JP4463218B2 - Electronic component pressure connection device and pressure connection method - Google Patents

Description

  The present invention relates to a pressure connection device and a pressure connection method for an electronic component in which two electronic components are pressure-connected through an adhesive anisotropic conductive member.

  In the assembling process of the display device, for example, as shown in FIG. 5A, first, liquid crystal driving is performed on a predetermined side of the outer periphery of the liquid crystal panel 200, which is a substrate as an electronic component by an outer lead bonder. A plurality of tabs 202 (TAB: Tape Automated Bonding) as electronic components on which ICs are mounted are mounted via tape-like anisotropic conductive members 204 as shown in FIG. Panel 200 is manufactured.

  Next, as shown in FIG. 5B, the liquid crystal panel 200 is assembled by electrically connecting a plurality of circuit boards 203 as electronic components to the tab 202 portion of the liquid crystal panel 200 with electronic components. Has been done. As the circuit board 203 and the tab 202 are connected to the tab 202 and the liquid crystal panel 200 as shown in FIG. 5C, an anisotropic conductive member 204 is used.

  Such an electronic component connection operation is performed using a pressure connection device. As is well known, the pressure connection device has a backup tool having a length that can receive one side of the liquid crystal panel 200. Above this backup tool, a pressurizing tool having substantially the same length as the backup tool is provided so as to be vertically movable. The backup tool and the pressure tool have a heater.

  One end of the liquid crystal panel 200 with one end of the tab 202 temporarily bonded is supplied to the backup tool. That is, one end portion where the liquid crystal panel 200 and the tab 202 are overlapped is positioned and placed on the upper end surface of the backup tool.

  In this state, the pressurizing tool is lowered to pressurize and heat the overlapping portion of the liquid crystal panel 200 and the tab 202. As a result, the anisotropic conductive member 204 is thermally cured, so that the plurality of tabs 202 temporarily bonded to one side of the liquid crystal panel 200 are simultaneously connected and fixed.

  On the other hand, when connecting the circuit board 203 to the tab 202, first, one end of the circuit board 203 is positioned and held on the upper end surface of the backup tool. Next, the liquid crystal panel 200 is conveyed and the other end of the tab 202 connected to the liquid crystal panel 200 is superposed on one end of the circuit board 203. Then, the superposed portion of the circuit board 203 and the tab 202 is heated under pressure with a pressure tool. Thereby, the plurality of circuit boards 203 are simultaneously connected and fixed to the plurality of tabs 202.

  By the way, recently, the liquid crystal panel 200 tends to increase in size. Therefore, in order to press-bond the plurality of tabs 202 and the plurality of circuit boards 203 to one side of the liquid crystal panel 200 at a time, the backup tool and the pressure tool must be lengthened according to the size of the liquid crystal panel 200.

  When the backup tool and the pressure tool are lengthened, even if they are mounted with a slight inclination relative to the horizontal direction, one end of the backup tool and the pressure tool and the other are proportional to the length. The difference in height from the edge increases.

  Therefore, when the plurality of tabs 202 temporarily bonded to the liquid crystal panel 200 are simultaneously pressure-bonded by lowering the pressurizing tool, a difference occurs in the pressure applied to the plurality of liquid crystal panels 200. In some cases, the main press cannot be uniformly applied to the panel 200.

  Similarly, when a plurality of circuit boards 203 are simultaneously press-bonded to a plurality of tabs 202, the plurality of circuit boards 203 cannot be pressed with the same pressure. There are times when it cannot be done.

  The present invention relates to a pressure connection device for an electronic component, which is capable of uniformly pressing and connecting these electronic components when the first electronic component and the second electronic component are pressed and connected. It is to provide a pressure connection method.

The present invention is a pressure connection device for an electronic component that superposes one end portion of a first electronic component and one end portion of a second electronic component and crimps the overlapped portion of these electronic components,
A backup tool that is divided into a plurality of backup portions in a direction intersecting the longitudinal direction, and one end portion of the first electronic component is positioned on the upper end surface of these backup portions;
Pressurizing tool that pressurizes one end of the second electronic component superposed on one end of the first electronic component positioned on the backup tool and connects the one end of the first and second electronic components When,
When pressurizing and connecting one end of the first electronic component and the second electronic component with the pressurizing tool, a plurality of backup units are connected to the first electronic component and the second electronic component via the first electronic component and the second electronic component. And a supporting means for displacing each backup portion in accordance with a difference in pressure applied by the pressurizing tool.

  The support means is an elastic material provided on the upper surface of the receiving member, and it is preferable that a plurality of the backup portions are provided on the upper surface of the elastic material.

