JP3104195B2 - Thermocompression bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
D) via an anisotropic conductive film (hereinafter ACF)
The present invention relates to a thermocompression bonding device for electrically and mechanically connecting (hereinafter, TAB) by thermocompression bonding.

[0002]

2. Description of the Related Art As the above-mentioned thermocompression bonding apparatus, a one-head type and a separation head type are conventionally known. As shown in FIGS. 4 and 5, in the one-head type, a plurality of TABs 4 are placed on an LCD 2 mounted on an LCD holding table (hereinafter referred to as a stage) 1 via an ACF 3 and a single long head 5 is heated. Thermocompression bonding at once. The head 5 is held by a holder 6, and the holder 6 is driven up and down by a pressurizing cylinder 7 fixed to the apparatus main body. The holder 6 has a pair of linear guides 8 fixed to the apparatus body.
Are provided with guide shafts 9 which are slidably guided.

On the other hand, as shown in FIG.
Each TAB has a dedicated heating head 11, and each heating head 11 is provided with a pressurizing cylinder 1
According to 2, the thermocompression bonding of each TAB is performed separately. Each heating head 11 has a portal structure, and is attached to one plate 13 in parallel. Reference numeral 14 in the figure denotes a valve for adjusting the pressure of each pressurizing cylinder 12.

[0004]

However, according to the one-head type thermocompression bonding apparatus described above, since a large number of TABs 4 are thermocompression-bonded at once by the long head 5, it is necessary to perform thermocompression bonding under uniform conditions over the entire area. There was a problem that was difficult. That is, although the parallelism of the pressing surface is required to be about 5 μm, it becomes difficult to secure the parallelism as the size of the LCD 2 increases, and it is also difficult to make the conditions such as the pressing force and the temperature uniform over the entire area. Was.

[0005] Further, even if the length or the number of TABs 4 changes, it is not necessary to replace the thermocompression bonding head, but it is necessary to change the pressing force and temperature, and these changes are difficult. Especially T
When the thickness of AB4 changes from lot to lot, there is a possibility that poor connection of thermocompression bonding may occur.

On the other hand, according to the separation head type thermocompression bonding apparatus,
Since each heating head 11 is individually driven by the pressurizing cylinder 12, the same number of driving systems as the heating head 11 are required, and there is a disadvantage that the cost is increased. In addition, since the number of pipe connections with each drive system is large, the workability for setup change is poor, and it is necessary to change conditions such as pressure adjustment for each setup change. Further, since the heating head 11 is located at the center of the portal structure, the mechanical accuracy was not stable due to the influence of the heater heat. Moreover, the maintenance workability was poor due to the complicated mechanism.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and has as its object to provide a thermocompression bonding apparatus capable of performing highly reliable thermocompression bonding with a simple structure and good workability. .

[0008]

SUMMARY OF THE INVENTION The thermocompression bonding apparatus according to claim 1, and a pressure cylinder fixed to the apparatus main body, The present
A connection member guided up and down by the body and driven up and down by a pressure cylinder , and a connection member through a pressing member.
With a thermo-compression head attached to the lower end.
With the axis perpendicular to the long direction of the contact surface of the thermocompression bonding head.
As a center, a plurality of
And a head holding member .

[0009] The thermocompression bonding apparatus according to claim 2 is a pressing member.
Is composed of a pressure adjusting part, a shaft, and a spring,
At the upper end of the shaft, a pressing adjustment unit is attached, and the lower end of the shaft
On the side, a head holding member is attached via a spring
The pressure adjustment section changes the amount of deflection of the spring.
The pressing force is adjusted by changing the pressing force .

[0010]

[0011]

In the thermocompression bonding apparatus according to the first aspect, the pressure is applied.
When the connection member is driven up and down by the cylinder, the connection member
A plurality of head holding members via pressing members
It is mounted so that it can be raised and lowered, and a thermocompression
The axis perpendicular to the longitudinal direction of the contact surface of the thermocompression bonding head.
As a center, it is held rotatably only in the longitudinal direction.

