive IC, and the like to an electrode terminal formed on a transparent substrate of a liquid crystal panel, and a method of manufacturing a liquid crystal device using the crimping device.

Generally, a liquid crystal panel is formed by encapsulating a liquid crystal in a cell gap formed between a pair of opposing transparent substrates. In order to display visible information such as letters, numbers and pictures by this liquid crystal panel, it is necessary to electrically connect a plurality of electrodes formed on a pair of transparent substrates to a liquid crystal drive IC. As a specific method of this conductive connection, various kinds of methods are known conventionally.

For example, first, there is a method of directly adhering a liquid crystal driving IC onto a transparent substrate of a liquid crystal panel using a bonding member such as an anisotropic conductive film (ACF). According to this method, a liquid crystal panel of COG (Chip On Glass) method is produced.

Secondly, there is a method of electrically connecting a liquid crystal drive IC to a liquid crystal panel in the form of a tape carrier package (TCP). As known in the art, the TCP is a liquid crystal driving IC mounted on a FPC (Flexible Printed Circuit Board) having a wiring pattern by using a method of Tape Automated Bonding (TAB). In this case, the TCP is electrically conductively connected to the transparent substrate of the liquid crystal panel through an ACF or a heat seal.

Thirdly, there is a method in which a liquid crystal drive IC is bonded onto a printed circuit board (PCB), and then the PCB is electrically connected to the liquid crystal panel using a heat seal.

As mentioned above, when electrically connecting a liquid crystal drive IC to a liquid crystal panel, various electronic components, such as liquid crystal drive IC itself, TCP, a heat seal, etc., are connected on the transparent substrate of a liquid crystal panel. Considering the case where the FPC, which is a configuration requirement of TCP, is connected to the liquid crystal panel using the ACF, conventionally, a crimping process has been performed using a crimping apparatus as shown in FIG. 8.

That is, the main body part of the liquid crystal panel 52 is arrange | positioned on the panel support 51, and the flange part of the transparent board | substrate 53a of the liquid crystal panel 52 is arrange | positioned on the panel receiving stand 54. As shown in FIG. Then, the ACF 56 is adhered to the flange portion of the transparent substrate 53a, and the FPC 57 is applied thereon. ) Bond. Thereafter, the pressing head 58 heated to a predetermined temperature is lowered and the FPC 57 is adhered onto the transparent substrate 53a by pushing the FPC 57 to the flange portion of the transparent substrate 53a at a predetermined pressure. .

In this conventional crimping device, if the height of the panel support 51 and the height of the panel reception stand 54 are exactly matched to the shape of the liquid crystal panel 52 and the height is set, the crimping head 58 uniformly compresses the process. Can be done. However, when the panel support 51 is higher than the predetermined position, as shown in Fig. 9, the flange heads of the FPC 57 and the substrate 53a cannot be uniformly pushed by the crimping head 58. In addition, when the panel support 51 is lower than the predetermined position, as shown in FIG. 10, the liquid crystal panel 52 rises, and still does not become a uniform push.

Moreover, as a conventional crimping apparatus, there exists the apparatus disclosed by Unexamined-Japanese-Patent No. 4-70816 or Unexamined-Japanese-Patent No. 5-341303, for example.

Japanese Patent Laid-Open No. 4-70816 discloses a structure for electrically connecting a carrier tape including an IC chip on a transparent substrate of a liquid crystal panel, and a structure in which a pressing head for pushing the carrier tape against the transparent substrate is supported by an elastic rocking mechanism. Is disclosed.

Further, Japanese Patent Laid-Open No. 5-341303 has a structure for conducting conductive connection of a liquid crystal driving IC as a TAB component on a substrate of a liquid crystal panel, and the liquid crystal driving IC is formed by a crimp block with a liquid crystal panel placed on a support table. Disclosed is a structure in which a press is pressed on a substrate. In this structure, it is also possible to apply a constant pressure to the liquid crystal drive IC in an instant by driving the pressing block using two pressurizing cylinders.

In the crimping device disclosed in Japanese Unexamined Patent Publication No. 4-70816, the support for supporting the main body portion of the liquid crystal panel is fixedly installed, and the backup jig corresponding to the panel receiver is movable up and down. In order to move the backup jig up and down, the structure becomes complicated, the price becomes high, and furthermore, the adhesive state between the transparent substrate of the liquid crystal panel and electronic components such as FPC may be considered to be unstable.