  The supporting means is a cylinder to which pressurized gas is supplied, and the pressure of the pressurized gas supplied to each cylinder is preferably adjustable according to the pressure applied to each backup portion.

The present invention is a pressure connection method of an electronic component in which one end portion of a first electronic component and one end portion of a second electronic component are superposed and a superposed portion of these electronic components is crimped,
Dividing the backup tool into a plurality of backup parts in a direction intersecting the longitudinal direction, and positioning and placing one end of the first electronic component on the upper end surface of these backup parts;
Superposing one end of the second electronic component on one end of the first electronic component positioned on the backup;
Pressurizing and connecting one end of the polymerized first electronic component and second electronic component with a pressure tool;
The pressurizing tool pressurizes and connects one end of the first electronic component and the second electronic component to the plurality of backup units via the first electronic component and the second electronic component. And a step of displacing each of the backup portions in accordance with a difference in pressure applied by the pressing tool.

  It is preferable to control the amount of displacement of these backup parts according to the pressure applied to the plurality of backup parts.

  According to the present invention, when the backup tool is divided into a plurality of backup units, and each backup unit receives a pressing force from the pressurizing tool via the first and second electronic components, each of the backup tools corresponds to the pressing force received by each. Displaced independently. Therefore, even if the pressure received by the backup tool from the pressure tool is not uniform, the backup parts of the backup tool are displaced according to the pressure distribution, so the first and second electronic components are applied with substantially uniform pressure. It is possible to make a pressure connection.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
FIG. 1 shows a schematic configuration of a pressure connection device for crimping a circuit board 203 as an electronic component to a plurality of tabs 202 as an electronic component that are crimped to a liquid crystal panel 200 as an electronic component on one side. The pressure connection device includes a base 1. The base 1 is provided with a table unit 2. The table unit 2 has an X table 3 provided on the base 1 so as to be movable along the X direction. The X table 3 is driven in the X direction indicated by an arrow in the figure by an X drive source 4 provided at one end of the base 1.

  A Y table 5 is provided on the X table 3 so as to be movable along the Y direction intersecting the X direction. The Y table 5 is driven in the Y direction by a Y drive source 6 provided on one side of the X table 3.

  The Y table 5 is provided with a θ table 7 so as to be rotatable on a horizontal plane. The θ table 7 is driven in the rotational direction by a θ drive source 8 provided on one side of the Y table 5. Therefore, the θ table 7 can be driven in the X, Y, and θ directions.

  As shown in FIG. 5A, the θ table 7 is supplied with a liquid crystal panel 200 in which a plurality of tabs 202 in this embodiment, six tabs 202 in this embodiment are connected and fixed by an anisotropic conductive member 204. The liquid crystal panel 200 is held and fixed on the θ table 7 so as not to move by means such as vacuum suction. As shown in FIG. 1, the liquid crystal panel 200 has a peripheral portion including one side to which the tab 202 is connected protruding from the outer peripheral surface of the θ table 7.

  A total of three circuit boards 203 are connected and fixed to the plurality of tabs 202 by the crimping portion 11 at a ratio of one to the plurality of tabs 202 in this embodiment. The crimping part 11 has an elongated plate-like backup tool 12 along the Y direction. 2 and 3, the backup tool 12 is divided into a plurality of backup units 13 according to the number of circuit boards 203 connected to the liquid crystal panel 200 in this embodiment. Each backup unit 13 includes a heater 13a.

  Each backup portion 13 is bonded and fixed to the upper surface of a strip-shaped elastic member 15 provided on the upper surface of a strip-shaped receiving member 14 as a support means. The receiving member 14 has substantially the same length as the three backup portions 13 and is attached to the upper surface of the movable body 17 driven in the Z direction, which is the vertical direction by the first Z driving source 16 shown in FIG. It is fixed. That is, the backup tool 12 can be driven in the Z direction by the first Z drive source 16.

  Above the backup tool 12, a pressing tool 18 having a lower end surface opposed to the upper end surface of the backup tool 12 is disposed. That is, the pressing tool 18 has a length dimension substantially the same as the length dimension of the three backup portions 13 arranged in a line as shown by a chain line in FIG. The pressurizing tool 18 is provided with a plurality of heaters 18a at the lower end in the width direction, and is driven by the second Z drive source 19 in the vertical direction which is the Z direction.

  Therefore, the circuit board 203 and the tab 202 are superposed on the upper end surface of each backup portion 13 of the backup tool 12 via the anisotropic conductive member 204, and each tool is pressed while pressing the overlapped portion with the pressure tool 18. When heated by the heaters 13a and 18a, the anisotropic conductive member 204 can be melt-cured to connect and fix the circuit board 203 and the tab 202.

