JP3249177B2 - Bonding apparatus, bonding method, and liquid crystal panel manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for mounting a liquid crystal driving IC as a TAB component on a liquid crystal glass substrate via an anisotropic conductive film.

[0002]

2. Description of the Related Art In a manufacturing process of a liquid crystal panel, as shown in FIG. 5, a liquid crystal driving IC 2 (hereinafter, referred to as "IC") is mounted around a liquid crystal glass substrate 1 (hereinafter, referred to as "glass substrate"). . Generally, the liquid crystal drive IC is TAB
(Tape Automated Bonding) A component is mounted to connect the lead protruding from the film carrier of the IC 2 to the wiring pattern of the liquid crystal glass substrate 1.

As this connection method, a bonding method using an anisotropic conductive film (anisotropic conductive adhesive) has been widely adopted. The anisotropic conductive film is roughly classified into a thermosetting type and a thermoplastic type according to its characteristics. In both cases, the lead of the IC 2 and the glass substrate 1 are interposed via the anisotropic conductive film.
After the wiring pattern is positioned and temporarily fixed, as shown in FIG. 6, the lead is pressed against the wiring pattern using a crimping block 3 and heated to join the two. is there.

Conventionally, the crimping block 3 employs either a constant heat method (constant heating method) or a pulse heat method (instantaneous heating method). The crimping block 3 is driven up and down by an air cylinder 4 to press the IC 2 against the glass substrate 1 at a predetermined bonding pressure P, thereby bonding the IC 2 to the glass substrate 1.

[0005]

The conventional bonding apparatus has the following disadvantages.

That is, first, when the IC 2 is pressed on the glass substrate 1 via the anisotropic conductive film, the carrier tape of the IC 2 expands due to the heating by the pressing block 3, and the pre-aligned glass is formed. Second, it is difficult to maintain the accuracy such as the parallelism and flatness of the pressing surface of the pressure bonding block 3 because a positional shift occurs between the wiring pattern of the substrate 1 and the lead of the IC 2. It is to be.

When a pulse heat method is used as the heating method of the pressure bonding block 3, the elongation of the film carrier can be suppressed by starting the energization heating after the completion of the pressurization. However, in the pulse heat method, there is a limit to the length (size) of the pressing surface of the pressure bonding block 3 from which a uniform temperature distribution, strength, and accuracy can be obtained due to its properties. For this reason, the liquid crystal driving IC 2 which is a relatively large TAB component is used.
Is not suitable for bonding. Further, the pulse heat type crimping block 3 has a shortcoming in that the life thereof is short, so that a maintenance cost is required. On the other hand, when the constant heat method is employed, the rigidity is higher and the life is longer as compared with the pulse heat method.

However, as shown in FIG. 6, in an apparatus having one crimping block 3 containing a heater and one air cylinder 4 for driving the crimping block up and down, the film carrier before pressurization is completed is not used. Crimp block 3 to control elongation
The only way to do this is to set the falling speed faster. However, if the descending speed of the crimping block 3 is set earlier, the impact when the crimping block 3 comes into contact with the IC 2 is large, and the IC 2 and the glass substrate 1 may be damaged.

On the other hand, when a high-pressure cylinder that generates a pressure higher than the bonding pressure is used as the air cylinder 4, the lead can be pressed strongly from the initial state, but the pressure is higher than the bonding pressure P. Therefore, there is a problem that the IC 2 and the glass substrate 1 are damaged.

When a liquid crystal panel having a relatively short side is manufactured as shown in FIG. 6, bonding may be carried out collectively by using one crimping block 3.
In the case of manufacturing a relatively large liquid crystal panel provided with 2 ..., there is a problem in accuracy as in the above-described pulse heat type.

Therefore, when bonding a large number of ICs 2, as shown in FIG. 7, the length of the pressing surface of the pressing block 3 is shortened and a plurality of ICs 2 are provided. However, as shown in FIG. 5, when the mounting intervals of the ICs 2 to be mounted are narrow, there is a problem that the adjacent crimping blocks 3 and 3 interfere with each other and it is difficult to arrange the crimping blocks 3.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and has as its object to provide a bonding apparatus which does not damage a glass substrate or a TAB component and can perform good and accurate bonding. Things.