[0012] In the thermocompression bonding apparatus according to the second aspect,
The pressure adjustment unit changes the amount of deflection of the spring.
The pressing force is adjusted more.

[0013]

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the thermocompression bonding apparatus of the present invention will be described below with reference to the drawings.

FIGS. 1 to 3 show the configuration of an embodiment of the present invention. In these figures, portions corresponding to those of the conventional example shown in FIGS. 4 and 5 are denoted by the same reference numerals, and description thereof will be omitted as appropriate. A stage 1 is attached to the apparatus main body 21, and an LCD 2, an ACF
3 and TAB4 are sequentially laminated. Further, the pressure cylinder 7 is fixed to the apparatus main body 21 in the vertical direction, and first linear guides 24 a and 24 b are connected to a rod 22 of the pressure cylinder 7 via an arm 23. The linear guide 24a is vertically fixed to the apparatus main body 21, and the linear guide 24b is a linear guide 24.
a to be movable in the vertical direction.

The connection block 25 is connected to the linear guide 24b.
Are attached with two screws 26, and the connection block 25 is positioned with respect to the linear guide 24b by two positioning pins 27. Connection block 25
Are connected to a plurality of sets of second linear guides 28a and 28b. The linear guide 28a is fixed to the connection block 25 in parallel in the vertical direction.
Are vertically movable by being guided by the linear guides 28a. Further, head holders 29 are fixed to the linear guides 28b, respectively, and thermocompression bonding heads 30 are attached to lower ends of the head holders 29, respectively. And, as shown in FIG.
The thermocompression head 30 is moved in the direction of arrow AA (the thermocompression head 30
Is perpendicular to the long side of the contact surface 30a that contacts the TAB4.
Rotation direction with the straight support shaft 31 as the rotation axis (of the contact surface 30a)
Only in the longitudinal direction)), it is rotatably supported. one
On the other hand, as shown in FIG.
A rotation axis is a straight axis (an axis perpendicular to the paper)
The rotation direction (short direction of the contact surface 30a)
The receiving head 30 is fixed and does not rotate.

On the upper surface of the connection block 25, a micrometer 32 is provided at a position corresponding to the head holder 29, respectively.
The spindle 33 of the micrometer 32 is inserted into a vertically formed hole 29a in the upper end surface of the head holder 29, as shown in FIG. A pressure spring 34 is mounted between the lower end surface of the spindle 33 and the bottom surface of the hole 29a, and presses the head holder 29 downward. In addition,
Reference numeral 35 shown in FIG. 1 is a heater provided in the thermocompression bonding head 30.

Next, the operation of this embodiment will be described. When the rod 22 of the pressure cylinder 7 is at the uppermost position, the thermocompression bonding head 30 and the TAB 4 are not connected. When the pressure cylinder 7 is operated and the rod 22 is lowered, the thermocompression bonding head 30 is integrally formed via the arm 23, the first linear guide 24b, the connection block 25, the second linear guides 28a and 28b, and the head holder 29. Descend. After the thermocompression bonding head 30 comes into contact with the TAB 4 and before reaching the stroke end of the pressing cylinder 7, the pressing spring 34 is compressed by an amount equal to the distance therebetween, and a pressing force is applied to the TAB 4.

Since the stroke of the pressurizing cylinder 7 is always constant, even if the pressurizing unit is exchanged together with the connection block 25, if the amount of deflection of the pressurizing spring 34 is adjusted by the micrometer 32 after the exchange, the load before attaching and detaching is adjusted. Pressure can be reproduced. Further, since the thermocompression bonding head 30 is rotatable with respect to the head holder 29, even when the parallelism between the stage 1 and each of the heads 30 is not sufficient, the thermocompression bonding head 30 may rotate and hit one side. And can be parallel. When the thermocompression bonding head 30 does not rotate smoothly due to a large frictional force on the surface of the TAB 4, the thermocompression bonding head 30 is brought into direct contact with the stage 1 and the rotation of the head 30 is locked in this state. May be.

