JP3743424B2 - Electronic component crimping apparatus and electronic component crimping method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component crimping apparatus and an electronic component crimping method for crimping an electronic component to an edge of a substrate such as a display panel.
[0002]
[Prior art]
A plurality of electronic components such as a driver flip chip and a tape carrier package in which a bare chip is mounted on a film carrier are mounted in parallel on the edge of a substrate such as a liquid crystal panel or a plasma display panel. When mounting these electronic components, the connection terminals such as bumps and outer leads formed on the lower surface of the electronic component at a narrow pitch are aligned with the electrodes arranged on the edge of the substrate, and the electronic component is mounted on the substrate. Is pressed against the electrode.
[0003]
In the mounting operation by this pressure bonding, it is necessary to press the electronic component while keeping the electronic component in a strictly parallel posture with respect to the substrate. For this reason, it is known that a crimping tool that contacts and presses electronic components and a pressure mechanism that applies a load to the crimping tool are provided separately so that the moment due to the pressure load is not transmitted to the crimping tool. (See Patent Document 1).
[0004]
[Patent Document 1]
JP 63-232345 A (FIG. 1)
[0005]
[Problems to be solved by the invention]
However, in the electronic component crimping apparatus shown in the above prior art, the pressurizing mechanism provided separately from the crimping tool has low rigidity, and it is difficult to generate high pressure for electronic components that require high crimping load. Met. In order to enable a high pressure bonding load in the above-described configuration, it is necessary to use a highly rigid mechanism part such as a guide, and there is a problem that the whole mechanism is complicated and expensive.
[0006]
Accordingly, an object of the present invention is to provide an electronic component crimping apparatus and an electronic component crimping method capable of uniformly crimping an electronic component to a substrate with a simple and low-cost structure.
[0007]
[Means for Solving the Problems]
The electronic component crimping apparatus according to claim 1 is an electronic component crimping device that crimps an electronic component to a substrate held by the substrate holding portion by a crimping head, and is supported by a base portion and receives the substrate from the lower surface side. A receiving portion, a head holding portion for holding the crimping head so as to be movable up and down, and raising and lowering the crimping head relative to the head holding portion and applying a pressing force to the crimping head from above to receive the lower receiving portion by the lower receiving portion. A lifting / lowering pressing mechanism that presses against the substrate, a reaction force receiving portion that receives an upward pressing reaction force during pressing by the lifting / lowering mechanism, and a fixed connection between the reaction force receiving portion and the base portion The pressure-bonding head unit composed of the pressure-bonding head, the head holding portion, and the lifting and lowering pressure mechanism is moved horizontally relative to the connecting portion to which the load during pressing is applied and the substrate. And a horizontal movement means.
[0008]
An electronic component crimping apparatus according to a second aspect is the electronic component crimping apparatus according to the first aspect, wherein the head holding portion and the lower receiving portion are coupled and horizontally move integrally.
[0009]
An electronic component crimping apparatus according to a third aspect is the electronic component crimping apparatus according to the first or second aspect, further comprising a fixing means for fixing the lower receiving portion to the base portion.
[0010]
The electronic component crimping apparatus according to claim 4 is the electronic component crimping apparatus according to any one of claims 1 to 3, comprising a plurality of the crimping head units, and a common reaction force receiving portion for pressing reaction force of these lifting and lowering pressing mechanisms. Receive by.
