KR101139252B1 - A bonding appartus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for attaching an integrated circuit device to a liquid crystal display panel. In detail, the flatness of the bonding unit can be easily managed, and the bonding process of the integrated circuit device can be performed on liquid crystal display panels of various sizes. The purpose is to provide a bonding apparatus that can be performed.

The present invention for achieving this object is a frame; In order to attach an integrated circuit device to a liquid crystal display panel, a bonding unit is provided in a plurality of frames and a bonding unit connected to the bonding unit to adjust the distance between the bonding unit provides a bonding device, characterized in that have.

Description

Bonding device {A bonding appartus}

1 is a front view of a bonding apparatus according to the present invention.

2 is a front view of the bonding portion according to the present invention.

3 and 4 is an operation of the bonding apparatus according to the present invention.

5 is a front view showing another embodiment of the bonding apparatus according to the present invention.

6 is a control block diagram of the bonding apparatus according to the present invention.

7 and 8 are perspective views illustrating a process of attaching an ACF to a liquid crystal display panel.

9 is a side view illustrating a state in which an ACF is attached to a liquid crystal display panel.

FIG. 10 is a perspective view showing an integrated circuit device pressed against a liquid crystal display panel. FIG.

FIG. 11 is a side view illustrating an integrated circuit device pressed onto a liquid crystal display panel. FIG.

12 is a perspective view showing a main compression process of an integrated circuit element.

FIG. 13 is a side view showing that an integrated circuit device is principally compressed on a liquid crystal display panel.

14 is a perspective view showing the connection between the integrated circuit device and the PCB.

Description of the Related Art [0002]

1: frame 2: cam plate

3: East Shanghai 4: Horizontal Movement

5: guide rail 10: bonding unit

12: body portion 14: crimping portion

16: heating part 70: liquid crystal display panel

72: ACF 74: integrated circuit device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus, and provides an invention capable of attaching circuit integrated elements to liquid crystal display panels of various sizes without replacing the bonding apparatus.

The bonding device is a device for attaching a circuit integrated element to a circuit line of a liquid crystal display panel by using high temperature and high pressure. Conventionally, as described in Korean Laid-Open Patent Publication No. 1999-39801, a long bar type heating member and a crimping part are used. The integrated circuit device was mounted on the liquid crystal display panel mounted on the backup member, and the resultant was pressurized by high temperature and high pressure.

In general, a liquid crystal display device using a liquid crystal display panel is composed of two panels in which an electric field generating electrode is formed and a liquid crystal layer inserted therebetween, by applying a voltage to the electrode to rearrange the liquid crystal molecules of the liquid crystal layer. A display device for controlling the transmittance of light passing through a layer.

Such a liquid crystal display device includes a liquid crystal display panel in which pixels are arranged to form an image display area, and a driving circuit for inputting a driving signal to the liquid crystal display panel, and the liquid crystal display is driven from the driving circuit through a circuit pattern provided around the liquid crystal display panel. The driving signal is input to the display panel.

In the periphery of the liquid crystal display panel, a plurality of integrated circuit devices (ICs) for controlling an input signal at a predetermined timing to generate an output signal are disposed.

In the process of mounting an integrated circuit device (IC) on a liquid crystal display panel, first, an anisotropic conductive film (ACF) is attached to a circuit pattern provided on the edge of the liquid crystal display panel, and then a preheating head is used. Heat the ACF.

Thereafter, after aligning the output side terminal of the integrated circuit element with the circuit pattern of the liquid crystal display panel, pressing is carried out, and main bonding is performed using the above-described long bar type bonding apparatus.

Then, the above process is completed by thermocompression-bonding the input side terminal of the integrated circuit element and the terminal group on the drive input PCB using the thermocompression bonding tool using ACF.

However, in the prior art, the liquid crystal display panel and the integrated circuit device have to be pressed and heated by using the long bar type crimping portion as wide as the width of the liquid crystal display panel. In order to have a great effect, there was an inconvenience of periodically checking and managing the flatness of the adhesion member.

In addition, there is a problem that the longer the length of the crimping portion of the long bar type becomes difficult to process the crimping portion.

Further, the flatness of the table-shaped settled portion and the crimped portion provided under the crimped portion to settle the liquid crystal panel also has a great influence on the adhesion characteristics of the liquid crystal display panel and the integrated circuit device. Adjusted on the basis of the flatness, there was a problem that the flatness of the upper part of the settlement needs to be readjusted when the entire long bar type crimp is replaced.

