JP2020074384A - Mounting device and mounting method - Google Patents
Mounting device and mounting method Download PDFInfo
- Publication number
- JP2020074384A JP2020074384A JP2019184871A JP2019184871A JP2020074384A JP 2020074384 A JP2020074384 A JP 2020074384A JP 2019184871 A JP2019184871 A JP 2019184871A JP 2019184871 A JP2019184871 A JP 2019184871A JP 2020074384 A JP2020074384 A JP 2020074384A
- Authority
- JP
- Japan
- Prior art keywords
- pressure bonding
- chip component
- circuit board
- temporary
- bonding head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000004840 adhesive resin Substances 0.000 claims abstract description 70
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 238000002788 crimping Methods 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 230000002950 deficient Effects 0.000 abstract description 3
- 238000001723 curing Methods 0.000 description 21
- 238000006243 chemical reaction Methods 0.000 description 10
- 230000003028 elevating effect Effects 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000003570 air Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Abstract
Description
本発明は、フリップチップなどの半導体チップを回路基板に実装する実装装置および実装方法に関する。 The present invention relates to a mounting device and a mounting method for mounting a semiconductor chip such as a flip chip on a circuit board.
フリップチップなどの半導体チップ（以下、チップ部品と呼ぶ）を回路基板に実装する装置として、本出願人は特許文献１の実装装置を出願している。 The present applicant has applied for a mounting device of Patent Document 1 as a device for mounting a semiconductor chip such as a flip chip (hereinafter referred to as a chip component) on a circuit board.
特許文献１に記載の実装装置は図９に示すように、複数の回路パターン７が形成された回路基板２の各回路パターン７にチップ部品４を接着剤樹脂６を介して仮圧着した後、仮圧着の次の工程で複数のチップ部品４と回路基板２を加圧および加熱してチップ部品４を回路基板２に本圧着して実装している。 As shown in FIG. 9, the mounting device described in Patent Document 1 temporarily attaches a chip component 4 to each circuit pattern 7 of a circuit board 2 on which a plurality of circuit patterns 7 are formed via an adhesive resin 6, In the process subsequent to the temporary pressure bonding, the plurality of chip components 4 and the circuit board 2 are pressed and heated so that the chip components 4 are fully pressure bonded to the circuit board 2 for mounting.
回路基板２は、生産性を高めるために複数の回路パターン７をマトリックス状に配置した集合基板となっており、上記の仮圧着工程は一つの回路基板２のすべての回路パターン７にチップ部品４の仮圧着を仮圧着部１００で行ってから、次いで回路基板２を本圧着部２００に移載して本圧着工程を行うバッチ処理による工法となっている。 The circuit board 2 is a collective board in which a plurality of circuit patterns 7 are arranged in a matrix in order to improve productivity, and the above-described temporary pressure bonding step is performed on all the circuit patterns 7 of one circuit board 2 by chip parts 4 After the temporary pressure bonding is performed in the temporary pressure bonding unit 100, the circuit board 2 is then transferred to the main pressure bonding unit 200 and the main pressure bonding process is performed.
チップ部品が回路基板２に仮圧着された状態は、接着剤樹脂６は未硬化状態で、位置決めしたチップ部品４が位置ずれしない程度の粘着力で保持されている。 In the state where the chip component is temporarily pressure-bonded to the circuit board 2, the adhesive resin 6 is in an uncured state and is held with an adhesive force such that the positioned chip component 4 is not displaced.
本圧着工程で使用される本圧着部２００の基板ステージは、回路基板２の接着剤樹脂６の流動性を高めるためにステージヒータが内蔵されており、回路基板２が７０℃程度になるように加熱されている。 The substrate stage of the main pressure-bonding section 200 used in the main pressure-bonding step has a built-in stage heater to enhance the fluidity of the adhesive resin 6 of the circuit board 2, so that the temperature of the circuit board 2 is about 70 ° C. It is heated.
本圧着工程では、チップ部品４に対して加圧および加熱が行われる。加熱は、加圧ヘッド２０７側に設けられたヒータを用いて行われ、チップ部品４から樹脂６へと伝熱される。この際、図１０に示すように、回路基板２の本圧着を行っている箇所から隣接する仮圧着された箇所へヒータの加熱による熱が伝熱してしまう。この熱により、仮圧着された箇所の接着剤樹脂の硬化反応が進行し、本圧着を行う際にチップ部品４のバンプ５と回路基板２の電極３の間に硬化した樹脂を噛み込んでしまい、接合不良を起こしてしまう問題がある。 In the main pressure bonding step, the chip component 4 is pressed and heated. Heating is performed using a heater provided on the pressure head 207 side, and heat is transferred from the chip component 4 to the resin 6. At this time, as shown in FIG. 10, heat generated by the heater is transferred from the portion of the circuit board 2 where the main pressure bonding is performed to the adjacent portion where the temporary pressure bonding is performed. Due to this heat, the hardening reaction of the adhesive resin at the temporarily press-bonded portion progresses, and when the main press-bonding is performed, the hardened resin is caught between the bumps 5 of the chip component 4 and the electrodes 3 of the circuit board 2. However, there is a problem of causing a defective joint.
また、回路基板２に設けられた回路パターンが多い場合には、最初のチップ部品４の本圧着作業から最終のチップ部品４の本圧着作業までに時間を要するため、仮圧着状態の接着剤樹脂６が時間の経過とともに硬化が進行し、最終のチップ部品４を本圧着するときに接合不良を起こしてしまう問題がある。 In addition, when there are many circuit patterns provided on the circuit board 2, it takes time from the main crimping work of the first chip component 4 to the final crimping work of the final chip component 4. 6 has a problem that the hardening progresses with the lapse of time and a bonding failure occurs when the final chip component 4 is finally pressure-bonded.
また、仮圧着状態の接着剤樹脂６は、未硬化状態であり、接着強度も低いため仮圧着部１００のステージから、本圧着部２００のステージへ回路基板２を移載する際に、移載ハンドによる受け渡しや搬送中の振動などによりチップ部品４が位置ずれしてしまう問題がある。 Further, since the adhesive resin 6 in the temporary pressure bonding state is in an uncured state and has low adhesive strength, it is transferred when the circuit board 2 is transferred from the stage of the temporary pressure bonding unit 100 to the stage of the main pressure bonding unit 200. There is a problem in that the chip component 4 is displaced due to hand-over and vibration during transportation.
また、本圧着工程で接着剤樹脂６の硬化温度以上に加熱されたヒーターで本圧着すると、接着剤樹脂６の特性によっては、加熱硬化が急速に進行して接着剤樹脂６の流動性を阻害しバンプと電極の間に接着剤樹脂６が噛み込んでしまって導通不良を起こすため、本圧着開始時には接着剤樹脂６の流動性を良くし硬化が進行しない温度で加圧し、次いで硬化する温度まで上昇させて本圧着する場合もある。 In addition, in the main pressure bonding step, when the main pressure bonding is performed with a heater heated to a temperature higher than the curing temperature of the adhesive resin 6, depending on the characteristics of the adhesive resin 6, the heat curing progresses rapidly and the fluidity of the adhesive resin 6 is impaired. Since the adhesive resin 6 is caught between the bumps and the electrodes to cause a poor conduction, the fluidity of the adhesive resin 6 is improved at the start of the main pressure bonding, and pressure is applied at a temperature at which curing does not proceed, and then a temperature at which it is cured. In some cases, it may be lifted up to the main pressure bonding.
その場合に硬化温度まで昇温したヒーターを開始温度まで冷却させる必要があり、タクトタイムが長くなり生産性が悪くなる問題がある。 In that case, it is necessary to cool the heater, which has been heated to the curing temperature, to the starting temperature, which results in a long takt time and poor productivity.
そこで本発明の課題は、複数の回路パターンが形成された回路基板の各回路パターンにチップ部品を接着剤樹脂を介して仮圧着工程および本圧着工程を行い実装する実装装置において、接合不良や位置ずれを発生させない生産性の高い実装装置および実装方法を提供することとする。 Therefore, an object of the present invention is to provide a mounting device that mounts a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns is formed by performing a temporary pressure bonding step and a final pressure bonding step via an adhesive resin. A mounting apparatus and a mounting method with high productivity that do not cause misalignment.
上記課題を解決するために、請求項１に記載の発明は、
複数の回路パターンが形成された回路基板の各回路パターンにチップ部品を接着剤樹脂を介して実装する実装装置であって、
チップ部品と回路基板に設けられた回路パターンの位置合わせを行って、チップ部品を回路パターンに仮圧着する仮圧着ヘッドと、
仮圧着されたチップ部品を加熱および加圧し接着剤樹脂を加熱硬化してチップ部品を回路パターンに本圧着する本圧着ヘッドと、
回路基板を保持する基板保持ステージと、
前記チップ部品を前記仮圧着ヘッドに受け渡すチップ供給手段と、
基板保持ステージを回路基板が保持された状態で、仮圧着ヘッドが設けられた仮圧着部と本圧着ヘッドが設けられた本圧着部との間を交互に移動する機構とを備え、
チップ部品を回路パターンに仮圧着した後、基板保持ステージを仮圧着ヘッドの下側から本圧着ヘッドの下側に移動してチップ部品を回路パターンに本圧着を行うとともに、
前記本圧着と並行して前記チップ供給手段が前記仮圧着ヘッドにチップ部品を受け渡す機能を有する制御部を備えた実装装置である。
In order to solve the above problems, the invention described in claim 1 is
A mounting device for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A temporary crimping head for temporarily crimping the chip component to the circuit pattern by aligning the chip component and the circuit pattern provided on the circuit board,
A main pressure bonding head that heats and pressurizes the temporarily bonded chip component to heat and cure the adhesive resin to perform final pressure bonding of the chip component to the circuit pattern,
A substrate holding stage for holding a circuit board,
A chip supply means for delivering the chip component to the temporary pressure bonding head,
In a state where the circuit board is held on the substrate holding stage, a mechanism that alternately moves between the temporary pressure bonding portion provided with the temporary pressure bonding head and the main pressure bonding portion provided with the main pressure bonding head,
After temporarily crimping the chip component to the circuit pattern, move the substrate holding stage from the lower side of the temporary pressure bonding head to the lower side of the main pressure bonding head to perform the main pressure bonding of the chip component to the circuit pattern.
The mounting apparatus is provided with a control unit having a function of transferring the chip component to the temporary pressure bonding head in parallel with the main pressure bonding.
