CN107079589A - The manufacture method of connector, the connection method of electronic unit, connector - Google Patents
The manufacture method of connector, the connection method of electronic unit, connector Download PDFInfo
- Publication number
- CN107079589A CN107079589A CN201580052796.8A CN201580052796A CN107079589A CN 107079589 A CN107079589 A CN 107079589A CN 201580052796 A CN201580052796 A CN 201580052796A CN 107079589 A CN107079589 A CN 107079589A
- Authority
- CN
- China
- Prior art keywords
- adhesive
- electronic unit
- circuit connection
- crimping process
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Combinations Of Printed Boards (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Present invention ensure that form the adhesive strength of the electronic unit brought by glue knurl, and prevent the rising of the connection resistance of being stained of the support table brought by adhesive resin, the bonding of substrate and electronic unit.This method is included in the bonding agent arrangement step that the adhesive for circuit connection (6) containing Photoepolymerizationinitiater initiater is set on the circuit substrate with photopermeability (2), and electronic unit (5) is configured on circuit substrate (2) across adhesive for circuit connection (6), electronic unit (5) is heated to the crimping process that presses and make adhesive for circuit connection (6) to solidify to circuit substrate (2), melt viscosity during heating-up temperature of the adhesive for circuit connection (6) in crimping process is below 4000Pas.
Description
Technical field
The present invention relates to connect electricity on the transparent substrate across the adhesive for circuit connection containing Photoepolymerizationinitiater initiater
The manufacture method of the connector of subassembly, across the adhesive for circuit connection containing Photoepolymerizationinitiater initiater on the transparent substrate
The connector for connecting the connection method of electronic unit and being manufactured using the manufacture method.
The application using Japanese patent application No. Patent 2014-212108 filed in 16 days October in 2014 of Japan as
Basis and CLAIM OF PRIORITY, this application by referring to and quote into the application.
Background technology
In the past, entered by the electronic unit such as the rigid substrates such as glass substrate, glass epoxy substrate and flexible base board, IC chip
During row connection, use and the adhesive resin for being dispersed with electroconductive particle as bonding agent is shaped to membranaceous anisotropy
Conducting film.If said in case of the connection terminal of the connection terminal of flexible base board and rigid substrates is attached
It is bright, then as shown in Fig. 6 (A), the region formed in two connection terminals 52,55 of flexible base board 51 and rigid substrates 54 it
Between configure anisotropic conductive film 53, appropriately configured fender 50 carries out heat by thermo-compression bonding tool 56 from flexible base board 51
Pressurization.Then, as shown in Fig. 6 (B), adhesive resin shows mobility, from the connection terminal 52 of flexible base board 51 with just
Property substrate 54 connection terminal 55 between flow out, and electroconductive particle in anisotropic conductive film 53 is held in two connections
It is flattened between terminal.
As a result, the connection terminal 55 of the connection terminal 52 of flexible base board 51 and rigid substrates 54 passes through electroconductive particle
And electrically connect, adhesive resin solidifies in this condition.It is not present in the electroconductive particle between two connection terminals 52,55
Adhesive resin is scattered in, the state of electric insulation is maintain.Hereby it is achieved that only flexible base board 51 connection terminal 52 with just
Conducted between the connection terminal 55 of property substrate 54.
In addition, in the side of rigid substrates 54, adhesive resin is extruded between flexible base board 51, with flexible base board
Glue knurl (fillet) is formed between 51 joint face, so as to improve adhesive strength.
But, in recent years, such as in the connection of the glass substrate and flexible base board of liquid crystal panel, glass substrate it is slim
Change in progress, and the maximization along with liquid crystal panel relative to electronic equipment casing, make the peripheral edge portion as picture
The narrow picture frameization that so-called picture frame portion narrows is also in progress.Therefore, in the connection for the anisotropic conductive film for having used thermohardening type
In method, hot pressed temperature is high, and the thermal shock for glass substrate, flexible base board becomes big.In addition, being connected to anisotropic conductive
After film, when temperature decreases up to normal temperature, due to the temperature difference, adhesive is shunk, and the glass substrate being thinned may be produced
Raw warpage.Therefore, it is possible to cause the undesirable conditions such as display inequality, the bad connection of flexible base board.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2005-26577 publications
The content of the invention
Invent problem to be solved
Therefore, it is also proposed that using the bonding agent of ultraviolet hardening come the bonding instead of using such thermohardening type
The connection method of the anisotropic conductive film of agent.Using ultraviolet hardening bonding agent connection method in, bonding agent by
In heat, softening is flowed, and carries out heating until for the trapping electroconductive particle between each electrode of glass substrate and flexible base board
Untill saying sufficient temperature, irradiated by ultraviolet and solidify bonding agent.
In the connection method of bonding agent for having used such ultraviolet hardening, in order that adhesive resin solidifies, no
Need to apply hyperpyrexia, the undesirable condition such as crooked as caused by for glass substrate, the thermal shock of flexible base board can be prevented.
In addition, in recent years, along with the maximization of the display in portable electronic device etc., having used light weight and having had
Flexible plastic base.Plastic base is compared with glass substrate etc., and the patience for thermal shock is also low, consolidates having used ultraviolet
In the connection process of the bonding agent of change type, it is desirable to the connection under the conditions of further low-temp low-pressure.
Here, because progress has used the law temperature joining of the bonding agent of ultraviolet hardening, therefore it can prevent under low temperature
The thermal shock brought, but then, there is the insufficient flow of adhesive in bonding agent, and electroconductive particle occurs in portion of terminal
Press-in is not enough, turns on the possibility of poor reliability.Therefore, the bonding agent of ultraviolet hardening needs to reduce the viscous of adhesive resin
Degree is in itself.
If however, the viscosity of reduction adhesive resin, there is following possibility：Carrying the ministrys of electronics industry such as flexible base board
Part, when being pressed by thermo-compression bonding tool, the adhesive resin melted is extruded from the side of substrate, spreads to the back of the body of substrate
Surface side.It is additionally, since adhesive resin and flows into the back side of substrate, thus has the possibility for supporting that the support table of substrate is defaced
Property, the possibility of substrate damage when thering is the substrate that will attach to support table to be peeled off in addition.
If improving the melt viscosity of adhesive resin to prevent the extrusion of such adhesive resin, glue is hindered
The formation of knurl, adhesive strength is not enough.In addition, under the conditions of low-temp low-pressure, the press-in of the electronic unit such as flexible base board is not enough, causes
The rising of conducting resistance.
Moreover, so the problem of not only in the case where having used the anisotropically conducting adhesive of light-cured type may hair
It is raw, and in the case where having used the anisotropically conducting adhesive of thermohardening type and optical and thermal curing type it can also happen that.
The present invention solves above-mentioned problem, and its object is to provide：Ensure to form the viscous of the electronic unit brought by glue knurl
Connect intensity, and prevent the connection resistance of being stained of the support table brought by adhesive resin, the bonding of substrate and electronic unit
Rising connector manufacture method；The connection method of electronic unit and the connector for having used the manufacture method to manufacture.
