JP2013048300A - Thermo-compression bonding apparatus and packaging method of electric component - Google Patents

Thermo-compression bonding apparatus and packaging method of electric component Download PDF

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JP2013048300A
JP2013048300A JP2012264673A JP2012264673A JP2013048300A JP 2013048300 A JP2013048300 A JP 2013048300A JP 2012264673 A JP2012264673 A JP 2012264673A JP 2012264673 A JP2012264673 A JP 2012264673A JP 2013048300 A JP2013048300 A JP 2013048300A
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electrical component
thermocompression bonding
mounting
wiring board
adhesive
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JP5406974B2 (en
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Misao Konishi
美佐夫 小西
Yoshihito Tanaka
芳人 田中
Tomoji Tashiro
智史 田代
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Dexerials Corp
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Dexerials Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H01L2224/75316—Elastomer inlay with retaining mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a packaging technique which efficiently package multiple electric components, packaged in different packaging methods, using an adhesive in a thermo-compression bonding apparatus having a simple structure.SOLUTION: A thermo-compression bonding apparatus of this invention is used for conducting thermo-compression bonding on multiple electric components, packaged in different packaging methods, collectively and packaging the electric components. The thermo-compression bonding apparatus includes: a stage 2 made of a rigid material; a crimp member 3 attached to the stage 2 and made of an elastic member; and a heating mechanism 4 disposed above the crimp member 3 so as to face the crimp member 3 and being vertically movable. A heating press surface 40a, having a size according to a heating region of an adhesive used for thermo-compressing bonding, is formed at a body part 40 of the heating mechanism 4.

Description

本発明は、例えば半導体チップやフレキシブルプリント配線板等の電気部品を配線基板上に実装する技術に関し、特に接着剤を用いて実装方式の異なる複数の電気部品を液晶表示装置用の配線基板上に実装する技術に関する。   The present invention relates to a technique for mounting electrical components such as semiconductor chips and flexible printed wiring boards on a wiring board, and in particular, a plurality of electrical components having different mounting methods using an adhesive are mounted on a wiring board for a liquid crystal display device. It relates to the technology to be implemented.

従来、液晶表示装置（ＬＣＤ）用のガラス基板上にＩＣチップ（ベアチップ）やフレキシブルプリント配線板を直接実装する方法として、異方導電性接着剤を用いる方法が知られている。   Conventionally, a method using an anisotropic conductive adhesive is known as a method of directly mounting an IC chip (bare chip) or a flexible printed wiring board on a glass substrate for a liquid crystal display device (LCD).

このようなＣＯＧ（CHIP ON GLASS）、ＦＯＧ（FILM ON GLASS）方式の実装では、例えば図３（ａ）（ｂ）に示すように、ＬＣＤパネル１０２を設けたガラス基板１０１の実装領域１０１ａに異方導電性接着フィルム１０３、１０４を配置し、それぞれの上にＩＣチップ１０５、フレキシブルプリント配線板１０６を搭載した後に、金属製の熱圧着ヘッド１０７、１０８を用いてＩＣチップ１０５、フレキシブルプリント配線板１０６を加圧・加熱して熱圧着実装を行う。   In such a COG (CHIP ON GLASS) and FOG (FILM ON GLASS) mounting, for example, as shown in FIGS. The conductive adhesive films 103 and 104 are arranged, and the IC chip 105 and the flexible printed wiring board 106 are mounted on the respective films, and then the IC chip 105 and the flexible printed wiring board are used by using the metal thermocompression bonding heads 107 and 108. The thermocompression mounting is performed by pressing and heating 106.

しかしながら、このような従来の実装方法では、ＣＯＧ実装、ＦＯＧ実装という実装方式の異なる複数の電気部品に対して別個独立した工程が必要であり、実装効率が悪い等の問題がある。   However, such a conventional mounting method has a problem in that mounting efficiency is poor because a plurality of separate electric parts having different mounting methods such as COG mounting and FOG mounting are required.

これに対し、近年、熱圧着ヘッドとして、例えばエラストマーからなる弾性圧着部材を用いて熱圧着を行う技術が提案されている（例えば特許文献１、２参照）。
この従来技術によれば、従来各実装方式の電気部品毎に行っていた各実装工程を一括して行うことが可能になるため、実装効率を向上させることができる。 On the other hand, as a thermocompression bonding head, a technique for performing thermocompression bonding using an elastic crimping member made of, for example, an elastomer has been proposed in recent years (see, for example, Patent Documents 1 and 2).
According to this conventional technique, it is possible to collectively perform each mounting process which has been performed for each electrical component of each conventional mounting method, so that mounting efficiency can be improved.