  As shown in FIG. 1, the circuit board 203 is transferred to the backup tool 12 by a transfer table 21. The transfer table 21 is provided with one end portion along the X direction fixed to the upper end surface of the movable body 22 whose side surface is L-shaped.

  A pair of sliders 23 are provided at both ends in the Y direction intersecting the X direction on the lower end surface of the movable body 22, and these sliders 23 are movably engaged with a pair of guide rails 25 (only one is shown). ing. The guide rail 25 is provided on the base 1 along the X direction via a mount 24.

  The movable body 22 is driven to reciprocate along the X direction. As a driving means for reciprocatingly driving the movable body 22 along the X direction, a rotationally driven screw shaft or cylinder may be used. In this embodiment, a large number of magnets arranged on the guide rail 25 at predetermined intervals are used. The slider 23 is driven by a linear motor including an electromagnetic coil (both not shown) provided on the slider 23.

The circuit board 203 is supplied and mounted on the transfer table 21. The circuit board 203 is supplied with one end projecting from the end surface of the transfer table 21 and is elastically held by a pair of holding members 27 (only one is shown).
Note that a tape-like anisotropic conductive member 204 is attached in advance to the upper surface of one end of the circuit board 203 over the entire length in the width direction.

  The holding member 27 is bent by an elastic band plate, and a front end portion elastically presses the upper surface of the circuit board 203, and a rear end is a first provided on a side surface of the movable body 22. The Z cylinder 29 is connected and fixed to a rod 29a.

  Therefore, when the rod 29a of the first Z cylinder 29 is driven in the protruding direction, the holding member 27 rises as shown by a chain line in FIG. Then, the holding state of the circuit board 203 is released. Thereby, the circuit board 203 can be attached to and detached from the transfer table 21.

  On the side surface of the backup tool 12 on the movable body 17 side, a pair of second Z cylinders 31 with a vertical axis corresponding to a pair of recesses 21a formed on the transfer table 21 (only one is shown). It is provided at intervals.

  A receiving member 30 is attached to the rod 31a of the second Z cylinder 31 with its upper surface horizontal. The receiving member 30 has a rectangular shape and is sized to enter a recess 21 a formed in the transfer table 21.

Next, an operation of connecting the circuit board 203 to the tab 202 connected to the liquid crystal panel 200 using the assembly apparatus having the above configuration will be described.
First, when the circuit board 203 is supplied to the transfer table 21 with the holding member 27 being driven in the upward direction as indicated by a chain line in FIG. 1, the holding member 27 is lowered and the circuit board 203 is held. The transfer table 21 is driven in the X direction so as to approach the backup tool 12.

  When the transfer table 21 approaches the backup tool 12, the pair of receiving members 30 provided on the side surfaces of the backup tool 12 are opposed to a pair of recesses 21 a formed open at the end surface of the transfer table 21. That is, the pair of receiving members 30 are opposed to the lower surface of the portion located in the recess 21 a of the circuit board 203.

  As a result, the circuit board 203 has one end projecting from the end surface of the transfer table 21, that is, the lower surface of the end portion where the anisotropic conductive member 204 is adhered to the upper surface positioned above the upper end surface of the backup tool 12. Positioned. That is, the circuit board 203 is positioned in the X direction by the transfer table 21.

  When the circuit board 203 is positioned in the X direction with respect to the backup tool 12, the second Z cylinder 31 operates to raise the receiving member 30. Thereby, the receiving member 30 supports the lower surface of the circuit board 203. Next, the rod 29a of the first Z cylinder 29 is driven in the protruding direction. As a result, the holding member 27 rises as indicated by a chain line in FIG. 1 to release the holding state of the circuit board 203.

  When the holding state of the circuit board 203 is released, the transfer table 21 moves backward and moves to a supply portion of the circuit board 203 (not shown), where a new circuit board 203 is supplied and held by the holding member 27.

  On the other hand, when the circuit board 203 is positioned with respect to the backup tool 12, the second Z cylinder 31 operates to lower the pair of receiving members 30 that support the lower surface of the circuit board 203. Accordingly, the lower surface of one end portion of the circuit board 203 having the anisotropic conductive member 204 attached to the upper surface is supported by the upper end surface of the backup tool 12.

  Next, the table unit 2 is driven in a direction approaching the backup tool 12 in the X direction. One end of the liquid crystal panel 200 to which the tab 202 is connected is imaged by a camera (not shown) at a predetermined position in the X direction. Then, the X table 3, the Y table 5, and the θ table 7 are driven based on the imaging result, and one end of the tab 202 is slightly spaced from the upper surface of one end of the circuit board 203 positioned on the backup tool 12. Positioned to polymerize through.