In addition, when a crimping portion for attaching an integrated circuit device to a liquid crystal display panel having a specific size is used for a liquid crystal display panel having a different size, in particular, when a bonding apparatus used for a large liquid crystal display panel is used for a small liquid crystal display panel. There is a problem in that thermal strain occurs in a portion that is in contact with the integrated circuit device by heat compression and in a portion that is not, and thus the flatness of the crimp is uneven. There was a problem to use.

In addition, when some of the plurality of integrated circuit devices are composed of different materials and different integrated circuit devices, the proper crimping conditions and the heating conditions should be different depending on the material. However, the long bar type crimps have the same temperature. Since the liquid crystal display panel and the integrated circuit device are attached at the same pressing force, there is a problem that only one type of integrated circuit device can be used when the long bar type crimp is used.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a bonding apparatus that can easily manage the flatness of the pressing portion and the settle portion attached to the bonding apparatus.

In addition, another object of the present invention is to provide a bonding apparatus capable of performing an attaching process of an integrated circuit device regardless of the size of a liquid crystal display panel.

In addition, in the case of attaching an integrated circuit device made of various materials, another object of the present invention is to provide a bonding device capable of performing a pressing process and a heating process using pressure and temperature according to characteristics of each integrated circuit device.

The present invention for achieving this object is a frame; In order to attach an integrated circuit device to a liquid crystal display panel, a bonding unit is provided in a plurality of frames and a bonding unit connected to the bonding unit to adjust the distance between the bonding unit provides a bonding device, characterized in that have.

In addition, each of the bonding portion is characterized in that each of the Shanghai East to guide the Shanghai East of the bonding portion.

In addition, the shanghai eastern part is characterized by consisting of a pneumatic cylinder.

The moving unit is connected to the bonding unit and a horizontal moving unit for horizontally moving the bonding unit; It characterized in that it further comprises a guide rail for guiding the horizontal movement of the bonding portion.

The horizontal moving unit and the drive motor provided on one side of the frame; A pulley connected to the driving motor and provided at upper and lower portions of the frame; A connection belt connecting the pulley; And a cam plate coupled to the connecting belt and connected to each of the bonding parts to convert the shank movement of the connecting belt into the horizontal movement of the bonding parts.

In addition, a shangdong portion connected to the bonding portion is provided with a protrusion inserted into the cam plate, and the cam plate is provided with a moving slit for seating the protrusion and converting the shanghai movement of the cam plate to left and right movement of the bonding portion. It is characterized by.

The moving slits are provided in plural and are formed in the up and down direction in the cam plate, and the intervals thereof are gradually reduced from the lower side to the upper side.

In addition, the pulleys are provided on both upper and lower sides of the frame, respectively, and the driving motor is connected to the pulleys provided on one lower side of the frame, and the pulleys provided on both upper sides of the frame are connected to each other by a connecting shaft.

The horizontal moving part may include a gear provided in each of the bonding parts, a gear driving motor for driving the gears, and a gear provided in the frame and engaged with the gears to horizontally move the bonding part according to rotation of the gear. It characterized in that it comprises a guide rack.

In addition, the bonding portion and the body portion; A connection rod part provided on an upper portion of the body part and connected to the shanghai east part; A compression unit provided under the body to press the integrated circuit device to the liquid crystal display panel; And a heating part connected to the crimping part to heat the crimping part.

In addition, the heating unit is characterized in that it is provided to be heated to different temperatures according to the characteristics of the integrated circuit device corresponding to each of the bonding portion of the bonding portion.

In addition, the crimping portion is composed of a metal block, the heating member is characterized in that the heater is inserted into the metal block to apply heat to the metal block.

In addition, the body portion has a horizontal position adjusting screw for the horizontal position adjustment and fixing of the bonding portion; Characterized in that it comprises a front and rear position adjusting screw for the front and rear position adjustment and fixing of the bonding portion.

In addition, the lower portion of the bonding portion is characterized in that the support for mounting the liquid crystal display panel is provided.

In addition, each of the bonding portion is characterized in that it is provided to be separately disassembled or assembled from the frame.

In addition, the bonding part is characterized in that it is provided so that only a part of the plurality of shangdong can perform the pressing process.