[0013]

[Means for solving the problems ]
In order to achieve the bonding device of the present invention,
The liquid crystal panel manufacturing method and the liquid crystal panel manufacturing method are configured as follows.
Have been. (1) Crimping block for applying pressure to the members to be joined
A first drive shaft for holding the crimp block,
Connected to the first drive shaft and fronted by said crimp block
When the pressure applied to the workpiece exceeds a specified value
Presses the crimp block by the first drive shaft.
Operable to set the pressure to be close to the predetermined value.
Low pressure cylinder to which the provided relief valve is connected
A second drive shaft for holding the low-pressure cylinder;
The low pressure cylinder is moved to the predetermined position by the second drive shaft.
High-pressure series that can be pressed by pressure exceeding
And a solder. (2) The bonding apparatus described in (1) above.
In the low pressure cylinder, the crimping block presses the
Hand that can increase internal pressure without applying force
The stages are connectable. (3) The bonding apparatus described in (1) above.
The low-pressure cylinder is composed of an air cylinder.
A pump for supplying air to the cylinder is provided so that it can be connected.
Characterized by a low pressure cylinder. (4) The bonding apparatus described in (1) above.
To the multiple crimp blocks and the multiple crimp blocks
Multiple low pressure cylinders
At the same time, the low-pressure cylinder is fixed with the axes parallel.
A second drive shaft to be provided.

(5) The crimping block connected to the crimping block
The pressure applied to the workpiece by the lock exceeds the specified value
Operable to keep the pressure near the predetermined value
For the cylinder to which the provided relief valve is connected
And by continuously applying pressure exceeding the predetermined value.
Pressure is applied to the member to be joined by the crimping block.
And a bonding step. (6) The bonding apparatus described in (1) above
Bonding method using low pressure
The first step of increasing the internal pressure of the cylinder for
Drives the ascending low-pressure cylinder using the second drive shaft
And apply pressure to the members to be joined with a crimping block.
In this state, the second drive shaft is connected to the high-pressure shell.
And a step of continuing to press with the Linda.
Features. (7) With a crimping block, T
By pressing the AB component, the lead of the TAB component is
Joints between the board and the wiring pattern of the liquid crystal glass substrate
Of a liquid crystal panel having a joining step of joining via materials
In the method, the joining step includes connecting with the crimp block.
Tied and added to the lead by the crimp block
If the pressure exceeds a predetermined value, the pressure near the predetermined value and
The relief valve operably provided is connected
Pressure above the specified value
By continuing, by the crimping block,
It is a joining process that applies pressure to the joining members
You.

[0015]

According to this structure, it is possible to provide a bonding apparatus which can perform good bonding with less damage to the electronic components and the pressure bonding block.

[0016]

An embodiment of the present invention will be described below with reference to the drawings. Note that the same components as those in the conventional example are denoted by the same reference numerals, and description thereof will be omitted. First, a first embodiment will be described.

In the drawing, reference numeral 9 denotes a mounting table. The mounting table 9 holds the liquid crystal glass substrate 1 on the upper surface of which a plurality of liquid crystal driving ICs 2 are temporarily fixed by an anisotropic conductive film (5 shown in FIGS. 3 and 4) as a bonding material. . The mounting table 9 is held by XYθ driving means 10,
Pitch feed driving is performed in a direction indicated by an arrow (a) in the figure.

A column 11 of the bonding apparatus is provided upright on the side of the mounting table 9 described above. A first drive source 12 is mounted on one surface of the column 11 on the table 9 side. This first drive source 12
A casing 13, a first high-pressure air cylinder 14 (high-pressure cylinder) provided on the upper surface of the casing 13, and one surface of the casing 13 on the side of the mounting table 9. A slider 15 slidably provided and driven up and down by the first air cylinder 14.

The slider 15 has a holding plate 15a projecting substantially horizontally. The holding plate 15a has three second cylinders 17 for low pressure.
(Low pressure cylinder) are fixed in parallel with the axis vertical. A drive shaft (not shown) of the second cylinder 17 extends below the holding plate portion 15a, and a crimp block 18 is provided on the drive shaft.

The pressure bonding block 18 is of a constant heat type (constant heating type) and has a pressing surface 18a corresponding to the bonding width of one IC 2. The crimping blocks 18 are provided apart from each other at intervals corresponding to the length of one IC 2. Next, the operation of this bonding apparatus will be described with reference to FIG. FIG. 3 is a schematic view showing a simplified relationship between the first and second cylinders 14 and 17 and the pressure bonding block 18 of the bonding apparatus.

That is, the first air cylinder 14 is fixed to the column 11, and a second cylinder 17 is attached to a drive shaft 14a of the first air cylinder 14. Therefore, when the first air cylinder 14 operates, the entire second cylinder 17 is vertically driven. The drive shaft 17a of the second air cylinder 17 is provided with a pressure bonding block 18.

