JP2012124504A - Method of implementing electrical component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of implementation by which electrical components of different method of implementation can be efficiently implemented using adhesive agent.SOLUTION: With a method of implementation, an electrical component is implemented on a glass substrate 1 using a thermo-compression-bonding head 7 having a crimp component 8 made of prescribed elastomer for a head body 8. The method includes a process in which after an anisotropic conductive adhesive film 4 is arranged in the whole area of an implementation area 3 on the glass substrate 1 for a liquid crystal display device having an ITO electrode, electrical components of a COG method and a FOG method are arranged in the implementation area 3 and the electrical components are collectively thermally crimped using the crimp component 8 whose size corresponds to the anisotropic conductive adhesive film 4. The thermo-compression-bonding process also serves as a process in which the ITO electrode is sealed by thermo-compressing and thermally hardening the binding resin of the anisotropic conductive adhesive film 4 arranged in the whole area of the implementation area 3 using the thermo-compression-bonding head 7.

Description

  The present invention relates to a technique for mounting an electrical component such as a semiconductor chip or a flexible printed wiring board on a wiring substrate, and more particularly to a technique for mounting the electrical component using an adhesive.

  Conventionally, as a method for directly mounting an IC chip (bare chip) or a flexible printed wiring board on a substrate such as an LCD substrate, a method using an anisotropic conductive adhesive film in which conductive particles are dispersed in a binder is known.

  In such COG (CHIP ON GLASS) and COF (CHIP ON FLEX) mounting, for example, as shown in FIGS. 6A and 6B, a predetermined mounting region 101a of the glass substrate 101 provided with the LCD panel is provided. After the anisotropic conductive adhesive film 104 is disposed and the IC chip 105 or the flexible printed wiring board 106 is mounted thereon, the IC chip 105 or the like is pressed and heated using a flat pressure bonding head (not shown). Then, the anisotropic conductive adhesive film 104 is cured to perform thermocompression mounting.

  Further, the area around the mounted IC chip 105 and flexible printed wiring board 106 is sealed with a sealing resin in order to prevent corrosion of the ITO electrode on the glass substrate 101.

However, in such a conventional mounting method, three independent processes of COG mounting, FOG mounting, and sealing process are necessary, and the mounting efficiency is low and improvement is desired.
As prior art documents of the present invention, there are the following.

Microfilm of Japanese Utility Model No. 2-119742 (Japanese Utility Model Application No. 4-77134)

  The present invention has been made in order to solve the problems of the conventional technology, and an object of the present invention is to provide a mounting method capable of efficiently mounting electrical components of different mounting methods using an adhesive. To do.

The invention according to claim 1 made to achieve the above object is a mounting method for mounting an electrical component on a wiring board using a thermocompression bonding head having a compression bonding member made of a predetermined elastomer on a head body. After the adhesive is entirely disposed in the mounting area on the wiring board, an electrical component of a different mounting method is disposed in the mounting area, and a thermocompression bonding head having a crimping member having a size corresponding to the adhesive is used. And the step of thermocompression bonding the electrical components together.
According to a second aspect of the present invention, in the first aspect of the invention, a COG type electric component is used as the electric component.
According to a third aspect of the present invention, in the first or second aspect of the present invention, an FOG electrical component is used as the electrical component.
According to a fourth aspect of the present invention, in the first aspect of the present invention, an anisotropic conductive adhesive is used as the adhesive.
The invention according to claim 5 is the invention according to any one of claims 1 to 4, wherein the wiring board is a glass substrate for a liquid crystal display device.
According to a sixth aspect of the present invention, in the invention according to any one of the first to fifth aspects, mounting is performed by arranging a plurality of adhesives over the entire mounting area on the wiring board.
The invention according to claim 7 is the invention according to claim 6, wherein a belt-like adhesive is used as the adhesive.
The invention according to claim 8 is a mounting method in which an electric component is mounted on a wiring board using a thermocompression bonding head having a pressure bonding member made of a predetermined elastomer on the head body, and the wiring board has an ITO electrode. In addition to a glass substrate for a liquid crystal display device, the mounting region of the wiring substrate includes a region where a COG-type electrical component and a FOG-type electrical component are arranged. After placing the curable adhesive on the entire surface, placing the COG type electric component and the FOG type electric component in the mounting region, and thermocompression bonding having a pressure bonding member having a size corresponding to the adhesive A step of performing thermocompression bonding of the electrical components collectively using a head, and in the thermocompression bonding step, the binder resin of the adhesive disposed on the entire mounting region is heated using the thermocompression bonding head. By thermally curing the wear, it is characterized in that also serves as a step of sealing the ITO electrode.