Method for solving problem
In order to solve above-mentioned problem, the manufacture method of connector of the present invention is included in the circuit with photopermeability
The bonding agent arrangement step of adhesive for circuit connection containing Photoepolymerizationinitiater initiater is set on substrate, and across foregoing circuit
Connecting adhesive configures electronic unit on foregoing circuit substrate, presses above-mentioned electronic unit to the heating of above-mentioned circuit substrate
The crimping process for pressing and making foregoing circuit connecting adhesive to solidify, foregoing circuit connecting adhesive is in above-mentioned crimping work
Melt viscosity during heating-up temperature in sequence is below 4000Pas.
Set in addition, the connection method of electronic unit of the present invention is included on the circuit substrate with photopermeability
The bonding agent arrangement step of adhesive for circuit connection containing Photoepolymerizationinitiater initiater, and across foregoing circuit connecting adhesive
Agent configures electronic unit on foregoing circuit substrate, above-mentioned electronic unit is heated into pressing to above-mentioned circuit substrate and made
State the crimping process of adhesive for circuit connection solidification, heating temperature of the foregoing circuit connecting adhesive in above-mentioned crimping process
Melt viscosity when spending is below 4000Pas.
In addition, connector of the present invention is the connector manufactured by the manufacture method of above-mentioned record.
The effect of invention
According to the present invention, melt viscosity during heating-up temperature due to making formal crimping process is below 4000Pas, because
This can fully be pressed into electroconductive particle by excluding adhesive resin, can obtain good conducting reliability.In addition,
According to the present invention, the extrusion width W of the glue knurl formed between circuit substrate and electronic unit also becomes appropriate, it is possible to achieve electricity
The bonding strength of base board and electronic unit improves and is also prevented from being stained for support table.
Brief description of the drawings
Fig. 1 applies the sectional view of one of the manufacture method of the connector of the present invention for expression.
Fig. 2 applies the stereogram of one of the manufacture method of the connector of the present invention for expression.
Fig. 3 is the side view for a mode for representing anisotropic conductive film.
Fig. 4 is the sectional view for schematically showing formal crimping process.
Fig. 5 is the top view of the surface density distribution for the electroconductive particle for schematically showing connector.
Fig. 6 is represents the sectional view of the manufacture method of conventional connector, and Fig. 6 (A) is decomposition section, and Fig. 6 (B) is just
Sectional view when formula is crimped.
Embodiment
Hereinafter, the manufacture method for the connector being applicable for the present invention, the connection method of electronic unit, connector, one
While being described in detail referring to the drawings one side.In addition, the present invention is not only limited to following embodiment, this is not being departed from
In the range of the purport of invention, it is even more natural that can carry out various become.In addition, accompanying drawing is schematical accompanying drawing, each chi
Very little ratio etc. is sometimes different from the ratio of reality.Specific size etc. should refer to the following description to be judged.In addition,
Certainly, it is also included in the different part of relation, the ratio of the mutual mutual size of accompanying drawing.
The connector that the present invention is applicable is on the circuit substrate with photopermeability, across anisotropic conductive bonding
Agent and the connector for being connected with the electronic units such as flexible base board, can be used for such as TV, PC, smart mobile phone, portable phone, trip
The display devices such as gaming machine, audio frequency apparatus, tablet terminal, wearable terminal, vehicle-mounted display screen, touch panel, other all electricity
Sub- equipment built-in substrate.In such substrate, from viewpoints such as fine-pitch, light weight slimmings, employ IC
Chip, the flexible base board for foring various circuits are directly installed on so-called COF (chip on the circuit substrate with photopermeability
On film (chip is connected on film)), COG (chip on glass (chip is connected on glass)), FOF (film on film (films
Upper junctional membrane)), FOG (film on glass (junctional membrane on glass)).In addition, being used as various substrates and IC chip, flexible base
Junction film used in the engagement of plate etc., has used the anisotropy that electroconductive particle is dispersed with adhesive resin layer mostly
Conducting film (ACF：anisotropic conductive film).
Hereinafter, one of the connector being applicable as the present invention, illustrates in various display screens as entering apparatus quilt
The touch sensor 1 of loading.As touch sensor 1, widely use and be combined with two and be formed with the film of electrode pattern, plastics etc.
The touch sensor of matrix, on the two sides of a matrix it is formed with the touch sensor of electrode pattern.
On the hyaline membrane 2 as matrix, be formed as rectangular as the electrode pattern of sensor portion, each electrode pattern with
The connection terminal 3 for being formed at the outer edge of hyaline membrane 2 is connected across Wiring pattern.Moreover, touch sensor 1 such as Fig. 1, figure
Shown in 2 like that, in multiple connection terminals 3 installation portion 4 arranged side by side, it is connected to the flexible base being connected with the controller of position detection
Plate 5.
On the hyaline membrane 2 of the matrix as touch sensor 1, it can use for example by PET (poly terephthalic acid second
Diol ester), makrolon, the material for attaching polyimide film on a pet film and enhancing, or add in annular ethylene series resin
Bonus point dissipates the membrane material that cycloolefin resin composition film of flexible body etc. etc. is formed by transparent synthetic resin.As
The electrode pattern of sensor portion is constituted, the transparent conductive material using organic conductive macromolecule as host can be used.Example
Such as, the composition including at least polythiofuran derivative polymer, water-soluble organic compounds and dopant can be enumerated.Using by this
The thickener of the organic conductive macromolecule formation of sample is for example directly patterned as printing-ink by screen painting, so that
The electrode pattern of regulation shape can be formed on the surface of hyaline membrane 2.Or, organic conductive macromolecule is coated on hyaline membrane
After 2 two sides, by including the transparent printing-ink of acid or alkaline reagent, make the high molecular layer segment of organic conductive bad
Change, so that electrode pattern can also be formed.In addition, for the patterning of electrode pattern, intaglio printing, ink-jet can be used
The various methods such as printing.In addition it is also possible to using the surface by the matrix by photosensitive material is coated with carrying out pattern-like
The photoetching process of exposure so as to form defined pattern etc..That is, as electrode pattern, as long as can be formed organic conductive high score
Son can then use the method beyond the above method as the transparent conductive material of host.
The multiple connection terminals 3 connected across each electrode pattern and Wiring pattern for example can be by the way that transparent be led
Electrolemma is filmed and formed using method known to sputtering, vacuum evaporation etc., or by the screen painting of silver paste material and
Directly patterning is formed, or is formed by being etched copper foil etc..Multiple connection terminals 3 are for example formed as substantially square
Shape, as shown in Fig. 2 being formed by arranging multiple along direction orthogonal to the longitudinal direction in the outer edge of hyaline membrane 2, so that structure
Into the installation portion 4 for being connected to flexible base board 5.
On the connection of the installation portion 4 and flexible base board 5, as the bonding agent of electric conductivity, anisotropic conductive can be used
Film (ACF：anisotropic conductive film)6.Anisotropic conductive film 6 as described later, is wrapped in adhesive resin
Containing electroconductive particle, by the connection terminal 7 of flexible base board 5 and the connection terminal 3 of hyaline membrane 2 is formed at across electroconductive particle
Electrical connection.