しかし、このような従来技術では、例えば図４に示すように、上下動可能な弾性圧着部材２０１を有する熱圧着ヘッド２００を上下動可能に構成するとともにステージ３００側に熱源３０１を配置する必要があるため、既存の熱圧着装置と比較して装置構成が複雑化するという問題がある。   However, in such a conventional technique, for example, as shown in FIG. 4, it is necessary to configure a thermocompression bonding head 200 having an elastic pressure-bonding member 201 that can move up and down and to arrange a heat source 301 on the stage 300 side. Therefore, there is a problem that the device configuration is complicated as compared with existing thermocompression bonding devices.

また、従来技術では、熱圧着の際にガラス基板１０１側から実装領域１０１ａの全体を加熱することになるため、実装領域１０１ａに形成された配線パターン等にダメージを与えるおそれがあるという問題もある。   Further, in the prior art, since the entire mounting region 101a is heated from the glass substrate 101 side during thermocompression bonding, there is a problem in that the wiring pattern formed in the mounting region 101a may be damaged. .

特開２００３−８６６３５号公報JP 2003-86635 A 特開２００６−２４５５５４号公報JP 2006-245554 A

本発明は、このような従来の技術の課題を解決するためになされたもので、簡素な構成の熱圧着装置で、接着剤を用いて実装方式の異なる複数の電気部品を効率良く実装可能な実装技術を提供することを目的とする。   The present invention has been made in order to solve the above-described problems of the conventional technology, and a thermocompression bonding apparatus having a simple configuration can efficiently mount a plurality of electrical components having different mounting methods using an adhesive. The purpose is to provide mounting technology.

上記目的を達成するためになされた請求項１記載の発明は、剛性材料からなるステージと、前記ステージに装着され弾性材料からなる圧着部材と、前記圧着部材に対して上方に対向配置され、上下動可能に構成された加熱機構とを有する熱圧着装置である。
請求項２記載の発明は、請求項１記載の発明において、前記加熱機構が、当該熱圧着に使用する接着剤に対する加熱領域に応じた大きさの加熱押圧面を有するものである。
請求項３記載の発明は、請求項１又は２のいずれか１項記載の熱圧着装置を用い、電気部品を配線基板上に実装する電気部品の実装方法であって、前記電気部品を、その接続側面を上方に向けた状態で前記ステージの前記圧着部材上に配置するとともに、当該電気部品上に接着剤を介して前記配線基板を配置し、前記加熱機構を下降させ前記配線基板を前記電気部品に対して押圧することにより、当該配線基板と前記電気部品とを熱圧着する工程を有するものである。
請求項４記載の発明は、請求項３記載の発明において、前記接着剤として、結着樹脂中に導電粒子が分散された異方導電性接着フィルムを用いるものである。
請求項５記載の発明は、請求項３又は４のいずれか１項記載の発明において、前記配線基板が、液晶表示装置用の配線パターンが形成された基板であることを特徴とする。
本発明は、実装方式の異なる複数の電気部品を一括して熱圧着を行い実装するための熱圧着装置であって、剛性材料からなるステージと、前記ステージに装着され弾性材料からなる圧着部材と、前記圧着部材に対して上方に対向配置され、上下動可能に構成された加熱機構とを有し、前記加熱機構は、当該熱圧着に使用する接着剤に対する加熱領域に応じた大きさの加熱押圧面を有する熱圧着装置である。
本発明は、上述した熱圧着装置を用い、電気部品を配線基板上に実装する電気部品の実装方法であって、実装方式の異なる複数の電気部品を、その接続側面を上方に向けた状態で前記ステージの前記圧着部材上に配置するとともに、当該電気部品上に接着剤を介して前記配線基板を配置し、前記加熱機構を下降させ前記配線基板を前記電気部品に対して押圧することにより、当該配線基板と当該電気部品とを一括して熱圧着する工程を有する電気部品の実装方法である。
本発明では、前記接着剤として、結着樹脂中に導電粒子が分散された異方導電性接着フィルムを用いる場合にも効果的である。
本発明では、前記配線基板が、液晶表示装置用の配線パターンが形成された基板である場合にも効果的である。 In order to achieve the above-mentioned object, the invention according to claim 1 is characterized in that a stage made of a rigid material, a crimping member made of an elastic material attached to the stage, an upper surface facing the crimping member, A thermocompression bonding apparatus having a heating mechanism configured to be movable.
According to a second aspect of the present invention, in the first aspect of the present invention, the heating mechanism has a heat pressing surface having a size corresponding to a heating region for the adhesive used for the thermocompression bonding.
Invention of Claim 3 is the mounting method of the electrical component which mounts an electrical component on a wiring board using the thermocompression bonding apparatus of any one of Claim 1 or 2, Comprising: The wiring board is disposed on the pressure-bonding member of the stage with the connection side facing upward, and the wiring board is disposed on the electrical component via an adhesive, and the heating mechanism is lowered to place the wiring board on the electrical component. The method includes a step of thermocompression bonding the wiring board and the electrical component by pressing against the component.
According to a fourth aspect of the present invention, in the third aspect of the present invention, as the adhesive, an anisotropic conductive adhesive film in which conductive particles are dispersed in a binder resin is used.
The invention according to claim 5 is the invention according to any one of claims 3 or 4, characterized in that the wiring substrate is a substrate on which a wiring pattern for a liquid crystal display device is formed.
The present invention is a thermocompression bonding apparatus for performing a thermocompression bonding and mounting a plurality of electrical components having different mounting methods at once, a stage made of a rigid material, and a crimping member mounted on the stage and made of an elastic material, A heating mechanism that is arranged to face the crimping member and is configured to be movable up and down, and the heating mechanism is heated in a size corresponding to a heating region for the adhesive used for the thermocompression bonding. A thermocompression bonding apparatus having a pressing surface.
The present invention is an electrical component mounting method for mounting an electrical component on a wiring board using the above-described thermocompression bonding apparatus, and a plurality of electrical components having different mounting methods are placed with their connection side surfaces facing upward. By placing the wiring board on the crimping member of the stage and placing the wiring board on the electrical component via an adhesive, lowering the heating mechanism and pressing the wiring board against the electrical component, It is a mounting method of an electrical component having a step of thermocompression bonding the wiring board and the electrical component together.
In the present invention, the adhesive is also effective when an anisotropic conductive adhesive film in which conductive particles are dispersed in a binder resin is used.
The present invention is also effective when the wiring substrate is a substrate on which a wiring pattern for a liquid crystal display device is formed.