On the other hand, in the crimping device disclosed in Japanese Patent Laid-Open No. 5-341303, the support table for supporting the liquid crystal panel is movable in the left and right directions to convey the liquid crystal panel, but not in the vertical direction. Therefore, the problems described above with respect to FIGS. 8 to 10 are included.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a crimping device that can be uniformly pressed against a liquid crystal panel by uniformly pushing the entire surface of electronic components such as a liquid crystal driving IC and a heat seal with a simple structure. It aims to do it.

(Initiation of invention)

A crimping apparatus for a liquid crystal panel according to the present invention is a crimping apparatus for attaching an electronic component under pressure to a substrate flange portion of a liquid crystal panel having a body portion and a substrate flange portion, the panel support supporting the body portion of the liquid crystal panel, and a liquid crystal. A panel receiving table for supporting a substrate flange portion of the panel, and a crimping head arranged opposite to the panel receiving table and movable in a direction close to and away from the panel receiving table. The panel support is supported by the reaction force applying means while being capable of parallel movement in the same direction as the movement direction of the crimping head.

In the above configuration, the reaction force applying means can constitute an elastic force, a pneumatic pressure, a hydraulic force, etc. by a spring or the like as a reaction force source. In the above configuration, as the electronic component bonded to the liquid crystal panel, a liquid crystal drive IC itself, a heat seal, TCP (Tape Carrier Pakage), and the like can be considered. When the liquid crystal drive IC itself is directly bonded to the transparent substrate of the liquid crystal panel, that is, when manufacturing a COG (Chip On Glass) liquid crystal panel, an ACF or the like is formed between the liquid crystal drive IC and the transparent substrate. They are adhered through an adhesive member. The situation in which the heat seal is adhered to the transparent substrate is a situation that occurs when the PCB on which the liquid crystal drive IC is mounted is connected to the transparent substrate by sandwiching the heat seal. In the case of bonding the TCP to the transparent substrate, an adhesive member such as ACF, a heat seal, or the like is interposed between the TCP and the transparent substrate.

According to the crimping apparatus of the present invention, since the panel support supporting the main body portion of the liquid crystal panel is held by the reaction force applying means, i.e., in the rising state, the liquid crystal panel can follow the movement of the crimping head and move freely, thus the liquid crystal panel Since the crimping treatment can be performed in a state of always placing horizontally, the entire area of an electronic component such as a liquid crystal driving IC can be pushed to a uniform pressure.

In addition, since the panel support side has a movable structure, the panel receiver for supporting the substrate flange portion of the liquid crystal panel is fixedly arranged, and thus, the substrate and the electronic component are compared with the conventional crimping apparatus that allows the portion corresponding to the panel receiver to be moved. The pressing force applied between the and can be stably maintained at a constant size. As a result, the liquid crystal panel and the electronic component can be bonded stably and accurately without imbalance. In addition, since the drive device for moving the panel receiver up and down is unnecessary, the structure can be simplified and the cost can be made low. The panel support is movably installed under the action of the reaction force applying means, but since this reaction force applying means does not include a special driving device, the structure is not complicated or expensive.

In addition, although the panel support moves in parallel in the same direction as the movement direction of the crimping head as described above, the panel support can be tilted in a relatively small angle range and can be installed to be movable. In this way, even when there is an imbalance in the temporary bonding state of the electronic component to the liquid crystal panel, the front surface of the electronic component can be pushed uniformly by the pressing head.

Moreover, the manufacturing method of the liquid crystal panel which concerns on this invention is a process of (1) placing the main-body part of a liquid crystal panel on a panel support stand, (2) placing a board flange part of a liquid crystal panel on a panel receiving stand, (3) A step of placing the electronic component by sandwiching the adhesive member on the substrate flange portion, and (4) bonding the electronic component to the substrate flange portion of the liquid crystal panel by pushing the electronic component toward the panel receiver by the pressing head. It is a manufacturing method of a liquid crystal panel, In particular, the said panel support is supported by reaction force provision means, such as a spring, while being able to move in parallel with the movement direction of a crimping head.

BRIEF DESCRIPTION OF THE DRAWINGS Explanatory drawing which shows one Example of the crimping apparatus of the liquid crystal panel which concerns on this invention.