[flexible base board]
The flexible base board 5 that the installation portion 4 of hyaline membrane 2 is connected is connected with the controller of position detection (not shown), into
For the connector for being attached the connection terminal 3 constituted set by each electrode pattern of sensor portion with the controller.Such as
As shown in Figure 2, on flexible base board 5, the connection terminal 7 being connected with the connection terminal 3 of hyaline membrane 2 has in polyimides etc.
Arrange multiple and formed on one face 9a of flexible substrate 9.Connection terminal 7 is for example, by patterning and fitting copper foil etc.
Formed when to plating coating process such as the golden platings of surface implementation nickel, in the same manner as connection terminal 3, for example formed as substantially square
Shape, arranges multiple and is formed along direction orthogonal to the longitudinal direction.Width on width and the connection terminal 3 of connection terminal 7,
And the interval between adjacent connection terminal 7 and the interval between adjacent connection terminal 3, it is arranged with roughly the same pattern,
Connection terminal 7 is overlapping across anisotropic conductive film 6 with connection terminal 3.
[coating]
In addition, flexible base board 5 is provided with coating 8 in the vicinity of connection terminal 7.The protective substrate 9 of coating 8 with it is transparent
Other Wiring patterns that the face 9a that film 2 is connected is formed, set bond layer in a face of the Ranvier's membrane of insulating properties, lead to
The bond layer is crossed to be pasted on a face 9a of substrate 9.
On touch sensor 1, it is provided with the installation portion 4 for being provided with connection terminal 3 of hyaline membrane 2, flexible base board 5
The outer edge stricturization of connection terminal 7, therefore as shown in Figure 2, include covering to the covering near the outer rim of flexible base board 5
Layer 8 a part and be attached across anisotropic conductive film 6.Thus, touch sensor 1 ensures hyaline membrane 2 and flexible base
The reliability of electrical connection of plate 5, mechanical connection reliability.
[anisotropic conductive film]
Anisotropic conductive film 6 is the bonding agent of light-cured type, and carrying out heat by using thermo-compression bonding tool 20 described later adds
Press and liquidation, electroconductive particle 16 is flattened between each connection terminal 3,7 of hyaline membrane 2 and flexible base board 5, passes through illumination
Penetrate, electroconductive particle 16 solidifies in the state of being flattened.Thus, anisotropic conductive film 6 is by hyaline membrane 2 and flexible base board
5 electrical connections, mechanical connection.
It is by adhesive resin 15 (bonding agent) for example as shown in Figure 3 on anisotropic conductive film 6
Dispersed electro-conductive particle 16, the thermosetting is bonded material composition be coated on Ranvier's membrane 17 it is membranaceous each to different so as to be shaped to
Property conducting film.
It is for example in PET (polyethylene terephthalate), OPP (oriented polypropylene (OPP)), PMP on Ranvier's membrane 17
The removers such as the upper coating organosilicon such as (poly- 4- methylpentenes -1), PTFE (polytetrafluoroethylene (PTFE)) are formed.
Adhesive resin 15 is not particularly limited if light-cured type, can use radical polymerization mould assembly, cation
Aggretion type etc..Hereinafter, illustrated for the adhesive resin of radical polymerization mould assembly.
The adhesive resin of radical polymerization mould assembly contains film formation resin, radically curing compound, radical polymerization
Initiator.As film formation resin, can use phenoxy resin, epoxy resin, polyester resin, polyurethane resin,
Thermoplastic elastomer (TPE)s such as polyamide, EVA etc..Wherein, for heat resistance, cementability, preferably use and synthesized by bisphenol-A and epichlorohydrin
Bisphenol A-type phenoxy resin.
, can be appropriate from (methyl) acrylate used in the fields such as bonding agent as free-radical polymerised compound
Select to use.In addition, in this specification, so-called (methyl) acrylate is to include acrylate (acrylic acid
Ester) (acrylate (acrylate)) and methacrylate (methacrylic acid ester) (methacrylate
(methacrylate) implication).
As the concrete example of free-radical polymerised compound, epoxy acrylate, isocyanuric acid EO can be enumerated and be modified dipropyl
Olefin(e) acid ester, Tricyclodecane Dimethanol diacrylate, dihydroxymethyl-tristane diacrylate, polyethylene glycol diacrylate
Ester, urethane acrylate, acrylic acid 2- hydroxy methacrylates, acrylic acid 2- hydroxy propyl esters, acrylic acid 4- hydroxybutyls, propylene
Sour isobutyl ester, tert-butyl acrylate, Isooctyl acrylate monomer, double phenoxetol fluorenes diacrylates, 2- acryloyl-oxyethyls
Butanedioic acid, lauryl acrylate, stearyl acrylate ester, isobornyl acrylate, cyclohexyl acrylate, three (2- hydroxyethyls) are different
Cyanurate triacrylate, acrylic acid tetrahydro furfuryl ester, phthalic acid diglycidyl ether acrylate, ethoxylation
Bisphenol a dimethacrylate, bisphenol-a epoxy acrylate and (methyl) acrylate corresponding with them etc., can make
It is one kind or two or more with them.Wherein, acrylate, urethane acrylate etc. are preferably used.It is used as in the market energy
The concrete example enough obtained, can enumerate trade name " M-315 ", " M1600 " of East Asia compound probability Co. Ltd. system etc..
Optical free radical polymerization initiator suitably can select to use from known radical polymerization initiator.
As the radical polymerization initiator of photo-polymerization type, ethyl ketone, 1- [9- ethyls -6- (2- toluyls can be enumerated
Base) -9H- carbazole -3- bases] -, 1- (O- acetyl oxime), benzophenone, 4,4- double (diethylamino) benzophenone, 2,4,6- tri-
The thioxanthene ketone class such as methyl benzophenone；Diethoxy acetophenone, 2- hydroxy-2-methyl -1- phenyl-propane -1- ketone, benzil two
The acetophenones such as methyl ketal；The benzoin ethers such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether；2,4,
It is 6- trimethylbenzoyls diphenyl phosphine oxide, double (2,6- Dimethoxybenzoyls) -2,4,4- trimethylpentylphosphine oxides, double
Acylphosphine oxide class such as (2,4,6- trimethylbenzoyls)-phenyl phosphine oxide etc..
These radical polymerization initiators can be used alone a kind, or be two kinds or more to use.Wherein, preferably make
With 1,1- bis- (tert-butyl hydroperoxide) hexamethylene, double (2,4,6- trimethylbenzoyls)-phenyl phosphine oxides etc..It is used as in the market
The concrete example resulted in, can enumerate trade name " IRGACURE OXE02 " etc. of BASF Japanese (strain).
In addition, as the other additives coordinated in circuit connection material, as needed, can containing silane coupler,
Inorganic filler, acrylic rubber, various acrylic monomers etc. dilution with monomer, filler, softening agent, colouring agent, fire retardant,
Thixotropic agent etc..
As silane coupler, it is not particularly limited, such as epoxy, amino system, sulfydryl-sulfide-based, urea can be enumerated
Base system etc..By adding silane coupler, the cementability of the interface of organic material and inorganic material can be improved.
In addition, as inorganic filler, being not particularly limited, silica, talcum, titanium oxide, calcium carbonate, oxygen can be used
Change magnesium etc..By adding inorganic filler, so as to control the mobility of adhesive resin 15, particle trapping rate is improved.