[0011]
According to a fifth aspect of the present invention, there is provided an electronic component crimping method comprising: a lower receiving portion supported by a base and receiving a substrate from the lower surface side; a head holding portion that holds the crimping head so as to be movable up and down; Elevating and depressing mechanism for raising and lowering the pressure-bonding head and applying a pressing force to the pressure-bonding head from above, a reaction force receiving portion for receiving an upward pressing reaction force at the time of pressing by the elevating and pressing mechanism, An electronic component crimping apparatus comprising: a coupling portion that fixedly couples the base portion; and a horizontal moving means that relatively moves a crimping head unit including a crimping head, a head holding portion, and an elevation pressing mechanism relative to the substrate. An electronic component crimping method for crimping an electronic component to the substrate by a crimping head, wherein the crimping head unit is relative to the electronic component mounting target position on the substrate. A positioning step of horizontally moving and aligning with the electronic component mounting target position, a crimping head lowering step of lowering the crimping head by the lifting / lowering pressing mechanism, and a pressing force acting on the crimping head from above by the lifting / lowering pressing mechanism. A pressing step in which the electronic component is pressed against the substrate by pressing against the substrate received by the lower receiving portion. In this pressing step, the upward pressing reaction force at the time of pressing by the lift pressing mechanism is It receives by the reaction force receiving portion, and a load at the time of pressing is applied to a connecting portion that fixedly connects the reaction force receiving portion and the base portion.
[0012]
According to the present invention, the pressing step of pressing the electronic component to the substrate by pressing the pressing head against the substrate received by the lower receiving portion by applying a pressing force to the pressing head from above by the elevation pressing mechanism. , The upward pressing reaction force during pressing by the up-down pressing mechanism is received by the reaction force receiving portion, and the load at the time of pressing is applied to the connecting portion that fixedly connects the reaction force receiving portion and the base portion supporting the lower receiving portion. Can prevent the bending load from acting on the pressure-bonding head and the mechanism portion holding the pressure-bonding head, and can evenly bond the electronic component to the substrate with a simple and low-cost structure. .
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a display panel assembling apparatus according to an embodiment of the present invention, FIG. 2 is a front view of an electronic component crimping apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic apparatus according to an embodiment of the present invention. 4 is a side view of the component crimping apparatus, FIG. 4 is a flowchart of the electronic component crimping method according to the embodiment of the present invention, and FIGS. 5 and 6 are operation explanatory views of the electronic component crimping apparatus according to the embodiment of the present invention. .
[0014]
First, the configuration of the display panel assembling apparatus will be described with reference to FIG. In FIG. 1, an ACF adhering portion 2, a component mounting portion 3 and a component crimping portion 4 are disposed on the upper surface of the base 1 from the upstream side (left side in FIG. 1). Positioning tables 5 </ b> A, 5 </ b> B, 5 </ b> C provided with a substrate holding unit 6 are arranged.
[0015]
The substrate 7 transported from the upstream side is carried into the positioning table 5 </ b> A and is held by the substrate holding unit 6. Then, the positioning table 5A is driven to position the substrate 7 with respect to the tape adhering unit 2a, and the tape adhering unit 2a performs the tape adhering operation, whereby the ACF tape cut to the edge of the substrate 7 to a fixed size. (Anisotropic conductive tape) is attached.
[0016]
The substrate 7 after the ACF tape is adhered is conveyed to the positioning table 5B and is held by the substrate holding unit 6. The electronic component 8 (see FIG. 3) is mounted on the ACF tape adhered to the substrate 7 by aligning the substrate 7 with respect to the component mounting unit 3a and causing the component mounting unit 3a to perform the component mounting operation. Then, it is temporarily crimped.
[0017]
Next, the substrate 7 on which the components are mounted is conveyed to the positioning table 5 </ b> B and held on the substrate holding unit 6. Then, the substrate 7 is aligned with the component crimping unit 4a, and the component crimping unit 4a performs a crimping operation, whereby the temporarily crimped electronic component is finally crimped to the substrate 7 with heat and load.
[0018]
Next, the structure of the component crimping unit 4a will be described with reference to FIGS. As described above, the component crimping unit 4a has a configuration as an electronic component crimping device that crimps an electronic component to the edge of the substrate 7 held by the substrate holding unit 6 by using a crimping head described later.
[0019]
2 and 3, an elongated base 10 that supports the entire component crimping unit 4a is disposed on the upper surface of the base 1 in the substrate transport direction. Side frames 11 are erected on both ends of the base 10, and the upper ends of the side frames 11 are rigidly connected by a horizontal upper frame 12. The two side frames 11 and the upper frame 12 constitute a portal frame whose lower end is fixed to the base 10.
