KR20080069764A - Apparatus and method for component compression of liquid crystal panel - Google Patents

Abstract

An apparatus and a method for compressing parts of an LCD(Liquid Crystal Display) panel are provided to bond different parts on the LCD panel through one heating and compressing apparatus respectively, thereby shortening a bonding time and a process time. An LCD panel includes a liquid crystal layer formed between a lower substrate(11) and an upper substrate(12). An ACF(Anisotropic Conductive Film)(31) is attached on the lower substrate of the LCD panel. A driving chip(32) and a flexible substrate(33) are respectively mounted on mounting positions of the ACF. A heating and compressing head(50) has a first compressing part(51) and a second compressing part(52) corresponding to the driving chip and the flexible substrate. The heating and compressing head heats and compresses the driving chip and the flexible substrate by using the first compressing part and the second compressing part.

Description

Apparatus and method for component compression of liquid crystal panel

1 is a side cross-sectional view of a liquid crystal panel.

2 is a side cross-sectional view showing a component pressing device of a liquid crystal panel according to an exemplary embodiment of the present invention.

3 is a block diagram of a heat compression apparatus according to an embodiment of the present invention.

4 is a view illustrating a method of compressing parts of a liquid crystal panel according to an exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10 liquid crystal panel 11 lower substrate

12: upper substrate 31: anisotropic conductive film

32: driving chip 33: flexible substrate

50: heating crimp head 51,52: crimping portion

60: heating crimp device 61: base

62: cylinder 63: vertical movement frame

64: adjusting lever 65: stage

66: head stopper

The present invention relates to an apparatus and method for crimping parts of liquid crystal panels.

The coupling between the lead line of the semiconductor chip or the liquid crystal display and the connection portion of the driving circuit thereof forms a bump or uses a carrier tape. However, this method is inadequate to form more detailed connecting portions. Thus, an anisotropic conductive film capable of improving this has become widely used as a material for electrically connecting electronic components such as semiconductor devices and circuit boards.

The use of anisotropic conductive films is becoming more diversified in accordance with the trend toward thinner and shorter electronic components. In recent years, computer monitors as well as televisions have become thinner and thinner. A connection method using an anisotropic conductive film (ACF) is widely used. In addition, in particular, the use of ACF in LCD mounting technology is intensifying, and a method of directly mounting a semiconductor circuit on a film or a glass substrate by a COF (Chip On Film) or COG (Chip on Glass) method is also rapidly developing.

A conventional LCD module attaches a driver IC to a liquid crystal panel through a chip on glass (COG) process and attaches a flexible substrate (FPCB) to a liquid on glass (FOG) process. The liquid crystal panel with the flexible substrate is assembled to the backlight unit.

However, as described above, as the driving chip and the flexible substrate are electrically connected to the liquid crystal panel in each line, the entire process of the liquid crystal display is increased.

The present invention provides a component crimping device and method for a liquid crystal panel.

The present invention provides an apparatus and a method for crimping parts of a liquid crystal panel in which an anisotropic conductive film can be used to electrically and mechanically connect a driving chip and a flexible substrate to the liquid crystal panel.

Component pressing apparatus for a liquid crystal panel according to an embodiment of the present invention, a liquid crystal panel having a liquid crystal layer formed between the upper and lower substrates; An anisotropic conductive film attached to the lower substrate of the liquid crystal panel; A driving chip and a flexible substrate mounted at a mounting position on the anisotropic conductive film; And a heat compression head configured to have first and second compression parts corresponding to the driving chip and the flexible substrate to heat, compress, and bond the driving chip and the flexible substrate by using the first and second compression parts.

In addition, the method of compressing a component of a liquid crystal panel according to an exemplary embodiment of the present invention includes attaching an anisotropic conductive film on the liquid crystal panel; Arranging a driving chip and a flexible substrate at mounting positions on the anisotropic conductive film, respectively; Pre-bonding the aligned drive chip and the flexible substrate using the first and second compression parts of the heat compression head, and then performing final bonding.

Referring to the accompanying drawings with respect to the component pressing device and method of the liquid crystal panel according to an embodiment of the present invention are as follows.

1 is a side cross-sectional view of a liquid crystal panel according to an exemplary embodiment of the present invention.

Referring to FIG. 1, the liquid crystal panel 10 is filled with a liquid crystal layer (not shown) between the lower substrate 11, the upper substrate 12, and the upper and lower substrates.

The lower substrate 11 includes a gate line, a data line, a thin film transistor, a pixel electrode, and the like, and the upper substrate 12 is opposite to the lower substrate 11 and has a color filter and a common electrode. Upper and lower polarizers 15 and 17 may be attached to both surfaces of the upper and lower substrates 11 and 12.

An anisotropic conductive film (ACF) 31 is attached to a wiring pattern (eg, an ITO electrode) of the lower substrate 13, and a driver IC 32 is disposed on the anisotropic conductive film 31. ) And a flexible substrate (FPCB) 33 are mounted.

