JPH08114810A - Apparatus for producing liquid crystal panel and press bonding device - Google Patents

Abstract

PURPOSE: To provide a device capable of well executing press bonding of an IC for driving liquid crystal (TAB parts) while well maintaining the parallelism of the pressing surface of a block. CONSTITUTION: This press bonding device includes the press bonding block 35 which has the pressing surface 33a for pressing the TAB parts 2 to glass substrates 1a, 1b of a liquid crystal cell 1 via anisotropic conductive films and is internally embedded with a heater, a driving cylinder 29 which drives this block 35 to attach the TAB parts 2 by thermo bonding to the glass substrates 1a, 1b, plural piezoelectric actuators 36 which are disposed at the press bonding block 35 and operate to adjust the inclination of the pressing surface 33a, a cooling mechanism 28 which cools the TAB parts 2 to be adjacent to the TAB parts 2 to be subjected to normal press bonded and a washing mechanism 27 which cleans the pressing surface 33a and removes the deposits of the anisotropic conductive films when the pressing surface 33a of the press bonding block 35 is stained with the deposits of the anisotropic conductive films.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal panel manufacturing apparatus and a pressure bonding apparatus for pressing a TAB component, which is a liquid crystal driving IC, onto a glass substrate constituting a liquid crystal cell.

[0002]

2. Description of the Related Art In a manufacturing process of a liquid crystal panel, as shown in FIG. 9, a liquid crystal driving I is provided around a liquid crystal cell 1 formed by facing two first and second liquid crystal glass substrates 1a and 1b.
C2 is implemented. This liquid crystal driving IC is shown in FIG.
The TAB component 2 as shown in 0 is generally used.

The TAB component 2 is manufactured by inner lead bonding a semiconductor element 5 to a thin cine film-shaped film carrier 4 having a predetermined circuit pattern 3 formed on the surface thereof.

To mount the TAB component 2 on the first and second glass substrates 1a and 1b of the liquid crystal cell 1, for example, an anisotropic conductive film is used as a bonding material. This anisotropic conductive film is a tape-shaped member in which conductive particles are mixed in a thermosetting or thermoplastic resin film, and FIG.
As indicated by reference numeral 6, for example, the TAB component 2 is attached to a plurality of outer leads 7 protruding from one end side in a state where the longitudinal direction is orthogonal to the outer leads 7. The anisotropic conductive film 6 may be attached to the first and second glass substrates 1a and 1b sides.

When connecting the TAB component 2 and the first and second glass substrates 1a and 1b, first, the TAB is connected.
The outer lead 7 of the component 2 and the wiring pattern (not shown) formed on the edges of the glass substrates 1a and 1b are positioned to face each other with the anisotropic conductive film 6 interposed therebetween. Then, the TAB component 2 is pressed against the first and second glass substrates 1a and 1b to temporarily press-bond the TAB component 2 to the first and second glass substrates 1a and 1b.

Then, as shown in FIG. 11, the above-mentioned TA is performed by using the pressure tip 9 held on the lower surface of the crimp block 8.
The B component 2 is pressed and heated against the glass substrate 1a. As a result, the anisotropic conductive film 6 sandwiched between the two is crushed and softened, and the outer lead 7 and the wiring patterns of the first and second glass substrates 1a and 1b are electrically and mechanically formed. Are joined together. The TAB component 2 is mounted on the first and second glass substrates 1a and 1b by undergoing the temporary pressure bonding process and the final pressure bonding process.

[0007]

By the way, the conventional liquid crystal panel manufacturing technique has the following problems to be solved. The crimp block 8 is an air cylinder 10.
The TAB component 2 is bonded to the glass substrates 1a and 1b by being driven up and down by pressing the TAB component 2 against the glass substrates 1a and 1b with a predetermined bonding pressure P.

The glass substrates 1a and 1b are backed up and supported by a bonding stage (not shown) disposed below the pressure bonding block 8.
The crimping block 8 is adapted to crimp (outer lead bonding) the TAB component 2 and the glass substrates 1a and 1b by sandwiching them between the bonding stage and the bonding stage.

When performing such bonding, first
Another problem is the parallelism between the pressing surface of the pressure chip 9 held by the pressure bonding block 8 and the backup surface of the bonding stage. That is, when the parallelism is poor, the anisotropic conductive film 6 cannot be locally sandwiched by a pressure of a specified value, so that the conductive particles in the anisotropic conductive film 6 are crushed. Without the liquid crystal glass substrate 1a,
There is a possibility that a portion where electrical connection is not made between the wiring pattern 1b and the outer lead 7 of the TAB component 2 may occur.

The factors that determine the accuracy of the parallelism include not only the shape accuracy of the pressing surface of the pressure chip 9 and the bonding stage, but also the thermal deformation of the pressure bonding block 8. .

That is, when the pressure tip 9 is heated, the pressure-bonding block 8 holding the pressure-tip 9 is thermally deformed, so that the pressure-bonding block 8 is thermally distorted and held by the pressure-bonding block 8. Further, the parallelism between the pressing surface of the pressure chip 9 and the upper surface of the bonding stage may change.

Also in this case, it becomes impossible to locally apply a pressure of a specified value to the anisotropic conductive film 6,
The same problem as described above occurs. Also, the glass substrate 1
When the TAB component 2 is pressure-bonded to a and 1b via the anisotropic conductive film 6, the above-mentioned T
The glass substrate 1 in which the film carrier 4 (made of resin), which is the base of the AB component 2, is expanded and pre-aligned
Positional deviation may occur between the terminals of the wiring patterns a and 1b and the outer leads 7 of the TAB component 2.

