JP2002319601A - Device and method for pressure-bonding electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure-bonding device which can prevent the breakage of a board and also can pressure-bond electronic components satisfactorily. SOLUTION: This device is for arranging a plurality of electronic components 2 in a straight line and mounting them on a board 1, and this is equipped with a pressurizing tool 26, a pressure receiving tool 29 provided facing opposite to this pressurizing tool, a board supporting tool 31 for supporting the board 1, a shifter 32, and a controller 25 for controlling this shifter thereby pressure- bonding the substrate and the electronic components to each other by the pressurizing tool, and this controller regulates the relative position between the pressurizing tool and the board supported by the board-supporting tool, so that an end of the pressurizing tool is positioned outside that one row of the electronic components or between adjoining electronic components by controlling the displacement device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component crimping apparatus and an electronic component crimping method for crimping an electronic component on a substrate.

[0002]

2. Description of the Related Art Plasma display panels (PDPs)
2. Description of the Related Art As an apparatus for manufacturing a flat panel display or the like, an electronic component mounting apparatus for mounting an electronic component formed of a film member or the like on a glass substrate is known.

FIG. 11 shows an example of a glass substrate on which electronic components are mounted by an electronic component mounting apparatus. FIG. 11 (a) is a plan view and FIG. 11 (b) is a side view thereof. The glass substrate 1 shown here has two types of substrates 1a having different sizes,
1b is formed by bonding. On the lower surface of the upper substrate 1a and the upper surface of the lower substrate 1b, a plurality of electronic components 2 are respectively provided along the sides of each substrate via an anisotropic conductive film (hereinafter, referred to as "ACF") 3. Has been implemented.

In an electronic component mounting apparatus for manufacturing a glass substrate of this type, an ACF 3 is attached along a side of the glass substrate 1 on which the electronic component 2 is mounted, and the adhesiveness of the ACF 3 is used. Then, the electronic component 2 is temporarily attached to the glass substrate 1, and thereafter, the temporarily attached electronic component 2 is heated and pressed against the glass substrate 1 using an electronic component pressing device, thereby forming the electronic component 2 on the glass substrate 1. The connected lead and the lead of the electronic component 2 are connected.

FIG. 12 shows an example of the electronic component crimping apparatus 10. The electronic component crimping apparatus 10 shown in FIG.
1, a long pressurizing tool 13 having a heater 12 built therein and moved up and down, and disposed opposite to the pressurizing tool 13;
It has a backup tool 15 as a pressure receiving tool which is raised and lowered by a lifting means (not shown) and has a heater 14 built therein, and a sheet member 16 arranged between the pressurizing tool 13 and the backup tool 15. . The sheet member 16 is interposed between the pressing tool 13 and the electronic component 2 when pressing the electronic component 2 by the pressing tool 13 to absorb a variation in flatness of a pressing surface of the pressing tool 13, This is to apply a uniform pressing force to the entire pressing area, and its size is set so as to cover the entire pressing surface of the pressing tool 13.

A crimping operation using the electronic component crimping apparatus 10 is performed as follows. First, the glass substrate 1 to which the electronic component 2 is temporarily attached in the previous step is placed on a substrate stage (not shown) and positioned at the pressure bonding position. In FIG. 12, the positioning is performed in the electronic component group located along the side of the glass substrate 1 which is to be press-bonded this time.
The left end portion a of the electronic component 2-1 located at the leftmost position coincides with the left end portion A of the pressing tool 13 (exactly, the left end portion of the pressing surface of the pressing tool 13), or It is positioned so as to be slightly inside the left end A. Next, the backup tool 15 is raised to support the glass substrate 1 from below (the state shown in FIG. 12), and then the pressurizing tool 13 is lowered by the pressurizing cylinder 11. Thus, the four electronic components 2-1, 2-2, 2-3, and 2-4 existing within the length range of the pressing tool 13 are interposed via the sheet member 16 as shown in FIG. By the pressing force of the pressing cylinder 11 and the heating by the heaters 12 and 14, the glass substrate 1 is thermocompression-bonded to the glass substrate 1 via the ACF 3 at a time.

[0007] When the thermocompression bonding to the electronic components 2-1 to 2-4 is completed, the pressurizing tool 13 is raised, and after the backup tool 15 is lowered, the substrate stage (not shown) is moved. As shown, the right end b of the electronic component 2-6 located at the rightmost end of the electronic component group is the right end B of the pressing tool 13 (more precisely, the right end of the pressing surface of the pressing tool). Or press tool 1
3 is positioned slightly inside from the right end B. Then, as in the previous case, the backup tool 15 is raised to support the glass substrate 1 from below, and the pressing tool 13 is lowered, so that the four electronic components 2-3 existing within the length range of the pressing tool 13. , 2-4, 2-5, 2-
6 is heated and pressurized.

