JP2001168146A - Component mounting machine and component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting machine and a component mounting method whereby the thermocompression bonding man-hours of components to a board is reduced, the bonding accuracy can be raised, and a high quality component mounting board can be manufactured at a low cost. SOLUTION: The component mounting machine comprises a first thermocompression unit 200 for holding and mounting a component 102 on a board 101, and for pressing and heating it to tentatively bond it; and a second thermocompression unit 240 for pressing and heating the tentatively bonded component to actually bond it.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus and a component mounting method for mounting components on a substrate by thermocompression bonding.

[0002]

2. Description of the Related Art Generally, a flip chip bonder (F / C bonder) is used when a bare chip (hereinafter simply referred to as a chip), which is an IC before a package divided from a wafer, is mounted on a printed circuit board. . This F /
C bonder is a unit for supplying chips, a unit for moving chips from a supply position to a mounting position,
It generally includes a unit for mounting a chip, a unit for image recognition of the position of a printed circuit board, and a unit for correcting the mounting position of a chip based on image processing results.

[0003]

The mounting of the chip on the printed circuit board by the above-mentioned F / C bonder is performed by thermocompression bonding using one heater integrated with the chip suction tool of the chip mounting unit. I have. In this thermocompression bonding, first, temporary compression bonding (maximum 100 ° C. × several seconds)
Is performed, and then the final press bonding (about 200 ° C. × 10 sec.
0 sec).

As described above, since the thermocompression bonding process is divided into two processes, it takes a long time for heating and cooling with one heater, so that there is a problem that the number of steps increases. In addition, if the bonding agent melted during the high-temperature final bonding adheres to the chip suction tool, it is not easy to remove the hardened bonding agent from the chip suction tool, and it takes time and effort, thereby increasing the number of steps. There is. Further, there is a problem that high-temperature heat at the time of final press-bonding is transmitted to the chip suction tool, which causes thermal deformation of the chip suction tool, and deteriorates chip mounting accuracy.

[0005] Therefore, the above-mentioned problem is solved by performing the temporary crimping with a single heater integrated with the chip suction tool and performing the main crimping with a thermocompression bonding device prepared separately from the F / C bonder. Can be eliminated. However, even when the production volume of chip-mounted printed circuit boards is small, F / C
It is necessary to prepare a bonder and a thermocompression bonding device, and it is necessary to secure an installation space for two devices.
Since the risk of maintenance and failure of the apparatus is doubled, there is a problem that the production cost increases. Also,
During the thermocompression bonding step, the step of moving the temporarily mounted chip mounting printed board from the F / C bonder to the thermocompression bonding apparatus is included, which causes a problem that the quality of the chip mounted printed board becomes unstable.

An object of the present invention is to solve the above-mentioned problems, reduce the number of steps of thermocompression bonding of components to a substrate, increase the mounting accuracy, and produce a high-quality component mounting substrate with low production cost. It is an object of the present invention to provide a component mounting device and a component mounting method that can be used.

[0007]

SUMMARY OF THE INVENTION According to the present invention, there is provided a component mounting apparatus for mounting a component by thermocompression bonding on a substrate. This is attained by providing a first thermocompression bonding section that performs preheating and precompression bonding, and a second thermocompression bonding section that presses the precompression-bonded component and heats and performs precompression bonding.

Further, according to the present invention, there is provided a component mounting method for mounting a component by thermocompression bonding to a substrate.
The component is held by a first thermocompression bonding portion, and the component is placed on the substrate by the first thermocompression bonding portion, pressurized, heated and temporarily press-bonded, and the substrate is maintained as it is, This is achieved by pressurizing the pre-compressed component by the second thermocompression bonding section and heating the pre-pressed component at a temperature higher than the previous heating temperature to perform the final press bonding.

