JP3246282B2 - Display panel module manufacturing apparatus and display panel module manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display panel module manufacturing apparatus and a display panel module manufacturing method in which a plurality of electronic components bonded to an edge of a display panel are connected to electrodes of a circuit board.

[0002]

2. Description of the Related Art In recent years, display panels such as liquid crystal panels have been widely used as display devices for electronic equipment. FIG.
4 is a display panel module 100 incorporated in the electronic device.
It is a perspective view of. Reference numeral 105 denotes a display panel on which a liquid crystal display unit is formed, and one end of electronic components 106 and 107 for driving the display panel is bonded to a peripheral portion thereof. A circuit board 116 on which a control circuit is formed is soldered to the other ends of the electronic components 106 and 107.

[0003]

SUMMARY OF THE INVENTION Electronic components 106 and 10
7 is automatically bonded to the display panel 105 by the outer lead bonding apparatus, but the electronic components 106 and 107 and the circuit boards 116 and 117 are bonded.
Has been performed almost manually, and has a problem that the productivity of the display panel module is low.

In addition, since the flux used at the time of soldering must be cleaned, there is a problem that the number of working steps increases and the cost increases.

SUMMARY OF THE INVENTION The present invention provides a display panel module manufacturing apparatus and a display panel module manufacturing method capable of automatically connecting a circuit board and an electronic component without using solder. Aim.

[0006]

According to the present invention, there is provided a display panel module manufacturing apparatus, comprising: a main substrate holding table for holding a display panel having a plurality of electronic components bonded to an edge;
A sub-board holding table for holding a circuit board having electrodes to which an anisotropic conductor is attached in advance; and a main board holding table and a sub-board holding table for aligning the leads of the electronic components and the electrodes of the circuit board. And a crimping head for crimping the leads of the electronic component to the electrodes of the circuit board.

In the method of manufacturing a display panel module according to the present invention, a step of holding a display panel having a plurality of electronic components bonded to an edge portion on a main board holding table;
A step of holding a circuit board having electrodes to which an anisotropic conductor is pasted on an upper surface in advance on a sub-substrate holding table; and moving the seed substrate holding table and the sub-substrate holding table relatively to each other, The method includes the steps of aligning the leads with the electrodes of the circuit board, and thermocompression bonding the leads of the electronic component to the electrodes of the circuit board via the anisotropic conductor.

[0008]

According to the above structure, a display panel having a plurality of electronic components mounted on an edge is held on a main board holding table.
Further, a circuit board provided with an electrode having an anisotropic conductor adhered to the upper surface in advance is held on the sub-board holding table.

By moving the main board holding table and the sub board holding table relative to each other, the leads of the electronic parts are aligned with the electrodes of the circuit board, and the leads of the electronic parts are moved by the thermocompression bonding head. It is crimped to the electrode.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an external perspective view of an apparatus for manufacturing a display panel module according to an embodiment of the present invention. As shown in FIG. 1, the apparatus for manufacturing a display panel module according to the present embodiment can be roughly divided into a main body 1 and a circuit board supply section 2. The circuit board supply unit 2 will be described later with reference to FIG.

In the main body 1, 3 is a base, 4 is a base 3
The main panel mounting table is disposed on the upstream side in the X direction. The main panel mounting table 4 is supplied with the display panel 5 having the electronic components 6 bonded to the edges of the display panel 5. . Reference numeral 7 denotes a transfer arm movement axis provided in the X direction over the main substrate mounting table 4 and the upper part of the base 3;
The transfer arm moving shaft 7 is provided with transfer arms 10 and 11 having suction pads 8 and 9 respectively. The display panel 5 supplied onto the main substrate mounting table 4 is transferred onto the base 3 by the transfer arm 10.

On the upper part of the base 3, the following members are provided. In FIG. 2, 12 is a Y table for swinging two motors, a first Y motor 13 on the front side and a second Y motor 14 on the back side, 15 is a first X table moved in the Y direction by the first Y motor 13, and 17 is a circuit board A sub-substrate holding table that holds the upper substrate 16 and moves in the Y direction when the second Y motor 14 is driven. Reference numeral 17L denotes an elevation drive unit that moves the sub-substrate holding table 17 up and down.

Reference numeral 18 denotes a first X motor for moving the first X table 15 in the X direction. On the first X table 15, a main substrate holding table 19 for holding the display panel 5 by suction is provided on the upper surface. That is, the first Y motor 13,
The second Y motor 14 and the first X motor 18 constitute positioning means for relatively moving the main board holding table 19 and the sub board holding table 17.

