WO2006134880A1 - Film multicouche, son procédé de production, procédé de sélection du corps de support pour le film multicouche, et procédé d’évaluation du corps de support pour le film multicouche - Google Patents

Film multicouche, son procédé de production, procédé de sélection du corps de support pour le film multicouche, et procédé d’évaluation du corps de support pour le film multicouche Download PDF

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Publication number
WO2006134880A1
WO2006134880A1 PCT/JP2006/311766 JP2006311766W WO2006134880A1 WO 2006134880 A1 WO2006134880 A1 WO 2006134880A1 JP 2006311766 W JP2006311766 W JP 2006311766W WO 2006134880 A1 WO2006134880 A1 WO 2006134880A1
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WO
WIPO (PCT)
Prior art keywords
support
film
circuit
adhesive
laminated film
Prior art date
Application number
PCT/JP2006/311766
Other languages
English (en)
Japanese (ja)
Inventor
Gentaro Seki
Kazuya Satou
Xiaoli Du
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2007521280A priority Critical patent/JPWO2006134880A1/ja
Publication of WO2006134880A1 publication Critical patent/WO2006134880A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]

Definitions

  • Laminated film and production method thereof method for selecting laminated film support, and evaluation method for laminated film support
  • the present invention relates to a laminated film and a method for producing the same, a method for selecting a laminated film support, and a method for evaluating a laminated film support.
  • connection between a liquid crystal display and TCP Tape Carrier Package
  • connection between an FPC (Flexible Printed Circuit) and TCP or connection between an FPC and a printed wiring board
  • conductive particles are dispersed in an adhesive.
  • An anisotropic conductive adhesive is used. This is intended to make the circuit connection more reliable.
  • flip chip mounting is performed in which the semiconductor silicon chip is directly mounted on the substrate face down instead of the conventional wire bond. Even in this case, the application of anisotropic conductive adhesive has started! Speak.
  • the adhesive film before use usually comprises a support on at least one side of the main surface to constitute a laminated film.
  • the support is coated with a release treatment agent so that the adhesive film provided on the surface can be easily removed.
  • this release treatment agent makes it easy to peel off the adherend from the support, a part of the release treatment agent component and the low molecular weight component contained in the release treatment agent component are intentionally transferred to the adherend side. It is designed to be Thereby, the light peeling of the adherend from the support is realized, but due to this, a part of the peeling treatment agent is transferred to the surface of the adhesive film.
  • a release treatment agent made of silicone resin is widely known.
  • the release treatment agent moves particularly easily to the adhesive film side (see, for example, Patent Documents 1 and 2). Therefore, as described in Patent Document 3, it is conceivable to adopt a support (release film) that does not contain silicone resin.
  • Patent Document 1 JP 2001-123130 A
  • Patent Document 2 Japanese Patent Laid-Open No. 2002-331614
  • Patent Document 3 Japanese Patent Laid-Open No. 2001-171033
  • Light release is realized by transferring a part of the release treatment component and a low molecular weight component contained in the release treatment component. Therefore, even when using such a support
  • the present invention is a laminated film obtained by laminating an adhesive film on the surface of a support, the laminated film having sufficient connection reliability, and a method for producing the same, and a laminated film support It is an object of the present invention to provide a body sorting method and a method for evaluating a laminated film support.
  • the present invention provides a laminated film in which an adhesive film containing an adhesive composition is formed on the surface of a support, and the support is formed on the surface thereof.
  • a laminated film having a residual adhesion ratio C of 80% or more is provided.
  • residual adhesion rate C on the surface of the support is a numerical value derived as follows.
  • peel strength A and above the peel strength between an adhesive tape (31B tape), which is a standard sample, and a predetermined metal plate is measured, and this is used as the reference peel strength A.
  • the adhesive tape is affixed to the substrate to be measured and peeled off, and the procedure for measuring the peel strength with a predetermined metal plate is repeated 5 times. Peel strength A and above
  • Patent Document 2 also describes the term “residual adhesion rate”.
  • the “residual adhesion rate” described in Patent Document 2 can be measured using the residual adhesion rate C defined in the present invention.
  • Patent Document 2 also differs from the present invention in that the peel strength to be measured is the first time. This has an important meaning as will be described later. This will be described in more detail with reference to FIGS.
  • a support 8 constituting a laminated film, a 25 mm wide acrylic foam double-sided adhesive tape 4, a glass plate 3, a 10 mm wide 31B tape 2 (manufactured by Nitto Denko), and a stainless steel (SUS) Prepare board 1.
  • the surface of the glass plate 3 is washed using various solvents such as toluene, acetone, methanol, etc., and organic components and inorganic components adhering to the surface are removed.
  • an acrylic foam double-sided adhesive tape 4 cut out to a length of 60 mm is attached to the surface of the glass plate 3 after washing using a rubber roll having a mass of 2 kg.
  • the release substrate of the acrylic foam double-sided adhesive tape 4 is peeled to expose the adhesive surface. Further, a support 8 cut out in a rectangular film shape of 20 mm ⁇ 55 mm is arranged on the center portion of the adhesive surface of the acrylic foam double-sided adhesive tape 4 so that the entire main surface of one side is placed.
  • 31B tape 2 newly cut to a length of 70 mm was attached to the surface of the support 8 using a rubber roll with a mass of 2 kg so that no scissors would enter, and FIG. It is configured as shown in the schematic front view of (a) and the schematic plan view of FIG.