FIG. 2 is a side view showing the structure of a main part of the crimping device of FIG. 1, in particular a part supporting the liquid crystal panel; FIG.

3 is a plan view of the structure shown in FIG. 2;

4 is a front view of the structure shown in FIG. 2;

FIG. 5 is a side view showing a state during the crimping operation of the structure shown in FIG. 2; FIG.

6 is a perspective view illustrating an example of a liquid crystal panel that is a target of a crimping operation.

FIG. 7 is a cross-sectional view illustrating a cross-sectional structure of the liquid crystal panel of FIG. 6. FIG.

8 is a cross-sectional view showing an example of a conventional liquid crystal panel crimping device.

9 is a cross-sectional view showing an operating state which is one of the conventional apparatus of FIG. 8;

10 is a cross-sectional view showing another operating state of the conventional device of FIG.

(Preferred form for carrying out the invention)

1 shows an embodiment of a pressing device of a liquid crystal panel according to the present invention. This crimping apparatus has a crimping work stage 11, a left panel loading stage 12, and a right panel loading stage 13. In both stages of the left panel loading stage 12 and the right panel loading stage 13, the panel positioning unit 16 is provided on the base 14. These panel positioning units 16 can be rotated around the vertical axis X as shown by arrow A, and can also be moved in parallel in the front-rear direction as shown by arrow B, and the support frame thereof. It is fixed to the upper end of 17, and has the guide panel 18 long in a horizontal direction. By turning the front and rear adjustment knob 19 in the positive and half directions, the support frame 17 and the guide panel 18 supported thereon can be moved in the direction of arrow B. In addition, by selecting one of the left and right pairs of angle adjusting knobs 21 and turning them, the support frame 17 and the guide panel 18 supported thereon can be rotated about the vertical axis X. FIG.

A linear guide rail 22 is provided on the base 14 over three stages of the left panel loading stage 12, the crimping work stage 11, and the right panel loading stage 13. The left table unit 23 and the right table unit 24 are slidably placed on the guide rails 22. As shown in FIG. 2, these table units 23 and 24 are mounted on the slide table 26 which is slidably mounted on the guide rail 22 and the guide rods 27 which are erected on the slide table 26. It has a lifting table 28 which is guided and moves up and down. The lifting table 28 is driven by an air cylinder 29 provided on the slide table 26 to move up and down as shown by arrow C. FIG.

1, the slide table 26 of the left table unit 23 and the slide table 26 of the right table unit 24 are mutually connected by the connecting plate 31. As shown in FIG. In addition, a linear driving device (not shown) is connected to either the left table unit 23 or the right table unit 24, and is driven by the linear driving device to drive the left table unit 23 and the right table unit 24. ) Is integrated to move from side to side on the guide rail 22. Although this linear drive device is comprised by arbitrary structures, it can be comprised, for example using a delivery screw.

In the state shown in FIG. 1, the left table unit 23 is located in the left panel loading stage 12, and the right table unit 24 is located in the crimping work stage 11. When the left table unit 23 is driven to the crimping work stage 11 by being driven by the above linear drive device, the left table unit 24 is automatically transported to the right panel loading stage 13 correspondingly.

Each of the left table unit 23 and the right table unit 24 is provided with a plurality of panel supports 1 (five in this embodiment). As shown in FIG. 2, these panel supports 1 are fixedly mounted on the upper end of the elevating rod 32 supported to be elevated on the elevating table 28. As shown in FIG. 4, two lifting rods 32 are provided in the transverse direction with respect to one panel support 1, and a balance spring 33 is provided between these lifting rods 32. The balance spring 33 is disposed between the adjusting screw 34 screwed to the panel support 1 and the lifting table 28. On the upper surface of the panel support 1, a guide pin 41 for positioning the liquid crystal panel 2 to be worked in the lateral direction is fixed.

In Fig. 2, the V-groove block 36 is provided at the rear end of the panel support 1 (left end of the drawing), and the lock is supported by the bracket 38 extending from the rear end of the elevating table 28. The air cylinder 37 is provided opposite the V-groove block 36. The lock piece 39 having the lock air cylinder 37 formed at the tip of the output shaft is engaged with the V groove of the V-groove block 36 when the air cylinder 37 is operated and the output shaft is extended and moved. do. As a result, the panel support 1 is fixedly held, i.e., locked, so as not to move in any of the up, down, left, and right directions.