A thermocompression bonding head 20 for thermocompression bonding the leads of the electronic component 6 to the electrodes of the circuit board 16 is provided above the sub-board holding table 17 and the main board holding table 19. Further, an observation device 21 for observing a positional relationship between the circuit board 16 and the display panel 5 is provided on the back side of the thermocompression bonding head 20.

Next, the configuration of the observation device 21 and the outline of the positioning operation by the positioning means will be described with reference to FIG. 22 of the observation device 21 is the main body 1
The second X table is provided on the back side of the camera and moves the moving block 24 in the X direction by the second X motor 23. A camera 25 for observing the lower side is mounted on the front surface of the moving block 24. The first Y motor 13, the second Y motor 14, the first X motor 18, and the second X motor 23 operate in cooperation with each other according to a command from the control unit 28, and the image information acquired by the camera 25 is transmitted to the control unit 28. It is output.

Now, both sides of the display panel 5 are provided with alignment marks 5M, and both sides of the circuit board 16 are also provided with alignment marks 16M. And
The camera 25 observes the alignment marks 5M and 16M, detects the amount of misalignment between them, and drives the second X motor 18 in the X direction, and the first Y motor 13 in the Y direction. Alignment is performed by operating one or both of the second Y motors 14.

Next, referring to FIG.
0 will be described. Of the thermocompression bonding head 20,
30 is a fixed frame having an inverted L-shaped cross section fixed to the main body 1, 31 and 32 are guide rails vertically fixed to both sides of the fixed frame 30, 33 is a slider 34 provided on the back surface, 35 is slidably engaged with the guide rails 31 and 32, so that the fixed frame 30 is
Is a lifting frame that is supported at the front of the frame so as to be able to move up and down. Below the elevating frame 33, an electronic component pressing plate 33a that holds the electronic component 6 from above is mounted. In addition,
The mounting structure of the electronic component holding plate 33a will be described later in detail.

Reference numeral 36 denotes a ball nut fixed to the back side of the lifting frame 33, 37 denotes a ball screw which is vertically mounted on the center of the fixed frame 30 and is screwed to the ball nut 36, and 38 rotates the ball screw 37. This is the Z motor to be driven. Therefore, when the Z motor 38 is driven and the ball screw 37 is rotated, the lifting frame 33 can be moved up and down with respect to the fixed frame 30.

On the front surface of the lifting frame 33, cylinders 40 to 44 are provided in parallel. Cylinder 40
44 to 44 are provided with downward rods 40a to 44a, respectively, and thermocompression blocks 40b to 44b are fixed downward to the lower ends of the rods 40a to 44a.
Further, thermocompression bonding portions 40c-4c for pressing the electronic component 6 against the circuit board 16 are provided at the lower ends of the thermocompression bonding blocks 40b-44b.
4c are respectively mounted.

A cooling pipe 46 is horizontally fixed to a lower end of a bracket 45 projecting forward from the side of the elevating frame 33 in a hook shape. Although not shown in FIG.
Cooling air holes 46a (see FIG. 5) for projecting cool air are opened on the side of the cooling pipe 46 toward the thermocompression bonding sections 40c to 44c.

Reference numeral 50 denotes a Z motor drive unit for driving the Z motor 38, and reference numeral 51 denotes a cylinder drive unit for independently driving the cylinders 40 to 44, respectively.

Next, the positional relationship when the leads of the electronic component 6 are thermocompression-bonded to the circuit board 16 will be described with reference to FIG. 5, the circuit board 16 is placed on the sub-board holding table 17, the second Y motor 14 is driven as shown by the arrow N1, and the circuit board 16 on the sub-board holding table 17 is an electronic component. Approach 6.

At this time, the elevation drive unit 17L is at a slightly lower level, and the sub-board holding table 17 is slightly raised as shown by the arrow N2, so that the electrode of the circuit board 16 is placed on the lower surface of the electronic component 6. 16a.

The electronic component pressing plate 33a includes a guide rail 52 provided on the back of the lifting frame 33, and a slider 53 slidably engaged with the guide rail 52.
And a spring 54 held by the elevating frame 33 so as to be able to move up and down with respect to the elevating frame 33.