[0020]
A guide rail 14 is disposed on the upper surface of the base 10 in the substrate transport direction, and the three sliders 15 slidably fitted to the guide rail 14 are connected to the crimping head units 13A, 13B, and 13 through a bottom plate 16, respectively. 13C is bound. The pressure-bonding head units 13A, 13B, and 13C are respectively connected to belts 26A, 26B, and 26C that are horizontally extended by a pair of pulleys 27 via connecting members 25, and the belts 26A, 26B, and 26C are connected to each other. Driven by motors 28A, 28B, and 28C, respectively.
[0021]
By driving the motors 28A, 28B, and 28C, the crimping head units 13A, 13B, and 13C move in the horizontal direction via the belts 26A, 26B, and 26C, respectively. Thereby, the crimping | compression-bonding position with respect to the board | substrate 7 by crimping | compression-bonding head unit 13A, 13B, 13C can be adjusted. Accordingly, the motors 28A, 28B, 28C and the belts 26A, 26B, 26C include horizontal moving means for horizontally moving the pressure-bonding head units 13A, 13B, 13C relative to the substrate 7 held by the substrate holding unit 6. It has become.
[0022]
As shown in FIG. 3, a position fixing electromagnet 9 is embedded in the crimping position set on the base 10, and the electromagnet 9 is excited while the crimping head units 13A, 13B, 13C are moved to the crimping position. Thus, the positions of the lower receiving portion 17 and the pressure bonding head units 13A, 13B, and 13C are firmly fixed via the slider 15 that is a magnetic body and the bottom plate 16 that is coupled to the slider 15. Therefore, the electromagnet 9 is a fixing means for fixing the lower receiving portion 17 that supports the substrate 7 to the base portion 10.
[0023]
Next, the configuration of the crimping head units 13A, 13B, and 13C will be described. As shown in FIG. 3, the lower end portion of the vertical head holding portion 18 is fixed to the bottom plate 16, and the lower receiving portion 17 is disposed on the bottom plate 16. The lower receiving portion 17 receives the edge portion of the substrate 7 from the lower surface side when the electronic component is crimped to the substrate 7. In this configuration, the lower receiving portion 17 is connected to the head holding portion 18 and integrally moves horizontally. A crimping head 21 is held by the head holding portion 18 by a slide mechanism including a guide rail 19 and a slider 20 so as to be movable up and down.
[0024]
The crimping head 21 has a crimping tool 21a at the lower end, and a cylinder 24 is coupled to the upper end with the rod 24a facing upward. Further, the crimping head 21 is biased upward by a tension spring 23. By driving the cylinder 24 to project the rod 24a and bringing the upper end of the rod 24a into contact with the upper frame 12, the crimping head 21 is pushed down. At this time, the crimping tool 21a presses the edge of the substrate 7 downward by bringing the crimping tool 21a into contact with the substrate 7 whose edge is received by the lower receiving portion 17.
[0025]
When the driving of the cylinder 24 is stopped and the rod 24 a is immersed, the crimping head 21 is pulled upward by the urging force of the tension spring 23. Therefore, the cylinder 24 and the tension spring 23 raise and lower the pressure-bonding head 21 relative to the head holding portion 18, and apply a pressing force to the pressure-bonding head 21 from above so that the edge of the substrate 7 received by the lower receiving portion 17. It is an elevating and pressing mechanism that presses against the part. In addition to the combination of the cylinder 24 and the tension spring 23 shown here, various mechanisms such as a linear motion mechanism using a motor and a feed screw can be used as the raising / lowering pressing mechanism.