請求項２に記載の発明は、
複数の回路パターンが形成された回路基板の各回路パターンにチップ部品を接着剤樹脂を介して実装する実装装置であって、
チップ部品と回路基板に設けられた回路パターンの位置合わせを行って、チップ部品を回路パターンに仮圧着する仮圧着ヘッドと、
仮圧着されたチップ部品を加熱および加圧し接着剤樹脂を加熱硬化してチップ部品を回路パターンに本圧着する本圧着ヘッドと、
回路基板を保持する基板保持ステージと、
前記チップ部品を前記仮圧着ヘッドに受け渡すチップ供給手段と、
仮圧着ヘッドと本圧着ヘッドを基板保持ステージ上に交互に移動させる機構とを備え、
基板保持ステージ上に仮圧着ヘッドを移動し仮圧着を行った後、基板保持ステージ上に本圧着ヘッドを移動し本圧着を行うとともに、
前記本圧着と並行して前記チップ供給手段が前記仮圧着ヘッドにチップ部品を受け渡す機能を有する制御部を備えた実装装置である。
The invention according to claim 2 is
A mounting device for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A temporary crimping head for temporarily crimping the chip component to the circuit pattern by aligning the chip component and the circuit pattern provided on the circuit board,
A main pressure bonding head that heats and pressurizes the temporarily bonded chip component to heat and cure the adhesive resin to perform final pressure bonding of the chip component to the circuit pattern,
A substrate holding stage for holding a circuit board,
A chip supply means for delivering the chip component to the temporary pressure bonding head,
A mechanism for alternately moving the temporary pressure bonding head and the main pressure bonding head on the substrate holding stage,
After moving the temporary pressure bonding head onto the substrate holding stage to perform temporary pressure bonding, move the main pressure bonding head onto the substrate holding stage to perform main pressure bonding, and
The mounting apparatus is provided with a control unit having a function of transferring the chip component to the temporary pressure bonding head in parallel with the main pressure bonding.
請求項３に記載の発明は、請求項１または請求項２の発明において、
前記チップ部品と前記本圧着ヘッドの間に樹脂シートを供給する樹脂シート供給機構を更に備え、
前記本圧着ヘッドの先端部に、圧着面の外周サイズが前記チップ部品よりも大きい本圧着用アタッチメントを有し、
前記本圧着アタッチメントが前記樹脂シートを介して前記チップ部品を加圧する実装装置である。
The invention according to claim 3 is the same as the invention according to claim 1 or 2,
Further comprising a resin sheet supply mechanism for supplying a resin sheet between the chip component and the main pressure bonding head,
The tip of the main pressure bonding head has a main pressure bonding attachment in which the outer peripheral size of the pressure bonding surface is larger than the chip component,
The main pressure-bonding attachment is a mounting device that pressurizes the chip component via the resin sheet.
請求項４に記載の発明は、
請求項１または請求項２の発明において、
前記本圧着ヘッドが複数のチップ部品を一括で加熱および加圧する本圧着アタッチメントを備えた実装装置である。
The invention according to claim 4 is
In the invention of claim 1 or 2,
In the mounting apparatus, the main pressure bonding head includes a main pressure bonding attachment for collectively heating and pressing a plurality of chip components.
請求項５に記載の発明は、請求項４の発明において、
前記本圧着ヘッドの加圧力を制御する前記制御部が加圧される複数のチップ部品の数量に応じて加圧力を可変する機能を有した実装装置である。
The invention of claim 5 is the same as the invention of claim 4,
It is a mounting apparatus having a function of varying the pressing force according to the number of a plurality of chip components to be pressed by the control unit that controls the pressing force of the main pressure bonding head.
請求項６に記載の発明は、
複数の回路パターンが形成された回路基板の各回路パターンにチップ部品を接着剤樹脂を介して実装する実装方法であって、
チップ部品と回路基板に設けられた回路パターンの位置合わせを行って、チップ部品を回路パターンに仮圧着ヘッドを用いて仮圧着工程と、
仮圧着されたチップ部品を加熱および加圧し接着剤樹脂を加熱硬化してチップ部品を回路パターンに本圧着ヘッドを用いて本圧着工程とを有し、
回路基板を保持する基板保持ステージを、仮圧着ヘッドの下側に配置する仮圧着工程と、本圧着ヘッドの下側に配置する本圧着工程とを交互に行い、前記回路基板のすべての回路パターンにチップ部品を仮圧着および本圧着してから回路基板の取り出しを行うものであり、前記本圧着工程と並行して前記仮圧着ヘッドにチップ部品が受け渡されることを特徴とする実装方法である。
The invention according to claim 6 is
A mounting method for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
The chip parts are aligned with the circuit pattern provided on the circuit board, and the chip parts are formed on the circuit pattern using a temporary pressure bonding head.
The chip component that has been temporarily pressure bonded is heated and pressed to heat and cure the adhesive resin, and the chip component is formed into a circuit pattern using a main pressure bonding head.
All the circuit patterns of the circuit board are obtained by alternately performing a temporary pressure bonding step of arranging the substrate holding stage for holding the circuit board under the temporary pressure bonding head and a main pressure bonding step of arranging the circuit board under the main pressure bonding head. A circuit board is taken out after the chip component is temporarily pressure-bonded and finally pressure-bonded, and the chip component is delivered to the temporary pressure-bonding head in parallel with the main pressure-bonding step. ..
請求項７に記載の発明は、
複数の回路パターンが形成された回路基板の各回路パターンにチップ部品を接着剤樹脂を介して実装する実装方法であって、
チップ部品と回路基板に設けられた回路パターンの位置合わせを行って、チップ部品を回路パターンに仮圧着ヘッドを用いて仮圧着工程と、
仮圧着されたチップ部品を加熱および加圧し接着剤樹脂を加熱硬化してチップ部品を回路パターンに本圧着ヘッドを用いて本圧着工程とを有し、
回路基板を保持する基板保持ステージ上に、仮圧着ヘッドを配置する仮圧着工程と、本圧着ヘッドを配置する本圧着工程とを交互に行い、回路基板のすべての回路パターンにチップ部品を仮圧着および本圧着してから回路基板の取り出しを行うものであり、前記本圧着工程と並行して前記仮圧着ヘッドにチップ部品が受け渡されることを特徴とする実装方法である。
The invention according to claim 7 is
A mounting method for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
The chip parts are aligned with the circuit pattern provided on the circuit board, and the chip parts are formed on the circuit pattern using a temporary pressure bonding head.
The chip component that has been temporarily pressure bonded is heated and pressed to heat and cure the adhesive resin, and the chip component is formed into a circuit pattern using a main pressure bonding head.
On the substrate holding stage that holds the circuit board, the temporary crimping step of placing the temporary crimping head and the main crimping step of placing the main crimping head are alternately performed, and the chip components are temporarily crimped to all the circuit patterns on the circuit board. Also, the circuit board is taken out after the main pressure bonding, and the chip component is delivered to the temporary pressure bonding head in parallel with the main pressure bonding step.
請求項１に記載の発明によれば、基板保持ステージに回路基板を保持した状態で、仮圧着部で回路基板の回路パターンにチップ部品を仮圧着して、次いで、基板保持ステージを本圧着部に移動して、仮圧着したチップ部品を本圧着ヘッドで本圧着を行う。チップ部品の仮圧着毎に本圧着を行い接着剤樹脂の硬化が行われるので、他の回路パターンにチップ部品を本圧着している時に基板からの伝熱があっても、すでに接着剤樹脂の硬化が完了しているので硬化反応が繰り返されることがない。そのため本圧着された回路パターンのチップ部品に位置ずれや接合不良を発生させることがない。また、基板保持ステージ上の基板は、吸着保持したまま、仮圧着部、本圧着部を往復して最終のチップ部品まで本圧着してから回路基板を移送するので、移送による仮圧着後の位置ずれの問題はなくなる。しかも、本圧着中に仮圧着ヘッドは次のチップ部品の受け渡しを行うことができるので、タクトタイム短縮が図れる。 According to the invention described in claim 1, in the state where the circuit board is held on the substrate holding stage, the chip component is temporarily pressure-bonded to the circuit pattern of the circuit board at the temporary pressure bonding portion, and then the substrate holding stage is fixed to the main pressure bonding portion. Then, the chip components that have been temporarily crimped are subjected to main crimping with the main crimping head. Since the adhesive resin is hardened by performing final pressure bonding for each temporary crimp of the chip component, even if heat is transferred from the substrate when the chip component is permanently pressure bonded to another circuit pattern, the adhesive resin is already Since the curing is completed, the curing reaction is not repeated. Therefore, the chip components of the circuit pattern that have been fully pressure-bonded do not cause misalignment or bonding failure. In addition, while the substrate on the substrate holding stage is sucked and held, the circuit board is transferred after reciprocating between the temporary pressure bonding part and the main pressure bonding part to reach the final chip component. The problem of misalignment disappears. In addition, since the temporary pressure bonding head can transfer the next chip component during the main pressure bonding, the takt time can be shortened.
請求項２に記載の発明によれば、基板保持ステージに回路基板を保持した状態で、基板保持ステージ上に仮圧着ヘッドを移動し仮圧着を行った後、基板保持ステージ上に本圧着ヘッドを移動し本圧着を行う。チップ部品の仮圧着毎に本圧着を行い接着剤樹脂の硬化が行われるので、他の回路パターンにチップ部品を本圧着している時に基板からの伝熱があっても、すでに接着剤樹脂の硬化が完了しているので硬化反応が繰り返されることがない。そのため本圧着された回路パターンのチップ部品に位置ずれや接合不良を発生させることがない。しかも、本圧着中に仮圧着ヘッドは次のチップ部品の受け渡しを行うことができるので、タクトタイム短縮が図れる。 According to the second aspect of the invention, in the state where the circuit board is held on the substrate holding stage, the temporary pressure bonding head is moved onto the substrate holding stage to perform temporary pressure bonding, and then the main pressure bonding head is placed on the substrate holding stage. Move and perform main crimping. Since the adhesive resin is hardened by performing final pressure bonding for each temporary crimp of the chip component, even if heat is transferred from the substrate when the chip component is permanently pressure bonded to another circuit pattern, the adhesive resin is already Since the curing is completed, the curing reaction is not repeated. Therefore, the chip components of the circuit pattern that have been fully pressure-bonded do not cause misalignment or bonding failure. In addition, since the temporary pressure bonding head can transfer the next chip component during the main pressure bonding, the takt time can be shortened.
請求項３に記載の発明によれば、本圧着時にチップ部品から接着剤樹脂がはみ出しても本圧着用アタッチメントに付着することがないので、チップ部品の外周にはみ出した接着剤樹脂のフィレット形状を安定させ、接合強度を高めることができる。 According to the invention as set forth in claim 3, even if the adhesive resin protrudes from the chip component during the main pressure bonding, it does not adhere to the attachment for the main pressure bonding. Therefore, the fillet shape of the adhesive resin protruding on the outer periphery of the chip component is eliminated. It is possible to stabilize and increase the bonding strength.
請求項４に記載の発明によれば、本圧着ヘッドが複数のチップ部品を一括で加熱および加圧する本圧着用アタッチメントを備えている。そのため、複数箇所の仮圧着されたチップ部品を一括して本圧着でき、タクトタイムを短縮することができる。 According to the invention described in claim 4, the main pressure bonding head includes the main pressure bonding attachment for collectively heating and pressing a plurality of chip components. Therefore, a plurality of temporary crimped chip components can be collectively collectively crimped, and the tact time can be shortened.
請求項５に記載の発明によれば、本圧着ヘッドの加圧力を制御する制御部が加圧される複数のチップ部品の数量に応じて加圧力を可変する機能を有している。そのため、回路パターンの不良により仮圧着されなかった回路パターンが本圧着の圧着箇所に含まれていても、個々のチップ部品には適正な加圧を行うことができる。また、回路基板がウエハなど円形の形状の場合、外周部の複数の回路パターンを本圧着する際に、チップ部品の数に応じて加圧力を可変しているので加圧不良を発生させない。 According to the fifth aspect of the present invention, the control unit that controls the pressing force of the main pressure bonding head has a function of varying the pressing force according to the number of the plurality of chip components to be pressed. Therefore, even if the circuit pattern that has not been temporarily pressure-bonded due to a defective circuit pattern is included in the pressure-bonding portion of the main pressure-bonding, it is possible to apply appropriate pressure to each chip component. Further, in the case where the circuit board has a circular shape such as a wafer, when the plurality of circuit patterns on the outer peripheral portion are subjected to the main pressure bonding, the pressurizing force is changed according to the number of chip components, so that the pressurization failure does not occur.