本発明装置の場合、剛性材料からなるステージに弾性材料からなる圧着部材を装着し、上下動可能に構成された加熱機構を圧着部材に対して上方に対向配置したことから、ステージ側に熱源を配置する必要はなく、既存の熱圧着装置に多少の改造を施すだけで済む簡素な構成の熱圧着装置を提供することができる。
また、本発明によれば、弾性材料からなる圧着部材がステージ側に設けられており確実に固定することができるので、ファインピッチの電極を有する電気部品の接続の際においても、安定して熱圧着を行うことができる。
本発明において、加熱機構が、当該熱圧着に使用する接着剤に対する加熱領域に応じた大きさの加熱押圧面を有する場合には、熱圧着の際に例えば基板側から電気部品の実装領域、即ち接着剤の広がる領域と同等の領域のみを加熱することができるため、液晶表示装置等の配線パターンへのダメージを確実に回避することができる。 In the case of the apparatus of the present invention, a pressure member made of an elastic material is mounted on a stage made of a rigid material, and a heating mechanism configured to be movable up and down is disposed above the pressure bonding member. It is not necessary to arrange the thermocompression bonding apparatus with a simple configuration that only requires some modifications to the existing thermocompression bonding apparatus.
In addition, according to the present invention, since the pressure-bonding member made of an elastic material is provided on the stage side and can be securely fixed, even when connecting an electrical component having a fine-pitch electrode, the heat can be stably supplied. Crimping can be performed.
In the present invention, when the heating mechanism has a heating pressing surface having a size corresponding to the heating region for the adhesive used for the thermocompression bonding, for example, the mounting region of the electrical component from the substrate side during the thermocompression bonding, that is, Since only the region equivalent to the region where the adhesive spreads can be heated, damage to the wiring pattern of the liquid crystal display device or the like can be reliably avoided.

そして、本発明装置並びに方法によれば、従来各実装方式の電気部品毎に行っていた実装工程を一括して行うことができ、工程数を大幅に削減することができるので、例えば液晶表示装置の製造の際における異方導電性接着剤を用いた実装効率を大幅に向上させることができる。   According to the apparatus and method of the present invention, the mounting process that has been conventionally performed for each electrical component of each mounting method can be performed collectively, and the number of processes can be greatly reduced. The mounting efficiency using the anisotropic conductive adhesive in the manufacture of can be greatly improved.

本発明によれば、簡素な構成の熱圧着装置で、接着剤を用いて実装方式の異なる複数の電気部品を効率良く実装可能な実装技術を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the mounting technique which can mount efficiently several electrical components from which a mounting system differs using an adhesive agent with the thermocompression bonding apparatus of simple structure can be provided.