[0026]
The component crimping unit is configured as described above. Next, referring to the flow of FIG. 4 and FIGS. 5 and 6, the electronic component crimping operation in the display panel assembling process and the pressure reaction force in the component crimping operation are described. The support will be described. Prior to the start of the electronic component crimping operation, an ACF tape is adhered to the edge of the substrate 7 by the ACF adhesive portion 2, and electronic components such as flip chips for display panel drivers are mounted on the ACF tape. And temporarily crimped. Then, the substrate 7 in this state is placed on the substrate holding unit 6 of the component crimping unit 4.
[0027]
First, the positioning table 5 is driven to align the edge portion of the substrate 7 held by the substrate holding portion 6 with the lower receiving portion 17 (see FIG. 4), and then the substrate 7 on which the electronic component 8 is mounted on the edge portion. On the other hand, the crimping head units 13A, 13B, and 13C are relatively horizontally moved to align with the electronic component 8 as the electronic component mounting target position (positioning step) (ST1). Then, the position of each crimping head unit is fixed by the electromagnet 9.
[0028]
Next, the rod 24a of the cylinder 24 is projected and brought into contact with the lower surface of the upper frame 12 to lower the crimping head 21, and the crimping tool 21a is brought into contact with the upper surface of the electronic component 8 (crimping head lowering step) (ST2). ). After that, by continuing the pressurization of the cylinder 24, a pressing force F is applied to the pressure-bonding head 21 from above to press against the edge of the substrate 7 received by the lower receiving portion 17 (pressing step). (ST3). The electronic component 8 is heated by the crimping tool 21a while maintaining this pressed state (ST4). By continuing the pressing and heating for a predetermined time, the electronic component 8 is pressure-bonded to the edge of the substrate 7 via the ACF tape.
[0029]
In this pressing step, the upward pressing reaction force R when pressed by the cylinder 24 is supported by the upper frame 12 as shown in FIGS. Therefore, the upper frame 12 is a reaction force receiving portion that receives the upward pressing reaction force R by the cylinder 24.
[0030]
The reaction force receiving portion is configured to receive the pressing reaction force R of each cylinder 24 of the plurality of pressure bonding head units 13A, 13B, and 13C by the common upper frame 12. The pressing reaction force R is transmitted to the base portion 10 by the portal frame constituted by the upper frame 12 and the side frame 11, and balances with the pressing force F here to hold the pressing load generated by the cylinder 24. The
[0031]
That is, the side frame 11 is a connecting portion that connects the upper frame 12 that is a reaction force receiving portion and the base portion 10. In this configuration of the connecting portion, a large upward load acts on the portal frame, but both the upper frame 12 and the side frame 11 are structural members that are easy to ensure high rigidity, and are necessary and sufficient. Can be given strong strength.
[0032]
On the other hand, as shown in FIGS. 5 and 6, a mechanism 24 including a movable portion such as the crimping head 21 and the head holding portion 18 is subjected to a cylinder 24 positioned immediately above the electronic component 8 to be pressed. The pressing force F is applied only in the form of an axial compressive load. That is, the bending load does not act on the mechanism portion such as the crimping head 21 in the transmission path of the pressing force F.
[0033]
Therefore, the electronic component can be kept in a correct parallel posture with respect to the substrate when pressed by the crimping head 21, and even when targeting an electronic component that requires a high crimping load, a highly rigid crimping mechanism is not required, With a simple and low-cost structure, the electronic component can be uniformly bonded to the substrate.
[0034]
In the above-described example, the electronic head is pressed by the electronic component in a state where the electronic component is previously mounted on the electronic component mounting target position of the substrate. However, the present invention is not limited to this. For example, the present invention can also be applied to a case where the crimping head holds an electronic component by vacuum suction or the like, and the electronic component is pressed against the electronic component mounting target position on the substrate by the crimping head.