請求項６に記載の発明によれば、回路基板を保持する基板保持ステージを、仮圧着ヘッドの下側に移動させて仮圧着する工程と、本圧着ヘッドの下側に移動させて本圧着する工程とを交互に行い、回路基板のすべての回路パターンにチップ部品を仮圧着および本圧着してから回路基板の取り出しを行う工程を有している。チップ部品の仮圧着毎に本圧着を行い接着剤樹脂の硬化が行われるので、他の回路パターンにチップ部品を本圧着している時に回路基板からの伝熱があっても、すでに接着剤樹脂の硬化が完了しているので硬化反応が繰り返されることがない。そのため本圧着された回路パターンのチップ部品に位置ずれや接合不良を発生させることがない。しかも、本圧着中に仮圧着ヘッドは次のチップ部品の受け渡しを行うことができるので、タクトタイム短縮が図れる。 According to the invention described in claim 6, the step of moving the substrate holding stage holding the circuit board to the lower side of the temporary pressure bonding head to perform the temporary pressure bonding, and the step of moving it to the lower side of the main pressure bonding head to perform the main pressure bonding. Steps are alternately performed, and the circuit board is taken out after the chip components are temporarily and permanently bonded to all the circuit patterns on the circuit board. Since the adhesive resin is hardened by performing final crimping for each temporary crimp of the chip component, even if heat is transferred from the circuit board when the chip component is permanently crimped to another circuit pattern, the adhesive resin is already used. Since the curing of (1) is completed, the curing reaction is not repeated. Therefore, the chip components of the circuit pattern that have been fully pressure-bonded do not cause misalignment or bonding failure. In addition, since the temporary pressure bonding head can transfer the next chip component during the main pressure bonding, the takt time can be shortened.
請求項７に記載の発明によれば、回路基板を保持する基板保持ステージ上に、仮圧着ヘッドを移動させて仮圧着する工程と、本圧着ヘッドを移動させて本圧着する工程とを交互に行い、回路基板のすべての回路パターンにチップ部品を仮圧着および本圧着してから回路基板の取り出しを行う工程を有している。チップ部品の仮圧着毎に本圧着を行い接着剤樹脂の硬化が行われるので、他の回路パターンにチップ部品を本圧着している時に回路基板からの伝熱があっても、すでに接着剤樹脂の硬化が完了しているので硬化反応が繰り返されることがない。そのため本圧着された回路パターンのチップ部品に位置ずれや接合不良を発生させることがない。しかも、本圧着中に仮圧着ヘッドは次のチップ部品の受け渡しを行うことができるので、タクトタイム短縮が図れる。 According to the invention of claim 7, the step of moving the temporary pressure bonding head to perform temporary pressure bonding and the step of moving the main pressure bonding head to perform main pressure bonding alternately on the substrate holding stage that holds the circuit board. There is a step of taking out the circuit board after performing the temporary pressure bonding and the final pressure bonding of the chip component to all the circuit patterns of the circuit board. Since the adhesive resin is hardened by performing final crimping for each temporary crimp of the chip component, even if heat is transferred from the circuit board when the chip component is permanently crimped to another circuit pattern, the adhesive resin is already used. Since the curing of (1) is completed, the curing reaction is not repeated. Therefore, the chip components of the circuit pattern that have been fully pressure-bonded do not cause misalignment or bonding failure. In addition, since the temporary pressure bonding head can transfer the next chip component during the main pressure bonding, the takt time can be shortened.
以下に、本発明の実施の形態１について図面を参照しながら説明する。図１において、実装装置１に向かって左右方向をＸ軸、手前方向をＹ軸、Ｘ軸とＹ軸とで構成されるＸＹ平面に直交する軸をＺ軸、Ｚ軸を中心として回転する方向をθ方向とする。実装装置１は、回路基板２にチップ部品４を仮圧着する仮圧着部１００と、回路基板２にチップ部品４を本圧着する本圧着部２００と、実装装置１の全体を制御する制御部１５０とから構成されている。 Embodiment 1 of the present invention will be described below with reference to the drawings. In FIG. 1, a direction rotating toward the mounting apparatus 1 about the X axis in the left-right direction, the Y axis in the front direction, the axis orthogonal to the XY plane composed of the X axis and the Y axis as the Z axis, and the Z axis as a center. Be the θ direction. The mounting apparatus 1 includes a temporary crimping section 100 for temporarily crimping the chip component 4 onto the circuit board 2, a final crimping section 200 for final crimping the chip component 4 onto the circuit board 2, and a control section 150 for controlling the entire mounting apparatus 1. It consists of and.
仮圧着部１００は、基台１０１上に載置された基板保持ステージ１０２と、基台１０１のＹ方向後方に設けられた支持フレーム１０３と、支持フレーム１０３に設けられた回路基板２にチップ部品４を仮圧着する加圧手段１０４と、加圧手段１０４に設けられた仮圧着ヘッド１０７にチップ部品４を供給するチップスライダ１１０と、回路基板２に設けられた位置合わせマークとチップ部品４に設けられた位置合わせマークを画像認識する２視野カメラ１３０とから構成されている。 The temporary pressure bonding unit 100 includes a substrate holding stage 102 mounted on a base 101, a support frame 103 provided on the rear side of the base 101 in the Y direction, and a chip component on the circuit board 2 provided on the support frame 103. 4 for temporarily press-bonding the chip 4, a chip slider 110 for supplying the chip component 4 to the temporary press-fitting head 107 provided on the pressurizing unit 104, an alignment mark provided on the circuit board 2 and the chip component 4. It is composed of a two-view camera 130 that recognizes an image of the alignment mark provided.
基板保持ステージ１０２には、図示していない搬送手段により回路基板２が供給される。基板保持ステージ１０２は、ＸＹ方向に移動可能な位置調整手段１０６が設けられている。位置調整手段１０６は、サーボモータに連結されたボールねじなどの機構により基板保持ステージ１０２をＸＹ方向に駆動するように構成されている。基板保持ステージ１０２には、回路基板２の樹脂６の流動性を高めるためにステージヒータ１０５が内蔵されている。 The circuit board 2 is supplied to the substrate holding stage 102 by a transfer unit (not shown). The substrate holding stage 102 is provided with position adjusting means 106 that can move in the XY directions. The position adjusting means 106 is configured to drive the substrate holding stage 102 in the XY directions by a mechanism such as a ball screw connected to a servo motor. The substrate holding stage 102 has a stage heater 105 built therein to enhance the fluidity of the resin 6 on the circuit board 2.
基板保持ステージ１０２の位置調整手段１０６は、仮圧着部１００から本圧着部２００に伸びるスライドレール１２０上に備えられている。スライドレール１２０と位置調整手段１０６の下部に設けられたリニアガイド１２１が嵌合し、基板保持ステージ１０２を仮圧着部１００と本圧着部２００との間を往復できるように構成されている。図１では、本圧着部２００に移動した基板保持ステージ１０２を点線で示した。 The position adjusting means 106 of the substrate holding stage 102 is provided on a slide rail 120 extending from the temporary pressure bonding portion 100 to the main pressure bonding portion 200. The slide rail 120 and a linear guide 121 provided below the position adjusting unit 106 are fitted to each other, and the substrate holding stage 102 can be reciprocated between the temporary pressure bonding unit 100 and the main pressure bonding unit 200. In FIG. 1, the substrate holding stage 102 that has moved to the main pressure bonding portion 200 is shown by a dotted line.
加圧手段１０４は、Ｚ方向に駆動される仮圧着ヘッド１０７と、仮圧着ヘッド１０７を駆動する昇降手段１０８と、θ方向に駆動する回転手段１０９から構成されている。昇降手段１０８は、サーボモータとボールねじの機構により仮圧着ヘッド１０７をＺ方向に駆動するように構成されている。サーボモータとボールねじの構成に限らず、圧空シリンダとピストン又はボイスコイルモータの構成にしても良い。 The pressing means 104 is composed of a temporary pressure bonding head 107 driven in the Z direction, an elevating means 108 driving the temporary pressure bonding head 107, and a rotating means 109 driving the θ direction. The elevating means 108 is configured to drive the temporary pressure bonding head 107 in the Z direction by a mechanism of a servo motor and a ball screw. The configuration is not limited to the servo motor and the ball screw, and may be the configuration of a pneumatic cylinder and a piston or a voice coil motor.
仮圧着ヘッド１０７には、仮圧着ヒータ１２５、仮圧着用アタッチメント１２６が設けられている。仮圧着ヒータ１２５は、チップ部品４を加熱するためのものであり、カートリッジヒータから構成されている。ただし、カートリッジヒータに限定されるものではなく、ラバーヒータ等、チップ部品４を加熱することができるものであればよい。 The temporary pressure bonding head 107 is provided with a temporary pressure bonding heater 125 and a temporary pressure bonding attachment 126. The temporary pressure bonding heater 125 is for heating the chip component 4, and is composed of a cartridge heater. However, it is not limited to the cartridge heater, and may be any one that can heat the chip component 4, such as a rubber heater.
仮圧着用アタッチメント１２６は、チップ部品４を保持するものである。仮圧着用アタッチメント１２６は、仮圧着ヒータ１２５に吸着により保持されている。また、仮圧着用アタッチメント１２６は、仮圧着ヒータ１２５によって加熱されるように構成されている。つまり、仮圧着用アタッチメント１２６は、チップ部品４を位置決め保持するとともに、仮圧着ヒータ１２５からの伝熱によってチップ部品４を加熱できるように構成されている。 The temporary pressure attachment 126 holds the chip component 4. The temporary pressure bonding attachment 126 is held by suction on the temporary pressure bonding heater 125. Further, the temporary pressure bonding attachment 126 is configured to be heated by the temporary pressure bonding heater 125. That is, the temporary pressure bonding attachment 126 is configured to position and hold the chip component 4 and to heat the chip component 4 by heat transfer from the temporary pressure bonding heater 125.
仮圧着用アタッチメント１２６のチップ部品４を吸着する面の外周サイズは、チップ部品４のサイズよりも小さくすることで、チップ部品４と回路基板２の間から接着剤樹脂６（例えばＮＣＦ）がはみ出したとしても仮圧着用アタッチメント１２６に付着するという問題は生じない。仮圧着用アタッチメント１２６の各辺は、チップ部品４の各辺に対して０．１ｍｍから０．５ｍｍ程度小さくすることが望ましい。 By making the outer peripheral size of the surface of the attachment 126 for temporary pressure bonding for adsorbing the chip component 4 smaller than the size of the chip component 4, the adhesive resin 6 (for example, NCF) protrudes from between the chip component 4 and the circuit board 2. Even if it does, there is no problem that it adheres to the temporary pressure attachment 126. It is desirable that each side of the temporary pressure attachment 126 is smaller than each side of the chip component 4 by about 0.1 mm to 0.5 mm.