  • the 31B tape 2 affixed to the surface of the support 8 is peeled 180 ° by a tensile tester at a pulling speed of 50 mmZmin as shown in the schematic front view of FIG. 1 (b). In this way, the 31B tape 6 is obtained.
  • the 31B tape 2 to be affixed to the surface of the support 8 is newly cut each time.
  • 31B tape 2 and stainless steel plate 1 are prepared. Furthermore, the surface of the stainless steel plate 1 is cleaned using various solvents such as toluene, acetone, methanol, etc., and organic components and inorganic components adhering to the surface are removed. Next, 31B tape 2 cut out to a length of 70 mm was affixed to the surface of the washed stainless steel plate 1 using a rubber roll with a mass of 2 kg so that no scissors could enter. It is configured as shown in the schematic front view.
  • the residual adhesion rate C is a numerical value obtained after repeating the operation [3] five times.
  • the peel strength may be measured by performing the operations [5] and [6] each time the operation [3] is performed once. In this case, if the peel strength obtained by the operation of [6] is B after the operation of [3] is repeated n times, the corresponding residual adhesion rate C is expressed by the following formula (2).
  • a support having a residual adhesion ratio C of 80% or more as defined in the present invention is a transfer of a release treatment agent.
  • connection reliability of the adhesive film can be sufficiently enhanced because the transfer of foreign matter to the adhesive film is suppressed.
  • the adhesive composition according to the present invention preferably contains conductive particles.
  • the circuit members can be more stably electrically connected while maintaining the insulation state between the circuit electrodes on the same substrate.
  • the present invention is a method for selecting a support for a laminated film, in which the support is selected from a laminate film in which an adhesive film containing an adhesive composition is formed on the surface of the support.
  • the support force is also peeled off to connect the circuit electrodes.
  • the adhesive film sandwiched between the electrodes can sufficiently maintain the connection reliability between the circuit electrodes.
  • the present invention includes a step of selecting a support having a surface residual adhesion ratio C of 80% or more, and a selection process.
  • the present invention also includes a step of forming a support so that the residual adhesion ratio C of the surface is 80% or more, and the support
  • the present invention measures the peel strength between an adhesive tape, which is a standard sample, and a predetermined metal plate.
  • a method for evaluating a support is provided.
  • a laminated film obtained by laminating an adhesive film on the surface of a support, wherein the adhesive film has sufficient connection reliability.
  • FIG. 1 is a process front view for explaining peel strength B.
  • FIG. 2 is a schematic plan view for explaining peel strength B.
  • FIG. 3 is a process front view for explaining peel strength A.
  • FIG. 4 is a schematic sectional view showing an embodiment of a circuit member connection structure according to the present invention.
  • FIG. 5 is a series of process diagrams for connecting circuit members according to the present invention.
  • FIG. 6 is a schematic cross-sectional view showing an embodiment of a semiconductor device according to the present invention.
  • (meth) acrylic acid means “acrylic acid” and its corresponding “methacrylic acid”
  • (meth) acrylate means “atallylate” and its corresponding “
  • Methodacrylate means “(meth) atalyloxy group” means “atallyloxy group” and the corresponding “methacryloxy group”.
  • a laminated film according to a preferred embodiment of the present invention is a laminated film in which an adhesive film containing an adhesive composition is formed on the surface of a support, and the support is a surface.
  • the residual adhesion C force is 3 ⁇ 40% or more.
  • the support is not particularly limited as long as the residual adhesion C on the surface thereof is 80% or more.
  • the support include, for example, a polyethylene terephthalate film, a polyethylene naphthalate film, a polyethylene isophthalate film, a polybutylene terephthalate film, a polyolefin-based film, a polyacetate film, a polycarbonate film, and a polyphenylene sulfide film.
  • a polyethylene terephthalate film a polyethylene naphthalate film
  • a polyethylene isophthalate film a polybutylene terephthalate film
  • a polyolefin-based film a polyacetate film, a polycarbonate film, and a polyphenylene sulfide film.
  • the film surface may be subjected to corona discharge treatment, anchor coating treatment, antistatic treatment or the
  • the support has a residual adhesion C of 80% or more and at the same time is formed on the surface thereof.
  • the surface of the adhesive film may be coated with a release treatment so that the adhesive film can be easily removed.
  • the release treatment agent include silicone resin, copolymer of silicone and organic resin, alkyd resin, amino alkyd resin, resin having a long-chain alkyl group, and resin having a fluoroalkyl group. Fat and shellac rosin are listed. Among these, from the viewpoint of more effectively preventing the release treatment agent from transferring from the support to the adhesive film, release treatment agents other than the release treatment agent mainly composed of silicone resin are preferred.
  • the thickness of the support is not particularly limited. However, storage and use of laminated film Considering the convenience of time, the thickness of the support is preferably 4 to 200 / ⁇ ⁇ . Furthermore, considering the material cost and productivity of the laminated film, the thickness of the support is more preferably 15 to 75 m.
  • the support is preferably evaluated by the above-described method for evaluating a laminated film support according to the present invention and selected by the method for selecting a laminated film support according to the present invention.
  • the method of selecting a support for example, multiple types of supports with different materials and manufacturing methods are prepared, and only those whose surface residual adhesion ratio C is 80% or more are prepared.
  • connection reliability of the adhesive film is improved, and the circuit connection structure formed using the adhesive film and the yield of the semiconductor device are sufficiently increased.
  • the support surface has a low content.
  • Examples include a method in which a low molecular weight component is not present as much as possible, a high molecular weight component is preferentially present, and control is performed so that a part of the molecule of the releasable treatment agent component does not easily fall off.