[0035]
【The invention's effect】
According to the present invention, the pressing step of pressing the electronic component to the substrate by pressing the pressing head against the substrate received by the lower receiving portion by applying a pressing force to the pressing head from above by the elevation pressing mechanism. , The upward pressing reaction force during pressing by the up-down pressing mechanism is received by the reaction force receiving portion, and the load at the time of pressing is applied to the connecting portion that fixedly connects the reaction force receiving portion and the base portion supporting the lower receiving portion. Therefore, it is possible to prevent the bending load from acting on the crimping head and the mechanism part that holds the crimping head, and to uniformly crimp the electronic component to the substrate with a simple and low-cost structure. Can do.
[Brief description of the drawings]
FIG. 1 is a perspective view of a display panel assembling apparatus according to an embodiment of the present invention. FIG. 2 is a front view of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 4 is a side view of an electronic component crimping apparatus. FIG. 4 is a flowchart of an electronic component crimping method according to an embodiment of the invention. FIG. 5 is an operation explanatory diagram of the electronic component crimping apparatus according to an embodiment of the invention. Operation explanatory diagram of electronic component crimping apparatus of one embodiment of the present invention
2 ACF adhering portion 3 Component mounting portion 4 Component pressure bonding portion 6 Substrate holding portion 10 Base portion 11 Side frame 12 Upper frame 13A, 13B, 13C Pressure bonding head unit 17 Lower receiving portion 18 Head holding portion 21 Pressure bonding head 23 Tension spring 24 Cylinder

Claims (5)

An electronic component crimping apparatus for crimping an electronic component to a substrate held by a substrate holding unit by a crimping head, wherein the lower part is supported by a base and receives the substrate from the lower surface side, and the crimping head can be moved up and down. A holding head to be held, and a raising / lowering press for raising and lowering the pressure-bonding head with respect to the head-holding portion and pressing the pressure-receiving head against the substrate received by the lower-receiving portion by applying a pressing force from above. A mechanism, a reaction force receiving portion that receives an upward pressing reaction force during pressing by the elevating and pressing mechanism, and a connection in which the reaction force receiving portion and the base portion are fixedly connected and a load is applied during the pressing And a horizontal moving means for horizontally moving the pressure-bonding head unit including the pressure-bonding head, the head holding portion, and the elevation pressing mechanism with respect to the substrate. Electronic parts crimping machine to. 2. The electronic component crimping apparatus according to claim 1, wherein the head holding portion and the lower receiving portion are connected and horizontally move integrally. The electronic component crimping apparatus according to claim 1, further comprising a fixing unit that fixes the lower receiving portion to the base portion. The electronic component crimping apparatus according to claim 1, wherein a plurality of the crimping head units are provided, and a pressing reaction force of these lifting and lowering pressing mechanisms is received by a common reaction force receiving portion. A lower receiving portion supported by the base and receiving the substrate from the lower surface side, a head holding portion for holding the crimping head so that it can be raised and lowered, and raising and lowering the crimping head relative to the head holding portion and An elevating and depressing mechanism for applying a pressing force, a reaction force receiving portion for receiving an upward pressing reaction force at the time of pressing by the elevating and depressing mechanism, and a connecting portion for fixedly connecting the reaction force receiving portion and the base portion The electronic component is crimped to the substrate by the crimping head by the electronic component crimping apparatus provided with a horizontal moving means for horizontally moving the crimping head unit including the crimping head, the head holding portion, and the lifting and pressing mechanism to the substrate. Electronic component crimping method
An alignment step of moving the crimping head unit relatively horizontally with respect to the electronic component mounting target position on the substrate to align with the electronic component mounting target position, and a crimping head lowering for lowering the crimping head by the lifting and lowering pressing mechanism And a pressing step of pressing the electronic component to the substrate by pressing the pressing head against the substrate received by the lower receiving portion by applying a pressing force to the crimping head from above by the lifting and pressing mechanism. In the pressing step, an upward pressing reaction force when pressed by the lifting / lowering pressing mechanism is received by the reaction force receiving portion, and a load at the time of pressing is applied to a connecting portion that fixedly connects the reaction force receiving portion and the base portion. An electronic component crimping method characterized by comprising:

Images