[0009] According to the above configuration, the provisional pressure bonding and the final pressure bonding of the component to the substrate are performed by the separate thermocompression bonding units provided in the same apparatus. That is, the first thermocompression bonding portion having the function of holding and mounting the component is temporarily press-bonded, and the final thermocompression bonding is performed by the second thermocompression bonding portion provided as a component separate from the first thermocompression bonding portion. ing. Since the second thermocompression bonding portion, which becomes high in temperature, is separated from the first thermocompression bonding portion for mounting components, the high temperature during the main compression does not propagate to the first thermocompression bonding portion, and the thermocompression cycle time is reduced. In addition to being able to reduce the length, the maintainability of the first thermocompression bonding part can be improved, and highly reliable mounting can be realized.

[0010]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIG. 1, FIG. 2 and FIG. 3 are a plan view, a side view and a front view showing an embodiment of the component mounting apparatus of the present invention. The component mounting apparatus 100 includes a flip chip bonder (F / F) for mounting a chip 102 on a printed circuit board 101.
A frame 106, a substrate XY stage 111, a chip inversion X stage 118, and a tray Y stage 119 are attached to a base 105 of a gantry 104.

On the frame 106, a tool Z linear guide 107, a tool Z motor 108, a tool Z stage 1
09, spacer Y stage 110 and tool unit 2
00 is attached. Tool Z stage 109
Are moved in the Z direction along the tool Z linear guide 107 by driving the tool Z motor 108. The details of the tool unit 200 will be described later.

Further, a camera base 114, a camera Z motor 115, a camera 116, and a camera Z stage 117 are mounted on the frame 106. Camera Z
The camera 116 attached to the stage 117
The camera Z motor 115 is driven to move in the Z direction. Although not shown, the camera 116
Also has an XY direction movement function comprising a camera XY motor and a camera XY stage.

A board X motor 112 and a board Y motor 113 are mounted on the board XY stage 111. Further, on the upper surface of the board XY stage 111, the printed board 101 is positioned at a predetermined position. A positioning mechanism (not shown) is attached. The substrate XY stage 111 includes a substrate X motor 112 and a substrate Y motor 1
13 is moved in the X-Y direction by the driving of the motor 13.

The chip reversing X stage 118 includes a chip reversing X motor 121, a chip reversing cylinder 122, a chip reversing arm 123, and a chip reversing linear guide 124.
Is attached. Chip inversion X stage 118
Is moved in the X direction along the chip reversing linear guide 124 by the driving of the chip reversing X motor 121. Further, the tip reversing arm 123 turns in the X direction by driving the tip reversing cylinder 122. The tip suction nozzle 123a attached to the tip of the tip reversing arm 123 is
The chip 102 is sucked by vacuum suction means (not shown).

A tray Y motor 120 is mounted on the tray Y stage 119. Further, on the upper surface of the tray Y stage 119, a holding mechanism (not shown) for holding a chip storage tray 103 storing a plurality of chips 102 at a predetermined position is attached. The tray Y stage 119 drives the tray Y motor 120
It moves in the direction. A control unit 130 and an operation panel 140 for controlling these components as shown in FIG. 4 are built in or externally attached to the gantry 104, for example.

FIG. 5 is an enlarged front view showing details of a peripheral portion of the above-described tool unit 200, and FIG. 6 is a perspective view of a main portion thereof. This tool unit 200 has a tool Z
The tool shaft (first thermocompression bonding section, first moving section) 210 attached to the stage 109 and the tool (first thermocompression bonding section, component holding section,
Heating unit) 220, spacer arm (second thermocompression unit, second moving unit) 230 attached to spacer Y stage 110, and spacer (second thermocompression unit, second heating unit) attached to spacer arm 230 ) 240.