Next, the circuit board supply section 2 will be described with reference to FIG. The circuit board supply unit 2 is provided with a multi-stage magazine 61 that is raised and lowered by a lifting motor 60,
In each stage of the magazine 61, a jig 63 for mounting a plurality of circuit boards 16 is stored. The jig 63 is pulled out toward the main body 1 by the circuit board transfer device 64. Then, the second Y motor 14 is driven to transfer the circuit board 16 from the jig 63 onto the sub-board holding table 17 located on the circuit board supply unit 2 side, and the sub-board holding table 17 is moved to the first X table 15 side. Then, the positional relationship as shown in FIG.

FIG. 12 is a perspective view of the circuit board 16, and FIG.
(A), (b) is explanatory drawing of the joining principle of a lead and an electrode by an anisotropic conductor. The electronic component 6 is mounted on the circuit board 16.
An electrode 16a that is electrically connected to the lead 6a formed on the lower surface of the substrate is formed, and an anisotropic conductor 90 is attached to the upper surface of the electrode 16a. 13 (a) and 13 (b), the anisotropic conductor 90 has conductive particles 9 in a thermosetting resin.
0a is mixed. As shown in FIG. 13A, an anisotropic conductor 90 is interposed between the aligned lead 6a and the electrode 16a, and when the lead 6a is pressed against the electrode 16a, the electrode 16a and the lead facing the electrode 16a are pressed. 6
Only a is electrically conducted through the conductive particles 90a (see FIG. 13B). Further, the electronic component 6 is fixed to the circuit board 16 by heating and curing the anisotropic conductor 90 in this state.

The manufacturing apparatus for a display panel module according to the present embodiment has the above-described configuration. Next, the entire operation will be described. First, the electronic components 6 are bonded one by one to the edge of the display panel 5 by an outer lead bonding apparatus (not shown). Then, the display panel 5 on which the bonding is completed is set on the main substrate mounting table 4.

Next, the display panel 5 on the main substrate mounting table 4 is picked up by the transfer arm 10 and transferred onto the main substrate holding table 19. Then, the positional relationship shown in FIG. 1 is obtained.

On the other hand, the second Y motor 14 is driven to bring the sub-board holding table 17 close to the circuit board supply unit 2, and the circuit board 16 on the jig 63 previously pulled out of the magazine 61 by the circuit board transfer device 64. Pick up
It is transferred onto the sub-substrate holding table 17. Then, the positional relationship shown in FIG. 6 is obtained.

Next, the first Y motor 13 is driven to move the display panel 5 below the camera 25.
The image of the alignment mark 5M of the display panel 1 is picked up and recognized, and the position of the display panel 5 is detected from the position of the alignment mark 5M.

Next, the first Y motor 13 is driven to retract the main board holding table 19 from below the camera 25, and the second Y motor 14 is driven to move the sub board holding table 17 below the camera 25. Move to the circuit board 16
Is recognized, and the position of the circuit board 16 is obtained.

Based on the determined positions of the display panel 5 and the circuit board 16, the display panel 5 and the circuit board 16 are aligned as described with reference to FIG. At this time,
The first X motor 18, first Y motor 13,
The second Y motor 14 is driven. Further, as shown in FIG. 5, the sub-board holding table 17 is temporarily moved below the electronic component 6 by the lifting drive unit 17L (arrow N1).
By ascending (arrow N2), the anisotropic conductor 90 on the electrode 16a of the circuit board 16 is brought into contact with the lead of the electronic component 6b.

Next, as shown in FIG. 7, the Z motor 38 is driven to lower the electronic component pressing plate 33a, and the electronic component 6 is brought into close contact with the circuit board 16. And cylinder 4
0 to 44 are driven to lower the thermocompression bonding blocks 40 b to 44 b, and the leads of the electronic component 6 are connected to the electrodes 1 of the circuit board 16.
6a to heat the electrode 16a. As a result, the lead 6a of the electronic component 6 and the electrode 1 are formed by the anisotropic conductor 90.
6a is connected.

In this embodiment, the thermocompression bonding block 40 is used.
Instead of lowering b to 44b all at once, FIG.
As shown in (a) to (d), the descent is performed in a plurality of times. Here, the thermocompression bonding blocks 40b to 4b
4b has a high temperature, but by dividing and descending in this manner, thermal expansion of the circuit board 16 due to heating is suppressed to within an allowable range, and a positional shift may occur between the lead 6a and the electrode 16a. In addition, the residual stress of the lead 6a after joining can be reduced. In addition, as shown in the drawing, the lowering may be performed sequentially from the outside, or the lowering may be performed alternately in a staggered manner.