本発明に係る熱圧着装置の実施の形態を示す部分断面図The fragmentary sectional view which shows embodiment of the thermocompression bonding apparatus which concerns on this invention （ａ）（ｂ）：同熱圧着装置を用いた実装方法の実施の形態を示す部分断面工程図(A) (b): Partial cross-sectional process drawing which shows embodiment of the mounting method using the thermocompression bonding apparatus （ａ）：従来技術に係る熱圧着装置を用いた実装方法の例を示す斜視図（ｂ）：同従来技術に係る熱圧着装置を用いた実装方法の例を示す側面図(A): Perspective view showing an example of a mounting method using a thermocompression bonding apparatus according to the prior art (b): Side view showing an example of a mounting method using the thermocompression bonding apparatus according to the prior art 他の同従来技術に係る熱圧着装置を用いた実装方法の例を示す部分断面図The fragmentary sectional view which shows the example of the mounting method using the thermocompression bonding apparatus which concerns on the other said prior art

以下、本発明の実施の形態を図面を参照して詳細に説明する。
図１は、本発明に係る熱圧着装置の実施の形態を示す部分断面図、図２（ａ）（ｂ）は、同熱圧着装置を用いた実装方法の実施の形態を示す部分断面工程図である。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a partial cross-sectional view showing an embodiment of a thermocompression bonding apparatus according to the present invention, and FIGS. 2A and 2B are partial cross-sectional process views showing an embodiment of a mounting method using the thermocompression bonding apparatus. It is.

図１に示すように、本実施の形態の熱圧着装置１は、金属等の剛性材料からなるステージ２を備えている。
このステージ２は、鉛直方向には移動しないように固定された状態で設置されている。なお、ステージ２を水平方向に移動可能に構成することもできる。 As shown in FIG. 1, a thermocompression bonding apparatus 1 according to the present embodiment includes a stage 2 made of a rigid material such as metal.
The stage 2 is installed in a fixed state so as not to move in the vertical direction. The stage 2 can be configured to be movable in the horizontal direction.

ステージ２の上面部分には凹部２ａが形成されており、この凹部２ａには、プレート状のエラストマーからなる圧着部材３が凹部２ａに密着するように取り付けられている。   A concave portion 2a is formed in the upper surface portion of the stage 2, and a crimping member 3 made of a plate-like elastomer is attached to the concave portion 2a so as to be in close contact with the concave portion 2a.

そして、後述するように、圧着部材３上には、例えばＩＣチップやフレキシブル基板等の実装方式の異なる複数の電気部品１０と、配線基板１２とが、結着樹脂２１中に導電粒子２２が分散された異方導電性接着フィルム（接着剤）２０を挟んで載置されるようになっている（図１においては、説明の都合上一つの電気部品１０のみが示されている。）。   As will be described later, a plurality of electrical components 10 having different mounting methods such as an IC chip and a flexible substrate, and a wiring substrate 12 are dispersed on the crimping member 3, and conductive particles 22 are dispersed in the binder resin 21. The anisotropic conductive adhesive film (adhesive) 20 thus placed is placed between them (in FIG. 1, only one electric component 10 is shown for convenience of explanation).

圧着部材３は、その上面側に位置する圧着面３ａが水平となるように配置される。そして、圧着部材３の圧着面３ａは、電気部品１０の頂部１０ａの面積より大きくなるように構成されている。   The crimping member 3 is arranged such that the crimping surface 3a located on the upper surface side thereof is horizontal. The crimping surface 3 a of the crimping member 3 is configured to be larger than the area of the top portion 10 a of the electrical component 10.

本発明の場合、圧着部材３のエラストマーの硬さは特に限定されることなないが、接続信頼性を向上させる観点からは、ゴム硬度が４０以上８０以下のものを用いることが好ましい。   In the case of the present invention, the hardness of the elastomer of the pressure-bonding member 3 is not particularly limited, but from the viewpoint of improving the connection reliability, it is preferable to use a rubber having a rubber hardness of 40 to 80.

ゴム硬度が４０未満のエラストマーは、電気部品に対する圧力が不十分で初期抵抗及び接続信頼性が劣るという不都合があり、ゴム硬度が８０より大きいエラストマーは、接着剤のフィレット部分に対する圧力が不十分で結着樹脂中にボイドが発生して接続信頼性が劣るという不都合がある。   Elastomers with a rubber hardness of less than 40 have the disadvantages of insufficient pressure on the electrical components and poor initial resistance and connection reliability. Elastomers with a rubber hardness of more than 80 have insufficient pressure on the fillet portion of the adhesive. There is an inconvenience that voids are generated in the binder resin and the connection reliability is poor.

なお、本明細書では、エラストマーのゴム硬度として、ＪＩＳ Ｓ ６０５０に準拠する規格を適用するものとする（温度条件は室温：５〜３５℃）。   In this specification, a standard conforming to JIS S 6050 is applied as the rubber hardness of the elastomer (temperature condition is room temperature: 5 to 35 ° C.).

このようなエラストマーとしては、天然ゴム、合成ゴムのいずれも用いることができるが、耐熱性、耐圧性の観点からは、シリコーンゴムを用いることが好ましい。   As such an elastomer, both natural rubber and synthetic rubber can be used, but silicone rubber is preferably used from the viewpoint of heat resistance and pressure resistance.