At this time, if the pressing surface of the pressing tip 9 and the bonding stage are not parallel to each other and the pressing force varies, a large expansion occurs in the direction of lower pressing force. is there.

Further, on the pressing surface of the pressing tip 9, there is a case where the residue of the anisotropic conductive film 6 adheres and accumulates every time thermocompression bonding is repeated. In this state, the TAB part 2
If the pressing is performed, the pressing force may not be uniform due to the unevenness on the pressing surface, and the same problem as in the case where the parallelism is not correct may occur.

Since the TAB component 2 for driving the liquid crystal is a large component as compared with other mounted components, the length of joining at one time (joining length) is relatively long, the parallelism is out of order and the thermal expansion is caused. Can greatly affect the accuracy of bonding.

Further, with the recent demand for larger size and higher definition of the liquid crystal panel, the liquid crystal glass substrates 1a and 1b are increased in size, and the wiring patterns formed on the glass substrates 1a and 1b are multi-terminaled and high density. Due to the miniaturization and miniaturization, higher accuracy may be required for the above pressure bonding.

The present invention has been made in view of the above circumstances, and maintains the parallelism between the pressing surface of the crimping tool and the bonding stage with high accuracy, and prevents misalignment due to thermal expansion while maintaining the above liquid crystal. It is an object of the present invention to provide a liquid crystal panel manufacturing apparatus and a pressure bonding apparatus capable of pressure bonding a driving IC (TAB component).

[0018]

A first means of the present invention is to manufacture a liquid crystal panel provided with a main pressure bonding mechanism for main pressure bonding a liquid crystal driving IC temporarily pressure bonded to a substrate constituting a liquid crystal cell to the substrate. In the apparatus, the main pressure-bonding mechanism includes a pressure-bonding block having a pressing surface that presses the liquid crystal driving IC against the substrate via a bonding material, a heating unit that raises the pressure-bonding block to a predetermined pressure-bonding temperature, and the pressure-bonding. Driving means for thermocompression bonding the liquid crystal driving IC to the substrate by driving the block and pressing the liquid crystal driving IC on the pressing surface, and the pressing surface provided on the pressure bonding block by the operation. An actuator for adjusting the inclination of the IC, cooling means for cooling the IC that is temporarily pressure-bonded to a position adjacent to the IC that is permanently pressure-bonded by the pressure-bonding block, and the pressure-bonding block. And a cleaning mechanism that is provided in the vicinity of the pressure-applying block and that cleans the pressing surface of the pressure-bonding block when the pressing surface is soiled with the bonding material and removes the bonding material. This is a liquid crystal panel manufacturing apparatus.

A second means is a liquid crystal panel manufacturing apparatus provided with a main pressure bonding mechanism for main pressure bonding the liquid crystal driving IC, which is temporarily pressure bonded to a substrate constituting a liquid crystal cell, to the substrate, wherein the main pressure bonding mechanism is A pressure-bonding block having a pressing surface for pressing the liquid crystal driving IC against the substrate via a bonding material;
Driving means for pressing the liquid crystal driving IC onto the substrate by driving the pressure bonding block and pressing the liquid crystal driving IC on the pressing surface, and the pressing means provided on the pressure bonding block and operating to operate the pressing surface. And an actuator that adjusts the inclination of the liquid crystal panel manufacturing apparatus.

A third means is the liquid crystal panel manufacturing apparatus according to the first and second means, wherein a plurality of the actuators are arranged in a direction substantially parallel to the pressing surface and are energized, respectively. The liquid crystal panel manufacturing apparatus is a piezoelectric actuator that individually expands and contracts in a direction substantially orthogonal to the pressing surface and controls the inclination of the pressing surface.

A fourth means is a liquid crystal panel manufacturing apparatus provided with a main pressure bonding mechanism for main pressure bonding the liquid crystal driving IC, which is temporarily pressure bonded to a substrate constituting a liquid crystal cell, to the substrate, wherein the main pressure bonding mechanism is A pressure-bonding block having a pressing surface for pressing the liquid crystal driving IC against the substrate via a bonding material;
By heating the pressure-bonding block to a predetermined pressure-bonding temperature and by driving the pressure-bonding block to press the liquid crystal driving IC against the pressing surface, the liquid crystal driving IC is pressed.
A liquid crystal panel manufacturing method, comprising: driving means for thermocompression-bonding the substrate to the substrate; and cooling means for cooling the IC that is temporarily pressure-bonded to a position adjacent to the IC that is permanently pressure-bonded by the pressure-bonding block. It is a device.

A fifth means is the liquid crystal panel manufacturing apparatus according to the first and fourth means, wherein the cooling means blows a cooling air to the adjacent IC to provide a cooling air blowing nozzle for cooling the IC. It is a liquid crystal panel manufacturing apparatus characterized by having.

A sixth means is a liquid crystal panel manufacturing apparatus comprising a main pressure bonding mechanism for main pressure bonding the liquid crystal driving IC, which is temporarily pressure bonded to the substrate constituting the liquid crystal cell, to the substrate, wherein the main pressure bonding mechanism is A pressure-bonding block having a pressing surface for pressing the liquid crystal driving IC against the substrate via a bonding material;
By heating the pressure-bonding block to a predetermined pressure-bonding temperature and by driving the pressure-bonding block to press the liquid crystal driving IC against the pressing surface, the liquid crystal driving IC is pressed.
Is provided in the vicinity of the crimping block, and the pressing surface of the crimping block is contaminated with the adhering material of the bonding material. A liquid crystal panel manufacturing apparatus comprising: a cleaning mechanism for removing a kimono.