The first cylinder 14 is connected to a high-pressure pump 20 via a closed center type four-port valve 19. The high-pressure pump 20 is connected to the first cylinder 1
4 has a role of driving the drive shaft 14a at a maximum pressure F larger than the bonding pressure P.

The second cylinder 17 is connected to a low-pressure pump 21 for driving a drive shaft 17a of the second cylinder 17 at a maximum pressure P (F> P), and a relief valve 22 is connected to this circuit. Have been. The relief valve 22 is connected to the second
When the pressure in the second cylinder 17 becomes P or more, it operates to keep the pressure in the second cylinder 17 always at P. Next, referring to FIG. 4, the first and second cylinders 1 will be described.
4, 17 and the operation of the crimping block 18 will be described.

FIG. 2A is the same as the state shown in FIG. 2 before the operation. In this state, the four-port valve 19 operates to operate the first air cylinder 14, thereby driving the second cylinder 14 and the crimping block 18 downward. At this time, the descending speed of the pressure bonding block 18 is set to a value that does not give an impact to the IC 2 or the glass substrate 1. At this time, the pressure in the second cylinder 17 is already maintained at the pressure P.

Next, as shown in FIG. 2B, when the pressing surface 18a of the crimping block 18 comes into contact with the IC2,
The pressing force is increased by the first cylinder 17. When the pressing force reaches P, the drive shaft 14a of the second cylinder 14 is driven in the compression direction.
Since the air escapes from 2, the pressing force of the crimping block 18 does not rise above P.

As shown in FIGS. 3 (c) and (d), the first cylinder 17 is further lowered to drive the second air cylinder 14 downward. During this time, the relief valve 22 is used.
Is operated, the leads of the IC 2 are pressed with a pressure P against the wiring pattern of the glass substrate 1 via the anisotropic conductive film. Thus, the IC 2 is mounted on the glass substrate 1.

Next, the 4-port valve 19 is switched,
The crimp block 18 is raised. And the above XY
The above-mentioned table 9 is driven by operating the .theta.
IC2, which has not yet been bonded, is driven and driven by the IC pitch so as to face and be positioned below the pressure bonding block 18. Then, the pressure bonding block 18 is driven by the same operation as described above, and the IC 2 is bonded to the glass substrate 1.

According to such a configuration, since the first cylinder 14 is a high pressure cylinder, the pressure cylinder 1
The pressing force of the crimping block 18 instantaneously reaches the predetermined pressure P even if the pressure 8 is lowered slowly. Thereafter, when the relief valve 19 is operated, the pressing force of the crimping block 17 is always maintained at P, so that the IC 2 is not pressed at a pressure higher than P.

Thus, the pressing force can be instantaneously increased without giving an impact to the IC 2, so that the expansion of the TAB component due to heat can be effectively suppressed. Further, since it is possible to prevent the IC 2 from being shocked or pressed with a large pressure, the IC 2 is hardly damaged.

On the other hand, in the bonding apparatus, the ICs 2 arranged in parallel are bonded separately twice, so that even if the intervals between the ICs 2 are narrow, the ICs 2 can be effectively and accurately separated. Bonding is possible. The present invention is not limited to the above-described embodiment, and can be variously modified without changing the gist of the invention. For example, in the above embodiment, three crimping blocks are provided in parallel. However, when a relatively small liquid crystal panel is manufactured, one crimping block may be used.

Even in this case, as shown in FIG. 2, one crimping block 18 'is provided with the first and second cylinders 14, 1
7 and operates in the same manner as described above, so that the ICs 2 can be effectively bonded to the glass substrate 1.

In the above-described embodiment, the bonding device is a device for bonding the IC 2 to the glass substrate 1. However, the bonding device is not limited to the bonding device. It may be a device.

Further, in the above embodiment, the lead of the TAB component (IC2) and the wiring pattern of the wiring substrate (glass substrate 1) are joined via an anisotropic conductive film. However, the present invention is not limited to this, and the joining may be performed using a solder material or the like as the joining material.

[0034]

As described above, the first configuration of the bonding apparatus according to the present invention is such that TAB is added to the wiring pattern of the substrate.
A crimping block for bonding parts through a bonding material, a low-pressure cylinder for holding the crimping block and pressing the crimping block at a predetermined bonding pressure or less;
The low pressure cylinder is provided with a high pressure cylinder which can be driven up and down at a pressure higher than the bonding pressure.