On the other hand, when the output shaft of the air cylinder 37 is dragged and moved, the lock piece 39 will fall from the V groove of the V groove block 36 as shown in FIG. Then, the locked state of the panel support 1 is released, and the panel support 1 is pushed upward by the elastic force of the balance spring 33 while being supported by the lifting rod 32. That is, the panel support 1 in this state is in a state floating in the space by the elastic force of the balance spring 33, so that the panel support 1 is in the direction of the action of the external force when an external force in the vertical direction is applied thereto. Move freely.

Moreover, since the panel support 1 is fixed to the upper end of the elevating rod 32 which moves up and down with respect to the elevating table 28, the moving direction of the panel support 1 is restrict | limited in an up-down direction. However, in the present embodiment, there is a slight margin, i.e., spacing, in the engagement between the lifting rod 32 and the lifting table 28. As shown in FIG. For this reason, the panel support 1 is capable of tilting in a very small angle range as indicated by arrow D in FIG. 5 and arrow E in FIG. 4 in addition to the movement in the vertical direction.

In addition, in FIG. 2, the air suction opening 54 is opened to the outside of the panel support 1, and the air passage 53 which extends from the opening 54 has the inside of the panel support 1. As shown in FIG. It is formed in. An intake apparatus 55 is connected to the air passage 53. When the intake apparatus 55 is operated, external air is sucked through the opening 54. As shown in FIG. By this air suction, the liquid crystal panel 2 placed on the panel support 1 is correctly held and held.

Returning to FIG. 1, in the crimping work stage 11, a plurality of panel receivers 4 (five in the present embodiment) are arranged in parallel with the guide rails 22 on the base 14. Moreover, the top plate 43 is supported by the support | pillar 42, and five crimping heads 8 are provided as if it came down from the top plate 43. As shown in FIG. In these crimping heads 8, each panel stand 4 is correctly positioned in the upper position. An upper portion of the top plate 43 is provided with an air cylinder 44 corresponding to each of the pressing heads 8. The crimping head 8 is provided by the air cylinder 44. The crimping head 8 is driven by the air cylinder 44, and is moved up and down as shown by arrow F-F 'in FIG. In addition, a heater (not shown) is built into each of the pressing heads 8, and each of the pressing heads 8 is heated to a predetermined temperature by the heaters.

In FIG. 1, tape winding reels 46a and 46b are fixedly attached to left and right side ends of the top plate 43. A fluorine resin, for example, a tape 47 made of Teflon (trade name) is placed on the reel. As shown in FIG. 2, this fluororesin film tape 47 is removed to the downward direction position of the crimping head 8. As shown in FIG. When the press head 8 is driven by the air cylinder 44 and moved downward, the fluororesin film tape 47 is pushed down by the press head 8 and continuously discharged from the reels 46a and 46b. Move down.

In this embodiment, with respect to the five panel reception desks 4 and the five crimping heads 8 corresponding thereto, temperature control and position adjustment can be performed independently of each other. Therefore, each crimping head 8 can perform a crimping process in the highest crimping conditions, respectively, without being influenced by another crimping head.

Hereinafter, the operation | movement is demonstrated about the crimping device which consists of the said structure.

In addition, in this embodiment, as shown in FIG. 6, the liquid crystal panel 2 of a COG (Chip On Glass) system is made into the object of a crimping | compression-bonding operation. As shown in FIG. 7, the liquid crystal panel 2 has the second transparent substrate 3b made of glass sandwiched between the spacers 9 and the sealing member 7 in the same manner as the glass first transparent substrate 3a. And the liquid crystals 5 are encapsulated in the cell gap G formed between the substrates. The part in which the liquid crystal 5 is enclosed among the liquid crystal panels 2 is the main-body part of a liquid crystal panel.

The first transparent electrode 10a is formed on the inner surface of the first transparent substrate 3a, and the second transparent electrode 10b is formed on the inner surface of the second transparent substrate 3b. And the electrode terminal 48 connected to these transparent electrodes is formed on the flange part 3c of the 1st transparent substrate 3a. In addition, a connection terminal 49 for electrically connecting an external circuit is formed at the end of the substrate flange portion 3c. In addition, polarizing plates 51a and 51b are adhered to the outer surfaces of the transparent substrates 3a and 3b, respectively.