  • Examples of the high molecular weight component include amino alkyd resin.
  • the adhesive film may be, for example, one obtained by forming an adhesive composition into a film.
  • the adhesive composition preferably cures a polymerizable compound such as a polymerizable resin component for maintaining a connection state between electronic materials such as circuit electrodes, and the polymerizable compound.
  • U which preferably includes a polymerization initiator that is a curing agent for the purpose, and a film-forming component for imparting film-forming properties to the adhesive composition.
  • the polymerizable compound is a thermosetting compound that can be cured in a temperature range that is set according to the environment when the laminated film is used, or a light irradiation that is used depending on the environment when the laminated film is used. It may be a curable compound such as a photocurable compound that can be cured by the above method. As the curable compound, a radical polymerizable compound that is advantageous for low-temperature rapid curing is preferable.
  • the radical polymerizable compound is a compound having a functional group that is polymerized by radicals.
  • the radically polymerizable compound examples include (meth) atalytoi compound, maleimide compound, citraconimid compound, and nadiimide compound. These are one kind alone or Used in combination of two or more.
  • the radical polymerizable compound can be used in either a monomer or oligomer state, and the monomer and oligomer may be mixed and used.
  • Examples of (meth) ataretoy compounds include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, isobutyl (meth) acrylate, and heterangel recall (meth).
  • Atalylate diethylene glycol di (meth) acrylate, trimethylol propane tri (meth) acrylate, tetramethylene glycol tetra (meth) acrylate, 2 —hydroxy mono 1,3 di (meth) talyloxy propane, 2, 2 bis [4 — (((Meth) Ataryloxymethoxy) phenol] propane, 2, 2 bis [4— (((Meth) Atalyloxyethoxy) phenol] propane, dicyclopentayl (meth) acrylate tricyclodehydryl ( (Meta) Atalylate, Tris ((Meth) Atari Mouth Kichetil) Isocyanurate, Urethane (Meta ) Atarylate, isocyanuric acid ethylene oxide-modified di (meth) acrylate. These may be used alone or in combination of two or more.
  • a (meth) acrylic resin can be obtained by radical polymerization of the above (meth) attale toy compound.
  • a maleimide compound is a compound having at least one maleimide group in the molecule.
  • maleimide compounds include: phenol maleimide, 1-methyl-2,4 bismaleimide benzene, N, N, 1m-phenol bismaleimide, N, N, 1p phenolene bismaleimide, N, N, -4 , 4-bi-bilenene bismaleimide, N, N, —4, 4— (3, 3-dimethylbiphenylene) bismaleimide, N, N, 1, 4, 4- (3, 3-dimethyldiphenylmethane) bis Maleimide, N, N, 1,4,4- (3,3-Jetyldiphenylmethane) bismaleimide, N, N, —4,4-diphenylmethane bismaleimide, N, N, 1,4,4-diphenylpropane Bismaleimide, N, N, 1,4,4-diphenyl ether bismaleimide, N, N, 1,4,4-diphenyl ether
  • a citraconimide compound is a compound having at least one citraconimide group in the molecule.
  • Citraconimide compounds include, for example, phenol citraconimide, 1-methyl-2,4 biscitraconimide benzene, N, N, 1 m-phenylene biscitraconimide, N, N, 1p -Lenbiscitraconimide, N, N, 1,4,4-biphenylene biscitraconimide, N, N, 4,4— (3,3-dimethylbiphenyl) biscitraconimide, N, N, —4,4 — (3,3-Dimethyldiphenylmethane) biscitraconimide, N, N, 4,4— (3,3-Detyldiphenylmethane) biscitraconeimide, N, ⁇ '— 4, 4-Diphenylmethane biscitracon Imido,
  • a nadiimide compound is a compound having at least one nadiimide group in the molecule.
  • Nadiimide compounds include, for example, ferronadiimide, 1-methyl 2,4 bisnadiimidebenzene, ⁇ , N, 1m-phenolene bisnadiimide, N, N, 1p phenylenediamine imide, N, N , —4, 4-Bi-phenylene bisnadiimide, N, N, —4, 4— (3, 3-dimethylbiphenylene) bisnadiimide, N, N, 1, 4, 4— (3, 3-dimethyldiphenylmethane) ) Bisnadiimide, N, N, —4, 4— (3, 3—Jetyldiphenylmethane) Bisnadiimide, N, N, 1,4,4-Diphenylmethane bisnadiimide, N, N, 1,4,4—Diphen
  • the polymerization initiator is a compound that can initiate a polymerization reaction with the polymerizable compound.
  • radical polymerization is used as the polymerization initiator. Use an initiator.
  • the radical polymerization initiator is not particularly limited as long as it is a compound that generates radicals by light irradiation and Z or heating.
  • Preferred radical polymerization initiators are compounds that generate radicals upon irradiation with light at 150 to 750 nm and heating at Z or 80 to 200 ° C. Specifically, peroxides, azo compounds, etc. Is preferred. These are selected in consideration of the target connection temperature, connection time, storage stability, etc.
  • the peroxide is preferably an organic peroxide from the viewpoint of high reactivity and storage stability. From the same viewpoint, among organic peroxides, organic peroxides having a half-life of 10 hours at a temperature of 40 ° C or higher and a half-life of 1 minute at a temperature of 200 ° C or lower are preferred. Particularly preferred are organic peroxides having a half-life of 10 hours at a temperature of 50 ° C or higher and a half-life of 1 minute at a temperature of 180 ° C or lower.