The tool axis 210 is used for the tool Z stage 10
9 is moved in the Z-direction by a drive mechanism (not shown) built in. The tool 220 has a built-in flat plate heater 221 at the lower portion, a suction hole 222 penetrating in the Z direction at the center, and is fixed to the lower end surface of the tool shaft 210 by screws, and is connected to the suction hole 222 (not shown). By suctioning the chip 102 on the lower surface by vacuum suction means and pressing it against a bonding agent C such as an anisotropic conductive adhesive applied in advance on the printed circuit board 101, and heating the chip 102 by the flat plate type heater 221, The chip 102 is temporarily press-bonded to the printed board 101.

The spacer arm 230 is moved in the Y direction by a drive mechanism (not shown) built in the spacer Y stage 110. Spacer 240
Has a built-in flat plate type heater 241 at the lower part, is fixed to the tip of the spacer arm 230, and presses the chip 102 in close contact with the upper surface of the chip 102 on the temporarily press-bonded printed circuit board 101 by the action of the tool 220. By heating the chip 102 with the flat plate type heater 241, the chip 102 is completely press-bonded to the printed circuit board 101. The upper and lower surfaces of the spacer 240 are polished parallel and flat.

In the vicinity of the tool 220 and the spacer 240, a cooler such as an air blow (not shown) for cooling the flat plate heaters 221 and 241 is provided. Further, the tool 220 and the spacer 240 are provided with a temperature detection sensor such as a thermocouple (not shown) for detecting the temperature of each of the flat heaters 221 and 241.

An operation example of such a configuration will be described with reference to the flowchart of FIG. 7 and the operation diagrams of FIGS. First, the operator operates the printed circuit board 101.
Is fixed on the upper surface of the substrate XY stage 111,
Chip storage tray 10 in which chips 102 are stored
3 is fixed to the upper surface of the tray Y stage 119 (SPT
1, 2).

Subsequently, the control unit 130 drives the board X motor 112 and the board Y motor 113 to
-The printed circuit board 101 fixed on the upper surface of the Y stage 111 is moved and positioned in the XY directions. Further, the control unit 130 drives the tray Y motor 120 to move and position the chip storage tray 103 fixed on the upper surface of the tray Y stage 119 in the Y direction, and drives the chip inversion X motor 121. Then, the chip inversion X stage 118 is moved and positioned in the X direction, that is, the chip storage tray 103 side.

Then, the control unit 130 drives the chip reversing cylinder 122 so that the chip reversing X stage 1
The chip reversing arm 123 on the chip 18 is rotated toward the chip storage tray 103 side, and the vacuum suction means for the chip reversing arm 123 is driven. A predetermined chip 102 in the chip storage tray 103 is sucked (SPT3).

Thereafter, the control unit 130 drives the chip reversing X motor 121 in the reverse direction to move the chip reversing X stage 118 in the X direction, ie, toward the printed circuit board 101, and positions the chip reversing X stage 118. The chip reversing arm 123 on the chip reversing X stage 118 is driven by driving the
Flip 180 degrees to one side.

Then, the control unit 130 stops the vacuum suction means for the chip reversing arm 123 and, at the same time, drives the vacuum suction means for the tool 220 to be sucked by the chip suction nozzle 123a of the chip reversing arm 123. The present chip 102 is transferred to the tool 220. Thereafter, the control unit 130 controls the chip inversion X motor 121
Is driven to move the chip reversal X stage 118 in the X direction, that is, toward the chip storage tray 103, and retract (STP4).

Subsequently, the control unit 130 controls the camera X
-Y motor is driven to move the camera XY stage to XY
, The camera 116 is moved to the tool 220 side, the camera Z motor 115 is driven, the camera Z stage 117 is moved in the Z direction, and the images of the printed circuit board 101 and the chip 102 are simultaneously recognized (STP5). .

The control unit 130 measures the deviation of the mounting position of the chip 102 on the printed circuit board 101 based on the captured image. And
The control unit 130 drives the board X motor 112 and the board Y motor 113, and moves the printed board 101 fixed on the upper surface of the board XY stage 111 in the XY direction by the amount of the shift in the XY direction. It is moved to correct the mounting position of the chip 102.