In addition, the present invention provides a bonding apparatus for manufacturing a liquid crystal display device, comprising: a frame forming a main body; A plurality of bonding parts provided in a state spaced apart from each other in the liquid crystal display panel to heat-compress the integrated circuit devices; And a moving unit connected to the bonding unit and moving the bonding unit to adjust the separation interval of the bonding unit according to the disposition interval of the integrated circuit elements disposed in the liquid crystal display panel, and providing a bonding apparatus for manufacturing the liquid crystal display device. have.

In addition, the upper portion of the bonding portion is further provided with a shanghai east portion for guiding the shanghai dong of the bonding portion, the bonding portion body portion to form a body; A connection rod provided on the body part and connected to the shanghai east part; A crimping part formed under the body part to crimp an integrated circuit device; It is characterized in that it comprises a heating unit connected to the pressing unit for heating the pressing unit.

The moving unit may include a driving motor provided at one side of the frame; A main pulley connected to the driving motor; A driven pulley connected to the driving pulley; A connection belt connecting the driving pulley and the driven pulley; A cam plate coupled to the connecting belt and moved by the connecting belt; A protrusion part slidably inserted into the cam plate and provided in the bonding part; And a guide rail coupled to the bonding portion to guide the horizontal movement of the bonding portion, wherein the horizontal spacing of the bonding portion is performed by switching the horizontal movement of the cam plate to horizontal movement of the bonding portion.

In addition, the moving unit and the gear provided in the bonding portion; A gear driving motor for driving the gear; It is provided in the frame, the gear is engaged, characterized in that it comprises a rack for guiding the horizontal movement of the bonding portion in accordance with the rotational drive of the gear.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 1, the bonding apparatus of the present invention includes a frame 1 forming a main body, a bonding portion 10 provided below the frame 1, and a bonding portion 10 below the bonding portion 10. And a settling portion 50 to settle the liquid crystal display panel.

Here, the bonding part 10 is provided in plural and spaced apart in parallel, and the bonding part 10 may be independently driven, and the frame 1 is connected to the upper part of the bonding part 10. Thus, the shanghai-dong 3 is provided with a pneumatic cylinder to guide the shanghai-dong of the bonding part 10.

In addition, the shanghai 3 is provided to be horizontally movable left and right by the horizontal mover 4 provided in the frame 1, the bonding unit 10 by the horizontal movement of the shanghai 3 As the horizontal movement moves, the gap between the bonding parts 10 can be adjusted.

In the configuration of the horizontal moving unit 4, the drive motor 6 is provided on one side of the frame 1, the pulley 7 is provided spaced apart from each other on the upper and lower sides of the frame 1, The left and right horizontal movement of the Shanghai East 3 is coupled to the connecting belt 9 and the Shanghai East 3 to connect the pulleys 7 respectively provided on the upper and lower sides and the other upper and lower sides of the frame 1. It includes a guide rail (5) for guiding to be made.

Here, the drive motor 6 is connected to the pulley (7) provided on one side lower portion of the frame (1), the pulley (7) provided on both sides of the frame (1) by the connecting shaft (8) It is connected, the pulley (7) directly connected to the drive motor (6) is the main pulley, the other pulley (7) is the driven pulley.

The cam plate 2 is connected to the connecting belt 9 by a fixing member 2b. A protruding portion 3a protruding forward from the front surface of the shang east part 3 is formed inside the cam plate 2. The moving slit 2a to be inserted is formed.

The protrusion 3a may be installed in the bonding part 10 in addition to the shanghai east part 3.

On the other hand, the moving slits 2a are provided by the amount of the bonding portion 10 and the shanghai east portion 3, and are spaced apart from each other by a predetermined distance, where the moving slits 2a are gradually moved from the bottom to the top thereof. The interval is reduced in sequence.

Accordingly, the movable slit 2a is radially disposed downwardly with respect to the front center portion of the cam plate 2 such that the shandong of the cam plate 2 is connected to the shangdong 3 and the bonding portion connected thereto. It can be converted to the horizontal movement of (10).

That is, when the driving motor 6 operates, the pulley 7 provided below one side of the frame 1 rotates, and one side of the frame 1 is moved by the movement of the connecting belt 9. The pulley 7 provided on the upper side rotates.