When the liquid crystal drive IC 15 is mounted on the liquid crystal panel 2, as shown in Fig. 6, first, the ACF 6 is moved to a predetermined position on the flange portion 3c of the substrate 3a. The liquid crystal drive IC 15 is placed on the ACF 6, and the liquid crystal drive IC 15 is heated to a predetermined temperature and pushed against the substrate flange 3c at the same time. The liquid crystal drive IC 15 and the substrate flange portion 3c are fixed to each other by the resin portion of the ACF 6 by this heat compression treatment, and at the same time, the liquid crystal drive is carried out by the conductive particles dispersed in the resin. Bumps for input and output of the IC 15 are electrically connected to the external connection terminal 49 and the electrode terminal 48 on the substrate, respectively.

In the crimping apparatus of the present embodiment, the ACF 6 and the liquid crystal drive IC 15 are connected to the liquid crystal drive IC 15 with respect to the liquid crystal panel 2 temporarily bonded to a predetermined position of the substrate flange portion 3c. The crimping operation, that is, the crimping operation is performed formally by 6), and the present crimping operation will be described below.

In FIG. 1, when the left table unit 23 is set to the left panel loading stage 12, the output shaft of the lock air cylinder 37 is extended and moved as shown in FIG. 2, and the lock piece of the front end is shown. 39 is fitted to the V-groove lock 36 of the panel support 1, and as a result, the panel support 1 is in a locked state which cannot be moved. Moreover, the air cylinder 29 on the slide table 26 has set the lifting table 28 to the upper position as an extended state.

Subsequently, the liquid crystal panel 2 to be worked on is placed on each panel support 1 in the left table unit 23 in FIG. 1, and is fixed by suction by air suction. The ACF 6 and the liquid crystal drive IC 15 are temporarily bonded to the liquid crystal panel 2 at predetermined positions. When the liquid crystal panel 2 is placed on the panel support 1, as shown in Fig. 3, the side end of the liquid crystal panel 2 is pushed against the guide pin 41, and the front end is pushed against the guide panel 18. do. As a result, the liquid crystal panel 2 is positioned at a fixed position on the panel support 1. In addition, the position of the guide panel 18 can be adjusted to a desired position by turning both or one side of the front-back adjustment knob 19 and the angle adjustment knob 21 suitably in FIG.

After completion of the above operation, when a predetermined start switch is operated, a linear driving device (not shown) for driving a table is operated to move the left table unit 23 along the guide rail 22 and to the crimping work stage 11. do. At this time, the right table unit 24 is conveyed from the crimping work stage 11 to the right panel loading stage 13. When the left table unit 23 is transported to the crimping work stage 11 and stopped there, the substrate flange portion 3c of the liquid crystal panel 2 on the panel support 1 in FIG. From the top position at appropriate intervals.

Then, as shown in Fig. 5, the lock air cylinder 37 is operated so that the lock piece 39 is separated from the V-groove block 36 to release the lock of the panel support 1, and the lifting air cylinder 29 ) Is activated and the output shaft is dragged. Then, since the force that pushed the panel support 1 upward is released, the panel support 1 is lowered as indicated by arrow G in FIG. 5, and the bottom surface of the substrate flange portion 3c of the liquid crystal panel 2 is lowered. It stops at a position in contact with or close to the upper end of the panel stand 4. Functionally, the liquid crystal panel 2 is fixed in a state in which it is in contact with the panel receiver 4 or stopped in a close or floating state. However, which state is set is adjusted by rotating the adjusting screw 34 in FIG. 4 to change the length of the balance spring 33.

Thereafter, the crimping head 8 accompanies the fluorine-hard-resin film table 47 and descends as shown by arrow F, and touches the upper surface of the liquid crystal drive IC 15 on the liquid crystal panel 2, which is then prescribed. To the panel stand (4). As a result, the ACF 6 interposed between the liquid crystal drive IC 15 and the substrate flange portion 3c of the liquid crystal panel 2 is heated and pressurized, and as a result, the liquid crystal drive IC 15 is connected to the substrate plan. It is adhere | attached to the branch part 3c. In this way, the main crimping of the liquid crystal drive IC 15 is completed. The intervening fluorine resin film tape 47 is interposed between the crimping head 8 and the liquid crystal drive IC 15 to avoid direct contact of the crimping head 8 with the bonding IC 15. .