The anisotropic conductive film 31 has a structure in which conductive particles are contained in an insulating adhesive containing, as a main component, a resin component having an epoxy group and a resin component assisting film formation. Here, the conductive particles may be contained in the insulating adhesive in a number such that a sufficient number of conductive particles may contribute to the connection between the conductors in order to obtain proper electrical conductivity between the conductors.

As a result, the lower substrate (by pressing the drive chip 32 and the flexible substrate 33 by heat-compression while appropriately supplying time, temperature, and pressure applied to the anisotropic conductive film 31 attached to the lower substrate 11). The wiring pattern of 11) and the conductors of the driving chip 32 and the flexible substrate 33 are mechanically and electrically connected. In addition, it is also possible to use one anisotropic conductive film 31 or to separate and heat-compress them.

In the present invention, the driving chip attaching process is referred to as a chip on glass (COG) process, and the flexible substrate attaching process is referred to as a film on glass (FOG) process, and the driving chip 32 and the flexible substrate 33 are formed on the anisotropic conductive film 31. ) Can be integrated into one process.

Specifically, referring to FIG. 2 for the heat-compression apparatus of the liquid crystal panel, after attaching the anisotropic conductive film 31 to the lower substrate 11 of the liquid crystal panel 10, the driving chip 32 on the anisotropic conductive film 31. ) And the flexible substrate 33 are pre-bonded by using the first and second compression parts 51 and 52 of the heat compression head 50, respectively. At this time, the prebonding step is a primary heat crimping step, which may be performed simultaneously with the driving chip and the flexible substrate, or may be performed in any order, and then the driving chip or the flexible substrate may be performed first.

When the driving chip 32 and the flexible substrate 33 are prebonded on the anisotropic conductive film 31, the first pressing part 51 and the second pressing part 52 formed at the lower end of the heating crimping head 50. The driving chip 32 and the flexible substrate 33 may be mounted on the lower substrate 11 by heat pressing the driving chip 32 and the flexible substrate 33 using the.

The heating crimping head 50 is generated by Joule heat according to the input current, and the generated heat is transmitted to the first crimping part 51 or / and the second crimping part 52 provided at the lower end of the crimping head, respectively. . In addition, since the heating crimping head 50, the first crimping portion 51 and the second crimping portion 52 are moved together in the up / down direction by the cylinder of the heating crimping device, the predetermined time, temperature and pressure The driving chip 31 is transferred to the flexible substrate 32, respectively.

Here, the first and second crimping portions 51 and 52 are capable of heat-compressing two parts simultaneously or separately, and bonding them at different times / temperatures / pressures to different parts using one equipment. The process can be carried out. In addition, the first and second compression parts 51 and 52 may be spaced apart by a part spacing, and the protruding heights of the first and second compression parts 51 and 52 may be formed at a height inversely proportional to the height of the parts. .

In this way, the heating pattern and the driving chip of the lower substrate 11 are formed by the anisotropic conductive film 31 by performing thermal compression on the driving chip 32 or / and the flexible substrate 33 by the heating crimping head 50. The conductors of the 32 and the flexible substrate 33 can be electrically connected.

3 is a view showing a heat compression apparatus according to an embodiment of the present invention.

2 and 3, the heat press apparatus 60 includes a heat press head 50, a support 61, a cylinder 62, a vertical movement frame 63, an adjustment lever 64, and a stage 65. And a head stopper 66.

The support part 61 supports the entire heating and pressing device 60, and the cylinder 62 converts the reciprocating motion into the vertical motion. The reciprocating motion moves the vertical movement frame 63 to the guide shaft 63a. Along the up / down direction.

An adjustment lever 64 and a heat compression head 65 are installed on the vertical movement frame 63.

In addition, the adjustment lever 64 adjusts the flatness of the heat press head 50 using the bolt 64a.

The stage 65 is placed on the liquid crystal panel, and prevents the liquid crystal panel from flowing downward when pressed. The stage 65 supports the liquid crystal panel, and may be moved to the X, Y or X, Y, Z axis so that the heat compression position of the liquid crystal panel detected through the camera unit (not shown) is in the home position. It is a structure.

The head stopper 66 makes it possible to adjust the distance between the heat compression head 50 and the stage 65.

The heat compression head 50 is heat-compressed against the driving chip 32 and the flexible substrate 33 aligned with the lower substrate of the liquid crystal panel, and has the first and second compression parts 51 and 52.

In view of the operation of such a hot pressing device, the liquid crystal panel is placed on the stage 65 and then the anisotropic conductive film 31 is attached to the component mounting position. Then, the cylinder 62 is reciprocated to move the vertical movement frame 63 and the heat press head 50 downward. At this time, the heat compression head 50 presses the driving chip 32 and the flexible substrate 33 to a predetermined pressure. At this time, the head stopper 66 restricts the downward movement of the heat compression head 50.

At this time, the heat compression head 50 generates Joule heat according to the input current, and the generated heat is transmitted through the first and second compression parts 51 and 52. The heating crimping head 50 may include a heater wire to generate heat to a predetermined temperature instantaneously, pre-bond the driving chip 32 through the first crimping part 51, and the second crimping part ( 52, the flexible substrate 33 is prebonded. Here, the prebonding conditions may be applied at the same time, temperature, and pressure, or may be applied at different times, temperatures, and pressures.

At this time, the final bonding conditions of the driving chip 32 and the flexible substrate 33 may be applied to different times, temperatures, and pressures. As a final bonding condition of the driving chip 32, the wiring pattern of the lower substrate 11 and the bumps of the driving chip 32 are aligned to both sides of the anisotropic conductive film 31, and then 200 to 220 with respect to the liquid crystal panel 10. By supplying a pressure of 17 to 23 kgf / mm ² for 5 to 7 seconds in the temperature range of ℃ and heat-compression, the anisotropic conductive film 31 is melted so that bumps (not shown) of the driving chip 32 is formed on the lower substrate It is electrically connected to the wiring pattern.

The flexible substrate 33 is thermally compressed by using the second pressing portion 52 of the heat pressing head 50 to melt the anisotropic conductive film 31 so that the flexible substrate 33 is placed on the lower substrate 11. It is mounted. At this time, as a final bonding condition of the flexible substrate, a pressure of 17 to 23 kgf / mm ² is supplied to the liquid crystal panel for 15 to 20 seconds in the temperature range of 170 ~ 190 ℃, it is heated and compressed.

As described above, according to the present invention, both the bonding process of the driving chip 32 and the bonding process of the flexible substrate 33 may be performed on the liquid crystal panel 10 in the thermocompression bonding apparatus 60.

4 is a flowchart illustrating a method of thermally compressing a liquid crystal panel according to an exemplary embodiment of the present invention.

Referring to FIG. 4, after the liquid crystal panel is supplied to the liquid crystal panel stage (S11), the liquid crystal panel is aligned with the horizontal, heat and compression positions. An anisotropic conductive film (ACF) is attached onto the lower substrate of the liquid crystal panel (S12). Here, the anisotropic conductive film may be used in common for the driving chip and the flexible substrate, or may be separately used for the driving chip or the flexible substrate.

After attaching the anisotropic conductive film, a driver chip and a flexible substrate are supplied (S15), and the driving chip and the flexible substrate are aligned at mounting positions on the liquid crystal panel (S17).

Then, pre-bonding is performed on the driving chip and the flexible substrate arranged at the mounting position on the liquid crystal panel by using the first and second compression parts of the heating crimping head, respectively, to temporarily drive the driving chip and the flexible substrate to the lower substrate of the liquid crystal panel. It will be fixed.

The final bonding is performed by thermally compressing the pre-bonded driving chip and the flexible substrate on the lower substrate of the liquid crystal panel (S19). Thereafter, the liquid crystal panel in which the component mounting is completed is discharged (S21).

In this case, the bonding start condition may be any one of a driving chip or a flexible substrate, or two components may be performed simultaneously. When the two components are executed simultaneously, only the bonding termination conditions may be used. In addition, as a final bonding condition, the components that require a short bonding time may be mounted first or later, based on the time taken for bonding.

 As such, by bonding different components on the liquid crystal panel using one hot pressing device, the process and the bonding time may be shortened because it is not necessary to move to other equipment.

Although the present invention has been described above with reference to the embodiments, these are only examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains may have an abnormality within the scope not departing from the essential characteristics of the present invention. It will be appreciated that various modifications and applications are not illustrated. For example, each component shown in detail in the embodiment of the present invention may be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

According to the thermocompression bonding apparatus and method of the liquid crystal panel according to the present invention, it is possible to bond different components onto the liquid crystal panel in one thermocompression apparatus, respectively, to perform the bonding process of the two components in one line, so that the bonding time And the process can be shortened.

Claims (6)

A liquid crystal panel having a liquid crystal layer formed between the upper and lower substrates; An anisotropic conductive film attached to the lower substrate of the liquid crystal panel; A driving chip and a flexible substrate mounted at a mounting position on the anisotropic conductive film; Compressing parts of a liquid crystal panel including a first and second pressing parts corresponding to the driving chip and the flexible substrate, and a heating pressing head for heating, pressing and bonding the driving chip and the flexible substrate using the first and second pressing parts. Device. The method of claim 1, And a cylinder for transferring the reciprocating motion to the vertical motion, a vertical movement frame for moving the pressing head up and down by the cylinder, and a stage facing the heating pressing head and on which the liquid crystal panel is placed. . The method of claim 1, And the first and second pressing parts are separated by a distance between a driving chip to be mounted on a lower substrate of the liquid crystal panel and a flexible substrate. Attaching an anisotropic conductive film on the liquid crystal panel; Arranging a driving chip and a flexible substrate at mounting positions on the anisotropic conductive film, respectively; And pre-bonding the aligned drive chip and the flexible substrate using the first and second compression parts of the heat compression head, and then performing final bonding. The method of claim 4, wherein A method of compressing a component of a liquid crystal panel by first bonding any one of a driving chip and a flexible substrate using the first and second pressing parts. The method of claim 4, wherein The bonding step is a component pressing method of the liquid crystal panel is carried out in the order of the time it takes to heat compression of the driving chip and the flexible substrate or the reverse order.

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