なお、本発明の場合、圧着部材３の厚さは電気部品の厚さより厚ければ特に限定されることなないが、接続信頼性を向上させる観点からは、０．１〜２ｃｍに設定することが好ましい。   In the case of the present invention, the thickness of the crimping member 3 is not particularly limited as long as it is thicker than the thickness of the electrical component. However, from the viewpoint of improving connection reliability, it is set to 0.1 to 2 cm. Is preferred.

一方、ステージ２の圧着部材３の上方には、圧着部材３と対向する位置に加熱機構４が配設されている。   On the other hand, a heating mechanism 4 is disposed above the pressure bonding member 3 of the stage 2 at a position facing the pressure bonding member 3.

この加熱機構４は金属製の本体部４０を有し、この本体部４０内には、温度制御可能なヒーター５が設けられている。また、加熱機構４の本体部４０は、図示しない駆動機構によって鉛直方向に上下動するように構成されている。   The heating mechanism 4 has a metal main body 40, and a heater 5 capable of controlling the temperature is provided in the main body 40. The main body 40 of the heating mechanism 4 is configured to move up and down in the vertical direction by a drive mechanism (not shown).

さらに、本実施の形態の場合、加熱機構４の本体部４０は、熱圧着に使用する接着剤に対する加熱領域に応じた大きさの水平な加熱押圧面４０ａを有している。   Furthermore, in the case of this Embodiment, the main-body part 40 of the heating mechanism 4 has the horizontal heating press surface 40a of the magnitude | size according to the heating area | region with respect to the adhesive agent used for thermocompression bonding.

例えば、図１に示す例の場合、加熱機構４の加熱押圧面４０ａは、電気部品１０の本体部分と同様の形状で、かつ、熱圧着の際に異方導電性接着フィルム２０の広がる領域と同等の領域の大きさ（面積）に形成されている。   For example, in the case of the example shown in FIG. 1, the heating pressing surface 40 a of the heating mechanism 4 has the same shape as the main body portion of the electrical component 10, and a region where the anisotropic conductive adhesive film 20 spreads during thermocompression bonding. It is formed in the size (area) of the equivalent area.

なお、フレキシブル基板（図示せず）に対しては、当該フレキシブル基板の接着剤によって接着される領域と同様の形状で、かつ、熱圧着の際に接着剤の広がる領域と同等の大きさ（面積）に形成された加熱押圧面を有する加熱機構（図示せず）を用いるとよい。   For flexible substrates (not shown), the shape is the same as the region bonded by the adhesive of the flexible substrate, and the size (area) of the region where the adhesive spreads during thermocompression bonding. It is good to use the heating mechanism (not shown) which has the heating press surface formed in.

本実施の形態において電気部品１０の実装を行うには、図２（ａ）に示すように、電気部品１０をステージ２の圧着部材３の圧着面３ａ上に配置する（実際上は、上述したように複数の電気部品１０をステージ２の圧着部材３の圧着面３ａ上に配置する）。   In order to mount the electrical component 10 in the present embodiment, as shown in FIG. 2A, the electrical component 10 is disposed on the crimping surface 3a of the crimping member 3 of the stage 2 (in practice, as described above). A plurality of electrical components 10 are arranged on the crimping surface 3 a of the crimping member 3 of the stage 2).

この場合、本実施の形態では、各電気部品１０を、その接続側面、即ち電極であるバンプ１１が設けられた側の面１０ｂを上方に向けた状態で圧着部材３上に配置する。   In this case, in the present embodiment, each electrical component 10 is arranged on the crimping member 3 with its connection side surface, that is, the surface 10b on the side provided with the bumps 11 serving as electrodes facing upward.

そして、これらの電気部品１０上に異方導電性接着フィルム２０を配置し、さらに配線基板１２を、電極パターン１３が形成された側の面１２ａを下にした状態で異方導電性接着フィルム２０上に配置する。   And the anisotropic conductive adhesive film 20 is arrange | positioned on these electric components 10, and also the anisotropic conductive adhesive film 20 has the wiring board 12 in the state which faced the surface 12a in the side in which the electrode pattern 13 was formed. Place on top.

その後、図２（ｂ）に示すように、加熱機構４を下降させ、配線基板１２の裏側面１２ｂに加熱機構４の加熱押圧面４０ａを押し付けて位置決め（仮圧着）を行い、さらに、２００℃程度の温度で本圧着を行う。   Thereafter, as shown in FIG. 2B, the heating mechanism 4 is lowered, the heating pressing surface 40a of the heating mechanism 4 is pressed against the back side surface 12b of the wiring board 12, and positioning (temporary pressure bonding) is performed. The main pressure bonding is performed at about a temperature.