A seventh means is the liquid crystal panel manufacturing apparatus according to the first and sixth means, wherein the cleaning mechanism drives the tape and presses the adhesive surface of the tape against the pressing surface, whereby the adhered matter is removed. The liquid crystal panel manufacturing apparatus is characterized by having an adhesive tape drive mechanism for removing the.

An eighth means is a crimping device for crimping a component to a substrate, and a crimping block having a pressing surface for pushing the component onto the substrate, and the crimping block is driven to press the component on the pressing face. Thus, the crimping device is characterized in that it has a driving means for crimping the component to the substrate and an actuator provided on the crimping block for adjusting the inclination of the pressing surface when activated.

A ninth means is the crimping device of the eighth means, wherein a plurality of the actuators are arranged in a direction substantially parallel to the pressing surface, and each of them is individually connected to the pressing surface by being energized. The crimping device is characterized by controlling the inclination of the pressing surface by expanding and contracting in a substantially orthogonal direction.

[0027]

According to such means, such a state is eliminated when the pressing surface is inclined or the pressing surface is soiled by an adhered substance and the parallelism of the pressing surface is deviated. be able to. Therefore, the component (IC) can be pressed uniformly. Further, by cooling the adjacent IC, it is possible to prevent the heat at the time of crimping from being transferred to this IC and the thermal deformation of this IC component.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. The same components as those described in the section of the conventional example are designated by the same reference numerals, and detailed description thereof will be omitted.

In the device described below, a TAB component 2 as an IC for driving a liquid crystal is used to form a liquid crystal cell 1.
The outer leads 7 of the TAB component 2 are connected to the wiring pattern on the liquid crystal cell 1 side by main pressure bonding to the peripheral edges of the glass substrates 1a and 1b, and the main pressure bonding device of a liquid crystal panel manufacturing apparatus for manufacturing a liquid crystal panel is used. is there.

Although not shown, a temporary pressure bonding device for temporarily pressure bonding the TAB component 2 to the liquid crystal cell 1 is arranged in the preceding step of the main pressure bonding device. This temporary pressure bonding device is
After the outer lead 7 of the AB component 2 and each wiring pattern (transparent electrode terminal) (not shown) formed on the glass substrates 1a and 1b of the liquid crystal cell 1 are precisely aligned, an anisotropic method having an adhesive property between them. The conductive film 6 is sandwiched between the TAB and
Temporary pressure bonding is performed by pressing the component 2 against the substrates 1a and 1b.

The liquid crystal cell 1 in which the TAB component 2 is temporarily pressure-bonded is transferred from the temporary pressure-bonding device to the main pressure-bonding. Then, the main press bonding apparatus performs the main press bonding of the TAB component 2.

This main pressure bonding is performed by pressing the TAB component 2 against the glass substrates 1a and 1b and heating them. For this purpose, the main pressure bonding device has a configuration described below.

FIG. 1 is a front view showing a schematic structure of this main pressure bonding apparatus (hereinafter abbreviated as “apparatus”), and FIG. 2 is a side view thereof. As shown in FIG. 2, this device includes a pedestal 15 whose upper surface is formed to be substantially flat. This stand 1
A cell stage 16 for receiving the liquid crystal cell 1 from the temporary pressure bonding device and driving and positioning the liquid crystal cell 1 in the XYθ directions, and the TAB component for the liquid crystal cell 1 positioned by the cell stage 16 A bonding mechanism 17 (main pressure bonding mechanism) for main pressure bonding (bonding) 2 is provided.

Although not shown, a liquid crystal cell reversing mechanism for reversing the liquid crystal cell 1 is provided on the frame 15. When the liquid crystal cell 1 is turned upside down, the above TA is applied to both of the two glass substrates 1a and 1b facing each other.
It is configured so that the B component 2 can be permanently crimped.

Next, each component will be described in detail. First, the cell stage 16 will be described. Since the cell stage 16 is not shown in FIG. 1, it will be described with reference to FIGS. 2 and 6.

The cell stage 16 is attached to a guide rail 19 (X drive device) provided on the upper surface of the mount 15. The cell stage 16 is driven along the guide rail 19 so that it can be positioned in the X direction.

The cell stage 16 has an XY table 20 and a θ drive section 21 provided on the XY table 20. The θ drive unit 21 is provided with a suction arm 23 formed in an X shape and provided with a suction unit 23a at its tip so as to be positionable in the θ direction.

Although not shown, the θ drive unit 21 accommodates three lift pins which are provided so as to project and retract from the upper surface of the θ drive unit 21. By projecting these three lift pins, the liquid crystal cell 1 can be lifted up in a state of supporting at three points, and by being housed in the θ drive section 21, the liquid crystal cell 1 is held by the suction arm 2.
It is supposed to be handed over to 3rd.

The liquid crystal cell 1 delivered onto the suction arm 23 has a suction portion 2 provided at the tip of the arm 23.
3a is sucked and held by the guide rails 19, X
By operating the Y table 20 and the θ drive unit 21,
The carriage is positioned in the XYθ directions.

Next, the bonding mechanism 17 will be described. The bonding mechanism 17 is provided on the side of the guide rail 19 as shown in FIG.
The bonding mechanism 17 has a column 25 that is erected on the pedestal 15. This column 25
It has a front surface 25a formed substantially vertically, and a horizontal plate portion indicated by 25b in the drawing is provided at its upper end so as to project substantially horizontally.