  The present invention performs thermocompression bonding with an elastic pressure-bonding member made of a predetermined elastomer. For example, a plurality of highly reliable thermocompression mounting can be performed on electrical components having different heights. Corresponding to the adhesive after placing the adhesive on the entire mounting area on the wiring board, which is a glass substrate for liquid crystal display devices with electrodes, and then placing the COG and FOG electrical components in this mounting area Each mounting process (adhesive placement, temporary crimping, main crimping) that has been performed for each electrical component of each mounting method by thermocompression bonding these electrical components together using a thermocompression bonding head of the size Can be done at once.

  Moreover, in the present invention, the adhesive disposed over the entire mounting area on the wiring board is cured by thermocompression bonding, so that not only the area where the COG system and FOG system electrical parts are disposed, but also these electrical parts are disposed. Since the binder resin of the adhesive is also cured in the region that is not, the sealing function for the ITO electrode can be provided, and as a result, the conventional sealing process can be omitted.

  As described above, according to the present invention, the number of steps can be greatly reduced, so that it is possible to greatly improve the efficiency of mounting using an anisotropic conductive adhesive in the manufacture of a liquid crystal display device. become.

  Furthermore, in the present invention, if mounting is performed by arranging, for example, a plurality of strip-shaped adhesives in the entire mounting area on the wiring board, an adhesive having an optimum condition is used according to the electrical component to be mounted. Therefore, connection reliability can be further improved.

  According to the present invention, electrical components of different mounting methods can be efficiently mounted using an adhesive.

(A)-(d): It is explanatory drawing which shows the process of embodiment of this invention. It is a perspective view which shows the principal part of this Embodiment. It is a perspective view which shows the principal part of this Embodiment. It is explanatory drawing which shows the principal part of other embodiment of this invention. (A) (b): It is explanatory drawing which shows the principal part of other embodiment of this invention. It is a perspective view which shows the principal part of the embodiment. (A) (b): It is explanatory drawing which shows the example of the conventional mounting method.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electrical component mounting method according to the present invention will be described below in detail with reference to the drawings.
1A to 1D are explanatory views showing the steps of the present embodiment, and FIG. 2 is a perspective view showing the main part of the same embodiment.

  As shown in FIG. 1A, in the present embodiment, first, a glass substrate (wiring substrate) 1 on which a wiring pattern (not shown) is formed and an LCD panel 2 is provided is prepared.

  Here, the glass substrate 1 is placed on a base (not shown), and a heater is provided in the base.

  Then, an anisotropic conductive adhesive film (anisotropic conductive adhesive) 4 is stuck on the entire mounting area 3 of the glass substrate 1.

  The anisotropic conductive adhesive film 4 is obtained by dispersing conductive particles in a binder resin. In addition, if the quantity of the electroconductive particle disperse | distributed in binder resin is small, the melt viscosity as an adhesive agent handled by this invention will not be influenced by the presence or absence of dispersion | distribution of electroconductive particle.

  Next, as shown in FIG. 1B, an IC chip 5 that is, for example, a COG-type electrical component is mounted at a predetermined position of the anisotropic conductive adhesive film 4 and temporarily crimped.

  And as shown in FIG.1 (c), the edge part of the flexible printed wiring board 6 which is an electrical component of a FOG system, for example is mounted in the edge part of the anisotropic conductive adhesive film 4, and temporary crimping is performed.

  Further, as shown in FIG. 1D and FIG. 2, the main pressure bonding of the IC chip 5 and the flexible printed wiring board 6 is performed at once using the thermocompression bonding head 7.

  Here, the thermocompression bonding head 7 has a head body 8 made of a predetermined metal, and a heater for heating (not shown) is provided therein.

  A concave portion 8a is provided in a portion of the head main body 8 facing the glass substrate 1, and a crimping member 9 made of a plate-like elastomer is attached to the concave portion 8a so as to be in close contact with the inner wall of each concave portion 8a.

  The crimping member 9 of the present embodiment is arranged so that the planar crimping surface 9a is horizontal. And the crimping surface 9 a of the crimping member 9 is slightly larger than the size of the anisotropic conductive adhesive film 4, for example, so as to correspond to the size of the anisotropic conductive adhesive film 4 on the mounting region 3 of the glass substrate 1. It is configured as follows.