By the way, the above-described electronic component crimping apparatus 10
According to the above, when the type of the glass substrate 1 is changed and the size of the glass substrate 1, the size of the electronic component 2 mounted on the glass substrate 1, the mounting interval, and the like are changed, as shown in FIG. Inconvenience may occur. That is, in the same manner as described above, first, of the electronic components located along the side of the glass substrate 1 that is to be press-bonded this time, the left end c of the electronic component 2-1a located at the leftmost end is pressed with the pressing tool 13 When the right end B of the pressing tool 13 is positioned so as to coincide with the left end A of the electronic component 2 or slightly inside the left end A of the pressing tool 13, the center of the upper surface of the electronic component 2-5 a is just right. As a result, the pressing surface of the pressing tool 13 only partially contacts the electronic component 2-5a. When the crimping operation is performed in such a state, the ACF 3 located below the electronic component 2-5a also
Although it is affected by heat from the pressing tool 13 via the electronic component 2-5a or from the backup tool 15, since the ACF 3 is thermosetting, the electronic component 2-5a is hardened.
In the ACF 3 under 5a, the portion not subjected to the pressing force by the pressing tool 13 is also cured.

Therefore, even if the remaining part of the electronic component 2-5a is heated and pressed later,
Since the lower ACF 3 has already been cured as described above, the lead of the glass substrate 1 and the lead of the electronic component 2 corresponding to the remaining portion cannot be connected via the ACF 3. Therefore, a connection failure between the two occurs at this portion, and the glass substrate 1 becomes a defective product.

In order to eliminate this drawback, each time the size of the glass substrate 1, the size of the electronic component 2 mounted on the glass substrate 1, the mounting interval of the electronic component, etc. are changed, the pressing tool 13 corresponding to the size is changed. It is possible to replace it. However, replacing the pressurizing tool requires a large amount of adjustment time, which is not preferable because the operation rate of the apparatus is reduced.

An object of the present invention is to provide an electronic component crimping apparatus and an electronic component crimping method capable of satisfactorily crimping an electronic component to a substrate.

[0012]

According to one aspect of the present invention, an electronic component crimping apparatus for arranging a plurality of electronic components in a straight line and mounting the electronic components on a substrate includes: a pressing tool for applying pressure to the electronic components; A pressure receiving tool provided to face the pressing tool, a substrate holding tool for supporting the substrate between the pressing tool and the pressure receiving tool, and the substrate supported by the substrate holding tool. A moving device that moves relatively to the pressing tool, and is connected to the moving device to control the moving device, and the substrate supported by the pressing tool and the substrate holding tool in the linear direction; A control device that adjusts a relative position of the electronic component and presses the substrate and the electronic component by the pressure tool, the plurality of electronic components are grouped, and the pressure bonding by the pressure tool In order to prevent the presence of an electronic component that is partially pressurized before being pressed, the process is sequentially performed on each group in a plurality of times.

According to another aspect of the present invention, there is provided an electronic component crimping apparatus for mounting a plurality of electronic components on a substrate by using a buffer member and arranging the components on a straight line. A pressure receiving tool provided facing the pressure tool, a substrate holding tool for supporting the substrate between the pressure tool and the pressure receiving tool, and the buffer member between the substrate and the pressure tool And a moving device connected to at least one of the pressing tool and the buffer member holding tool for moving the pressing tool and the buffer member holding tool relative to the linear direction. And a controller for controlling the pressurizing tool to press the substrate and the electronic component.

According to still another aspect of the present invention, there is provided an electronic component crimping method for arranging a plurality of electronic components on a straight line and mounting the plurality of electronic components on a substrate, comprising the steps of: The substrate is moved relatively to the pressing tool, and one end of the pressing tool can be crimped to the entire electronic component of the plurality of electronic components which is located closest to one end of the substrate. Wherein the other end of the pressing tool can press the entire one of the electronic components near the other end and does not contact the adjacent electronic component. And adjusting relative to.

According to still another aspect of the present invention, there is provided an electronic component crimping method for mounting a plurality of electronic components on a substrate by using a buffer member and arranging the plurality of electronic components on a straight line. Arranging the substrate relative to a pressure tool, and adjusting the electronic component to a position where the entire electronic component at a position closest to one end of the substrate is pressed. Simultaneously with or before and after the step of moving the substrate relative to the pressure tool, the buffer member is moved relative to the pressure tool to press the electronic component, and The position of the buffer member is set to the position of the pressure tool so that one end of the member is located inside the one end of the pressure tool and one end of the substrate located near one end of the substrate. Comprising a step of relatively adjusting for.