In this crimping operation, the panel support 1 is supported in a state almost floating in the space by the elastic reaction force of the balance spring 33, so that the liquid crystal panel 2 can always move in the vertical direction. It is pushed by the crimping head 8 in the state. As a result, the liquid crystal drive IC 15 is conductively bonded onto the substrate of the liquid crystal panel 2 stably and stably without imbalance. In addition, in this embodiment, as shown by the arrow E in FIG. 4 and the arrow D in FIG. 5, since the panel support 1 was made to incline slightly, liquid crystal drive IC with respect to the liquid crystal panel 2 was carried out. Even when there is an imbalance in the temporary bonding state of (15), the entire pressing surface of the liquid crystal drive IC 15 can be uniformly pushed by the crimping head 8.

As described above, when the main pressing operation of the liquid crystal drive IC 15 to the liquid crystal panel 2 is completed, the pressing head 8 rises as shown by an arrow F 'in FIG. 5, and the air cylinder 29 Is activated and the output shaft moves up and down. By this extension movement, the lifting table 28 is raised to return the panel support 1 to the upper position shown in FIG. 2. 1, the left table unit 23 is returned from the crimping work table 11 to the left panel loading stage 12 again, and the liquid crystal panel 2 that has finished the crimping work is removed from the panel support 1. It is recovered.

While the left table unit 23 is set in the crimping work stage 11 and the above-mentioned crimping work is executed, the operator has untreated liquid crystal panel with respect to the right table unit 24 placed on the right panel loading stage 13. We perform by loading work of (2). When the crimping operation for the left table unit 23 set in the crimping work stage 11 is completed and the left table unit 23 is returned to the left panel loading stage 12, the right table unit 24 automatically It is conveyed to the crimping | compression-work stage 11, and receives this crimping operation | work. In this way, this crimping | compression-bonding operation | movement is performed with respect to the left table unit 23 and the right table unit 24 alternately.

As mentioned above, although this invention was demonstrated enumerating preferable embodiment, this invention is not limited to the Example and can be variously changed within the technical scope as described in a claim.

For example, in the above embodiment, the present invention is applied to the liquid crystal panel of the COG system shown in FIG. That is, the liquid crystal drive IC itself was considered as an electronic component pressed onto the liquid crystal panel. However, it goes without saying that the present invention can also be applied to the case where the heat seal and other electronic components such as TCP are electrically conductively connected to the liquid crystal panel. In this case, the pressing head 8 pushes the heat seal, TCP, or the like.

In addition, the number of the panel supporters 1 prepared for each table unit 23, 24 is not limited to five, It is possible to use one or less, more or more in some cases. In addition to the structure in which two table units are alternately transported to the crimping work stage 11 to continuously perform the crimping work, one table unit may be fixedly installed to perform the crimping work using only the table unit.

As described above, the present invention is a crimping device, which is preferable for uniformly pressing the entire surface area of electronic components such as a liquid crystal driving IC, a heat seal, etc. with respect to a liquid crystal panel and adhering without unevenness by a simple structure. Can be provided.

Claims (5)

A crimping apparatus for bonding an electronic component under pressure to a substrate flange portion of a liquid crystal panel having a body portion and a substrate flange portion, A panel support for supporting the body portion of the liquid crystal panel, A panel reception stand for supporting a substrate flange portion of the liquid crystal panel, and A crimping head disposed opposite the panel receiving table and movable in a direction close to the panel receiving table and away from the panel receiving table, The panel supporter is capable of parallel movement in the same direction as the movement direction of the crimping head, and is supported by a reaction force applying means. The liquid crystal panel pressing device according to claim 1, wherein the panel support is tiltable. The liquid crystal panel crimping device according to claim 1 or 2, wherein the electronic component is a tape carrier package in which a liquid crystal driving IC is mounted on a flexible printed plate having a wiring pattern formed thereon. The liquid crystal panel crimping device according to claim 1 or 2, wherein the electronic component is a liquid crystal driving IC. Place the body of the liquid crystal panel on the panel support, Place the substrate flange of the liquid crystal panel on the panel stand, An electronic component is placed by attaching an adhesive member on the substrate flange portion. In the manufacturing method of the liquid crystal device which has a crimping process which adhere | attaches an electronic component to the board | substrate flange part of a liquid crystal panel by pushing an electronic component to a panel acceptor direction by a crimping head, And the panel support is movable by parallel force in the same direction as the movement direction of the crimping head and supported by the reaction force applying means.