Then, the control unit 130 controls the tool Z
By driving the motor 108, the tool Z stage 109 is moved along the tool Z linear guide 107 in the Z direction, that is, toward the printed circuit board 101, and the chip 102 held by the tool 220 is moved to a desired position on the printed circuit board 101. (STP6, see FIG. 8A).

Subsequently, the control unit 130 controls the tool Z
By driving the drive mechanism built in the stage 109,
The tool shaft 210 is moved in the Z direction, and the chip 102 held by the tool 220 is pressed against the printed circuit board 101. At the same time, the flat heater 221 is operated to heat the chip 102 and temporarily press-bond it to the printed circuit board 101 (STP7, see FIG. 8B).

At this time, since the temperature of the flat plate heater 221 is relatively low, the adhesion and hardening of the bonding agent C to the tool 220 is eliminated, so that the cleaning operation of the tool 220 can be simplified and the flat plate type heater 221 can be simplified. Replacement of heater 221
The frequency of adjustment work and the like can be reduced.

Thereafter, the control unit 130 controls the tool 2
The vacuum suction means for 20 is stopped, and the flat heater 221 is turned off.
Is stopped, and the driving mechanism incorporated in the tool Z stage 109 is driven to move the tool 220 to the tool axis 2.
It is retracted in the Z direction together with 10 (see FIG. 8C).

Next, the control unit 130
By driving the drive mechanism built in the stage 110,
The spacer 240 is moved in the Y direction together with the spacer arm 230, and positioned on the chip 102 on the temporarily press-bonded printed circuit board 101 (STP8, see FIG. 9A).

After that, the control unit 130
By driving the drive mechanism built in the stage 109,
The tool shaft 210 is moved in the Z direction, the tool 220 is pressed against the spacer 240, and the spacer 240 is brought into close contact with the upper surface of the chip 102 on the temporarily-pressed printed circuit board 101 and pressed (STP9). Then, the control unit 130 operates the flat plate type heater 241 to heat the chip 102 and press-fit it to the printed circuit board 101 (STP10, see FIG. 9B).

At this time, since the flat plate type heater 241 is disposed on the chip 102 side of the spacer 240, a temperature difference occurs between the spacer 240 and the tool 220 side, and high heat hardly propagates to the tool 220. Also, it does not interfere with the cooling of the flat heater 221 of the tool 220. For this reason, thermal deformation of the tool 220 and the like can be prevented, and the mounting accuracy can be maintained with high accuracy. Also,
Even if the bonding agent C adheres and hardens to the spacer 240, since it is disposed independently of other members, the cleaning workability is good, and the positioning with respect to the tool shaft 210 after replacement and the substrate XY Adjustment work such as parallel setting with the stage 111 becomes unnecessary.

After that, the control unit 130
By driving the drive mechanism built in the stage 109,
The tool 220 is retracted in the Z direction together with the tool shaft 210, the operation of the flat plate type heater 241 is stopped, and the spacer Y
By driving the drive mechanism built in the stage 110,
The spacer 240 is retracted in the Y direction together with the spacer arm 230 (STP11, see FIG. 9C).

The above operation is repeated until all chips 102 are mounted on the printed circuit board 101 (STP12). This makes it possible to continuously perform the two-step thermocompression bonding process of the chip 102 by alternately using two separate flat plate heaters provided in one device.

FIGS. 10A and 10B are diagrams showing the cycle time of thermocompression bonding by the component mounting apparatus 100 of this embodiment and the cycle time of thermocompression bonding by the conventional component mounting apparatus. In addition, the thermocompression bonding by the component mounting apparatus 100 of the present embodiment is performed twice, that is, the temporary compression bonding and the main compression bonding, and the thermocompression bonding by the conventional component mounting apparatus is performed only once. In addition, the temperature before crimping and the temperature for final crimping are determined by the component mounting apparatus 100 of the present embodiment.
And the conventional component mounting apparatus have the same temperature.