  When the tab 202 is positioned together with the liquid crystal panel 200 in this way, the backup tool 12 is driven in the upward direction by the first Z drive source 16. As a result, the receiving member 30 provided integrally with the backup tool 12 ascends integrally with the backup tool 12 while holding the circuit board 203, so that the anisotropic conductive material provided at one end of the circuit board 203 is provided. One end of the tab 202 contacts the member 204.

  That is, since the receiving member 30 is provided integrally with the backup tool 12, even if the backup tool 12 is raised, a relative shift occurs in the X and Y direction positions of the circuit board 203 and the backup tool 12. There is nothing.

  Next, the pressing tool 18 is driven in the downward direction by the second Z drive source 19. As a result, the overlapping portion of the circuit board 203 and the tab 202 is pressurized and heated by the backup tool 12 and the pressure tool 15, so that the anisotropic conductive member 204 is melted and cured, and the circuit board 203 is connected to the tab 202. Fixed.

  While the pressurizing tool 18 is lowered and pressurizing and heating the overlapped portion of the circuit board 203 and the tab 202, the transfer table 21 to which the next circuit board 203 is supplied by retreating to the supply unit is used as the backup tool 12. Move forward to near and wait.

  When the pressure heating of the circuit board 203 and the tab 202 by the pressurizing tool 18 is finished and these are fixed by the melted and hardened anisotropic conductive member 204, the pressurizing tool 18 rises and the backup tool 12 Descends.

  When the pressurizing tool 18 is raised, the table unit 2 is retracted together with the liquid crystal panel 200, and the circuit board 203 connected to the liquid crystal panel 200 via the tab 202 is carried out from the backup tool 12. At the same time, the transfer table 21 moves forward, and a new circuit board 203 is positioned on the backup tool 12 in the X direction and the Y direction.

  When the three circuit boards 203 are connected to the six tabs 202 provided on the liquid crystal panel 200 by pressing with the pressing tool 18, the lower end surface of the pressing tool 18 and the upper end surface of the backup tool 12 are not parallel, These end faces may be inclined. In such a case, the entire length of the lower end surface of the pressing tool 18 may not press the plurality of circuit boards 203 uniformly.

  However, the backup tool 12 is divided into a plurality of backup units 13, and each backup unit 13 is elastically held by an elastic member 15. Therefore, when the pressurizing tool 18 is inclined with respect to the backup tool 12 and a difference occurs in the pressurizing force by which the pressurizing tool 18 pressurizes each backup unit 13, each backup unit 13 corresponds to the difference in pressurizing force. The elastic member 15 is displaced while being elastically deformed.

  If the backup unit 13 is displaced according to the difference in pressure applied from the pressing tool 18, the distance between the pressing tool 18 and each backup unit 13 becomes uniform. The pressure can be applied almost uniformly. In other words, a plurality of circuit boards 203 can be connected to the tab 202 by applying pressure and heating simultaneously and uniformly.

  On the other hand, when a plurality of circuit boards 203 are simultaneously crimped, the thickness of each circuit board 203 may be different. In such a case, the thick circuit board 203 is strongly pressed by the pressing tool 18, and the thin circuit board 203 is hardly pressed.

  However, when the thick circuit board 203 is strongly pressed by the pressing tool 18, the elastic member 15 corresponding to the backup unit 13 that supports the pressing substrate 203 is compressed and deformed, so that the backup unit 13 is displaced. Thus, the heights of the plurality of circuit boards 203 are substantially the same. Therefore, even if the thicknesses of the plurality of circuit boards 203 are different, each circuit board 203 is pressed and connected almost uniformly by the pressing tool 18.

  That is, if the plurality of circuit boards 203 are pressurized simultaneously, the pressurizing tool 18 and the backup tool 12 become longer, so even if they are slightly inclined, the plurality of circuit boards 203 are uniformly pressed. In some cases, the circuit board 203 cannot be pressurized with a uniform pressure, even when the thickness of the plurality of circuit boards 203 is different.

  However, since the backup tool 12 is divided into a plurality of backup parts 13 and these backup parts 13 are supported by the elastic members 15 so as to be elastically displaceable, the pressing tool 18 is inclined as described above, or a plurality of circuit boards are used. Even if the thickness of 203 is different, it is possible to pressurize these circuit boards 203 with a uniform applied pressure.

  In the above embodiment, the elastic member 15 is exemplified as a support means for displacably supporting the plurality of backup portions 13, but instead of the elastic member 15, it is supported by a cylinder 35 as shown in FIG. May be.