[0036]

According to the display panel manufacturing apparatus of the present invention, a main substrate holding table for holding a display panel having a plurality of electronic components bonded to an edge portion, and an anisotropic conductor previously attached to an upper surface. A sub-board holding table for holding a circuit board having electrodes, positioning means for relatively moving the main board holding table and the sub-board holding table to align the electronic components with the electrodes of the circuit board; Since a thermocompression bonding head for thermocompression bonding the leads of the components to the electrodes of the circuit board is provided, laborious connection of the circuit board can be automatically performed, and work efficiency can be improved. Further, since the lead and the circuit board are connected by using an anisotropic conductor, the work process can be shortened as compared with soldering, and the productivity is improved.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a display panel module manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a main part of a display panel module manufacturing apparatus according to an embodiment of the present invention.

FIG. 3 is a perspective view of a main part of a display panel module manufacturing apparatus according to an embodiment of the present invention.

FIG. 4 is a perspective view of a thermocompression bonding head according to an embodiment of the present invention.

FIG. 5 is a sectional view of a thermocompression bonding head according to an embodiment of the present invention.

FIG. 6 is a side view of an apparatus for manufacturing a display panel module according to an embodiment of the present invention.

FIG. 7 is an operation explanatory view of a display panel module manufacturing apparatus according to one embodiment of the present invention.

FIG. 8 is an operation explanatory diagram of a display panel module manufacturing apparatus according to one embodiment of the present invention.

FIG. 9 is an operation explanatory diagram of a display panel module manufacturing apparatus according to one embodiment of the present invention.

FIG. 10 is an operation explanatory diagram of a display panel module manufacturing apparatus according to one embodiment of the present invention.

11A is a diagram illustrating the operation of a display panel module manufacturing apparatus according to one embodiment of the present invention. FIG. 11B is a diagram illustrating the operation of a display panel module manufacturing apparatus according to one embodiment of the present invention. Operation explanatory diagram of the display panel module manufacturing apparatus in one embodiment (d) Operation explanatory diagram of the display panel module manufacturing apparatus in one embodiment of the present invention

FIG. 12 is a perspective view of a circuit board according to one embodiment of the present invention.

FIG. 13 (a) is a diagram illustrating the principle of bonding between a lead and an electrode using an anisotropic conductor according to one embodiment of the present invention. (B) The bonding between a lead and an electrode using an anisotropic conductor according to one embodiment of the present invention. Illustration of principle

FIG. 14 is a perspective view of a display panel module incorporated in an electronic device (the same is applied to the same electronic device in the related art and the present invention).

[Explanation of symbols]

 Reference Signs List 5 display panel 6 electronic component 13 first Y motor 14 second Y motor 16 circuit board 17 sub board holding table 18 first X motor 19 main board holding table 20 thermocompression bonding head 90 anisotropic conductor

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G02F 1/1345 G02F 1/13 101

Claims (7)

(57) [Claims] 1. A main board holding table for holding a display panel having a plurality of electronic components bonded to an edge thereof, and a sub-board for holding a circuit board having electrodes to which an anisotropic conductor is pasted on an upper surface in advance. A holding table, positioning means for relatively moving the main board holding table and the sub board holding table to align the leads of the electronic component and the electrodes of the circuit board; and A thermocompression bonding head for thermocompression bonding to the electrode of the circuit board via the anisotropic conductor. 2. The apparatus according to claim 1, further comprising: first transfer means for transferring a display panel to said main substrate holding table; and second transfer means for transferring a circuit board to said sub-substrate holding table. Item 2. An apparatus for manufacturing a display panel module according to Item 1. 3. A camera according to claim 1, further comprising a camera for observing the display panel and the circuit board, and a control unit for controlling the positioning means based on image information obtained from the camera. Display panel module manufacturing equipment. 4. The display panel module manufacturing apparatus according to claim 1, wherein the thermocompression bonding head includes a plurality of thermocompression blocks corresponding to the electronic components on a one-to-one basis. 5. An apparatus for manufacturing a display panel module according to claim 4, further comprising lifting means for individually lifting and lowering said thermocompression bonding blocks. 6. A step of holding a display panel having a plurality of electronic components bonded to an edge portion on a main board holding table, and a step of mounting a circuit board having electrodes to which an anisotropic conductor is pasted on an upper surface in advance. Holding the board on a board holding table, relatively moving the main board holding table and the sub board holding table to align the leads of the electronic component with the electrodes of the circuit board, Thermocompression bonding to the electrode of the circuit board via the anisotropic conductor. 7. The method of manufacturing a display panel module according to claim 6, wherein the thermocompression bonding is performed not in a batch but in a plurality of times.