According to still another aspect of the present invention, there is provided an electronic component crimping apparatus for arranging a plurality of electronic components in a line in a straight line and mounting the electronic components on a substrate, comprising: a pressing tool for applying pressure to the electronic component; A pressure receiving tool provided to face the tool, a substrate holding tool for supporting the substrate between the pressing tool and the pressure receiving tool, and a substrate holding tool relatively to the pressing tool. A moving device to be moved, connected to the moving device, controlling the moving device to adjust a relative position between the pressing tool and the substrate supported by the substrate holding tool in the linear direction,
A control device that presses the substrate and the electronic component by the pressure tool, wherein the control device controls the moving device so that any end of the pressure tool is in the one row of the electronic component. The relative position between the pressing tool and the substrate supported by the substrate holding tool is adjusted so as to be positioned outside or between the adjacent electronic components.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing the structure of the electronic component crimping apparatus according to the present invention, FIG. 2 is a front view showing the operation state of the electronic component crimping apparatus of FIG. 1, FIG. 3 is a right side view of FIG. 4 is a partially enlarged front view showing the operation state of the electronic component crimping apparatus, and FIG. 5 is a front view showing the crimping operation state of the electronic component at a position different from that in FIG.

Here, description will be made on the assumption that electronic components are crimped to a plasma display panel using the electronic component crimping device 20. However, those skilled in the art will understand that an EL display (Electroluminescence Display), FED (Field
It is clear that the same can be applied to other devices such as an emission display and a liquid crystal display.

In FIG. 1, the electronic component crimping device 20 comprises:
Crimping head 21, pressure receiving unit 22, substrate stage 23, sheet member supply unit 24, and control device 2
5.

The pressing head 21 is a long pressing tool 2.
6, a heater 27 for heating the pressing tool 26, and a pressing cylinder 28 for moving the pressing tool 26 up and down. The lower surface of the pressing tool 26 forms a pressing surface 26a. The pressurizing cylinder 28 is fixedly supported by a frame (not shown).

The pressure receiving unit 22 has a backup tool 29 as a pressure receiving tool and a heater 30 for heating the backup tool 29. It is arranged so as to face the pressure surface 26a. The backup tool 29 can be moved up and down via lifting means (not shown).

The substrate stage 23 includes a support 31 for supporting the glass substrate 1 with a suction cup or the like as a substrate holding tool, a θ table 32 for rotatably supporting the support 31, and θ.
An XY table 33 that supports the table 32 movably in the X and Y directions is provided. Then, the glass substrate 1 to which the plurality of rows of the electronic components 2 are temporarily attached in the previous process is supplied to the substrate stage 23 by carrying-in means (not shown), and the crimping operation by the electronic component crimping device 20 is completed. The glass substrate 1 thus carried out is carried out for the next step by carrying-out means (not shown). Here, the θ table 32 and the XY table 33 constitute a moving device of the support unit 31.

The electronic component 2 is, for example, an insulating substrate made of epoxy or the like having a wiring pattern formed on its surface. When assembling this plasma display panel,
It is electrically connected to another control circuit of the plasma display. If necessary, electronic elements such as transistors and resistors may be mounted on this wiring pattern. Such an electronic component 2 is generally made of a flexible printed circuit (FPC).
uit). In the case of other applications such as an EL display, an FED, and a liquid crystal display, electronic components suitable for the application are used.

The sheet member supply unit 24 constitutes a holder 34 as a buffer member holding tool, and constitutes a moving device for the holder 34. Position adjustment for moving the holder 34 in the longitudinal direction of the pressing tool 26 (m direction in FIG. 1). The holder 34 includes a sheet member 36 as a buffer member made of silicon or the like. That is, the holder 34 includes a supply reel 37 for supplying the sheet member 36,
The sheet reel 36 includes a storage reel 38 for winding the sheet member 36 and guide rollers 39 and 40. The supply reel 37 supplies the sheet member 36 from the supply reel 37 by the operation of a driving source that drives the storage reel 38 to rotate appropriately. , And are stored on a storage reel 38 via guide rollers 39 and 40. Then, the sheet member 36 located between the guide roller 39 and the guide roller 40 is disposed so as to pass between the pressing surface of the pressing tool 26 and the upper surface of the backup tool 29 opposed thereto. Further, the width of the sheet member 36 in the m direction in FIG. 1 is set substantially equal to the length L of the pressing tool 26 (see FIG. 2).

Also in this case, after the ACF is attached along the side of the glass substrate 1 on which the electronic component 2 is mounted, the electronic component 2 is temporarily attached to the glass substrate 1 by utilizing the adhesiveness of the ACF. By heating and pressurizing the temporarily attached electronic component 2 with respect to the glass substrate 1 using an electronic component crimping device, the lead formed on the glass substrate 1 and the lead of the electronic component 2 are connected. The ACF is made of a thermosetting material which can be made conductive by applying pressure and which is cured by heat. However, any other suitable material may be used as long as it has adhesiveness. For example, even if the lead does not necessarily have conductivity, the lead of the glass substrate 1 and the lead of the electronic component 2 may be fixed in a state of being directly and electrically connected by applying pressure. Further, it is also possible to use an ultrasonic wave instead of heat.