In addition, the pulley 7 provided on the upper side of the frame 1 is connected by the pulley 7 on the other side of the frame 1 and the connecting shaft 8, and the pulley (the upper side of the other side of the frame 1) 7 is connected to the lower pulley (7) by the connecting belt (9), so when the pulley (7) connected to the drive motor (6) is driven, the pulley (7) attached to the frame (1) ) Are all driven, the connection belt 9 can also be moved in the vertical direction in accordance with the rotation action of the pulleys (7).

In addition, the shanghaidong of the connecting belt 9 causes the vertical movement of the cam plate 2, and the shanghaidong of the camplate 2 is horizontal to the shanghaidongbu 3 and the bonding part 10. It is converted to movement.

Meanwhile, an ACF 72 attached to the upper surface of the liquid crystal display panel 70 and an integrated circuit device 74 pressurized thereon are provided on the upper surface of the settlement part 50, and the bonding action of the bonding part 10 is performed. The main compression is made by, where the method of attaching the integrated circuit device 74 is based on a chip on glass (COG) method directly mounting an integrated circuit device (not shown) or a tape carrier package (TCP). , But using a Chip On Film (COF), the recent trend is to use TCP, COF, TCP, COF will be described in detail later. .

Referring to FIG. 2, the configuration of the bonding unit 10 is as follows.

First, the body portion 12 constitutes the center of the bonding portion 10, and the lower end portion of the body portion 12 is provided with a crimping portion 14 formed in the form of a metal block, the crimping portion 14 Is provided with a heating unit 16 for heating the crimping unit 14, the heating unit 16 is preferably configured in the form of an electric heater, the heating unit 16 for supplying electric power ( 17) is connected.

On the other hand, the upper portion of the body portion 12 is provided with a connecting rod 19, the connecting rod 19 is connected to the Shanghai East (see Figs. 1 and 3) to the shandong of the bonding portion 10 It serves as a guide.

And, the body portion 12 is provided with a left and right position adjustment screw 21 and the front and rear position adjustment screw 23, the role of the left and right position adjustment screw 21 is the position of a portion of the bonding portion 10 is crimped. After adjusting from side to side to be a more appropriate position to perform the process, it is provided to fix the position, the front and rear position adjusting screw 23 is adjusted to the bonding portion 10 before and after its position. This is to firmly fix the.

Therefore, the left and right position adjustment screw 21 is provided perpendicularly to the left and right direction of the bonding portion 10, the front and rear position adjustment screw 23 is perpendicular to the front and rear direction of the bonding portion 10. It is prepared.

Hereinafter, the operation of the present invention will be described.

As shown in FIG. 1, the size of the liquid crystal display panel 70 substantially corresponds to the width of the settled portion 50, and the integrated circuit device 74 also has a predetermined distance from the liquid crystal display panel 70. In the case of wide distribution, the gap between the bonding parts 10 needs to be maximized.

In this case, the cam plate 2 is pulled upward as far as possible, so that the protrusion part 3a is positioned at the bottom of the movable slit 2a, and thus the gap between the bonding parts 10 is opened. The gap is maximized.

However, as shown in FIG. 3, when the size of the liquid crystal display panel 70 placed on the upper surface of the settlement unit 50 becomes small, and thus the spacing between the integrated circuit devices 74 is also narrowed, the bonding unit It is necessary to adjust the spacing between (10).

As such, the cam plate 2 is lowered by driving the pulley 7 so that the connecting belt 9 moves downward to adjust the gap between the bonding parts 10.

When the cam plate 2 is lowered, the protruding portion 3a located at the lowermost portion of the movable slit 2a moves toward the uppermost portion under the guidance of the movable slit 2a. 2) converts the shank movement to horizontal movement, the upward movement of the protrusion (3a) is converted to a horizontal movement that the gap between the bonding portion 10 becomes narrow.

At this time, the movement of the bonding part 10 is caused by moving the Shanghai East 3, the protrusion 3a is formed under the guidance of the guide rail (5).

As such, when the distance between the bonding unit 10 is adjusted by driving the horizontal moving unit 4, the bonding unit 10 is lowered to move the integrated circuit device 74 to the liquid crystal display panel. 70) is hot pressing.

On the other hand, the bonding apparatus according to the present invention may drive only a part of the bonding portion 10 to perform a heat compression action.

That is, as shown in FIG. 4, the size of the liquid crystal display panel 70 is similar to the size of the liquid crystal display panel shown in the embodiment shown in FIG. 3, but the spacing of the integrated circuit elements 74 is wider than that shown in FIG. 3. In the case of arrangement, some of the bonding parts 10a to 10e perform the main compression process by performing heat compression on the integrated circuit element 74 according to the lifting action of the shanghai east part 3. The remaining bonding portions 10f and 10g are fixed without moving up and down so as not to contact the integrated circuit device 74.