The column 25 is provided with a heating and pressing mechanism 26 for performing the main pressure bonding of the TAB component 2 and the heating and pressing mechanism 2.
Cleaning mechanism 27 for cleaning the heating and pressing surface 6 (described later)
A (cleaning mechanism) and a cooling mechanism 28 (cooling means) for cooling the TAB component 2 are attached.

First, the heating and pressing mechanism 26 will be described. The heating and pressing mechanism 26 includes a first air cylinder 29 (driving means) for vertically driving, which is fixed to the upper surface of the horizontal plate portion 25b of the column 25. The drive shaft 29a of the first air cylinder 29 penetrates the horizontal plate portion 25b and is led out downward.

Further, the drive shaft 2 of the first air cylinder 29
A holding plate indicated by 31 in the figure is fixed to the lower end of 9a. The holding plate 31 is a plate member that is elongated in the X direction as shown in FIG.
Two second cylinders 32 ... Are fixed in parallel with their axes vertical. A holder 34 is fixed to the lower end of the drive shaft 32a of each second cylinder 32.
4 holds a pressure bonding block 35 having a pressure tip 33 fixed to the lower end surface.

As shown in FIG. 3, the crimping block 35 is composed of an upper block 37 and a lower block 38 which are connected by a laminated piezoelectric actuator 36 (actuator of the present invention).
Is fixed to the lower block 38. A heating heater 39 (heating means) is embedded in the lower block 38, and the pressing tip 33 is heated to a predetermined temperature by operating the heating heater 39.

The lower end portion of the pressure tip 33 is formed to have a narrow width, and the lower end surface thereof is a flat pressing surface 33a formed according to the joint length of one of the TAB components. The pressing surface 33a is coated with a material having wear resistance such as fluorine resin.

On the other hand, the laminated piezoelectric actuator 3 provided between the upper block 37 and the lower block 38.
As shown in FIG. 4, 6 are provided in three rows in the X direction and two rows in the Y direction, and the upper surface and the lower surface of each actuator 36 are fixed to the upper block 37 and the lower block 38, respectively. .

The six actuators 36 are individually controlled as will be described later, and are displaced in the Z direction (direction substantially orthogonal to the pressing surface 33a) by applying a voltage to each of them. To do. By operating an arbitrary actuator 36, it is possible to drive the lower block 38 and adjust the inclination of the pressing surface 33a of the pressing tip 33.

Further, as shown in FIGS. 1 and 2, below the crimping block 35, a plate-shaped bonding stage (backup) 40 erected on the pedestal 15 is provided.
The upper surface 40a (backup surface) is provided so as to face the pressing surface 33a of the pressing tip 33 provided on the pressure-bonding block 35. This bonding stage 40
Is moved up and down by a cam mechanism (not shown).

Further, a tilt correction mechanism (not shown) is attached to the bonding stage 40, and the tilt of the backup surface 40a can be corrected by operating this correction mechanism.

The bonding stage 40 is driven upward by the operation of the cam mechanism, and the backup surface 40a supports the lower surfaces of the glass substrates 1a and 1b of the liquid crystal cell 1.

The pressurizing / heating mechanism 26 lowers the two crimping blocks 35 at the same time, so that the two TAB components 2 are separated by sandwiching the two TAB components 2 therebetween, as shown in FIG. Are configured so that they can be permanently pressure-bonded at the same time.

When pressing a plurality of TAB parts 2 in this way, a plurality of TAB parts are pressed by one crimping block 35.
Instead of pressing the component 2, two crimping blocks 35 are used to press one TAB component 2 with each crimping block 35 because the pressing surface 33 becomes longer when the pressing length becomes longer.
This is because it becomes difficult to maintain the parallelism between a and the backup surface 40a.

The two crimp blocks 35 are separated from each other by separating the two TAB parts from each other.
This is because if the five blocks are brought close to each other, the crimp blocks 35 may interfere with each other.

Next, the control and operation of the heating / pressurizing mechanism 26 will be described. The first air cylinder 29 is connected to a high pressure pump via, for example, a closed center type four port valve (not shown). The high-pressure pump has a role of driving the drive shaft 29a of the first air cylinder 29 at the maximum pressure F higher than the bonding pressure P.

The second air cylinder 32 has the second
Drive shaft 32a of the air cylinder 32 of the maximum pressure P (F>
It is connected to a low pressure pump driven by P), and a relief valve is connected to this circuit. This relief valve is the second
When the pressure in the air cylinder 32 of becomes P or more, it operates,
It has a role of always maintaining the pressure in the second air cylinder 32 at P.

The port valve provided in the high pressure pump is
The control unit 42 is connected to the control unit 42 in FIG. 1 and operates according to an operation command of the control unit 42. That is, if the part of the liquid crystal cell 1 which is tentatively pressure-bonded to the TAB component 2 is held on the backup surface 40a of the bonding stage 40, the controller 42
Opens the port valve to open the first air cylinder 2
9 is activated.

As a result, the crimp block 35 is
Is driven downward to bring the pressing surface 33a of the pressing tip 33 into contact with the TAB component 2. This pressure tip 33
The TAB component 2 is pressed against the liquid crystal cell 1 with a constant pressure P by the action of the second air cylinder 32. At this time, the heater 39 is operating to heat the TAB component 2.

As a result, the TAB component 2 is thermocompression bonded (outer lead bonding) to the liquid crystal cell 1.
To be done. The pressurizing tip 33 is of a constant heat type, and is kept at a constant temperature by the control of the heating heater 39 by the control unit 42 based on the temperature detection signal from the thermocouple embedded in the lower block 38. It is designed to be kept.

Further, the control section 42 includes the laminated piezoelectric actuators 36 provided on the pressure bonding block 35.
Is connected. The controller 42 individually controls the voltage applied to each piezoelectric actuator 36 as described above.