  • the connection time is 10 seconds or less, the amount of the radical polymerization initiator for obtaining a sufficient reaction rate is 0.1 to 20% by mass based on the total solid content of the adhesive composition. The preferred range is 2 to 15% by mass.
  • organic peroxides include disilver oxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, nanomouth peroxide, and silyl peroxide. It is done.
  • peroxide esters, dialkyl peroxides, hydride peroxides, and silyl peroxides have a concentration of chlorine ions and organic acids in the initiator of 5000 ppm or less, and produce less organic acids after thermal decomposition. This is especially preferred because it can further reduce the corrosion of metal parts such as circuit electrodes.
  • disilver oxide examples include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3, 5, 5-trimethylhexanoyl peroxide, octane peroxide, lauroyl peroxide, stearoyl peroxide.
  • Oxides, succinic peroxides, benzoylperoxytoluene, benzoyl peroxide Can be mentioned.
  • peroxydicarbonate examples include di-n-propinoliver oxydicarbonate, diisopropyl peroxydicarbonate, bis (4-tert-butylcyclohexyl) peroxydicarbonate, and di-2-ethoxy. Examples include methoxy baroxy dicarbonate, di (2-ethylhexyloxy) dicarbonate, dimethoxybutyl dioxygen dicarbonate, and di (3-methyl-3-methoxybutyl dioxy) dicarbonate.
  • Examples of peroxyesters include Tamil peroxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexylene 1-methylethylperpero Xinoedecanoate, t-hexoxyloxyneodecanoate, t-butylperoxybivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2 , 5 Di (2-ethylhexylperoxy) hexane, 1-cyclohexylene 1-methylethylperoxy-2-ethylhexanate, t-hexyloxy-2-ethylhexanoate, t-butylperoxy-2-ethyl Xanonate, t-butylperoxyisobutyrate, 1,1 bis (t-butylperoxy) cyclohexane,
  • peroxyketals for example, 1, 1 bis (t-hexyloxy) 3, 3, 5 trimethylcyclohexane, 1,1-bis (t-hexyloxy) cyclohexane, 1, Examples include 1-bis (t-butylperoxy) 1,3,3,5 trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane, and 2,2-bis (t-butylperoxy) decane.
  • dialkyl peroxide examples include ⁇ , ⁇ , monobis (t-butylperoxy).
  • hydride peroxide examples include diisopropylbenzene hydride peroxide and tamenoid oxid peroxide.
  • silyl peroxides include t-butyltrimethylsilyl peroxide, bis (t-butyl) dimethylsilyl peroxide, t-butyltributylsilyl peroxide, bis (tbutyl) dibulylsilyl peroxide, tris ( Examples thereof include t-butyl) butylsilyl peroxide, t-butyltriallylsilyl peroxide, bis (t-butyl) diallylsilyl peroxide, and tris (t-butyl) arylsilyl peroxide.
  • radical polymerization initiators may be used singly or in combination of two or more, and may be used in combination with a decomposition accelerator, an inhibitor and the like.
  • the concentration of chlorine ions and organic acids contained in the radical polymerization initiator is 5000 ppm or less in order to suppress corrosion of circuit electrodes of circuit members. It is preferable that Furthermore, a radical polymerization initiator that generates less organic acid after thermal decomposition is more preferred. In addition, since the stability of the adhesive film after curing is improved, it is preferable to have a mass retention of 20% by mass or more after being left open at room temperature (25 ° C.) and normal pressure for 24 hours.
  • the adhesive composition may contain a radical polymerization inhibitor such as NO, idroquinone, methyl ether nodule quinone, etc. in a range that does not impair the curability.
  • a radical polymerization inhibitor such as NO, idroquinone, methyl ether nodule quinone, etc. in a range that does not impair the curability.
  • the adhesive composition may contain a thermosetting resin other than the radical polymerizable compound as the polymerizable compound.
  • thermosetting resin is epoxy resin.
  • Epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, talesole novolak type epoxy resin, bisphenol A novolak.
  • These epoxy resins may be halogenated or hydrogenated. These epoxy resins can be used singly or in combination of two or more.
  • the curing agent for the epoxy resin those used as an ordinary epoxy resin curing agent can be used. Specific examples include amine-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, imidazole-based curing agents, and dicyandiamide. Furthermore, tertiary amines and organic phosphorus compounds that are usually used as curing accelerators may be used as appropriate.
  • cationic polymerization may be performed using a sulfone salt, a iodine salt, or the like.
  • the film-forming component is a component that makes the film-forming property of the adhesive film better, and can also improve the adhesiveness and the stress relaxation property during Z or curing.
  • the film-forming component include a film-forming polymer.
  • film-forming polymers include polybutyral resin, polybulal formal resin, polyester resin, polyamide resin, polyimide resin, xylene resin, phenoxy resin, polyurethane resin, and urea resin. Can be mentioned.
  • the film-forming component preferably has a weight average molecular weight of 1,000 to 10,000,000.
  • those obtained by modifying these polymers with radically polymerizable functional groups can also be used. Thereby, the heat resistance of an adhesive film improves.
  • the blending ratio of the film-forming component in the adhesive composition is preferably 2 to 80% by mass with respect to the total amount of the adhesive composition, and more preferably 5 to 70% by mass. It is especially preferable that it is -60 mass%. If the blending ratio of the film-forming component is less than 2% by mass, the stress relaxation property and adhesiveness tend to be lowered, and if it exceeds 80% by mass, the fluidity tends to be lowered.
