JP4267749B2 - Component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting method in which a component such as an IC chip is mounted on a substrate by ultrasonic bonding in the manufacturing process of a SAW filter used for a mobile phone, for example.
[0002]
[Prior art]
In recent years, there has been a demand for higher frequency, smaller size and lighter electronic components such as SAW filters incorporated therein, in order to cope with higher frequency and smaller size and weight of electric products such as small information terminals such as mobile phones. .
[0003]
In order to achieve this, a component mounting method called flip chip that directly connects the electrode on the substrate and the electrode on the component side is promising. Among them, the high frequency response of the circuit after mounting and the viewpoint of cost reduction by reducing the mounting process Therefore, ultrasonic bonding that bonds the electrodes to each other by applying ultrasonic vibration after positioning and contacting the gold electrode on the component side with respect to the gold electrode on the substrate is promising. .
[0004]
In the conventional component mounting method using the flip chip, as shown in FIGS. 5 and 6, first, in the step (a), the mounting head 43 is disposed above the component supply unit 42 for supplying the component (IC chip) 41 to a predetermined position. , And the vertical visual field optical recognition device 44 moves onto the substrate 45 and recognizes two points on the substrate 45 to start the substrate position recognition for recognizing the position of the substrate 45. Next, in step (b) The component 41 is delivered to the mounting head 43, and the completion of the position recognition of the substrate 45 is waited. Next, in step (c), the mounting head 43 is moved above the mounting position on the substrate 45, and the vertical visual field optical recognition device 44 The position of the component 41 is recognized by recognizing the two points of the component 41 held by the mounting head 43, and then the mounting head 43 is lowered after the vertical visual field optical recognition device 44 is retracted in step (d). Electrode of component 41 The electrodes of the substrate 45 into contact with the positioning, were joined parts 41 to the substrate 45 to the mounting head 43 by applying ultrasonic (US).
[0005]
For example, as shown in FIG. 6, the cycle time of the above mounting process requires 2.4 sec for the steps (a) to (c), and 0.9 sec for the component mounting in the step (d) (including ultrasonic waves). Therefore, the component 41 is mounted on the substrate 45 at a rate of one piece every 3.3 seconds.
[0006]
[Problems to be solved by the invention]
However, in the above mounting method, the mounting head 43 cannot move to the mounting operation until after the mounting head 43 has moved to the mounting position and optically recognizes the component 41 and then the retracting movement of the vertical visual field optical recognition device 44 has been completed. Therefore, the time loss in operation is large, and it takes a considerable time to mount one component 41. Therefore, it is desired to increase the speed.
[0007]
In view of the above-described conventional problems, an object of the present invention is to provide a component mounting method capable of mounting components at high speed.
[0008]
[Means for Solving the Problems]
The component mounting method according to the present invention includes a component holding step for holding the supplied component by moving the mounting head to the component supply position, and the recognition head having the component recognition means and the board recognition means between the component holding steps as the origin. A step of recognizing the component mounting position of the substrate by the substrate recognition means by moving from the position onto the substrate, and the mounting head and the recognition head in the component recognition position or the component recognition movement area set between the component supply position and the substrate And recognizing the position of the component while stopping or moving by the component recognition means, and moving the recognition head to the origin position and moving the mounting head onto the substrate to ultrasonically bond the component to the substrate. After the component is held at the component supply position, the component recognition unit recognizes the pattern surface of the component while moving it onto the board, and then the mounting head is mounted. The recognition head can be retracted while moving to the mounting position, and the component recognition data can be processed during that time, and the component can be positioned on the substrate with the mounting head and ultrasonically bonded. It is possible to shorten the cycle time of mounting one component and realize high-speed component mounting.
[0009]
Also, if parts are recognized together, the parts recognition time can be shortened, and higher-speed mounting can be realized.
[0010]
In addition, after component recognition, if the mounting head is lowered toward the board at a position where it does not interfere with the recognition head while moving the mounting head horizontally on the board, the mounting head moves obliquely toward the bonding position. The travel path length is shortened and the acceleration change is also slow, so that it can be moved at high speed and higher-speed mounting can be realized.
[0011]
In addition, after the component is temporarily bonded to the substrate in the above process, the substrate is transported to the next main bonding means and is finally bonded by ultrasonic waves, or the component is positioned on the substrate and temporarily bonded using ultrasonic waves. Then, if the components on the substrate are finally bonded to the substrate again using ultrasonic waves, the temporary bonding time may be about 0.1 sec, for example, and 0.5 to 1.0 sec is required for the main bonding at once. Compared with this, the joining time can be remarkably shortened, and the cycle time for mounting one component can be greatly shortened by carrying out the main joining separately in parallel.
[0012]
[0013]
[0014]
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a component mounting method of the present invention will be described with reference to FIGS.
[0016]
First, the configuration of the main part of the component mounting apparatus according to the present embodiment will be described with reference to FIG. Reference numeral 1 denotes a component take-out unit, on which an expanded wafer 3 is placed in a state of being diced and expanded into individual IC chips that are components 2 to be mounted. The component take-out unit 1 is installed on an XY table 4 movable in the X direction and the Y direction, and is configured to be able to position an arbitrary component 2 on the expanded wafer 3 at a predetermined component take-out position A. A push-up means 5 for pushing up the component 2 is disposed below the component extraction position A, and a recognition camera 6 for recognizing the component 2 is disposed at the upper portion.
[0017]
7 is a component supply reversing means which can reciprocate in the X direction between the upper part of the component extraction position A and the component supply position B on its side, and can be moved up and down to a movable table 8 movable in the X axis direction. A base 9 is provided, and a component holding nozzle 10 that can be turned 180 ° downward and upward about a horizontal axis around the horizontal axis is disposed. In this component supply reversing means 7, the component 2 pushed up at the component extraction position A is conveyed to the component supply position B and turned upside down by 180 ° so that the pattern surface on which the electrodes (gold bumps) are formed faces downward. Supplied in a dry state.
[0018]
A mounting head 11 is configured to be reciprocally movable in the X-axis direction by the X-axis robot 12. One end of the X-axis robot 12 is disposed at the rear of the component supply position B, and the Y-axis robot 13 is disposed at the front of the other end of the X-axis robot 12. A board positioning unit 14 is mounted on the Y-axis robot 13 so as to be movable in the Y-axis direction, and is configured to hold a board 15 on which the component 2 is mounted. The substrate positioning unit 14 includes a heater block having a built-in heater, and is configured to adsorb and fix the substrate 15 thereon and to heat to a temperature suitable for ultrasonic bonding.
[0019]
As shown in FIGS. 1 and 2, the mounting head 11 is mounted on a movable base 16 of the X-axis robot 12, and a lifting / lowering mechanism portion 17 by a feed screw mechanism, a suction mechanism portion 18, and a bonding tool that sucks the component 2. 20 and an ultrasonic horn 19 that applies ultrasonic vibration to the bonding tool 20, moves between the component supply position B and the component mounting position C in the X-axis direction and moves up and down in the H-axis direction. The component 2 is sucked and held on the lower surface of the bonding tool 20 at the supply position B, and is ultrasonically bonded to the substrate 15 at the component mounting position C.
[0020]
Reference numeral 21 denotes a recognition head, which is located between the component supply position and the origin position set between the Y-axis robot 13 and the Y-axis robot 13 along the X-axis guide 22 disposed below the X-axis robot 12. The component recognition means 24 for optically recognizing the component 2 held by the mounting head 11 from below and the substrate recognition means 25 for optically recognizing the component mounting position of the substrate 15 from above. Are arranged in parallel at an appropriate interval in the X-axis direction.
[0021]
In the above configuration, when the component 2 is ultrasonically bonded to the substrate 15, each component 2 of the expanded wafer 3 is sequentially recognized by the recognition camera 6 on the XY table 4 in the component extraction unit 1 and is moved to the component extraction position A. Positioned, pushed up by the push-up means 5, sucked and held by the component holding nozzle 10 of the component supply reversing means 7 and taken out, transported to the component supply position B, and reversed by 180.degree. The electrodes are sequentially supplied to the component supply position B with the electrode formation surface facing downward. On the other hand, the substrate 15 is sequentially supplied onto the substrate positioning unit 14 by a conveying means (not shown), and is discharged after the component 2 is mounted.
[0022]
Details of the operation of mounting the component 2 supplied to the component supply position B on the substrate 15 at the mounting position C during these steps are shown in the steps (a) to (e) of FIG. 3 and the timing chart of FIG. The description will be given with reference.
[0023]
First, in step (a), the mounting head 11 is moved and positioned toward the component supply position B, and is lowered for delivery of the component 2. In the meantime, the recognition head 21 moves from the origin position so that the substrate recognition means 25 faces the first recognition position on the substrate 15 to recognize the first recognition position of the substrate 15. Next, in step (b), the mounting head 11 moves upward after holding the component 2 supplied to the component supply position B by the component supply reversing means 7. During this time, the recognition head 21 moves so that the substrate recognition means 25 faces the second recognition position on the substrate 15, and the recognition data of the first recognition position is processed, and the second of the substrate 15 is processed. Recognize the recognition position. Next, in step (c), the mounting head 11 is moved and positioned to the component recognition position D set between the component supply position B and the component mounting position C, and at the same time, the recognition data of the second recognition position is updated. While performing processing, the recognition head 21 is moved and positioned so that the component recognition unit 24 is positioned at the component recognition position D, and the components 2 are collectively recognized by the component recognition unit 24. Next, in the step (d), the recognition data of the component 2 is processed and the recognition head 21 is retracted toward the origin position, and at the same time, the mounting head 11 is moved toward the component mounting position C. At this time, when the mounting head 11 and the recognition head 21 move to a position where they do not interfere with each other, the mounting head 11 is moved downward toward the substrate 15. Next, in step (e), the component 2 is ultrasonically bonded to the substrate 15 by applying ultrasonic vibration for 0.5 sec with the ultrasonic horn 19 while the component 2 is pressed against the substrate 15 with the mounting head 11. To do.
[0024]
As described above, according to the present embodiment, after the component 2 is held at the component supply position B, the pattern recognition surface of the component 2 is recognized by the component recognition unit 25 at the component recognition position D while moving onto the board 15. As a result, the recognition head 21 can be retracted while the mounting head 11 moves to the component mounting position C, and the component recognition data can be processed during that time. Can be positioned on the substrate 15 and ultrasonically bonded, and the cycle time for mounting one component 2 can be shortened to realize high-speed component mounting. In addition, since the components 2 are collectively recognized, the recognition operation time of the components can be shortened, and higher-speed mounting can be realized.
[0025]
Further, after the component 2 is recognized, the mounting head 11 is moved horizontally toward the substrate 15 and moved downward toward the substrate 15 at a position where it does not interfere with the recognition head 21, so that the mounting head 11 is directed toward the bonding position. By moving obliquely, the movement path length is shortened and the acceleration change is also moderated, so that it can be moved at a high speed and further high-speed mounting can be realized.
[0026]
Thus, according to the present embodiment, as shown in FIG. 4, the mounting cycle time of one component 2 can be set to 2.0 sec, and a marked improvement in productivity can be achieved as compared with the conventional 3.3 sec.
[0027]
In the above embodiment, the mounting head 11 and the recognition head 21 are stopped at the component recognition position D and the component 2 is recognized. However, the mounting head 11 moves from the component supply position B toward the component mounting position C. While moving, the recognition head 21 may be moved synchronously to recognize the component 2, and in this case, since there is no stop time, higher-speed mounting can be realized.
[0028]
Moreover, in the said embodiment, although the example which applied 0.5 sec ultrasonic vibration to the components 2 on the board | substrate positioning part 14 with the mounting head 11 and showed this joining to the board | substrate 15 at once is shown, it is only 0.1 sec, for example Temporary joining is performed by applying ultrasonic vibration, and as shown by the phantom line in FIG. 1, a main joining position E in which the main joining means 30 is arranged is disposed on the side of the component mounting position C, and the transfer means. It is also possible to transfer the substrate 15 to which the component 2 has been temporarily joined at 31 to the main joining position E and perform the main joining in parallel with the mounting process. If it does so, the joining time in the said mounting process can be shortened remarkably, and the cycle time of mounting of the one component 2 can be shortened significantly by performing this joining separately in parallel.
[0029]
【The invention's effect】
According to the component mounting method of the present invention, after the component is held at the component supply position as described above, the component recognition unit recognizes the pattern surface of the component while moving it onto the board, and then the mounting head The recognition head can be retracted while moving to the mounting position, and the component recognition data can be processed during that time, and the component can be positioned on the substrate with the mounting head and ultrasonically bonded. In addition, it is possible to reduce the cycle time of mounting one component and realize high-speed component mounting.
[0030]
Also, if parts are recognized together, the parts recognition time can be shortened, and higher-speed mounting can be realized.
[0031]
In addition, after component recognition, if the mounting head is lowered toward the board at a position where it does not interfere with the recognition head while moving the mounting head horizontally on the board, the mounting head moves obliquely toward the bonding position. The travel path length is shortened and the acceleration change is also slow, so that it can be moved at high speed and higher-speed mounting can be realized.
[0032]
Also, if the parts are positioned and placed on the board and temporarily joined using ultrasonic waves, and then the parts on the board are joined to the board again using ultrasonic waves, the temporary bonding time is longer than that of the actual joining. Since the time can be remarkably shortened, the cycle time for mounting one component can be greatly shortened by carrying out the main joining separately in parallel.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of a main part of a component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a perspective view of the mounting head of the same embodiment.
FIG. 3 is a process diagram of the component mounting method according to the embodiment;
FIG. 4 is a timing chart of the component mounting method of the same embodiment.
FIG. 5 is a process diagram of a conventional component mounting method.
FIG. 6 is an explanatory diagram of an operation time of the conventional example.
[Explanation of symbols]
2 component 11 mounting head 14 substrate positioning unit 15 substrate 21 recognition head 24 component recognition means 25 substrate recognition means 30 main joining means 31 transfer means B component supply position C component mounting position D component recognition position

Claims (4)

  A component holding step for holding the supplied component by moving the mounting head to the component supply position, and a recognition head having component recognition means and board recognition means is moved from the origin position onto the substrate during this component holding step. The step of recognizing the component mounting position of the substrate by the substrate recognition means, and the component recognition position by moving the mounting head and the recognition head to the component recognition position or the component recognition movement area set between the component supply position and the substrate. And a step of recognizing the position of the component while stopping or moving and a step of moving the recognition head to the origin position and moving the mounting head onto the substrate to ultrasonically bond the component to the substrate. Implementation method.   2. The component mounting method according to claim 1, wherein the component recognition is performed collectively.   2. The component mounting method according to claim 1, wherein after the component recognition, the mounting head is moved downward toward the substrate at a position where the mounting head is horizontally moved toward the substrate and does not interfere with the recognition head. A component holding step for holding the supplied component by moving the mounting head to the component supply position, and a recognition head having component recognition means and substrate recognition means is moved from the origin position onto the substrate during this component holding step. The step of recognizing the component mounting position of the substrate by the substrate recognition means, and the component recognition position by moving the mounting head and the recognition head to the component recognition position or component recognition movement area set between the component supply position and the substrate. The step of recognizing the position of the component while stopping or moving, the step of moving the recognition head to the origin position, moving the mounting head onto the substrate and temporarily bonding the component to the substrate with ultrasonic waves, part article mounting how to; and a step of the bonding and transported to the joining means at an ultrasonic.

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