As shown in FIG. 10A, in the thermocompression bonding step by the component mounting apparatus 100 of the present embodiment, preparation for thermocompression bonding is performed (from start to time t1), and the temperature before thermocompression bonding is changed to the temporary compression temperature (bonding agent). Normally 100 ° at the temperature at which the tackiness of C is exhibited
C or lower) (time t1 to time t2),
Temporary pressure bonding for several seconds is performed (time t2 to time t3). Then, during the cooling after the completion of the temporary pressing, the temporary pressing is switched to the final pressing (time t3 to time t4). From the temperature before thermocompression bonding to the final compression temperature (usually about 200 ° at the temperature at which the bonding agent C is completely cured)
C (temperature of C) (time t4 to time t5), 10
The main bonding is performed for 20 seconds to 20 seconds (time t5 to time t).
6). Immediately after the completion of the final compression bonding, preparation for thermocompression bonding is started (time t6 to time t7), and the next temporary compression bonding and switching from temporary compression to final compression are performed within the cooling time to the temperature before the thermocompression bonding (time t7 to time t8). Complete.

On the other hand, as shown in FIG. 10 (B), in the thermocompression bonding step using the conventional component mounting apparatus, preparation for thermocompression bonding is performed (from start to time t11), and the temperature is increased from the pre-thermocompression temperature to the main compression temperature. At (time t11 to time t12), the final press bonding is performed (time t12 to time t13). Then, after completion of the final compression bonding, the temperature is cooled to a temperature before thermocompression bonding (time t13 to time t14),
Immediately after cooling, preparation for thermocompression bonding is started and the next main compression bonding is started.

The thermocompression preparation time J1 from the start to time t1 in the component mounting apparatus 100 of this embodiment and the thermocompression preparation time J2 from the start to time t11 in the conventional component mounting apparatus.
Are the same time, the component mounting apparatus 1 of this embodiment
The actual thermocompression bonding time T1 at 00 is from time t4 to time t8.
On the other hand, the actual thermocompression bonding time T2 in the conventional component mounting apparatus is from time t11 to time t14.

Then, the component mounting apparatus 100 of the present embodiment
And the time T1 to the final pressing temperature from time t4 to time t6 and the final pressing time H1 in the conventional component mounting apparatus.
Assuming that the heating time to the final compression bonding temperature from 11 to time t13 and the final compression bonding time H2 are the same time, the cooling time to the temperature before thermocompression bonding from time t6 to time t8 in the component mounting apparatus 100 of the present embodiment. It is sufficient to compare C1 with the cooling time C2 to the pre-thermocompression temperature from time t13 to time t14 in the conventional component mounting apparatus.

The component mounting apparatus 100 of this embodiment includes a flat heater 221 for temporary compression and a flat heater 221 for final compression.
Since two independent 41s are provided, the heat capacity of the flat-plate type heater 241 for final pressure bonding can be reduced, the cooling effect from the outside can be enhanced, and the heating and cooling can be speeded up. . Therefore, since the cooling time C2 to the temperature before thermocompression bonding in the conventional component mounting apparatus is longer than the cooling time C1 to the temperature before thermocompression bonding in the component mounting apparatus 100 of the present embodiment, the difference therebetween, that is, T2
The thermocompression bonding step can be shortened by the time of -T1.

If a plurality of spacers 240 are arranged and used alternately, the cooling time after the final pressure bonding can be further reduced. In addition, if a bonding agent adhesion preventing sheet is provided on the chip 102 side of the spacer 240, replacement work and adjustment work of the flat heater 241 can be eliminated. If a bonding agent that can be semi-cured at room temperature is used, the flat heater 221 of the tool 220 does not need to be used.

[0044]

As described above, according to the present invention,
High-precision mounting is possible, and production tact time can be improved. Further, the maintainability of the apparatus can be improved, and investment costs and installation space can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a component mounting apparatus of the present invention.

FIG. 2 is a side view of the component mounting apparatus of FIG.

FIG. 3 is a front view of the component mounting apparatus of FIG. 1;

FIG. 4 is a block diagram showing a relationship between a control unit and an operation panel of the component mounting apparatus of FIG. 1;

FIG. 5 is a front view showing the periphery of a tool unit of the component mounting apparatus of FIG. 1;

FIG. 6 is a perspective view showing a main part of the tool unit of FIG. 5;

FIG. 7 is a flowchart showing an operation example of the component mounting apparatus of FIG. 1;

FIG. 8 is a first front view showing a thermocompression bonding operation of the component mounting apparatus of FIG. 1;

FIG. 9 is a second front view showing the thermocompression bonding operation of the component mounting apparatus of FIG. 1;

10 is a diagram showing a thermocompression cycle time of the component mounting apparatus of FIG. 1 and a thermocompression cycle time of a conventional component mounting apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 100 ... Component mounting apparatus, 101 ... Printed circuit board, 102 ... Chip, 103 ... Chip storage tray, 104 ... Stand, 105 ... Base, 106
... Frame, 107 ... Tool Z linear guide,
108 tool Z motor, 109 tool Z stage, 110 spacer Y stage, 111
・ Substrate XY stage, 112 ・ ・ ・ Substrate X motor, 1
13 ... substrate Y motor, 114 ... camera base,
115: Camera Z motor, 116: Camera, 1
17 ... Camera vertical mechanism, 118 ... Chip inversion X
Stage, 119 ... Tray Y stage, 120 ...
・ Tray Y motor, 121: Chip inversion X motor,
122: chip reversing cylinder, 123: chip reversing arm, 124: chip reversing linear guide, 1
30: control unit, 140: operation panel, 2
00: tool unit, 210: tool axis, 2
Reference numeral 20: tool, 221: flat heater, 230
... spacer arm, 240 ... spacer, 241
... Plate type heaters

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Iwao Ichikawa 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Manabu Yamauchi 6-35-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation F term (reference) 5E319 AB05 BB16 CC61 CD04 CD13 GG15 5F044 KK01 LL09 PP15 PP16 PP17 PP19

Claims (3)

[Claims] 1. A component mounting apparatus for mounting a component by thermocompression bonding to a substrate, a first thermocompression bonding section for holding the component, placing the component on the substrate, applying pressure, heating, and performing temporary compression. And a second thermocompression bonding section that pressurizes and heats the component to perform final compression bonding. 2. The first thermocompression bonding unit includes a component holding unit, a first moving unit in a vertical direction and a first heating unit, and the second thermocompression bonding unit includes a second moving unit in a horizontal direction and a first heating unit. And a second heating unit, wherein the first thermocompression unit holds the component by the component holding unit, moves vertically in the first moving unit, and places the component on the substrate. After pressing, the component is heated by the first heating unit and temporarily compressed, and then temporarily retracted, the second thermocompression unit moves in the horizontal direction by the second moving unit and temporarily compresses the component. The first thermocompression bonding section moves in the vertical direction by the first moving section and pressurizes the parts temporarily compressed through the second thermocompression bonding section, and the second thermocompression bonding section 2. The method according to claim 1, wherein the component is heated at a temperature higher than the previous heating temperature by the second heating unit, and the component is completely press-bonded. Article mounting device. 3. A component mounting method for mounting a component on a substrate by thermocompression bonding, wherein the component is held by a first thermocompression bonding portion, and the component is placed on the substrate by the first thermocompression bonding portion and added. Pressurizing and heating to temporarily press-bond, maintaining the substrate as it is, pressurizing the temporarily press-bonded component by the second thermocompression bonding section, and heating the component at a temperature higher than the previous heating temperature to perform full press-bonding. Characteristic component mounting method.