When the size of the LCD 2 is changed,
The screw 26 is removed and the connection block 25 is replaced. At this time, the mounting position of the connection block 25 to the first linear guide 24b can be reproduced by the positioning pin 27. At this time, the distance between the screw 26 and the positioning pin 27 is set so as to correspond to the size of the LCD 2 having the maximum size. In addition, a temperature sensor is attached to the center of each thermocompression bonding head 30, and the temperature is controlled by an external temperature controller so that each temperature is constant.

According to the present embodiment, since the drive system is driven by one pressurizing cylinder 7, the structure is simplified and the cost can be reduced. Further, since the thermocompression bonding heads 30 can move up and down independently of each other, the thermocompression bonding of the TAB 4 to the large LCD can be performed with high accuracy. Similarly, different lots of TAB can be handled,
Paralleling of D2 and head 30 is also facilitated. further,
Since the structure of the drive system is simple, setup change can be performed in a short time. Further, since the thermocompression bonding head 30 has an open structure, it is possible to prevent a decrease in mechanical accuracy due to the influence of heat from the heater.

[0022]

As described above, according to the thermocompression bonding apparatus according to the first aspect, the connection members are respectively provided with the pressing members.
And a plurality of head holding members
And a thermocompression head at the lower end of the holding member.
Along the axis perpendicular to the long direction of the contact surface,
Since only the head is rotatably held , the crimping conditions can be independently set for each head with a simple driving system, and high-quality thermocompression bonding with good workability can be performed.

Further, according to the thermocompression bonding apparatus of the second aspect, the pressing adjustment section can change the amount of deflection of the spring.
Since the pressing force is adjusted by (1) and (2), the pressing force of each head can be arbitrarily set individually.

[0024]

[Brief description of the drawings]

FIG. 1 is a side view showing a configuration of an embodiment of a thermocompression bonding apparatus according to the present invention.

FIG. 2 is a front view of FIG.

FIG. 3 is an enlarged explanatory view illustrating a configuration of a pressure adjusting unit in FIG. 1;

FIG. 4 is a front view showing a configuration of an example of a conventional one-head type thermocompression bonding apparatus.

FIG. 5 is a side view of FIG. 4;

FIG. 6 is a perspective view showing a configuration of an example of a conventional separation head type thermocompression bonding apparatus.

[Explanation of symbols]

 2 LCD (Liquid Crystal Substrate) 3 ACF (Anisotropic Conductive Film) 4 TAB (Drive IC) 7 Pressure Cylinder 21 Device Main Body 25 Connection Block (Connection Member) 29 Head Holder (Head Holding Member) 30 Thermocompression Head 34 Pressure Spring (pressing member)

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/36 H01L 21/603 H01R 43/00 H05K 3/32

Claims (2)

(57) [Claims] 1. A driving method for driving a liquid crystal substrate through an anisotropic conductive film.
In a thermocompression bonding apparatus for connecting C by thermocompression bonding, a pressurizing cylinder fixed to an apparatus main body, a connecting member guided to the apparatus main body so as to be able to move up and down, and driven up and down by the pressurizing cylinder; via the pressing member vertically movably mounted respectively, each to a lower thermal compression bonding head, the heat pressure
Around the axis perpendicular to the long direction of the contact surface of the wearing head,
And a plurality of head holding members for holding the head rotatably only in the longitudinal direction . 2. The pressing member according to claim 1, wherein the pressing member includes a pressing adjusting portion, a shaft, and a pressing member.
And a spring, and on the upper end side of the shaft, the pressing adjustment portion is attached,
At the lower end of the shaft, the head is connected via the spring.
A holding member, and the pressing adjustment portion changes a deflection amount of the spring.
The thermocompression bonding apparatus according to claim 1, wherein the pressing force is adjusted by adjusting the pressing force .