  That is, the rod 35 a of the cylinder 35 is attached to the lower surface of each backup portion 13. Pressurized gas is supplied to each cylinder 35 through a pipe 36. The pressure of the pressurized gas supplied to each cylinder 35 can be adjusted by a pressure adjusting valve 37 provided in the pipe 36.

  Accordingly, if the pressure of the pressurized gas supplied to each cylinder 35 is adjusted, the amount of elastic displacement of each backup unit 13 while compressing the pressurized gas with respect to the load applied to the backup unit 13 can be changed. It can be done.

  With such a configuration, when the backup tool 12 and the pressurizing tool 18 are relatively inclined or the thicknesses of the plurality of circuit boards 203 are different, the respective backup units 13 are supplied to the cylinder 35 accordingly. Since the compressed gas is elastically displaced while being compressed, the plurality of circuit boards 203 can be pressurized almost uniformly.

  When the circuit boards 203 having different thicknesses are pressure-bonded, the pressure of the pressurized gas supplied to each cylinder 35 is changed in advance according to the thickness of the circuit board 203. That is, the pressure of the pressurized gas is set lower in the cylinder 35 corresponding to the backup unit 13 that supports the thick circuit board 203 than in the cylinder 35 corresponding to the backup unit 13 that supports the thin circuit board 203.

  As a result, the circuit boards 203 having different thicknesses are uniformly pressed by the pressing tool 18, so that the circuit boards 203 having different thicknesses can be reliably crimped.

  In each of the embodiments described above, the case where the tab as the electronic component and the circuit board are pressure-bonded has been described. However, the present invention can also be applied to the case where the tab is pressure-bonded to the liquid crystal panel.

  Moreover, even if there is one each of the first electronic component and the second electronic component, when the backup tool and the pressurizing tool are relatively inclined, the effect can be obtained by applying the present invention. can get.

The side view which shows schematic structure of the pressurization connection apparatus of one Embodiment of this invention. The perspective view which shows a backup tool. The front view which shows a backup tool. The front view of the backup tool which shows other embodiment of this invention. (A)-(c) is explanatory drawing which connects a circuit board via an electronic component to a liquid crystal panel.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Crimp part, 12 ... Backup tool, 13 ... Backup part, 15 ... Elastic member (support means), 18 ... Pressure tool, 35 ... Cylinder (support means), 200 ... Liquid crystal panel (electronic component), 202 ... Tab (Electronic component), 203... Circuit board (electronic component), 204... Anisotropic conductive member.

Claims (5)

A pressure connection device for an electronic component that superimposes one end portion of a first electronic component and one end portion of a second electronic component and crimps the overlapped portion of these electronic components,
A backup tool that is divided into a plurality of backup portions in a direction intersecting the longitudinal direction, and one end portion of the first electronic component is positioned on the upper end surface of these backup portions;
Pressurizing tool that pressurizes one end of the second electronic component superposed on one end of the first electronic component positioned on the backup tool and connects the one end of the first and second electronic components When,
When pressurizing and connecting one end of the first electronic component and the second electronic component with the pressurizing tool, a plurality of backup units are connected to the first electronic component and the second electronic component via the first electronic component and the second electronic component. And a supporting means for displacing each backup portion in accordance with a difference in pressure applied by the pressure tool.   2. The component pressure connecting device according to claim 1, wherein the supporting means is an elastic material provided on the upper surface of the receiving member, and the plurality of backup portions are provided on the upper surface of the elastic material. .   The said support means is a cylinder to which pressurized gas is supplied, and the pressure of the pressurized gas supplied to each cylinder can be adjusted according to the pressure applied to each backup portion. Pressurized connection device for parts. A method for pressurizing and connecting electronic parts, wherein one end part of a first electronic component and one end part of a second electronic component are polymerized, and the superposed part of these electronic parts is crimped.
Dividing the backup tool into a plurality of backup parts in a direction intersecting the longitudinal direction, and positioning and placing one end of the first electronic component on the upper end surface of these backup parts;
Superposing one end of the second electronic component on one end of the first electronic component positioned on the backup;
Pressurizing and connecting one end of the polymerized first electronic component and second electronic component with a pressure tool;
The pressurizing tool pressurizes and connects one end of the first electronic component and the second electronic component to the plurality of backup units via the first electronic component and the second electronic component. And a step of displacing each of the backup portions in accordance with a difference in pressure applied by the pressing tool.   4. The method for pressurizing and connecting electronic parts according to claim 3, wherein the displacement amount of the backup parts is controlled in accordance with the pressure applied to the plurality of backup parts.

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