JP2003234017A - Circuit connecting material and circuit connecting method using the same - Google Patents

Circuit connecting material and circuit connecting method using the same

Info

Publication number
JP2003234017A
JP2003234017A JP2002305396A JP2002305396A JP2003234017A JP 2003234017 A JP2003234017 A JP 2003234017A JP 2002305396 A JP2002305396 A JP 2002305396A JP 2002305396 A JP2002305396 A JP 2002305396A JP 2003234017 A JP2003234017 A JP 2003234017A
Authority
JP
Japan
Prior art keywords
film
circuit connecting
circuit
connecting material
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002305396A
Other languages
Japanese (ja)
Other versions
JP4228652B2 (en
Inventor
Mitsugi Fujinawa
貢 藤縄
Isao Tsukagoshi
功 塚越
Tomohisa Ota
共久 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2002305396A priority Critical patent/JP4228652B2/en
Publication of JP2003234017A publication Critical patent/JP2003234017A/en
Application granted granted Critical
Publication of JP4228652B2 publication Critical patent/JP4228652B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film shape circuit connecting material which enables hardening of it under heating condition of rather low temperature of 140°C or less and enables its good connecting efficiency because of efficient fluidity of its connecting component when it is connected. <P>SOLUTION: The film shape circuit connecting material is composed in such a way that electrically conductive particles of 0.05 to 20 vol.% whose diameters are 1 to 18 μm are dispersed in the connecting component. The component is composed by combining sulfonium of 0.05 to 10 wt. which has benzyl of specified structure with composite material of 100 wt. which contains cation polymer and polymers having molecular weights of 10,000 to 80,000, wherein liquid viscosity of the connecting component at 100°C is 1 to 1,000 Pa.s. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、2つの回路基板を
互いに接着するとともに、同じ回路基板上にある隣接回
路を短絡させることなく、2つの回路基板の互いに向き
合う導体間を電気的に導通させることのできるフィルム
状回路接続材料及びその接続材料を用いた接続方法に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention adheres two circuit boards to each other and electrically connects between the conductors facing each other of the two circuit boards without short-circuiting adjacent circuits on the same circuit board. The present invention relates to a film-like circuit connecting material that can be used and a connecting method using the connecting material.

【0002】[0002]

【従来の技術】2つの回路基板を互いに接着するととも
に、2つの回路基板の互いに向き合う導体間を、回路を
短絡させることなく電気的に導通させることのできる、
回路接続材料としては、ウレタン系、ポリエステル系、
アクリル系などの熱可塑性物質や、エポキシ系、シリコ
ーン系などの熱硬化性物質を含む接着成分中に、導電性
粒子を分散させたものが知られている(例えば、特開昭
52−59889号、特開昭55−164007号参
照)。
2. Description of the Related Art Two circuit boards can be adhered to each other, and conductors of the two circuit boards facing each other can be electrically connected to each other without short-circuiting the circuit.
As circuit connection materials, urethane-based, polyester-based,
It is known that conductive particles are dispersed in an adhesive component containing a thermoplastic material such as an acrylic material or a thermosetting material such as an epoxy material or a silicone material (for example, JP-A-52-59889). , JP-A-55-164007).

【0003】接着成分が熱硬化性物質であるとき、その
熱硬化性物質を硬化させるための硬化剤又は触媒として
は、エポキシ樹脂に対してアニオン重合型硬化剤である
第3アミンやイミダゾール類が主として用いられる。第
3アミン類やイミダゾール類を配合したエポキシ樹脂は
160℃〜200℃程度の中温で、数10秒〜数時間程
度の加熱により硬化するために可使時間が比較的長い。
さらに、第3アミンやイミダゾール類をマイクロカプセ
ル化することにより可使時間が延長されることが知られ
ている(例えば、特開平4−314724号参照)。
When the adhesive component is a thermosetting substance, as a curing agent or a catalyst for curing the thermosetting substance, a tertiary amine or an imidazole which is an anionic polymerization type curing agent for the epoxy resin is used. Mainly used. Epoxy resins containing tertiary amines and imidazoles have a relatively long pot life because they cure at a medium temperature of 160 ° C. to 200 ° C. and are heated for several tens of seconds to several hours.
Further, it is known that the pot life is extended by encapsulating a tertiary amine or an imidazole (for example, see JP-A-4-314724).

【0004】上記アニオン重合型硬化剤のほか、カチオ
ン重合型硬化剤がある。カチオン重合型硬化剤として
は、エネルギー線照射により樹脂を硬化させる感光性オ
ニウム塩、例えば、芳香族ジアゾニウム塩、芳香族スル
ホニウム塩などが知られている。またエネルギー線照射
以外に、加熱によっても活性化してエポキシ樹脂を硬化
させるものとして、脂肪族スルホニウム塩が知られてい
る(例えば、特開昭57−102922号、特開昭58
−198532号参照)。
In addition to the anionic polymerization type curing agents, there are cationic polymerization type curing agents. As a cationic polymerization type curing agent, a photosensitive onium salt that cures a resin by irradiation with energy rays, such as an aromatic diazonium salt or an aromatic sulfonium salt, is known. Aliphatic sulfonium salts are known as those which are activated by heating in addition to irradiation with energy rays to cure the epoxy resin (for example, JP-A-57-102922 and JP-A-58).
-198532).

【0005】[0005]

【特許文献1】特開昭52−59889号公報[Patent Document 1] JP-A-52-59889

【特許文献2】特開昭55−164007号公報[Patent Document 2] JP-A-55-164007

【特許文献3】特開平4−314724号公報[Patent Document 3] Japanese Patent Laid-Open No. 4-314724

【特許文献4】特開昭57−102922号公報[Patent Document 4] Japanese Patent Laid-Open No. 57-102922

【特許文献5】特開昭58−198532号公報[Patent Document 5] JP-A-58-198532

【0006】[0006]

【発明が解決しようとする課題】イミダゾール類などを
硬化剤とする接着成分を用いた回路接続材料で回路基板
上の導体間を電気的に導通させる際、接続時間を例え
ば、15秒に限定すると、140℃以下の加熱温度では
接続部の信頼性が不十分であった。そして140℃以上
とすると、ポリカーボネートのように軟化点が低い熱可
塑性材料を用いた基板に対しては、熱的ダメージを与え
るという問題があった。
When electrically connecting between conductors on a circuit board with a circuit connecting material using an adhesive component containing an imidazole or the like as a curing agent, the connecting time is limited to, for example, 15 seconds. At a heating temperature of 140 ° C. or lower, the reliability of the connection was insufficient. If the temperature is 140 ° C. or higher, there is a problem that a substrate using a thermoplastic material having a low softening point such as polycarbonate is thermally damaged.

【0007】さらに、接続時間を5秒に限定すると、2
00℃以下の接続温度では接続部の信頼性が不十分であ
り、接続温度を200℃以上とすると、回路基板の熱膨
張等により接続部のずれ等が生じるという問題があっ
た。
Further, if the connection time is limited to 5 seconds, 2
When the connection temperature is 00 ° C. or lower, the reliability of the connection portion is insufficient. When the connection temperature is 200 ° C. or higher, there is a problem that the connection portion is displaced due to thermal expansion of the circuit board.

【0008】また、回路接続材料で回路基板上の導体間
を電気的に導通させるには、接続部の厚みを、接続材料
中の導電性粒子の直径以下にする必要があり、用いた硬
化剤とカチオン重合性物質を含む組成物との反応性及び
該組成物の流動性の調節が重要となる。流動性が悪い
と、接続不良となる。
Further, in order to electrically connect the conductors on the circuit board with the circuit connecting material, the thickness of the connecting portion must be equal to or less than the diameter of the conductive particles in the connecting material. It is important to control the reactivity of the composition with a composition containing a cationically polymerizable substance and the fluidity of the composition. Poor fluidity results in poor connection.

【0009】芳香族ジアゾニウム塩を硬化剤とする接着
成分は、回路基板が、エネルギー線を透過しないので使
用できない。また、脂肪族スルホニウム塩を硬化剤とす
るものも、イミダゾール類などを硬化剤とするものと同
様の問題がある。
An adhesive component containing an aromatic diazonium salt as a curing agent cannot be used because the circuit board does not transmit energy rays. Further, the one using an aliphatic sulfonium salt as a curing agent has the same problem as the one using an imidazole or the like as a curing agent.

【0010】本発明は、互いに向き合う回路基板同士の
導体間を接続するとき、接続時間が10秒〜20秒と限
定した場合でも、耐熱性に劣る基板に対しても熱的ダメ
ージを与えることのないように、140℃以下の比較的
低温の加熱条件で硬化でき、さらに接続時間を短く限定
した、5秒でも接続部のずれ等が少なく、200℃以下
の比較的中温の加熱条件で硬化でき、室温で10時間以
上の可使時間を有し、接続時に接着剤成分が十分に流動
し良好な接続性を有するフィルム状回路接続材料を提供
することを目的とするものである。
According to the present invention, when the conductors of the circuit boards facing each other are connected, even if the connection time is limited to 10 seconds to 20 seconds, thermal damage is caused even to a board having poor heat resistance. So that it can be cured under relatively low temperature heating conditions of 140 ° C or less, and the connection time is limited to 5 seconds with minimal misalignment of the connection part, and curing under relatively moderate temperature heating conditions of 200 ° C or less. Another object of the present invention is to provide a film-like circuit connecting material which has a pot life of 10 hours or more at room temperature and has a sufficient flowability of the adhesive component at the time of connection and has good connectivity.

【0011】[0011]

【課題を解決するための手段】本発明者らは、2つの回
路基板上の、互いに向き合う回路導体間を140℃以下
の加熱では60秒以内で、140〜200℃の加熱では
30秒以内で接続できかつ室温では不活性な接続材料に
ついて鋭意検討した結果、ベンジル基を有する芳香族ス
ルホニウム塩より選択された感熱性スルホニウム塩を用
いることにより上記目的が達成されることを見出し、本
発明を完成したものである。
The inventors of the present invention have taken 60 seconds or less to heat the circuit conductors facing each other on two circuit boards at 140 ° C. or less and 30 seconds or less to heat them at 140 to 200 ° C. As a result of extensive studies on a connecting material which can be connected and is inactive at room temperature, it was found that the above object can be achieved by using a heat-sensitive sulfonium salt selected from an aromatic sulfonium salt having a benzyl group, and the present invention has been completed. It was done.

【0012】本発明は、カチオン重合性物質と分子量1
0,000以上80,000以下のポリマー類を含む組
成物100重量部に対して化2で示されるベンジル基を
含有するスルホニウム塩を、0.05〜10重量部配合
した接着成分に、粒子径が1〜18μmである導電性粒
子を0.05〜20体積%分散し、接着成分の100℃
における溶融粘度が1〜1,000Pa・sであること
を特徴とするフィルム状回路接続材料である。
The present invention comprises a cationically polymerizable substance and a molecular weight of 1.
Particle size of an adhesive component in which 0.05 to 10 parts by weight of the benzyl group-containing sulfonium salt represented by Chemical formula 2 is mixed with 100 parts by weight of a composition containing 50,000 or more and 80,000 or less polymers is used. Of conductive particles having a particle size of 1 to 18 μm dispersed in an amount of 0.05 to 20% by volume, and the adhesive component at 100 ° C.
The film-like circuit connecting material has a melt viscosity of 1 to 1,000 Pa · s.

【化2】 化2中、R1が電子吸引性の基であり、R2及びR3が電
子供与性の基で、R1、R 2及びR3は、置換又は非置換
の基であり、互いに同じでも異なっていてもよく、Y
は、非求核性陰イオンである。
[Chemical 2] R in chemical formula 21Is an electron-withdrawing group, and R2And R3Electric power
R is the basis of childhood1, R 2And R3Is substituted or unsubstituted
And may be the same or different from each other, Y
Is a non-nucleophilic anion.

【0013】[0013]

【発明の実施の形態】R1としては、カチオン重合の開
始剤として推定されるベンジルカチオンを発生させるた
めに、電子吸引性の基、例えば、ニトロソ基、カルボニ
ル基、カルボキシル基、シアノ基、トリアルキルアンモ
ニウム基、フルオロメチル基などが好ましく、R2及び
3としては、電子供与性の基、例えば、アミノ基、水
酸基、メチル基などが好ましい。Yは、非求核性陰イ
オンであればよく、例えば、ヘキサフルオロアルセネー
ト(AsF6 )、ヘキサクロロアンチモネート(SbC
6 )、ヘキサフルオロホスフェート(PF6 )、テト
ラフルオロボレート(BF 4 )が挙げられる。
BEST MODE FOR CARRYING OUT THE INVENTION R1As for the development of cationic polymerization
The benzyl cation, which is supposed to be the initiator, is generated.
For example, electron-withdrawing groups such as nitroso group and carbon
Group, carboxyl group, cyano group, trialkylammonium
R, R, R, R, R, R, R2as well as
R3Is an electron-donating group, for example, an amino group or water.
An acid group and a methyl group are preferred. YIs a non-nucleophilic yin
It may be on, for example, hexafluoroarsene
To (AsF6 ), Hexachloroantimonate (SbC
l 6 ), Hexafluorophosphate (PF6 ), Tet
Rafluoroborate (BF Four ) Is mentioned.

【0014】これらのスルホニウム塩は140℃以下の
温度で活性化し、カチオン重合を引き起こすことがで
き、かつ室温(25℃)においてカチオン重合性物質の
存在下で、10時間以上経過後の反応性接着剤の粘度
が、初期粘度の2倍以下である。また、これらのスルホ
ニウム塩は必要に応じて溶解可能な各種溶媒(例えば酢
酸エチル)に溶解して使用できる。スルホニウム塩の配
合量は、接着成分100重量部に対して0.05〜10
重量部とする。接着成分100重量部に対して、1.5
〜5重量部とするのが特に好ましい。配合量が多いと、
電食の原因となりやすく、また、硬化反応が爆発的に進
行するので望ましくない。
These sulfonium salts can be activated at a temperature of 140 ° C. or lower to cause cationic polymerization, and at room temperature (25 ° C.), in the presence of a cationically polymerizable substance, reactive adhesion after 10 hours or more has elapsed. The viscosity of the agent is not more than twice the initial viscosity. In addition, these sulfonium salts can be used by dissolving them in various solvents (for example, ethyl acetate) which can be dissolved, if necessary. The blending amount of the sulfonium salt is 0.05 to 10 parts by weight with respect to 100 parts by weight of the adhesive component.
Parts by weight. 1.5 to 100 parts by weight of the adhesive component
It is particularly preferable that the amount is -5 parts by weight. If the blending amount is large,
It is not desirable because it easily causes electrolytic corrosion and the curing reaction explosively proceeds.

【0015】接着成分中に分散させる導電性粒子として
は、加熱加圧又は単なる加圧により変形するものが好ま
しい。導電性粒子が変形することにより、接続時に回路
との接触面積が増加し、接続信頼性が向上し、回路の厚
みや平坦性のばらつき、回路が突起したものとそうでな
いものが混在しているときでも、良好な接続が行える。
この変形は、導電性粒子自体が変形するもの、導電性粒
子が凝集体を形成していて、接続時に凝集状態を変える
ものいずれでもよい。
The conductive particles dispersed in the adhesive component are preferably those which are deformed by heat or pressure. The deformation of the conductive particles increases the contact area with the circuit during connection, improves the connection reliability, and has variations in the thickness and flatness of the circuit. Good connections can be made even at times.
This deformation may be either a deformation of the conductive particles themselves or a modification of the conductive particles forming an aggregate and changing the aggregation state at the time of connection.

【0016】導電性粒子としては、Au、Ag、Ni、
Cu、Sb、Sn、はんだなどの金属粒子や、カーボン
など導電性を有する物質の粒子、これらの粒子又は非導
電性のガラス、セラミックス、プラスチック粒子を核と
して表面に他の導電性材料を被覆したものがある。更
に、導電性粒子を核とし、この核の表面を絶縁層で被覆
し、加圧したときに内部の核が絶縁層を破って接触する
ようにしたものも有効である。このような導電性粒子を
用いると、加圧方向に直角方向の絶縁性が確保され、回
路間の狭い細線回路の接続に極めて有効である。導電性
粒子の粒径は、回路中で隣接する線間距離よりも小さく
ないと、隣接回路間を短絡させる。また、接続時の加圧
により変形して、横に拡がることも考慮して、導電性粒
子の粒径は1〜18μmであるのが好ましい。必要によ
り、絶縁粒子を、導電性粒子間の接触を妨げない程度に
併用してもよい。
The conductive particles include Au, Ag, Ni,
Metal particles such as Cu, Sb, Sn, and solder, particles of a conductive substance such as carbon, these particles or non-conductive glass, ceramics, and plastic particles are used as cores for coating the surface with other conductive materials. There is something. Further, it is also effective that the conductive particles are used as nuclei, the surfaces of the nuclei are covered with an insulating layer, and the inner nuclei rupture the insulating layers and come into contact with each other when pressurized. When such conductive particles are used, the insulating property in the direction perpendicular to the pressurizing direction is ensured, and it is extremely effective for connecting a narrow wire circuit between circuits. If the particle size of the conductive particles is not smaller than the distance between adjacent lines in the circuit, the adjacent circuits are short-circuited. Further, it is preferable that the particle size of the conductive particles is 1 to 18 μm in consideration of the fact that the conductive particles are deformed by the pressure applied at the time of connection and spread laterally. If necessary, insulating particles may be used in combination to the extent that they do not prevent contact between the conductive particles.

【0017】導電性粒子の配合量は、接着時に、加圧方
向にのみ導電性を生ずる程度とするのが好ましい。回路
中で、隣接する線間距離や導電性粒子の径によって異な
るが、接着成分に対して、0.05〜20体積%の範
囲、好ましくは、0.1〜15体積%、より好ましく
は、0.2〜10体積%とする。20体積%をこえる
と、透明性が悪化し、接続する回路の位置合わせが困難
となる。0.05体積%より少ないと導電性を得られな
い。
The amount of the conductive particles to be blended is preferably such that conductivity is generated only in the pressing direction during adhesion. In the circuit, it depends on the distance between adjacent lines and the diameter of the conductive particles, but is in the range of 0.05 to 20% by volume, preferably 0.1 to 15% by volume, more preferably, to the adhesive component. 0.2 to 10% by volume. When it exceeds 20% by volume, the transparency is deteriorated and it becomes difficult to align the circuits to be connected. If it is less than 0.05% by volume, conductivity cannot be obtained.

【0018】接着成分の100℃における溶融粘度が、
1〜1,000Pa・s、特に、10〜1,000Pa
・sである場合に、接着成分がよく流動して接続厚みが
導電性粒子の径よりも小さくなる。1,000Pa・s
以上であると、流動性が悪く接続厚みが導電性粒子の径
よりも厚くなり接続性が悪い。1〜10Pa・sの範囲
であるときには、初期に圧力を小さくし、接着成分があ
る程度硬化してから圧力を高めるなどの注意が必要とな
る。1Pa・s以下では、流動しすぎて成着成分が接続
部外に流れ出し、接続部分に保持されにくく、信頼性が
悪くなる。溶融粘度の調整については、後述する。
The melt viscosity of the adhesive component at 100 ° C.
1 to 1,000 Pa · s, especially 10 to 1,000 Pa
In the case of s, the adhesive component flows well and the connection thickness becomes smaller than the diameter of the conductive particles. 1,000 Pa · s
When it is above, the fluidity is poor and the connection thickness is larger than the diameter of the conductive particles, resulting in poor connectivity. When the pressure is in the range of 1 to 10 Pa · s, it is necessary to reduce the pressure in the initial stage and increase the pressure after the adhesive component is cured to some extent. When the pressure is 1 Pa · s or less, the flow rate is excessive and the deposition component flows out of the connection portion and is difficult to be retained in the connection portion, resulting in poor reliability. The adjustment of the melt viscosity will be described later.

【0019】接着成分中のスルホニウム塩をマイクロカ
プセル化すると接着成分の貯蔵安定性がよくなる。カチ
オン重合性物質とスルホニウム塩とが貯蔵中に互いに接
触しないためである。マイクロカプセル化する方法は、
溶剤蒸発法、スプレードライ法、コアセルベーション
法、界面重合法、などとくに制限はない。マイクロカプ
セルの粒径は小さいほうがよく、スルホニウム塩は疎水
性であるので、界面重合法によるのが好ましい。
When the sulfonium salt in the adhesive component is microencapsulated, the storage stability of the adhesive component is improved. This is because the cationically polymerizable substance and the sulfonium salt do not come into contact with each other during storage. The method of microencapsulation is
The solvent evaporation method, spray drying method, coacervation method, interfacial polymerization method, etc. are not particularly limited. The smaller the particle size of the microcapsules is, the better the sulfonium salt is hydrophobic, and therefore the interfacial polymerization method is preferable.

【0020】接着成分中、カチオン重合性物質として
は、エポキシ樹脂、ポリビニルエーテル、ポリスチレン
などがあり、これらは、単独で用いてもよく、併用して
もよい。また、他のポリマーや重量平均分子量3000
以下の固形樹脂と混合して用いることもできる。
The cationically polymerizable substance in the adhesive component includes epoxy resin, polyvinyl ether, polystyrene and the like, and these may be used alone or in combination. In addition, other polymers and weight average molecular weight 3000
It can also be used as a mixture with the following solid resins.

【0021】前記カチオン重合性物質のうち、エポキシ
樹脂がもっとも好適である。エポキシ樹脂は、1分子中
に2個以上のエポキシ基を有する化合物であり、例え
ば、エピクロルヒドリンとビスフェノールA又はビスフ
ェノールFなどから誘導されるビスフェノール型エポキ
シ樹脂や、ポリグリシジルエーテル、ポリグリシジルエ
ステル、脂還式エポキシ樹脂などが挙げられる。
Of the above cationically polymerizable substances, the epoxy resin is most preferable. The epoxy resin is a compound having two or more epoxy groups in one molecule, and includes, for example, a bisphenol type epoxy resin derived from epichlorohydrin and bisphenol A or bisphenol F, polyglycidyl ether, polyglycidyl ester, and fat reductant. Formula epoxy resin etc. are mentioned.

【0022】カチオン重合性物質と混合可能なポリマー
としては、ポリビニルアセタール、フェノキシ樹脂、ポ
リエチレンテレフタレート、ポリウレタンなどや、塩化
ビニル、オレフィン、エチレン系アイオノマー、ポリア
ミド系などのポリマー類がある。フィルム形成性や溶融
時の流動性、樹脂相互の溶解性を考慮して、これらのポ
リマーの分子量は10,000以上80,000以下が
好ましい。また、水酸基(OH基)やカルボキシル基
(COOH基)などの極性基を有すると、エポキシ樹脂
との相溶性が向上し均一な外観や特性を有するフィルム
が得られ、かつ、エポキシ基との反応性を有するので好
ましい。
Polymers that can be mixed with the cationically polymerizable substance include polyvinyl acetal, phenoxy resin, polyethylene terephthalate, polyurethane, and polymers such as vinyl chloride, olefins, ethylene ionomers, and polyamide polymers. The molecular weight of these polymers is preferably 10,000 or more and 80,000 or less in consideration of the film forming property, the fluidity at the time of melting, and the mutual solubility of resins. Further, having a polar group such as a hydroxyl group (OH group) or a carboxyl group (COOH group), the compatibility with the epoxy resin is improved, a film having a uniform appearance and characteristics is obtained, and a reaction with the epoxy group is obtained. It is preferable because it has properties.

【0023】重量平均分子量3000以下の固形樹脂と
しては、ロジンやテルペンなどの天然物系樹脂、脂肪
族、脂環族、芳香族、クマロン・インデン・スチレン系
などの重合系樹脂、フェノール樹脂やキシレン樹脂など
の縮合系樹脂など、及び、これらの変性体や誘導体があ
る。重量平均分子量3000以下の固形樹脂は、粘着性
や接着性などの調整する必要がある場合に、単独で、又
は、混合して用いる。
As the solid resin having a weight average molecular weight of 3000 or less, natural resin such as rosin and terpene, aliphatic, alicyclic, aromatic, polymer resin such as coumarone / indene / styrene resin, phenol resin and xylene. There are condensation resins such as resins, and modified products and derivatives thereof. The solid resins having a weight average molecular weight of 3,000 or less are used alone or in a mixture when it is necessary to adjust the tackiness and adhesiveness.

【0024】前記化2で表されるスルホニウム塩は常温
で安定であり、かつカチオン重合性物質を110℃〜1
40℃では10〜60秒、130℃〜200℃では1〜
30秒の加熱で活性化して硬化する。さらに接着成分の
溶融粘度を100℃で1〜1,000Pa・sにするこ
とで、0.5〜5MPaの加圧により接着成分の好適な
流動が得られ、導電性粒子を介した回路導体間の接続が
得られる。したがって、粘着成分の常温での保存安定性
がよく、かつ基板材料に熱的なダメージを与えることな
く粘着硬化でき、回路の接続が得られる。
The sulfonium salt represented by the above chemical formula 2 is stable at room temperature and contains a cationically polymerizable substance at 110 ° C. to 1 ° C.
10 to 60 seconds at 40 ° C, 1 to 130 ° C to 200 ° C
It is activated and hardened by heating for 30 seconds. Furthermore, by setting the melt viscosity of the adhesive component to 1 to 1,000 Pa · s at 100 ° C., a suitable flow of the adhesive component can be obtained by applying a pressure of 0.5 to 5 MPa, and between the circuit conductors through the conductive particles. Connection is obtained. Therefore, the storage stability of the adhesive component at room temperature is good, and the adhesive material can be adhesively cured without causing thermal damage to the substrate material, and a circuit connection can be obtained.

【0025】[0025]

【実施例】以下、実施例で、より詳細に説明するが、本
発明はこれに限定されるものではない。 実施例1 ビスフェノールA型液状エポキシ樹脂(油化シェル株式
会社、商品名エピコート828を使用)50g、平均分
子量25,000、水酸基含有量6%のフェノキシ樹脂
(ユニオンカーバイト株式会社、商品名PKHAを使
用)50gを、重量比でトルエン対酢酸エチル1対1の
混合溶剤に溶解して、固形分40%の溶液とした。
EXAMPLES The present invention will now be described in more detail with reference to examples, but the present invention is not limited thereto. Example 1 A phenoxy resin (Union Carbide Co., Ltd., trade name PKHA) having 50 g of a bisphenol A type liquid epoxy resin (using Yuka Shell Co., Ltd., trade name Epicoat 828), an average molecular weight of 25,000 and a hydroxyl group content of 6%. (Use) 50 g was dissolved in a mixed solvent of toluene and ethyl acetate in a weight ratio of 1: 1 to obtain a solution having a solid content of 40%.

【0026】ポリスチレンを核とする粒子の表面に、厚
み0.2μmのニッケル層を設け、このニッケル層の外
側に、厚み0.02μmの金層を設け、平均粒径10μ
m、比重2.0の導電性粒子を製造した。
A 0.2 μm thick nickel layer is provided on the surface of particles having polystyrene as the nucleus, and a 0.02 μm thick gold layer is provided on the outside of the nickel layer to give an average particle diameter of 10 μm.
m, a specific gravity of 2.0 was produced.

【0027】p−アセトキシフェニルベンジルメチルス
ルホニウム塩を酢酸エチルに溶解して、50重量%溶液
とした。
The p-acetoxyphenylbenzylmethylsulfonium salt was dissolved in ethyl acetate to give a 50% by weight solution.

【0028】固形重量比で樹脂成分100、p−アセト
キシフェニルジルベンジルメチルスルホニウム塩2とな
るように配合し、更に、導電性粒子を2体積%配合分散
させ、厚み80μmのフッ素樹脂フィルムに塗布し、室
温で送風乾燥して、厚み25μmのフィルム状回路接続
材料を得た。
Resin component 100 and p-acetoxyphenyldibenzylbenzylmethylsulfonium salt 2 were compounded in a solid weight ratio, and further 2% by volume of conductive particles were compounded and dispersed, and coated on a fluororesin film having a thickness of 80 μm. Then, it was dried by blowing air at room temperature to obtain a film-like circuit connecting material having a thickness of 25 μm.

【0029】実施例2 p−アセトキシフェニルベンジルメチルスルホニウム塩
に代えて、p−メトキシカルボニルオキシフェニルベン
ジルエチルスルホニウム塩を使用したほかは、実施例1
と同様にしてフィルム状回路接続材料を得た。
Example 2 Example 1 was repeated except that p-methoxycarbonyloxyphenylbenzylethylsulfonium salt was used instead of p-acetoxyphenylbenzylmethylsulfonium salt.
A film-like circuit connecting material was obtained in the same manner as in.

【0030】実施例3 p−アセトキシフェニルベンジルメチルスルホニウム塩
に代えて、p−ヒドロキシフェニルベンジルメチルスル
ホニウム塩を使用したほかは、実施例1と同様にしてフ
ィルム状回路接続材料を得た。
Example 3 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that p-hydroxyphenylbenzylmethylsulfonium salt was used in place of p-acetoxyphenylbenzylmethylsulfonium salt.

【0031】実施例4 p−アセトキシフェニルベンジルメチルスルホニウム塩
に代えて、p−ヒドロキシフェニル−p−ニトロベンジ
ルメチルスルホニウム塩を使用したほかは、実施例1と
同様にしてフィルム状回路接続材料を得た。
Example 4 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that p-hydroxyphenyl-p-nitrobenzylmethylsulfonium salt was used instead of p-acetoxyphenylbenzylmethylsulfonium salt. It was

【0032】実施例5 p−アセトキシフェニルベンジルメチルスルホニウム塩
の配合量を0.2重量部としたほかは、実施例1と同様
にしてフィルム状回路接続材料を得た。
Example 5 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that the p-acetoxyphenylbenzylmethylsulfonium salt content was 0.2 part by weight.

【0033】実施例6 p−アセトキシフェニルベンジルメチルスルホニウム塩
の配合量を10重量部としたほかは、実施例1と同様に
してフィルム状回路接続材料を得た。
Example 6 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that the p-acetoxyphenylbenzylmethylsulfonium salt content was 10 parts by weight.

【0034】実施例7 ビスフェノールA型液状エポキシ樹脂に代えて、脂環式
エポキシ樹脂(ダイセル化学工業株式会社、商品名セロ
キサイド2021を使用)を使用したほかは、実施例1
と同様にしてフィルム状回路用接続材料を得た。
Example 7 Example 1 was repeated except that an alicyclic epoxy resin (using Daicel Chemical Industries Ltd., trade name Celoxide 2021) was used in place of the bisphenol A type liquid epoxy resin.
A film-like circuit connecting material was obtained in the same manner as in.

【0035】実施例8 ビスフェノールA型液状エポキシ樹脂に代えて、ビスフ
ェノールA型固形エポキシ樹脂(油化シェルエポキシ株
式会社、商品名エピコート1001を使用)を使用した
ほかは、実施例1と同様にしてフィルム状回路用接続材
料を得た。
Example 8 In the same manner as in Example 1 except that a bisphenol A type solid epoxy resin (Yukaka Shell Epoxy Co., Ltd., trade name Epicoat 1001 was used) was used in place of the bisphenol A type liquid epoxy resin. A film-like circuit connecting material was obtained.

【0036】実施例9 ビスフェノールA型液状エポキシ樹脂に代えて、アクリ
ル樹脂(昭和高分子株式会社、商品名リポキシSD−1
509を使用、グリシジルアクリレート)を使用したほ
かは、実施例1と同様にしてフィルム状回路接続材料を
得た。
Example 9 Acrylic resin (Showa Polymer Co., Ltd., trade name Lipoxy SD-1) was used in place of the bisphenol A type liquid epoxy resin.
A film-like circuit connecting material was obtained in the same manner as in Example 1 except that 509 was used and glycidyl acrylate was used.

【0037】実施例10 導電性粒子の量を0.5体積%としたほかは実施例1と
同様にしてフィルム状回路接続材料を得た。
Example 10 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that the amount of conductive particles was 0.5% by volume.

【0038】実施例11 導電性粒子の量を5体積%としたほかは、実施例1と同
様にしてフィルム状回路接続材料を得た。
Example 11 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that the amount of conductive particles was 5% by volume.

【0039】実施例12 導電性粒子の径を3μmとしたほかは、実施例1と同様
にしてフィルム状回路接続材料を得た。
Example 12 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that the conductive particles had a diameter of 3 μm.

【0040】実施例13 導電性粒子を、平均単粒径2μm、凝集粒径10μmの
ニッケル粒子に代えたほかは実施例1と同様にしてフィ
ルム状回路接続材料を得た。
Example 13 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that the conductive particles were replaced with nickel particles having an average single particle size of 2 μm and an aggregate particle size of 10 μm.

【0041】実施例14 導電性粒子を、平均単粒径2μm、凝集粒径10μmの
ニッケル粒子を0.5体積%とし、粒径2μmのシリカ
粒子を0.5体積%加えたほかは実施例1同様にしてフ
ィルム状回路接続材料を得た。
Example 14 In addition to 0.5% by volume of nickel particles having an average single particle size of 2 μm and an aggregate particle size of 10 μm, 0.5% by volume of silica particles having a particle size of 2 μm was added as the conductive particles. A film-like circuit connecting material was obtained in the same manner as in 1.

【0042】実施例15 ビスフェノールA型液状エポキシ樹脂(エピコート82
8)を70gとし、フェノキシ樹脂(ユニオンカーバイ
ト株式会社、商品名PKHAを使用)の配合量を30g
としたほかは実施例1と同様にしてフィルム状回路接続
材料を得た。
Example 15 Bisphenol A type liquid epoxy resin (Epicoat 82
8) to 70 g, and the compounding amount of phenoxy resin (using Union Carbite Co., Ltd., trade name PKHA) is 30 g.
A film-like circuit connecting material was obtained in the same manner as in Example 1 except that.

【0043】実施例16 p−アセトキシフェニルベンジルメチルスルホニウム塩
10重量部、メタクリル酸メチル16重量部、スチレン
16重量部、エチレングリコールジメタクリレート8重
量部、アゾ化合物0.05重量部(和光純薬株式会社製
V−60、V−40各0.025重量部)をA成分と
し、水200重量部、ドデシルベンゼンスルフォン酸ナ
トリウム0.2重量部、ポリビニルアルコール0.12
5重量部をB成分とし、チッ素雰囲気の密封容器中60
℃で、4時間撹拌し、乾燥してスルホニウム塩をマイク
ロカプセル化した。以下実施例1と同様にしてフィルム
状回路接続材料を得た。
Example 16 10 parts by weight of p-acetoxyphenylbenzylmethylsulfonium salt, 16 parts by weight of methyl methacrylate, 16 parts by weight of styrene, 8 parts by weight of ethylene glycol dimethacrylate, 0.05 part by weight of azo compound (Wako Pure Chemical Industries, Ltd. Company-made V-60, V-40 each 0.025 parts by weight) as the component A, 200 parts by weight of water, 0.2 parts by weight of sodium dodecylbenzene sulfonate, polyvinyl alcohol 0.12
5 parts by weight as component B, 60 in a nitrogen atmosphere sealed container
The mixture was stirred at ℃ for 4 hours and dried to microencapsulate the sulfonium salt. Thereafter, a film-like circuit connecting material was obtained in the same manner as in Example 1.

【0044】比較例1 p−アセトキシフェニルベンジルメチルスルホニウム塩
に代えて、p−ヒドロキシフェニルジメチルスルホニウ
ム塩(ベンジル基のないスルホニウム塩)を使用したほ
かは、実施例1と同様にしてフィルム状回路接続材料を
得た。
Comparative Example 1 A film-like circuit connection was made in the same manner as in Example 1 except that p-hydroxyphenyldimethylsulfonium salt (sulfonium salt having no benzyl group) was used in place of p-acetoxyphenylbenzylmethylsulfonium salt. Got the material.

【0045】比較例2 p−アセトキシフェニルベンジルメチルスルホニウム塩
に代えて、1−シアノエチル−2−メチルイミダゾール
を使用したほかは、実施例1と同様にしてフィルム状回
路接続材料を得た。
Comparative Example 2 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that 1-cyanoethyl-2-methylimidazole was used in place of the p-acetoxyphenylbenzylmethylsulfonium salt.

【0046】比較例3 導電性粒子を配合しないほかは、実施例1と同様にして
フィルム状回路接続材料を得た。
Comparative Example 3 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that the conductive particles were not blended.

【0047】比較例4 導電性粒子の径が20μmを用いたほかは、実施例1と
同様にしてフィルム状回路接続材料を得た。
Comparative Example 4 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that the conductive particles had a diameter of 20 μm.

【0048】比較例5 ビスフェノールA型液状エポキシ樹脂(エピコート82
8)を20gとし、フェノキシ樹脂(PKHA)を80
gとしたほかは実施例1と同様にしてフィルム状回路接
続材料を得た。
Comparative Example 5 Bisphenol A type liquid epoxy resin (Epicoat 82
8) to 20 g and 80% phenoxy resin (PKHA)
A film-like circuit connecting material was obtained in the same manner as in Example 1 except that g was used.

【0049】DSCの測定 以上得られたフィルム状回路接続材料を3mg(±0.
1mg)秤りとり、密閉式アルミパン中で昇温速度10
℃/分でDSCを測定した。用いた分析計は、デュポン
社製TA2000である。
Measurement of DSC 3 mg (± 0.
1mg) Weighed and heated in an enclosed aluminum pan at a heating rate of 10
DSC was measured at ° C / min. The analyzer used is TA2000 manufactured by DuPont.

【0050】溶融粘度の測定 実施例1、15、比較例で、ビスフェノールA型液状エ
ポキシ樹脂(エピコート828)とフェノキシ樹脂(P
KHA)を溶剤に溶解せず250℃近辺で溶融し、均一
に混合した後、10g程度を分取し、徐々に冷却し、1
00℃での粘度を測定した。このとき硬化剤、導電性粒
子は配合しなかった。測定に用いた装置は(株)レスカ
製デジタル粘度計HU−8である。
Measurement of Melt Viscosity In Examples 1 and 15 and Comparative Example, bisphenol A type liquid epoxy resin (Epicoat 828) and phenoxy resin (P
KHA) is not dissolved in a solvent, is melted at around 250 ° C., and is uniformly mixed.
The viscosity at 00 ° C was measured. At this time, no curing agent or conductive particles were added. The device used for the measurement is a digital viscometer HU-8 manufactured by RESCA CORPORATION.

【0051】回路の接続 実施例1〜16、比較例1〜5のフィルム状回路接続材
料を用いてライン幅100μm、ピッチ200μm、厚
み35μmの銅回路を250本有するフレキシブル回路
板(FPC)と、全面に酸化インジウム(ITO)の薄
層を形成(表面抵抗40Ω/□)した、厚み0.5mm
のポリカーボネート板(ASTM D648、1.86
MPaでの熱変形温度140℃)とを、130℃、1.
5MPaで20秒間加熱加圧して幅3mmにわたり接続
した。このとき、あらかじめポリカーボネート板上に、
フィルム状回路用接続材料の接着剤面を貼り付け後、7
0℃、0.5MPa、5秒間加熱加圧して仮接続し、そ
の後フッ素樹脂フィルムを剥離してFPCと接着した。
また、ライン幅100μm、ピッチ200μm厚み35
μmの銅回路を250本有するFPCとITOの薄層形
成したガラス(表面抵抗20Ω/□)とを、160℃、
1.5MPaで10秒間加熱加圧して幅3mmにわたり
接続した。このとき上記と同様にITOガラス上に仮接
続を行った。
Circuit Connection A flexible circuit board (FPC) having 250 copper circuits each having a line width of 100 μm, a pitch of 200 μm and a thickness of 35 μm, using the film-like circuit connection materials of Examples 1 to 16 and Comparative Examples 1 to 5, A thin layer of indium oxide (ITO) is formed on the entire surface (surface resistance 40 Ω / □), thickness 0.5 mm
Polycarbonate plate (ASTM D648, 1.86
Heat distortion temperature at 140 ° C.) at 130 ° C., 1.
It was heated and pressed at 5 MPa for 20 seconds and connected over a width of 3 mm. At this time, on the polycarbonate plate beforehand,
After attaching the adhesive surface of the film-like circuit connecting material,
Temporary connection was performed by heating and pressing at 0 ° C., 0.5 MPa for 5 seconds, and then the fluororesin film was peeled off and adhered to the FPC.
The line width is 100 μm, the pitch is 200 μm, and the thickness is 35.
FPC having 250 μm copper circuits and glass (surface resistance 20 Ω / □) with a thin layer of ITO formed at 160 ° C.
It was heated and pressed at 1.5 MPa for 10 seconds and connected over a width of 3 mm. At this time, temporary connection was made on the ITO glass in the same manner as above.

【0052】接続抵抗の測定 回路の接続後、接続部を含むFPCの隣接回路間の抵抗
値を、初期と、85℃、85%RHの高温高湿下に50
0時間保持した後にマルチメータで測定した。
After connecting the circuit for measuring the connection resistance, the resistance value between the adjacent circuits of the FPC including the connection portion was set to 50 at the initial value and at high temperature and high humidity of 85 ° C. and 85% RH.
After holding for 0 hour, measurement was performed with a multimeter.

【0053】保存安定性 フィルム状回路接続材料を配合溶液のままで、溶剤が揮
発しないように密封して、25℃に放置し、溶液粘度が
2倍になった時間を調べた。
The storage stability of the film-like circuit connecting material was sealed as the compounded solution so as not to volatilize the solvent, and allowed to stand at 25 ° C., and the time when the solution viscosity doubled was examined.

【0054】接続厚みの測定 ITOの薄層を形成した基板とFPCの厚みをマイクロ
メータによりあらかじめ測定しておき、フィルム状回路
接続材料により接続後厚みを測定し、接続厚みを算出し
た。
Measurement of Connection Thickness The thickness of the substrate on which the thin layer of ITO was formed and the FPC were measured in advance with a micrometer, and the thickness after connection was measured with the film-shaped circuit connecting material to calculate the connection thickness.

【0055】これらの測定結果を表1及び表2に示す。
この結果から、以下のことがわかる。
The results of these measurements are shown in Tables 1 and 2.
From this result, the following can be seen.

【0056】各実施例について、DSCのピーク温度
は、100〜120℃であり、比較例1及び2のそれよ
りも10〜20℃低い。特に、実施例7の接着剤は、D
SCのピーク温度が、実施例1のそれよりも10℃低
く、接続抵抗の上昇も見られず、良好な接続が得られて
いる。また、各実施例について、初期の抵抗値は、比較
例1及び2のそれよりも著しく低く、高温高湿下に保持
した後の接続抵抗の上昇も見られないか、小さい値であ
る。比較例1,2は反応不足であったためと考える。実
施例8の接続材料は、DSCのピーク温度が120℃と
高く、接続抵抗の上昇も若干大きくなっている。この理
由は、固形エポキシ樹脂を用いたので、反応性が若干低
下したためと考えられる。比較例3は導電性粒子がない
ので、初期の抵抗も高く、接続抵抗の上昇も著しい。比
較例4は導電性粒子が20μmと大きいため、2体積%
では接続部の導電性粒子数が少なくなったため、若干高
い抵抗値となった。導電性粒子として、平均単粒径2μ
mで凝集径10μmのニッケル粒子を用いた実施例10
のフィルム状接続材料も、実施例1のフィルム状接続材
料と同様に、良好な接続がえられている。ニッケル粒子
と粒径2μmのシリカ粒子を体積比で1対1で混合した
ものを配合した実施例11の接着剤も、実施例1と同様
に良好な接続が得られ、特に、ニッケル粒子の間にシリ
カ粒子が存在して、隣接回路との絶縁性を良好にしてい
ることがわかった。実施例1及び実施例15のフィルム
状接続材料は、100℃の溶融粘度が1〜1,000P
a・sの範囲内にあり、接続厚みも導電性粒子の粒径以
下になっているが、比較例5のフィルム状接続材料は、
溶融粘度が高く、接着成分が十分に流動する前に硬化し
てしまい、接続厚みが導電性粒子の粒径よりも大きくな
った。そのため、接続抵抗は大きくなり、上昇も著しか
った。実施例1、5、6及び16の接着剤溶液につい
て、25℃で長期間放置したところ、実施例1の溶液は
3ヵ月後に、実施例5の溶液は6ヵ月後に、実施例6の
溶液は1か月後に、それぞれ、粘度が2倍になった。実
施例16はマイクロカプセル化することにより保存性が
のびて3ヵ月から6ヵ月となっている。
For each example, the DSC peak temperature is 100-120 ° C., which is 10-20 ° C. lower than that of Comparative Examples 1 and 2. In particular, the adhesive of Example 7 was D
The peak temperature of SC is 10 ° C. lower than that of Example 1, no increase in connection resistance is observed, and good connection is obtained. In addition, in each example, the initial resistance value is significantly lower than that of Comparative Examples 1 and 2, and there is no increase in the connection resistance after being kept under high temperature and high humidity, or a small value. It is considered that Comparative Examples 1 and 2 had insufficient reaction. The connection material of Example 8 has a high DSC peak temperature of 120 ° C., and the increase in connection resistance is slightly large. It is considered that this is because the solid epoxy resin was used and the reactivity was slightly lowered. In Comparative Example 3, since there are no conductive particles, the initial resistance is high and the connection resistance is significantly increased. In Comparative Example 4, the conductive particles are as large as 20 μm, so 2% by volume
Since the number of conductive particles in the connection portion was small, the resistance value was slightly high. As conductive particles, average single particle size 2μ
Example 10 using nickel particles having an aggregate diameter of 10 μm in m
The film-like connecting material (1) also provided good connection, like the film-like connecting material of Example 1. The adhesive of Example 11 in which nickel particles and silica particles having a particle diameter of 2 μm were mixed at a volume ratio of 1: 1 also provided good connection as in Example 1, and particularly, between the nickel particles. It was found that the silica particles exist in the layer, which improves the insulation between adjacent circuits. The film-shaped connecting materials of Example 1 and Example 15 have a melt viscosity at 100 ° C. of 1 to 1,000 P.
It is within the range of a · s and the connection thickness is less than or equal to the particle diameter of the conductive particles, but the film-like connection material of Comparative Example 5 is
The melt viscosity was high, the adhesive component was cured before it sufficiently flowed, and the connection thickness became larger than the particle diameter of the conductive particles. Therefore, the connection resistance increased and the rise was remarkable. When the adhesive solutions of Examples 1, 5, 6 and 16 were left to stand at 25 ° C. for a long period of time, the solution of Example 1 after 3 months, the solution of Example 5 after 6 months and the solution of Example 6 After one month, the viscosity doubled in each case. The microcapsule of Example 16 has a long shelf life of 3 to 6 months.

【0057】[0057]

【表1】 [Table 1]

【0058】[0058]

【表2】 [Table 2]

【0059】[0059]

【発明の効果】本発明のフィルム状接続部材は、熱的に
ダメージをうけやすい基板に、熱的ダメージを与えない
比較的低温域でも互いに向き合う回路導体間の接続可能
であり、また、中温域では短時間で確実な接続ができ
る。
The film-like connecting member of the present invention is capable of connecting circuit conductors facing each other even in a relatively low temperature region where thermal damage is not caused to a substrate which is easily damaged by heat, and in a medium temperature region. Then you can make a reliable connection in a short time.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C09J 201/00 C09J 201/00 5G301 H01B 5/16 H01B 5/16 5G307 H01R 4/04 H01R 4/04 11/01 501 11/01 501A 43/00 43/00 H H05K 3/36 H05K 3/36 A Fターム(参考) 4J004 AA06 AA08 AA09 AA11 AA13 AA14 AA15 AA18 AB05 EA05 FA05 FA08 4J040 DB021 DD051 DD072 EC001 ED032 EF002 EG002 HD18 JA11 KA32 LA01 LA09 MB03 NA19 5E051 CA03 5E085 BB08 CC01 DD06 EE34 FF11 GG33 JJ06 JJ36 5E344 AA01 CD02 CD06 EE21 5G301 DA02 DA42 DA51 DA59 DD03 DD08 5G307 HA02 HC01 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 7 Identification code FI theme code (reference) C09J 201/00 C09J 201/00 5G301 H01B 5/16 H01B 5/16 5G307 H01R 4/04 H01R 4/04 11 / 01 501 11/01 501A 43/00 43/00 H H05K 3/36 H05K 3/36 AF Term (reference) 4J004 AA06 AA08 AA09 AA11 AA13 AA14 AA15 AA18 AB05 EA05 FA05 FA08 4J040 DB021 DD051 DD072 EC001 ED0022 EF002 JA11 KA32 LA01 LA09 MB03 NA19 5E051 CA03 5E085 BB08 CC01 DD06 EE34 FF11 GG33 JJ06 JJ36 5E344 AA01 CD02 CD06 EE21 5G301 DA02 DA42 DA51 DA59 DD03 DD08 5G307 HA02 HC01

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 カチオン重合性物質と分子量10,00
0以上80,000以下のポリマー類を含む組成物10
0重量部に対して化1で示されるベンジル基を含有する
スルホニウム塩を、0.05〜10重量部配合した接着
成分に、粒子径が1〜18μmである導電性粒子を0.
05〜20体積%分散し、接着成分の100℃における
溶融粘度が1〜1,000Pa・sであることを特徴と
するフィルム状回路接続材料。 【化1】 化1中、R1が電子吸引性の基であり、R2及びR3が電
子供与性の基で、R1、R 2及びR3は、置換又は非置換
の基であり、互いに同じでも異なっていてもよく、Y
は、非求核性陰イオンである。
1. A cationically polymerizable substance and a molecular weight of 10,000.
Composition 10 containing 0 to 80,000 polymers
Contains 0 parts by weight of the benzyl group shown in Chemical formula 1
Adhesion containing 0.05 to 10 parts by weight of sulfonium salt
As the component, conductive particles having a particle diameter of 1 to 18 μm are added.
05 to 20% by volume, and the adhesive component at 100 ° C
It has a melt viscosity of 1 to 1,000 Pa · s.
A film-like circuit connecting material. [Chemical 1] R in chemical formula 11Is an electron-withdrawing group, and R2And R3Electric power
R is the basis of childhood1, R 2And R3Is substituted or unsubstituted
And may be the same or different from each other, Y
Is a non-nucleophilic anion.
【請求項2】 ポリマー類が、ポリビニルアセタール、
フェノキシ樹脂、ポリエチレンテレフタレート、ポリウ
レタン、ポリアミドのうちいずれかである請求項1に記
載のフィルム状回路接続材料。
2. The polymer is polyvinyl acetal,
2. The film-like circuit connecting material according to claim 1, which is one of a phenoxy resin, polyethylene terephthalate, polyurethane and polyamide.
【請求項3】 導電性粒子が、導電性を示す物質の粒子
や非導電性物質の表面を導電性材料で被覆した粒子又は
導電性粒子の表面を絶縁物質で被覆した粒子のうちから
選択されたものであることを特徴とする請求項1または
請求項2に記載のフィルム状回路接続材料。
3. The conductive particles are selected from particles of a material exhibiting conductivity, particles of a non-conductive material whose surface is coated with a conductive material, and particles of a conductive particle whose surface is coated with an insulating material. The film-like circuit connecting material according to claim 1 or 2, wherein
【請求項4】 ベンジル基を含有するスルホニウム塩を
マイクロカプセル化したことを特徴とする請求項1ない
し請求項3のいずれかに記載のフィルム状回路接続材
料。
4. The film-like circuit connecting material according to claim 1, wherein a sulfonium salt containing a benzyl group is microencapsulated.
【請求項5】 カチオン重合性物質と分子量10,00
0以上80,000以下のポリマー類を含む組成物10
0重量部に対して化1で示されるベンジル基を含有する
スルホニウム塩を、0.05〜10重量部配合した接着
成分に、粒子径が1〜18μmである導電性粒子を0.
05〜20体積%分散し、接着成分の100℃における
溶融粘度が1〜1,000Pa・sであるフィルム状回
路接続材料を、互いに向き合う2つの回路導体間に挾
み、それぞれの回路導体を有する配線板の裏から加熱、
加圧して積層一体化することを特徴とする回路の接続方
法。
5. A cationically polymerizable substance and a molecular weight of 10,000.
Composition 10 containing 0 to 80,000 polymers
An adhesive component in which 0.05 to 10 parts by weight of the benzyl group-containing sulfonium salt represented by Chemical Formula 1 is mixed with 0 to 0 parts by weight of conductive particles having a particle diameter of 1 to 18 μm is used.
A film-like circuit connecting material in which the melt viscosity of the adhesive component at 100 ° C. is 1 to 1,000 Pa · s dispersed between 05 to 20% by volume is sandwiched between two circuit conductors facing each other, and each circuit conductor is provided. Heating from the back of the wiring board,
A method of connecting circuits, which comprises pressurizing and laminating.
【請求項6】 加熱、加圧する条件が温度110〜14
0℃、圧力0.5MPa〜5MPa、時間10〜60秒
の範囲であることを特徴とする請求項5に記載の回路の
接続方法。
6. The conditions for heating and pressurizing are temperature 110 to 14
The circuit connection method according to claim 5, wherein the temperature is 0 ° C., the pressure is 0.5 MPa to 5 MPa, and the time is 10 to 60 seconds.
JP2002305396A 1993-07-29 2002-10-21 Circuit connection material and circuit connection method using the connection material Expired - Lifetime JP4228652B2 (en)

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JP5-186511 1993-07-29
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JP2006257742A Division JP2007053107A (en) 1993-07-29 2006-09-22 Film circuit connection material

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JP2013216820A (en) * 2012-04-11 2013-10-24 Sekisui Chem Co Ltd Adhesive for electronic component and adhesive film for electronic component
CN103773265A (en) * 2012-10-22 2014-05-07 日立化成株式会社 Anisotropic conductive adhesive composition
JP2016082070A (en) * 2014-10-16 2016-05-16 デクセリアルズ株式会社 Method of manufacturing connection body, connection method of electronic component, connection body

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