  • the adhesive composition of the present invention preferably contains conductive particles.
  • Conductive particles enable electrical connection If it has such electroconductivity, it will not specifically limit.
  • the conductive particles include metal particles including alloys such as Au, Ag, Ni, Cu, Co, and solder, and carbon.
  • Conductive particle force Multi-layers in which core particles such as non-conductive glass, ceramics, and plastics are coated with a film containing a conductive material such as the metal or a particle containing a conductive material such as the metal. It may be.
  • the thickness of the coating film is preferably 10 nm or more in order to obtain more reliable conductivity.
  • the conductive particles When powerful multi-layered conductive particles or heat-meltable metal particles are used as the conductive particles, the conductive particles have a deformability that deforms when heated and pressurized. Therefore, when connecting the circuits using the adhesive composition containing such conductive particles, the contact area between the circuit and the conductive particles is increased, and variations in thickness between the plurality of electrodes can be absorbed. Therefore, the viewpoint power of improving reliability is also preferable.
  • the fine particles obtained by further coating the surface of the conductive particles with a resin film or the like can further suppress a short circuit caused by contact between the fine particles. Accordingly, since the insulation between the electrode circuits is improved, it may be blended into the adhesive composition, as appropriate, alone or mixed with conductive particles.
  • the content ratio of the conductive particles in the adhesive composition is preferably 0.1 to 30% by volume, more preferably 0.1 to 20% by volume. A volume% is particularly preferred.
  • the content ratio of the conductive particles is less than 0.1 part by volume, the cured product of the adhesive composition tends to be inferior in conductivity.
  • the content exceeds 30 parts by volume the adhesive composition is used for circuit connection. In some cases, a short circuit between the circuits to be insulated tends to occur.
  • the content of the conductive particles is preferably 0.5 to 30 parts by mass with respect to 100 parts by mass of the thermoplastic resin.
  • the content ratio of the conductive particles is determined based on the volume of each component in the adhesive composition before curing at 23 ° C.
  • the volume of each component may be converted into a volume based on the specific gravity.
  • the adhesive composition of the present invention is for the purpose of further improving the adhesiveness of the adhesive film
  • a coupling agent may be contained.
  • the coupling agent include alkoxysilanes such as trimethoxysilane methacrylate and ⁇ -glycidoxypropyltrimethoxysilane.
  • the adhesive composition according to the present invention can solve the problems of the present invention by adding a filler, a softening agent, an anti-aging agent, a colorant, a flame retardant, a coupling agent, and the like, if necessary. Please follow the range.
  • the adhesive film according to the present invention is suitably used as an adhesive film for electronic materials.
  • a method for producing a laminated film according to a preferred embodiment of the present invention includes a first step of selecting a support having a surface residual adhesion ratio C of 80% or more, and a support selected in the selection step.
  • a second step of forming an adhesive film containing the adhesive composition on the surface of the holder In the first step, a support having a residual surface adhesion C of 80% or more
  • Examples of a method for forming an adhesive film containing the adhesive composition on the support throughout the second step include the following methods. First, a solution obtained by adding a solvent or the like to the adhesive composition obtained by mixing the above-described components, if necessary, is applied on a support to form a coating film. Next, after removing the solvent, the adhesive film is obtained by making the coating film into a solid or semi-solid state. Alternatively, the adhesive composition may be heated to ensure fluidity, then a solvent is added to obtain a solution, and the solution is treated in the same manner as described above to form an adhesive film.
  • the laminated film of the present invention may be a laminated film having a two-layer force of a support and an adhesive film formed on the surface thereof.
  • it may be a laminated film in which two or more layers of adhesive films having the same or different composition and manufacturing method are provided on the surface of the support.
  • the laminated film is obtained by further forming an adhesive film as described above on the surface opposite to the support of the adhesive film formed on the surface of the support as described above. It is done.
  • the laminated film can be obtained by laminating adhesive films formed on the surfaces of separate supports with each other using a laminator or the like.
  • FIG. 4 is a schematic cross-sectional view showing an embodiment of a circuit member connection structure obtained by this manufacturing method.
  • the circuit member connection structure includes a first circuit member 20 and a second circuit member 30 that face each other, and the first circuit member 20 and the second circuit member 30 are provided. Between them, a circuit connecting member 10 is provided for connecting them.
  • the first circuit member 20 includes a circuit board (first circuit board) 21 and a circuit electrode (first circuit electrode) 22 formed on the main surface 21a of the circuit board 21.
  • the second circuit member 30 includes a circuit board (second circuit board) 31 and a circuit electrode (second circuit electrode) 32 formed on the main surface 31 a of the circuit board 31.
  • the circuit boards 21 and 31 include semiconductors, glass, ceramics and other inorganic substances, polyimides, polycarbonates, polyesters, polyethersulfone and other organic substances, and composite materials of these inorganic substances and organic substances (for example, glass Z polyepoxy resin). There are things that can help.
  • the first and second circuit members 20, 30 are not particularly limited as long as electrodes that require electrical connection are formed. Specific examples include electrodes used in liquid crystal displays, such as glass substrates or plastic substrates, printed wiring boards, ceramic wiring boards, and flexible wiring boards, which are made of V, ITO, or the like. Used in combination.
  • the circuit connecting member 10 contains an insulating substance 11 and conductive particles 7.
  • the conductive particles 7 are disposed not only between the circuit electrode 22 and the circuit electrode 32 facing each other but also between the main surfaces 21a and 31a.
  • the circuit electrodes 22 and 32 are electrically connected via the conductive particles 7. That is, the conductive particles 7 are in direct contact with both the circuit electrodes 22 and 32.
  • the conductive particles 7 correspond to the conductive particles that may be contained in the above-mentioned adhesive composition.
  • the opposing circuit electrode 22 and circuit electrode 32 are electrically connected via the conductive particles 7. For this reason, the connection resistance between the circuit electrodes 2 2 and 32 is sufficiently reduced. Therefore, the current between circuit electrodes 22 and 32 The flow can be made smooth, and the functions of the circuit can be fully exhibited.
  • circuit connecting member 10 does not contain the conductive particles 7, the circuit electrode 22 and the circuit electrode 32 are in direct contact with each other to be electrically connected.
  • the circuit connecting member 10 is made of a cured product of the adhesive film. Therefore, the connection reliability of the circuit connection member 10 with respect to the circuit member 20 or 30 is sufficiently high.
  • the first circuit member 20 and the film-like circuit connection material 40 described above are prepared (see FIG. 5 (a)).
  • the film-like circuit connecting material 40 is the above-described adhesive film, and is formed on the surface of the support 1 according to the present invention to form the laminated film 100 at the stage of preparation. Further, the film-like circuit connecting material 40 here contains conductive particles 7.
  • the film-like circuit connecting material 40 is usually drawn out from the state of being wound around the core and cut to a required length.
  • the film-like circuit connecting material 40 is placed on the surface of the first circuit member 20 on which the circuit electrodes 22 are formed. At this time, since the film-like circuit connecting material 40 is provided on the support 1, the film-like circuit connecting material 40 is placed on the first circuit member 20 so that the film-like circuit connecting material 40 side faces the first circuit member 20. .
  • the film-like circuit connecting material 40 can be easily interposed between the first circuit member 20 and the second circuit member 30. Connection work with the second circuit member 30 can be easily performed.
  • the film-like circuit connecting material 40 is temporarily fixed (temporarily connected) to the first circuit member 20. At this time, you may pressurize, heating. However, the heating temperature is a temperature at which the adhesive composition in the film-like circuit connecting material 40 is not cured.
  • the support 1 is peeled from the film-like circuit connecting material 40 (see FIG. 5 (b)).
  • the support 1 is a support according to the present invention, the support 1 and the film-like circuit connection material 40 are laminated, such as transfer of the release treatment agent from the support 1 to the film-like circuit connection material 40. It is possible to sufficiently suppress the deterioration factor of the connection reliability due to the fact.
  • the film-like circuit connecting material 40 is irradiated with actinic rays.
  • Fig. 5 (c) the second circuit member 30 is placed on the film-like circuit connecting material 40 so that the second circuit electrode faces the first circuit member 20.
  • the film-like circuit connecting material 40 is pressurized through the first and second circuit members 20 and 30 in the directions of arrows A and B in FIG.
  • the heating temperature at this time is a temperature at which the adhesive composition of the present invention can be cured.
  • the film-like circuit connecting material 40 is cured and the main connection is performed, so that a circuit member connection structure as shown in FIG. 4 is obtained.
  • the connection conditions are appropriately selected depending on the intended use, the adhesive composition, and the circuit member.
  • the heating temperature is 90 to 250 ° C
  • the pressure is generally 0.1 to 10 to the adherend.
  • connection time is preferably 1 second to 10 minutes.
  • the apparatus for heating and pressurizing is not particularly limited! However, in consideration of productivity and convenience, a pressurizing and heating apparatus including a pressurizing head with a built-in heater is preferable.
  • the method for producing a laminated film according to another embodiment of the present invention includes a step of forming a support so that the residual adhesion C on the surface is 80% or more, and the support
  • the composition and the composition are substantially the same as those of the support selected by the above-described support screening method and having a surface residual adhesion ratio C of 80% or more.
  • the support may be formed by a manufacturing method.
  • a curing process using light, ultrasonic waves, Z, or electromagnetic waves may be further performed.
  • an adhesive film may be used as a material for a semiconductor connection member that connects a semiconductor element and a circuit pattern in a semiconductor device.
  • FIG. 6 is a schematic cross-sectional view showing an embodiment of this semiconductor device.
  • the semiconductor device 80 of the present embodiment includes a semiconductor element 50 and a substrate 60 that serves as a semiconductor support member, and the semiconductor element that electrically connects them between the semiconductor element 50 and the substrate 60.
  • a connecting member 40 is provided.
  • the semiconductor element connection member 40 is laminated on the main surface 60a of the substrate 60, and the semiconductor element 50 is further laminated on the semiconductor element connection member 40.
  • the substrate 60 includes a circuit pattern 61, and the circuit pattern 61 is electrically connected to the semiconductor element 50 via the semiconductor connection member 40 on the main surface 60 a of the substrate 60 or directly. These are sealed with a sealing material 70 to form a semiconductor device 80.
  • the material of the semiconductor device 50 is not particularly limited, but is a group 4 semiconductor device of silicon, germanium, a group IIIV compound semiconductor device such as GaAs, InP, GaP, InGaAs, or the like, such as ⁇ gTe, HgCdTe, or CdMnTe.
  • Group VI compound semiconductor devices and various devices such as CuInSe (CIS) can be used.
  • the semiconductor element connecting member 40 contains the insulating substance 11 and the conductive particles 7, and is a cured product of the adhesive film of the present invention.
  • the conductive particles 7 are disposed not only between the semiconductor element 50 and the circuit pattern 61 but also between the semiconductor element 50 and the main surface 60a.
  • the semiconductor element 50 and the circuit pattern 61 are electrically connected via the conductive particles 7. For this reason, the connection resistance between the semiconductor element 50 and the circuit pattern 61 is sufficiently reduced. Therefore, the current flow between the semiconductor element 50 and the circuit pattern 61 can be made smooth, and the functions of the semiconductor can be fully exhibited.
  • the semiconductor element connection member 40 is made of the cured adhesive film according to the present invention, the connection reliability between the semiconductor element 50 and the circuit pattern 61 is improved, and the yield of the semiconductor device 80 is increased. Will be high enough.
  • PET film A polyethylene terephthalate (hereinafter referred to as “PET”) film was prepared as a base film.
  • amino alkyd resin trade name “TA31-209” manufactured by Hitachi Chemical Co., Ltd.
  • acid catalyst trade name “Dryer 900” manufactured by Hitachi Chemical Polymer Co., Ltd.
  • a product name “AH3” manufactured by Teijin Limited was prepared as the base material for support # 7
  • a product name “UH2” manufactured by Teijin Limited was prepared as the base material for support # 8.
  • the conductive particles are formed by forming a 0.2 ⁇ m thick nickel layer and a 0.04 ⁇ m thick gold layer in this order on the surface of polystyrene-based particles, and then forming a polybutyl alcohol on the surface. Obtained by forming a layer consisting of .
  • the average particle diameter of the conductive particles was 4 ⁇ m.
  • the first adhesive composition was applied onto the surface of the substrate for support # 1 using a coating apparatus to obtain a coating film.
  • the coating film was dried with hot air at 70 ° C. for 5 minutes to obtain a first intermediate laminate having an adhesive film thickness of 25 ⁇ m.
  • the film-forming component fluorene-biphenyl type phenolic resin 40g the same bisphenol A type phenolic resin 10g, and the polymerizable compound tris (acrylochelchetil) ) 10g of isocyanurate, 10g of urethane acrylate, 10g of trimethoxysilane metatalylate as coupling agent, and 3g of n-butyl-4,4-bis (t-butylperoxy) valerate as polymerization initiator.
  • the second adhesive composition was applied onto the surface of the substrate for support # 2 using a coating apparatus to obtain a coating film.
  • the coating film was dried with hot air at 70 ° C. for 5 minutes to obtain a second intermediate laminate having an adhesive film thickness of 25 ⁇ m.
  • the first intermediate laminate and the second intermediate laminate are laminated such that the adhesive films overlap each other and the adhesive films are sandwiched between the respective substrates for the support.
  • Lamination was performed under the conditions of ° C, 0.5 mmZmin, no pressure, and a laminated film was obtained.
  • the film-forming component fluorene biphenol type phenolic resin 10g, bisphenol A type phenolic resin 30g, polymerizable compound phenol novolac type epoxy resin 20g, coupling agent 5 g of ⁇ -glycidoxypropyltrimethoxysilane and 40 g of an imidazole curing agent as a curing agent were blended. Further, 40 g of conductive particles were mixed and dispersed in the same manner as in Example 1 to obtain a first adhesive composition. [0113] Next, a coating film was obtained by applying the first adhesive composition on the surface of the substrate for support # 1 using a coating apparatus. The coating film was dried with hot air at 70 ° C. for 5 minutes to obtain a first intermediate laminate having an adhesive film thickness of 12 m.
  • the film-forming component fluorene biphenol type phenolic resin 10 g was obtained by blending 20 g of rosin, 5 g of ⁇ -glycidoxypropyltrimethoxysilane as a coupling agent, and 40 g of an imidazole curing agent as a curing agent.
  • the second adhesive composition was applied onto the surface of the substrate for support # 2 using a coating apparatus to obtain a coating film.
  • the coating film was dried with hot air at 70 ° C. for 5 minutes to obtain a second intermediate laminate having an adhesive film thickness of 13 m.
  • the first intermediate laminate and the second intermediate laminate are laminated such that the adhesive films overlap each other and the adhesive films are sandwiched between the respective substrates for support.
  • Lamination was performed under the conditions of ° C, 0.5 mmZmin, no pressure, and a laminated film was obtained.
  • Example 2 In the same manner as in Example 1 except that the support substrate # 7 was used instead of the support substrate # 1, and the support substrate # 8 was used instead of the support substrate # 2. A laminated film was obtained.
  • the pasting conditions were: heating temperature 90 ° C, pressure IMPa (paste 3 seconds).
  • an IC chip with a gold bump electrode with a chip size of 1.7 mm x 17 mm x 0.55 mm, a bump area of 50 m x 50 ⁇ m, a bump height of 15 ⁇ m, and a bump count of 358 Prepared.
  • the base material for support # 1 of the laminated film attached to the circuit member was peeled off.
  • alignment is performed so that the adhesive film exposed by peeling off the substrate for support # 1 and the gold bump electrode side of the IC chip face each other, and the IC chip and the electrodes of the circuit member can be connected to each other.
  • the circuit member with laminated film and the IC chip were superposed.
  • connection temperature 200 ° C
  • pressing pressure 80 MPa (per total bump area)
  • connection resistance measurement samples according to Examples 2 to 4 and Comparative Examples 1 and 2 were obtained in the same manner as described above. Obtained.
  • connection resistance the electrical resistance value (connection resistance) between the electrode circuit in the circuit member and the bump electrode in the IC chip was measured using a digital multimeter by the 4-terminal measurement method. It was measured. The measurement current was 1 mA.
  • the measurement was performed immediately after preparation of the connection resistance measurement sample (initial stage) and after the sample was exposed to thermal cycle conditions (after cycle).
  • the thermal cycle used was a thermal shock test apparatus (trade name “TSA-41L-A” manufactured by ESPEC) .
  • TSA-41L-A manufactured by ESPEC
  • the present invention it is possible to provide a laminated film obtained by laminating an adhesive film on the surface of a support, wherein the adhesive film has sufficient connection reliability.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

La présente invention concerne un film multicouche obtenu en formant un film adhésif contenant une composition adhésive sur la surface d’un corps de support. Ce film multicouche se caractérise en ce que le corps de support possède une surface présentant un taux d’adhésion résiduelle C5 de 80 %.
PCT/JP2006/311766 2005-06-14 2006-06-12 Film multicouche, son procédé de production, procédé de sélection du corps de support pour le film multicouche, et procédé d’évaluation du corps de support pour le film multicouche WO2006134880A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007521280A JPWO2006134880A1 (ja) 2005-06-14 2006-06-12 積層フィルム及びその製造方法、積層フィルム用支持体の選別方法、並びに積層フィルム用支持体の評価方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-173553 2005-06-14
JP2005173553 2005-06-14

Publications (1)

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WO2006134880A1 true WO2006134880A1 (fr) 2006-12-21

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JP (1) JPWO2006134880A1 (fr)
KR (2) KR100972262B1 (fr)
CN (1) CN101198669A (fr)
TW (1) TW200716719A (fr)
WO (1) WO2006134880A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013084953A1 (fr) * 2011-12-05 2013-06-13 電気化学工業株式会社 Procédé de fabrication d'un stratifié à substrat dur et transmettant la lumière

Families Citing this family (3)

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Publication number Priority date Publication date Assignee Title
US8695413B2 (en) * 2011-05-30 2014-04-15 The Procter & Gamble Company Method for evaluating the stickiness of an outer surface on an absorbent article
CN105203451A (zh) * 2015-09-18 2015-12-30 福建蓝海黑石科技有限公司 涂层内聚力的表征方法
CN112394029B (zh) * 2019-08-13 2023-03-17 宝山钢铁股份有限公司 用于评价覆膜铁表面薄膜结合力的模拟液及其评价方法

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JPH08253741A (ja) * 1995-01-19 1996-10-01 Sekisui Chem Co Ltd 粘着テープ及びその製造方法並びに表面保護フィルム
JP2000239623A (ja) * 1999-02-25 2000-09-05 Mitsubishi Polyester Film Copp 粘着層保護フィルム
JP2001294718A (ja) * 2000-04-11 2001-10-23 Tokuyama Corp ポリオレフィン系樹脂組成物
JP2001315261A (ja) * 2000-05-10 2001-11-13 Sumitomo Chem Co Ltd 離型フィルム
JP2002210860A (ja) * 2001-01-17 2002-07-31 Dainippon Printing Co Ltd 離型フィルムおよびその製造法
JP2003089169A (ja) * 2001-09-19 2003-03-25 Yupo Corp 剥離性フィルム
JP2003306661A (ja) * 2002-02-12 2003-10-31 Mitsubishi Chemicals Corp 離型剤
JP2004025516A (ja) * 2002-06-24 2004-01-29 Shin Etsu Chem Co Ltd シリコーン剥離層とシリコーン粘着層の積層物品及びその製造方法
JP2005146080A (ja) * 2003-11-13 2005-06-09 Mitsubishi Chemicals Corp 離型フィルム及び積層体

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Publication number Priority date Publication date Assignee Title
JPH08253741A (ja) * 1995-01-19 1996-10-01 Sekisui Chem Co Ltd 粘着テープ及びその製造方法並びに表面保護フィルム
JP2000239623A (ja) * 1999-02-25 2000-09-05 Mitsubishi Polyester Film Copp 粘着層保護フィルム
JP2001294718A (ja) * 2000-04-11 2001-10-23 Tokuyama Corp ポリオレフィン系樹脂組成物
JP2001315261A (ja) * 2000-05-10 2001-11-13 Sumitomo Chem Co Ltd 離型フィルム
JP2002210860A (ja) * 2001-01-17 2002-07-31 Dainippon Printing Co Ltd 離型フィルムおよびその製造法
JP2003089169A (ja) * 2001-09-19 2003-03-25 Yupo Corp 剥離性フィルム
JP2003306661A (ja) * 2002-02-12 2003-10-31 Mitsubishi Chemicals Corp 離型剤
JP2004025516A (ja) * 2002-06-24 2004-01-29 Shin Etsu Chem Co Ltd シリコーン剥離層とシリコーン粘着層の積層物品及びその製造方法
JP2005146080A (ja) * 2003-11-13 2005-06-09 Mitsubishi Chemicals Corp 離型フィルム及び積層体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013084953A1 (fr) * 2011-12-05 2013-06-13 電気化学工業株式会社 Procédé de fabrication d'un stratifié à substrat dur et transmettant la lumière
JPWO2013084953A1 (ja) * 2011-12-05 2015-04-27 電気化学工業株式会社 透光性硬質基板積層体の製造方法

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KR20100036370A (ko) 2010-04-07
CN101198669A (zh) 2008-06-11
TW200716719A (en) 2007-05-01
KR100991074B1 (ko) 2010-10-29
KR100972262B1 (ko) 2010-07-23
KR20080024198A (ko) 2008-03-17
JPWO2006134880A1 (ja) 2009-01-08

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