これにより、当該熱圧着の際、異方導電性接着フィルムを、溶融粘度が１．０×１０2ｍＰａ・ｓ以上１．０×１０5ｍＰａ・ｓ以下となるように加熱する。 Thereby, in the said thermocompression bonding, an anisotropic conductive adhesive film is heated so that melt viscosity may be 1.0 * 10 < 2 > mPa * s or more and 1.0 * 10 < 5 > mPa * s or less.

ここで、熱圧着の際の異方導電性接着フィルムの溶融粘度が１．０×１０2ｍＰａ・ｓ未満の場合は、熱圧着時の結着樹脂の流動性が大きく、ボイドが発生して初期抵抗及び接続信頼性が劣るという不都合があり、溶融粘度が１．０×１０5ｍＰａ・ｓより大きい場合は、熱圧着時に接続部分において結着樹脂が排除しきれず、初期抵抗及び接続信頼性が劣るという不都合がある。 Here, when the melt viscosity of the anisotropic conductive adhesive film during thermocompression bonding is less than 1.0 × 10 2 mPa · s, the fluidity of the binder resin during thermocompression bonding is large and voids are generated. There is a problem that initial resistance and connection reliability are inferior, and when the melt viscosity is larger than 1.0 × 10 5 mPa · s, the binder resin cannot be completely removed at the connection portion during thermocompression bonding, and the initial resistance and connection reliability Is inconvenient.

なお、本圧着時の圧力は、電気部品１個当たり４ＭＰａ程度で１０秒程度とするとよい。   In addition, the pressure at the time of this crimping | compression-bonding is good to be about 10 seconds at about 4 MPa per electrical component.

以上述べたように本実施の形態においては、剛性材料からなるステージ２に弾性材料からなる圧着部材３を装着し、上下動可能に構成された加熱機構４を圧着部材３に対して上方に対向配置したことから、ステージ２側に熱源を配置する必要はなく、既存の熱圧着装置に多少の改造を施すだけで済む簡素な構成の熱圧着装置を提供することができる。   As described above, in the present embodiment, the pressure member 3 made of an elastic material is attached to the stage 2 made of a rigid material, and the heating mechanism 4 configured to be movable up and down is opposed to the pressure member 3 upward. Since it is arranged, it is not necessary to arrange a heat source on the stage 2 side, and it is possible to provide a thermocompression bonding apparatus having a simple configuration that only requires some modifications to the existing thermocompression bonding apparatus.

また、本実施の形態によれば、弾性材料からなる圧着部材３がステージ２側に設けられており確実に固定することができるので、ファインピッチの電極を有する電気部品の接続の際においても、安定して熱圧着を行うことができる。   In addition, according to the present embodiment, the pressure-bonding member 3 made of an elastic material is provided on the stage 2 side and can be reliably fixed. Therefore, even when connecting electrical components having fine-pitch electrodes, Thermocompression bonding can be performed stably.

さらに、本実施の形態では、加熱機構４が、熱圧着に使用する接着剤に対する加熱領域に応じた大きさの加熱押圧面４０ａを有することから、熱圧着の際に配線基板１２側から電気部品の実装領域、即ち接着剤の広がる領域と同等の領域のみを加熱することができるため、液晶表示装置等の配線パターンへのダメージを確実に回避することができる。   Further, in the present embodiment, the heating mechanism 4 has the heating pressing surface 40a having a size corresponding to the heating region for the adhesive used for thermocompression bonding. Since only the mounting region, that is, the region equivalent to the region where the adhesive spreads, can be heated, damage to the wiring pattern of the liquid crystal display device or the like can be reliably avoided.

そして、本実施の形態によれば、弾性材料からなる圧着部材３による押圧により、例えば、図２（ｂ）に示すように、ＩＣチップ等の電気部品１０の周囲の接着剤フィレット部２３に対してもボイドの生じないように加圧することができるので、従来各実装方式の電気部品毎に行っていた実装工程を一括して行うことができる。その結果、実装工程数を大幅に削減することができ、例えば液晶表示装置の製造の際における異方導電性接着剤を用いた実装効率を大幅に向上させることができる。   And according to this Embodiment, with the press by the crimping | compression-bonding member 3 which consists of an elastic material, as shown, for example in FIG.2 (b), with respect to the adhesive fillet part 23 around the electrical components 10, such as an IC chip, However, since the pressure can be applied so that no void is generated, the mounting process conventionally performed for each electrical component of each mounting method can be performed collectively. As a result, the number of mounting processes can be greatly reduced, and for example, mounting efficiency using an anisotropic conductive adhesive in manufacturing a liquid crystal display device can be greatly improved.