As electroconductive particle 16, known any electroconductive particle used in anisotropic conductive film 6 can be enumerated.
As electroconductive particle 16, the various metals such as can enumerate nickel, iron, copper, aluminium, tin, lead, chromium, cobalt, silver, gold, metal alloy
Particle；The particle of metal is coated with the surface of the particles such as metal oxide, carbon, graphite, glass, ceramics, plastics；Or at this
The surface of a little particles is further coated with particle of insulation film etc..The feelings of the particle of metal are coated with the surface of resin particle
Under condition, as resin particle, for example, epoxy resin, phenolic resin, acrylic resin, acrylonitrile-styrene (AS) can be enumerated
The particle of resin, benzoguano amine resin, divinyl benzene series resin, phenylethylene resin series etc..
In addition, on anisotropic conductive film 6, the viewpoint such as easiness, storage stability from operation can be set to
In the face with being laminated with Ranvier's membrane 17, an opposite surface side sets the composition of cover layer.In addition, the shape of anisotropic conductive film 6
It is not particularly limited, it is for instance possible to use the strip belt shape of winding reel 18 can be wound in, cuts into defined length and come
Use.
In addition, the anisotropic conductive film of following sandwich constructions can be made in anisotropic conductive film 6 of the present invention,
That is, by the adhesive resin layer containing electroconductive particle 16 and the adhesive composite by the insulating properties without electroconductive particle
The anisotropic conductive film for the sandwich construction that the insulating properties bond layer of formation is laminated.In addition, the connection institute of flexible base board 5
The anisotropically conducting adhesive used can also make in addition to it can use and be shaped to membranaceous anisotropic conductive film 6
Pasted with the anisotropic conductive of pasty state.
[melt viscosity]
Here, the anisotropic conductive film 6 that this technology is related to is utilized in the formal crimping process of flexible base board 5 described later
The melt viscosity during heating-up temperature that thermo-compression bonding tool 20 is brought is below 4000Pas.Pass through adding formal crimping process
The melt viscosity of anisotropic conductive film 6 during hot temperature is set to the scope, thus even in used light-cured type it is each to
In anisotropic conductive film 6, formal crimping process under the conditions of low-temp low-pressure, adhesive resin 15 displays that appropriate mobility,
By using connection terminal 3,7 to be fully pressed into electroconductive particle 16, it can be ensured that conducting reliability.
In addition, adhesive resin 15 shows appropriate mobility, thus adhesive resin from flexible base board 5 stretch out it is transparent
The side 2a of film 2 is moderately extruded, and glue knurl 21 is formed by the irradiation of ultraviolet light.Thus, in hyaline membrane 2 and flexible base board 5
Between adhesive resin 15 contact area increase, and adhesive resin 15 is fused to hyaline membrane 2, the base material of flexible base board 5
In, so-called anchoring effect is played by solidification, so as to realize the raising of adhesive strength.
In addition, the anisotropic conductive film 6 that this technology is related to utilizes heat preferably in the formal crimping process of flexible base board 5
The melt viscosity during heating-up temperature that crimping tool 20 is brought is more than 1000Pas.By making to heat in formal crimping process
The melt viscosity of anisotropic conductive film 6 during temperature is the scope, so that flexible base of the adhesive resin 15 in hyaline membrane 2
The side 2a extrusions that plate 5 stretches out, the extrusion width W of the glue knurl 21 formed turns into appropriate length, it is possible to achieve with adhesive
The raising for the adhesive strength that the increase of the connection area of resin 15 is brought, and adhesive resin 15 is also prevented from from transparent
The side 2a of film 2 spreads to the back side and pollutes support table.
Particularly, the anisotropic conductive film 6 that this technology is related to is thermally compressed work by being utilized in formal crimping process is made
The heating-up temperatures brought of tool 20 are in less than 100 DEG C of low temperature crimping process, to make the melt viscosity during heating-up temperature
More than 1000Pas below 4000Pas, so as to realize ensuring and bonding with flexible base board 5 strong for conducting reliability
The raising of degree, and the thermal shock for hyaline membrane 2, flexible base board 5 can also be suppressed, prevent crooked undesirable condition of Denging.
[manufacturing process]
Then, illustrated for the manufacturing process of touch sensor 1.The manufacturing process of touch sensor 1 includes following
Process：Anisotropic conductive film 6 is configured into the bonding agent arrangement step on the installation portion 4 of hyaline membrane 2；And across each to different
Property conducting film 6 configures flexible base board 5 on hyaline membrane 2, and flexible base board 5 is heated into pressing, and irradiating ultraviolet light to hyaline membrane 2
So that the formal crimping process that anisotropic conductive film 6 solidifies.
[interim adhering processes]
First, anisotropic conductive film 6 is pasted onto on hyaline membrane 2 (bonding agent arrangement step) temporarily.It is interim to paste each
The method of anisotropy conducting film 6 is on the connection terminal 3 of hyaline membrane 2, so that adhesive resin 15 turns into the side of connection terminal 3
Mode, configures anisotropic conductive film 6.After adhesive resin 15 is configured on connection terminal 3, utilized from the side of Ranvier's membrane 17
Thermo-compression bonding tool is heated and pressurizeed and adhesive resin 15 is transferred into hyaline membrane 2, by Ranvier's membrane 17 from adhesive resin
15 peel off.
[alignment process/interim crimping process]
Then, while opposite across adhesive resin 15 according to the connection terminal 7 of transparency electrode 6 and flexible base board 5
Mode carries out the alignment of flexible base board 5, while configuring flexible base board 5 on hyaline membrane 2, mobility is shown in adhesive resin 15
Degree low-temp low-pressure under the conditions of carry out flexible base board 5 interim crimping.Thus, the warpage of hyaline membrane 2 is suppressed to minimum,
In addition also flexible base board 5 is not caused by thermally-induced damage.
[formal crimping process]
Then, as shown in Figure 4, by the way that flexible base board 5 is heated into pressing and irradiating ultraviolet light to hyaline membrane 2, from
And electrically connect, mechanically connect (formal crimping process).In formal crimping process, by thermo-compression bonding tool 20, make adhesive tree
The low temperature that fat 15 flows is heated, and in the connection terminal 7 and hyaline membrane 2 for electroconductive particle 4 is held on flexible base board 5
Connection terminal 3 between defined pressure under pressurizeed.In addition, being separated between the hot pressurized plane of thermo-compression bonding tool 20 by silicon
The fender 22 of the elastic material formation of the sheets such as rubber.
In addition, in formal crimping process, by ultraviolet radiation device 23, from the backside illuminated ultraviolet light of hyaline membrane 2.By purple
The ultraviolet that outside line irradiator 23 is sent is irradiated in adhesive tree through transparent support table 24 such as the glass for supporting hyaline membrane 2
Fat 15.