チップスライダ１１０は、チップ部品４を図示いていないチップ供給部から仮圧着ヘッド１０７の下方まで水平搬送する。チップスライダ１１０は、チップ供給部から仮圧着ヘッド１０７まで伸びるスライドレール１１１とチップ部品４を搬送するチップ搬送部１１２とから構成されている。チップ搬送部１１２は、チップ部品４を吸着保持しながらチップ供給部と仮圧着ヘッド１０７の下方を水平移動するように構成されている。 The chip slider 110 horizontally conveys the chip component 4 from a chip supply unit (not shown) to a position below the temporary pressure bonding head 107. The chip slider 110 includes a slide rail 111 extending from the chip supply unit to the temporary pressure bonding head 107 and a chip transport unit 112 that transports the chip component 4. The chip transport unit 112 is configured to horizontally move below the chip supply unit and the temporary pressure bonding head 107 while sucking and holding the chip component 4.
２視野カメラ１３０は、上下に視野を持つカメラで、仮圧着ヘッド１０７と基板保持ステージ１０２の間に挿入され、回路基板２に設けられた位置合わせマークとチップ部品４に設けられた位置合わせマークを画像認識することが出来るように構成されている。図１では挿入した状態を点線で示した。 The two-view camera 130 is a camera having a vertical view, and is inserted between the temporary pressure bonding head 107 and the substrate holding stage 102, and the alignment mark provided on the circuit board 2 and the alignment mark provided on the chip component 4. Is configured to be capable of image recognition. In FIG. 1, the inserted state is shown by a dotted line.
本圧着部２００は、基台１０１のＹ方向後方に設けられた支持フレーム２０３と、支持フレーム２０３に設けられた回路基板２にチップ部品４を本圧着する加圧手段２０４と、樹脂シート供給機構２１０とから構成されている。スライドレール１２０上に設けられた基板保持ステージ１０２が仮圧着部１００から本圧着部２００に移動可能に構成されている。 The main press-bonding section 200 includes a support frame 203 provided on the rear side of the base 101 in the Y direction, a pressurizing unit 204 for main-pressurizing the chip component 4 to the circuit board 2 provided on the support frame 203, and a resin sheet supply mechanism. And 210. The substrate holding stage 102 provided on the slide rail 120 is configured to be movable from the temporary pressure bonding unit 100 to the main pressure bonding unit 200.
加圧手段２０４は、Ｚ方向に駆動される本圧着ヘッド２０７と、本圧着ヘッド２０７を駆動する昇降手段２０８と、θ方向に駆動する回転手段２０９から構成されている。昇降手段２０８は、サーボモータとボールねじの機構により本圧着ヘッド２０７をＺ方向に駆動するように構成されている。サーボモータとボールねじの構成に限らず、圧空シリンダとピストン又はボイスコイルモータの構成にしても良い。本圧着ヘッド２０７には本圧着ヒータ２２０が組み付けされており、回路基板２に充填された接着剤樹脂６を加熱硬化させることができるようになっている。加圧手段２０４の加圧力は、チップ部品４の電極の数や、回路基板２との電極同士の接触面積に応じて可変できるよう制御される。 The pressing means 204 is composed of a main pressure bonding head 207 driven in the Z direction, an elevating means 208 for driving the main pressure bonding head 207, and a rotating means 209 driving in the θ direction. The elevating means 208 is configured to drive the main pressure bonding head 207 in the Z direction by a mechanism of a servo motor and a ball screw. The configuration is not limited to the servo motor and the ball screw, and may be the configuration of a pneumatic cylinder and a piston or a voice coil motor. A main pressure bonding heater 220 is attached to the main pressure bonding head 207 so that the adhesive resin 6 filled in the circuit board 2 can be heated and cured. The pressing force of the pressurizing unit 204 is controlled so as to be variable according to the number of electrodes of the chip component 4 and the contact area of the electrodes with the circuit board 2.
樹脂シート供給機構２１０は、樹脂シート巻出部２１１および樹脂シート巻取部２１２を構成要素として、樹脂シート巻出部２１１に巻かれたテープ状の樹脂シート２１３を本圧着用アタッチメント２２１とチップ部品４の間に供給した後に樹脂シート巻取部２１２で巻取るものである。樹脂シート供給機構２１０には、樹脂シート巻出部２１１と樹脂シート巻取部２１２以外に、樹脂シート２１３を安定に搬送するためのガイドロール等があってもよい。ここで、樹脂シート２１３としては、柔軟性を有しつつ、耐熱性に優れ、半導体チップに対する防着性にも優れている材料が好ましく、この特性を備えた材料として、ポリテトラフルオロエチレン（ＰＴＦＥ）、テトラフルオロエチレン・パーフルオロアルキルビニルエーテル共重合体（ＰＦＡ）等のフッ素樹脂が好適である。また、厚みとしては、機械的強度を保持しつつもチップ部品４（例えば半導体チップ）への熱伝導性も考慮して２０〜５０μｍ程度が好ましい。 The resin sheet supply mechanism 210 includes a resin sheet unwinding portion 211 and a resin sheet winding portion 212 as constituent elements, and a tape-shaped resin sheet 213 wound around the resin sheet unwinding portion 211 and a main pressure attachment 221 and a chip component. After being supplied during 4 minutes, the resin sheet is wound by the resin sheet winding section 212. In addition to the resin sheet unwinding section 211 and the resin sheet winding section 212, the resin sheet supply mechanism 210 may include a guide roll or the like for stably conveying the resin sheet 213. Here, as the resin sheet 213, a material having flexibility, excellent heat resistance, and excellent adhesion to a semiconductor chip is preferable. As a material having this property, polytetrafluoroethylene (PTFE) is used. ), And fluororesins such as tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA) are suitable. Further, the thickness is preferably about 20 to 50 μm in consideration of the thermal conductivity to the chip component 4 (for example, a semiconductor chip) while maintaining the mechanical strength.
本圧着ヒータ２２０は、チップ部品４を加熱するためのものである。本圧着ヒータ２２０は、カートリッジヒータ２０５から構成され、本圧着ヘッド２０７に組み込まれている。本実施形態において、本圧着ヒータ２２０はカートリッジヒータ２０５から構成されているが、これに限定されるものではなく、セラミックヒータ、ラバーヒータ等、チップ部品４を所定の温度まで加熱することができるものであればよい。 The main pressure bonding heater 220 is for heating the chip component 4. The main pressure bonding heater 220 includes a cartridge heater 205 and is incorporated in the main pressure bonding head 207. In the present embodiment, the main pressure bonding heater 220 is composed of the cartridge heater 205, but is not limited to this, and can heat the chip component 4 to a predetermined temperature, such as a ceramic heater or a rubber heater. If
また、接着剤樹脂６の特性によっては、加熱硬化が急速に進行して接着剤樹脂６の流動性を阻害しバンプと電極の間に接着剤樹脂６が噛み込んでしまって導通不良を起こすため、本圧着開始時には接着剤樹脂６の流動性を良くし硬化が進行しない温度で加圧し、次いで硬化する温度まで上昇させて本圧着する必要があるので、本圧着ヒーター２２０には硬化温度まで昇温したヒーターを開始温度まで冷却させるための、冷却機構が内蔵されている。冷却手段には、空気や窒素、水など、熱を奪うものであればよい。 Further, depending on the characteristics of the adhesive resin 6, heat curing rapidly progresses, which impedes the fluidity of the adhesive resin 6 and causes the adhesive resin 6 to be caught between the bumps and the electrodes, resulting in poor conduction. Since it is necessary to pressurize the adhesive resin 6 at a temperature at which the fluidity of the adhesive resin 6 is good and curing does not proceed at the time of starting the main pressure bonding, and then to raise the temperature to the curing temperature to perform the main pressure bonding, the main pressure bonding heater 220 is heated to the curing temperature. A cooling mechanism is built in to cool the heated heater to the starting temperature. Any cooling means such as air, nitrogen, or water may be used as the cooling means.
本圧着用アタッチメント２２１は、樹脂シート２１３を介してチップ部品４を加圧するものである。本圧着用アタッチメント２２１は、本圧着ヒータ２２０によって加熱されるように構成されている。つまり、本圧着用アタッチメント２２１は、チップ部品４を加圧すると同時に、本圧着ヒータ２２０からの伝熱によって加熱できるように構成されている。なお、仮圧着用アタッチメント１２６と異なり、本圧着用アタッチメント２２１はチップ部品４を吸着保持する必要がないので、吸着穴はなくてもよい。 The main pressure-bonding attachment 221 presses the chip component 4 via the resin sheet 213. The main pressure bonding attachment 221 is configured to be heated by the main pressure bonding heater 220. That is, the main-bonding attachment 221 is configured to pressurize the chip component 4 and at the same time to heat it by heat transfer from the main-bonding heater 220. Unlike the temporary pressure bonding attachment 126, since the main pressure bonding attachment 221 does not need to suction-hold the chip component 4, the suction hole may be omitted.
樹脂シート２１３により、本圧着時にチップ部品４から接着剤樹脂６がはみ出しても本圧着用アタッチメント２２１に付着することがないので、本圧着用アタッチメント２２１は圧着面の外周サイズをチップ部品４よりも大きくすることができる。そのため、チップ部品４の周辺部まで全面に熱を伝えることができ、チップ部品４の外周にはみだした接着剤樹脂６のフィレット形状を安定させ、接合強度を高めることができる。また、チップ部品４を圧着する面の外周サイズを、実装のピッチサイズよりも小さくすることで、隣接チップ部品４間での干渉を抑えて本圧着を行うことができる。なお、本圧着用アタッチメント２２１には、効率よく熱を伝えるために５０Ｗ／ｍＫ以上の熱伝導率を有する材料を用いることが好ましい。 The resin sheet 213 prevents the adhesive resin 6 from sticking out of the chip component 4 from the chip component 4 at the time of the main pressure bonding, so that the main pressure bonding attachment 221 does not adhere to the outer peripheral size of the pressure bonding surface more than the chip component 4. Can be large. Therefore, heat can be transmitted to the entire surface of the chip component 4, and the fillet shape of the adhesive resin 6 protruding to the outer periphery of the chip component 4 can be stabilized and the bonding strength can be increased. Further, by making the outer peripheral size of the surface for crimping the chip component 4 smaller than the pitch size for mounting, it is possible to suppress the interference between the adjacent chip components 4 and perform the main crimping. In addition, it is preferable to use a material having a thermal conductivity of 50 W / mK or more for the main pressure bonding attachment 221 in order to efficiently transfer heat.
本圧着アタッチメント２２１は、本圧着ヒータ２２０と分離されていて脱着できる構成であれば、安価であり、交換することで複数品種に対応できて好ましいが、一体型の構造であってもよい。 The main pressure-bonding attachment 221 is inexpensive as long as it can be detached from the main pressure-bonding heater 220 and can be attached to and detached from the main pressure-bonding heater 220.
制御部１５０は、タッチパネル等の入出力装置、メモリチップやマイクロプロセッサなどを主体とした適当なハードウエア、このハードウエアを動作させるためのプログラムを組み込んだハードディスク装置、及び各構成部とデータ通信を行う適当なインターフェイス回路から構成され、実装装置１の全体制御を行っている。 The control unit 150 performs data communication with input / output devices such as a touch panel, appropriate hardware mainly including a memory chip and a microprocessor, a hard disk device incorporating a program for operating this hardware, and each component. It is composed of an appropriate interface circuit for performing the overall control of the mounting apparatus 1.