The control device 25 controls the driving of the pressurizing cylinder 28, the position adjusting device 35, the θ table 32, the XY table 33, and the like.
Information about the glass substrate 1, the tool length L of the pressing tool 26, and the like are stored. The information on the glass substrate 1 is, for example, the individual positional relationship of a plurality of electronic components temporarily attached to each side of the glass substrate 1 (the width of each electronic component,
(The distance between each other), the number of electronic components 2 that can be press-bonded by one press by the press tool 26, or the order of performing the press operation.

Next, the operation of the electronic component crimping apparatus 20 will be described with reference to FIG.

In FIG. 2, the number of electronic components temporarily mounted on the glass substrate 1, the mounting interval, and the length of the pressing tool are as follows.
This is the same as that of the prior art described earlier with reference to FIG. In addition, the control device 25 has information about the glass substrate 1 that the number of electronic components that can be collectively pressed by the pressing tool 26 is four, and the four electronic components 2-1a to 2-
4a is collectively pressurized, and then two electronic components 2-5a,
This is an example in which information or the like that 2-6a is collectively pressurized is set.

First, the glass substrate 1 on which a plurality of electronic components 2 are temporarily attached in the previous process is placed on the substrate stage 23 and positioned at the pressure bonding position. Then, in the first positioning, the control device 25 controls the substrate based on the supplied information on the glass substrate 1 and the position information of the glass substrate 1 detected by using a camera (not shown) arranged near the backup tool 29. The movement of the stage 23 is controlled to position the glass substrate 1 so as to have the following positional relationship.
In other words, a total of six electronic components 2-1a to 2-6a are arranged and temporarily attached along the side that is to be crimped this time. From the condition that four electronic components can be collectively pressurized by the pressurizing operation, the end of the electronic component group composed of the six electronic components 2-1a to 2-6a arranged along this side A fourth electronic component (2 in this example) adjacent along the side including the located electronic component (2-1a in this example)
-4a), and an end (right end in FIG. 2, also referred to as an outer end in this specification) e opposite to the electronic component 2-1a is a corresponding end on the pressing surface 26a of the pressing tool 26. The substrate stage 23 is controlled so as to coincide with the portion D (right end in FIG. 2) or slightly inside the right end D of the pressing surface 26a. At this time, as shown in FIG. 2, the electronic component 2-1 to be collectively pressed.
Since the length h (required crimping length) between a to 2-4a is shorter than the length L of the pressing tool 26, the left end C of the pressing tool 26 is located on the end of the glass substrate 1. It will protrude.

Now, under such a positional relationship between the pressing tool 26 and the glass substrate 1, the control device 25
Controls the driving of the position adjusting device 35 so that the sheet member 36
The edge f on the electronic component 2-1a side (the left side in FIG. 2) located below the pressing surface 26a of the pressing tool 26 in FIG.
Outer end of electronic component 2-1a (left end in FIG. 2)
By moving the holder 34 so as to coincide with the position d or slightly project from the left end d of the electronic component 2-1a, the relative position between the sheet member 36 and the glass substrate 1 is adjusted. Here, the sheet member 36 and the pressing tool 26
May be adjusted before adjusting the relative position between the pressing tool 26 and the glass substrate 1, or may be adjusted simultaneously.

When the above-described position setting is completed, the control unit 2
5 controls the lifting device (not shown) to raise the backup tool 29 to support the glass substrate 1 from below (the state shown in FIG. 2), and to drive the pressing cylinder 28 to drive the pressing tool 26. Then, the pressing tool 26 collectively presses the electronic components 2 against the glass substrate 1 via the sheet member 36, and the electronic components 2-1a to 2-
4d is thermocompression-bonded to the glass substrate 1.

In FIG. 2, the left edge f of the sheet member 36 located below the pressing surface 26a of the pressing tool 26 coincides with the left end d of the electronic component 2-1a.
Alternatively, the relative position between the sheet member 36 and the glass substrate 1 is adjusted so as to be slightly protruded from the left end d of the electronic component 2-1a for the following reason. That is, as described above, the left end portion C of the pressing tool 26 projects above the end portion of the glass substrate 1 in the positional relationship at the time of pressing, as shown in FIG. Since f is slightly coincident with the left end d of the electronic component 2-1a or slightly protrudes from the left end d of the electronic component 2-1a, when the electronic component is pressed by the pressing tool 26, the glass substrate 1 Left side upper surface and pressing surface 2 of pressing tool 26
A gap g exists between the gap 6a and the gap 6a. In FIG. 4, the sheet member 36 is a pressing surface 26a of the pressing tool 26.
When the pressing tool 26 is pressed, the pressing force is applied via the sheet member 26 to the glass substrate 1.
In this embodiment, even if the pressing tool 26 is pressed due to the presence of the gap g, the glass substrate 1 is damaged even when the pressing is performed by the pressing tool 26. The end of the substrate 1 is prevented from being overheated or subjected to pressure from the pressing tool 26, and the glass substrate 1 can be prevented from being damaged.