Accordingly, the main compression process may be performed by controlling the number of bonding parts 10 necessary for the compression process so as to correspond to the sizes of the liquid crystal display panels having various sizes.

Figure 5 shows a second embodiment of the bonding apparatus of the present invention, showing that the device for adjusting the spacing of the bonding portion 10 is composed of a rack and pinion gear.

In this case, the horizontal moving part 4 includes a rack 22 provided in the frame 1, a pinion gear 20 provided in the shanghai east part 3 and engaged with the rack 22, and the pinion gear ( 20, the gear drive motor 21 for driving.

Therefore, in the present embodiment, the horizontal movements of the bonding units 10 can be independently performed, so that the intervals between the integrated circuit elements 74 on the upper surface of the liquid crystal display panel 70 placed on the settling unit 50 are different for each section. In case of loss, the pinion gear 20 is rotated through the gear driving motor 21 so that the pinion gear 20 moves horizontally on the rack 22. The interval can be adjusted individually.

Therefore, in the conventional long bar type, heat is applied to all parts of the crimping unit regardless of whether the heated crimping unit is in contact with the integrated circuit device. In this state, the part contacting the integrated circuit device is part of the heat. Moves toward the integrated circuit element, but heat remains in the portion without contact.

Therefore, the temperature of the non-contacted portion at the moment of contact is higher than that of the contacted portion, and the thermal strain at the crimped portion due to the pressing action is changed, which ultimately causes the flatness of the crimped portion.

However, in the present invention, the horizontal spacing between the bonding portions 10 may be adjusted, and in addition, when the main compression process is performed on the small size liquid crystal display panel 70, only a part of the bonding portion 10 may be operated. Since the position of the provided crimping portion 14 is also in a position in direct contact with the integrated circuit device 74, and the crimping portion 14 is not positioned at the non-contact portion, the thermal deformation partly in the crimping portion as in the prior art. The degree can be changed to prevent the problem of inhibiting flatness.

Meanwhile, the crimping portions (see FIGS. 2 and 12) of the respective bonding portions 10 are all heated to the same temperature by the heating portions (see FIGS. 2 and 14), or the distribution of the integrated circuit devices 74 is distributed. Can be heated to different temperatures.

In addition, when the bonding part 10 performs the crimping process, the pressure used in the crimping process may be equally applied to all of the bonding parts 10, or for each distribution of the integrated circuit device 74. The pressurization process can be performed at different pressures.

As such, the reason why the temperature and the pressure of the bonding unit 10 are provided so as to cause a difference in each bonding unit is that when the material of the integrated circuit device 74 is not the same, the heating proper temperature and the pressure appropriate pressure are the respective integrated circuits. This is because it must be different for each device.

As shown in FIG. 6, the operation of the power supply unit 130 for supplying power to the pressure sensor 110, the temperature sensor 120, and the bonding device is operated at an input terminal of the control unit 100 of the bonding device of the present invention. The operation unit 140 is provided, and the shank east section 3, the horizontal moving section 4, and the heating section 16 are provided at the output end of the control unit 100.

Therefore, when the integrated circuit devices 74 are not the same material but have integrated circuit devices having different materials, the heating temperature is set according to the distribution, and whether the temperature sensor reaches the proper temperature is detected. The information is transmitted to the control unit to adjust the temperature of the heating unit 16 so that the heating temperature is a temperature suitable for attachment of each integrated circuit element 74.

Meanwhile, in the case of the pressure sensor 100, the pressure sensor 100 senses data necessary for pressure control such as the repulsive force transmitted to the crimping unit when the contact between the crimping unit and the integrated circuit device is transmitted to the controller to adjust the pressure. When the repulsive force and the like is different for each integrated circuit device to have a different pressing force through the horizontal moving unit (3) connected to the bonding portion corresponding to the integrated circuit device, respectively.

Hereinafter, an ACF crimping process, an integrated circuit device crimping process and a main crimping process, and a PCB attaching process will be described with reference to the drawings.

As shown in Fig. 7, the ACF 72 is attached to the circuit pattern (not shown) of the liquid crystal display panel 70b on the lower side of the two layers of liquid crystal display panels, and as shown in Figs. The ACF 72 attached to the liquid crystal display panel 70b is preheated by using the preheating head 200 which is a heating crimping means of the ACF crimping device.

Here, the ACF (72, anisotropic conductive film, anisotropic conductive film) is a conductive particle dispersed in a thermosetting or thermoplastic resin film, the electrical connection between the terminals is implemented by interposing the ACF in the portion subjected to heat compression.

As described above, the ACF 72 covers the circuit pattern 71 formed on the liquid crystal display panel 70b by the preheating operation after the ACF 72 is attached.

As shown in FIG. 10, the integrated circuit device 74 is attached and pressed onto the ACF 72, and the integrated circuit device 74 used here is provided in a TCP form.

TCP refers to an integrated circuit device 74 mounted on a rectangular FPC 76 having a wiring pattern formed on an insulating film such as polyimide, and output terminal 74a along one side of the integrated circuit device. ) Is provided in plural, and a plurality of input terminals 74b are provided on the opposite side.

Thus, the output terminal 74a of the integrated circuit device 74 is mechanically and electrically connected to a circuit pattern formed on the liquid crystal display panel 70b, and the input terminal 74b of the integrated circuit device 74 is a drive signal. The ACF is connected to the PCB which transmits the same as the connection method of the liquid crystal panel and TCP.

On the other hand, COF is almost identical to the structure of TCP, except that FPC used for COF is thinner than FPC used for TCP.

11, the output terminal 74a of the integrated circuit device 74 and the circuit pattern 71 of the liquid crystal display panel 70b are aligned using a charge coulped device (CCD) or the like. After that, the pressing of the integrated circuit device 74 is performed.

As shown in FIG. 12, main bonding is performed on the integrated circuit device 74 using the bonding unit 10. As shown in FIG. The output terminal 74a of the element 74 and the circuit pattern 71 of the liquid crystal display panel 70b are electrically connected.

That is, as shown in the enlarged source of FIG. 13, the ACF 72 is composed of the conductive particles 72b in the thermosetting or thermoplastic resin film 72a. A plurality of conductive particles 72b are interposed between the circuit pattern 71 and the output terminal 74a of the integrated circuit device 74 to form an electrical connection therebetween.

When the main compression process of the integrated circuit device 74 is completed as described above, as shown in FIG. 14, the input signal transmission PCB 76 is connected to the integrated circuit device 74 using the thermocompression bonding tool 102. Connect to the input terminal.

However, instead of using the long bar type thermocompression tool 102, thermocompression may be performed using a plurality of compression parts (see FIG. 12 and 10) and ACF according to the present invention. The method is the same as the method of thermocompression bonding the integrated circuit device 74 on the liquid crystal display panel 70.

According to the present invention having the configuration as described above, all the surfaces of the pressurized portion heated during the main press contact with the integrated circuit device, so that even thermal expansion and contraction occurs over the entire press portion, thereby ensuring the flatness of the press portion.

In addition, by driving all or part of the bonding unit, there is an advantage that the main pressing process of the integrated circuit device may be performed regardless of the size of the liquid crystal display panel.

In addition, in the case of attaching the integrated circuit device made of various materials, it is also possible to obtain the effect that the appropriate pressure and temperature can be adjusted according to the characteristics of each integrated circuit device.

Claims (20)

Frame, Bonding parts provided in the frame to attach the integrated circuit elements to the liquid crystal display panel; A moving part connected to the bonding part to adjust a distance between the bonding parts, The moving part includes a horizontal moving part connected to the bonding part to horizontally move the bonding part, and a guide rail to guide horizontal movement of the bonding part. The horizontal moving unit includes a drive motor provided at one side of the frame, a pulley connected to the drive motor and provided at the upper and lower parts of the frame, a connecting belt connecting the pulleys on each side of the frame, and each of the frame. Bonding apparatus comprising a cam plate coupled to the connecting belt of the side is connected to each of the bonding portion to convert the vertical movement of the connecting belt to the horizontal movement of the bonding portion. The method of claim 1, Bonding devices, characterized in that each of the bonding portion is provided with a Shanghai East portion for guiding the Shanghai East of the bonding portion. 3. The method of claim 2, Bonding device, characterized in that the Shanghai East is composed of a pneumatic cylinder. delete delete The method of claim 1, The shanghai east portion connected to the bonding portion is provided with a protrusion inserted into the cam plate, Bonding device, characterized in that the cam plate is provided with a moving slit seated on the projection plate to convert the movement of the cam plate to the left and right movement of the bonding portion. The method of claim 6, The movable slits are provided in plural and are formed in the vertical direction in the cam plate. Bonding device, characterized in that the gap is provided in a form that is sequentially reduced from the bottom to the top. The method of claim 1, The pulleys are respectively provided on the upper and lower sides of the frame, The drive motor is connected to the pulley provided on one side lower portion of the frame, Bonding apparatus, characterized in that the pulleys provided on both sides of the frame are connected to each other by a connecting shaft. The method of claim 1, The horizontal moving unit and the gears provided in each bonding unit, A gear driving motor for driving the gear; Bonding device, characterized in that provided in the frame and the gear is engaged to guide the horizontal movement of the bonding portion according to the rotation of the gear. 3. The method of claim 2, The bonding portion and the body portion; A connection rod part provided on an upper portion of the body part and connected to the shanghai east part; A compression unit provided under the body to press the integrated circuit device to the liquid crystal display panel; Bonding device characterized in that it comprises a heating unit connected to the crimping portion for heating the crimping portion. The method of claim 10, Bonding device, characterized in that the heating unit is provided to be heated to different temperatures according to the characteristics of the integrated circuit device corresponding to each of the pressing portion of the bonding. The method of claim 10, The bonding unit is composed of a metal block, and the heating unit is bonded to the metal block is a bonding device, characterized in that consisting of a heater for applying heat to the metal block. The method of claim 10, The body portion has a horizontal position adjusting screw for adjusting and fixing the horizontal position of the bonding portion; Bonding device, characterized in that it comprises a front and rear position adjusting screw for the front and rear position adjustment and fixing of the bonding portion. The method of claim 1, Bonding device, characterized in that the lower portion of the bonding portion is provided with a support for mounting the liquid crystal display panel. The method of claim 1, Bonding device, characterized in that each bonding portion is provided to be separately disassembled or assembled from the frame. The method of claim 1, Bonding device, characterized in that the bonding portion is provided so that only a portion of the plurality of Shanghai to perform the pressing process. A frame forming a main body, a plurality of bonding parts provided to be spaced apart from each other in the frame to heat-compress the integrated circuit devices on the liquid crystal display panel, and an integrated circuit device connected to the bonding part and disposed on the liquid crystal display panel. In the bonding apparatus for manufacturing a liquid crystal display device comprising a moving unit for adjusting the separation interval of the bonding portion by moving the bonding portion in accordance with the arrangement interval of the, The moving part includes a horizontal moving part connected to the bonding part to horizontally move the bonding part, and a guide rail to guide horizontal movement of the bonding part. The horizontal moving unit includes a drive motor provided at one side of the frame, a pulley connected to the drive motor and provided at the upper and lower parts of the frame, a connecting belt connecting the pulleys on each side of the frame, and each of the frame. Bonding apparatus comprising a cam plate coupled to the connecting belt of the side is connected to each of the bonding portion to convert the vertical movement of the connecting belt to the horizontal movement of the bonding portion. The method of claim 17, It is provided on the bonding portion further comprises a shanghai east portion for guiding the shandong east of the bonding portion, The bonding portion and the body portion to form a body; A connection rod provided on the body part and connected to the shanghai east part; A crimping part provided under the body to crimp integrated circuit devices; Bonding apparatus for manufacturing a liquid crystal display device characterized in that it comprises a heating unit connected to the pressing unit for heating the pressing unit. The method of claim 18, The moving unit and a drive motor provided on one side of the frame; A drive pulley connected to the drive motor; A driven pulley connected to the driving pulley; A connection belt connecting the driving pulley and the driven pulley; A cam plate coupled to the connecting belt and moved by the connecting belt; A protrusion part slidably inserted into the cam plate and provided in the bonding part; A guide rail coupled to the bonding portion to guide the horizontal movement of the bonding portion, Bonding apparatus for manufacturing a liquid crystal display device, characterized in that the horizontal distance adjustment of the bonding portion is performed by switching the horizontal movement of the cam plate to the horizontal movement of the bonding portion. The method of claim 18, The moving unit and the gear provided in the bonding portion; A gear driving motor for driving the gear; And a rack provided in the frame, the rack engaged with the gear and guiding a horizontal movement of the bonding unit according to the rotational driving of the gear.

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