As ultraviolet radiation device 23, LED, mercury vapor lamp, metal halide lamp etc. can be used.In addition, ultraviolet shines
Emitter 23 is configured at the dorsal part of support table 24, with proceed by the heating of the flexible base board 5 brought using thermo-compression bonding tool 20 by
Only postpone the defined time while pressure or from pressing is begun to warm up, start ultraviolet irradiation.Thus, by using heat
Crimping tool 20 and be heated pressing so as to viscosity reduction, by the connection terminal 7 of connection terminal 3 and the flexible base board 5 of hyaline membrane 2
Electroconductive particle 16 is clamped, and adhesive resin 15 is extruded in the side of hyaline membrane 2, on such opportunity, ultraviolet irradiation
Device 23 carries out ultraviolet irradiation, solidifies adhesive resin 15.
Thus, flexible base board 5 is electrically connected, is mechanically connected on hyaline membrane 2, and sets glue knurl 21, so as to form bonding
The touch sensor 1 that intensity is improved.
During the heating-up temperature that here, as described above, the utilization thermo-compression bonding tool 20 of anisotropic conductive film 6 is brought
Melt viscosity is set to below 4000Pas.Therefore, according to this technology, even in low less than as 10MPa, such as 3~5MPa
In formal crimping process under the conditions of pressure, adhesive resin 15 can also show appropriate mobility, be filled by connection terminal 3,7
Divide ground press-in electroconductive particle 16.
On the other hand, if the utilization thermo-compression bonding tool 20 of anisotropic conductive film 6 bring heating-up temperature when melting
Viscosity is higher than 4000Pas, then the mobility of adhesive resin 15 is low, and the exclusion of the adhesive resin between connection terminal 3,7 is not
Foot, therefore the press-in of electroconductive particle 16 is not enough, infringement conducting reliability.
In addition, by gluing melting during heating-up temperature that the utilization thermo-compression bonding tool 20 of anisotropic conductive film 6 brings
Spend for more than 1000Pas, so that the adhesive resin 15 that the side of the hyaline membrane 2 stretched out in flexible base board 5 is extruded is squeezed
Go out width W as appropriate length, the glue knurl 21 of appropriate size can be formed by the irradiation of ultraviolet light, bonding can be improved
Intensity.
On the other hand, if the utilization thermo-compression bonding tool 20 of anisotropic conductive film 6 bring heating-up temperature when melting
Viscosity is less than 1000Pas, then adhesive resin 15 spreads to the back side of hyaline membrane 2, so as to occur transparent support table 24
The damaged danger of hyaline membrane when being stained, peeling off the hyaline membrane 2 for being adhered to support table 24 2.
Further, according to this technology, as formal crimping process, the heating temperature brought in progress using thermo-compression bonding tool 20
In the case of spending for less than 100 DEG C, such as low temperature crimping as 80 DEG C, by the way that the melt viscosity during heating-up temperature is set to
More than 1000Pas below 4000Pas, so as to realize ensuring and bonding with flexible base board 5 strong for conducting reliability
The raising of degree, and the thermal shock for hyaline membrane 2, flexible base board 5 can also be suppressed, prevent crooked undesirable condition of Denging.
[the surface density distribution of electroconductive particle]
Here, the touch sensor 1 manufactured by this manufacturing process is by using the conduction after the crimping of thermo-compression bonding tool 20
Property particle 16 show as defined in surface density distribution so that realize adhesive strength and conducting reliability raising.Specifically, as schemed
Shown in 5 like that, on touch sensor 1, hyaline membrane 2 be connected with flexible base board 5 after electroconductive particle 16 surface density be distributed
For：The installation portion 4 of flexible base board 5 and anisotropy electrolemma 6 will be being pressed from thermo-compression bonding tool 20 throughout to foring glue knurl 21
The particle density of outer edge 12 of lateral border of hyaline membrane 2 be set to (a), will be hot pressed in the installation portion 4 that bonding tool 20 is pressed
Two connection terminals 3,7 on particle density when being set to (b), a ＞ b.
Here, so-called surface density distribution, refers to the electric conductivity grain on the same plane of above-mentioned outer edge 12 and installation portion 4
The distribution of density a, b of son 16, the plane that electroconductive particle 16 in installation portion 4 is clamped between two connection terminals 3,7 is same
Particle density b progress pair on two connection terminals 3,7 in the particle density a and installation portion 4 of outer edge 12 in one plane
Than.
It is a primary object of the present invention to：By the heating pressing of thermo-compression bonding tool 20 so as to anisotropic conductive film 6
Adhesive resin 15 is flowed, and by forming glue knurl 21 in the side of hyaline membrane 2, conducting reliability is taken into account and viscous so as to realize
Connect intensity.If moreover, being irradiated by ultraviolet and being properly cured glue knurl 21, hindering the flowing in outer edge 12, because
This has different mobility at grade, and electroconductive particle 16 is accumulated in the maximum of outer edge 12 and turns into high density.
It is clamped between two connection terminals 3,7 in the installation portion 4 of electroconductive particle 16, by the heat pressurization of thermo-compression bonding tool 20 so as to viscous
Mixture resin 15 is extruded, therefore particle density diminishes relatively.
By possessing the Density Distribution of such electroconductive particle 16, anisotropic conductive film 6 is in hyaline membrane 2 and flexible base
Between plate 5, glue knurl 21 is properly formed using adhesive resin 15, adhesive strength can be improved.That is, according to anisotropic conductive
The density (a) of electroconductive particle 16 in film 6, outer edge 12 is higher than the density (b) of the electroconductive particle in installation portion 4, therefore
Understand that more adhesive resins 15 flow and are cured in outer edge 12.Moreover, as shown in Figure 4, passing through outer edge
The adhesive resin 15 flowed in 12, glue knurl 21 is formd between hyaline membrane 2 and flexible base board 5 throughout ground.Thus, respectively to different
Hyaline membrane 2 can be securely engaged by property conducting film 6 with flexible base board 5.
In addition, by possessing the Density Distribution of such electroconductive particle 16, so as on anisotropic conductive film 6, glue
Mixture resin 15 moderately flows out between two connection terminals 3,7, therefore the press-in carried out by using thermo-compression bonding tool 20 can
Positively to clamp electroconductive particle 16, conducting reliability can be improved.
That is, by confirming that the surface density of the installation portion 4 and the electroconductive particle 16 in outer edge 12 is distributed, so as to letter
Change places to check to realize and take into account cementability and feature.That is, such destructive inspection is checked without peel strength, and determined
Particle surface density, so as to understand to strengthen the end as starting point is peeled off according to the raising of the local strength by glue knurl position
Portion and electroconductive particle 16 is appropriate between two connection terminals 3,7 in the installation portion 4 being pressed by thermo-compression bonding tool 20
Ground clamping has been reached the biasing of electroconductive particle 16, non-can broken so as to keep the mode of anisotropic conductive well
The inspection of adhesive strength and conducting reliability bad and that simply carry out hyaline membrane 2 and flexible base board 5.
[other]
Among above-mentioned, it will be illustrated in case of flexible base board 5 will have been used as electronic unit, but the present invention is removed
It can use beyond flexible base board 5, can also use IC chip, flexible flat cable, rigid substrates, carrier package (TCP)
Deng.
Embodiment
Then, illustrated for embodiments of the invention.In the present embodiment, using containing light-cured type or being heating and curing
The anisotropic conductive film of the curing agent of type, is formd in evaluation with the company that evaluation flexible base board is connected with plastics ilm substrate
Junctor sample.For each connector sample, conducting reliability evaluation, the measure of the extrusion width (mm) of glue knurl, particle have been carried out
The crooked evaluation of plastics ilm substrate after the measure and crimping process of surface density (pcs/200 × 200 μm).
[anisotropic conductive film]
Anisotropic conductive film passes through the institute of table 1 used in the manufacture for the connector sample that each embodiment and comparative example are related to
Formula (the unit shown：Mass parts), prepare this 4 kinds of A~D.The anisotropic conductive film that formula A~C is related to is light-cured type
Bonding agent, the anisotropic conductive films that are related to of formula D are the bonding agent of heat-curing type.
[table 1]
The mixed solution that A~D each formula is related to is coated with a pet film, is dried using baking oven, so as to be shaped to
16 μm of thickness, width 20cm, length 30cm it is membranaceous.Anisotropic conductive film the leading before crimping that A~D each formula is related to
The density of conductive particles is 20pcs/200 × 200 μm.
[evaluation flexible base board]
Evaluation has been used with flexible base board in a face of the polyimide substrate of 25 μm of thickness, is formed with and is implemented Au platings
12 μm of thickness copper wiring pattern substrate.Wiring closet is away from for 400 μm, and L/S=1/1.
[plastics ilm substrate is used in evaluation]
As the circuit substrate of evaluation used in anisotropic conductive film, use on the PET film of 50 μm of thickness
ITO electrode is set and the overlays of Cu electrodes is laminated with the ITO electrode (thickness of electrode is respectively 0.1 μ
m).Wiring closet is away from for 400 μm, and L/S=1/1.
Carry out in the plastics ilm substrate interim stickup and the evaluation flexible base board of above-mentioned anisotropic conductive film
Interim crimping, then pressurizes and utilizes on one side and with the heat carried out using thermo-compression bonding tool ultraviolet radiation device (ZUV-C30H：Europe
Nurse dragon Co. Ltd. system) carry out ultraviolet irradiation, while formally being crimped, form connector sample.
On the formal crimping temperature of thermo-compression bonding tool, it is set in embodiment 1, embodiment 2, comparative example 1, comparative example 3
80 DEG C, 130 DEG C are set in comparative example 2, comparative example 4.In addition, the formal crimping pressure of thermo-compression bonding tool and time implement each
All be in example and each comparative example 4MPa, 5 seconds, in the hot pressurized plane of thermo-compression bonding tool, be separated with 450 μm of thickness silicon rubber it is slow
Rush material.In addition, ultraviolet radiation device is configured at the dorsal part for the transparent support table for supporting transparent plastic ilm substrate, except comparative example 3
In addition, since using thermo-compression bonding tool carry out flexible base board heating press start 4 seconds after ultraviolet irradiation, irradiate
1 second.The end of heat pressurization of the end of irradiation with being carried out using thermo-compression bonding tool is set to simultaneously.In addition, the illumination of ultraviolet is
180mW/cm2(spike is long：365nm).
Moreover, the connector sample being related on each embodiment and comparative example, determine initial turn-on resistance value (Ω) and
Conduction resistance value (Ω) after reliability test.The condition of reliability test is 60 DEG C of 95%RH100hr.On conduction resistance value
Measure, be that digital multimeter is connected to the transparent plastic ilm substrate being connected with evaluation with the connection terminal of flexible base board
ITO electrode or Cu electrodes, resistance value when flowing through electric current 2mA is determined using so-called 4 terminal method, is determined 30 times, is averaged
Value is used as conduction resistance value.On conducting reliability evaluation, 5 below Ω are set to OK, the situation that will be greater than 5 Ω is set to NG.
On the extrusion width W of the glue knurl of connector sample, by the side for the plastics ilm substrate stretched out from flexible base board,
The width W (reference picture 4) of the glue knurl formed on aspect of measure direction is carried out.Moreover, lifting company from transparent support table after connection
Junctor sample, connector sample overlay substrate-side (face contacted with the hot pressurized plane of thermo-compression bonding tool it is opposite
Side) or transparent support table sheet with, if extrusion adhesive it is unattached if be set to OK, NG is set to if any one is attached to.
On connector sample electroconductive particle surface density distribution, by from the area pressed of thermo-compression bonding tool throughout to
The particle density being formed with the outer edge area of the lateral border of the transparent plastic ilm substrate of glue knurl is set to (a), will utilize thermo-compression bonding
Particle density in the area pressed that instrument is produced is set to (b), determines the particle on same plane in each 200 × 200 μm of region
Density.
The crooked of overlay after crimping is visually carried out, and is gone out in the area pressed produced using thermo-compression bonding tool
The situation of existing apparent fluctuating situation is set to ×, will it not confirm same outer outside fluctuating situation, presentation and area pressed
The situation of sight is set to zero.
[embodiment 1]
In embodiment 1, the anisotropic conductive film for being formulated the light-cured type that A is related to has been used.It is each to different that formula A is related to
Property heating-up temperature (80 DEG C) of the conducting film in formal crimping process when melt viscosity be 1000Pas.What embodiment 1 was related to
The conducting reliability evaluation of connector sample is 5 below Ω (OK), and the extrusion width W of glue knurl is 550 μm (OK).In addition, outer rim
Particle density (a) in region be the particle density (b) in 12.1pcs/200 × 200 μm, area pressed for 4.2pcs/200 ×
200μm.Further, do not confirm yet connector sample overlay it is crooked.
[embodiment 2]
In embodiment 2, the anisotropic conductive film for being formulated the light-cured type that B is related to has been used.It is each to different that formula A is related to
Property heating-up temperature (80 DEG C) of the conducting film in formal crimping process when melt viscosity be 4000Pas.What embodiment 2 was related to
The conducting reliability evaluation of connector sample is 5 below Ω (OK), and the extrusion width W of glue knurl is 400 μm (OK).In addition, outer rim
Particle density (a) in region be the particle density (b) in 11.1pcs/200 × 200 μm, area pressed for 4.5pcs/200 ×
200μm.Further, do not confirm yet connector sample overlay it is crooked.
[comparative example 1]
In comparative example 1, the anisotropic conductive film for being formulated the light-cured type that C is related to has been used.It is each to different that formula C is related to
Property heating-up temperature (80 DEG C) of the conducting film in formal crimping process when melt viscosity be 10000Pas.Comparative example 1 is related to
The conducting reliability evaluation of connector sample be 20 more than Ω (NG), the extrusion width W of glue knurl is 200 μm (OK).In addition, outer
Particle density (a) in edge region is that the particle density (b) in 8.4pcs/200 × 200 μm, area pressed is 4.2pcs/200
×200μm.In addition, not confirming the crooked of the overlay of connector sample.
[comparative example 2]
In comparative example 2, the anisotropic conductive film for being formulated the light-cured type that C is related to has been used.In addition, in comparative example 2, will
Heating-up temperature in formal crimping process is set to 130 DEG C.The conducting reliability evaluation for the connector sample that comparative example 2 is related to is 5
Below Ω (OK), the extrusion width W of glue knurl is 350 μm (OK).In addition, the particle density (a) in outer edge area is 11.5pcs/
200 × 200 μm, the particle density (b) in area pressed is 4.6pcs/200 × 200 μm.In addition, confirming connector sample
Overlay it is crooked.
[comparative example 3]
In comparative example 3, the anisotropic conductive film for being formulated the heat-curing type that D is related to has been used.Formula D be related to it is each to
Melt viscosity during heating-up temperature (80 DEG C) of the anisotropic conductive film in formal crimping process is 1000Pas.Comparative example 3 is related to
The conducting reliability evaluation of connector sample be 20 more than Ω (NG), the extrusion width W of glue knurl is 550 μm (OK).In addition, outer
Particle density (a) in edge region is that the particle density (b) in 13.5pcs/200 × 200 μm, area pressed is 5.1pcs/200
×200μm.In addition, not confirming the crooked of the overlay of connector sample.
[comparative example 4]
In comparative example 4, the anisotropic conductive film for being formulated the light-cured type that A is related to has been used.In addition, in comparative example 4, will
Heating-up temperature in formal crimping process is set to 130 DEG C.The conducting reliability evaluation for the connector sample that comparative example 4 is related to is
5 below Ω (OK), the extrusion width W of glue knurl is wide, is 900 μm (NG).In addition, the particle density (a) in outer edge area is
Particle density (b) in 12.9pcs/200 × 200 μm, area pressed is 4.7pcs/200 × 200 μm.In addition, confirming connection
The overlay of body sample it is crooked.
[table 2]
As shown in table 2 like that, in the connector sample that embodiment 1 and embodiment 2 are related to, the heating temperature of formal crimping process
Melt viscosity when spending turns into 1000~4000Pas, therefore by excluding adhesive resin, is led so as to fully be pressed into
Conductive particles, obtain good conducting reliability.In addition, in the connector sample that embodiment 1 and embodiment 2 are related to, glue knurl
Extrusion width W also turn into appropriate width, realize the raising of the bonding strength of plastics ilm substrate and flexible base board.This also may be used
It is distributed to confirm with the particle density for the connector sample being related to by embodiment 1 and embodiment 2.Further, embodiment 1 and implementation
In the connector sample that example 2 is related to, the crooked of plastics ilm substrate is not confirmed yet.
On the other hand, in the connector sample that comparative example 1 is related to, the melt viscosity during heating-up temperature of formal crimping process
Height, is 10000Pas, because the press-in of electroconductive particle is not enough, therefore conducting reliability evaluation declines, in addition, adhesive tree
The extrusion width W of fat is also small, and bonding strength is also reduced.
In addition, the connector sample being related on comparative example 2, by being improved relative to comparative example 1 in formal crimping process
Crimping temperature, so as to improve the mobility of adhesive resin, therefore in conducting reliability and the extrusion width W of glue knurl side
The plastics ilm substrate that face is seen after improvement, but crimping shows crooked.
Use in the connector sample that the comparative example 3 of the anisotropic conductive film of thermohardening type is related to, due to 80 DEG C
Low-temperature heat, curing reaction becomes insufficient, and the conducting reliability evaluation obtained via reliability test declines.
The connector sample being related on comparative example 4, using melt viscosity at 80 DEG C it is low, be 1000Pas formula A
Anisotropic conductive film, the crimping temperature in formal crimping process is improved to 130 DEG C, therefore the mobility of adhesive resin
Become superfluous, the extrusion width W of glue knurl is big, and adhesive resin spreads to the back side of plastics ilm substrate, the plastics after crimping in addition
Ilm substrate shows crooked.
Symbol description
1：Touch sensor；2：Hyaline membrane；3：Connection terminal；4：Installation portion；5：Flexible base board；6：Anisotropic conductive
Film；7：Connection terminal；8：Coating；9：Substrate；10：Wiring pattern；12：Outer edge；20：Thermo-compression bonding tool；21：Glue knurl；22：
Fender；23：Ultraviolet radiation device；24：Support table.
Claims (9)
1. a kind of manufacture method of connector, including following processes：
The bonding agent of adhesive for circuit connection containing Photoepolymerizationinitiater initiater is set on the circuit substrate with photopermeability
Arrangement step；And
Electronic unit is configured on the circuit substrate across the adhesive for circuit connection, by the electronic unit to described
Circuit substrate heating pressing, and the crimping process for solidifying the adhesive for circuit connection,
Melt viscosity during heating-up temperature of the adhesive for circuit connection in the crimping process for 4000Pas with
Under.
2. the manufacture method of connector according to claim 1, wherein, the adhesive for circuit connection is in the crimping
Melt viscosity during heating-up temperature in process is more than 1000Pas.
3. the manufacture method of connector according to claim 1 or 2, wherein, the circuit substrate is plastics ilm substrate,
In the crimping process, temperature of the electronic unit below 100 DEG C is heated.
4. the manufacture method of connector according to claim 1 or 2, wherein, in the crimping process, in the electronics
The side for the circuit substrate that part stretches out, the adhesive for circuit connection extrusion, forms glue knurl,
On the particle density of the electroconductive particle contained by the adhesive for circuit connection after crimping process, the glue knurl
Region is higher than the area pressed of the electronic unit.
5. the manufacture method of connector according to claim 3, wherein, in the crimping process, in the ministry of electronics industry
The side for the circuit substrate that part stretches out, the adhesive for circuit connection extrusion, forms glue knurl,
On the particle density of the electroconductive particle contained by the adhesive for circuit connection after crimping process, the glue knurl
Region is higher than the area pressed of the electronic unit.
6. the manufacture method of connector according to claim 1 or 2, wherein, the circuit substrate is the biography of touch panel
Sensor film.
7. the manufacture method of connector according to claim 1 or 2, wherein, the electronic unit is flexible base board.
8. a kind of connection method of electronic unit, including following processes：
The bonding agent of adhesive for circuit connection containing Photoepolymerizationinitiater initiater is set on the circuit substrate with photopermeability
Arrangement step；And
Electronic unit is configured on the circuit substrate across the adhesive for circuit connection, by the electronic unit to described
Circuit substrate heating pressing, and the crimping process for solidifying the adhesive for circuit connection,
Melt viscosity during heating-up temperature of the adhesive for circuit connection in the crimping process for 4000Pas with
Under.
9. the connector manufactured by method according to any one of claims 1 to 7.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-212108 | 2014-10-16 | ||
| JP2014212108A JP6609406B2 (en) | 2014-10-16 | 2014-10-16 | Connection body manufacturing method, electronic component connection method, connection body |
| PCT/JP2015/078867 WO2016060098A1 (en) | 2014-10-16 | 2015-10-13 | Method of manufacturing connector, method for connecting electronic component, and connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107079589A true CN107079589A (en) | 2017-08-18 |
| CN107079589B CN107079589B (en) | 2020-06-09 |
Family
ID=55746644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580052796.8A Active CN107079589B (en) | 2014-10-16 | 2015-10-13 | Method for manufacturing connected body, method for connecting electronic component, and connected body |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6609406B2 (en) |
| KR (1) | KR102476432B1 (en) |
| CN (1) | CN107079589B (en) |
| TW (1) | TWI688176B (en) |
| WO (1) | WO2016060098A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111052881A (en) * | 2017-09-11 | 2020-04-21 | 日立化成株式会社 | Adhesive film for circuit connection and method for producing same, method for producing circuit connection structure, and adhesive film housing module |
| CN111526669A (en) * | 2020-05-07 | 2020-08-11 | 深圳市晶泓科技有限公司 | Transparent circuit board and manufacturing method of transparent LED display screen |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018150897A1 (en) * | 2017-02-15 | 2018-08-23 | デクセリアルズ株式会社 | Anisotropic conductive connection structure body, production method for anisotropic conductive connection structure body, anisotropic conductive film, and anisotropic conductive paste |
| CN109389903B (en) * | 2017-08-04 | 2021-01-29 | 京东方科技集团股份有限公司 | Flexible substrate, processing method thereof and processing system thereof |
| JP6619783B2 (en) * | 2017-09-21 | 2019-12-11 | 株式会社タムラ製作所 | Electrode connection method and electronic substrate manufacturing method |
| KR102395732B1 (en) | 2018-01-15 | 2022-05-09 | 파이 크리스탈 가부시키가이샤 | Flexible substrate, electronic device, manufacturing method of electronic device |
| CN109739037B (en) * | 2018-11-23 | 2023-12-15 | 深圳市新盈恒科技有限公司 | Liquid crystal display of convenient maintenance |
| WO2021161948A1 (en) * | 2020-02-10 | 2021-08-19 | パイオニア株式会社 | Electronic device and method for manufacturing electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003234017A (en) * | 1993-07-29 | 2003-08-22 | Hitachi Chem Co Ltd | Circuit connecting material and circuit connecting method using the same |
| JP2012124504A (en) * | 2005-02-02 | 2012-06-28 | Sony Chemical & Information Device Corp | Method of implementing electrical component |
| JP2012178441A (en) * | 2011-02-25 | 2012-09-13 | Sekisui Chem Co Ltd | Method of manufacturing connection structure and connection structure |
| WO2012169497A1 (en) * | 2011-06-06 | 2012-12-13 | デクセリアルズ株式会社 | Connection method, connected-body production method and connected body |
| JP2013062302A (en) * | 2011-09-12 | 2013-04-04 | Sekisui Chem Co Ltd | Method of manufacturing connection structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005026577A (en) | 2003-07-04 | 2005-01-27 | Matsushita Electric Ind Co Ltd | Mounting method of electronic component |
| JP5690648B2 (en) * | 2011-04-28 | 2015-03-25 | デクセリアルズ株式会社 | Anisotropic conductive film, connection method and connection structure |
-
2014
- 2014-10-16 JP JP2014212108A patent/JP6609406B2/en active Active
-
2015
- 2015-10-12 TW TW104133331A patent/TWI688176B/en active
- 2015-10-13 WO PCT/JP2015/078867 patent/WO2016060098A1/en active Application Filing
- 2015-10-13 KR KR1020167036449A patent/KR102476432B1/en active IP Right Grant
- 2015-10-13 CN CN201580052796.8A patent/CN107079589B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003234017A (en) * | 1993-07-29 | 2003-08-22 | Hitachi Chem Co Ltd | Circuit connecting material and circuit connecting method using the same |
| JP2012124504A (en) * | 2005-02-02 | 2012-06-28 | Sony Chemical & Information Device Corp | Method of implementing electrical component |
| JP2012178441A (en) * | 2011-02-25 | 2012-09-13 | Sekisui Chem Co Ltd | Method of manufacturing connection structure and connection structure |
| WO2012169497A1 (en) * | 2011-06-06 | 2012-12-13 | デクセリアルズ株式会社 | Connection method, connected-body production method and connected body |
| JP2013062302A (en) * | 2011-09-12 | 2013-04-04 | Sekisui Chem Co Ltd | Method of manufacturing connection structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111052881A (en) * | 2017-09-11 | 2020-04-21 | 日立化成株式会社 | Adhesive film for circuit connection and method for producing same, method for producing circuit connection structure, and adhesive film housing module |
| CN111052881B (en) * | 2017-09-11 | 2024-02-13 | 株式会社力森诺科 | Adhesive film for circuit connection, method for producing same, method for producing circuit connection structure, and adhesive film housing assembly |
| CN111526669A (en) * | 2020-05-07 | 2020-08-11 | 深圳市晶泓科技有限公司 | Transparent circuit board and manufacturing method of transparent LED display screen |
| CN111526669B (en) * | 2020-05-07 | 2021-07-23 | 深圳市晶泓科技有限公司 | Transparent circuit board and manufacturing method of transparent LED display screen |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016082070A (en) | 2016-05-16 |
| WO2016060098A1 (en) | 2016-04-21 |
| JP6609406B2 (en) | 2019-11-20 |
| TW201633638A (en) | 2016-09-16 |
| KR20170069962A (en) | 2017-06-21 |
| KR102476432B1 (en) | 2022-12-09 |
| CN107079589B (en) | 2020-06-09 |
| TWI688176B (en) | 2020-03-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107079589A (en) | The manufacture method of connector, the connection method of electronic unit, connector | |
| CN1926675B (en) | Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film | |
| CN108702845B (en) | Method for manufacturing connection structure | |
| JP5685473B2 (en) | Anisotropic conductive film, method for manufacturing bonded body, and bonded body | |
| WO2009079216A1 (en) | Conductive adhesive precursor, method of using the same, and article | |
| CN107978579A (en) | Electronic unit, connector, the design method of electronic unit | |
| JP2014096531A (en) | Method for manufacturing connection structure and connection method | |
| CN107432084A (en) | Anisotropic conductive connection structural bodies, anisotropic conductive connection method and anisotropically conducting adhesive | |
| WO2022102573A1 (en) | Circuit-connection adhesive film and method for producing same, and circuit connection structure and method for producing same | |
| CN106715622B (en) | Radical polymerization type adhesive composition and method for producing electric connection body | |
| CN103797078B (en) | Circuit connection material and use method of attachment and the connection structural bodies of this circuit connection material | |
| KR101973823B1 (en) | Anisotropic conductive connection material, film laminate, connection method, and connection structure | |
| CN106063043B (en) | Anisotropic conductive film and method for producing same | |
| CN105940562B (en) | Anisotropic conductive film and its manufacturing method | |
| JP2002358825A (en) | Anisotropic conductive adhesion film | |
| JP2009111326A (en) | Mounting method of circuit member | |
| WO2006134880A1 (en) | Multilayer film, method for producing same, method for selecting supporting body for multilayer film, and method for evaluating supporting body for multilayer film | |
| CN105473674A (en) | Radical polymerization type adhesive composition, and method for producing electrical connection body | |
| KR101828192B1 (en) | Electrical connection material | |
| CN105940559B (en) | Anisotropic conductive film and method for producing same | |
| CN107230646A (en) | The manufacture method of connector | |
| US20240355665A1 (en) | Adhesive sheet, production method for adhesive sheet, roll, and production method for connection structure | |
| JP2016076628A (en) | Method of manufacturing connection body, connection method of electronic component, connection body | |
| JP2017098413A (en) | Repair method and connection method | |
| JP2014090185A (en) | Manufacturing method of connection structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1240744 Country of ref document: HK |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |