CN107432084A - Anisotropic conductive connection structural bodies, anisotropic conductive connection method and anisotropically conducting adhesive - Google Patents

Anisotropic conductive connection structural bodies, anisotropic conductive connection method and anisotropically conducting adhesive Download PDF

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Publication number
CN107432084A
CN107432084A CN201680014182.5A CN201680014182A CN107432084A CN 107432084 A CN107432084 A CN 107432084A CN 201680014182 A CN201680014182 A CN 201680014182A CN 107432084 A CN107432084 A CN 107432084A
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CN
China
Prior art keywords
terminal
anisotropic conductive
foregoing
conducting adhesive
substrate
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CN201680014182.5A
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Chinese (zh)
Inventor
大关裕树
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Dexerials Corp
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Dexerials Corp
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Priority to CN202210519422.4A priority Critical patent/CN115151035A/en
Publication of CN107432084A publication Critical patent/CN107432084A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention, which provides, can be made by simpler process and have new and improved anisotropic conductive connection structural bodies, anisotropic conductive connection method and the anisotropically conducting adhesive of high reliability.In order to solve aforementioned problems, certain viewpoint according to the present invention, there is provided anisotropic conductive connection structural bodies, it possesses：Basal substrate；The 1st terminal being arranged on basal substrate；Flexible substrate；The wiring pattern being arranged on flexible substrate；Cover the insulating properties diaphragm of wiring pattern；The 2nd terminal being connected on wiring pattern；And the anisotropically conducting adhesive layer for being connected the 1st terminal with the 2nd terminal progress anisotropic conductive; wherein; insulating properties diaphragm is configured on the outside of the face direction of basal substrate, untill anisotropically conducting adhesive layer extends to the end of basal substrate side of insulating properties diaphragm from the 2nd terminal.

Description

Anisotropic conductive connection structural bodies, anisotropic conductive connection method and respectively to different Property electrically conducting adhesive
Technical field
The present invention relates to anisotropic conductive connection structural bodies, anisotropic conductive connection method and anisotropic conductive to glue Connect agent.
Background technology
For example, disclosed in patent document 1,2：In order to by display module, utilize anisotropically conducting adhesive The terminal column of the terminal column of basal substrate (substrate for forming display panel side) side and flexible substrate side is carried out into anisotropy to lead Electrical connection.In the technology, flexible substrate side is set on the terminal column of basal substrate side between anisotropically conducting adhesive Terminal.That is, anisotropically conducting adhesive is clamped with the terminal column of basal substrate side and the terminal column of flexible substrate side.With Afterwards, the terminal column of basal substrate side and the terminal column of flexible substrate side are thermally compressed.Thus, by the terminal of basal substrate side Arrange and be connected with the terminal column of flexible substrate side progress anisotropic conductive.
But formed with the wiring pattern being connected on the terminal of flexible substrate side on flexible substrate.Therefore, in flexible base During plate bending, wiring pattern has to be contacted with substrate (the particularly corner of substrate), causes wiring pattern to produce the possibility of broken string. Therefore, in the technology disclosed in patent document 1,2, formed on wiring pattern insulating properties diaphragm (soldering-resistance layer or solder resist, Solder resist) and form the insulating properties diaphragm untill the region on basal substrate.Thus, flexible base is prevented Wiring pattern contacts with basal substrate during plate bending.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2002-358026 publications；
Patent document 2：Japanese Unexamined Patent Publication 2009-135388 publications.
The content of the invention
Invent problem to be solved
But in the technology disclosed in patent document 1,2, by the terminal of the terminal column of basal substrate side and flexible substrate side When row are thermally compressed, insulating properties diaphragm has situation about being contacted with basal substrate.Now, become not to the end of basal substrate side Apply sufficient pressure between son row and the terminal column of flexible substrate side.In other words, if insulating properties diaphragm connects with basal substrate Touch, then insulating properties diaphragm hinders the close of the terminal column of basal substrate side and the terminal column of flexible substrate side.Therefore, substrate base The terminal column of plate side shows the situation for producing bad connection with the terminal of flexible substrate side.
Moreover, when the terminal column of the terminal column of basal substrate side and flexible substrate side is thermally compressed, have neither part nor lot in each The anisotropically conducting adhesive that anisotropy is conductively connected, in the mutual gap flowing of terminal for forming each terminal column, thereafter, stream Move to the outside of each terminal column.Here, if insulating properties diaphragm contacts with basal substrate, be intended to from the terminal of basal substrate side that The anisotropically conducting adhesive that this gap flows to outside is blocked by insulating properties diaphragm.Now, many anisotropy are led Electric bonding agent is residued between the terminal of basal substrate side.That is, between the terminal of basal substrate side, delay has many compositions each to different The conducting particles of property electrically conducting adhesive.Moreover, these conducting particles have the terminal for making basal substrate side to turn on each other (i.e. between terminal Produce short circuit) situation.In this way, in the technology disclosed in patent document 1,2, have the terminal column and flexible substrate of substrate-side It is low that the terminal column progress anisotropy of side turns on the structure being formed by connecting, the i.e. reliability of anisotropic conductive connection structural bodies The problem of.
As technique for solving these problems, motion insulating properties diaphragm is configured at substrate face direction (with The vertical direction of the thickness direction of substrate) on the outside of technology.But in the art, have in insulating properties diaphragm with each to different Property conductive adhesive (terminal column of the terminal column of substrate-side and flexible substrate side is subjected to the bonding of anisotropic conductive connection Oxidant layer) between formed gap situation.Now, being present in the wiring pattern in the gap can expose.If in this way, the one of wiring pattern Part is exposed, then has the situation that foreign matter is attached to the part and makes wiring pattern produce short circuit.In addition, rolled over by flexible substrate When curved, the exposed portion for having wiring pattern produces the situation of fracture.Therefore, anisotropic conductive can not also be made using the technology The reliability lifting of connection structural bodies.
Therefore, the technology of the exposed portion of wiring pattern is protected in motion with sealant.But in the art, it is necessary to The process in addition being covered the exposed portion of wiring pattern with sealant.In the process, by the terminal column of substrate-side and flexibility After the terminal column of substrate-side is thermally compressed, the connection structural bodies of basal substrate and flexible substrate is turned over.Thus, cloth is made The exposed portion of line pattern is upward.Moreover, sealant is injected into the exposed portion of the wiring pattern, and from light source to close Seal agent irradiation light.Thus, sealant cures are made.In this way, the process due to the exposed portion that wiring pattern is covered with sealant Take the time in the extreme, so increasing in the time spent needed for bonding display panel and flexible substrate.
Therefore, the present invention is to carry out in view of the above problems, and it is an object of the invention to provide can be by simpler Process make and connect with the new and improved anisotropic conductive connection structural bodies of high reliability, anisotropic conductive Connect method and anisotropically conducting adhesive.
Means for solving the problems
In order to solve above-mentioned problem, certain viewpoint according to the present invention, there is provided anisotropic conductive connection structural bodies, it possesses：Base Substrate；The 1st terminal being arranged on basal substrate；Flexible substrate；The wiring pattern being arranged on flexible substrate；Covering wiring The insulating properties diaphragm of pattern；It is connected to the 2nd terminal of wiring pattern；And the 1st terminal and the 2nd terminal are subjected to anisotropy The anisotropically conducting adhesive layer being conductively connected, wherein, insulating properties diaphragm is configured on the outside of the face direction of basal substrate, respectively Untill anisotropy conductive adhesive extends to the end of basal substrate side of insulating properties diaphragm from the 2nd terminal.
Here, the end of end to the basal substrate side of insulating properties diaphragm from the insulating properties diaphragm side of basal substrate Untill distance can be below 0.3mm.
Moreover, 30 DEG C of modulus of elasticity of anisotropically conducting adhesive layer can be below 4.0GPa.
Other viewpoints according to the present invention, there is provided anisotropic conductive connection method, it includes following process：Preparation is set It is equipped with the process of the basal substrate of the 1st terminal；Prepare be provided with wiring pattern, cover wiring pattern insulating properties diaphragm and It is connected to the process of the flexible substrate of the 2nd terminal of wiring pattern；Prepare to draw comprising uncured polymerizable compound, heat cure The process for sending out the anisotropically conducting adhesive of agent and electroconductive particle；Led with the 1st terminal and the 2nd terminal clamping anisotropy Electric bonding agent, and insulating properties diaphragm is configured at the process on the outside of the face direction of basal substrate；And by by basal substrate It is thermally compressed with flexible substrate, the 1st terminal is carried out into anisotropic conductive with the 2nd terminal is connected, while leads anisotropy Electric bonding agent flows to the process untill the end of the basal substrate side of insulating properties diaphragm.Prepare the order of the process of each material It is unlimited.
Here, anisotropically conducting adhesive can further include trigger for optical solidification, make anisotropically conducting adhesive It is each on the outside of the face direction of basal substrate to flowing to after flowing to untill the end of the basal substrate side of insulating properties diaphragm Anisotropy electrically conducting adhesive irradiation light.
In addition, flexible substrate is configured in the top of basal substrate, from the lower section of anisotropically conducting adhesive to it is each to Anisotropic conductive adhesion agent irradiation light.
In addition, anisotropically conducting adhesive can be anisotropic conductive film, the thickness of anisotropic conductive film can be the 1st At least more than 1.4 times of total height of terminal and the 2nd terminal.
Other viewpoints according to the present invention, there is provided anisotropically conducting adhesive, it includes uncured polymerism chemical combination Thing, thermal cure initiators and electroconductive particle, the lowest melt viscosity under its uncured state is 100~1000Pa s, completely solid 30 DEG C of modulus of elasticity after change are below 4.0GPa.
Here, anisotropically conducting adhesive also can further include trigger for optical solidification.
According to the above-mentioned viewpoint of the present invention, insulating properties diaphragm is configured on the outside of the face direction of basal substrate.Therefore, because Insulating properties diaphragm will not hinder the close of the 1st terminal and the 2nd terminal, be connected so the 1st terminal is not allowed to be also easy to produce with the 2nd terminal It is bad.Moreover, the 1st terminal can successfully be flowed to by flowing to the anisotropically conducting adhesive in the 1st mutual gap of terminal The outside of row.Therefore, the 1st terminal is not allowed to be also easy to produce short circuit each other.Therefore, the reliable of anisotropic conductive connection structural bodies is lifted Property.
Moreover, the above-mentioned viewpoint according to the present invention, untill bond layer reaches insulating properties diaphragm.Therefore, in bonding agent Gap will not be formed between layer and insulating properties diaphragm.Therefore, because the exposed portion of wiring pattern will not be formed, so being not required to The process exposed portion of wiring pattern is sealed by sealant.Therefore, can be made by simpler process each Anisotropy conduction connecting structure body.
Invention effect
As described above, according to the present invention, the anisotropic conductive with high reliability can be made by simpler process Connection structural bodies.
Brief description
Fig. 1 is the sectional side view of the composition for the anisotropic conductive connection structural bodies for schematically showing embodiment of the present invention.
Fig. 2 is the sectional side view of a part for the manufacturing process for showing anisotropic conductive connection structural bodies.
Fig. 3 is the sectional side view of a part for the manufacturing process for showing anisotropic conductive connection structural bodies.
Fig. 4 is the oblique view for illustrating the assay method of resin flow.
Fig. 5 is the top view for illustrating the assay method of resin flow.
Fig. 6 is the top view for illustrating the assay method of resin flow.
Fig. 7 is to be illustrated schematically in the side formed with gap between anisotropically conducting adhesive layer and insulating properties diaphragm The sectional side view of the example of case.
Fig. 8 is to be illustrated schematically in the side formed with gap between anisotropically conducting adhesive layer and insulating properties diaphragm The sectional side view of other examples of case.
Embodiment
Hereinafter, while referring to the drawings while explain the present invention suitable embodiment.It should be noted that in this theory , will weight by additional identical symbol for the inscape substantially formed with identical function in bright book and schema Multiple explanation is omitted.
<1. the composition of anisotropic conductive connection structural bodies>
First, based on Fig. 1, the composition of the anisotropic conductive connection structural bodies 1 of present embodiment is illustrated.
Anisotropic conductive connection structural bodies 1 (it is following, and also referred to as " connection structural bodies 1 ") possess：Basal substrate 10, 1 terminal 11, the 1st wiring pattern 12, flexible substrate 20, the 2nd terminal 21, the 2nd wiring pattern 22, insulating properties diaphragm 30 and each Anisotropy conductive adhesive 40 (it is following, also referred to as " bond layer 40 ").
Basal substrate 10 is the glass substrate for for example forming display panel, as long as carry out anisotropy with flexible substrate 20 The substrate being conductively connected, is not particularly limited.In addition, the thickness to basal substrate 10 is it is not also specifically limited, in this reality Apply in mode, even if thickness is below 0.7mm, bond layer 40 is also not easy to go for a stroll into the back side of basal substrate 10 (with shape The face of the terminal columns of Cheng You 1 and wiring pattern 12 is the face of opposite side).In addition, it can also be formed on the end 10a of basal substrate 10 Chamfered section 10b.
1st terminal 11 sets multiple on the end 10a of basal substrate 10.1st terminal 11 is parallel each other and by more Individual 1st terminal 11 forms the 1st terminal column.It should be noted that when forming chamfered section 10b on the 10a of end, as long as the 1st terminal 11 are formed at the central side (inner side) closer to basal substrate 10 than chamfered section 10b.Respective and the 2nd end of 1st terminal 11 Son 21 carries out anisotropic conductive connection.
As long as the conductive material of the material for forming the 1st terminal 11, is not particularly limited.As forming the The material of 1 terminal 11, such as can enumerate：The metal of aluminium, silver, nickel, copper and gold etc.；Tin indium oxide (ITO), indium zinc oxide (IZO), the conductive metal oxide of indium oxide, conductive tin oxide, antimony tin oxide (ATO) and electroconductive zinc oxide etc.； Electroconductive polymer of polyaniline, polypyrrole and polythiophene etc. etc..The metal of the 1st terminal 11 is formed, also can be by various metals (such as gold, tin etc.) plating.It should be noted that when basal substrate 10 turns into the substrate of display panel, it is necessary to ensure that showing The distinguishing of image shown by panel.Therefore, now the 1st terminal 11 preferably by transparent conductivity material (ITO, IZO etc.) shape Into.
1st wiring pattern 12 is the wiring pattern from the extension of the 1st terminal 11 and is arranged on basal substrate 10.Form the 1st The material of wiring pattern 12 and the 1st terminal 11 are same.
Flexible substrate 20 is the substrate formed by the high material of pliability and flexibility.Material to forming flexible substrate 20 It is not particularly limited, the material applied to known flexible substrate can also be applied in the present embodiment.As the flexible base of composition The material of plate 20, such as can enumerate：PET, PEN, polyether sulfone, polyethylene, poly- carbon The resin of acid esters, polyimides and acrylic resin etc., and the metal through filming or glass etc..It should be noted that base When substrate 10 turns into the substrate of display panel, it is necessary to ensure that in the distinguishing of the image shown by display panel.Therefore, now Flexible substrate 20 is preferably formed by the high transparent resin of transmission of visible light.
2nd terminal 21 sets multiple on the end 20a of flexible substrate 20.2nd terminal 21 is parallel each other and by more Individual 2nd terminal 21 forms the 2nd terminal column.Respective and the 1st terminal 11 of 2nd terminal 21 carries out anisotropic conductive and is connected.That is, 1 terminal column carries out anisotropic conductive with the 2nd terminal column and is connected.The material of the 2nd terminal 21 is formed with the 1st terminal 11 equally i.e. Can.
2nd wiring pattern 22 is the wiring pattern from the extension of the 2nd terminal column and is arranged on basal substrate 10.Form the 2nd The material of wiring pattern 22 and the 1st terminal 11 are same.
Insulating properties diaphragm 30 is the film for covering wiring pattern 22.Insulating properties diaphragm 30 is the film for having insulating properties, is protected Protect wiring pattern 22.Insulating properties diaphragm 30 is also referred to as soldering-resistance layer (solder resist, solder resist).Protected to forming insulating properties The material of cuticula 30 is not particularly limited, as long as it is applied to soldering-resistance layer (solder resist, the solder of flexible substrate in the past Resist) material, can also compatibly apply in the present embodiment.
In the present embodiment, insulating properties diaphragm 30 is configured at the face direction of basal substrate 10 (with basal substrate 10 The vertical direction of thickness direction) outside.As described above, because when insulating properties diaphragm 30 is configured on basal substrate 10, the 1st end Son row and the bad connection of the 2nd terminal column, there may be the problem of short circuit each other for the 1st terminal 11.It should be noted that to from base The end 10a (end of the side of insulating properties diaphragm 30) of substrate 10 to the side of basal substrate 10 of insulating properties diaphragm 30 end Distance L untill 30a is not particularly limited.In the present embodiment, when the 1st terminal column and the 2nd terminal column being thermally compressed, Make untill anisotropically conducting adhesive flows to insulating properties diaphragm 30.Therefore, glued according to distance L adjustment anisotropic conductives Connect the lowest melt viscosity of agent.Lowest melt viscosity is smaller, and the amount of flow of anisotropically conducting adhesive is bigger.But Distance L is preferably below 0.3mm.Now, when the 1st terminal column and the 2nd terminal column are thermally compressed, can more reliably make each Untill anisotropy electrically conducting adhesive flows to insulating properties diaphragm 30.This is more than 0 situation in distance L, significantly.In addition, base When the thickness of substrate 10 is excessively thin, during for example, below 0.2mm, distance L can be less than 0, as long as the end of insulating properties diaphragm 30 Portion 30a is the scope being configured on chamfered section 10b, preferably 0~0.2mm.Because suppress bond layer 40 to go for a stroll into base The back side of substrate 10.If being described in detail, L turns into the end that negative value refers to the side of basal substrate 10 of insulating properties diaphragm 30 Portion 30a is configured on basal substrate 10.But even if at this moment, as long as the end 30a of insulating properties diaphragm 30 is configured at substrate On the chamfered section 10b of substrate 10, when the 1st terminal column and the 2nd terminal column are thermally compressed, insulating properties diaphragm 30 is also not easy Contacted with basal substrate 10.In addition, insulating properties diaphragm 30 is difficult to the stream that anisotropically conducting adhesive is hindered in thermo-compression bonding It is dynamic.
Bond layer 40 is the layer that anisotropically conducting adhesive solidification described later forms.Bond layer 40 is by the 1st terminal Row carry out anisotropic conductive with the 2nd terminal column and are connected.Moreover, bond layer 40 extends to insulating properties protection from the 2nd terminal column Untill the end 30a of the basal substrate side of film 30.Therefore, in the present embodiment, in bond layer 40 and insulating properties diaphragm Gap is not formed between 30.That is, the part not covered among wiring pattern 22 by insulating properties diaphragm 30, glued oxidant layer 40 are protected Shield.It should be noted that untill bond layer 40 extends to insulating properties diaphragm 30, insulating properties diaphragm 30 is preferably covered End 30a.Now, bond layer 40 can more reliably protect the part not covered by insulating properties diaphragm 30.
The physical property other than the above of bond layer 40 is not particularly limited, preferably 30 DEG C of modulus of elasticity be 4.0GPa with Under.In the present embodiment, because bond layer 40 is formed untill on the outside of the face direction of basal substrate 10, so in flexible base During 20 bending of plate, bond layer 40 is also bent over.Therefore, when 30 DEG C of modulus of elasticity are below 4.0GPa, flexible substrate 20 is easy Bending.It should be noted that the material for forming bond layer 40, in the project of anisotropically conducting adhesive described later It is described in detail.
<2. anisotropically conducting adhesive>
Bond layer 40 is the layer for forming anisotropically conducting adhesive solidification.Then, anisotropic conductive is bonded at this Agent illustrates.Anisotropically conducting adhesive comprises at least polymerizable compound, thermal cure initiators and electroconductive particle.
Polymerizable compound is the resin with thermal cure initiators or trigger for optical solidification while solidification.Cured polymerization Property compound the 1st terminal column is carried out with the 2nd terminal column in the bond layer 40 be bonded, while electroconductive particle is held in viscous Connect in oxidant layer 40.As long as polymerizable compound meets the compound of aftermentioned physical property, it is not particularly limited.As polymerism Compound, such as can enumerate：Polymerizable epoxy compound and acroleic acid polymerization compound etc..Polymerizable epoxy compound be Monomer, oligomer or prepolymer of the intramolecular with the epoxy radicals of 1 or more than 2., can as polymerizable epoxy compound Enumerate：Various bisphenol-type epoxy resin (bisphenol A-type, F types etc.), phenolic resin varnish type epoxy resin, rubber and carbamates etc. Various modified epoxies, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolak type epoxy resin, stilbene type ring Oxygen tree fat, triphenol methane type epoxy resin, dicyclopentadiene-type epoxy resin, triphenylmethane type epoxy resin and these Prepolymer etc..
Acroleic acid polymerization compound be monomer of the intramolecular with the acryloyl group of 1 or more than 2, oligomer, Or prepolymer.As acroleic acid polymerization compound, such as can enumerate：Methyl acrylate, ethyl acrylate, acrylic acid isopropyl Ester, isobutyl acrylate, epoxy acrylate, glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane Triacrylate, dihydroxymethyl tristane diacrylate, four methylene glycol tetraacrylates, the propylene of 2- hydroxyls -1,3- two Double [4- (acryloyl-oxy ylmethoxy) phenyl] propane of acyloxy propane, 2,2-, double [4- (acryloyloxyethoxy) benzene of 2,2- Base] propane, acrylic acid dicyclopentenyl ester, acrylic acid tricyclodecenyl esters, (acryloyl-oxyethyl) ester of isocyanic acid three and amino first Acid esters acrylate etc..
In the present embodiment, can be used it is any among above-mentioned cited polymerizable compound, also can by two kinds with On be arbitrarily applied in combination.
Thermal cure initiators be can because heat and with above-mentioned polymerizable compound simultaneously solidify material.To thermal cure initiators Species be also not particularly limited.As thermal cure initiators, such as can enumerate：Make the heat of polymerizable epoxy compound cures cloudy Ion or hot cationic curing initiator；Make hot radical aggretion type curing agent of acroleic acid polymerization compound cures etc.. In present embodiment, appropriate thermal cure initiators are selected according to polymerizable compound.
Electroconductive particle is that the 1st terminal column is carried out into anisotropic conductive with the 2nd terminal column in bond layer 40 to be connected Material.Specifically, the electroconductive particle clamped in bond layer 40 by the 1st terminal column and the 2nd terminal column, makes the 1st end Son row turn on the 2nd terminal column.On the other hand, other electroconductive particles are (for example, enter 11 mutual gap of the 1st terminal Electroconductive particle, the electroconductive particle etc. that enters 21 mutual gap of the 2nd terminal), due to disperseing in bond layer 40, So do not turn on mutually.Therefore, electroconductive particle can maintain in the bond layer 40 the 1st terminal 11 each other with the 2nd terminal 21 Mutual insulating properties, while the 1st terminal column is turned on the 2nd terminal column.That is, electroconductive particle is interior by the 1st in bond layer 40 Terminal column carries out anisotropic conductive with the 2nd terminal column and is connected.
The species of electroconductive particle is not particularly limited.As electroconductive particle, such as can enumerate：Metallic and gold Belong to resin-coated particle etc..As metallic, such as can enumerate：Metallic of nickel, cobalt, copper, silver, gold or palladium etc. etc..Make For metallic cover resin particle, such as can enumerate：It is total to by the metallic cover styrene-divinylbenzene of nickel, copper, gold or palladium etc. The core of polymers, benzoguanamine resin, cross-linked polystyrene resin, acrylic resin or styrene-silica compound resin etc. Particle that the surface of resin particle forms etc..The surface of electroconductive particle also can formed with gold palladium membranes or crimping when not Relatively thin insulating resin film of destroyed degree etc..
The anisotropically conducting adhesive of present embodiment preferably further includes trigger for optical solidification.In more detail can be in rear State, in the present embodiment, clamp anisotropically conducting adhesive with the 1st terminal column and the 2nd terminal column, then, use hot melt 1st terminal column and the 2nd terminal column are thermally compressed by the heating pressure-producing part of instrument (heat tool) etc..Now, anisotropy A part for electrically conducting adhesive is flowed to from the 1st terminal column and the 2nd terminal column on the outside of the face direction of basal substrate 10, reaches insulation Untill property diaphragm 30.The anisotropically conducting adhesive being present between the 1st terminal column and the 2nd terminal column, pressurizeed from heating Part is supplied to sufficient heat.Accordingly, there exist the anisotropically conducting adhesive between the 1st terminal column and the 2nd terminal column, Only solidified by carrying out the heat can of self-heating pressure-producing part.But it flow to substrate from the 1st terminal column and the 2nd terminal column Anisotropically conducting adhesive on the outside of the face direction of substrate 10, have from heating pressure-producing part can not fully supply heat can Can property.Therefore, the anisotropic conductive being flow to from the 1st terminal column and the 2nd terminal column on the outside of the face direction of basal substrate 10 glues Agent is connect, there is the possibility only not cured sufficiently by carrying out the heat of self-heating pressure-producing part.Then, present embodiment it is each to Anisotropic conductive adhesion agent preferably further includes trigger for optical solidification.Now, by from the 1st terminal column and the 2nd terminal column stream The anisotropically conducting adhesive irradiation light on the outside of the face direction of basal substrate 10 is moved, the anisotropic conductive can also be made Bonding agent cures sufficiently.
It should be noted that the species of trigger for optical solidification is also not particularly limited.As trigger for optical solidification, such as It can enumerate：Make the time ion or light cationic curing initiator of polymerizable epoxy compound cures；Make acroleic acid polymerization Optical free radical aggretion type curing agent of compound solidification etc..In the present embodiment, appropriate light is selected according to polymerizable compound Curing initiator.The anisotropy being flow to from the 1st terminal column and the 2nd terminal column on the outside of the face direction of basal substrate 10 is led Electric bonding agent, only by carrying out the heat of self-heating pressure-producing part to cure sufficiently when, trigger for optical solidification can be also not added to In anisotropically conducting adhesive.
In addition, in anisotropically conducting adhesive in addition to above-mentioned composition, film-forming resin, various additions can be also included Agent etc..When anisotropically conducting adhesive is turned into film shape, film-forming resin can be added in anisotropically conducting adhesive.Into The species of film resin, as long as meeting the resin of aftermentioned characteristic, it is not particularly limited.As film-forming resin, such as can be with Use：Epoxy resin, phenoxy resin, polyester urethane resin, polyester resin, polyurethane resin, acrylic resin, polyamides The various resins of imide resin, butyral resin etc..In addition, in the present embodiment, can be used only these film-forming resins it In it is any, can also be arbitrarily applied in combination two or more.It should be noted that from make film forming and bonding reliability into From the viewpoint of good, film-forming resin is preferably phenoxy resin.
As the additive that can be added in anisotropically conducting adhesive, can enumerate：Silane coupler, inorganic fill out Material, colouring agent, antioxidant and antirust agent etc..The species of silane coupler is not particularly limited.As silane coupler, Such as it can enumerate：Epoxy, amino system, sulfydryl thioether system, the silane coupler etc. of urea groups system.It is bonded in anisotropic conductive When these silane couplers are added with agent, the cementability of the inorganic substrate to glass substrate etc. can be lifted.
In addition, inorganic filler be mobility for adjusting anisotropically conducting adhesive and film-strength, it is particularly aftermentioned Lowest melt viscosity additive.The species of inorganic filler is also not particularly limited.As inorganic filler, such as can lift Go out：Silica, talcum, titanium oxide, calcium carbonate, magnesia etc..
The lowest melt viscosity of anisotropically conducting adhesive is 100~1000Pa s.In the case where meeting the condition, Anisotropically conducting adhesive can reach insulating properties diaphragm 30 when the 1st terminal column and the 2nd terminal column are thermally compressed Untill.Here, the lowest melt viscosity of anisotropically conducting adhesive can also be entered by changing the species of polymerizable compound Row adjustment, but can also be adjusted by the addition of above-mentioned inorganic filler.The addition of inorganic filler is fewer, respectively to different The lowest melt viscosity of property electrically conducting adhesive has the tendency of more to diminish.Therefore, by adjusting the addition of inorganic filler, Ke Yirong Change places and adjust the lowest melt viscosity of anisotropically conducting adhesive.It should be noted that anisotropically conducting adhesive is most Low melting viscosity is preferably 100~800Pa s, more preferably 200~600Pa s.In the case where meeting these conditions, respectively to Untill anisotropic conductive adhesion agent can more reliably reach insulating properties diaphragm 30.
In addition, 30 DEG C of modulus of elasticity after anisotropically conducting adhesive is fully cured are preferably below 4.0GPa.As above It is described, in the present embodiment, due to the anisotropically conducting adhesive after being fully cured, i.e. bond layer 40, formed to base Untill on the outside of the face direction of substrate 10, so in 20 bending of flexible substrate, bond layer 40 is also bent over.Therefore, 30 DEG C When modulus of elasticity is below 4.0GPa, 20 easy bending of flexible substrate.In addition, when 30 DEG C of modulus of elasticity are below 4.0GPa, Bond layer 40 is unlikely to be peel off during 20 bending of flexible substrate.That is, the adhesive strength of bond layer 40 fully uprises.Respectively to different Property electrically conducting adhesive 30 DEG C of modulus of elasticity, such as can by change film-forming resin and polymerizable compound species, blending Amount is adjusted.
In addition, the resin flow of anisotropically conducting adhesive is preferably 1.3~2.5, more preferably 1.5~2.3.Resin When the value of flow turns into the value in the range of these, anisotropically conducting adhesive can more reliably reach insulating properties diaphragm 30 Untill.
Anisotropically conducting adhesive can be the anisotropic conductive cream of paste, also can be by further containing film-forming resin And be formed as membranaceous anisotropic conductive film.Here, during using anisotropic conductive film as anisotropically conducting adhesive, Anisotropic conductive film wishes to be arranged on stripping film.Stripping film is for example in PET (PETs；Poly Ethylene Terephthalate), OPP (oriented polypropylenes；Oriented Polypropylene), PMP (poly- 4- methyl Amylene -1；Poly-4-methylpentene-1), PTFE (polytetrafluoroethylene (PTFE)；Polytetrafluoroethylene it is) etc. upper to apply The film that the removers such as cloth organosilicon form.Stripping film maintains anisotropy to lead while preventing anisotropic conductive film from drying The shape of electrolemma.
<3. anisotropic conductive connection method>
Secondly, based on Fig. 2 and Fig. 3, manufacture method, i.e. anisotropic conductive connection method to connection structural bodies 1 illustrate. It should be noted that here, the anisotropic conductive film comprising trigger for optical solidification will be used to be bonded as anisotropic conductive The situation of agent illustrates as an example to manufacture method.First, preparation is provided with the basal substrate 10 of the 1st terminal column. Moreover, prepare to be provided with the flexible substrate 20 of the 2nd terminal column, wiring pattern 22, insulating properties diaphragm 30.Moreover, prepare to have The anisotropic conductive film 50 of above-mentioned characteristic.
Then, as shown in Fig. 2 clamping anisotropic conductive film 50 with the 1st terminal column and the 2nd terminal column.For example, at certain Basal substrate 10 is set on sample platform.Then, anisotropic conductive film 50 is arranged on the 1st terminal column and carries out pre-crimping. Here, pre-crimping for example by will heating pressure-producing part pressure touch in anisotropic conductive film 50 and carry out.Temperature during pre-crimping Temperature of degree when being set below formally crimping, and be the temperature of the not curing degree of anisotropic conductive film 50.Then, with the 2nd end Son row and the opposite mode of the 1st terminal column, flexible substrate 20 is arranged on basal substrate 10.Here, insulating properties diaphragm 30 is matched somebody with somebody It is placed on the outside of the face direction of basal substrate 10.In addition, the thickness of anisotropic conductive film 50 is preferably the 1st terminal column and the 2nd terminal More than 1.4 times of total height of row.Now, anisotropic conductive film 50 can more reliably flow to insulating properties diaphragm 30.
Then, the 1st terminal column is thermally compressed and (formally crimped) with the 2nd terminal column.For example, preparation can be by the 1st end The heating pressure-producing part 100 of the whole region heating pressurization of son row and the 2nd terminal column, by the heating pressure-producing part from flexible substrate 20 top pressure is touched on flexible substrate 20.Pressing position by heating pressure-producing part 100 is set to the 1st terminal column and the 2nd end The surface of son row.Heat the material of the plus-pressure, temperature, pressing time of pressure-producing part 100 according to anisotropic conductive film 50 Deng appropriate adjustment.That is, these parameters are untill anisotropic conductive film 50 flows to insulating properties diaphragm 30 and in the shape The mode solidified under state adjusts.
Thus, a part for anisotropic conductive film 50 is residued between the 1st terminal column and the 2nd terminal column, remainder Flow to 11 mutual gap of the 1st terminal, 21 mutual gap of the 2nd terminal or the outside of the 1st terminal column and the 2nd terminal column.Stream Anisotropic conductive film 50 after dynamic, as shown in figure 3, dividing into anisotropic conductive coupling part 40a, the 1st flowing part 40b, the 2nd flowing part 40c.Anisotropic conductive coupling part 40a is residued between the 1st terminal column and the 2nd terminal column and incited somebody to action These conductings.1st flowing part 40b is from the part that the 1st terminal column and the 2nd terminal column are flow on the inside of the direction of face.2nd flowing Part 40c is that the part of insulating properties diaphragm 30 is flowed on the outside of the direction of face and reached from the 1st terminal column and the 2nd terminal column.1st Flow part 40b, the 2nd flowing part 40c maintains insulating properties.Therefore, the 1st terminal column and the 2nd terminal column are made by formally crimping Carry out anisotropic conductive connection.
The flowing part 40b of anisotropic conductive coupling part 40a and the 1st from heating pressure-producing part 100 by being supplied Heat and cure sufficiently.But only have not by the heat supplied from heating pressure-producing part 100, the 2nd flowing part 40c Situation about curing sufficiently.Then, as shown in figure 3, from flowing part 40c lower section irradiation light (such as UV light).Light Intensity, irradiation time are the values that the 2nd flowing part 40c is cured sufficiently.It is thus, it is possible to anisotropic conductive film 50 is complete Solidify entirely.It should be noted that by the solidification of light irradiation, can also be carried out from thermo-compression bonding after the elapsed time.It is solid The anisotropic conductive film 50 of change turns into above-mentioned bond layer 40.
According to above-mentioned, according to present embodiment, the insulating properties diaphragm 30 of connection structural bodies 1 is set to be configured at basal substrate 10 Face direction on the outside of.Therefore, because insulating properties diaphragm 30 does not hinder the close of the 1st terminal column and the 2nd terminal column, so the 1st Terminal column and the 2nd terminal column are not allowed to be also easy to produce bad connection.Moreover, it flow to the anisotropy in 11 mutual gap of the 1st terminal Electrically conducting adhesive, it can successfully flow to the outside of the 1st terminal column.Therefore, the 1st terminal 11 is not allowed to be also easy to produce short circuit each other. Therefore, the reliability lifting of connection structural bodies 1.
Moreover, in the present embodiment, untill bond layer 40 reaches insulating properties diaphragm 30.Therefore, in bond layer Gap is not formed between 40 and insulating properties diaphragm 30.Therefore, because the exposed portion of wiring pattern 22 is not formed, so being not required to The process exposed portion of wiring pattern is sealed by sealant.Therefore, can be by simpler process come the company of making Connect structure 1.
It should be noted that in using technology of the sealant to make connection structural bodies, using possessing heating pressurization part The manufacture device of part and light source makes connection structural bodies.On the other hand, in the present embodiment, also using heating pressure-producing part And light source.Therefore, can (such as the tune of set location by only changing light source etc. that conventional manufacture device is most of directly It is whole) manufacture device of the peculation as present embodiment.
Embodiment
(making of anisotropic conductive film)
(embodiment 1)
By by the phenoxy resin (name of an article：PKHC, bar industrial group's system) 50 mass parts, urethane acrylates (class) oligomer (the name of an article：EB-600, DAICEL-CYTEC company system) 40 mass parts, the acrylic monomers (name of an article：A-DCP, Xin Zhong village chemical company System) 5 mass parts, the silane coupler (name of an article：KBM-503, SHIN-ETSU HANTOTAI's Silicone company systems) 2 mass parts, as heat cure trigger PERHEXA C (Nof Corp.'s system) 5 mass parts, the mass parts of benzophenone 5, the electric conductivity as trigger for optical solidification of agent Particle (the name of an article：4 μm of AUL704, particle diameter ponding chemical industrial company systems) mixing of 6 mass parts, make adhesive composite.And And be coated on adhesive composite using rod coating device in the lift-off processing PET film of 38 μm of the thickness prepared in addition, done It is dry, it resulting in the anisotropic conductive film of 20 μm of thickness.
(embodiment 2)
In the adhesive composite made by embodiment 1, hydrophobic silica (product of additional 4 mass parts as tackifier Name：AEROSIL 972, EVONIK company systems) beyond, processing similarly to Example 1 is carried out, resulting in 20 μm of thickness Anisotropic conductive film.
(embodiment 3)
By by the phenoxy resin (name of an article：PKHC, bar industrial group's system) 50 mass parts, urethane acrylates (class) oligomer (the name of an article：EB-600, DAICEL-CYTEC company system) 35 mass parts, the acrylic monomers (name of an article：A-DCP, Xin Zhong village chemical company System) 15 mass parts, the silane coupler (name of an article：KBM-503, SHIN-ETSU HANTOTAI's Silicone company systems) 2 mass parts, as heat cure trigger PERHEXA C (Nof Corp.'s system) 5 mass parts, the mass parts of benzophenone 5, the electric conductivity as trigger for optical solidification of agent Particle (the name of an article：4 μm of AUL704, particle diameter ponding chemical industrial company systems) mixing of 6 mass parts, obtain adhesive composite.And And be coated on adhesive composite using rod coating device in the lift-off processing PET film of 38 μm of the thickness prepared in addition, done It is dry, it resulting in the anisotropic conductive film of 20 μm of thickness.
(embodiment 4)
Except from the adhesive composite made by embodiment 1, removing beyond the benzophenone as trigger for optical solidification, Processing similarly to Example 1 is carried out, resulting in the anisotropic conductive film of 20 μm of thickness.
(embodiment 5)
Except in the adhesive composite made by embodiment 1, adding hydrophobic silica of 8 mass parts as tackifier (the name of an article：AEROSIL 972, EVONIK company systems) beyond, processing similarly to Example 1 is carried out, resulting in the μ of thickness 20 M anisotropic conductive film.
(embodiment 6)
By by the phenoxy resin (name of an article：PKFE, bar industrial group's system) 50 mass parts, urethane acrylates (class) oligomer (the name of an article：EB-600, DAICEL-CYTEC company system) 25 mass parts, the acrylic monomers (name of an article：A-9300, Xin Zhong village chemistry are public Department system) 25 mass parts, the silane coupler (name of an article：KBM-503, SHIN-ETSU HANTOTAI's Silicone company systems) 2 mass parts, draw as heat cure Send out PERHEXA C (Nof Corp.'s system) 5 mass parts, the mass parts of benzophenone 5, the conduction as trigger for optical solidification of agent Property particle (the name of an article：4 μm of AUL704, particle diameter ponding chemical industrial company systems) mixing of 6 mass parts, make adhesive composite. Moreover, being coated on adhesive composite using rod coating device in the lift-off processing PET film of 38 μm of the thickness prepared in addition, carry out Dry, resulting in the anisotropic conductive film of 20 μm of thickness.
(comparative example 1)
Except in the adhesive composite made by embodiment 1, adding hydrophobicity titanium dioxide of 12 mass parts as tackifier Silicon (the name of an article：AEROSIL 972, EVONIK company systems) beyond, processing similarly to Example 1 is carried out, resulting in thickness 20 μm of anisotropic conductive film.
(comparative example 2)
By by the epoxy resin (name of an article：JER4004, Mitsubishi Chemical Ind's system) 50 mass parts, urethane acrylates (class) Oligomer (the name of an article：EB-600, DAICEL-CYTEC company system) 40 mass parts, the acrylic monomers (name of an article：A-DCP, Xin Zhong village Learn company system) 5 mass parts, the silane coupler (name of an article：KBM-503, SHIN-ETSU HANTOTAI's Silicone company systems) 2 mass parts, as thermosetting Change PERHEXA C (Nof Corp.'s system) 5 mass parts of initiator, the mass parts of benzophenone 5 as trigger for optical solidification, Electroconductive particle (the name of an article：4 μm of AUL704, particle diameter ponding chemical industrial company systems) mixing of 6 mass parts, make bonding agent combination Thing.Moreover, be coated on adhesive composite using rod coating device in the lift-off processing PET film of 38 μm of the thickness prepared in addition, It is dried, resulting in the anisotropic conductive film of 20 μm of thickness.
(measure of lowest melt viscosity)
Determine the lowest melt viscosity of made anisotropic conductive film.First, anisotropic conductive film is overlapped, made The laminates of 300 μm of thickness.Then, laminates are installed on fusion viscosimeter (Thermo Fisher Scientific companies System) on.Moreover, by 10 DEG C/min of programming rate, frequency 1Hz, plus-pressure 1N, 30~180 DEG C of measurement temperature scope condition Lower driving fusion viscosimeter, determine the lowest melt viscosity of anisotropic conductive film.Measurement result is collected and is shown in Table 1.
(measure of resin flow)
Secondly, resin flow is determined.Here, being based on Fig. 4~Fig. 6, the assay method of resin flow is illustrated.It will make Anisotropic conductive film cut into 2.0mm width.Then, as shown in figure 4, being cut with the clamping of alkali-free glass (0.7 μm of thickness) 150 Cut the anisotropic conductive film 50 finished.Then, added with heating of the hot-melting tool of 2.0mm width in 180 DEG C of -4MPa-6sec From the top of alkali-free glass 150 pressurization anisotropic conductive film 50 under the conditions of pressure.Pressurized part is set to anisotropic conductive film 50 Surface.Moreover, the resin extensive magnitude that measure pressurization is front and rear, resin flow is determined according to the result.That is, by by Fig. 6 Shown in width B (width B in this is set to the maximum of the width of anisotropic conductive film 50) divided by Fig. 5 after shown pressurization Pressurization before width A (=2.0mm), determine resin flow.Result is collected and is shown in Table 1.
(measure of modulus of elasticity)
Make after made anisotropic conductive film is fully cured in 200 DEG C of baking oven, the film being fully cured is cut Into width 2mm, length 50mm.Moreover, film is installed on DMA (SII company systems) and DMA is driven by stretch mode.Moreover, Carried out 30 DEG C of elastic modulus Es ' measure.Result is collected and is shown in Table 1.
(making of evaluation connection structural bodies)
ITO pattern glass is prepared as basal substrate.Form what is be made up of ITO on the ITO pattern glass with 50 μm of spacing 1st terminal.In addition, the height of the 1st terminal is 200nm, the thickness of glass part is 0.7 μm.
In addition, the flexible substrate of polyimides is prepared as flexible substrate.The thickness of flexible substrate is 38 μm.Separately Outside, on the flexible substrate, the 2nd terminal being made up of tin plating copper is formed with 50 μm of spacing.The height of 2nd terminal is 8 μm.Cause This, the thickness of anisotropic conductive film is more than 1.4 times of total height of the 1st terminal and the 2nd terminal.In addition, from the 2nd terminal The 2nd wiring pattern being made up of material identical with the 2nd terminal is initially formed, the 2nd wiring pattern is by insulating properties diaphragm (SN9000, Hitachi Chemical Co., Ltd.) covers.
Then, it is provided with basal substrate in pre-prepd sample platform.Moreover, by above-mentioned made anisotropic conductive Film is pasted on the 1st terminal and peeled by lift-off processing PET film from anisotropic conductive film in advance.Then, with the 2nd terminal and the 1st The opposite mode of terminal, flexible substrate is arranged on basal substrate.Here, insulating properties diaphragm is configured at the face of basal substrate On the outside of direction.From the end of the insulating properties diaphragm side of basal substrate untill the end of the basal substrate side of insulating properties diaphragm Distance be set to 0.3mm.
Then, Teflon (registration mark) film of 150 μm of thickness is provided with flexible substrate as padded coaming.With Afterwards, the hot-melting tool of 1.2mm width is touched on flexible substrate from the top of flexible substrate pressure.Pass through the pressurization position of hot-melting tool Put, be set to the surface of the 1st terminal column and the 2nd terminal column.Heating pressurized conditions are set to 180 DEG C of -4MPa-6sec.Then, from below Ultraviolet is irradiated to flowing to the anisotropic conductive film on the outside of the face direction of basal substrate from the 1st terminal and the 2nd terminal.It is ultraviolet The irradiation of line is carried out using the ultraviolet lamp (USHIO Electric Co., Ltd system) of LED type.Irradiation time is set to 5 seconds. In addition, exposure intensity is set to 100mW/cm2, wavelength is set to 365nm.Process more than, has made connection structural bodies.
(extrusion capacity (or spill-out) evaluation of bond layer)
Bond layer have rated toward the extrusion capacity on the outside of the face direction of basal substrate by observation by light microscope.Result is collected It is shown in Table 1.OK is evaluated as when untill bond layer arrival insulating properties diaphragm.In addition, bond layer does not reach insulating properties guarantor NG is evaluated as when untill cuticula.Here, the scheme as NG, it can be envisaged that have 2 kinds of following schemes：Due to anisotropic conductive The lowest melt viscosity of bonding agent is too high, so bond layer does not reach the scheme of insulating properties diaphragm；And due to each to different The lowest melt viscosity of property electrically conducting adhesive is too low, so bond layer does not reach insulating properties diaphragm and gone for a stroll into substrate base The scheme of the rear side of plate.In the present embodiment, the former scheme is evaluated as NG1, the scheme of the latter is evaluated as NG2.Will NG1 example is shown in Figure 7, and NG2 example is shown in Figure 8.Learn that any example is protected in bond layer 40 and insulating properties Formed with gap 22a between cuticula 30.In the 22a of gap, wiring pattern 22 exposes.
(conducting resistance measure)
Enter to be about to the reliability evaluation experiment that connection structural bodies is placed 500 hours in the environment of 85 DEG C/relative humidity 85%.With Afterwards, the conducting resistance in the front and rear connection structural bodies of reliability evaluation experiment is determined.Specifically, determined by 4 terminal methods Conduction resistance value in connection structural bodies streaming current 1mA.Measure has used digital multimeter (digital Multimeter) (Yokogawa Motor company system).A will be evaluated as less than 2 Ω, B will be evaluated as less than 5 Ω, 5 more than Ω are evaluated as C.Measurement result is shown in Table 1.
(determining bonding strength)
Connection structural bodies is placed in the environment of 85 DEG C/relative humidity 85% the reliability evaluation experiment of 500 hours. Then, the adhesive strength in the front and rear connection structural bodies of reliability evaluation experiment is determined.Measure uses cupping machine (AND Company system) carry out.That is, the basal substrate of connection structural bodies is held on sample platform, drawn high from top by flexible substrate.Survey Constant speed degree (draw speed) is set to 50mm/sec.It is moreover, flexible substrate (specifically, the 2nd terminal) is completely peeled off from the 1st terminal When tensile strength be set to adhesive strength.More than 7N/cm is evaluated as A, 5~7N/cm is evaluated as B, will be evaluated as less than 5N/cm C.When adhesive strength is relatively low, bond layer has the possibility of peeling when flexible substrate is bent.Measurement result is collected and is shown in Table 1.
(short-circuit test)
3 μm of (calculations of ball equivalent diameter of average grain diameter are spread in the basal substrate of connection structural bodies and the boundary part of flexible substrate Art average value) Ni powder, to the uniformly applied vibration of connection structural bodies.Thereafter, apply between the 1st terminal and the 2nd terminal 15V voltage, determines insulaion resistance.By 106OK is evaluated as during more than Ω, 10 will be less than6NG is evaluated as during Ω.Measure is tied Fruit, which collects, to be shown in Table 1.
[table 1]
(table 1)
The all good results of embodiment 1~3.Compared with embodiment 1~3, embodiment 4 is seen due to eliminating light curing agent Observing the adhesive strength after reliability evaluation experiment has the tendency of somewhat to reduce.But in practicality it is the level having no problem. In embodiment 5, lowest melt viscosity is higher than other embodiments 1~4.Therefore, the extrusion capacity of bond layer become it is insufficient and Bond layer does not reach insulating properties diaphragm.But make insulating properties diaphragm further towards basal substrate side, make both away from During from as 0.2mm, bond layer reaches insulating properties diaphragm.The result, OK result is obtained in short-circuit test. In embodiment 6,30 DEG C of modulus of elasticity are higher than other embodiments 1~5.Therefore, bond layer is hardened in physical property and is bonded strong Degree reduces.But in practicality it is the level having no problem.In comparative example 1, lowest melt viscosity is more than 1000.Therefore, it is bonded The extrusion capacity of oxidant layer becomes insufficient and bond layer does not reach insulating properties diaphragm.In comparative example 2, lowest melt viscosity is small In 100.Therefore, bond layer is gone for a stroll into the back side of basal substrate and is not reached insulating properties diaphragm.
More than, while referring to the drawings while be described in detail by the present invention suitable embodiment, but the invention is not restricted to Described example.Clearly：As long as there is the technical staff of usual knowledge in the technical field of the invention, it is possible in right In the range of technological thought described in claim, it is contemplated that various modifications or modification, it should be understood that：These fall within this certainly The technical scope of invention.
Symbol description
1 connection structural bodies
10 basal substrates
11 the 1st terminals
12 the 1st wiring patterns
20 flexible substrates
21 the 2nd terminals
22 the 2nd wiring patterns
30 insulating properties diaphragms
40 bond layers
50 anisotropic conductive films

Claims (9)

1. anisotropic conductive connection structural bodies, it possesses：
Basal substrate；
The 1st terminal being arranged on aforementioned substrates substrate；
Flexible substrate；
The wiring pattern being arranged on foregoing flexible substrate；
Cover the insulating properties diaphragm of foregoing wiring pattern；
The 2nd terminal being connected on foregoing wiring pattern；And
The anisotropically conducting adhesive layer that foregoing 1st terminal is connected with foregoing 2nd terminal progress anisotropic conductive,
Wherein, aforementioned dielectric diaphragm is configured on the outside of the face direction of aforementioned substrates substrate,
Foregoing anisotropically conducting adhesive layer extends to the aforementioned substrates substrate of aforementioned dielectric diaphragm from foregoing 2nd terminal Untill the end of side.
2. the anisotropic conductive connection structural bodies described in claim 1, wherein, protected from the aforementioned dielectric of foregoing basal substrate Distance of the end of cuticula side untill the end of the aforementioned substrates substrate-side of aforementioned dielectric diaphragm is below 0.3mm.
3. the anisotropic conductive connection structural bodies described in claim 1 or 2, wherein, foregoing anisotropically conducting adhesive layer 30 DEG C of modulus of elasticity be below 4.0GPa.
4. anisotropic conductive connection method, it includes following process：
Prepare the process for being provided with the basal substrate of the 1st terminal；
Prepare to be provided with wiring pattern, cover the insulating properties diaphragm of foregoing wiring pattern and be connected on foregoing wiring pattern The 2nd terminal flexible substrate process；
Prepare the anisotropic conductive comprising uncured polymerizable compound, thermal cure initiators and electroconductive particle to be bonded The process of agent；
Foregoing anisotropically conducting adhesive is clamped with foregoing 1st terminal and foregoing 2nd terminal, and by aforementioned dielectric diaphragm The process being configured on the outside of the face direction of aforementioned substrates substrate；And
By the way that aforementioned substrates substrate and foregoing flexible substrate are thermally compressed, foregoing 1st terminal and foregoing 2nd terminal are carried out Anisotropic conductive connects, while foregoing anisotropically conducting adhesive is flowed to the aforementioned substrates of aforementioned dielectric diaphragm Process untill the end of substrate-side.
5. the anisotropic conductive connection method described in claim 4, wherein, foregoing anisotropically conducting adhesive further wraps Containing trigger for optical solidification,
Make untill foregoing anisotropically conducting adhesive flow to the end of aforementioned substrates substrate-side of aforementioned dielectric diaphragm Afterwards, the foregoing anisotropically conducting adhesive irradiation light to flowing on the outside of the face direction of aforementioned substrates substrate.
6. the anisotropic conductive connection method described in claim 5, wherein, foregoing flexible substrate is configured at aforementioned substrates substrate Top,
From the lower section of foregoing anisotropically conducting adhesive to foregoing anisotropically conducting adhesive irradiation light.
7. the anisotropic conductive connection method described in any one of claim 4~6, wherein, foregoing anisotropic conductive Bonding agent is anisotropic conductive film,
The thickness of foregoing anisotropic conductive film be at least 1.4 times of total height of foregoing 1st terminal and foregoing 2nd terminal with On.
8. anisotropically conducting adhesive, it includes uncured polymerizable compound, thermal cure initiators and electric conductivity grain Son,
Lowest melt viscosity under its uncured state is 100~1000Pa s,
30 DEG C of modulus of elasticity after being fully cured are below 4.0GPa.
9. the anisotropically conducting adhesive described in claim 8, it further includes trigger for optical solidification.
CN201680014182.5A 2015-03-20 2016-03-09 Anisotropic conductive connection structural bodies, anisotropic conductive connection method and anisotropically conducting adhesive Pending CN107432084A (en)

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