  Also, the thickness of the crimping member 9 is the same as that having the maximum thickness among the electrical components from the viewpoint of pressurizing the top of each electrical component and the fillet portion of the adhesive during thermocompression bonding with an optimum pressure. It is preferable to set so as to be above.

  On the other hand, in the case of the present invention, the type of elastomer of the crimping member 9 is not particularly limited, but from the viewpoint of improving connection reliability, it is preferable to use a rubber having a rubber hardness of 40 or more and 80 or less.

  An elastomer having a rubber hardness of less than 40 has a disadvantage that the pressure on each electrical component is insufficient and initial resistance and connection reliability are poor, and an elastomer having a rubber hardness of more than 80 has an insufficient pressure on the fillet portion. There is an inconvenience that voids are generated in the binder resin and the connection reliability is poor.

  In this specification, a standard conforming to JIS S 6050 is applied as the rubber hardness (temperature conditions are room temperature: 5 to 35 ° C.).

  As such an elastomer, both natural rubber and synthetic rubber can be used, but silicone rubber is preferably used from the viewpoint of heat resistance and pressure resistance.

  Using such a thermocompression bonding head 7, the pressure bonding surface 9 a of the thermocompression bonding head 7 is pressed against the tops of the IC chip 5 and the flexible printed wiring board 6 through a protective film (not shown), and the main compression bonding is performed under the following conditions.

  In the case of the present invention, from the viewpoint of surely preventing the generation of voids by sufficiently heating the fillet portion around each electrical component, each electrical component side is heated at a predetermined temperature during the main crimping. It is preferable to heat the glass substrate 1 side at a temperature higher than the above-mentioned predetermined temperature.

  Specifically, the heater of the thermocompression bonding head 4 is controlled so that the temperature of the pressure bonding member 9 is about 100 ° C., and the base is set so that the temperature of the binder resin of the anisotropic conductive adhesive film is about 200 ° C. Control the heater.

Thereby, in the said thermocompression bonding, the adhesive anisotropically conductive adhesive film 4 is heated so that the melt viscosity becomes 1.0 × 10 ² mPa · s or more and 1.0 × 10 ⁵ mPa · s or less.

Here, when the melt viscosity of the anisotropic conductive adhesive film 4 during thermocompression bonding is less than 1.0 × 10 ² mPa · s, the fluidity of the binder resin during thermocompression bonding is large and voids are generated. If the melt viscosity is larger than 1.0 × 10 ⁵ mPa · s, the binder resin cannot be completely removed at the connection part during thermocompression bonding, and voids are generated. There is an inconvenience that initial resistance and connection reliability are inferior.
In addition, the pressure at the time of this crimping | compression-bonding shall be about 100 seconds per about 15 seconds about each electrical component.

  In the present embodiment, by applying pressure with the above-described pressure-bonding member 9 made of elastomer, the tops of the IC chip 5 and the flexible printed wiring board 6 are pressed against the glass substrate 1 with a predetermined pressure, while the IC The adhesive fillet portion on the side of the chip 5 and the flexible printed wiring board 6 can be pressed with a pressure smaller than the pressure applied to the top portion, thereby connecting the IC chip 5 and the flexible printed wiring board 6 to the glass substrate 1. While sufficient pressure can be applied, the fillet portions around the IC chip 5 and the flexible printed wiring board 6 can be pressurized so as not to generate voids.

  As a result, according to the present embodiment, highly reliable connection can be made to the IC chip 5 and the flexible printed wiring board 6 of different mounting methods by using the anisotropic conductive adhesive film 4.

  And according to this Embodiment, it becomes possible to perform each mounting process (arrangement | positioning of an adhesive agent, temporary crimping | compression-bonding, this crimping | compression-bonding) performed for every IC chip 5 and the flexible printed wiring board 6 at once.

  In addition, in the present embodiment, the IC chip 5 and the flexible printed wiring are obtained by curing the binder resin of the anisotropic conductive adhesive film 4 disposed entirely on the mounting region 3 on the glass substrate 1 by thermocompression bonding. Since the binder resin of the anisotropic conductive adhesive film 4 is cured not only in the region where the plate 6 is disposed but also in the region where the IC chip 5 and the flexible printed wiring board 6 are not disposed, it has a sealing function for the ITO electrode. As a result, the conventional sealing process can be omitted.

  As described above, according to the present embodiment, the number of processes can be greatly reduced, so that the efficiency of mounting using the anisotropic conductive adhesive in the manufacture of the liquid crystal display device can be greatly improved. Is possible.

  The present invention is not limited to the above-described embodiment, and various changes can be made.

  For example, in the above-described embodiment, the case where two electrical components such as the IC chip 5 and the flexible printed wiring board 6 are mounted has been described as an example. However, the present invention is not limited to this, and three or more electrical components are included. It is also possible to apply when implementing.

  For example, as shown in FIG. 3, in addition to the IC chip 5 and the flexible printed wiring board 6, other electrical components 10 such as a COG resistor and a capacitor can be thermocompression bonded together.

  In this case, the other electrical components 10 are also temporarily crimped in the same manner as the IC chip 5 and the flexible printed wiring board 6 and are collectively crimped under the same conditions as in the above embodiment.

  4 (a) and 4 (b) are explanatory views showing the main part of another embodiment of the present invention, and FIG. 5 is a perspective view showing the main part of the same embodiment. The same reference numerals are given to the parts common to and the detailed description is omitted.

  As shown in FIGS. 4A, 4B and 5, in the present embodiment, a plurality of (three in the case of this example) strip-shaped anisotropic conductive adhesive films are used as the anisotropic conductive adhesive. 4a, 4b, and 4c are used, and these strip-like anisotropic conductive adhesive films 4a to 4c are adhered to the mounting region 3 of the glass substrate 1 over the entire surface.

  In the case of the present invention, although not particularly limited, it is preferable that the anisotropic conductive adhesive films 4a to 4c are arranged as close as possible from the viewpoint of improving the sealing function with respect to the ITO electrode.

  Further, each anisotropic conductive adhesive film 4a, 4b, 4c is not particularly limited, but from the viewpoint of improving the connection reliability, optimum conditions (binder material, It is preferable to select a conductive particle type, a film size, a thickness and the like.

  Also in the present embodiment, for example, the pressure-bonding surface 9a of the thermocompression bonding head 7 is anisotropic so as to correspond to the entire size of the anisotropic conductive adhesive films 4a to 4c on the mounting region 3 of the glass substrate 1. The size is slightly larger than the size of the pasting region of the entire conductive adhesive films 4a to 4c.

In the present embodiment, a plurality of IC chips 5 and other electrical components 10 are mounted side by side on the anisotropic conductive adhesive films 4a and 4b, and each is temporarily bonded, and further, the anisotropic conductive adhesive film 4c. The edge of the flexible printed wiring board 6 is mounted on the edge, and temporary pressure bonding is performed.
After that, as in the above embodiment, the IC chip 5, the other electrical components 10 and the flexible printed wiring board 6 are collectively pressure bonded together using the thermocompression bonding head 7.

  According to this embodiment, in addition to the fact that the mounting efficiency can be greatly improved as in the above-described embodiment, the anisotropic conductive adhesive films 4a to 4b having the optimum conditions depending on the electric components to be mounted. Since mounting can be performed using 4c, connection reliability can be further improved. Since other configurations and operational effects are the same as those of the above-described embodiment, detailed description thereof is omitted.

In this embodiment, the case where a plurality of strip-shaped anisotropic conductive adhesive films are used has been described as an example. However, the present invention is not limited to this, and a plurality of different shapes such as a square, a rectangle, and various other shapes are used. It is also possible to use a direction-conductive adhesive film.
However, when an alignment mark is provided for each electrical component mounted on the wiring board, it is preferable to use a strip-shaped anisotropic conductive adhesive film as in this embodiment.
That is, by using a strip-shaped anisotropic conductive adhesive film, a plurality of anisotropic conductive adhesive films can be arranged on the wiring board so as to avoid each alignment mark, so that mounting with higher accuracy is performed. Can do.

  Further, in the above-described embodiment, the case where the electrical component is mounted using the anisotropic conductive adhesive film has been described as an example, but it is also possible to use a paste-like anisotropic conductive adhesive. It is also possible to use an adhesive that does not contain conductive particles.

Furthermore, in the above-described embodiment, the pressure-bonding member of the thermocompression bonding head is not limited to the above-described embodiment, and various forms can be used.
For example, a device provided with a plurality of crimping members corresponding to the electric component to be mounted can be used.

  Moreover, in order to adjust the pressing force with respect to the electrical component, a frame or a protruding portion can be provided on the head main body, or a notch can be provided on the crimping member. Furthermore, the pressing force can be adjusted by forming the gap by forming the crimping member with a plurality of blocks.

In addition, the present invention can be applied not only when mounting electrical components on a glass substrate for a liquid crystal display device but also when mounting electrical components on various wiring substrates.
However, the present invention can reduce the number of man-hours and improve the mounting efficiency especially when mounting electrical components on a glass substrate for a liquid crystal display device.

1 …… Glass substrate (wiring board)
2 ... LCD panel 2
3 …… Mounting area 4 …… Anisotropic conductive adhesive film (Anisotropic conductive adhesive)
5 …… IC chip (electrical part)
6 …… Flexible printed circuit board (electrical parts)
7 …… Thermo-compression head 8 …… Head body 9 …… Crimping member 9a… Crimping surface

In such COG (CHIP ON GLASS) and FOG (FILM ON GLASS) mounting, for example, as shown in FIGS. 6A and 6B, a predetermined mounting region 101a of the glass substrate 101 provided with the LCD panel is provided. After the anisotropic conductive adhesive film 104 is disposed and the IC chip 105 or the flexible printed wiring board 106 is mounted thereon, the IC chip 105 or the like is pressed and heated using a flat pressure bonding head (not shown). Then, the anisotropic conductive adhesive film 104 is cured to perform thermocompression mounting.

The invention according to claim 1 made to achieve the above object is a mounting method for mounting an electrical component on a wiring board using a thermocompression bonding head having a compression bonding member made of a predetermined elastomer on a head body. The wiring board is a glass substrate for a liquid crystal display device having an ITO electrode, and the mounting area of the wiring board includes a region where a COG type electric component and a FOG type electric component are disposed, A single thermosetting adhesive is placed over the entire mounting area of the board, and then the COG type electrical component and the FOG type electrical part are placed in the mounting area. using thermocompression bonding head having a compression member sized collectively the electrical parts have a step of thermocompression bonding, in the thermocompression bonding process, the binder of the adhesive totally disposed in the mounting region By thermally cured by thermocompression bonding using a fat of the thermocompression bonding head, is characterized in that also serves as a step of sealing the ITO electrode.
Invention 請 Motomeko 2 in that in the invention of claim 1, wherein, as the adhesive is to use an anisotropic conductive adhesive.
According to a third aspect of the present invention, in the first or second aspect of the present invention, the wiring substrate is a glass substrate for a liquid crystal display device.
According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, mounting is performed by arranging a plurality of adhesives over the entire mounting region on the wiring board.
According to a fifth aspect of the present invention, in the fourth aspect of the present invention, a strip-shaped adhesive is used as the adhesive .

Specifically, the heater of the thermocompression bonding head 7 is controlled so that the temperature of the pressure bonding member 9 is about 100 ° C., and the base is set so that the temperature of the binder resin of the anisotropic conductive adhesive film is about 200 ° C. Control the heater.

Claims (8)

A mounting method for mounting an electrical component on a wiring board using a thermocompression bonding head having a pressure bonding member made of a predetermined elastomer in the head body,
After the adhesive is entirely disposed in the mounting area on the wiring board, an electrical component of a different mounting method is disposed in the mounting area, and a thermocompression bonding head having a crimping member having a size corresponding to the adhesive is used. A mounting method comprising a step of thermocompression bonding the electrical components together.   The mounting method according to claim 1, wherein a COG type electric component is used as the electric component.   The mounting method according to claim 1, wherein an FOG electrical component is used as the electrical component.   The mounting method according to claim 1, wherein an anisotropic conductive adhesive is used as the adhesive.   The mounting method according to claim 1, wherein the wiring board is a glass substrate for a liquid crystal display device.   The mounting method according to any one of claims 1 to 5, wherein mounting is performed by disposing a plurality of adhesives entirely on a mounting region on the wiring board.   The mounting method according to claim 6, wherein a strip-shaped adhesive is used as the adhesive. A mounting method for mounting an electrical component on a wiring board using a thermocompression bonding head having a pressure bonding member made of a predetermined elastomer in the head body,
The wiring substrate is a glass substrate for a liquid crystal display device having an ITO electrode, and the mounting region of the wiring substrate includes a region where a COG electrical component and a FOG electrical component are disposed,
Placing a single thermosetting adhesive on the mounting area of the wiring board, and then placing the COG electrical component and the FOG electrical component in the mounting area;
Using a thermocompression bonding head having a crimping member having a size corresponding to the adhesive, and a step of thermocompression bonding the electrical components together,
The thermocompression bonding process also serves as a process of sealing the ITO electrode by thermocompression bonding the binder resin of the adhesive disposed on the entire mounting region using the thermocompression bonding head. An implementation method characterized by that.

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