JP3775960B2 - Electronic component crimping apparatus and crimping method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component crimping apparatus and a crimping method for crimping an electronic component to a substrate such as a display panel.
[0002]
[Prior art]
Electronic components such as a driver chip are mounted on a substrate such as a display panel. This mounting operation is performed by first mounting an electronic component on a substrate supplied with a resin adhesive at the mounting position, and heating the electronic component while pressing it with a pressure bonding head to maintain a predetermined load and thermal condition. An electronic component is bonded to a substrate. In this crimping process, a large load is applied to the substrate, and therefore, a lower receiving portion is provided for receiving the lower surface of the substrate and supporting the load at the pressing position by the crimping tool.
[0003]
[Problems to be solved by the invention]
In order to ensure good pressure bonding quality, it is required to press the electronic component with a uniform load with a pressure bonding tool. For this reason, the lower surface of the crimping tool and the upper surface of the receiving member must be aligned with high accuracy. Conventionally, a plurality of adjustment bolts are provided on the crimping head, and by adjusting the tightening degree of the adjustment bolts, Matching the lower surface with the lower surface has been performed. However, since this adjustment operation is performed while confirming a delicate contact condition, the operation requires time and effort, and a method of performing this surface alignment operation efficiently and accurately has been desired.
[0004]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component crimping apparatus and a crimping method that can perform surface adjustment of a crimping tool and a receiving portion efficiently and with high accuracy and ensure crimping quality.
[0005]
[Means for Solving the Problems]
The electronic component crimping device according to claim 1 is an electronic component crimping device for crimping an electronic component by pressing the electronic component against the substrate by a crimping head, and holds the substrate and positions the substrate with respect to the crimping head. And a pressing means for raising and lowering the pressure bonding head relative to the substrate, and a lower receiving portion for receiving the lower surface of the substrate pressed by the pressure bonding head with a lower receiving surface, the lower receiving portion, The base comprises a base member that is supported by a plurality of piezoelectric support members that are formed by arranging crimping elements in a direction perpendicular to the base surface, and the base and the base member are coupled by a plurality of connecting bolts . by the shape of the combine and the lower receiving base member and the base in a state in which sandwich the piezoelectric supporting portions from above and below, the lower receiving surface of the lower receiving base member upper surface by driving the plurality of piezoelectric elements It is intended to change the.
[0007]
According to the present invention, a plurality of piezoelectric elements are arranged in a vertical direction with respect to the lower receiving surface in the lower receiving portion that supports the lower surface of the substrate in the crimping position, and the upper surface shape of the lower receiving portion is changed by driving the plurality of piezoelectric elements. By doing so, it is possible to efficiently and precisely perform surface alignment between the lower receiving portion and the crimping tool.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component crimping apparatus according to an embodiment of the present invention, FIG. 2 is a front view of the electronic component crimping apparatus according to an embodiment of the present invention, and FIGS. 3, 4, and 5 are books. It is a front view of the receiving part of the crimping | compression-bonding apparatus of the electronic component of one embodiment of invention.
[0009]
First, the configuration of an electronic component crimping apparatus will be described with reference to FIGS. 1 and 2, a positioning table 2 is disposed on a base 1. The positioning table 2 is configured by stacking an X table 3, a Y table 4, and a θ table 5 and mounting a substrate holder 6 thereon. A substrate 7 to which an electronic component is crimped is placed and held on the substrate holding unit 6. An anisotropic conductive agent 8 for adhering electronic components is attached to the substrate 7 in the previous step, and an electronic component 9 is mounted thereon. By driving the positioning table 2, the position of the substrate 7 is adjusted.
[0010]
A crimping portion 10 is disposed above the positioning table 2. A pressure bonding head 13 is provided on the main body frame 11 of the pressure bonding portion 10 so as to be movable up and down by a head vertical movement mechanism 12. By driving the head vertical movement mechanism 12, the pressure-bonding head 13 moves up and down and presses the pressure-bonding head 13 against the substrate 7 with a predetermined load. That is, the head vertical movement mechanism 12 is a pressing means.
[0011]
A substrate recognition camera 14 is disposed above the crimping portion 10. By recognizing the position of the substrate 7 with the camera 14 and driving the positioning table 2 based on the recognition result, the substrate 7 is held at the correct crimping position by the crimping head 13. Then, by driving the head vertical movement mechanism 12 in this state, the pressure-bonding head 13 presses the electronic component 9 mounted on the substrate 7 in the previous process. At this time, the lower surface of the substrate 7 is supported by the lower receiving surface of the lower receiving portion 15, and the pressing load by the pressure bonding head 13 is supported.
[0012]
Next, the structure of the lower receiving part 15 will be described with reference to FIG. As shown in FIG. 3, the lower receiving portion 15 is configured such that a horizontal lower receiving base member 21 is supported on a base portion 20 by a piezoelectric supporting mechanism including a plurality of piezoelectric supporting portions 26. That is, the lower receiving base portion 21 is coupled to the base portion 20 by a plurality of connection bolts 22 and supported from below by a plurality of piezoelectric support portions 26 having a structure in which the piezoelectric element 23 is sandwiched from above and below by the holding members 24 and 25. ing. Therefore, the piezoelectric support portion 26 is sandwiched from above and below by the base portion 20 and the lower receiving base member 21. The lower receiving portion 15 has a structure in which a plurality of piezoelectric elements 23 are arranged in a direction perpendicular to the lower receiving surface.
[0013]
By applying a voltage to the piezoelectric element 23, the piezoelectric element 23 is displaced in the vertical direction according to the voltage, and pushes up the lower surface of the lower base member 21 upward. At this time, the lower receiving base member 21 is held in a state where the tension generated in the connecting bolt 22 and the push-up force generated by the piezoelectric element 23 are balanced.
[0014]
Since a plurality of the piezoelectric support portions 26 are arranged along the width direction of the lower receiving portion 15, different displacements are generated in each piezoelectric support portion 26 by controlling the voltage applied to the piezoelectric element 23 at each position. Can be made. That is, the deflection state of the lower receiving base member 21 can be set to a different deflection amount at each position along the width direction. Thereby, the shape of the lower receiving surface 21a of the upper surface of the lower receiving base member 21 changes.
[0015]
The electronic component crimping apparatus is configured as described above, and the surface adjustment of the lower base member 21 during the electronic component crimping will be described below with reference to FIGS. 4 and 5. In crimping an electronic component, it is necessary to press the electronic component against the substrate with a uniform load. For this reason, the lower surface of the crimping head 13 that contacts and presses the electronic component and the upper surface of the lower base member 21 that contacts the lower surface of the substrate and supports the pressing load need to be properly aligned.
[0016]
However, when the size of the lower base member 21 is increased, it is not easy to ensure a correct lower surface in which the straightness is maintained at the correct level over the entire width. For example, as shown in FIG. 4, the height of the upper surface of the lower receiving base member 21 may be partially undulated (see the lower receiving surface 21′a indicated by a broken line in FIG. 4).
[0017]
In such a case, the flatness adjustment is performed based on the flatness measurement result of the upper surface of the lower receiving base member 21. This adjustment is performed by controlling the voltage applied to the piezoelectric element 23. That is, the voltage applied to each piezoelectric element 23 is changed according to the planar shape of the receiving surface 21a in the no-load state, and the lower part is supported with a larger pushing force. As a result, a substantially correct linear bearing surface such as the bearing surface 21a indicated by the solid line is ensured, whereby the parallelism with the lower surface of the crimping head 13 is correctly maintained, and the electronic component can be kept under good crimping conditions. Crimping can be performed.
[0018]
Further, as shown in FIG. 5, the straightness accuracy of the crimping head 13 is not properly maintained, and the place where the straight lower surface 13'a indicated by the broken line should be correctly changed to the lower surface 13a indicated by the solid line due to the deformation. There may be a bent shape. In such a case, on the contrary, the linear lower support surface (see the lower support surface 21′b shown by a broken line) is adjusted to a shape corresponding to the lower surface 13a of the crimping head 13 in a no-load state. Also in this case, similarly, by changing the voltage applied to the piezoelectric element 23 along the width direction of the lower base member 21, the lower receiving surface (refer to the lower receiving surface 21 b shown by a solid line) is made to be on the crimping head 13. It can be set to a shape that follows the lower surface.
[0019]
In this way, by configuring the lower receiving portion 15 as described above, the shape of the lower receiving surface 21a can be set to a desired deflection shape according to the state of the electronic component to be pressed and the pressure bonding head 13 used. Thus, a flexible crimping apparatus capable of setting various crimping conditions is realized, and the crimping quality can be ensured while maintaining appropriate crimping conditions. Further, by adopting a configuration in which the lower receiving portion 15 is adjusted by the piezoelectric element 23, finer adjustment can be easily performed as compared with the conventional mechanical adjustment method using the adjustment bolt, and the accuracy of the adjustment work is increased. In addition, workability can be improved.
[0020]
【The invention's effect】
According to the present invention, a plurality of piezoelectric elements are arranged in a vertical direction with respect to the lower receiving surface in the lower receiving portion that supports the lower surface of the substrate in the crimping position, and the upper surface shape of the lower receiving portion is changed by driving the plurality of piezoelectric elements. Since it did in this way, the surface alignment of a receiving part and a crimping | compression-bonding tool can be performed efficiently with high precision, and crimping | compression-bonding quality can be ensured.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 2 is a front view of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 4 is a front view of a lower receiving portion of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 5 is a front view of a lower receiving portion of an electronic component crimping apparatus according to an embodiment of the present invention. Front view of the receiving part of the crimping device for electronic parts [Explanation of symbols]
2 Positioning table 6 Substrate holding part 7 Substrate 9 Electronic component 10 Crimping part 12 Head vertical movement mechanism 13 Crimping head 15 Lower receiving part 21 Lower receiving base member 21a, 21b Lower receiving surface 23 Piezoelectric element 26 Piezoelectric supporting part

Claims (1)

An electronic component crimping apparatus for crimping an electronic component by pressing the electronic component against a substrate with a crimping head, the substrate holding unit for holding the substrate and positioning the crimping head relative to the substrate, and the crimping head relative to the substrate And a pressing means for raising and lowering and a lower receiving portion for receiving the lower surface of the substrate pressed by the pressure bonding head with a lower receiving surface, and the lower receiving portion has a pressure bonding element on the base portion with respect to the lower receiving surface. It consists of a lower receiving base member supported by a plurality of piezoelectric support portions arranged in a vertical direction, and the base support portion and the lower receiving base member are coupled by a plurality of connecting bolts , thereby sandwiching the piezoelectric support portion from above and below. the lower receiving combines the base member and the base in a state, an electronic unit, characterized in that to change the shape of the lower receiving surface of the lower receiving base member upper surface by driving the plurality of piezoelectric elements Of the crimping device.

Images