The control unit 42 controls the voltage applied to each actuator 36 based on the inclination of the pressing surface 33a of the pressing tip 33, and displaces each actuator 36 in the thickness direction, thereby applying the pressing force. Pressing surface 33 of chip 33
The inclination of a is corrected.

Next, the cleaning mechanism 27 (cleaning mechanism) will be described. As shown in FIG. 2, the cleaning mechanism 27 is attached to the front surface 25a of the column 25 and, if necessary, the pressure tip 3 of the heating and pressure mechanism 26.
The pressing surface 33a of No. 3 is cleaned. This cleaning is performed by the pressing surface 33a of the pressing tip 33.
1 and 2, the adhesive surface of the tape indicated by 44 is pressed, and the tape 44 wipes off the dirt on the pressing surface 33a.

The cleaning mechanism 27 has the following structure as a tape drive mechanism for driving the tape 44. This cleaning mechanism 27, as shown in FIG.
Has a drive cylinder 45 for advancing and retreating, which is fixed to the front surface 25a of the. The drive shaft 45a of the cylinder 45 is connected to the front surface 25 of the column 25 by the operation of the cylinder 45.
A moving body 46 is provided that is driven to move back and forth in a direction away from a.

As shown in FIG. 1, this moving body 46 is
Formed in a long direction, and the pair of crimp blocks 35,
It has both end portions protruding and located outside 35. Projecting parts 47 projecting to the front side are provided at the upper ends of both ends of the moving body 46, and the upper surfaces of the projecting parts 47 are
The vertical drive cylinder 48 is fixed.

Further, vertical moving sliders 51 shown in the figure are slidably provided on the front surfaces of the lower ends of both ends of the moving body 46, respectively. This slider 51
It is fixed to the drive shaft 48a of each of the drive cylinders 48, and is vertically driven by the operation of the vertical drive cylinders 48.

Further, as shown in FIG.
In the figure, a feeding reel 53 for feeding the tape 44 is provided on the front surface of the protruding portion 47 located on the left side, and a winding reel 54 for winding the tape 44 is provided on the front surface of the protruding portion 47 located on the right side. It is provided.

The take-up reel 54 is rotatably driven by a drive motor (not shown).
A tension mechanism (not shown) for applying back tension to the tape 44 fed from the feeding reel 53 is connected to the feeding reel 53.

A plurality of guide rollers 55 that guide the tape 44 to the front surfaces of the pair of upper and lower sliders 51 and stretch the tape 44 substantially horizontally below the pressing surface 33a of the pressing tip 33. ... is rotatably fixed.

Next, the operation of the cleaning mechanism 27 will be described. When performing a normal bonding operation, the moving body 46 of the cleaning mechanism 27 retracts the tape 44 from below the pressure tip 33 to the column 25 side, as shown in FIG. On the other hand, at the time of cleaning, the advancing / retreating drive cylinder 45 is operated to position the tape 44 below the pressing tip 33, and the vertical drive cylinder 48 is operated to drive the vertical slider 51 upward. As a result, as shown in FIGS. 7 and 8, the tape 44 is brought into contact with the pressing surface 33 a of the pressing tip 33.

When the tape 44 is wound by rotating the take-up reel 54, the tape 44 is wound.
Moves while slidingly contacting the pressing surface 33a and wipes off the dirt on the pressing surface 33a.

Upon completion of such an operation, the upper and lower cylinders 48 and the forward / backward drive cylinder 45 are operated, so that the tape 44 is separated from the pressing surface 33a and returned to the original position shown in FIG.

Next, the cooling mechanism 28 will be described. As shown in FIGS. 1 and 2, the cooling mechanism 28 has a cooling airflow passage 56 provided below the cleaning mechanism 27 along the X direction. The cooling air flow passage 56 is connected to a cooling air supply source (not shown) so that the cooling air flows inside.

On the side surface of the cooling airflow passage 56,
A nozzle 57 is provided for blowing the cooling air in the flow passage 56 onto the TAB component 2 which is pressure-bonded to the liquid crystal cell 1.

In this cooling mechanism 28, the heat of the pressurizing tip 33 during thermocompression bonding of the TAB component is changed to another TA
This is to prevent the B part 2 from being affected. Therefore, the nozzle 57 is provided at a position sandwiching the crimp blocks 35 as shown in FIGS. 1 and 6.

In the cooling mechanism 28, the pressurizing and heating mechanism 26 is operated so that the predetermined TAB component 2 operates in the liquid crystal cell 1.
When the TAB component 2 is pressed against the TAB component 2 as shown in FIGS. 5 and 6, the cooling air is blown from the nozzle 57 to the TAB component 2 that is temporarily pressure-bonded to a position adjacent to the pressed TAB component 2. It has become.

This main pressure bonding device (liquid crystal panel manufacturing device)
Has a configuration as described above. Next, a series of main pressure bonding operations by this device will be described. In this apparatus, the parallelism between the pressing surface 33a of the pressing tip 33 and the backup surface 40a of the bonding stage 40 is adjusted before performing the main pressure bonding operation. First, this operation will be described.

The parallelism is measured using pressure sensitive paper. That is, a pressure sensitive paper is placed on the backup surface 40a of the bonding stage 40, and the pressing surface 33a of the pressure tip 33 is pressed against the pressure sensitive paper.

At this time, the heater 39 is operated. This is because the inclination of the pressing surface 33a may be caused not only by a mechanical error but also by the thermal deformation of the pressure bonding block 35.

This pressure-sensitive paper may be one that is generally used, and the portion that is strongly pressed is displayed in dark red. The operator changes the inclination of the pressing surface 33a of the pressing tip 33 by operating the control unit 42 and operating the laminated piezoelectric actuator 36 based on the detection result of the pressure sensitive paper.

Each of the laminated piezoelectric actuators 36 has
When a voltage is applied in accordance with a command from the controller 42, the voltage expands and contracts in the Z direction. By controlling the value of the applied voltage for each actuator 36, the pressing tip 33 is pressed. The inclination of the surface 33a can be changed in any direction.

For example, by applying different voltages to the laminated piezoelectric actuators 36 adjacent in the Y direction, Z
The tilt in the Y plane can be changed. Further, the inclination in the XZ plane can be changed by making the applied voltage different between the laminated piezoelectric actuators 36 adjacent in the X direction. And XY
By changing the applied voltage between the laminated piezoelectric actuators 36 adjacent to each other in the direction, the inclinations in the ZY plane and the XZ plane can be simultaneously corrected, and the inclination of the pressing surface 33a can be changed in the three-dimensional direction.

In this embodiment, two crimping blocks 35 are provided, but the inclination of the pressing surface 33a of the pressing tip 33 is corrected for each crimping block 35.

If the inclination of the pressing surface 33a of the pressing tip 33 is corrected in this way, this device
The main pressure bonding operation of the TAB component temporarily pressure bonded to the liquid crystal cell 1 is performed.

First, the liquid crystal cell 1 in which the above-mentioned TAB components are temporarily pressure-bonded is supplied from a temporary pressure-bonding device for temporarily pressure-bonding the TAB components. The cell stage 16 receives the liquid crystal cell 1 from the temporary pressure bonding device and conveys the liquid crystal cell 1 to a position facing the bonding mechanism 17.

In the bonding mechanism 17, first, the TAB components 2 that have been temporarily pressure-bonded to the first glass substrate 1a are permanently pressure-bonded. To this end, the cell stage 1
The portion of one side of the first glass substrate 1a of the liquid crystal cell 1 held in FIG. 6 where the TAB component 2 is temporarily pressure-bonded is the backup surface 40a of the bonding stage 40 and the pressure chip 33 ( Crimp block 35)
Insert between and.

Then, by operating the pressurizing and heating mechanism 26, as shown in FIGS. 5 and 6, two TABs are formed.
Two TAB parts 2 located with the part 2 sandwiched therebetween are simultaneously main-press bonded. This main pressure bonding is performed with respect to the TAB component 2 described above.
This is performed by pressing the pressing surface 33a of the pressure tip 33 for a predetermined time.

At this time, the cooling mechanism 28 is operated to heat and press the TAB as shown in FIG.
This is performed while cooling the TAB component 2 that has been temporarily pressure-bonded to a position adjacent to the component 2.

When the crimping of the two TAB parts 2 is completed, the pressurizing and heating mechanism 26 is operated by the pressurizing and heating block 26.
Raise 5 Then, the cell stage 16 transfers the liquid crystal cell 1 (first glass substrate 1 a) to the TAB component 1.
Moved in the X direction by the number of pieces and not yet fully crimped 2
The individual TAB components 2 are positioned between the pressure chip 33 and the bonding stage 40.

Then, by the same operation as described above, the two TAB components 2 are finally pressure-bonded. The main pressure bonding is also performed while cooling the TAB component 2 adjacent to the TAB component 2.

The main press-bonding apparatus repeats the above-described operation to perform the main press-bonding of all the TAB components 2 which are temporarily press-bonded to one side of the first glass substrate 1a. When the main pressure bonding to one side of the first glass substrate 1a is completed, the cell stage 16 rotates the first glass substrate 1a by 180 ° in the horizontal direction, and the other side of the first glass substrate is set to the above. It faces the bonding mechanism 17 (pressurizing and heating mechanism 26).

Then, by the same operation as described above, the TAB component 2 that has been temporarily pressure-bonded to the other side of the first glass substrate 1a is finally pressure-bonded. This first glass substrate 1a
When the main pressure bonding of all of the TAB components 2 temporarily pressure bonded is completed, the liquid crystal cell is turned over by the above-described inversion mechanism (not shown). Then, one side of the second glass substrate 1b of the liquid crystal cell 1 on which the TAB component 2 is temporarily pressure-bonded is opposed to the bonding mechanism 17 (pressurizing and heating mechanism 26), and the TAB temporarily pressure-bonded on this side. The main crimping of the component 2 is performed by the same operation as described above.

As a result, the first and second liquid crystal cells 1 are
All the TABs that have been temporarily pressure-bonded to the glass substrates 1a and 1b of
The main pressure bonding of the component 2 is completed. The liquid crystal cell 1 to which the TAB component 2 has been fully pressure-bonded is transported to the next step, and liquid crystal is injected into the liquid crystal cell to complete a liquid crystal panel.

The liquid crystal cell 1 in which the TAB component 2 is temporarily pressure-bonded is sequentially supplied from the temporary pressure-bonding device to the final pressure-bonding device. This main pressure bonding apparatus repeats the above-described main pressure bonding operation every time the liquid crystal cell 1 is supplied. As a result, the liquid crystal panels described above have been mass-produced.

On the other hand, when such a main press-bonding operation is repeated, the pressing surface 33a of the pressing tip 33 is gradually soiled with deposits of the anisotropic conductive adhesive 6 such as dust. come.

The contamination of the pressing surface 33a adversely affects the parallelism between the pressing surface 33a of the pressing tip 33 and the backup surface 40a of the bonding stage 40 as described above. In this apparatus, the pressing surface 33a of the pressing tip 33 is cleaned by operating the cleaning mechanism 27 every predetermined number of times of bonding. In addition,
The predetermined number of times of bonding can be set to a desired value based on experience.

As described above, this cleaning is carried out by bringing the adhesive surface of the tape 44 into sliding contact with the pressing surface 33a of the pressing tip 33. Since this operation has been described above,
The description here is omitted.

If such washing is performed,
This main pressure bonding apparatus restarts the above-mentioned main pressure bonding operation. next,
The effects of the present invention will be described.

That is, according to the above-mentioned configuration, the pressing surface 33a of the pressing tip 33 and the bonding stage 4 are connected.
It is possible to maintain good parallelism with the backup surface 40a of 0.

That is, a plurality of laminated piezoelectric actuators 36 are provided in the crimping block 35 in a matrix form in the XY directions, and these are individually controlled so that the pressing surface 33a of the pressing tip 33 can be tilted in any direction. Can be adjusted.

Further, by regularly cleaning the pressing surface 33a of the pressing tip 33 using the cleaning mechanism 27, the anisotropic conductive film 6 adhered to the pressing surface 33a, such as dust, is removed. Can be satisfactorily removed. Therefore, it is possible to effectively prevent unevenness from occurring on the pressing surface 33a.

With these features, the TAB component 2 can be pressed uniformly, so that the anisotropic conductive film 6 can be pressed.
Can be crushed well. This has the effect that the outer lead 7 of the TAB component 2 and the wiring pattern (not shown) of the first and second glass substrates 1a and 1b can be satisfactorily connected.

Further, the pressing surface 33a of the pressing tip 33 is
And the backup surface 40 of the bonding stage 40
When the parallelism with a is poor and the pressing surface 33a is in a one-sided contact state, when the TAB part 2 is heated, the film carrier of the TAB part 2 moves in a direction in which the pressing force is weak. It may expand toward the heat. As a result, the outer leads 7 formed on the film carrier 4 and the wiring patterns formed on the glass substrates 1a and 1b may be misaligned.

However, according to the present invention, since the TAB component 2 can be pressed uniformly, the elongation of the film carrier 4 of the TAB component 2 can be effectively prevented, and the shift between the outer lead 7 and the wiring pattern can be prevented. There is an effect that can be effectively prevented.

[0103] Further, when pressure heating is performed, the TAB component 2 adjacent to the TAB component 2 being pressure heated.
However, the heat may be conducted and the carrier tape 4 of the adjacent TAB component 2 may be thermally expanded.

As a result, it is conceivable that a positional deviation will occur between the outer leads 7 and the wiring patterns provided on the first and second glass substrates 1a and 1b before the main pressure bonding.

However, in the present invention, since the bonding mechanism 17 is provided with the cooling mechanism 28 for cooling the TAB component 2 adjacent to the TAB component 1 that is performing the main pressure bonding,
It is possible to effectively prevent the heat of the pressure tip 33 from affecting the adjacent TAB component 2.

The present invention is not limited to the above-mentioned embodiment, but can be variously modified without changing the gist of the invention. For example, in the above-described one embodiment, as the device for crimping the component to the mounting substrate, the main crimping device of the liquid crystal panel manufacturing device has been described, but the device is not limited to this, and may be a device for performing other similar work. You may make it apply.

Further, in the above-mentioned one embodiment, the pressure tip 33 is a constant heat type pressure tip which is always kept at a constant temperature regardless of the vertical movement thereof, but the present invention is not limited to this. Instead of the TAB part 2 above
It may be a pulse heat type pressure tip 33 that generates heat by energization only when is pressed.

[0108]

According to the configuration of the present invention described above, the inclination of the pressing surface of the crimping block can be favorably maintained. That is, by providing a plurality of actuators for adjusting the inclination of the pressing surface in the pressure bonding block, the inclination of the pressing surface can be adjusted three-dimensionally. Therefore, this pressing surface, the substrate, and the liquid crystal driving IC
It is possible to maintain good parallelism with the crimped part.

Further, by cleaning the pressing surface by using the cleaning mechanism, it is possible to satisfactorily remove the adhering matter such as the residue of the bonding material adhered to the pressing surface. Therefore,
It is possible to effectively prevent unevenness from occurring on the pressing surface.

With these, the TAB component can be pressed uniformly, and the IC and the substrate can be satisfactorily pressure-bonded. Further, according to the present invention, since the IC can be pressed uniformly, the thermal expansion of the IC can be effectively prevented.

Further, in the present invention, since the main pressure bonding mechanism is provided with the cooling means for cooling the adjacent IC, it is possible to effectively prevent the adjacent IC from being affected by heat from the pressure bonding block. This allows adjacent ICs
It also has an effect of effectively preventing thermal expansion.

[Brief description of drawings]

FIG. 1 is a schematic front view showing an embodiment of the present invention.

FIG. 2 is a schematic side view of the same.

FIG. 3 is a longitudinal sectional view showing a crimping block in an enlarged manner.

FIG. 4 is a perspective view of the crimp block.

FIG. 5 is a schematic side view showing a crimping process.

FIG. 6 is a perspective view showing a crimping process.

FIG. 7 is a front view showing a cleaning process.

FIG. 8 is a side view showing a cleaning process.

FIG. 9 is likewise a perspective view showing a liquid crystal panel.

FIG. 10 is an enlarged perspective view of a TAB component.

FIG. 11 is a perspective view showing a conventional full pressure bonding apparatus.

[Explanation of symbols]

1 ... Liquid crystal cell, 1a ... 1st glass substrate (substrate, mounting substrate), 1b ... 2nd glass substrate (substrate, mounting substrate), 2 ... TAB component (liquid crystal drive IC, component) 17 ...
Bonding mechanism (main pressure bonding mechanism), 27 ... Washing mechanism (cleaning mechanism, tape driving mechanism), 28 ... Cooling mechanism (cooling means), 29 ... First cylinder (driving means), 3
3a ... Pressing surface, 35 ... Pressure bonding block, 36 ... Laminated piezoelectric actuator (actuator), 39 ... Heating heater (heating means), 44 ... Tape. N.

Claims (9)

[Claims] 1. A manufacturing apparatus for a liquid crystal panel, comprising: a main pressure-bonding mechanism for permanently pressure-bonding a liquid crystal driving IC, which is temporarily pressure-bonded to a substrate forming a liquid crystal cell, to the substrate. A pressure-bonding block having a pressing surface for pressing the IC onto the substrate via a bonding material, a heating means for raising the pressure-bonding block to a predetermined pressure-bonding temperature, and driving the pressure-bonding block to drive the liquid crystal with the pressing surface. Driving means for thermocompression-bonding the liquid crystal driving IC to the substrate by pressing the IC, an actuator provided in the pressure-bonding block for adjusting the inclination of the pressing surface by operating the IC, and the pressure-bonding block Cooling means for cooling the IC that has been temporarily pressure-bonded to a position adjacent to the pressure-bonded IC, and the pressure-bonding block provided near the pressure-bonding block. Based on the pressing surface it becomes soiled by deposits of bonding material, liquid crystal panel manufacturing apparatus characterized by comprising a cleaning mechanism for removing the pressing surface cleaning deposits the bonding material. 2. A liquid crystal panel manufacturing apparatus comprising a main pressure bonding mechanism for main pressure bonding a liquid crystal driving IC temporarily pressure bonded to a substrate constituting a liquid crystal cell, wherein the main pressure bonding mechanism is the liquid crystal driving IC. And a liquid crystal driving IC is pressed against the substrate by pressing the liquid crystal driving IC against the pressure bonding block by pressing the liquid crystal driving IC against the substrate through a bonding material. An apparatus for manufacturing a liquid crystal panel, comprising: a driving unit; and an actuator, which is provided in the pressure-bonding block and adjusts the inclination of the pressing surface by operating the liquid crystal panel. 3. The liquid crystal panel manufacturing apparatus according to claim 1 or 2, wherein a plurality of the actuators are arranged in a direction substantially parallel to the pressing surface and are energized to individually A liquid crystal panel manufacturing apparatus, which is a piezoelectric actuator that expands and contracts in a direction substantially orthogonal to a pressing surface and controls the inclination of the pressing surface. 4. A liquid crystal panel manufacturing apparatus comprising a main pressure-bonding mechanism for main pressure-bonding a liquid crystal driving IC, which is temporarily pressure-bonded to a substrate forming a liquid crystal cell, to the substrate, wherein the main pressure-bonding mechanism is the liquid crystal driving IC. A pressure-bonding block having a pressing surface that presses the bonding material onto the substrate via a bonding material, heating means for raising the pressure-bonding block to a predetermined pressure-bonding temperature, and driving the pressure-bonding block so that the liquid crystal driving IC Pressing means for driving the liquid crystal driving IC by thermocompression bonding to the substrate, and cooling means for cooling the IC that is temporarily pressure bonded at a position adjacent to the IC that is permanently pressure bonded by the pressure bonding block. An apparatus for manufacturing a liquid crystal panel, comprising: 5. The liquid crystal panel manufacturing apparatus according to claim 1 or 4, wherein the cooling means blows a cooling air to the adjacent ICs so that the I
A liquid crystal panel manufacturing apparatus having a cooling air blowing nozzle for cooling C. 6. A liquid crystal panel manufacturing apparatus comprising a main pressure-bonding mechanism for main pressure-bonding a liquid crystal drive IC, which is temporarily pressure-bonded to a substrate forming a liquid crystal cell, to the substrate, wherein the main pressure-bonding mechanism is the liquid crystal drive IC. A pressure-bonding block having a pressing surface that presses the bonding material onto the substrate via a bonding material, heating means for raising the pressure-bonding block to a predetermined pressure-bonding temperature, and driving the pressure-bonding block so that the liquid crystal driving IC The driving means for thermocompression bonding the liquid crystal driving IC to the substrate by pressing is provided in the vicinity of the pressure bonding block, and the pressing surface of the pressure bonding block is contaminated with the adhering material of the bonding material. A liquid crystal panel manufacturing apparatus, comprising: a cleaning mechanism that cleans a pressing surface to remove deposits of the bonding material. 7. The liquid crystal panel manufacturing apparatus according to claim 1 or 6, wherein the cleaning mechanism drives a tape and presses the adhesive surface of the tape against the pressing surface to remove the adhered matter. A liquid crystal panel manufacturing apparatus having an adhesive tape drive mechanism. 8. A crimping device for crimping a component to a substrate, the crimping block having a pressing surface for pushing the component to the substrate, and driving the crimping block to press the component on the pressing surface, A crimping device comprising: a drive unit for crimping a component to the substrate; and an actuator provided on the crimping block and operating to adjust the inclination of the pressing surface. 9. The crimping device according to claim 8, wherein a plurality of the actuators are arranged in a direction substantially parallel to the pressing surface, and each actuator is individually energized in a direction substantially orthogonal to the pressing surface. A crimping device which is capable of controlling the inclination of the pressing surface by expanding and contracting.