WO2006134880A1

WO2006134880A1 - Multilayer film, method for producing same, method for selecting supporting body for multilayer film, and method for evaluating supporting body for multilayer film

Info

Publication number: WO2006134880A1
Application number: PCT/JP2006/311766
Authority: WO
Inventors: Gentaro Seki; Kazuya Satou; Xiaoli Du
Original assignee: Hitachi Chemical Company, Ltd.
Priority date: 2005-06-14
Filing date: 2006-06-12
Publication date: 2006-12-21
Also published as: CN101198669A; TW200716719A; JPWO2006134880A1; KR20080024198A; KR100991074B1; KR100972262B1; KR20100036370A

Abstract

Disclosed is a multilayer film obtained by forming an adhesive film containing an adhesive composition on the surface of a supporting body. This multilayer film is characterized in that the supporting body has a surface having a residual adhesion ratio C5 of not less than 80%.

Description

Specification

Laminated film and production method thereof, method for selecting laminated film support, and evaluation method for laminated film support

Technical field

The present invention relates to a laminated film and a method for producing the same, a method for selecting a laminated film support, and a method for evaluating a laminated film support.

Background art

[0002] In the field of precision electronic equipment such as semiconductors and liquid crystal displays, various adhesives are used to fix electronic materials to a substrate and make circuit connections. In these fields, semiconductor chips and circuits are becoming denser and more precise, and adhesives that bond and fix them are also required to have high adhesive strength and reliability.

[0003] For example, for connection between a liquid crystal display and TCP (Tape Carrier Package), connection between an FPC (Flexible Printed Circuit) and TCP, or connection between an FPC and a printed wiring board, conductive particles are dispersed in an adhesive. An anisotropic conductive adhesive is used. This is intended to make the circuit connection more reliable. When a semiconductor silicon chip is mounted on a substrate, so-called flip chip mounting is performed in which the semiconductor silicon chip is directly mounted on the substrate face down instead of the conventional wire bond. Even in this case, the application of anisotropic conductive adhesive has started! Speak.

[0004] When an adhesive film for electronic materials is used as the above-mentioned adhesive, the adhesive film before use usually comprises a support on at least one side of the main surface to constitute a laminated film. In many cases, the support is coated with a release treatment agent so that the adhesive film provided on the surface can be easily removed. In addition, since this release treatment agent makes it easy to peel off the adherend from the support, a part of the release treatment agent component and the low molecular weight component contained in the release treatment agent component are intentionally transferred to the adherend side. It is designed to be Thereby, the light peeling of the adherend from the support is realized, but due to this, a part of the peeling treatment agent is transferred to the surface of the adhesive film. Some of these stripping agents (foreign matter) may cause a decrease in connection reliability after mounting. [0005] As a typical release treatment agent, a release treatment agent made of silicone resin is widely known. In a laminated film using a support coated with this release treatment agent, the release treatment agent moves particularly easily to the adhesive film side (see, for example, Patent Documents 1 and 2). Therefore, as described in Patent Document 3, it is conceivable to adopt a support (release film) that does not contain silicone resin.

Patent Document 1: JP 2001-123130 A

Patent Document 2: Japanese Patent Laid-Open No. 2002-331614

Patent Document 3: Japanese Patent Laid-Open No. 2001-171033

Disclosure of the invention

Problems to be solved by the invention

[0006] In the same way as described above, even if the support does not contain silicone resin,

Light release is realized by transferring a part of the release treatment component and a low molecular weight component contained in the release treatment component. Therefore, even when using such a support

Cause a decrease in connection reliability.

Means for solving the problem

Therefore, the present invention is a laminated film obtained by laminating an adhesive film on the surface of a support, the laminated film having sufficient connection reliability, and a method for producing the same, and a laminated film support It is an object of the present invention to provide a body sorting method and a method for evaluating a laminated film support.

In order to achieve the above object, the present invention provides a laminated film in which an adhesive film containing an adhesive composition is formed on the surface of a support, and the support is formed on the surface thereof. A laminated film having a residual adhesion ratio C of 80% or more is provided.

Five

Here, “residual adhesion rate C” on the surface of the support is a numerical value derived as follows.

Five

That is, first, the peel strength between an adhesive tape (31B tape), which is a standard sample, and a predetermined metal plate is measured, and this is used as the reference peel strength A. Next, the adhesive tape is affixed to the substrate to be measured and peeled off, and the procedure for measuring the peel strength with a predetermined metal plate is repeated 5 times. Peel strength A and above

Five

And B, the residual adhesion ratio C expressed by the following formula (1) is derived. C = B / AX 100 (1)

5 5

The above-mentioned Patent Document 2 also describes the term “residual adhesion rate”. However, the “residual adhesion rate” described in Patent Document 2 can be measured using the residual adhesion rate C defined in the present invention.

Five

Not the same. Patent Document 2 also differs from the present invention in that the peel strength to be measured is the first time. This has an important meaning as will be described later. This will be described in more detail with reference to FIGS.

[0010] [1] First, a support 8 constituting a laminated film, a 25 mm wide acrylic foam double-sided adhesive tape 4, a glass plate 3, a 10 mm wide 31B tape 2 (manufactured by Nitto Denko), and a stainless steel (SUS) Prepare board 1. Next, the surface of the glass plate 3 is washed using various solvents such as toluene, acetone, methanol, etc., and organic components and inorganic components adhering to the surface are removed. Subsequently, an acrylic foam double-sided adhesive tape 4 cut out to a length of 60 mm is attached to the surface of the glass plate 3 after washing using a rubber roll having a mass of 2 kg.

[2] Next, the release substrate of the acrylic foam double-sided adhesive tape 4 is peeled to expose the adhesive surface. Further, a support 8 cut out in a rectangular film shape of 20 mm × 55 mm is arranged on the center portion of the adhesive surface of the acrylic foam double-sided adhesive tape 4 so that the entire main surface of one side is placed.

[0012] [3] Next, 31B tape 2 newly cut to a length of 70 mm was attached to the surface of the support 8 using a rubber roll with a mass of 2 kg so that no scissors would enter, and FIG. It is configured as shown in the schematic front view of (a) and the schematic plan view of FIG. Subsequently, the 31B tape 2 affixed to the surface of the support 8 is peeled 180 ° by a tensile tester at a pulling speed of 50 mmZmin as shown in the schematic front view of FIG. 1 (b). In this way, the 31B tape 6 is obtained.

[0013] [4] When only the residual adhesion rate C is measured, the above operation (3) is repeated five times. On this occasion

Five

The 31B tape 2 to be affixed to the surface of the support 8 is newly cut each time.

[5] Next, the surface of the stainless steel plate 1 is washed using various solvents such as toluene, acetone, methanol, etc., and organic components and inorganic components adhering to the surface are removed. In addition, the 31B tape 6 obtained in the fifth operation [3] above is affixed to the surface of the washed stainless steel plate 1 using a rubber roll with a mass of 2 kg so that no scissors will enter. Figure l (c ) Is configured as shown in the schematic front view.

[0015] [6] Next, for 31B tape 6 affixed to stainless steel plate 1, from the tensile test machine, as shown in the schematic front view of Fig. 1 (d), a bow of 50mmZmin | At 180 ° peeling. Measure and record the peel strength B at this time.

Five

[7] In addition to the operations [1] to [6] described above, 31B tape 2 and stainless steel plate 1 are prepared. Furthermore, the surface of the stainless steel plate 1 is cleaned using various solvents such as toluene, acetone, methanol, etc., and organic components and inorganic components adhering to the surface are removed. Next, 31B tape 2 cut out to a length of 70 mm was affixed to the surface of the washed stainless steel plate 1 using a rubber roll with a mass of 2 kg so that no scissors could enter. It is configured as shown in the schematic front view.

[0017] [8] After that, for 31B tape 2 affixed to stainless steel plate 1, from a tensile test machine, as shown in the schematic front view of Fig. 3 (b), at a bow tension of 50mmZmin 18 0 ° Peel off. Measure and record the peel strength A at this time.

[0018] [9] From the peel strengths A and B obtained as described above, residual adhesion is obtained by the above equation (1).

Five

Deriving rate C.

Five

[0019] The residual adhesion rate C is a numerical value obtained after repeating the operation [3] five times.

Five

1S The peel strength may be measured by performing the operations [5] and [6] each time the operation [3] is performed once. In this case, if the peel strength obtained by the operation of [6] is B after the operation of [3] is repeated n times, the corresponding residual adhesion rate C is expressed by the following formula (2).

C = B / AX 100 (2)

[0020] The factors that the laminated film of the present invention has sufficient connection reliability are considered as follows. However, the factor is not limited to this.

[0021] A support having a residual adhesion ratio C of 80% or more as defined in the present invention is a transfer of a release treatment agent.

Five

It means that it is a light release design that does not depend only on the photo. In other words, with conventional silicone resin-based release treatment agents, as described above, light release can be realized by transferring a part of the release treatment component or a low molecular weight component contained in the release treatment component! / Speak. Such a release treatment agent can remove a part of the release treatment agent component or the release treatment no matter how many times the above-mentioned release test is repeated. The low molecular weight component contained in the release agent component is peeled off. Therefore, residual adhesion rate C

5 remains low. On the other hand, in the case of a release treatment agent in which light release does not depend only on the transfer of the release treatment agent, a part of the release treatment agent is transferred in the same manner during the first and second release tests, or the release treatment agent component The low molecular weight component contained in the flakes off. Therefore, the residual adhesion rate in the first and second times represents a low value. However, by repeating the peeling test up to 5 times, such transfer and peeling-off are completed, and the residual adhesion rate C becomes 80% or more. Such a support having a residual adhesion rate C is in contact with the mounting.

5 5

It is speculated that the connection reliability of the adhesive film can be sufficiently enhanced because the transfer of foreign matter to the adhesive film is suppressed.

[0022] The adhesive composition according to the present invention preferably contains conductive particles. Thus, the circuit members can be more stably electrically connected while maintaining the insulation state between the circuit electrodes on the same substrate.

[0023] The present invention is a method for selecting a support for a laminated film, in which the support is selected from a laminate film in which an adhesive film containing an adhesive composition is formed on the surface of the support. Provides a method for selecting a support with a residual adhesion C of 80% or more on the surface of the body

Five

To do. According to this method of selecting a support, when connecting circuit electrodes and the like using a laminated film obtained by laminating an adhesive film on the surface of the selected support, the support force is also peeled off to connect the circuit electrodes. The adhesive film sandwiched between the electrodes can sufficiently maintain the connection reliability between the circuit electrodes.

[0024] The present invention includes a step of selecting a support having a surface residual adhesion ratio C of 80% or more, and a selection process.

Five

And a step of forming an adhesive film containing the adhesive composition on the surface of the support selected in a separate step. The present invention also includes a step of forming a support so that the residual adhesion ratio C of the surface is 80% or more, and the support

Five

And a step of forming an adhesive film containing the adhesive composition on the surface of the body. According to these manufacturing methods, when connecting the circuit electrodes and the like using the obtained laminated film, the adhesive film that is peeled off from the support and sandwiched between the circuit electrodes and the like sufficiently maintains the connection reliability between the circuit electrodes and the like. can do.

[0025] The present invention measures the peel strength between an adhesive tape, which is a standard sample, and a predetermined metal plate. The process of setting this as the reference peel strength A and the procedure for measuring the peel strength between the above-mentioned predetermined metal plate by attaching the adhesive tape to the laminated film support that is the object of measurement and peeling the force Repeatedly, the fifth peel strength as B and the above-mentioned peel strength A and B

From 5 5 for a laminated film having a step of deriving a residual adhesion ratio C represented by the following formula (1)

Five

A method for evaluating a support is provided.

C = B / AX 100 (1)

5 5

[0026] According to this evaluation method, it is possible to sufficiently adequately determine whether or not the adhesive film after peeling from the support has sufficient connection reliability.

The invention's effect

[0027] According to the present invention, there can be provided a laminated film obtained by laminating an adhesive film on the surface of a support, wherein the adhesive film has sufficient connection reliability.

Brief Description of Drawings

FIG. 1 is a process front view for explaining peel strength B.

Five

FIG. 2 is a schematic plan view for explaining peel strength B.

Five

FIG. 3 is a process front view for explaining peel strength A.

FIG. 4 is a schematic sectional view showing an embodiment of a circuit member connection structure according to the present invention.

FIG. 5 is a series of process diagrams for connecting circuit members according to the present invention.

FIG. 6 is a schematic cross-sectional view showing an embodiment of a semiconductor device according to the present invention.

Explanation of symbols

[0029] 1 ··· Stainless steel (SUS) plate, 2, 6 ···· 31Β tape, 3 ··· Glass plate, 4 ··· Acrylic foam Double-sided adhesive tape, ························· , 10 ··· Circuit connection member, 11 ··· Insulating material, 20 ··· First circuit member, ············· 1st circuit board, 22 ··· 1st circuit electrode, 30 · · · 2nd circuit member 31 ... Second circuit board, 32 ... Second circuit electrode, 40 ... Semiconductor element connection member, 50 ... Semiconductor element, 60 ... Substrate, 61 ... Circuit pattern, 70 ... Sealant , 80 · “Semiconductor devices.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings as necessary. In the drawings, the same elements are denoted by the same reference numerals, and duplicate descriptions are omitted. In addition, positional relationships such as up, down, left and right are based on the positional relationships shown in the drawings unless otherwise specified. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios. In the present specification, “(meth) acrylic acid” means “acrylic acid” and its corresponding “methacrylic acid”, and “(meth) acrylate” means “atallylate” and its corresponding “ “Methacrylate” means “(meth) atalyloxy group” means “atallyloxy group” and the corresponding “methacryloxy group”.

[0031] A laminated film according to a preferred embodiment of the present invention is a laminated film in which an adhesive film containing an adhesive composition is formed on the surface of a support, and the support is a surface. The residual adhesion C force is ¾0% or more.

Five

[0032] The support is not particularly limited as long as the residual adhesion C on the surface thereof is 80% or more.

Five

[0033] Specific examples of the support include, for example, a polyethylene terephthalate film, a polyethylene naphthalate film, a polyethylene isophthalate film, a polybutylene terephthalate film, a polyolefin-based film, a polyacetate film, a polycarbonate film, and a polyphenylene sulfide film. , Polyamide film, ethylene-butyl acetate copolymer film, polychlorinated bure film, poly (vinylidene chloride) film, synthetic rubber film, and liquid crystal polymer film. If necessary, the film surface may be subjected to corona discharge treatment, anchor coating treatment, antistatic treatment or the like.

[0034] The support has a residual adhesion C of 80% or more and at the same time is formed on the surface thereof.

Five

The surface of the adhesive film may be coated with a release treatment so that the adhesive film can be easily removed. Examples of the release treatment agent include silicone resin, copolymer of silicone and organic resin, alkyd resin, amino alkyd resin, resin having a long-chain alkyl group, and resin having a fluoroalkyl group. Fat and shellac rosin are listed. Among these, from the viewpoint of more effectively preventing the release treatment agent from transferring from the support to the adhesive film, release treatment agents other than the release treatment agent mainly composed of silicone resin are preferred.

[0035] The thickness of the support is not particularly limited. However, storage and use of laminated film Considering the convenience of time, the thickness of the support is preferably 4 to 200 / ζ πι. Furthermore, considering the material cost and productivity of the laminated film, the thickness of the support is more preferably 15 to 75 m.

[0036] The support is preferably evaluated by the above-described method for evaluating a laminated film support according to the present invention and selected by the method for selecting a laminated film support according to the present invention. In the method of selecting a support, for example, multiple types of supports with different materials and manufacturing methods are prepared, and only those whose surface residual adhesion ratio C is 80% or more are prepared.

Five

And remove the support with a residual surface adhesion C of less than 80%. In this way

Five

When a laminated film is produced using only the selected support, the connection reliability of the adhesive film is improved, and the circuit connection structure formed using the adhesive film and the yield of the semiconductor device are sufficiently increased.

[0037] In order to increase the residual adhesion ratio C of the support to 80% or more, for example, the support surface has a low content.

Five

Examples include a method in which a low molecular weight component is not present as much as possible, a high molecular weight component is preferentially present, and control is performed so that a part of the molecule of the releasable treatment agent component does not easily fall off. Examples of the high molecular weight component include amino alkyd resin.

[0038] The adhesive film may be, for example, one obtained by forming an adhesive composition into a film. The adhesive composition preferably cures a polymerizable compound such as a polymerizable resin component for maintaining a connection state between electronic materials such as circuit electrodes, and the polymerizable compound. U, which preferably includes a polymerization initiator that is a curing agent for the purpose, and a film-forming component for imparting film-forming properties to the adhesive composition.

[0039] The polymerizable compound is a thermosetting compound that can be cured in a temperature range that is set according to the environment when the laminated film is used, or a light irradiation that is used depending on the environment when the laminated film is used. It may be a curable compound such as a photocurable compound that can be cured by the above method. As the curable compound, a radical polymerizable compound that is advantageous for low-temperature rapid curing is preferable.

[0040] The radical polymerizable compound is a compound having a functional group that is polymerized by radicals.

Examples of the radically polymerizable compound include (meth) atalytoi compound, maleimide compound, citraconimid compound, and nadiimide compound. These are one kind alone or Used in combination of two or more. In addition, the radical polymerizable compound can be used in either a monomer or oligomer state, and the monomer and oligomer may be mixed and used.

[0041] Examples of (meth) ataretoy compounds include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, isobutyl (meth) acrylate, and heterangel recall (meth). Atalylate, diethylene glycol di (meth) acrylate, trimethylol propane tri (meth) acrylate, tetramethylene glycol tetra (meth) acrylate, 2 —hydroxy mono 1,3 di (meth) talyloxy propane, 2, 2 bis [4 — (((Meth) Ataryloxymethoxy) phenol] propane, 2, 2 bis [4— (((Meth) Atalyloxyethoxy) phenol] propane, dicyclopentayl (meth) acrylate tricyclodehydryl ( (Meta) Atalylate, Tris ((Meth) Atari Mouth Kichetil) Isocyanurate, Urethane (Meta ) Atarylate, isocyanuric acid ethylene oxide-modified di (meth) acrylate. These may be used alone or in combination of two or more. A (meth) acrylic resin can be obtained by radical polymerization of the above (meth) attale toy compound.

[0042] A maleimide compound is a compound having at least one maleimide group in the molecule. Examples of maleimide compounds include: phenol maleimide, 1-methyl-2,4 bismaleimide benzene, N, N, 1m-phenol bismaleimide, N, N, 1p phenolene bismaleimide, N, N, -4 , 4-bi-bilenene bismaleimide, N, N, —4, 4— (3, 3-dimethylbiphenylene) bismaleimide, N, N, 1, 4, 4- (3, 3-dimethyldiphenylmethane) bis Maleimide, N, N, 1,4,4- (3,3-Jetyldiphenylmethane) bismaleimide, N, N, —4,4-diphenylmethane bismaleimide, N, N, 1,4,4-diphenylpropane Bismaleimide, N, N, 1,4,4-diphenyl ether bismaleimide, N, N, 1,4,4-diphenylsulfone bismaleimide, 2,2bis (4- (4 maleimidephenoxy) phenyl) pro Bread, 2, 2 bis (3 s butyl 3, 4— (4 maleimide phenoxy) Ethyl), 1,1-bis (4- (4 maleimidophenoxy) phenol) decane, 4,4, monocyclohexylidene monobis (1- (4-maleimidophenoxy) (Phenoxy) 2-cyclohexylbenzen, 2,2 bis (4-maleimidephenoxy) hexafluoropropane. These may be used alone or in combination of two or more. [0043] A citraconimide compound is a compound having at least one citraconimide group in the molecule. Citraconimide compounds include, for example, phenol citraconimide, 1-methyl-2,4 biscitraconimide benzene, N, N, 1 m-phenylene biscitraconimide, N, N, 1p -Lenbiscitraconimide, N, N, 1,4,4-biphenylene biscitraconimide, N, N, 4,4— (3,3-dimethylbiphenyl) biscitraconimide, N, N, —4,4 — (3,3-Dimethyldiphenylmethane) biscitraconimide, N, N, 4,4— (3,3-Detyldiphenylmethane) biscitraconeimide, N, Ν'— 4, 4-Diphenylmethane biscitracon Imido, Ν, Ν, 1,4-Diphenylenopropronone biscitraconimide, Ν, Ν, —4, 4-Diphenyl ether biscitraconimide, Ν, Ν, — 4, 4-Diphenylsulfonbis Citraconimide, 2, 2 screw (4— (4 Citracon Imidophene) phenol) propan, 2, 2 bis (3 s butyl 3, 4— (4 citraconimide phenoxy) phenol) Propane, 1, 1—bis (4— (4 citracone imide phenol) ) Phenol) Decane, 4, 4, 1 Cyclohexylidene monobis (1— (4-Citraconimidephenoxy) phenoxy) 2-Cyclohexylbenzene, 2, 2 Bis (4— (4 Citraconimide) Enoxy) phenol) hexafluoropropane. These may be used alone or in combinations of two or more.

[0044] A nadiimide compound is a compound having at least one nadiimide group in the molecule. Nadiimide compounds include, for example, ferronadiimide, 1-methyl 2,4 bisnadiimidebenzene, 一, N, 1m-phenolene bisnadiimide, N, N, 1p phenylenediamine imide, N, N , —4, 4-Bi-phenylene bisnadiimide, N, N, —4, 4— (3, 3-dimethylbiphenylene) bisnadiimide, N, N, 1, 4, 4— (3, 3-dimethyldiphenylmethane) ) Bisnadiimide, N, N, —4, 4— (3, 3—Jetyldiphenylmethane) Bisnadiimide, N, N, 1,4,4-Diphenylmethane bisnadiimide, N, N, 1,4,4—Diphenyl -Lupropane bisnadiimide, N, N, —4,4-diphenyl ether bisnadiimide, N, N, —4,4-diphenylsulfone bisnadiimide, 2,2 bis (4- (4 nadiimidephenoxy) phenol -Le) propan, 2, 2 bis (3 s butyl 3, 4— (4 nadiimidephenoxy) -L) propan, 1,1-bis (4- (4 nadiimidephenoxy) phenol) decane, 4,4,1 cyclohexylidene monobis (1— (4 nadiimidephenoxy) Phenoxy) 2 cyclohexylben And 2,2-bis (4- (4-nadiimidephenoxy) phenol) hexafluoropropane. These may be used alone or in combination of two or more.

[0045] The polymerization initiator is a compound that can initiate a polymerization reaction with the polymerizable compound. When a radical polymerizable compound is used as the polymerizable compound, radical polymerization is used as the polymerization initiator. Use an initiator.

[0046] The radical polymerization initiator is not particularly limited as long as it is a compound that generates radicals by light irradiation and Z or heating. Preferred radical polymerization initiators are compounds that generate radicals upon irradiation with light at 150 to 750 nm and heating at Z or 80 to 200 ° C. Specifically, peroxides, azo compounds, etc. Is preferred. These are selected in consideration of the target connection temperature, connection time, storage stability, etc.

[0047] The peroxide is preferably an organic peroxide from the viewpoint of high reactivity and storage stability. From the same viewpoint, among organic peroxides, organic peroxides having a half-life of 10 hours at a temperature of 40 ° C or higher and a half-life of 1 minute at a temperature of 200 ° C or lower are preferred. Particularly preferred are organic peroxides having a half-life of 10 hours at a temperature of 50 ° C or higher and a half-life of 1 minute at a temperature of 180 ° C or lower. When the connection time is 10 seconds or less, the amount of the radical polymerization initiator for obtaining a sufficient reaction rate is 0.1 to 20% by mass based on the total solid content of the adhesive composition. The preferred range is 2 to 15% by mass.

[0048] Specific examples of the organic peroxides include disilver oxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, nanomouth peroxide, and silyl peroxide. It is done. Among these, peroxide esters, dialkyl peroxides, hydride peroxides, and silyl peroxides have a concentration of chlorine ions and organic acids in the initiator of 5000 ppm or less, and produce less organic acids after thermal decomposition. This is especially preferred because it can further reduce the corrosion of metal parts such as circuit electrodes.

[0049] Examples of disilver oxide include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3, 5, 5-trimethylhexanoyl peroxide, octane peroxide, lauroyl peroxide, stearoyl peroxide. Oxides, succinic peroxides, benzoylperoxytoluene, benzoyl peroxide Can be mentioned.

[0050] Examples of peroxydicarbonate include di-n-propinoliver oxydicarbonate, diisopropyl peroxydicarbonate, bis (4-tert-butylcyclohexyl) peroxydicarbonate, and di-2-ethoxy. Examples include methoxy baroxy dicarbonate, di (2-ethylhexyloxy) dicarbonate, dimethoxybutyl dioxygen dicarbonate, and di (3-methyl-3-methoxybutyl dioxy) dicarbonate.

[0051] Examples of peroxyesters include Tamil peroxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexylene 1-methylethylperpero Xinoedecanoate, t-hexoxyloxyneodecanoate, t-butylperoxybivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2 , 5 Di (2-ethylhexylperoxy) hexane, 1-cyclohexylene 1-methylethylperoxy-2-ethylhexanate, t-hexyloxy-2-ethylhexanoate, t-butylperoxy-2-ethyl Xanonate, t-butylperoxyisobutyrate, 1,1 bis (t-butylperoxy) cyclohexane, t-hexyloxyisopropyl Carbonate, t-butylperoxy 3,5,5-trimethylhexanoate, t-butylperoxylaurate, 2,5 dimethyl-2,5 di (m-toluoylperoxy) hexane, t-butinoreperoxyisopropinolemono And carbonate, tert-butylenoperoxy 2-ethylhexyl monocarbonate, tert-hexylperoxybenzoate, tert-butylenoperoxyacetate, n-butyl-4,4 bis (t-butylperoxy) valerate.

[0052] As peroxyketals, for example, 1, 1 bis (t-hexyloxy) 3, 3, 5 trimethylcyclohexane, 1,1-bis (t-hexyloxy) cyclohexane, 1, Examples include 1-bis (t-butylperoxy) 1,3,3,5 trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane, and 2,2-bis (t-butylperoxy) decane.

[0053] Examples of the dialkyl peroxide include α, α, monobis (t-butylperoxy). ) Diisopropylbenzene, dicumyl peroxide, 2,5 dimethyl-2,5 di (t-butylperoxy) hexane, t-butyltamyl peroxide.

[0054] Examples of the hydride peroxide include diisopropylbenzene hydride peroxide and tamenoid oxid peroxide.

[0055] Examples of silyl peroxides include t-butyltrimethylsilyl peroxide, bis (t-butyl) dimethylsilyl peroxide, t-butyltributylsilyl peroxide, bis (tbutyl) dibulylsilyl peroxide, tris ( Examples thereof include t-butyl) butylsilyl peroxide, t-butyltriallylsilyl peroxide, bis (t-butyl) diallylsilyl peroxide, and tris (t-butyl) arylsilyl peroxide.

[0056] These radical polymerization initiators may be used singly or in combination of two or more, and may be used in combination with a decomposition accelerator, an inhibitor and the like.

[0057] Further, those encapsulating these radical polymerization initiators with a polyurethane-based or polyester-based polymeric substance or the like and being microcapsulated are preferable because the pot life is extended.

[0058] When an adhesive film is used as a circuit connecting material, the concentration of chlorine ions and organic acids contained in the radical polymerization initiator is 5000 ppm or less in order to suppress corrosion of circuit electrodes of circuit members. It is preferable that Furthermore, a radical polymerization initiator that generates less organic acid after thermal decomposition is more preferred. In addition, since the stability of the adhesive film after curing is improved, it is preferable to have a mass retention of 20% by mass or more after being left open at room temperature (25 ° C.) and normal pressure for 24 hours.

[0059] Further, if necessary, the adhesive composition may contain a radical polymerization inhibitor such as NO, idroquinone, methyl ether nodule quinone, etc. in a range that does not impair the curability.

[0060] The adhesive composition may contain a thermosetting resin other than the radical polymerizable compound as the polymerizable compound. An example of such thermosetting resin is epoxy resin. Epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, talesole novolak type epoxy resin, bisphenol A novolak. Type epoxy resin, bisphenol F novolac type epoxy resin, alicyclic epoxy resin, glycidyl ester type Poxy soy sauce, glycidinoleamine type epoxy soy sauce, hydantoin type epoxy resin, isocyanurate type epoxy resin, aliphatic chain epoxy resin, and the like. These epoxy resins may be halogenated or hydrogenated. These epoxy resins can be used singly or in combination of two or more.

[0061] Further, as the curing agent for the epoxy resin, those used as an ordinary epoxy resin curing agent can be used. Specific examples include amine-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, imidazole-based curing agents, and dicyandiamide. Furthermore, tertiary amines and organic phosphorus compounds that are usually used as curing accelerators may be used as appropriate.

[0062] Further, as a method of reacting the epoxy resin, in addition to using the above-described curing agent, cationic polymerization may be performed using a sulfone salt, a iodine salt, or the like.

[0063] The film-forming component is a component that makes the film-forming property of the adhesive film better, and can also improve the adhesiveness and the stress relaxation property during Z or curing. Examples of the film-forming component include a film-forming polymer. Examples of film-forming polymers include polybutyral resin, polybulal formal resin, polyester resin, polyamide resin, polyimide resin, xylene resin, phenoxy resin, polyurethane resin, and urea resin. Can be mentioned.

[0064] The film-forming component preferably has a weight average molecular weight of 1,000 to 10,000,000. In addition, those obtained by modifying these polymers with radically polymerizable functional groups can also be used. Thereby, the heat resistance of an adhesive film improves.

[0065] The blending ratio of the film-forming component in the adhesive composition is preferably 2 to 80% by mass with respect to the total amount of the adhesive composition, and more preferably 5 to 70% by mass. It is especially preferable that it is -60 mass%. If the blending ratio of the film-forming component is less than 2% by mass, the stress relaxation property and adhesiveness tend to be lowered, and if it exceeds 80% by mass, the fluidity tends to be lowered.

[0066] The adhesive composition of the present invention preferably contains conductive particles. As a result, when the adhesive film is used for connecting circuit electrodes or the like, it becomes possible to have further excellent connection reliability and to exhibit anisotropic conductivity. Conductive particles enable electrical connection If it has such electroconductivity, it will not specifically limit. Examples of the conductive particles include metal particles including alloys such as Au, Ag, Ni, Cu, Co, and solder, and carbon. Conductive particle force Multi-layers in which core particles such as non-conductive glass, ceramics, and plastics are coated with a film containing a conductive material such as the metal or a particle containing a conductive material such as the metal. It may be. The thickness of the coating film is preferably 10 nm or more in order to obtain more reliable conductivity.

When powerful multi-layered conductive particles or heat-meltable metal particles are used as the conductive particles, the conductive particles have a deformability that deforms when heated and pressurized. Therefore, when connecting the circuits using the adhesive composition containing such conductive particles, the contact area between the circuit and the conductive particles is increased, and variations in thickness between the plurality of electrodes can be absorbed. Therefore, the viewpoint power of improving reliability is also preferable.

[0068] Further, the fine particles obtained by further coating the surface of the conductive particles with a resin film or the like can further suppress a short circuit caused by contact between the fine particles. Accordingly, since the insulation between the electrode circuits is improved, it may be blended into the adhesive composition, as appropriate, alone or mixed with conductive particles.

[0069] The content ratio of the conductive particles in the adhesive composition is preferably 0.1 to 30% by volume, more preferably 0.1 to 20% by volume. A volume% is particularly preferred. When the content ratio of the conductive particles is less than 0.1 part by volume, the cured product of the adhesive composition tends to be inferior in conductivity. When the content exceeds 30 parts by volume, the adhesive composition is used for circuit connection. In some cases, a short circuit between the circuits to be insulated tends to occur. From the same viewpoint, the content of the conductive particles is preferably 0.5 to 30 parts by mass with respect to 100 parts by mass of the thermoplastic resin.

[0070] The content ratio of the conductive particles is determined based on the volume of each component in the adhesive composition before curing at 23 ° C. The volume of each component may be converted into a volume based on the specific gravity. In addition, do not dissolve or swell the component in a graduated cylinder, etc., and put the component in a container that contains a suitable solvent (water, alcohol, etc.) that wets the component well. It can also be determined as a volume.

[0071] Also, the adhesive composition of the present invention is for the purpose of further improving the adhesiveness of the adhesive film, A coupling agent may be contained. Examples of the coupling agent include alkoxysilanes such as trimethoxysilane methacrylate and γ-glycidoxypropyltrimethoxysilane.

[0072] The adhesive composition according to the present invention can solve the problems of the present invention by adding a filler, a softening agent, an anti-aging agent, a colorant, a flame retardant, a coupling agent, and the like, if necessary. Please follow the range.

[0073] The adhesive film according to the present invention is suitably used as an adhesive film for electronic materials.

[0074] A method for producing a laminated film according to a preferred embodiment of the present invention includes a first step of selecting a support having a surface residual adhesion ratio C of 80% or more, and a support selected in the selection step.

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And a second step of forming an adhesive film containing the adhesive composition on the surface of the holder. In the first step, a support having a residual surface adhesion C of 80% or more

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If the above-mentioned method of selecting the support is adopted as the method of selecting the substrate.

[0075] Examples of a method for forming an adhesive film containing the adhesive composition on the support throughout the second step include the following methods. First, a solution obtained by adding a solvent or the like to the adhesive composition obtained by mixing the above-described components, if necessary, is applied on a support to form a coating film. Next, after removing the solvent, the adhesive film is obtained by making the coating film into a solid or semi-solid state. Alternatively, the adhesive composition may be heated to ensure fluidity, then a solvent is added to obtain a solution, and the solution is treated in the same manner as described above to form an adhesive film.

[0076] The laminated film of the present invention may be a laminated film having a two-layer force of a support and an adhesive film formed on the surface thereof. Alternatively, it may be a laminated film in which two or more layers of adhesive films having the same or different composition and manufacturing method are provided on the surface of the support. In this case, the laminated film is obtained by further forming an adhesive film as described above on the surface opposite to the support of the adhesive film formed on the surface of the support as described above. It is done. Alternatively, the laminated film can be obtained by laminating adhesive films formed on the surfaces of separate supports with each other using a laminator or the like. Next, a preferred embodiment of a method for manufacturing a circuit member connection structure using the laminated film of the present invention will be described. FIG. 4 is a schematic cross-sectional view showing an embodiment of a circuit member connection structure obtained by this manufacturing method. As shown in FIG. 4, the circuit member connection structure includes a first circuit member 20 and a second circuit member 30 that face each other, and the first circuit member 20 and the second circuit member 30 are provided. Between them, a circuit connecting member 10 is provided for connecting them.

The first circuit member 20 includes a circuit board (first circuit board) 21 and a circuit electrode (first circuit electrode) 22 formed on the main surface 21a of the circuit board 21. Yes. On the other hand, the second circuit member 30 includes a circuit board (second circuit board) 31 and a circuit electrode (second circuit electrode) 32 formed on the main surface 31 a of the circuit board 31. The circuit boards 21 and 31 include semiconductors, glass, ceramics and other inorganic substances, polyimides, polycarbonates, polyesters, polyethersulfone and other organic substances, and composite materials of these inorganic substances and organic substances (for example, glass Z polyepoxy resin). There are things that can help.

[0079] The first and second circuit members 20, 30 are not particularly limited as long as electrodes that require electrical connection are formed. Specific examples include electrodes used in liquid crystal displays, such as glass substrates or plastic substrates, printed wiring boards, ceramic wiring boards, and flexible wiring boards, which are made of V, ITO, or the like. Used in combination.

[0080] The circuit connecting member 10 contains an insulating substance 11 and conductive particles 7. The conductive particles 7 are disposed not only between the circuit electrode 22 and the circuit electrode 32 facing each other but also between the main surfaces 21a and 31a. In the circuit member connection structure, the circuit electrodes 22 and 32 are electrically connected via the conductive particles 7. That is, the conductive particles 7 are in direct contact with both the circuit electrodes 22 and 32.

Here, the conductive particles 7 correspond to the conductive particles that may be contained in the above-mentioned adhesive composition.

In the circuit member connection structure, as described above, the opposing circuit electrode 22 and circuit electrode 32 are electrically connected via the conductive particles 7. For this reason, the connection resistance between the circuit electrodes 2 2 and 32 is sufficiently reduced. Therefore, the current between circuit electrodes 22 and 32 The flow can be made smooth, and the functions of the circuit can be fully exhibited. In addition

When the circuit connecting member 10 does not contain the conductive particles 7, the circuit electrode 22 and the circuit electrode 32 are in direct contact with each other to be electrically connected.

[0083] As will be described later, the circuit connecting member 10 is made of a cured product of the adhesive film. Therefore, the connection reliability of the circuit connection member 10 with respect to the circuit member 20 or 30 is sufficiently high.

In the method for manufacturing a circuit member connection structure according to the present invention, first, the first circuit member 20 and the film-like circuit connection material 40 described above are prepared (see FIG. 5 (a)). The film-like circuit connecting material 40 is the above-described adhesive film, and is formed on the surface of the support 1 according to the present invention to form the laminated film 100 at the stage of preparation. Further, the film-like circuit connecting material 40 here contains conductive particles 7. The film-like circuit connecting material 40 is usually drawn out from the state of being wound around the core and cut to a required length.

Next, the film-like circuit connecting material 40 is placed on the surface of the first circuit member 20 on which the circuit electrodes 22 are formed. At this time, since the film-like circuit connecting material 40 is provided on the support 1, the film-like circuit connecting material 40 is placed on the first circuit member 20 so that the film-like circuit connecting material 40 side faces the first circuit member 20. . By being in the form of a circuit connecting material force film, the film-like circuit connecting material 40 can be easily interposed between the first circuit member 20 and the second circuit member 30. Connection work with the second circuit member 30 can be easily performed.

Then, pressure is applied in the directions of arrows A and B in FIG. 5A, and the film-like circuit connecting material 40 is temporarily fixed (temporarily connected) to the first circuit member 20. At this time, you may pressurize, heating. However, the heating temperature is a temperature at which the adhesive composition in the film-like circuit connecting material 40 is not cured.

Next, the support 1 is peeled from the film-like circuit connecting material 40 (see FIG. 5 (b)). At this time, since the support 1 is a support according to the present invention, the support 1 and the film-like circuit connection material 40 are laminated, such as transfer of the release treatment agent from the support 1 to the film-like circuit connection material 40. It is possible to sufficiently suppress the deterioration factor of the connection reliability due to the fact.

Subsequently, the film-like circuit connecting material 40 is irradiated with actinic rays. Next, in Fig. 5 (c) In this manner, the second circuit member 30 is placed on the film-like circuit connecting material 40 so that the second circuit electrode faces the first circuit member 20.

[0089] Then, the film-like circuit connecting material 40 is pressurized through the first and second circuit members 20 and 30 in the directions of arrows A and B in FIG. The heating temperature at this time is a temperature at which the adhesive composition of the present invention can be cured. In this way, the film-like circuit connecting material 40 is cured and the main connection is performed, so that a circuit member connection structure as shown in FIG. 4 is obtained. The connection conditions are appropriately selected depending on the intended use, the adhesive composition, and the circuit member.

[0090] For example, the heating temperature is 90 to 250 ° C, and the pressure is generally 0.1 to 10 to the adherend.

The time required for MPa and heating and pressurization (connection time) is preferably 1 second to 10 minutes.

[0091] The apparatus for heating and pressurizing is not particularly limited! However, in consideration of productivity and convenience, a pressurizing and heating apparatus including a pressurizing head with a built-in heater is preferable.

When the circuit member connection structure is manufactured as described above, the connection reliability is improved in the obtained circuit member connection structure, and therefore the yield of the circuit member connection structure is sufficiently increased.

[0093] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these. For example, the method for producing a laminated film according to another embodiment of the present invention includes a step of forming a support so that the residual adhesion C on the surface is 80% or more, and the support

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Forming an adhesive film containing the adhesive composition on the surface of the body. In the step of forming the support, the composition and the composition are substantially the same as those of the support selected by the above-described support screening method and having a surface residual adhesion ratio C of 80% or more.

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The support may be formed by a manufacturing method.

[0094] Further, in the method for manufacturing a circuit member connection structure, after the curing process by heating and pressurization, a curing process using light, ultrasonic waves, Z, or electromagnetic waves may be further performed.

[0095] Furthermore, in another embodiment of the present invention, an adhesive film may be used as a material for a semiconductor connection member that connects a semiconductor element and a circuit pattern in a semiconductor device.

FIG. 6 is a schematic cross-sectional view showing an embodiment of this semiconductor device. As shown in Figure 6 The semiconductor device 80 of the present embodiment includes a semiconductor element 50 and a substrate 60 that serves as a semiconductor support member, and the semiconductor element that electrically connects them between the semiconductor element 50 and the substrate 60. A connecting member 40 is provided. The semiconductor element connection member 40 is laminated on the main surface 60a of the substrate 60, and the semiconductor element 50 is further laminated on the semiconductor element connection member 40.

The substrate 60 includes a circuit pattern 61, and the circuit pattern 61 is electrically connected to the semiconductor element 50 via the semiconductor connection member 40 on the main surface 60 a of the substrate 60 or directly. These are sealed with a sealing material 70 to form a semiconductor device 80.

[0098] The material of the semiconductor device 50 is not particularly limited, but is a group 4 semiconductor device of silicon, germanium, a group IIIV compound semiconductor device such as GaAs, InP, GaP, InGaAs, or the like, such as ΗgTe, HgCdTe, or CdMnTe. — Group VI compound semiconductor devices and various devices such as CuInSe (CIS) can be used.

[0099] The semiconductor element connecting member 40 contains the insulating substance 11 and the conductive particles 7, and is a cured product of the adhesive film of the present invention. The conductive particles 7 are disposed not only between the semiconductor element 50 and the circuit pattern 61 but also between the semiconductor element 50 and the main surface 60a. In the semiconductor device 80 of this embodiment, the semiconductor element 50 and the circuit pattern 61 are electrically connected via the conductive particles 7. For this reason, the connection resistance between the semiconductor element 50 and the circuit pattern 61 is sufficiently reduced. Therefore, the current flow between the semiconductor element 50 and the circuit pattern 61 can be made smooth, and the functions of the semiconductor can be fully exhibited. In addition, it is possible to show the anisotropy of electrical connection by setting the conductive particles 7 to the above-described mixing ratio.

[0100] Since the semiconductor element connection member 40 is made of the cured adhesive film according to the present invention, the connection reliability between the semiconductor element 50 and the circuit pattern 61 is improved, and the yield of the semiconductor device 80 is increased. Will be high enough.

Example

[0101] Hereinafter, the present invention will be described in more detail by way of examples. However, the present invention is not limited to these examples.

[0102] [Preparation of support] A polyethylene terephthalate (hereinafter referred to as “PET”) film was prepared as a base film. Separately, amino alkyd resin (trade name “TA31-209” manufactured by Hitachi Chemical Co., Ltd.) and acid catalyst (trade name “Dryer 900” manufactured by Hitachi Chemical Polymer Co., Ltd.) in a mass ratio of 100% solids. : 1 ~: LOO: 5 was mixed and further diluted with a solvent to obtain a solution. The obtained solution was coated on one side of the PET film, and the solvent was volatilized to prepare # 1 to # 6 support substrates. In addition, a product name “AH3” manufactured by Teijin Limited was prepared as the base material for support # 7, and a product name “UH2” manufactured by Teijin Limited was prepared as the base material for support # 8.

[0103] The thicknesses of base materials for support # 1-8 were measured. Further, the residual adhesion rate C on the surface of the substrate for support # 1-8 was measured as described above. The results are shown in Table 1.

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[0104] [Table 1]

[0105] (Example 1)

First, based on the weight of solids, the film-forming component fluorene biphenyl type phenoloxy resin 40g, bisphenol A type phenoloxy resin 10g, polymerizable compound tris (acryloxychetyl) isocyanurate 10g Similarly, 10 g of urethane acrylate, 10 g of trimethoxysilane metatalylate as a coupling agent, and 3 g of n-butyl 4,4-bis (t-butylperoxy) valerate as a polymerization initiator were blended. Thereto, 40 g of conductive particles were further mixed and dispersed to obtain a first adhesive composition. The conductive particles are formed by forming a 0.2 μm thick nickel layer and a 0.04 μm thick gold layer in this order on the surface of polystyrene-based particles, and then forming a polybutyl alcohol on the surface. Obtained by forming a layer consisting of . The average particle diameter of the conductive particles was 4 μm.

[0106] Next, the first adhesive composition was applied onto the surface of the substrate for support # 1 using a coating apparatus to obtain a coating film. The coating film was dried with hot air at 70 ° C. for 5 minutes to obtain a first intermediate laminate having an adhesive film thickness of 25 μm.

[0107] Next, in terms of the weight of the solid content, the film-forming component fluorene-biphenyl type phenolic resin 40g, the same bisphenol A type phenolic resin 10g, and the polymerizable compound tris (acrylochelchetil) ) 10g of isocyanurate, 10g of urethane acrylate, 10g of trimethoxysilane metatalylate as coupling agent, and 3g of n-butyl-4,4-bis (t-butylperoxy) valerate as polymerization initiator. Obtained an adhesive composition

[0108] Subsequently, the second adhesive composition was applied onto the surface of the substrate for support # 2 using a coating apparatus to obtain a coating film. The coating film was dried with hot air at 70 ° C. for 5 minutes to obtain a second intermediate laminate having an adhesive film thickness of 25 μm.

[0109] Using the laminator, the first intermediate laminate and the second intermediate laminate are laminated such that the adhesive films overlap each other and the adhesive films are sandwiched between the respective substrates for the support. Lamination was performed under the conditions of ° C, 0.5 mmZmin, no pressure, and a laminated film was obtained.

[0110] (Example 2)

In the same manner as in Example 1, except that the support substrate # 3 was used instead of the support substrate # 1, and the support substrate # 4 was used instead of the support substrate # 2. A laminated film was obtained.

[0111] (Example 3)

In the same manner as in Example 1, except that the support substrate # 5 was used instead of the support substrate # 1, and the support substrate # 6 was used instead of the support substrate # 2. A laminated film was obtained.

[0112] (Example 4)

First, based on the weight of the solids, the film-forming component fluorene biphenol type phenolic resin 10g, bisphenol A type phenolic resin 30g, polymerizable compound phenol novolac type epoxy resin 20g, coupling agent 5 g of γ-glycidoxypropyltrimethoxysilane and 40 g of an imidazole curing agent as a curing agent were blended. Further, 40 g of conductive particles were mixed and dispersed in the same manner as in Example 1 to obtain a first adhesive composition. [0113] Next, a coating film was obtained by applying the first adhesive composition on the surface of the substrate for support # 1 using a coating apparatus. The coating film was dried with hot air at 70 ° C. for 5 minutes to obtain a first intermediate laminate having an adhesive film thickness of 12 m.

[0114] Next, in terms of the weight of the solid content, the film-forming component fluorene biphenol type phenolic resin 10 g, the same bisphenol A type phenolic resin 30 g, the polymerizable novolac type epoxy resin A second adhesive composition was obtained by blending 20 g of rosin, 5 g of γ-glycidoxypropyltrimethoxysilane as a coupling agent, and 40 g of an imidazole curing agent as a curing agent.

[0115] Subsequently, the second adhesive composition was applied onto the surface of the substrate for support # 2 using a coating apparatus to obtain a coating film. The coating film was dried with hot air at 70 ° C. for 5 minutes to obtain a second intermediate laminate having an adhesive film thickness of 13 m.

[0116] Using the laminator, the first intermediate laminate and the second intermediate laminate are laminated such that the adhesive films overlap each other and the adhesive films are sandwiched between the respective substrates for support. Lamination was performed under the conditions of ° C, 0.5 mmZmin, no pressure, and a laminated film was obtained.

[0117] (Comparative Example 1)

In the same manner as in Example 1 except that the support substrate # 7 was used instead of the support substrate # 1, and the support substrate # 8 was used instead of the support substrate # 2. A laminated film was obtained.

[0118] (Comparative Example 2)

In the same manner as in Example 4 except that the support substrate # 7 was used instead of the support substrate # 1, and the support substrate # 8 was used instead of the support substrate # 2, A laminated film was obtained.

[0119] [Preparation of connection resistance measurement sample]

A circuit (line width 50 μm, pitch 100 μm, thickness 250 nm (2500 A μm) made of indium-stannate (hereinafter referred to as “ITO”) as a circuit electrode is a glass substrate (coning A circuit member formed on a product name “# 1737”, 28 mm × 32 mm × O. 7 mm) was prepared, and the laminated film produced in Example 1 was cut into 2.5 mm × 20 mm. Subsequently, the base material for support # 2 in this laminated film is peeled off, and the laminated film is pasted so that the exposed adhesive film faces the main surface of the circuit member on the circuit forming side. The pasting conditions were: heating temperature 90 ° C, pressure IMPa (paste 3 seconds).

[0120] Next, an IC chip with a gold bump electrode with a chip size of 1.7 mm x 17 mm x 0.55 mm, a bump area of 50 m x 50 μm, a bump height of 15 μm, and a bump count of 358 Prepared. Subsequently, the base material for support # 1 of the laminated film attached to the circuit member was peeled off. Next, alignment is performed so that the adhesive film exposed by peeling off the substrate for support # 1 and the gold bump electrode side of the IC chip face each other, and the IC chip and the electrodes of the circuit member can be connected to each other. However, the circuit member with laminated film and the IC chip were superposed. Then, using a pressure heating device equipped with a pressure heating head, they were pressure-bonded by heating and pressing by an IC chip side force, and the connection resistance measurement sample according to Example 1 was obtained. The heating and pressing conditions were a connection temperature of 200 ° C, a pressing pressure of 80 MPa (per total bump area), and 3 seconds.

[0121] In addition, using the laminated films of Examples 2 to 4 and Comparative Examples 1 and 2, respectively, the connection resistance measurement samples according to Examples 2 to 4 and Comparative Examples 1 and 2 were obtained in the same manner as described above. Obtained.

[0122] [Measurement of connection resistance]

For the obtained connection resistance measurement sample, the electrical resistance value (connection resistance) between the electrode circuit in the circuit member and the bump electrode in the IC chip was measured using a digital multimeter by the 4-terminal measurement method. It was measured. The measurement current was 1 mA. The measurement was performed immediately after preparation of the connection resistance measurement sample (initial stage) and after the sample was exposed to thermal cycle conditions (after cycle). The thermal cycle used was a thermal shock test apparatus (trade name “TSA-41L-A” manufactured by ESPEC) .The thermal cycle conditions were: −40 ° C for 15 minutes and 100 ° C for 15 minutes. The condition was repeated 1000 times, and the results are shown in Table 2.

[0123] [Table 2] Examples Comparative examples

1 2 3 4 1 2

# 1 # 3 # 5 # 1 # 7 #F Support

# 2 # 4 # 6 # 2 # 8 # 8 Connection resistance (Ω)

Initial 1 1 1 1 1 0 5 After cycle 36 32 30 20 84 65 Industrial applicability

According to the present invention, it is possible to provide a laminated film obtained by laminating an adhesive film on the surface of a support, wherein the adhesive film has sufficient connection reliability.

Claims

The scope of the claims

[1] A laminated film in which an adhesive film containing an adhesive composition is formed on the surface of a support, wherein the support has a residual adhesion rate C force of ≧ 0% or more on the surface.

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Layer film.

[2] The laminated film according to [1], wherein the adhesive composition contains conductive particles.

[3] A method for sorting a laminated film support for sorting the support of a laminated film in which an adhesive film containing an adhesive composition is formed on the surface of the support, wherein the surface remains A method of selecting the support having an adhesion rate C force of ¾0% or more.

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[4] A step of selecting a support having a residual surface adhesion C of 80% or more,

Five

Forming an adhesive film containing an adhesive composition on the surface of the support that has been selected in the screening step.

[5] forming a support so that the residual adhesion C on the surface is 80% or more;

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A process for forming an adhesive film containing an adhesive composition on the surface of the support.

[6] Measure the peel strength between the adhesive tape, which is a standard sample, and a predetermined metal plate, and use this as the reference peel strength A, and attach the adhesive tape to the laminated film support that is the object of measurement. The procedure of measuring the peel strength between the predetermined metal plate and the predetermined metal plate is repeated 5 times, and the following formula is obtained from the step of setting the fifth peel strength to B and the peel strength A and B:

5 5

A step of deriving a residual adhesion rate C represented by (1),

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Evaluation methods.

C = B / AX 100 (1)