なお、本発明は上述の実施の形態に限られることなく、種々の変更を行うことができる。
例えば、上述の実施の形態においては、電気部品としてＩＣチップ、フレキシブル基板を実装する場合を例にとって説明したが、本発明はこれに限られず、抵抗器、コンデンサ等を実装する場合に適用することはもちろんである。 The present invention is not limited to the above-described embodiment, and various changes can be made.
For example, in the above-described embodiment, the case where an IC chip or a flexible substrate is mounted as an electrical component has been described as an example. However, the present invention is not limited to this, and is applied when a resistor, a capacitor, or the like is mounted. Of course.

また、上述の実施の形態においては、異方導電性接着フィルムを用いて電気部品を実装する場合を例にとって説明したが、ペースト状の異方導電性接着剤を用いることも可能であり、さらに、導電粒子を含有しない接着剤を用いることも可能である。   Further, in the above-described embodiment, the case where the electrical component is mounted using the anisotropic conductive adhesive film has been described as an example, but it is also possible to use a paste-like anisotropic conductive adhesive. It is also possible to use an adhesive that does not contain conductive particles.

さらにまた、上述の実施の形態においては、熱圧着ヘッドの圧着部材についても、上記実施の形態のものに限られず、例えば、実装する電気部品に対応して複数の圧着部材を設けることもできる。   Furthermore, in the above-described embodiment, the crimping member of the thermocompression bonding head is not limited to that in the above-described embodiment, and for example, a plurality of crimping members can be provided corresponding to the electrical component to be mounted.

加えて、本発明は液晶表示装置用のガラス基板上に電気部品を実装する場合のみならず、種々の配線基板上に電気部品を実装する場合に適用することができる。
ただし、本発明は液晶表示装置用のガラス基板上に電気部品を実装する場合に特に実装効率を向上させることができるものである。 In addition, the present invention can be applied not only when mounting electrical components on a glass substrate for a liquid crystal display device but also when mounting electrical components on various wiring substrates.
However, the present invention can improve the mounting efficiency particularly when an electrical component is mounted on a glass substrate for a liquid crystal display device.

１……熱圧着装置
２……ステージ
３……圧着部材
４……加熱機構
５……ヒーター
１０……電気部品
２０……異方導電性接着フィルム（接着剤）
４０……本体部
４０ａ…加熱押圧面 DESCRIPTION OF SYMBOLS 1 ... Thermocompression bonding apparatus 2 ... Stage 3 ... Crimping member 4 ... Heating mechanism 5 ... Heater 10 ... Electrical component 20 ... Anisotropic conductive adhesive film (adhesive)
40... Main body 40 a ... Heating pressing surface

上記目的を達成するためになされた本発明は、実装方式の異なる複数の電気部品を一括して熱圧着を行い実装するための熱圧着装置であって、剛性材料からなるステージと、前記ステージに装着され弾性材料からなる圧着部材と、前記圧着部材に対して上方に対向配置され、上下動可能に構成された加熱機構とを有し、前記加熱機構は、当該熱圧着に使用する接着剤に対する加熱領域に応じた大きさの加熱押圧面を有する熱圧着装置である。
本発明は、上述した熱圧着装置を用い、電気部品を配線基板上に実装する電気部品の実装方法であって、実装方式の異なる複数の電気部品を、その接続側面を上方に向けた状態で前記ステージの前記圧着部材上に配置するとともに、当該電気部品上に接着剤を介して前記配線基板を配置し、前記加熱機構を下降させ前記配線基板を前記電気部品に対して押圧することにより、当該配線基板と当該電気部品とを一括して熱圧着する工程を有する電気部品の実装方法である。
本発明では、前記接着剤として、結着樹脂中に導電粒子が分散された異方導電性接着フィルムを用いる場合にも効果的である。
本発明では、前記配線基板が、液晶表示装置用の配線パターンが形成された基板である場合にも効果的である。 The present invention made to achieve the above object is a thermocompression bonding apparatus for performing thermocompression bonding of a plurality of electrical components having different mounting methods in a lump, and comprising a stage made of a rigid material and the stage A pressure-bonding member that is mounted and made of an elastic material; and a heating mechanism that is disposed upwardly and opposed to the pressure-bonding member and configured to be movable up and down. The heating mechanism corresponds to an adhesive used for the thermo-compression bonding. It is a thermocompression bonding apparatus having a heating pressing surface having a size corresponding to the heating region.
The present invention is an electrical component mounting method for mounting an electrical component on a wiring board using the above-described thermocompression bonding apparatus, and a plurality of electrical components having different mounting methods are placed with their connection side surfaces facing upward. By placing the wiring board on the crimping member of the stage and placing the wiring board on the electrical component via an adhesive, lowering the heating mechanism and pressing the wiring board against the electrical component, It is a mounting method of an electrical component having a step of thermocompression bonding the wiring board and the electrical component together.
In the present invention, the adhesive is also effective when an anisotropic conductive adhesive film in which conductive particles are dispersed in a binder resin is used.
The present invention is also effective when the wiring substrate is a substrate on which a wiring pattern for a liquid crystal display device is formed.

Claims (9)

剛性材料からなるステージと、
前記ステージに装着され弾性材料からなる圧着部材と、
前記圧着部材に対して上方に対向配置され、上下動可能に構成された加熱機構とを有する熱圧着装置。 A stage made of rigid material;
A pressure-bonding member mounted on the stage and made of an elastic material;
A thermocompression bonding apparatus including a heating mechanism that is disposed to face the crimping member and is configured to be movable up and down. 前記加熱機構は、当該熱圧着に使用する接着剤に対する加熱領域に応じた大きさの加熱押圧面を有する請求項１記載の熱圧着装置。   The thermocompression bonding apparatus according to claim 1, wherein the heating mechanism has a heat pressing surface having a size corresponding to a heating region for an adhesive used for the thermocompression bonding. 請求項１又は２のいずれか１項記載の熱圧着装置を用い、電気部品を配線基板上に実装する電気部品の実装方法であって、
前記電気部品を、その接続側面を上方に向けた状態で前記ステージの前記圧着部材上に配置するとともに、当該電気部品上に接着剤を介して前記配線基板を配置し、
前記加熱機構を下降させ前記配線基板を前記電気部品に対して押圧することにより、当該配線基板と前記電気部品とを熱圧着する工程を有する電気部品の実装方法。 An electrical component mounting method for mounting an electrical component on a wiring board using the thermocompression bonding apparatus according to claim 1,
The electrical component is disposed on the crimping member of the stage with the connection side face upward, and the wiring board is disposed on the electrical component via an adhesive,
An electrical component mounting method comprising a step of thermocompression bonding the wiring board and the electrical component by lowering the heating mechanism and pressing the wiring substrate against the electrical component. 前記接着剤として、結着樹脂中に導電粒子が分散された異方導電性接着フィルムを用いる請求項３記載の電気部品の実装方法。   The method for mounting an electrical component according to claim 3, wherein an anisotropic conductive adhesive film in which conductive particles are dispersed in a binder resin is used as the adhesive. 前記配線基板が、液晶表示装置用の配線パターンが形成された基板である請求項３又は４のいずれか１項記載の電気部品の実装方法。   The method of mounting an electrical component according to claim 3, wherein the wiring board is a board on which a wiring pattern for a liquid crystal display device is formed. 実装方式の異なる複数の電気部品を一括して熱圧着を行い実装するための熱圧着装置であって、
剛性材料からなるステージと、
前記ステージに装着され弾性材料からなる圧着部材と、
前記圧着部材に対して上方に対向配置され、上下動可能に構成された加熱機構とを有し、
前記加熱機構は、当該熱圧着に使用する接着剤に対する加熱領域に応じた大きさの加熱押圧面を有する熱圧着装置。 A thermocompression bonding apparatus for performing thermocompression bonding and mounting a plurality of electrical components having different mounting methods in a batch,
A stage made of rigid material;
A pressure-bonding member mounted on the stage and made of an elastic material;
A heating mechanism that is disposed to face upward with respect to the crimping member and configured to be movable up and down;
The said heating mechanism is a thermocompression bonding apparatus which has a heating press surface of the magnitude | size according to the heating area | region with respect to the adhesive agent used for the said thermocompression bonding. 請求項６記載の熱圧着装置を用い、電気部品を配線基板上に実装する電気部品の実装方法であって、
実装方式の異なる複数の電気部品を、その接続側面を上方に向けた状態で前記ステージの前記圧着部材上に配置するとともに、当該電気部品上に接着剤を介して前記配線基板を配置し、
前記加熱機構を下降させ前記配線基板を前記電気部品に対して押圧することにより、当該配線基板と当該電気部品とを一括して熱圧着する工程を有する電気部品の実装方法。 An electrical component mounting method for mounting an electrical component on a wiring board using the thermocompression bonding apparatus according to claim 6,
A plurality of electrical components having different mounting methods are disposed on the crimping member of the stage with the connection side face upward, and the wiring board is disposed on the electrical component via an adhesive,
An electrical component mounting method including a step of collectively thermocompression bonding the wiring board and the electrical component by lowering the heating mechanism and pressing the wiring board against the electrical component. 前記接着剤として、結着樹脂中に導電粒子が分散された異方導電性接着フィルムを用いる請求項７記載の電気部品の実装方法。   The electrical component mounting method according to claim 7, wherein an anisotropic conductive adhesive film in which conductive particles are dispersed in a binder resin is used as the adhesive. 前記配線基板が、液晶表示装置用の配線パターンが形成された基板である請求項７又は８のいずれか１項記載の電気部品の実装方法。   The method of mounting an electrical component according to claim 7, wherein the wiring board is a board on which a wiring pattern for a liquid crystal display device is formed.
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