回路基板２は、図２に示すように、複数の回路パターン７が設けられ、各回路パターン７には図示しない接着剤樹脂供給手段により、接着剤樹脂６が充填される。接着剤樹脂６を充填する代わりにシート状の熱硬化性シートを回路基板２上に貼り付けても良い。 As shown in FIG. 2, the circuit board 2 is provided with a plurality of circuit patterns 7, and each circuit pattern 7 is filled with the adhesive resin 6 by an adhesive resin supply unit (not shown). Instead of filling the adhesive resin 6, a sheet-shaped thermosetting sheet may be attached on the circuit board 2.
また、チップ部品４の回路面にシート状の熱硬化性シートを貼り付けても良い。チップ部品４の回路面にシート状の熱硬化性シートを予め貼り付けておくことで、接着剤樹脂供給手段及び、接着剤樹脂充填工程が不要になるので望ましい。 Further, a sheet-shaped thermosetting sheet may be attached to the circuit surface of the chip component 4. By adhering a sheet-like thermosetting sheet to the circuit surface of the chip component 4 in advance, the adhesive resin supply means and the adhesive resin filling step are not required, which is desirable.
このような構成の実装装置１を用いて、チップ部品４を回路基板２に実装する実装方法を図３の動作フローチャートを参照しながら以下に説明する。 A mounting method for mounting the chip component 4 on the circuit board 2 using the mounting apparatus 1 having such a configuration will be described below with reference to the operation flowchart of FIG.
まず、回路基板２を基板保持ステージ１０２に吸着保持する（ステップＳＴ０１）。この際、基板保持ステージ１０２は、仮圧着部１００に移動している。２視野カメラ１３０の回路基板２用のカメラで、基板保持ステージ１０２に保持された回路基板２の姿勢補正用マークを認識して、実装ポイント位置を計算する。次いで、図示しない樹脂供給手段の位置に、計算された最初の実装ポイントに接着剤樹脂６を供給するために、基板保持ステージ１０２を移動させる。 First, the circuit board 2 is suction-held on the board-holding stage 102 (step ST01). At this time, the substrate holding stage 102 has moved to the temporary pressure bonding unit 100. The camera for the circuit board 2 of the two-view camera 130 recognizes the attitude correction mark of the circuit board 2 held by the board holding stage 102 and calculates the mounting point position. Next, the substrate holding stage 102 is moved to the position of the resin supply means (not shown) in order to supply the adhesive resin 6 to the calculated first mounting point.
次に、回路基板２の回路パターン７に、チップ部品４が実装される場所の１箇所の回路パターンに接着剤樹脂６を充填する（ステップＳＴ０２）。予めチップ部品４の回路面にシート状の熱硬化性シートが貼り付けられたチップ部品４を使用した場合は、この工程は不要となる。 Next, the circuit board 7 of the circuit board 2 is filled with the adhesive resin 6 at one place where the chip component 4 is mounted (step ST02). When the chip component 4 in which the sheet-shaped thermosetting sheet is attached to the circuit surface of the chip component 4 in advance is used, this step is unnecessary.
次に、チップスライダ１１０がチップ部品４をチップ供給部から仮圧着ヘッド１０７の下側に搬送する（ステップＳＴ０３）。 Next, the chip slider 110 conveys the chip component 4 from the chip supply unit to the lower side of the temporary pressure bonding head 107 (step ST03).
次に、仮圧着ヘッド１０７が下降し、チップスライダ１１０からチップ部品４を受け取る（ステップＳＴ０４）。 Next, the temporary pressure bonding head 107 descends and receives the chip component 4 from the chip slider 110 (step ST04).
次に、チップスライダ１１０がチップ供給部に退避し、チップ部品４と回路基板２の間に２視野カメラ１３０を挿入する。２視野カメラ１３０は、チップ部品４に設けられた位置合わせマークと、所定の回路パターン７に設けられた位置合わせマークとを画像認識する。制御部１５０は、画像認識されたデータに基づき、基板保持ステージ１０２をＸＹ方向、仮圧着ヘッド１０７をθ方向に位置合わせする（ステップＳＴ０５）。 Next, the chip slider 110 is retracted to the chip supply section, and the two-view camera 130 is inserted between the chip component 4 and the circuit board 2. The two-view camera 130 image-recognizes the alignment mark provided on the chip component 4 and the alignment mark provided on the predetermined circuit pattern 7. The control unit 150 aligns the substrate holding stage 102 in the XY directions and the temporary pressure bonding head 107 in the θ direction based on the image-recognized data (step ST05).
次に、２視野カメラ１３０が退避位置に移動し、仮圧着ヘッド１０７が回路基板２側に下降し、チップ部品４が所定の回路パターン７に仮圧着される（ステップＳＴ０６）。仮圧着ヘッド１０７は所定時間、チップ部品４を回路パターン７に加圧した後、上昇する。チップ部品４は樹脂６を介して回路パターン７に仮止めされる。 Next, the two-view camera 130 moves to the retracted position, the temporary pressure bonding head 107 moves down to the circuit board 2 side, and the chip component 4 is temporarily pressure bonded to the predetermined circuit pattern 7 (step ST06). The temporary pressure bonding head 107 presses the chip component 4 against the circuit pattern 7 for a predetermined time and then moves up. The chip component 4 is temporarily fixed to the circuit pattern 7 via the resin 6.
次に、本圧着部２００の本圧着ヘッド２０７の下部に仮圧着されたチップ部品４が来るように、仮圧着部１００で計算された実装ポイント情報に基づき、基板保持ステージ１０２を移動させる（ステップＳＴ０７）。基板保持ステージ１０２に保持された回路基板２の姿勢で、傾きが大きすぎた場合には、本圧着ヘッド２０７を回路基板２の傾きに応じて、回転させるのが望ましい。 Next, the substrate holding stage 102 is moved based on the mounting point information calculated by the temporary pressure bonding unit 100 so that the temporarily pressure-bonded chip component 4 comes under the main pressure bonding head 207 of the main pressure bonding unit 200 (step ST07). When the inclination of the circuit board 2 held by the substrate holding stage 102 is too large, it is desirable to rotate the main pressure bonding head 207 according to the inclination of the circuit board 2.
次に、本圧着ヘッド２０７がチップ部品４が仮圧着されている箇所に下降し、所定の加圧力で加圧および所定の温度で加熱し本圧着を行う（ステップＳＴ０８）。加圧と加熱は、図３に示すように、本圧着ヘッド２０７がチップ部品４に接触すると所定加圧が開始され、所定時間の遅れ（図４のｔ）の後、接着剤樹脂６を熱硬化させる温度までの加熱が行われる。こうすることにより、チップ部品４のバンプ５が回路パターン７に設けられた電極３に所定圧力で加圧された後、バンプ５の周辺の接着剤樹脂６が硬化反応するようになる。そのため、バンプ５と電極３が良好に接合される。接着剤樹脂６の特性によっては、加熱を接着剤樹脂６の硬化温度に加熱された状態で実施すると、バンプ５が所定加圧される前に接着剤樹脂６の硬化反応が開始されるため接触不良を招く問題がある。 Next, the main pressure bonding head 207 descends to a position where the chip component 4 is temporarily pressure bonded, pressurizes at a predetermined pressure and heats at a predetermined temperature to perform the main pressure bonding (step ST08). As shown in FIG. 3, the pressurization and the heating start the predetermined pressurization when the main press bonding head 207 comes into contact with the chip component 4, and heat the adhesive resin 6 after a predetermined time delay (t in FIG. 4). Heating to the temperature for curing is performed. By doing so, after the bump 5 of the chip component 4 is pressed against the electrode 3 provided on the circuit pattern 7 with a predetermined pressure, the adhesive resin 6 around the bump 5 undergoes a curing reaction. Therefore, the bumps 5 and the electrodes 3 are joined well. Depending on the characteristics of the adhesive resin 6, when the heating is carried out while being heated to the curing temperature of the adhesive resin 6, the curing reaction of the adhesive resin 6 is started before the bumps 5 are pressed by a predetermined amount, so that the contact occurs. There is a problem that causes defects.
本圧着部２００で本圧着が行われている間に、仮圧着部１００では、チップスライダ１１０がチップ供給部から次に実装するチップ部品４を仮圧着ヘッド１０７の下側に搬送し、仮圧着ヘッド１０７にチップ部品４が受け渡されている（ステップＳＴ０９）。 While the main pressure bonding unit 200 is performing the main pressure bonding, in the temporary pressure bonding unit 100, the chip slider 110 conveys the chip component 4 to be mounted next from the chip supply unit to the lower side of the temporary pressure bonding head 107 to perform the temporary pressure bonding. The chip component 4 is delivered to the head 107 (step ST09).
次に、本圧着ヘッド２０７が上昇し、基板保持ステージ１０２が本圧着部２００から仮圧着部１００に移動する（ステップＳＴ１０）。 Next, the main pressure bonding head 207 moves up, and the substrate holding stage 102 moves from the main pressure bonding unit 200 to the temporary pressure bonding unit 100 (step ST10).
次に、回路基板２の回路パターン７に次の実装ポイントの回路パターン７に接着剤樹脂６を充填する。貫通電極を用いた３次元実装の場合には、前回実装したチップ部品の上面側の接合される面に接着剤樹脂６を充填する（ステップＳＴ１１）。 Next, the circuit pattern 7 on the circuit board 2 is filled with the adhesive resin 6 on the circuit pattern 7 at the next mounting point. In the case of three-dimensional mounting using the through electrodes, the adhesive resin 6 is filled on the surface to be joined on the upper surface side of the previously mounted chip component (step ST11).
次に、仮圧着ヘッド１０７と基板保持ステージ１０２の間に２視野カメラ１３０を挿入し、次に実装する回路パターン７に設けられた位置合わせマークと仮圧着ヘッド１０７に吸着保持されたチップ部品の位置合わせマークとを画像認識する。制御部１５０は、画像認識されたデータに基づき、基板保持ステージ１０２をＸＹ方向に仮圧着ヘッド１０７をθ方向に位置合わせする（ステップＳＴ１２）。 Next, the two-view camera 130 is inserted between the temporary pressure bonding head 107 and the substrate holding stage 102, and the alignment mark provided on the circuit pattern 7 to be mounted next and the chip component sucked and held by the temporary pressure bonding head 107 are attached. Image recognition of the alignment mark. The control unit 150 positions the substrate holding stage 102 in the XY directions and the temporary pressure bonding head 107 in the θ direction based on the image-recognized data (step ST12).
次に、２視野カメラ１３０が退避位置に移動し、仮圧着ヘッド１０７が回路基板２側に下降し、チップ部品４が所定の回路パターン７に仮圧着される（ステップＳＴ１３）。仮圧着ヘッド１０７は所定時間、チップ部品４を回路パターン７に加圧した後、上昇する。チップ部品４は接着剤樹脂６を介して回路パターン７に仮止めされる。 Next, the two-view camera 130 moves to the retracted position, the temporary pressure bonding head 107 moves down to the circuit board 2 side, and the chip component 4 is temporarily pressure bonded to the predetermined circuit pattern 7 (step ST13). The temporary pressure bonding head 107 presses the chip component 4 against the circuit pattern 7 for a predetermined time and then moves up. The chip component 4 is temporarily fixed to the circuit pattern 7 via the adhesive resin 6.
仮圧着部１００で仮圧着が行われている間、本圧着部２００の本圧着ヘッド２０７の冷却が行われる（ステップＳＴ１４）。 While the temporary pressure bonding part 100 is performing the temporary pressure bonding, the main pressure bonding head 207 of the main pressure bonding part 200 is cooled (step ST14).
次に、ステップＳＴ０７以降の動作が繰り返され、回路基板２のすべての回路パターン７にチップ部品４が仮圧着および本圧着されると回路基板２が実装装置１から排出される（ステップＳＴ１５）。 Next, the operations after step ST07 are repeated, and the circuit board 2 is ejected from the mounting apparatus 1 when the chip components 4 are temporarily and permanently pressure-bonded to all the circuit patterns 7 of the circuit board 2 (step ST15).
このように、仮圧着が行われる毎に、基板保持ステージ１０２を仮圧着部１００から本圧着部２００に移動し本圧着を行っているので、個々の回路パターン７の接着剤樹脂６は加熱による硬化反応が完了してるので、隣接する回路パターン７で本圧着が行われても、熱の伝導による硬化反応はなくなる。 In this way, every time the temporary pressure bonding is performed, the substrate holding stage 102 is moved from the temporary pressure bonding portion 100 to the main pressure bonding portion 200 to perform the main pressure bonding, so that the adhesive resin 6 of each circuit pattern 7 is heated. Since the curing reaction is completed, even if the main pressure bonding is performed in the adjacent circuit pattern 7, the curing reaction due to the conduction of heat disappears.
また、仮圧着中に本圧着部２００の本圧着ヒータ２２０の冷却が行われ、本圧着中に仮圧着部１００のチップ部品４の搬送が行われているので、タクトタイムを短縮し効率よい生産を行うことができる。 Further, since the main pressure bonding heater 220 of the main pressure bonding unit 200 is cooled during the temporary pressure bonding and the chip component 4 of the temporary pressure bonding unit 100 is transported during the main pressure bonding, the takt time is shortened and efficient production is performed. It can be performed.
また、一旦、基板保持ステージ１０２に吸着保持した回路基板２はすべての工程が完了するまで取り外されることがないので、回路基板２の搬送にともなう置き換えなどによるチップ部品４の位置ずれを防止することができる。 Further, since the circuit board 2 once sucked and held on the board holding stage 102 is not removed until all the steps are completed, it is possible to prevent the displacement of the chip component 4 due to the replacement or the like accompanying the transfer of the circuit board 2. You can
次に、本発明の実施の形態２について図５を参照しながら説明する。なお、実施の形態１と同様の機能を有する部材は符号を同一にして説明する。図５に示す実装装置５００は、基板保持ステージ１０２が、位置調整手段１０６を介して基台１０１に固定されている。基台１０１には門方フレーム３００が立設している。門方フレーム３００には、仮圧着用の加圧手段１０４が水平移動するスライドレール３０１と、本圧着用の加圧手段２０４が水平移動するスライドレール３０２が設けられている。基板保持ステージ１０２上を作業位置とし、加圧手段１０４および加圧手段２０４は、サーボモータとボールねじの機構により作業位置と退避位置とを移動できるようになっている。チップ部品４をチップ供給部から搬送してきたチップスライダ１１０は、加圧手段１０４の退避位置でチップ部品４の仮圧着ヘッド１０７への受け渡しを行うようになっている。２視野カメラ１３０は、基板保持ステージ１０２上に挿入可能に構成されている。樹脂シート供給機構２１０は図示しないが、基板保持ステージ１０２上に挿入可能に構成されている。 Next, a second embodiment of the present invention will be described with reference to FIG. The members having the same functions as those in the first embodiment will be described with the same reference numerals. In the mounting apparatus 500 shown in FIG. 5, the substrate holding stage 102 is fixed to the base 101 via the position adjusting means 106. A gate frame 300 is erected on the base 101. The gate frame 300 is provided with a slide rail 301 on which the pressure means 104 for temporary pressure bonding moves horizontally and a slide rail 302 on which the pressure means 204 for main pressure bonding moves horizontally. The working position is on the substrate holding stage 102, and the pressing means 104 and the pressing means 204 can be moved between the working position and the retracted position by the mechanism of the servo motor and the ball screw. The chip slider 110, which has carried the chip component 4 from the chip supply unit, transfers the chip component 4 to the temporary pressure bonding head 107 at the retracted position of the pressing means 104. The two-view camera 130 is configured to be insertable on the substrate holding stage 102. Although not shown, the resin sheet supply mechanism 210 is configured to be insertable on the substrate holding stage 102.
このような実装装置５００を用いて、チップ部品４を回路基板２に実装する実装方法を図６の動作フローチャートを参照しながら以下に説明する。 A mounting method for mounting the chip component 4 on the circuit board 2 using such a mounting apparatus 500 will be described below with reference to the operation flowchart of FIG.
まず、回路基板２を基板保持ステージ１０２に吸着保持する（ステップＳＴ５１）。 First, the circuit board 2 is suction-held on the board-holding stage 102 (step ST51).
次に、回路基板２の回路パターン７にチップ部品４が実装される場所の１箇所の回路パターン７に接着剤樹脂６を充填する（ステップＳＴ５２）。予めチップ部品４の回路面にシート状の熱硬化性シートが貼り付けられたチップ部品４を使用した場合は、この工程は不要となる。 Next, the adhesive resin 6 is filled in the circuit pattern 7 at one place where the chip component 4 is mounted on the circuit pattern 7 of the circuit board 2 (step ST52). When the chip component 4 in which the sheet-shaped thermosetting sheet is attached to the circuit surface of the chip component 4 in advance is used, this step is unnecessary.
次に、チップスライダ１１０がチップ部品４をチップ供給部から退避位置に移動した仮圧着ヘッド１０７の下側に搬送する（ステップＳＴ５３）。 Next, the chip slider 110 conveys the chip component 4 from the chip supply unit to the lower side of the temporary pressure bonding head 107 moved to the retracted position (step ST53).
次に、仮圧着ヘッド１０７が下降し、チップスライダ１１０からチップ部品４を受け取る（ステップＳＴ５４）。 Next, the temporary pressure bonding head 107 descends and receives the chip component 4 from the chip slider 110 (step ST54).
次に、仮圧着ヘッド１０７が基板保持ステージ１０２上に移動する（ステップＳＴ５５）。 Next, the temporary pressure bonding head 107 moves onto the substrate holding stage 102 (step ST55).
次に、チップ部品４と回路基板２の間に２視野カメラ１３０を挿入する。２視野カメラ１３０は、チップ部品４に設けられた位置合わせマークと、所定の回路パターン７に設けられた位置合わせマークとを画像認識する。制御部１５０は、画像認識されたデータに基づき、基板保持ステージ１０２をＸＹ方向に仮圧着ヘッド１０７をθ方向に位置合わせする（ステップＳＴ５６）。 Next, the two-view camera 130 is inserted between the chip component 4 and the circuit board 2. The two-view camera 130 image-recognizes the alignment mark provided on the chip component 4 and the alignment mark provided on the predetermined circuit pattern 7. The controller 150 positions the substrate holding stage 102 in the XY directions and the temporary pressure bonding head 107 in the θ direction based on the image-recognized data (step ST56).
次に、２視野カメラ１３０が退避位置に移動し、仮圧着ヘッド１０７が回路基板２側に下降し、チップ部品４が所定の回路パターン７に仮圧着される（ステップＳＴ５７）。仮圧着ヘッド１０７は所定時間、チップ部品４を回路パターン７に加圧した後、上昇する。チップ部品４は接着剤樹脂６を介して回路パターン７に仮止めされる。 Next, the two-view camera 130 moves to the retracted position, the temporary pressure bonding head 107 moves down to the circuit board 2 side, and the chip component 4 is temporarily pressure bonded to the predetermined circuit pattern 7 (step ST57). The temporary pressure bonding head 107 presses the chip component 4 against the circuit pattern 7 for a predetermined time and then moves up. The chip component 4 is temporarily fixed to the circuit pattern 7 via the adhesive resin 6.
次に、仮圧着ヘッド１０７が退避位置に移動し、本圧着用の本圧着ヘッド２０７が基板保持ステージ１０２上に移動する（ステップＳＴ５８）。 Next, the temporary pressure bonding head 107 moves to the retracted position, and the main pressure bonding head 207 for main pressure bonding moves to the substrate holding stage 102 (step ST58).
次に、本圧着ヘッド２０７がチップ部品４が仮圧着されている箇所に下降し、所定の加圧力で加圧および所定の温度で加熱し本圧着を行う（ステップＳＴ５９）。加圧と加熱は、実装装置１と同じように図３に示すプロファイルで行われる。 Next, the main pressure bonding head 207 descends to a position where the chip component 4 is temporarily pressure bonded, pressurizes at a predetermined pressure and heats at a predetermined temperature to perform the main pressure bonding (step ST59). Pressurization and heating are performed according to the profile shown in FIG.
本圧着ヘッド２０７で本圧着が行われている間に、チップスライダ１１０がチップ供給部から次に実装するチップ部品４を仮圧着ヘッド１０７の下側に搬送し、仮圧着ヘッド１０７にチップ部品４が受け渡されている（ステップＳＴ６０）。 While the main pressure bonding head 207 is performing the main pressure bonding, the chip slider 110 conveys the chip component 4 to be mounted next from the chip supply unit to the lower side of the temporary pressure bonding head 107, and the temporary pressure bonding head 107 transfers the chip component 4 to the chip component 4. Has been delivered (step ST60).
次に、本圧着ヘッド２０７が上昇し、基板保持ステージ１０２上から本圧着ヘッド２０７が退避位置に移動する（ステップＳＴ６１）。 Next, the main pressure bonding head 207 moves up, and the main pressure bonding head 207 moves from the substrate holding stage 102 to the retracted position (step ST61).
次に、仮圧着ヘッド１０７がチップ部品４を保持した状態で基板保持ステージ１０２上に移動する（ステップＳＴ６２）。 Next, the temporary pressure bonding head 107 moves onto the substrate holding stage 102 while holding the chip component 4 (step ST62).
次に、回路基板２の次の実装ポイントの回路パターン７に接着剤樹脂６を充填する。貫通電極を用いた３次元実装の場合には、前回実装したチップ部品の上面側の接合される面に接着剤樹脂６を充填する（ステップＳＴ６３）。 Next, the circuit pattern 7 at the next mounting point on the circuit board 2 is filled with the adhesive resin 6. In the case of the three-dimensional mounting using the through electrodes, the adhesive resin 6 is filled on the surface to be joined on the upper surface side of the previously mounted chip component (step ST63).
次に、チップ部品４と回路基板２の間に２視野カメラ１３０を挿入する。２視野カメラ１３０は、チップ部品４に設けられた位置合わせマークと、所定の回路パターン７に設けられた位置合わせマークとを画像認識する。制御部１５０は、画像認識されたデータに基づき、基板保持ステージ１０２をＸＹ方向に仮圧着ヘッド１０７をθ方向に位置合わせする（ステップＳＴ６４）。 Next, the two-view camera 130 is inserted between the chip component 4 and the circuit board 2. The two-view camera 130 image-recognizes the alignment mark provided on the chip component 4 and the alignment mark provided on the predetermined circuit pattern 7. The control unit 150 positions the substrate holding stage 102 in the XY directions and the temporary pressure bonding head 107 in the θ direction based on the image-recognized data (step ST64).
次に、２視野カメラ１３０が退避位置に移動し、仮圧着ヘッド１０７が回路基板２側に下降し、チップ部品４が所定の回路パターン７に仮圧着される（ステップＳＴ６５）。仮圧着ヘッド１０７は所定時間、チップ部品４を回路パターン７に加圧した後、上昇する。チップ部品４は接着剤樹脂６を介して回路パターン７に仮止めされる。 Next, the two-view camera 130 is moved to the retracted position, the temporary pressure bonding head 107 is lowered to the circuit board 2 side, and the chip component 4 is temporarily pressure bonded to the predetermined circuit pattern 7 (step ST65). The temporary pressure bonding head 107 presses the chip component 4 against the circuit pattern 7 for a predetermined time and then moves up. The chip component 4 is temporarily fixed to the circuit pattern 7 via the adhesive resin 6.
仮圧着が行われている間、本圧着ヘッド２０７の冷却が行われる（ステップＳＴ６６）。 While the temporary pressure bonding is being performed, the main pressure bonding head 207 is cooled (step ST66).
次に、ステップＳＴ５８以降の動作が繰り返され、回路基板２のすべての回路パターン７にチップ部品４が仮圧着および本圧着されると回路基板２が実装装置５００から排出される（ステップＳＴ６７）。 Next, the operations after step ST58 are repeated, and the circuit board 2 is ejected from the mounting apparatus 500 when the chip components 4 are provisionally pressure-bonded and finally pressure-bonded to all the circuit patterns 7 of the circuit board 2 (step ST67).
このように、基板保持ステージ１０２上に仮圧着ヘッド１０７と本圧着ヘッド２０７を交互に移動し仮圧着と本圧着を行っているので、個々の回路パターン７の接着剤樹脂６は加熱による硬化反応が完了してるので、隣接する回路パターン７で本圧着が行われても、熱の伝導による硬化反応はなくなる。 In this way, since the temporary pressure bonding head 107 and the main pressure bonding head 207 are alternately moved on the substrate holding stage 102 to perform the temporary pressure bonding and the main pressure bonding, the adhesive resin 6 of each circuit pattern 7 is cured by heating. Therefore, even if the main pressure bonding is performed on the adjacent circuit pattern 7, the curing reaction due to the conduction of heat disappears.
また、仮圧着中に本圧着部２００の本圧着ヒータ２２０の冷却が行われ、本圧着中に仮圧着部１００のチップ部品４の搬送が行われているので、タクトタイムを短縮し効率よい生産を行うことができる。 Further, since the main pressure bonding heater 220 of the main pressure bonding unit 200 is cooled during the temporary pressure bonding and the chip component 4 of the temporary pressure bonding unit 100 is transported during the main pressure bonding, the takt time is shortened and efficient production is performed. It can be performed.
さらに、貫通電極を用いた３次元実装の場合には連続して仮圧着動作を行うことで、本圧着時間と本圧着ヒータ２２０の冷却時間を無駄なく使えるので、効率よい生産を行うことができる。 Further, in the case of three-dimensional mounting using the through electrodes, by performing the temporary pressure bonding operation continuously, the main pressure bonding time and the cooling time of the main pressure bonding heater 220 can be used without waste, so that efficient production can be performed. ..
また、一旦、基板保持ステージ１０２に吸着保持した回路基板２はすべての工程が完了するまで取り外されることがないので、回路基板２の搬送にともなう置き換えなどによるチップ部品４の位置ずれを防止することができる。 Further, since the circuit board 2 once sucked and held on the board holding stage 102 is not removed until all the steps are completed, it is possible to prevent the displacement of the chip component 4 due to the replacement or the like accompanying the transfer of the circuit board 2. You can
次に、本発明の実施の形態３について図７を参照しながら説明する。図７は実施の形態１または実施の形態２の実装装置１，５００の本圧着ヘッド２０７の形状を示したものである。本圧着ヘッド２０７は、複数のチップ部品４を一括して本圧着できるようにヘッドの幅を大きくしている。このような本圧着ヘッド２０７を用いることにより、仮圧着作業を複数のチップ部品４に行った後、本圧着を行うことができるので生産効率を大幅に向上することができる。 Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 7 shows the shape of the main pressure bonding head 207 of the mounting apparatus 1,500 of the first or second embodiment. The main pressure bonding head 207 has a large head width so that a plurality of chip components 4 can be collectively main pressure bonded. By using such a main pressure bonding head 207, it is possible to perform the main pressure bonding after the temporary pressure bonding work is performed on the plurality of chip components 4, so that the production efficiency can be significantly improved.
また、本圧着ヘッド２０７に設けられた本圧着ヒータ２２０の冷却を毎チップ部品４行う場合に比べて、本圧着ヒータ２２０の冷却を複数のチップ部品４の実装毎に１回の冷却動作にできるため確実に冷却することができる。 Further, as compared with the case where the main pressure bonding heater 220 provided on the main pressure bonding head 207 is cooled for each chip component 4, the main pressure bonding heater 220 can be cooled once for each mounting of a plurality of chip components 4. Therefore, it can be surely cooled.
また、本圧着ヘッド２０７の加圧力を複数のチップ部品４の数量に応じて加圧力を可変するようにすると、回路パターン７の不良により仮圧着されなかった回路パターン７が本圧着の圧着箇所に含まれていても、個々のチップ部品４には適正な加圧を行うことができる。また、回路基板２がウエハなど円形の形状の場合、外周部の複数の回路パターン７を本圧着する際に、チップ部品４の数に応じて加圧力を可変することができるので加圧不良を発生させない。 Further, when the pressure applied by the main pressure bonding head 207 is varied according to the number of the plurality of chip components 4, the circuit pattern 7 that was not temporarily pressure bonded due to a defect in the circuit pattern 7 becomes the pressure bonding portion of the main pressure bonding. Even if it is included, the proper pressure can be applied to each chip component 4. Further, when the circuit board 2 has a circular shape such as a wafer, the pressurizing force can be varied according to the number of the chip components 4 when the plurality of circuit patterns 7 on the outer peripheral portion are permanently pressure-bonded, so that the pressurization failure is prevented. Do not generate.
次に、本発明の実施の形態４について図８を参照しながら説明する。図８は実施の形態１または実施の形態２の実装装置１，５００の基板保持ステージ１０２で回路基板２に複数のチップ部品４を積層した場合を説明する図である。チップ部品４は仮圧着状態で順次積層され、所定の積層数まで仮圧着が完了すると、本圧着工程へと移動し加圧および加熱が行われる。このように、仮圧着状態で積層した後、本圧着することで上記、実施の形態１および実施の形態２の効果と同様の効果が得られる。 Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a diagram illustrating a case where a plurality of chip components 4 are stacked on the circuit board 2 by the board holding stage 102 of the mounting apparatus 1,500 of the first or second embodiment. The chip components 4 are sequentially stacked in the temporary pressure bonding state, and when the temporary pressure bonding is completed up to a predetermined number of layers, the chip components 4 are moved to the final pressure bonding step and pressure and heating are performed. As described above, the effects similar to those of the above-described first and second embodiments are obtained by performing the final pressure-bonding after stacking in the temporary pressure-bonding state.
１ 実装装置
２ 回路基板
３ 電極
４ チップ部品
５ バンプ
６ 接着剤樹脂
７ 回路パターン
１００ 仮圧着部
１０１ 基台
１０２ 基板保持ステージ
１０３ 支持フレーム
１０４ 加圧手段
１０５ ステージヒータ
１０６ 位置調整手段
１０７ 仮圧着ヘッド
１０８ 昇降手段
１０９ 回転手段
１１０ チップスライダ
１１１ スライドレール
１１２ チップ搬送部
１２０ スライドレール
１２１ リニアガイド
１２５ 仮圧着ヒータ
１２６ 仮圧着用アタッチメント
１３０ ２視野カメラ
１５０ 制御部
２００ 本圧着部
２０３ 支持フレーム
２０４ 加圧手段
２０５ カートリッジヒータ
２０７ 本圧着ヘッド
２０８ 昇降手段
２０９ 回転手段
２１０ 樹脂シート供給機構
２１１ 樹脂シート巻出部
２１２ 樹脂シート巻取部
２１３ 樹脂シート
２２０ 本圧着ヒータ
２２１ 本圧着用アタッチメント
３００ 門方フレーム
３０１ スライドレール
３０２ スライドレール
５００ 実装装置
1 Mounting Device 2 Circuit Board 3 Electrode 4 Chip Component 5 Bump 6 Adhesive Resin 7 Circuit Pattern 100 Temporary Crimping Section 101 Base 102 Substrate Holding Stage 103 Support Frame 104 Pressurizing Means 105 Stage Heater 106 Position Adjusting Means 107 Temporary Crimping Head 108 Elevating means 109 Rotating means 110 Chip slider 111 Slide rail 112 Chip conveying section 120 Slide rail 121 Linear guide 125 Temporary pressure bonding heater 126 Temporary pressure bonding attachment 130 Two-view camera 150 Control section 200 Main pressure bonding section 203 Support frame 204 Pressurizing means 205 Cartridge Heater 207 Main pressure bonding head 208 Elevating means 209 Rotating means 210 Resin sheet supply mechanism 211 Resin sheet unwinding section 212 Resin sheet winding section 213 Resin sheet 220 Main pressure The heater 221 present crimping attachment 300 Gate side frame 301 slide rail 302 slide rail 500 mounting device
Claims (7)
チップ部品と回路基板に設けられた回路パターンの位置合わせを行って、チップ部品を回路パターンに仮圧着する仮圧着ヘッドと、
仮圧着されたチップ部品を加熱および加圧し接着剤樹脂を加熱硬化してチップ部品を回路パターンに本圧着する本圧着ヘッドと、
回路基板を保持する基板保持ステージと、
前記チップ部品を前記仮圧着ヘッドに受け渡すチップ供給手段と、
基板保持ステージを回路基板が保持された状態で、仮圧着ヘッドが設けられた仮圧着部と本圧着ヘッドが設けられた本圧着部との間を交互に移動する機構とを備え、
チップ部品を回路パターンに仮圧着した後、基板保持ステージを仮圧着ヘッドの下側から本圧着ヘッドの下側に移動してチップ部品を回路パターンに本圧着を行うとともに、
前記本圧着と並行して前記チップ供給手段が前記仮圧着ヘッドにチップ部品を受け渡す機能を有する制御部を備えた実装装置。 A mounting device for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A temporary crimping head for temporarily crimping the chip component to the circuit pattern by aligning the chip component and the circuit pattern provided on the circuit board,
A main pressure bonding head that heats and pressurizes the temporarily bonded chip component to heat and cure the adhesive resin to perform final pressure bonding of the chip component to the circuit pattern,
A substrate holding stage for holding a circuit board,
A chip supply means for delivering the chip component to the temporary pressure bonding head,
In a state where the circuit board is held on the substrate holding stage, a mechanism that alternately moves between the temporary pressure bonding portion provided with the temporary pressure bonding head and the main pressure bonding portion provided with the main pressure bonding head,
After temporarily crimping the chip component to the circuit pattern, move the substrate holding stage from the lower side of the temporary pressure bonding head to the lower side of the main pressure bonding head to perform the main pressure bonding of the chip component to the circuit pattern.
A mounting device provided with a control unit having a function of transferring the chip component to the temporary pressure bonding head in parallel with the main pressure bonding.
チップ部品と回路基板に設けられた回路パターンの位置合わせを行って、チップ部品を回路パターンに仮圧着する仮圧着ヘッドと、
仮圧着されたチップ部品を加熱および加圧し接着剤樹脂を加熱硬化してチップ部品を回路パターンに本圧着する本圧着ヘッドと、
回路基板を保持する基板保持ステージと、
前記チップ部品を前記仮圧着ヘッドに受け渡すチップ供給手段と、
仮圧着ヘッドと本圧着ヘッドを基板保持ステージ上に交互に移動させる機構とを備え、
基板保持ステージ上に仮圧着ヘッドを移動し仮圧着を行った後、基板保持ステージ上に本圧着ヘッドを移動し本圧着を行うとともに、
前記本圧着と並行して前記チップ供給手段が前記仮圧着ヘッドにチップ部品を受け渡す機能を有する制御部を備えた実装装置。 A mounting device for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A temporary crimping head for temporarily crimping the chip component to the circuit pattern by aligning the chip component and the circuit pattern provided on the circuit board,
A main pressure bonding head that heats and pressurizes the temporarily bonded chip component to heat and cure the adhesive resin to perform final pressure bonding of the chip component to the circuit pattern,
A substrate holding stage for holding a circuit board,
A chip supply means for delivering the chip component to the temporary pressure bonding head,
A mechanism for alternately moving the temporary pressure bonding head and the main pressure bonding head on the substrate holding stage,
After moving the temporary pressure bonding head onto the substrate holding stage to perform temporary pressure bonding, move the main pressure bonding head onto the substrate holding stage to perform main pressure bonding, and
A mounting device provided with a control unit having a function of transferring the chip component to the temporary pressure bonding head in parallel with the main pressure bonding.
前記チップ部品と前記本圧着ヘッドの間に樹脂シートを供給する樹脂シート供給機構を更に備え、
前記本圧着ヘッドの先端部に、圧着面の外周サイズが前記チップ部品よりも大きい本圧着用アタッチメントを有し、
前記本圧着アタッチメントが前記樹脂シートを介して前記チップ部品を加圧する実装装置。 In the invention of claim 1 or 2,
Further comprising a resin sheet supply mechanism for supplying a resin sheet between the chip component and the main pressure bonding head,
The tip of the main pressure bonding head has a main pressure bonding attachment in which the outer peripheral size of the pressure bonding surface is larger than the chip component,
A mounting device in which the main pressure-bonding attachment pressurizes the chip component via the resin sheet.
前記本圧着ヘッドが複数のチップ部品を一括で加熱および加圧する本圧着アタッチメントを備えた実装装置。 In the invention of claim 1 or 2,
A mounting apparatus in which the main pressure bonding head includes a main pressure bonding attachment for collectively heating and pressing a plurality of chip components.
前記本圧着ヘッドの加圧力を制御する前記制御部が加圧される複数のチップ部品の数量に応じて加圧力を可変する機能を有した実装装置。 In the invention of claim 4,
A mounting apparatus having a function of varying the pressure depending on the number of a plurality of chip components to be pressed by the control unit that controls the pressure of the main pressure bonding head.
チップ部品と回路基板に設けられた回路パターンの位置合わせを行って、チップ部品を回路パターンに仮圧着ヘッドを用いて仮圧着工程と、
仮圧着されたチップ部品を加熱および加圧し接着剤樹脂を加熱硬化してチップ部品を回路パターンに本圧着ヘッドを用いて本圧着工程とを有し、
回路基板を保持する基板保持ステージを、仮圧着ヘッドの下側に配置する仮圧着工程と、本圧着ヘッドの下側に配置する本圧着工程とを交互に行い、前記回路基板のすべての回路パターンにチップ部品を仮圧着および本圧着してから回路基板の取り出しを行うものであり、
前記本圧着工程と並行して前記仮圧着ヘッドにチップ部品が受け渡されることを特徴とする実装方法。 A mounting method for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
The chip parts are aligned with the circuit pattern provided on the circuit board, and the chip parts are formed on the circuit pattern using a temporary pressure bonding head.
The chip component that has been temporarily pressure bonded is heated and pressed to heat and cure the adhesive resin, and the chip component is formed into a circuit pattern using a main pressure bonding head.
All the circuit patterns of the circuit board are obtained by alternately performing a temporary pressure bonding step of arranging the substrate holding stage for holding the circuit board under the temporary pressure bonding head and a main pressure bonding step of arranging the circuit board under the main pressure bonding head. The circuit board is taken out after the chip parts are temporarily crimped and fully crimped.
A mounting method, wherein a chip component is delivered to the temporary pressure bonding head in parallel with the main pressure bonding step.
チップ部品と回路基板に設けられた回路パターンの位置合わせを行って、チップ部品を回路パターンに仮圧着ヘッドを用いて仮圧着工程と、
仮圧着されたチップ部品を加熱および加圧し接着剤樹脂を加熱硬化してチップ部品を回路パターンに本圧着ヘッドを用いて本圧着工程とを有し、
回路基板を保持する基板保持ステージ上に、仮圧着ヘッドを配置する仮圧着工程と、本圧着ヘッドを配置する本圧着工程とを交互に行い、回路基板のすべての回路パターンにチップ部品を仮圧着および本圧着してから回路基板の取り出しを行うものであり、
前記本圧着工程と並行して前記仮圧着ヘッドにチップ部品が受け渡されることを特徴とする実装方法。 A mounting method for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
The chip parts are aligned with the circuit pattern provided on the circuit board, and the chip parts are formed on the circuit pattern using a temporary pressure bonding head.
The chip component that has been temporarily pressure bonded is heated and pressed to heat and cure the adhesive resin, and the chip component is formed into a circuit pattern using a main pressure bonding head.
On the substrate holding stage that holds the circuit board, the temporary crimping step of placing the temporary crimping head and the main crimping step of placing the main crimping head are alternately performed, and the chip components are temporarily crimped to all the circuit patterns on the circuit board. And after the main crimping, the circuit board is taken out.
A mounting method, wherein a chip component is delivered to the temporary pressure bonding head in parallel with the main pressure bonding step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019184871A JP7083795B2 (en) | 2019-10-08 | 2019-10-08 | Mounting device and mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019184871A JP7083795B2 (en) | 2019-10-08 | 2019-10-08 | Mounting device and mounting method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015030664A Division JP6602022B2 (en) | 2015-02-19 | 2015-02-19 | Mounting apparatus and mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020074384A true JP2020074384A (en) | 2020-05-14 |
| JP7083795B2 JP7083795B2 (en) | 2022-06-13 |
Family
ID=70610257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019184871A Active JP7083795B2 (en) | 2019-10-08 | 2019-10-08 | Mounting device and mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7083795B2 (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168146A (en) * | 1999-12-09 | 2001-06-22 | Sony Corp | Component mounting machine and component mounting method |
| JP2007067175A (en) * | 2005-08-31 | 2007-03-15 | Renesas Technology Corp | Method of manufacturing semiconductor device |
| JP2011061073A (en) * | 2009-09-11 | 2011-03-24 | Toshiba Corp | Method of manufacturing semiconductor device and semiconductor device |
| JP2012099635A (en) * | 2010-11-02 | 2012-05-24 | Shibaura Mechatronics Corp | Chip laminating device and laminating method |
| WO2013133015A1 (en) * | 2012-03-07 | 2013-09-12 | 東レ株式会社 | Method and apparatus for manufacturing semiconductor device |
| JP2013232667A (en) * | 2013-06-27 | 2013-11-14 | Toray Eng Co Ltd | Mounting device and mounting method |
| JP2014060241A (en) * | 2012-09-18 | 2014-04-03 | Toray Ind Inc | Semiconductor device manufacturing method |
| JP2014236021A (en) * | 2013-05-30 | 2014-12-15 | 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． | Semiconductor chip junction device and semiconductor chip junction method |
-
2019
- 2019-10-08 JP JP2019184871A patent/JP7083795B2/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168146A (en) * | 1999-12-09 | 2001-06-22 | Sony Corp | Component mounting machine and component mounting method |
| JP2007067175A (en) * | 2005-08-31 | 2007-03-15 | Renesas Technology Corp | Method of manufacturing semiconductor device |
| JP2011061073A (en) * | 2009-09-11 | 2011-03-24 | Toshiba Corp | Method of manufacturing semiconductor device and semiconductor device |
| JP2012099635A (en) * | 2010-11-02 | 2012-05-24 | Shibaura Mechatronics Corp | Chip laminating device and laminating method |
| WO2013133015A1 (en) * | 2012-03-07 | 2013-09-12 | 東レ株式会社 | Method and apparatus for manufacturing semiconductor device |
| JP2014060241A (en) * | 2012-09-18 | 2014-04-03 | Toray Ind Inc | Semiconductor device manufacturing method |
| JP2014236021A (en) * | 2013-05-30 | 2014-12-15 | 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． | Semiconductor chip junction device and semiconductor chip junction method |
| JP2013232667A (en) * | 2013-06-27 | 2013-11-14 | Toray Eng Co Ltd | Mounting device and mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7083795B2 (en) | 2022-06-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7938929B2 (en) | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | |
| KR20120109963A (en) | Bonding apparatus and bonding method | |
| JP5401709B2 (en) | Bonding apparatus and bonding method for semiconductor device | |
| CN107210239B (en) | Mounting device and mounting method | |
| JP6602022B2 (en) | Mounting apparatus and mounting method | |
| US10847434B2 (en) | Method of manufacturing semiconductor device, and mounting apparatus | |
| WO2015133446A1 (en) | Crimp head, and mounting device and mounting method using same | |
| JP6639915B2 (en) | Semiconductor mounting apparatus and semiconductor mounting method | |
| KR20230043978A (en) | Mounting device and mounting method | |
| JP7083795B2 (en) | Mounting device and mounting method | |
| KR102372519B1 (en) | mounting device | |
| JP5098939B2 (en) | Bonding apparatus and bonding method | |
| JP2003297879A (en) | Semiconductor chip press-fixing device | |
| WO2014065199A1 (en) | Bonding tool cooling apparatus and bonding tool cooling method | |
| JP2009004462A (en) | Method of mounting semiconductor device | |
| WO2016125763A1 (en) | Mounting device and mounting method | |
| JP2002141373A (en) | Method and apparatus for mounting semiconductor | |
| JP7023700B2 (en) | Mounting device and mounting method | |
| JP7398612B2 (en) | Semiconductor device manufacturing system and semiconductor device manufacturing method | |
| JP2003133707A (en) | Method and apparatus for placing electronic component | |
| JP2018137262A (en) | Mounting device and mounting method | |
| JP6461822B2 (en) | Semiconductor device mounting method and mounting apparatus | |
| JP2004259917A (en) | Bonding method and device thereof | |
| JP4377402B2 (en) | Component mounting method and apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191008 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200910 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200929 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201119 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210416 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210609 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211102 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211217 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220517 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220601 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7083795 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |