KR20080024198A - Multilayer film, method for producing same, method for selecting supporting body for multilayer film, and method for evaluating supporting body for multilayer film - Google Patents

Abstract

Disclosed is a multilayer film obtained by forming an adhesive film containing an adhesive composition on the surface of a supporting body. This multilayer film is characterized in that the supporting body has a surface having a residual adhesion ratio C5 of not less than 80%. ® KIPO & WIPO 2008

Description

Laminated film and its manufacturing method, the screening method of the support for laminated films, and the evaluation method of the support for laminated films }

This invention relates to a laminated | multilayer film and its manufacturing method, the selection method of the support for laminated films, and the evaluation method of the support for laminated films.

BACKGROUND ART In the field of precision electronic devices such as semiconductors and liquid crystal displays, various adhesives are used to fix circuits by fixing electronic materials to substrates and the like. In these fields, since high density and high precision of semiconductor chips and circuits are being advanced, high adhesive strength and reliability are required for adhesives for bonding and fixing them.

For example, the anisotropic conductive adhesive which disperse | distributed electroconductive particle in the adhesive agent is used for the connection of a liquid crystal display and TCP (tape carrier package), the connection of FPC (flexible printed circuit) and TCP, or the connection of an FPC and a printed wiring board. This intends to perform circuit connection more reliably. In addition, when mounting a semiconductor silicon chip on a board | substrate, what is called flip chip mounting which mounts a semiconductor silicon chip directly to a board | substrate directly face-down instead of the conventional wire bonding is performed. Also in this case, application of the anisotropic conductive adhesive is disclosed.

When using the adhesive film for electronic materials as the adhesive agent mentioned above, the adhesive film before use normally comprises the support body in at least one of the main surface, and comprises the laminated | multilayer film. The surface of the support is often covered with a peeling treatment agent so that the adhesive film provided on the surface can be easily removed. In addition, in order to make peeling of a to-be-adhered substance easy to peel from a support body, this peeling treatment agent is designed so that one part of a peeling agent component and the low molecular weight component contained in the component of a peeling treatment agent are intentionally transferred to the to-be-adhered body side. Thereby, although the light peeling of the to-be-adhered body from a support body is implement | achieved, a part of peeling agent transfers to the surface of an adhesive film by this. A part (foreign material) of such a peeling treatment agent may generate the fall of the connection reliability after mounting.

As a typical peeling treatment agent, a peeling treatment agent made of a silicone resin is widely known. As for the laminated | multilayer film using the support body coat | covered with this peeling processing agent, the peeling processing agent moves especially easily to the adhesive film side (for example, refer patent document 1, 2). Therefore, as described in patent document 3, the countermeasure using the support body (peel film) which does not contain a silicone resin is considered.

Patent Document 1: Japanese Patent Application Laid-Open No. 2001-123130

Patent Document 2: Japanese Patent Laid-Open No. 2002-331614

Patent Document 3: Japanese Patent Laid-Open No. 2001-171033

Problems to be Solved by the Invention

However, the support which does not contain a silicone resin also realizes light peeling by transferring a part of peeling agent component and the low molecular weight component contained in a peeling agent component as mentioned above. Therefore, even when such a support body is used, the fall of connection reliability arises.

Therefore, this invention is a laminated | multilayer film formed by laminating | stacking an adhesive film on the surface of a support body, Comprising: The laminated | multilayer film which the said adhesive film has sufficient connection reliability, its manufacturing method, the selection method of the support for laminated films, and evaluation of the support for laminated films It is an object to provide a method.

To achieve the above object, the present invention provides a laminated film obtained by forming an adhesive film containing an adhesive composition on the surface of the support, the support provides a residual adhesion rate of C ₅ are laminated more than 80% of the film of the surface thereof.

Here, "residual adhesion rate C ₅ " of the support surface is a numerical value derived as follows. That is, the peeling strength between the adhesive tape 31B tape which is a standard sample, and a predetermined metal plate is first measured, and this is set as reference peeling strength A. FIG. Next, the adhesive tape is adhered to the support to be measured and then peeled off. Similarly, the procedure of measuring the peel strength with a predetermined metal plate is repeated five times, and the fifth peel strength is set to B ₅ . From the peeling strengths A and B ₅ mentioned above, the residual adhesion rate C ₅ represented by following formula (1) is derived.

C ₅ = B ₅ / A × 100

The term "residual adhesion rate" is also described in patent document 2 mentioned above. However, the "residual adhesion rate" described in Patent Document 2 is not the same as the measurement method with respect to the residual adhesion rate C ₅ defined in the present invention. Moreover, also in patent document 2, the peeling strength to measure is 1st time also different from this invention. This has an important meaning as described later. This will be described in more detail with reference to FIGS. 1 to 3.

[1] First, the support 8 constituting the laminated film, the acrylic foam double-sided bonding tape 4 having a width of 25 mm, the glass plate 3, the 31B tape 2 having a width of 10 mm (manufactured by Nitto Denko Corp.), and A stainless steel (SUS) plate 1 is prepared. Next, the surface of the glass plate 3 is wash | cleaned using various solvents, such as toluene, acetone, and methanol, and the organic component and inorganic component which adhered on the surface are removed. Subsequently, the acrylic foam double-sided bonding tape 4 cut | disconnected to length 60mm is adhere | attached on the surface of the glass plate 3 after washing | cleaning using the rubber roll of 2 mass.

[2] Next, the release substrate of the acrylic foam double-sided bonding tape 4 is peeled off to expose the adhesive surface. Moreover, the support body 8 cut | disconnected in the rectangular membrane shape of 20 mm x 55 mm is arrange | positioned so that the whole main surface of one may be placed on the center part of the said adhesive surface of the acrylic foam double-sided bonding tape 4.

[3] Next, the 31B tape 2 newly cut to a length of 70 mm was bonded to the surface of the support 8 to prevent wrinkles from occurring using a rubber roll having a mass of 2 kg. It is comprised as shown to the front view and the schematic top view of FIG. Subsequently, with respect to the 31B tape 2 adhered to the surface of the support 8, a 180 ° peeling was performed at a tensile speed of 50 mm / min with a tensile tester as shown in the schematic front view of FIG. 1 (b). Do it. In this way, the 31B tape 6 which peeled is obtained.

[4] When only the residual adhesion rate C ₅ is measured, the operation of (3) is repeated five times. At this time, the 31B tape 2 adhere | attached on the surface of the support body 8 uses the thing cut | disconnected newly in consideration of circumstances.

[5] Next, the surface of the stainless steel sheet 1 is washed with various solvents such as toluene, acetone and methanol to remove organic and inorganic components adhering on the surface. Further, the 31B tape 6 obtained in the fifth step of operation [3] was bonded to the surface of the cleaned stainless steel sheet 1 using a rubber roll having a mass of 2 kg to prevent wrinkles from occurring. The structure is configured as shown in the schematic front view of the step.

[6] Subsequently, with respect to the 31B tape 6 bonded to the stainless steel sheet 1, as shown in the schematic front view of FIG. 1 (d) by a tensile tester, 180 ° at a tensile speed of 50 mm / min. Peeling is performed. The peeling strength B ₅ at this time is measured and recorded.

[7] A 31B tape 2 and a stainless steel sheet 1 are prepared separately from the operations of [1] to [6] described above. In addition, the surface of the stainless steel sheet 1 is cleaned using various solvents such as toluene, acetone, methanol, and the like to remove organic and inorganic components adhering on the surface. Subsequently, the 31B tape 2 cut to a length of 70 mm was bonded to the surface of the stainless steel sheet 1 after cleaning using a rubber roll having a mass of 2 kg to prevent wrinkles from occurring. It is comprised as shown in a schematic front view.

[8] Thereafter, the 31B tape 2 adhered to the stainless steel sheet 1 was subjected to a tensile tester, as shown in the schematic front view of Fig. 3 (b), at a tensile speed of 50 mm / min. ° Peel off. The peeling strength A at this time is measured and recorded.

[9] From the peel strengths A and B ₅ obtained as described above, the residual adhesion rate C ₅ is derived by the above expression (1).

The residual adhesion rate C ₅ is a numerical value obtained after repeating the operation of [3] five times, but each time the operation of [3] is performed once, the operation of [5] and [6] is subsequently performed. It is also possible to measure the peel strength. In this case, after repeating the operation of [3] n times and then setting the peel strength obtained by the operation of [6] to B _n , the corresponding residual adhesion rate C ₅ is represented by the following formula (2).

C _n = B _n / A × 100

It is thought that the factor which has the sufficient connection reliability of the laminated | multilayer film of this invention is as follows. However, the factor is not limited to this.

The support whose residual adhesion rate C ₅ prescribed | regulated by this invention is 80% or more means that it is a light peeling design which does not depend only on the transcription | transfer of a peeling processing agent. That is, in the conventional silicone resin peeling agent, as described above, light peeling is realized by transferring a part of the peeling agent component or a low molecular weight component contained in the peeling agent component. Even if such a peeling treatment agent repeats the said peeling test several times, the low molecular weight component contained in a part of peeling agent component and peeling agent component will peel. Therefore, the residual adhesion rate C ₅ remains low. On the other hand, in the peeling agent in which light peeling does not depend only on the transcription | transfer of a peeling agent, a part of peeling agent is similarly transferred in the 1st and 2nd peel test, or the low molecular weight component contained in a peeling agent component peels. Therefore, the residual adhesiveness in the 1st time and the 2nd time shows low numerical value. However, since such transfer and peeling are completed by repeating the peeling test up to five times, the residual adhesion rate C ₅ becomes 80% or more. This residual adhesion rate of the support is shown the C _5, is assumed that since the implementation of the foreign matter of the adhesive film at the time of mounting is suppressed, and sufficient to increase the connection reliability of the adhesive film.

It is preferable that the adhesive composition which concerns on this invention contains electroconductive particle. Thereby, circuit members can be electrically connected more stably while maintaining the insulation state of the circuit electrodes on the same board | substrate.

The present invention provides a screening method for a laminate film support to screen the support of the laminated film formed of the adhesive film is formed which contains an adhesive composition on the surface of the support, the support is a residual adhesion rate of C ₅ in the surface of the support is 80% or more It provides a method of screening. According to the selection method of this support body, when connecting circuit electrodes etc. using the laminated | multilayer film which laminated | stacks an adhesive film on the surface of the selected support body, the adhesive film peeled from the support body and inserted in a circuit electrode etc. is made into circuit electrodes, etc. The connection reliability of can fully be maintained.

The invention method of producing a laminated film and a step of the step of screening the support is a residual adhesion rate of C ₅ in the surface of 80% or more, and forming an adhesive film containing an adhesive composition on the surface of the selected substrate in the screening process To provide. In addition, the present invention method of producing a laminated film having a step of forming an adhesive film containing a step of forming the support is a residual adhesion rate of C ₅ of the surface is at least 80% and the adhesive composition on the surface of the support, To provide. According to these manufacturing methods, when connecting circuit electrodes etc. using the laminated | multilayer film obtained, the adhesive film which peels from a support body and fits in a circuit electrode etc. can fully maintain connection reliability, such as circuit electrodes.

This invention measures the peeling strength of the adhesive tape which is a standard sample, and a predetermined metal plate, makes it the reference peeling strength A, and adhere | attaches the said adhesive tape to the support body for laminated films which is a measurement object, and peels it, The said predetermined | prescribed The procedure of measuring the peel strength with the metal plate is repeated five times, and the step of setting the _fifth peel strength to B ₅ and the residual adhesiveness expressed by the following formula (1) from the peel strengths A and B ₅ described above. It provides a method of evaluating the laminated film support substrate and a step of deriving a C _5.

<Equation 1>

C ₅ = B ₅ / A × 100

According to this evaluation method, it becomes possible to judge suitably adequately about whether the adhesive film after peeling from a support body has sufficient connection reliability.

Effect of the Invention

According to this invention, the laminated | multilayer film which laminates an adhesive film on the surface of a support body can provide the laminated | multilayer film with sufficient connection reliability.

[Fig. 1] is a front view for explaining a step peel strength B _5.

[Figure 2] it is a schematic plane view illustrating the peel strength B _5.

3 is a process front view for explaining the peel strength A;

4 is a schematic cross-sectional view showing an embodiment of a connection structure of a circuit member according to the present invention.

5 is a series of process diagrams for connecting a circuit member according to the present invention.

6 is a schematic cross-sectional view showing one embodiment of a semiconductor device according to the present invention.

<Brief description of symbols for the main parts of the drawings>

One… Stainless steel (SUS) plate, 2, 6... 31B tape, 3... Glass plate, 4... Acrylic foam double-sided adhesive tape, 7.. Conductive particles, 8.. Support 10... . Circuit connecting member, 11... Insulating material, 20... First circuit member, 21... First circuit board, 22... First circuit electrode, 30... Second circuit member, 31... Second circuit board, 32... Second circuit electrode, 40... Semiconductor element connection member, 50.. Semiconductor element, 60... Substrate 61... Circuit pattern, 70... Sealing material, 80... Semiconductor device.

Best Mode for Carrying Out the Invention

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail, referring drawings as needed. In addition, in drawing, the same code | symbol is attached | subjected to the same element, and overlapping description is abbreviate | omitted. In addition, the positional relationship, such as up, down, left, and right, is based on the positional relationship shown in drawing unless there is particular notice. In addition, the dimension ratio of drawing is not limited to the ratio shown. In addition, in this specification, "(meth) acrylic acid" means "acrylic acid" and the corresponding "methacrylic acid", and "(meth) acrylate" means "acrylate" and the corresponding "methacrylate" "(Meth) acryloxy group" means "acryloxy group" and "methacryloxy group" corresponding thereto.

The laminated film according to a preferred embodiment of the present invention is a film made of the adhesive containing an adhesive composition on the surface of the support is formed in the laminated film, the support is a residual adhesion rate of C ₅ of the surface is 80% or more.

The support is not particularly limited as long as the residual adhesion rate C ₅ on the surface thereof is 80% or more.

As a specific example of a support body, a polyethylene terephthalate film, a polyethylene naphthalate film, a polyethylene isophthalate film, a polybutylene terephthalate film, a polyolefin type film, a polyacetate film, a polycarbonate film, a polyphenylene sulfide film, Polyamide film, ethylene-vinyl acetate copolymer film, polyvinyl chloride film, polyvinylidene chloride film, synthetic rubber film, liquid crystal polymer film. These may be subjected to corona discharge treatment, anchor coating treatment, antistatic treatment or the like on the film surface as necessary.

The support may have a residual adhesion rate C ₅ of 80% or more, and may be formed by coating a release treatment agent on the surface so that the adhesive film formed on the surface can be easily peeled off. Examples of the peeling treatment agent include silicone resins, copolymers of silicone and organic resins, alkyd resins, aminoalkyd resins, resins having long-chain alkyl groups, resins having fluoroalkyl groups, and cerac resins. Among them, a peeling treatment agent other than a peeling treatment agent having a silicone resin as a main component is preferable from the viewpoint of more effectively preventing the transition from the support of the peeling treatment agent to the adhesive film.

The thickness of the support is not particularly limited. However, in consideration of the convenience of storage and use of the laminated film, the thickness of the support is preferably 4 to 200 m. In addition, in consideration of material cost and productivity of the laminated film, the thickness of the support is more preferably 15 to 75 µm.

It is preferable to use the support body evaluated by the evaluation method of the support body for laminated films which concerns on this invention mentioned above, and selected by the selection method of the support body for laminated films which concerns on this invention. In the screening methods of the support, e.g., preparing a support of a plurality of the material or manufacturing method different species, and of those of the support, select a residual adhesion rate of just less than C _5, 80% of the surface, residual adhesion rate of the surface C _The support whose pentavalent is less than 80% is removed. When the laminated film is manufactured using only the selected support body in this way, the connection reliability of an adhesive film improves and the connection structure of the circuit formed using this adhesive film, and the yield of a semiconductor device become high enough.

In order to make the residual adhesion rate C ₅ of a support body into 80% or more, for example, a high molecular weight component may be preferentially present without making the low molecular weight component exist as much as possible on the surface of a support body, or a part of the molecules of a peelable treatment agent component may fall out. The method of controlling so that it may become difficult to mention may be mentioned. As a high molecular weight component, an amino alkyd resin is mentioned, for example.

As an adhesive film, it is preferable to shape | mold an adhesive composition, for example in a film form. The adhesive composition preferably forms a film on a polymerizable compound such as a polymerizable resin component for maintaining a connected state between electronic materials such as circuit electrodes, a polymerization initiator which is a curing agent for curing the polymerizable compound, and an adhesive composition. It is preferable to include the film formation component for giving a property.

The polymeric compound is curable, such as a thermosetting compound which can be cured in the temperature range set according to the environment when using a laminated film, or a photocurable compound which can be cured by irradiation of light used according to the environment when using a laminated film. Compound is preferred. As the curable compound, a radically polymerizable compound that is advantageous for low temperature fast curing is preferable.

A radically polymerizable compound is a compound which has a functional group superposing | polymerizing by a radical. As a radically polymerizable compound, a (meth) acrylate compound, a maleimide compound, a citraconimide compound, a nadimide compound is mentioned, for example. These are used individually by 1 type or in combination of 2 or more types. In addition, a radically polymerizable compound can be used in any state of a monomer or an oligomer, and can also mix and use a monomer and an oligomer.

As a (meth) acrylate compound, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, isobutyl (meth) acrylate, ethylene glycol di (meth) acrylate, for example, Diethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylene glycol tetra (meth) acrylate, 2-hydroxy-1,3-di (meth) acryloxypropane, 2,2 -Bis [4-((meth) acryloxymethoxy) phenyl] propane, 2,2-bis [4-((meth) acryloxyethoxy) phenyl] propane, dicyclopentenyl (meth) acrylate tricyclo Decanyl (meth) acrylate, tris ((meth) acryloxyethyl) isocyanurate, urethane (meth) acrylate, isocyanurate ethylene oxide modified di (meth) acrylate. These are used individually by 1 type or in combination of 2 or more types. By radical polymerization of the said (meth) acrylate compound, a (meth) acrylic resin is obtained.

A maleimide compound is a compound which has one or more maleimide groups in a molecule | numerator. As a maleimide compound, For example, phenyl maleimide, 1-methyl-2, 4-bis maleimide benzene, N, N'-m-phenylene bis maleimide, N, N'-p-phenylene bis maleimide , N, N'-4,4-biphenylenebismaleimide, N, N'-4,4- (3,3-dimethylbiphenylene) bismaleimide, N, N'-4,4- ( 3,3-dimethyldiphenylmethane) bismaleimide, N, N'-4,4- (3,3-diethyldiphenylmethane) bismaleimide, N, N'-4,4-diphenylmethanebis Maleimide, N, N'-4,4-diphenylpropanebismaleimide, N, N'-4,4-diphenyletherbismaleimide, N, N'-4,4-diphenylsulfonbismaleimide , 2,2-bis (4- (4-maleimidephenoxy) phenyl) propane, 2,2-bis (3-s-butyl-3,4- (4-maleimidephenoxy) phenyl) propane, 1 , 1-bis (4- (4-maleimidephenoxy) phenyl) decane, 4,4'-cyclohexylidene-bis (1- (4-maleimidephenoxy) phenoxy) -2-cyclohexylbenzene And 2,2-bis (4- (4-maleimidephenoxy) phenyl) hexafluoropropane. These are used individually by 1 type or in combination of 2 or more types.

A citraconimide compound is a compound which has one or more citraconimide groups in a molecule | numerator. As a citraconimide compound, a phenyl cytraconimide, 1-methyl-2, 4-biscitraconimide benzene, N, N'-m-phenylenebiscitraconimide, N, N ' -p-phenylenebiscitraconimide, N, N'-4,4-biphenylenebiscitraconimide, N, N'-4,4- (3,3-dimethylbiphenylene) bissheet Laconimide, N, N'-4,4- (3,3-dimethyldiphenylmethane) biscitraconimide, N, N'-4,4- (3,3-diethyldiphenylmethane) bis Citraconimide, N, N'-4,4-diphenylmethanebiscitraconimide, N, N'-4,4-diphenylpropanebiscitraconimide, N, N'-4,4- Diphenyletherbiscitraconimide, N, N'-4,4-diphenylsulfonbiscitraconimide, 2,2-bis (4- (4-citraconimidephenoxy) phenyl) propane, 2 , 2-bis (3-s-butyl-3,4- (4-citraconimidephenoxy) phenyl) propane, 1,1-bis (4- (4-citraconimidephenoxy) phenyl) decane , 4,4'-cyclohexylidene-bis (1- (4-citraconimidephenoxy) phenoxy) -2-cyclohexylbenne , 2,2-bis (4- (4-citraconimide phenoxy) phenyl) hexafluoropropane. These are used individually by 1 type or in combination of 2 or more types.

A nadimide compound is a compound which has one or more nadimide groups in a molecule | numerator. As a nadimide compound, a phenyl nimide, 1-methyl- 2, 4- bis nimide benzene, N, N'-m- phenylene bis nimide, N, N'-p- phenylene bis nimide, for example , N, N'-4,4-biphenylenebisnamidide, N, N'-4,4- (3,3-dimethylbiphenylene) bisnamidide, N, N'-4,4- ( 3,3-dimethyldiphenylmethane) bisnamidide, N, N'-4,4- (3,3-diethyldiphenylmethane) bisnamidimide, N, N'-4,4-diphenylmethanebis Nadimide, N, N'-4,4-diphenylpropanebisnamidide, N, N'-4,4-diphenyletherbisnamidimide, N, N'-4,4-diphenylsulfonbisnamidide , 2,2-bis (4- (4-namidimenophenoxy) phenyl) propane, 2,2-bis (3-s-butyl-3,4- (4-namidimidephenoxy) phenyl) propane, 1 , 1-bis (4- (4-nadimidephenoxy) phenyl) decane, 4,4'-cyclohexylidene-bis (1- (4-namidimidephenoxy) phenoxy) -2-cyclohexylbenzene And 2,2-bis (4- (4-nadimidephenoxy) phenyl) hexafluoropropane. These are used individually by 1 type or in combination of 2 or more types.

As a polymerization initiator, the compound which can start the polymerization reaction by the said polymeric compound is preferable, and when using a radically polymerizable compound as a polymeric compound, a radical polymerization initiator can be used as a polymerization initiator.

The radical polymerization initiator is not particularly limited as long as it is a compound that generates radicals by light irradiation and / or heating. As such a radical polymerization initiator, the compound which generate | occur | produces a radical by light irradiation of 150-750 nm and / or heating of 80-200 degreeC is preferable, and a peroxide, an azo compound, etc. are specifically preferable. These are selected in consideration of the target connection temperature, connection time, storage stability, and the like.

As a peroxide, organic peroxide is preferable at the point of high reactivity and storage stability. From the same point of view, among organic peroxides, organic peroxides having a temperature of 10 hours for a half life of 40 ° C. or more and 200 ° C. or less for a half life of 1 minute are preferable, and a temperature of 50 hours or more for a half life of 10 hours and a temperature of 1 minute for a half life of 180 degrees. Particular preference is given to organic peroxides which are at most C. In addition, when making connection time into 10 second or less, 0.1-20 mass% is preferable on the basis of solid content whole quantity of an adhesive composition, and, as for the compounding quantity of the radical polymerization initiator for obtaining sufficient reaction rate, 2-15 mass% is especially preferable. .

Specific examples of the organic peroxide include diacyl peroxide, peroxydicarbonate, peroxy ester, peroxy ketal, dialkyl peroxide, hydroperoxide and silyl peroxide. Among these, peroxyesters, dialkylperoxides, hydroperoxides and silylperoxides have a concentration of chlorine ions or organic acids in the initiator of 5000 ppm or less, less organic acids generated after thermal decomposition, such as circuit electrodes of circuit members, It is especially preferable because corrosion of a metal member can be suppressed more.

Examples of the diacyl peroxide include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide and stearoyl peroxane. Seed, succinic peroxide, benzoyl peroxy toluene, and benzoyl peroxide are mentioned.

As peroxy dicarbonate, di-n-propyl peroxy dicarbonate, diisopropyl peroxy dicarbonate, bis (4-t- butylcyclohexyl) peroxy dicarbonate, di-2-, for example Ethoxy methoxy peroxy dicarbonate, di (2-ethylhexyl peroxy) dicarbonate, dimethoxy butyl peroxy dicarbonate, di (3-methyl-3- methoxy butyl peroxy) dicarbonate Can be.

As peroxy ester, for example, cumyl peroxy neodecanoate, 1,1,3,3- tetramethylbutyl peroxy neodecanoate, 1-cyclohexyl-1-methylethyl peroxy neodecanoate, t-hexyl peroxy neodecanoate, t-butyl peroxy pivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di (2-ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2 Ethyl hexanonate, t-butylperoxy isobutylate, 1,1-bis (t-butylperoxy) cyclohexane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3, 5,5-trimethylhexanoate, t-butylperoxylaurate, 2,5-dimethyl-2,5-di (m-toluylperoxy) hexane, t-butylperoxyisopropyl monocarbonate, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexylper When there may be mentioned a benzoate, t- butyl peroxy acetate, n- butyl-4,4-bis (t- butylperoxy) valerate.

As peroxy ketal, for example, 1,1-bis (t-hexyl peroxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexyl peroxy) cyclohexane, 1,1- Bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane and 2,2-bis (t-butylperoxy) decane have.

As the dialkyl peroxide, for example, α, α'-bis (t-butylperoxy) diisopropylbenzene, dicumylperoxide, 2,5-dimethyl-2,5-di (t-butylperoxy) Hexane and t-butyl cumyl peroxide.

As hydroperoxide, diisopropyl benzene hydroperoxide and cumene hydroperoxide are mentioned, for example.

As a silyl peroxide, t-butyl trimethyl silyl peroxide, bis (t-butyl) dimethyl silyl peroxide, t-butyl tri vinyl silyl peroxide, bis (t-butyl) divinyl silyl peroxide, tris (t-butyl) ) Vinyl silyl peroxide, t-butyltriallyl silyl peroxide, bis (t-butyl) diallyl silyl peroxide, and tris (t-butyl) allyl silyl peroxide.

These radical polymerization initiators may be used individually by 1 type or in mixture of 2 or more types, and may be used in mixture of a decomposition promoter, an inhibitor, etc.

In addition, it is preferable to coat these radical polymerization initiators with a polyurethane-based, polyester-based high molecular material, and the like and microencapsulate them because their pot life is extended.

In addition, when an adhesive film is used for a circuit connection material, in order to suppress corrosion of the circuit electrode of a circuit member, it is preferable that the density | concentration of the chlorine ion and organic acid contained in a radical polymerization initiator is 5000 ppm or less. Moreover, the radical polymerization initiator with few organic acids generated after thermal decomposition is more preferable. Moreover, since stability after hardening of an adhesive film improves, it is preferable to have a mass retention rate of 20 mass% or more after opening to stand for 24 hours at room temperature (25 degreeC) and normal pressure.

Moreover, as needed, an adhesive composition may contain radical polymerization inhibitors, such as hydroquinone and methyl ether hydroquinone, in the range in which sclerosis | hardenability is not impaired.

An adhesive composition may also contain thermosetting resins other than a radically polymerizable compound as a polymeric compound. An epoxy resin is mentioned as such a thermosetting resin. Examples of the epoxy resins include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, bisphenol A novolac epoxy resins, and bisphenol F novolac epoxy resins. And alicyclic epoxy resins, glycidyl ester epoxy resins, glycidylamine epoxy resins, hydantoin epoxy resins, isocyanurate epoxy resins and aliphatic chain epoxy resins. These epoxy resins may be halogenated or hydrogenated. These epoxy resins are used individually by 1 type or in combination of 2 or more types.

Moreover, what is used as a hardening | curing agent of a normal epoxy resin can be used as a hardening | curing agent of the said epoxy resin. Specifically, an amine hardening | curing agent, a phenol type hardening | curing agent, an acid anhydride type hardening | curing agent, an imidazole series hardening | curing agent, dicyandiamide, etc. are mentioned. Moreover, the tertiary amines and organophosphorus compounds which are normally used as a hardening accelerator can also be used suitably.

Moreover, as a method of making an epoxy resin react, it can also carry out cation polymerization using a sulfonium salt, an iodonium salt, etc. other than using the said hardening | curing agent.

A film formation component is a component which makes the film formability of an adhesive film more favorable, and can also improve the adhesiveness and / or the stress relaxation property at the time of hardening. Examples of the film forming component include film-forming polymers. Examples of the film-forming polymer include polyvinyl butyral resin, polyvinyl formal resin, polyester resin, polyamide resin, polyimide resin, xylene resin, phenoxy resin, polyurethane resin, and urea resin. .

It is preferable that the weight average molecular weights of a film formation component are 10000-10 million. Moreover, what modified | denatured these polymers with the radically polymerizable functional group can also be used. Thereby, the heat resistance of an adhesive film improves.

It is preferable that it is 2-80 mass% with respect to the total amount of an adhesive composition, as for the compounding ratio of the film formation component of a film formation component, it is more preferable that it is 5-70 mass%, and it is especially preferable that it is 10-60 mass%. When the blending ratio of the film forming component is less than 2% by mass, the stress relaxation property and the adhesiveness tend to be lowered, and when it exceeds 80% by mass, the fluidity tends to be lowered.

It is preferable that the adhesive composition of this invention contains electroconductive particle. Thereby, when an adhesive film is used for connection of circuit electrodes etc., it becomes possible to have more excellent connection reliability, and to show anisotropic conductivity. Electroconductive particle will not be specifically limited if it has electroconductivity by which electrical connection is possible. As electroconductive particle, the metal particle containing alloys, such as Au, Ag, Ni, Cu, Co, and solder, and carbon are mentioned, for example. In addition, the conductive particles may be a multi-layer coating of particles which become nuclei such as non-conductive glass, ceramics, and plastics with a film containing a conductive material such as the metal or particles containing a conductive material such as the metal. have. It is preferable that the thickness of the film | membrane to coat is 10 nm or more in order to acquire more reliable electroconductivity.

When such a multilayer electroconductive particle or heat meltable metal particle is used as electroconductive particle, this electroconductive particle has a deformation | transformation which is deformed by heat pressurization. Therefore, when connecting between circuits using the adhesive composition containing such electroconductive particle, the contact area of a circuit and electroconductive particle increases and can absorb the fluctuation of the thickness between a some electrode, From a viewpoint of reliability improvement desirable.

Moreover, the microparticles | fine-particles which coat | covered the surface of electroconductive particle further with the resin film etc. can further suppress the short circuit resulting from the contact between microparticles | fine-particles. Therefore, since the insulation property between electrode circuits improves, it can also be mix | blended with an adhesive composition individually or in mixture with electroconductive particle suitably.

It is preferable that the content rate of the electroconductive particle in an adhesive composition is 0.1-30 volume%, It is more preferable that it is 0.1-20 volume%, It is especially preferable that it is 0.1-10 volume%. If the content ratio of the conductive particles is less than 0.1 parts by volume, the cured product of the adhesive composition tends to deteriorate in conductivity, and if it exceeds 30 parts by volume, the short circuit between the circuits to be insulated is used when the adhesive composition is used for the connection between circuits. This tends to be easy to occur. Moreover, it is preferable that the content rate of electroconductive particle is 0.5-30 mass parts with respect to 100 mass parts of thermoplastic resins from a same viewpoint.

In addition, the content rate of electroconductive particle is determined based on the volume of each component in the adhesive composition before hardening at 23 degreeC. The volume of each component can also be converted from a mass into a volume using specific gravity. In addition, an increased volume can be obtained as the volume by injecting the component into a container into which a suitable solvent (water, alcohol, etc.) for moistening the component is added, without dissolving or swelling the component in a measuring cylinder or the like. .

Moreover, the adhesive composition of this invention may contain a coupling agent for the purpose of further improving the adhesiveness of an adhesive film. As a coupling agent, alkoxysilanes, such as a trimethoxysilane methacrylate and (gamma)-glycidoxy propyl trimethoxysilane, are mentioned, for example.

In addition to the adhesive composition which concerns on this invention, a filler, a softener, an anti-aging agent, a coloring agent, a flame retardant, a coupling agent, etc. can also be added as needed in the range which can solve the subject of this invention.

The adhesive film which concerns on this invention is used suitably as an adhesive film for electronic materials.

A production method of the multilayer film according to a preferred embodiment of the present invention includes a first step of selecting a support is a residual adhesion rate of C ₅ in the surface of 80% or more and, on the surface of a support selected from the screening step, which contains an adhesive composition It has a 2nd process of forming an adhesive film. In the first step, the method for screening the support is a residual adhesion rate of not less than 80% C ₅ of the surface is, it is possible to use a selection method for the above-mentioned support.

As a method of forming the adhesive film containing an adhesive composition on a support body in a 2nd process, the following method is mentioned, for example. First, the solution obtained by adding a solvent etc. to the adhesive composition obtained by mixing each above-mentioned component as needed is apply | coated on a support body, and a coating film is formed. Subsequently, an adhesive film is obtained by making a coating film solid or semisolid through removal of a solvent, etc. Alternatively, after the adhesive composition is heated to ensure fluidity, a solvent may be added to obtain a solution, and the solution may be treated in the same manner as described above to form an adhesive film.

The laminated | multilayer film of this invention may be a laminated | multilayer film containing two layers of a support body and the adhesive film formed on the surface. Or the laminated | multilayer film formed by providing 2 or more layers of adhesive films with the same or different composition and / or a manufacturing method on the surface of a support body may be sufficient. In this case, a laminated film is obtained by forming an adhesive film further as mentioned above on the surface on the opposite side to the support body of the adhesive film formed on the surface of a support body as mentioned above. In addition, a laminated film is obtained by superimposing the adhesive films formed on the surface of each support body with a laminator etc., respectively.

Next, preferable embodiment is demonstrated about the manufacturing method of the connection structure of the circuit member using the laminated | multilayer film of this invention. 4 is a schematic cross-sectional view showing one embodiment of a connection structure of a circuit member obtained by this manufacturing method. As shown in FIG. 4, the connection structure of this circuit member is provided with the 1st circuit member 20 and the 2nd circuit member 30 which mutually oppose, and the 1st circuit member 20 and the 2nd circuit member Between the 30, the circuit connection member 10 which connects these is provided.

The first circuit member 20 includes a circuit board (first circuit board) 21 and a circuit electrode (first circuit electrode) 22 formed on the main surface 21a of the circuit board 21. . On the other hand, the second circuit member 30 includes a circuit board (second circuit board) 31 and a circuit electrode (second circuit electrode) 32 formed on the main surface 31a of the circuit board 31. Doing. In addition, as the circuit boards 21 and 31, organic substances, such as an inorganic substance, such as a semiconductor, glass, and a ceramic, a polyimide, polycarbonate, polyester, and a polyether sulfone, the material which combined these inorganic substances and organic substance (for example, For example, glass / polyepoxy resin) can be mentioned.

There is no restriction | limiting in particular as the 1st and 2nd circuit members 20 and 30 as long as the electrode which requires an electrical connection is formed. Specifically, a glass substrate or a plastic substrate, a printed wiring board, a ceramic wiring board, a flexible wiring board, on which electrodes are formed of ITO or the like used in a liquid crystal display, may be used, and these may be used in combination as necessary.

The circuit connection member 10 contains the insulating material 11 and the electroconductive particle 7. The electroconductive particle 7 is arrange | positioned not only between the opposing circuit electrode 22 and the circuit electrode 32, but also between the main surfaces 21a and 31a. In the connection structure of a circuit member, the circuit electrodes 22 and 32 are electrically connected through the electroconductive particle 7. In other words, the conductive particles 7 are in direct contact with both the circuit electrodes 22 and 32.

Here, the electroconductive particle 7 is corresponded to the electroconductive particle which may be contained in the adhesive composition mentioned above.

In the connection structure of this circuit member, the opposing circuit electrode 22 and the circuit electrode 32 are electrically connected through the electroconductive particle 7 as mentioned above. For this reason, the connection resistance between the circuit electrodes 22 and 32 is reduced sufficiently. Therefore, the flow of the electric current between the circuit electrodes 22 and 32 can be made smooth, and the function which a circuit has can fully be exhibited. In addition, when the circuit connection member 10 does not contain the electroconductive particle 7, the circuit electrode 22 and the circuit electrode 32 directly contact, and are electrically connected.

The circuit connection member 10 is comprised by the hardened | cured material of the said adhesive film as mentioned later. Therefore, the connection reliability of the circuit connection member 10 with respect to the circuit member 20 or 30 becomes high enough.

In the manufacturing method of the circuit member connection structure which concerns on this invention, the 1st circuit member 20 mentioned above and the film-form circuit connection material 40 are prepared first (refer FIG. 5 (a)). The film-form circuit connection material 40 is the adhesive film mentioned above, and in the stage prepared, it is formed on the surface of the support body 1 which concerns on this invention, and comprises the laminated | multilayer film 100. As shown in FIG. In addition, the film-form circuit connection material 40 here contains the electroconductive particle 7. The film-form circuit connection material 40 is normally taken out from the state wound by the core, and cut | disconnected to the required length.

Next, the film-form circuit connection material 40 is put on the surface in which the circuit electrode 22 of the 1st circuit member 20 is formed. At this time, since the film-form circuit connection material 40 is provided on the support body 1, the 1st circuit member 20 is made so that the film-form circuit connection material 40 side may face the 1st circuit member 20. FIG. Put on If a circuit connection material is a film form, the film-form circuit connection material 40 can be easily interposed between the 1st circuit member 20 and the 2nd circuit member 30, and the 1st circuit member 20 and the 2nd The connection work of the circuit member 30 can be performed easily.

Moreover, it pressurizes in the arrow A and B direction of FIG. 5 (a), and temporarily fixes (temporary connection) the film-form circuit connection material 40 to the 1st circuit member 20. FIG. At this time, it may pressurize while heating. However, heating temperature shall be temperature which does not harden the adhesive composition in the film-form circuit connection material 40. FIG.

Next, the support body 1 is peeled from the film-form circuit connection material 40 (refer FIG. 5 (b)). At this time, since the support body 1 is a support body concerning this invention, the support body 1 and the film-form circuit connection material 40, such as transfer of the peeling processing agent from the support body 1 to the film-form circuit connection material 40, The deterioration factor of the connection reliability resulting from being laminated can be fully suppressed.

Subsequently, actinic light is irradiated to the film-form circuit connection material 40. Subsequently, as shown in FIG. 5C, the second circuit member 30 is placed on the film-form circuit connection material 40 with the second circuit electrode facing the first circuit member 20.

Moreover, while heating the film-form circuit connection material 40, it presses through the 1st and 2nd circuit members 20 and 30 in the arrow A and B direction of FIG.5 (c). The heating temperature at this time is made into the temperature which the adhesive composition of this invention can harden. In this way, the film-form circuit connection material 40 is hardened | cured and this connection is performed and the connection structure of the circuit member as shown in FIG. 4 is obtained. In addition, the conditions of a connection are suitably selected according to the use, adhesive composition, and circuit member to be used.

For example, it is preferable that heating temperature is 90-250 degreeC, pressure is 0.1-10 MPa with respect to a to-be-adhered body, and the time (connection time) required for heating and pressurization is 1 second-10 minutes.

In addition, the apparatus for heating and pressurizing is not particularly limited, but considering productivity and convenience, it is preferable that the apparatus is a pressurized heating apparatus having a pressurized head with a built-in heater.

When the connection structure of a circuit member is manufactured as mentioned above, since the connection reliability improves in the connection structure of the circuit member obtained, the yield of the connection structure of a circuit member becomes high enough.

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to this. For example, the production method of the multilayer film according to another embodiment of the invention, the step of forming the support is a residual adhesion rate of C ₅ of the surface is at least 80% and, containing an adhesive composition on the surface of the support It has a process of forming an adhesive film. In the step of forming the support, the support can be formed by a composition and a manufacturing method substantially the same as the support having a residual adhesion rate C ₅ of the surface selected according to the above-described screening method for the support.

Moreover, in the manufacturing method of the connection structure of a circuit member, after hardening process by heating and pressurization, hardening process using light, an ultrasonic wave, and / or an electromagnetic wave can also be performed.

Moreover, in another embodiment of this invention, an adhesive film may be used as a material of the semiconductor connection member which connects a semiconductor element and a circuit pattern in a semiconductor device.

6 is a schematic cross-sectional view showing one embodiment of this semiconductor device. As shown in FIG. 6, the semiconductor device 80 of this embodiment is provided with the semiconductor element 50 and the board | substrate 60 used as a support member of a semiconductor, and the semiconductor element 50 and the board | substrate 60 are shown. The semiconductor element connection member 40 which electrically connects these is provided in between. In addition, the semiconductor element connection member 40 is laminated | stacked on the main surface 60a of the board | substrate 60, and the semiconductor element 50 is further laminated | stacked on the semiconductor element connection member 40. FIG.

The substrate 60 has a circuit pattern 61, which is electrically connected to the semiconductor element 50 via the semiconductor connecting member 40 or directly on the main surface 60a of the substrate 60. Is connected. Moreover, these are sealed by the sealing material 70, and the semiconductor device 80 is formed.

Although it does not restrict | limit especially as a material of the semiconductor element 50, II-VI compound semiconductor elements, such as group IV-V semiconductor elements, such as silicon and germanium, GaAs, InP, GaP, InGaAs, HgTe, HgCdTe, CdMnTe, etc. Various things, such as a group compound semiconductor element and CuInSe (CIS), can be used.

The semiconductor element connection member 40 contains the insulating material 11 and the electroconductive particle 7, and is a hardened | cured material of the adhesive film of this invention. The electroconductive particle 7 is arrange | positioned not only between the semiconductor element 50 and the circuit pattern 61, but also between the semiconductor element 50 and the main surface 60a. In the semiconductor device 80 of this embodiment, the semiconductor element 50 and the circuit pattern 61 are electrically connected through the electroconductive particle 7. For this reason, the connection resistance between the semiconductor element 50 and the circuit pattern 61 is fully reduced. Therefore, the flow of the electric current between the semiconductor element 50 and the circuit pattern 61 can be made smooth, and the function which a semiconductor has can fully be exhibited. Moreover, it is also possible to show the anisotropy of electrical connection by making this electroconductive particle 7 into the compounding ratio mentioned above.

Since the semiconductor element connection member 40 is comprised by the hardened | cured material of the adhesive film which concerns on this invention, the connection reliability between the semiconductor element 50 and the circuit pattern 61 improves, and the semiconductor device 80 of the semiconductor device 80 Yield is also high enough.

Hereinafter, although an Example demonstrates this invention still in detail, this invention is not limited to these Examples.

[Preparation of Support]

As the base film, a polyethylene terephthalate (hereinafter referred to as "PET") film was prepared. Separately, aminoalkyd resin (manufactured by Hitachi Kasei Polymer Co., Ltd., trade name "TA31-209") and an acid catalyst (manufactured by Hitachi Kasei Polymer Co., Ltd., trade name "dryer 900") at a ratio of 100: 1 to 100: 5 mass ratio of solids It mixed and diluted with the solvent and obtained the solution. The obtained solution was coated on one side of the PET film and the solvent was volatilized to prepare substrates for the supports of # 1 to # 6. Furthermore, Dayjin Co., Ltd. make, brand name "AH3" as the base material for support body # 8, Dayjin Co. make and brand name "UH2" were prepared as base material # 8 for support bodies.

The thickness of the substrates # 1 to 8 for the support was measured. In addition, the residual adhesion rate C ₅ on the surfaces of the substrates # 1 to 8 for the support was measured as described above. The results are shown in Table 1.

(Example 1)

First, 40 g of fluorene-biphenyl type phenoxy resin which is a film formation component by the weight of solid content, 10 g of bisphenol-A phenoxy resins, and 10 g of tris (acryloxyethyl) isocyanurate which are polymeric compounds similarly 10 g of urethane acrylate, 10 g of trimethoxysilane methacrylate as a coupling agent, and 3 g of n-butyl-4,4-bis (t-butylperoxy) valerate as a polymerization initiator were blended. 40 g of compound electroconductive particles were further disperse | distributed here and the 1st adhesive composition was obtained. The electroconductive particle formed the nickel layer of thickness 0.2micrometer, and the gold layer of thickness 0.04micrometer in this order on the surface of the particle | grains which make polystyrene the nucleus, and formed the layer containing polyvinyl alcohol on the surface further. The average particle diameter of this electroconductive particle was 4 micrometers.

Next, the said 1st adhesive composition was apply | coated using the coating apparatus on the surface of the base material # 1 for support bodies, and the coating film was obtained. This coating film was dried by hot air for 5 minutes at 70 degreeC, and the 1st intermediate | middle laminated body whose thickness of an adhesive film is 25 micrometers was obtained.

Subsequently, 40 g of fluorene-biphenyl type phenoxy resin which is a film formation component by the weight of solid content, 10 g of bisphenol-A phenoxy resins, and 10 g of tris (acryloxyethyl) isocyanurate which are polymeric compounds similarly 10 g of urethane acrylates, 10 g of trimethoxysilane methacrylate as a coupling agent, and 3 g of n-butyl-4,4-bis (t-butylperoxy) valerate as a polymerization initiator are blended to form a second adhesive composition. Got.

Next, the said 2nd adhesive composition was apply | coated using the coating apparatus on the surface of the base material # 2 for support bodies, and the coating film was obtained. This coating film was dried by hot air for 5 minutes at 70 degreeC, and the 2nd intermediate | middle laminated body whose thickness of an adhesive film is 25 micrometers was obtained.

The first intermediate laminate and the second intermediate laminate superimpose the adhesive films on each other, and sandwich the adhesive films on the respective substrates for the support, and use a laminator at 40 ° C., 0.5 mm / min, and no pressure. It bonded together and obtained the laminated | multilayer film.

(Example 2)

A laminated film was obtained in the same manner as in Example 1 except that the support substrate # 3 was used instead of the support substrate # 1, and the support substrate # 4 was used instead of the support substrate # 2.

(Example 3)

A laminated film was obtained in the same manner as in Example 1 except that the support substrate # 5 was used instead of the support substrate # 1, and the support substrate # 6 was used instead of the support substrate # 2.

(Example 4)

First, 10 g of fluorene-biphenyl type phenoxy resin which is a film formation component by weight of solid content, 30 g of bisphenol-A phenoxy resins, 20 g of phenol novolak-type epoxy resins which are polymeric compounds, and gamma- which are coupling agents 5 g of glycidoxy propyl trimethoxysilane and 40 g of imidazole series hardening | curing agents which are hardening | curing agents were mix | blended. Here, 40g compound-dispersion of electroconductive particle was carried out similarly to using in Example 1, and the 1st adhesive composition was obtained.

Next, the said 1st adhesive composition was apply | coated using the coating apparatus on the surface of the base material # 1 for support bodies, and the coating film was obtained. This coating film was dried by hot air for 5 minutes at 70 degreeC, and the 1st intermediate | middle laminated body whose thickness of an adhesive film is 12 micrometers was obtained.

Subsequently, 10 g of fluorene-biphenyl type phenoxy resin which is a film formation component, 30 g of bisphenol-A phenoxy resins, 20 g of phenol novolak-type epoxy resins which are polymeric compounds, and the coupling agent (gamma)- 5 g of glycidoxy propyl trimethoxysilane and 40 g of imidazole series hardening | curing agents which are hardening | curing agents were mix | blended and the 2nd adhesive composition was obtained.

Next, the said 2nd adhesive composition was apply | coated using the coating apparatus on the surface of the base material # 2 for support bodies, and the coating film was obtained. This coating film was dried by hot air for 5 minutes at 70 degreeC, and the 2nd intermediate | middle laminated body whose thickness of an adhesive film is 13 micrometers was obtained.

The first intermediate laminate and the second intermediate laminate superimpose the adhesive films on each other, and sandwich the adhesive films on the respective substrates for the support, and use a laminator at 40 ° C., 0.5 mm / min, and no pressure. It bonded together and obtained the laminated | multilayer film.

(Comparative Example 1)

A laminated film was obtained in the same manner as in Example 1 except that the support substrate # 7 was used instead of the support substrate # 1, and the support substrate # 8 was used instead of the support substrate # 2.

(Comparative Example 2)

A laminated film was obtained in the same manner as in Example 4 except for using the support substrate # 7 instead of the support substrate # 1 and using the support substrate # 8 instead of the support substrate # 2.

[Production of Sample for Measurement of Connection Resistance]

A circuit (line width 50 μm, pitch 100 μm, thickness 250 nm (2500 μm)) containing indium tin oxide (hereinafter referred to as “ITO”) as the circuit electrode is a glass substrate (manufactured by Corning Corporation, trade name “# 1737”). ", 28 mm x 32 mm x 0.7 mm) were prepared. The laminated film produced in Example 1 was cut into 2.5 mm x 20 mm. Subsequently, the base material for a support body in this laminated film The laminated film was bonded so that # 2 was peeled off and the exposed adhesive film faced each other with the main surface of the said circuit formation side of the above-mentioned circuit member. (Per adhesion area), it was set as 3 second.

Subsequently, an IC chip having a gold bump electrode having a chip size of 1.7 mm x 17 mm x 0.55 mm, a bump area of 50 m x 50 m, a bump height of 15 m and a bump number of 358 was arranged. Subsequently, the base material # 1 for the support of the laminated | multilayer film bonded to the said circuit member was peeled. Subsequently, the adhesive film exposed by peeling of the base material # 1 for support bodies, and the gold bump electrode side of an IC chip oppose, and arrange | positioning so that the electrodes of an IC chip and the said circuit member may be connected, and a circuit with a laminated film The member and the IC chip were superimposed. Moreover, using the pressurization heating apparatus provided with a pressurization heating head, these were crimped | bonded by the heat press from the IC chip side, and the sample for connection resistance measurement which concerns on Example 1 was obtained. The conditions of heat pressurization were made into connection temperature 200 degreeC, pressurization pressure 80MPa (per total area of bump), and 3 seconds.

Moreover, using the laminated | multilayer film of Examples 2-4 and Comparative Examples 1 and 2, respectively, the sample for connection resistance measurement which concerns on Examples 2-4 and Comparative Examples 1 and 2 was obtained as above-mentioned, respectively.

[Measurement of connection resistance]

About the obtained connection resistance measurement sample, the electric resistance value (connection resistance) between the electrode circuit in a circuit member and the bump electrode in an IC chip was measured using the digital multimeter by the 4-terminal measuring method. The measurement current was 1 mA. The measurement was performed immediately after the sample preparation for connection resistance measurement (initial stage) and after exposing this sample to thermal cycling conditions (after a cycle). In addition, the heat cycle used the cold heat shock test apparatus (brand name "TSA-41L-A") by the ESPEC company. In addition, the heat cycle conditions were made into the conditions which hold 1000 minutes of holding | maintenance for 15 minutes at -40 degreeC, and holding | maintenance for 15 minutes at 100 degreeC. The results are shown in Table 2.

According to this invention, the laminated | multilayer film which laminates an adhesive film on the surface of a support body can provide the laminated | multilayer film with sufficient connection reliability.

Claims (6)

As the laminated film made of the adhesive film is formed which contains an adhesive composition on a support surface, the support is a residual adhesion rate of 80% or more C ₅ laminated film of the surface. The laminated film of Claim 1 in which the said adhesive composition contains electroconductive particle. As a screening method of the support for laminated films which selects the said support body of the laminated | multilayer film by which the adhesive film containing an adhesive composition is formed on the surface of a support body, To the residual adhesion rate of C ₅ of the screening surface of the support is 80% or more. Selecting a support having a residual adhesion rate C ₅ of the surface of 80% or more; The manufacturing method of the laminated | multilayer film which has a process of forming the adhesive film containing an adhesive composition on the said surface of the said support body sorted by the said sorting process. Forming a support such that the residual adhesion rate C ₅ on the surface thereof is 80% or more; The manufacturing method of the laminated | multilayer film which has a process of forming the adhesive film containing an adhesive composition on the said surface of the said support body. The peeling strength of the adhesive tape which is a standard sample, and a predetermined metal plate is measured, and it peels after sticking the adhesive tape to the support body for laminated films which is a measurement object, and making it the reference peeling strength A, and between said predetermined metal plate. Repeating the procedure for measuring the peel strength of 5 times, the step of setting the _fifth peel strength to B ₅ and the step of deriving the residual adhesion rate C ₅ represented by the following formula (1) from the peel strengths A and B _5: Evaluation method of the support for laminated films which have. <Equation 1> C ₅ = B ₅ / A × 100

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