Returning to FIG. 2, the electronic components 2-1a to
When 2-4a is thermocompression-bonded to the glass substrate 1, the pressure tool 26 is raised, and the backup tool 29 is lowered.

Next, as shown in FIG.
Controls the movement of the substrate stage 23 again, and among the remaining two electronic components 2-5a and 2-6a to be collectively pressed together,
Along the side including the electronic component (2-6a in this example) located at an end different from the end of the electronic component group composed of the six electronic components 2-1a to 2-6a arranged along the side And the second electronic component (2-5a in this example) adjacent thereto, and on the opposite end (left end in FIG. 5) to the electronic component 2-6a.
The substrate stage 23 is controlled such that k coincides with a corresponding end (left end in FIG. 5) C of the pressing surface 26a of the pressing tool 26, or is slightly inside the left end C of the pressing surface 26a. . At this time, as shown in FIG. 5, the electronic components 2-5a,
The length n (required crimping length) between −6a is the pressing tool 26
Is shorter than the length L, the pressing surface of the pressing tool 26 is present on the end of the glass substrate 1. Therefore, for the reason described above, the electronic component 2
The edge q on the −6a side (the right side in FIG. 5) is the electronic component 2
-6a coincides with the outer end (right end in FIG. 5) p,
Alternatively, the relative position between the sheet member 36 and the glass substrate 1 is adjusted by moving the holder 34 so as to be slightly protruded from the right end p of the electronic component 2-6a.

When the above-described position setting is completed, the control unit 2
By the drive control of 5, the backup tool 29 rises to support the glass substrate 1 from below, and the pressing tool 26 descends to thermally press the electronic components 2-5a and 2-6a to the glass substrate 1.

As described above, the pressing operation of the electronic component 2 to one side of the glass substrate 1 is completed. As in this example, the electronic component 2 temporarily attached to the other side of the glass substrate 1
If there is, the side is placed at the crimping position below the pressing tool 26, and the crimping operation for the other side is executed by the same operation as described above. Note that the sheet member 36 is sequentially sent from the supply reel 37 to the storage reel 38 when the number of times of pressing reaches a predetermined number, and a new surface of the sheet member is positioned below the pressing tool 26.

As described above, according to the above-described embodiment, when performing the pressing operation by the pressing tool 26, the electronic components 2-1a to 2-4a to be subjected to the current pressing operation are described.
Among them, the outer edge e of the electronic component 2-4a located on the side opposite to the edge of the glass substrate 1 is added to the end of the electronic component group composed of a plurality of electronic components arranged along the side. Since the positioning is performed so as to correspond to the corresponding end D of the pressing surface 26a of the pressing tool 26, and the other end C of the pressing tool 26 is projected above the end of the glass substrate 1,
Even when the crimping length h is shorter than the length L of the pressing tool 26, the electronic components 2-1a to 2-1
-4a can be heated and pressurized, and only a part of the electronic component 2 is heated and pressurized by the pressurizing tool 26 as conventionally occurred, so that the ACF below the electronic component 2
It is possible to prevent such a phenomenon that the portion corresponding to the portion protruding from the pressing tool 26 in 3 is hardened without receiving the pressing force by the pressing tool 26. As a result, the electronic component 2 can be favorably crimped.

According to the above embodiment, for example, when the electronic components 2-1a to 2-4a are collectively pressed by the pressing tool 26, the pressing surface 26a of the pressing tool 26 is used.
The edge f of the lower sheet member 36 is connected to the electronic component 2-
1a, the glass substrate 1 is damaged by the pressing of the pressing tool 26 even when the crimping length h is shorter than the length L of the pressing tool 26. Can be prevented, and the electronic component 2 can be satisfactorily crimped. The reason is as described above.

Further, according to the above-described embodiment, each time the size of the glass substrate 1, the size of the electronic component 2 mounted on the glass substrate 1, the mounting interval of the electronic component, and the like are changed as in the related art. Therefore, there is no need to replace the pressurizing tool 13 with the pressurizing tool 13. Therefore, much adjustment time required for replacing the pressurizing tool can be omitted, and the operation rate of the apparatus can be maintained.

In the above embodiment, the sheet member 3 is disposed between the pressurizing tool 26 and the backup tool 29.
As described in the example where 6 is arranged, if reliability is secured,
The sheet member 36 is not always necessary.

Although the embodiment has been described in which the sheet member 36 is supplied from the supply reel 37, the present invention is not limited to this. For example, a sheet member cut into a strip shape is held by a chuck or the like, and It may be supplied on the electronic component 2 to be pressed each time.

As information on the glass substrate 1,
The number of electronic components 2 to be heated and pressurized at once by the pressurizing tool 26 for each side of the glass substrate 1 and the pressing order are controlled by the control device 25.
Has been described in advance, but the present invention is not limited to this. For example, the mounting position of the electronic component 2 with respect to the glass substrate 1, the width dimension of the electronic component 2, and the like are set in the control device 25 as information on the glass substrate 1, and the control device 25 performs processing based on the information. The number of electronic components 2 that can be heated and pressed at one time by the pressure tool 26 may be determined. Specifically, for example, the width dimension of the electronic component 2 located at one end of the side of the glass substrate 1 is compared with the tool length L. As a result, if the tool length L is larger, the crimping length h obtained by adding the electronic component 2 to the adjacent electronic component 2 is determined by the set mounting position of the electronic component 2 and the width dimension of the electronic component 2. And compares it with the tool length L. Then, the crimping length h is changed to the tool length L by this operation.
When the crimping length h exceeds the tool length L, the number of the electronic components 2 immediately before that is increased by the pressing tool 26.
Is determined as the number of electronic components 2 that can be heated and pressed at one time. After the number of electronic components 2 that can be heated and pressed at one time by the pressing tool 26 is determined in this way, a crimping operation is performed by the same operation as the above-described embodiment.

Next, a specific example of the control device 25 will be described in more detail. FIG. 10 is a diagram showing a mounting example of the control device 25 according to the embodiment of the present invention. The control device 25 is a CPU
51, a RAM 53, a FLASH ROM 55, an input / output control unit 57, and a parameter setting unit 61. Here, the CPU 51 executes the control program loaded in the RAM 53 to control each element of the electronic component crimping apparatus 20, that is, the crimping head 21, the pressure receiving unit 22, the substrate stage 23, and the sheet member supply unit 24. The above crimping operation is performed. Also,
The parameter setting unit 61 includes a user interface 59, a network control unit 63, and a ROM 65.
And information about the glass substrate 1 and parameters such as the tool length L of the pressing tool 26 are stored in the RAM 53 (or
FLASH ROM 55). This information is used by the control device 25 to control the actual crimping operation, as described above.

Next, a method for setting information on the glass substrate 1 as a parameter using the parameter setting unit 61 will be described. When a two-dimensional code such as a barcode or a vericode is provided on the glass substrate 1, the two-dimensional code is read by the code reader 71, and the corresponding parameters are transferred to the RAM 53 by referring to the database stored in the ROM 65. . If the code provided on the glass substrate 1 does not have the necessary information, the parameter setting unit 61 accesses the server which seems to provide the information via the network control unit 63, and If parameters can be obtained, save them to RAM
Transfer to 53.

When a two-dimensional code such as a bar code or a Veri code is not provided on the glass substrate 1, the parameter setting unit 61
If the necessary parameters can be obtained by accessing the default server via the server 3, it is transferred to the RAM 53. If the required parameters cannot be obtained from the default server, the operator manually uses the user interface 59 to search for a server that seems to provide the information and accesses the server via the network control unit 63. Search for the required parameters. If the parameters can be obtained, they are transferred to the RAM 53.
If the necessary parameters cannot be obtained, the operator directly inputs a numerical value to the parameter setting unit 61 using the user interface 59 manually. The parameters transferred to the RAM 53 are processed by the control program in the manner described above, and are used for appropriate control of each element of the electronic component crimping apparatus 20. In addition, the operator may directly input the actual movement amount of each element of the electronic component crimping device 20 to the parameter setting unit 61 instead of the above-described parameters as the information regarding the glass substrate 1.

Although the present invention has been described in detail with reference to the embodiments, it is obvious to those skilled in the art that the present invention is not limited to the embodiments described in the present application. The device of the present invention can be embodied as modifications and alterations without departing from the spirit and scope of the present invention defined by the claims. Therefore, the description of the present application is intended for illustrative purposes, and has no restrictive meaning to the present invention.

For example, in the above-described embodiment, an example in which a plurality of electronic components are crimped at one time has been described.

It goes without saying that the substrate is not limited to glass.

Further, the present invention can be applied even when heat is not required for crimping.

In the example shown in FIG. 2, first, as many electronic components (specifically, four electronic components) as can be heated and pressed by the pressing tool 26 are crimped, and then the remaining electronic components (2 Although two electronic components are crimped, it is not always necessary to crimp electronic components as long as they can be heated and pressurized first, and a smaller number of electronic components may be crimped at a time. For example, in a case where six electronic components 2 are mounted on one side of the glass substrate 1 and four electronic components 2 can be pressed at once by the pressing tool 26, three electronic components 2 are each set to two. Heating and pressurizing may be performed separately.

When all of the electronic components 2 mounted on one side of the glass substrate 1 can be heated and pressed at a time by the pressing tool 26, the electronic component 2 located at any one end on that side is removed. The outer end (the end side of the glass substrate 1) is aligned with the corresponding end of the pressing surface 26a of the pressing tool 26, and the outer end of the electronic component 2 located on the other end side of the glass substrate 1 Preferably, the corresponding edge of the sheet member 36 is aligned.

FIGS. 6 to 9 show the pressing tool 26.
3 shows another embodiment of the positions that can be taken and the order of pressing by the pressing tool 26. In each figure, circled numbers indicate the pressing order, and thick solid lines indicate the position of the sheet member.

FIG. 6 shows that the electronic components 2 that can be pressed all at once are pressed from the left side, the electronic components 2 that can be pressed all at once are pressed from the right side, and finally the remaining electronic components 2 are pressed. The case where the left and right are performed alternately is shown.

FIG. 7 shows a case in which the pressing tool 26 does not protrude to the right side of the substrate and presses the electronic components 2 which can be pressed all at once from the left.

FIG. 8 shows a case where the electronic component 2 present on the side is divided into two and pressed.

FIG. 9 is similar to FIG.
The order when the number of electronic components 2 is larger than the length of 6 is shown.

[0058]

According to the present invention, it is possible to provide a crimping apparatus which can prevent breakage of a substrate and can crimp electronic parts well.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of an electronic component crimping apparatus according to the present invention.

FIG. 2 is a front view showing an operation state of the electronic component crimping apparatus.

FIG. 3 is a right side view of the electronic component crimping apparatus of FIG. 2;

FIG. 4 is a partially enlarged front view showing an operation state of the electronic component crimping apparatus.

5 is a front view showing a crimping operation state of the electronic component at a position different from that of FIG. 2 in the electronic component crimping apparatus of FIG. 1;

FIG. 6 is a schematic view showing another position of the pressing tool of the electronic component crimping device according to the present invention and another embodiment of the pressing order by the pressing tool.

FIG. 7 is a schematic diagram showing another position of the pressing tool of the electronic component crimping apparatus according to the present invention, and the order of pressing by the pressing tool.

FIG. 8 is a schematic diagram showing another position of the pressing tool of the electronic component crimping apparatus according to the present invention and the order of pressing by the pressing tool.

FIG. 9 is a schematic diagram showing another position of the pressing tool of the electronic component crimping apparatus according to the present invention and the order of pressing by the pressing tool.

FIG. 10 is a diagram showing a mounting example of a control device of the electronic component crimping device according to the embodiment of the invention.

11A and 11B show an example of a glass substrate on which electronic components are mounted by an electronic component mounting apparatus. FIG. 11A is a plan view showing an example of a glass substrate on which electronic components are mounted.
(B) is a side view thereof.

FIG. 12 is a schematic diagram showing a configuration of a conventional electronic component crimping apparatus.

FIG. 13 is a schematic view showing an operation state of the electronic component crimping apparatus of FIG.

FIG. 14 is a schematic view showing an operation state of the electronic component crimping apparatus of FIG.

FIG. 15 is a schematic view showing a problem of a conventional electronic component crimping apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 glass substrate 2 electronic component 10, 21 electronic component crimping device 11, 28 pressurizing cylinder 12, 14, 27, 30 heater 13, 26 pressurizing tool 15, 29 backup tool 16, 26, 36 sheet member 21 crimping head 22 pressure Receiving unit 23 Substrate stage 24 Sheet member supply unit 25 Control device 26a Pressurizing surface 31 Support portion 32 XY table 33 θ table 34 Holder 35 Position adjustment device 37 Supply reel 38 Storage reel 39, 40 Guide roller 57 Input / output control unit 59 User interface 61 Parameter setting unit 63 Network control unit 71 Code reader

Continuation of the front page (72) Inventor Shinichi Ogimoto 5-14-1, Higashikashigaya, Ebina-shi, Kanagawa Prefecture Inside the Sagamino Office of Mechatronics Co., Ltd. (72) Inventor Kunihiro Iwanaga 5-1-1, Higashikashigaya, Ebina-shi, Kanagawa Shibaura Mechatronics Co., Ltd. Sagami Field Office F-term (reference) 5E319 AA03 AC01 AC03 BB16 CD04 CD26 GG15 5F044 NN12 NN19 PP19

Claims (10)

[Claims] An electronic component crimping apparatus for mounting a plurality of electronic components on a substrate by arranging a plurality of electronic components on a straight line, comprising: a pressure tool for applying pressure to the electronic component; and a pressure provided opposite to the pressure tool. A receiving tool; a substrate holding tool that supports the substrate between the pressing tool and the pressure receiving tool; and a movement that moves the substrate supported by the substrate holding tool relative to the pressing tool. A device, connected to the moving device, controlling the moving device to adjust a relative position between the pressing tool and the substrate supported by the substrate holding tool in the linear direction, and by the pressing tool A control device for crimping the substrate and the electronic component, wherein the plurality of electronic components are grouped, and the crimping by the press tool is performed by partially pressing the electronic component before the crimping is performed. An electronic component crimping apparatus characterized in that the process is sequentially performed on each group in a plurality of times so that no component exists. 2. The apparatus according to claim 1, further comprising: a parameter setting unit configured to set a parameter relating to an arrangement of the plurality of electronic components arranged on the substrate, wherein the control device is configured to set the parameter based on the parameter set by the parameter setting unit. And controlling a moving device to adjust a relative position between the pressing tool and the substrate supported by the substrate holding tool in the linear direction, and pressing the substrate and the electronic component by the pressing tool. An electronic component crimping apparatus according to claim 1. 3. The control device according to claim 1, wherein one end of the pressurizing tool is a position at which one of the plurality of electronic components, which is located closest to the one end of the substrate, can be entirely press-bonded, The other end of the pressure tool can press the entire one of the electronic components near the other end and control the moving device to a position where it does not contact the adjacent electronic component. The electronic component crimping apparatus according to claim 1, wherein a relative position between the supported substrate and the pressing tool is adjusted. 4. The electronic component crimping apparatus according to claim 2, wherein the parameter setting unit sets a parameter indicating an individual positional relationship between the plurality of electronic components temporarily attached to the substrate. 5. The parameter setting unit according to claim 2, wherein the parameter setting unit sets a parameter indicating a width of each of the plurality of electronic components temporarily attached to each side of the substrate and a distance between the electronic components. Electronic component crimping equipment. 6. The parameter setting unit according to claim 2, wherein a code reader is provided in the parameter setting unit, and the code reader reads a code written on the board to acquire a corresponding parameter. Electronic component crimping equipment. 7. An electronic component crimping device for mounting a plurality of electronic components on a substrate by using a buffer member and arranging the plurality of electronic components on a straight line, wherein the pressing component applies pressure to the electronic component, and the pressing component faces the pressing tool. A pressure receiving tool provided; a substrate holding tool for supporting the substrate between the pressure tool and the pressure receiving tool; and a buffer member holding the buffer member between the substrate and the pressure tool. A tool, a moving device connected to at least one of the pressing tool and the buffer member holding tool, and relatively moving the pressing tool and the buffer member holding tool in the linear direction; And an electronic component crimping device comprising: a control device for controlling the electronic component to crimp the substrate and the electronic component. 8. A method for crimping an electronic component in which a plurality of electronic components are arranged on a straight line and mounted on a substrate, the method comprising: arranging the plurality of electronic components on the substrate in a straight line; The pressing tool is located at a position where one end of the pressing tool can press the entire electronic component of the plurality of electronic components that is located closest to the one end of the substrate; The position of the substrate is adjusted relative to the pressing tool so that the other end of the substrate can crimp the entire one of the electronic components near the other end and does not contact the adjacent electronic component. Electronic component crimping method comprising the steps of: 9. A method for crimping an electronic component, wherein a plurality of electronic components are arranged in a straight line using a buffer member and mounted on a substrate, wherein the step of arranging the plurality of electronic components at a predetermined position on the substrate comprises: Relative to the pressing tool, adjusting the electronic component at a position closest to one end of the substrate of the electronic component to perform the pressure bonding of the entire electronic component; Simultaneously with or before and after the step of relatively moving the buffer member, the buffer member is relatively moved with respect to the pressing tool, and at the time when the electronic component is crimped, one end of the buffer member is attached to the substrate. The position of the buffer member is relatively adjusted with respect to the pressing tool so as to be located inside one end of the pressing tool and one end of the substrate located near one end of the pressing tool. Electronic component crimping method. 10. An electronic component crimping apparatus for arranging a plurality of electronic components in a line in a straight line and mounting the electronic components on a substrate, comprising: a pressing tool for applying pressure to the electronic component; A pressure receiving tool, a substrate holding tool that supports the substrate between the pressing tool and the pressure receiving tool, a moving device that relatively moves the substrate holding tool with respect to the pressing tool, Connected to a moving device, controlling the moving device to adjust the relative position of the pressing tool and the substrate supported by the substrate holding tool in the linear direction, the substrate and the substrate by the pressing tool A control device for crimping the electronic component, wherein the control device controls the moving device so that any end of the pressing tool is outside or adjacent to the row of the electronic component. An electronic component crimping apparatus for adjusting a relative position between the pressing tool and the substrate supported by the substrate holding tool so as to be located between the electronic components.