According to the first configuration, the displacement of the TAB component due to the expansion of the tape can be prevented without damaging the TAB component or the substrate, and thus there is an effect that the bonding can be performed more accurately. .

In the second configuration, a plurality of TABs are provided on a substrate.
What is claimed is: 1. A bonding apparatus for bonding components, comprising: a pressing block having a pressing surface corresponding to a bonding width of at least one TAB component; and moving the pressing block and the substrate relative to each other to change the pressing surface of the pressing block. Drive means for sequentially facing TAB parts which have not yet been bonded. According to the second configuration, there is an effect that good bonding can be performed even when the arrangement interval of TAB components to be bonded is narrow.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a main part of the present invention.

FIG. 2 is also a perspective view.

FIG. 3 is also a schematic diagram.

FIGS. 4A to 4D are process diagrams showing a bonding operation.

FIG. 5 is a perspective view showing a general liquid crystal panel.

FIG. 6 is a perspective view showing a conventional example.

FIG. 7 is a perspective view of the same.

[Explanation of symbols]

1: glass substrate (substrate) 2: liquid crystal drive IC (TAB
Parts), 5: anisotropic conductive film (joining material), 10: XYθ driving means (driving means), 14: first air cylinder (high pressure cylinder), 17: second air cylinder (low pressure cylinder) , 18 ... Crimping block, 18a ... Pressing surface.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-70816 (JP, A) JP-A-5-290944 (JP, A) JP-A-5-234656 (JP, A) 147369 (JP, A) JP-A-53-51966 (JP, A) JP-A-2-239639 (JP, A) JP-A-1-109388 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G02F 1/1345 G02F 1/13 101 H01L 21/60-21/607

Claims (7)

(57) [Claims] 1. A pressure bonding blower for applying pressure to a member to be joined.
A first drive shaft for holding the crimp block, the first drive shaft being connected to the first drive shaft, and being connected to the first drive shaft by the crimp block.
When the pressure applied to the member to be joined exceeds a predetermined value.
In this case, the crimp block is moved by the first drive shaft.
Operable to set the pressing pressure to a pressure near the predetermined value
Low pressure series connected to a relief valve
And a second drive shaft for holding the low-pressure cylinder, and the second drive shaft holding the low-pressure cylinder at a predetermined position.
A high-pressure screen that can be pressed by pressure exceeding a certain value
Bonding apparatus characterized by comprising a cylinder, a. 2. The low pressure cylinder has a crimping block to be joined.
It is possible to increase internal pressure without applying pressure to members
2. A method according to claim 1, wherein said means are connectable.
3. The bonding apparatus according to claim 1. 3. The low pressure cylinder comprises an air cylinder.
And a pump to supply air to this air cylinder can be connected.
It is a low-pressure cylinder provided for Noh
The bonding apparatus according to claim 1. 4. A plurality of crimp blocks and a plurality of crimp blocks.
Multiple low-pressure cylinders, each corresponding to a lock
And the low-pressure cylinders have their axes parallel to each other.
And a second drive shaft fixed to the drive shaft.
The bonding apparatus according to claim 1. 5. A crimp block connected to a crimp block.
When the pressure applied to the workpiece exceeds
Is operably provided to have a pressure near the predetermined value.
To the cylinder to which the relief valve is connected
By continuously applying pressure exceeding the specified value ,
A contact that applies pressure to the member to be joined by the crimping block
A bonding method, comprising:
Law. 6. A bonding apparatus according to claim 1,
A bonding method for performing bonding, wherein a first step of increasing the internal pressure of a low-pressure cylinder and a low-pressure cylinder having an increased internal pressure are performed using a second drive shaft.
And pressure is applied to the workpiece by the crimping block.
In this state, the second drive shaft is
And a step of continuously pressing with a high-pressure cylinder . 7. A predetermined bonding pressure by a pressure bonding block.
By pressing the TAB component with force, the TAB component
Lead and the wiring pattern of the glass substrate for liquid crystal
Liquid crystal panel having a joining step of joining via a joining member
In the manufacturing method, the bonding step is performed by connecting the pressure bonding block to the pressure bonding block.
The pressure applied to the lead by the block
If it exceeds, the operation can be performed so that the pressure is close to the specified value.
To the cylinder connected to the relief valve
On the other hand, the pressure exceeding the predetermined value is continuously applied.
Therefore, pressure is applied to the member to be joined by the crimp block.
Liquid crystal panel characterized by the joining step of adding
Manufacturing method.